TWI800211B - 用於將電子元件自撓性承載基板移轉至撓性目標基板之裝置以及轉移電子元件之方法 - Google Patents
用於將電子元件自撓性承載基板移轉至撓性目標基板之裝置以及轉移電子元件之方法 Download PDFInfo
- Publication number
- TWI800211B TWI800211B TW111100995A TW111100995A TWI800211B TW I800211 B TWI800211 B TW I800211B TW 111100995 A TW111100995 A TW 111100995A TW 111100995 A TW111100995 A TW 111100995A TW I800211 B TWI800211 B TW I800211B
- Authority
- TW
- Taiwan
- Prior art keywords
- electronic component
- transferring electronic
- flexible
- substrate
- carrier substrate
- Prior art date
Links
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US17/884,575 US20230142207A1 (en) | 2021-11-05 | 2022-08-10 | Apparatus for transferring electronic component from flexible carrier substrate to flexible target substrate and method of transferring electronic component |
CN202210955355.0A CN116092971A (zh) | 2021-11-05 | 2022-08-10 | 用于将电子组件自挠性承载基板移转至挠性目标基板的装置以及转移电子组件的方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US202163275953P | 2021-11-05 | 2021-11-05 | |
US63/275,953 | 2021-11-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI800211B true TWI800211B (zh) | 2023-04-21 |
TW202320209A TW202320209A (zh) | 2023-05-16 |
Family
ID=86948900
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW111100995A TWI800211B (zh) | 2021-11-05 | 2022-01-10 | 用於將電子元件自撓性承載基板移轉至撓性目標基板之裝置以及轉移電子元件之方法 |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI800211B (zh) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999042289A1 (en) * | 1998-02-18 | 1999-08-26 | Hover-Davis, Inc. | Method and apparatus for removing die from a wafer and conveying die to a pickup location |
CN107452648A (zh) * | 2016-05-31 | 2017-12-08 | 致茂电子股份有限公司 | 晶粒拾取方法 |
TW201916210A (zh) * | 2017-10-13 | 2019-04-16 | 久元電子股份有限公司 | 晶粒轉移設備及使用該設備轉移晶粒的方法 |
US10490532B2 (en) * | 2015-03-20 | 2019-11-26 | Rohinni, LLC | Apparatus and method for direct transfer of semiconductor devices |
US20200294839A1 (en) * | 2019-03-12 | 2020-09-17 | Samsung Electronics Co., Ltd. | Chip ejecting apparatus |
TW202133294A (zh) * | 2020-02-21 | 2021-09-01 | 均華精密工業股份有限公司 | 黏晶機 |
-
2022
- 2022-01-10 TW TW111100995A patent/TWI800211B/zh active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999042289A1 (en) * | 1998-02-18 | 1999-08-26 | Hover-Davis, Inc. | Method and apparatus for removing die from a wafer and conveying die to a pickup location |
US10490532B2 (en) * | 2015-03-20 | 2019-11-26 | Rohinni, LLC | Apparatus and method for direct transfer of semiconductor devices |
US10615153B2 (en) * | 2015-03-20 | 2020-04-07 | Rohinni, LLC | Apparatus for direct transfer of semiconductor device die |
CN107452648A (zh) * | 2016-05-31 | 2017-12-08 | 致茂电子股份有限公司 | 晶粒拾取方法 |
TW201916210A (zh) * | 2017-10-13 | 2019-04-16 | 久元電子股份有限公司 | 晶粒轉移設備及使用該設備轉移晶粒的方法 |
US20200294839A1 (en) * | 2019-03-12 | 2020-09-17 | Samsung Electronics Co., Ltd. | Chip ejecting apparatus |
TW202133294A (zh) * | 2020-02-21 | 2021-09-01 | 均華精密工業股份有限公司 | 黏晶機 |
Also Published As
Publication number | Publication date |
---|---|
TW202320209A (zh) | 2023-05-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP3648151C0 (en) | SUBSTRATE PROCESSING DEVICE FOR PROCESSING SUBSTRATES | |
EP3871258A4 (en) | METHOD OF REMOVING A BULK SUBSTRATE FROM A BONDED ARRAY OF WAFERS | |
EP4012750A4 (en) | SUBSTRATE FOR ELECTRONIC DEVICE AND PRODUCTION METHOD THEREOF | |
TWI800211B (zh) | 用於將電子元件自撓性承載基板移轉至撓性目標基板之裝置以及轉移電子元件之方法 | |
EP3998376A4 (en) | SUBSTRATE FOR ELECTRONIC DEVICE AND METHOD FOR PRODUCTION THEREOF | |
SG10202103960VA (en) | Substrate processing method and plasma processing apparatus | |
EP4022526A4 (en) | ELECTRONIC DEVICE AND CONTROL METHOD OF THE ELECTRONIC DEVICE | |
PL4129956T3 (pl) | Sposób wytwarzania powlekanych podłoży, jak i powlekane podłoże i jego zastosowanie | |
KR20240058620A (ko) | 기판 이송 시스템 및 방법 | |
KR102459642B9 (ko) | 기판처리장치의 기판이송방법 | |
EP3775074A4 (en) | COMPOSITIONS AND METHODS FOR PROCESSING A SUBSTRATE AND FOR IMPROVING THE ADHESION OF AN IMAGE TO A TREATED SUBSTRATE | |
GB2588935B (en) | Method and apparatus for sputter deposition of target material to a substrate | |
GB2588932B (en) | Method and apparatus for sputter deposition of target material to a substrate | |
SG10202101193RA (en) | Substrate processing apparatus and substrate processing method | |
EP4024466A4 (en) | ELECTRONIC DEVICE SUBSTRATE AND METHOD OF MAKING IT, AND ELECTRONIC DEVICE THEREOF | |
SG11202109533QA (en) | A method for activating a surface of a non-conductive or carbon-fibres containing substrate for metallization | |
GB202203879D0 (en) | Apparatus and method for coating substrate | |
GB202201287D0 (en) | System and method for treatment of an organic substrate | |
EP4034691A4 (en) | METHOD AND APPARATUS FOR SURFACE TREATMENT OF A SEMICONDUCTOR SUBSTRATE | |
TWI839164B (zh) | 基板處理裝置 | |
KR20240058004A (ko) | 기판 처리 방법 및 기판 처리 장치 | |
KR20240058311A (ko) | 기판 처리 장치 | |
KR20240057799A (ko) | 기판 처리 장치 | |
TWI838863B (zh) | 基板處理裝置 | |
TWI840524B (zh) | 蝕刻基板之膜之方法及電漿處理裝置 |