TWI840524B - 蝕刻基板之膜之方法及電漿處理裝置 - Google Patents

蝕刻基板之膜之方法及電漿處理裝置 Download PDF

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Publication number
TWI840524B
TWI840524B TW109107649A TW109107649A TWI840524B TW I840524 B TWI840524 B TW I840524B TW 109107649 A TW109107649 A TW 109107649A TW 109107649 A TW109107649 A TW 109107649A TW I840524 B TWI840524 B TW I840524B
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Taiwan
Prior art keywords
substrate
processing apparatus
plasma processing
etching film
etching
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TW109107649A
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English (en)
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TW202040689A (zh
Inventor
小笠原幸輔
岩﨑峰久
石井健太郎
井手誠司
謝其儒
Original Assignee
日商東京威力科創股份有限公司
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Priority claimed from JP2019053348A external-priority patent/JP7220603B2/ja
Application filed by 日商東京威力科創股份有限公司 filed Critical 日商東京威力科創股份有限公司
Publication of TW202040689A publication Critical patent/TW202040689A/zh
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Publication of TWI840524B publication Critical patent/TWI840524B/zh

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TW109107649A 2019-03-20 2020-03-09 蝕刻基板之膜之方法及電漿處理裝置 TWI840524B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-053348 2019-03-20
JP2019053348A JP7220603B2 (ja) 2019-03-20 2019-03-20 膜をエッチングする方法及びプラズマ処理装置

Publications (2)

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TW202040689A TW202040689A (zh) 2020-11-01
TWI840524B true TWI840524B (zh) 2024-05-01

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018006706A (ja) 2016-07-08 2018-01-11 東京エレクトロン株式会社 被処理体を処理する方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018006706A (ja) 2016-07-08 2018-01-11 東京エレクトロン株式会社 被処理体を処理する方法

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