TWI800211B - 用於將電子元件自撓性承載基板移轉至撓性目標基板之裝置以及轉移電子元件之方法 - Google Patents

用於將電子元件自撓性承載基板移轉至撓性目標基板之裝置以及轉移電子元件之方法 Download PDF

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Publication number
TWI800211B
TWI800211B TW111100995A TW111100995A TWI800211B TW I800211 B TWI800211 B TW I800211B TW 111100995 A TW111100995 A TW 111100995A TW 111100995 A TW111100995 A TW 111100995A TW I800211 B TWI800211 B TW I800211B
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TW
Taiwan
Prior art keywords
electronic component
transferring electronic
flexible
substrate
carrier substrate
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TW111100995A
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English (en)
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TW202320209A (zh
Inventor
林清儒
吳懿賢
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斯託克精密科技股份有限公司
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Priority to US17/884,575 priority Critical patent/US20230142207A1/en
Priority to CN202210955355.0A priority patent/CN116092971A/zh
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Publication of TWI800211B publication Critical patent/TWI800211B/zh
Publication of TW202320209A publication Critical patent/TW202320209A/zh

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TW111100995A 2021-11-05 2022-01-10 用於將電子元件自撓性承載基板移轉至撓性目標基板之裝置以及轉移電子元件之方法 TWI800211B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US17/884,575 US20230142207A1 (en) 2021-11-05 2022-08-10 Apparatus for transferring electronic component from flexible carrier substrate to flexible target substrate and method of transferring electronic component
CN202210955355.0A CN116092971A (zh) 2021-11-05 2022-08-10 用于将电子组件自挠性承载基板移转至挠性目标基板的装置以及转移电子组件的方法

Applications Claiming Priority (2)

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US202163275953P 2021-11-05 2021-11-05
US63/275,953 2021-11-05

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TWI800211B true TWI800211B (zh) 2023-04-21
TW202320209A TW202320209A (zh) 2023-05-16

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TW111100995A TWI800211B (zh) 2021-11-05 2022-01-10 用於將電子元件自撓性承載基板移轉至撓性目標基板之裝置以及轉移電子元件之方法

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999042289A1 (en) * 1998-02-18 1999-08-26 Hover-Davis, Inc. Method and apparatus for removing die from a wafer and conveying die to a pickup location
CN107452648A (zh) * 2016-05-31 2017-12-08 致茂电子股份有限公司 晶粒拾取方法
TW201916210A (zh) * 2017-10-13 2019-04-16 久元電子股份有限公司 晶粒轉移設備及使用該設備轉移晶粒的方法
US10490532B2 (en) * 2015-03-20 2019-11-26 Rohinni, LLC Apparatus and method for direct transfer of semiconductor devices
US20200294839A1 (en) * 2019-03-12 2020-09-17 Samsung Electronics Co., Ltd. Chip ejecting apparatus
TW202133294A (zh) * 2020-02-21 2021-09-01 均華精密工業股份有限公司 黏晶機

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999042289A1 (en) * 1998-02-18 1999-08-26 Hover-Davis, Inc. Method and apparatus for removing die from a wafer and conveying die to a pickup location
US10490532B2 (en) * 2015-03-20 2019-11-26 Rohinni, LLC Apparatus and method for direct transfer of semiconductor devices
US10615153B2 (en) * 2015-03-20 2020-04-07 Rohinni, LLC Apparatus for direct transfer of semiconductor device die
CN107452648A (zh) * 2016-05-31 2017-12-08 致茂电子股份有限公司 晶粒拾取方法
TW201916210A (zh) * 2017-10-13 2019-04-16 久元電子股份有限公司 晶粒轉移設備及使用該設備轉移晶粒的方法
US20200294839A1 (en) * 2019-03-12 2020-09-17 Samsung Electronics Co., Ltd. Chip ejecting apparatus
TW202133294A (zh) * 2020-02-21 2021-09-01 均華精密工業股份有限公司 黏晶機

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