TWI799512B - 清洗方法及電漿處理裝置 - Google Patents
清洗方法及電漿處理裝置 Download PDFInfo
- Publication number
- TWI799512B TWI799512B TW108105055A TW108105055A TWI799512B TW I799512 B TWI799512 B TW I799512B TW 108105055 A TW108105055 A TW 108105055A TW 108105055 A TW108105055 A TW 108105055A TW I799512 B TWI799512 B TW I799512B
- Authority
- TW
- Taiwan
- Prior art keywords
- processing apparatus
- plasma processing
- cleaning method
- cleaning
- plasma
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
- H01L21/31116—Etching inorganic layers by chemical means by dry-etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
- H01J37/32449—Gas control, e.g. control of the gas flow
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32174—Circuits specially adapted for controlling the RF discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32816—Pressure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32853—Hygiene
- H01J37/32871—Means for trapping or directing unwanted particles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02046—Dry cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018025594A JP7055031B2 (ja) | 2018-02-16 | 2018-02-16 | クリーニング方法及びプラズマ処理装置 |
JP2018-025594 | 2018-02-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201937597A TW201937597A (zh) | 2019-09-16 |
TWI799512B true TWI799512B (zh) | 2023-04-21 |
Family
ID=67618079
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108105055A TWI799512B (zh) | 2018-02-16 | 2019-02-15 | 清洗方法及電漿處理裝置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US11594399B2 (zh) |
JP (1) | JP7055031B2 (zh) |
KR (1) | KR20190099131A (zh) |
TW (1) | TWI799512B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110690097B (zh) * | 2019-09-26 | 2022-06-24 | 深圳市金奥兰科技有限公司 | 一种等离子刻蚀机用尘埃消除装置 |
CN111530851B (zh) * | 2020-05-15 | 2021-08-06 | 聚束科技(北京)有限公司 | 一种粒子束显微镜的样品除污方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140053867A1 (en) * | 2009-01-16 | 2014-02-27 | Novellus Systems, Inc. | Plasma clean method for deposition chamber |
TW201801179A (zh) * | 2016-03-31 | 2018-01-01 | 東京威力科創股份有限公司 | 利用無晶片乾式清潔之光學放射光譜進行的乾式蝕刻處理特徵控制 |
US20180005814A1 (en) * | 2016-07-01 | 2018-01-04 | Lam Research Corporation | Selective atomic layer deposition with post-dose treatment |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09283494A (ja) * | 1996-04-12 | 1997-10-31 | Sony Corp | プラズマエッチング装置およびプラズマエッチング方法 |
TW422892B (en) | 1997-03-27 | 2001-02-21 | Applied Materials Inc | Technique for improving chucking reproducibility |
JP2002057149A (ja) | 2000-08-08 | 2002-02-22 | Tokyo Electron Ltd | 処理装置及びそのクリーニング方法 |
JP2003297817A (ja) | 2002-04-03 | 2003-10-17 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法、半導体装置、そのためのプラズマcvd装置 |
JP4052477B2 (ja) | 2004-02-25 | 2008-02-27 | 三菱重工業株式会社 | プラズマ処理装置のクリーニング方法 |
JP5214316B2 (ja) | 2008-04-22 | 2013-06-19 | 大陽日酸株式会社 | プラズマ成膜装置のクリーニング方法 |
JP5364514B2 (ja) | 2009-09-03 | 2013-12-11 | 東京エレクトロン株式会社 | チャンバ内クリーニング方法 |
JP5956933B2 (ja) | 2013-01-15 | 2016-07-27 | 東京エレクトロン株式会社 | プラズマ処理方法及びプラズマ処理装置 |
JP6462477B2 (ja) | 2015-04-27 | 2019-01-30 | 東京エレクトロン株式会社 | 被処理体を処理する方法 |
JP2017212361A (ja) * | 2016-05-26 | 2017-11-30 | 東京エレクトロン株式会社 | プラズマ処理装置及びパーティクル付着抑制方法 |
KR20180019906A (ko) * | 2016-08-17 | 2018-02-27 | 삼성전자주식회사 | 플라즈마 식각장비 및 이를 이용한 반도체 소자의 제조방법 |
-
2018
- 2018-02-16 JP JP2018025594A patent/JP7055031B2/ja active Active
-
2019
- 2019-02-13 KR KR1020190016701A patent/KR20190099131A/ko not_active Application Discontinuation
- 2019-02-14 US US16/275,848 patent/US11594399B2/en active Active
- 2019-02-15 TW TW108105055A patent/TWI799512B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140053867A1 (en) * | 2009-01-16 | 2014-02-27 | Novellus Systems, Inc. | Plasma clean method for deposition chamber |
TW201801179A (zh) * | 2016-03-31 | 2018-01-01 | 東京威力科創股份有限公司 | 利用無晶片乾式清潔之光學放射光譜進行的乾式蝕刻處理特徵控制 |
US20180005814A1 (en) * | 2016-07-01 | 2018-01-04 | Lam Research Corporation | Selective atomic layer deposition with post-dose treatment |
Also Published As
Publication number | Publication date |
---|---|
KR20190099131A (ko) | 2019-08-26 |
US20190259578A1 (en) | 2019-08-22 |
JP2019145540A (ja) | 2019-08-29 |
JP7055031B2 (ja) | 2022-04-15 |
TW201937597A (zh) | 2019-09-16 |
US11594399B2 (en) | 2023-02-28 |
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TWI799512B (zh) | 清洗方法及電漿處理裝置 |