SG11202109533QA - A method for activating a surface of a non-conductive or carbon-fibres containing substrate for metallization - Google Patents

A method for activating a surface of a non-conductive or carbon-fibres containing substrate for metallization

Info

Publication number
SG11202109533QA
SG11202109533QA SG11202109533QA SG11202109533QA SG 11202109533Q A SG11202109533Q A SG 11202109533QA SG 11202109533Q A SG11202109533Q A SG 11202109533QA SG 11202109533Q A SG11202109533Q A SG 11202109533QA
Authority
SG
Singapore
Prior art keywords
metallization
activating
conductive
carbon
containing substrate
Prior art date
Application number
Inventor
Josef Gaida
Lutz Stamp
Lena Ivanova
Thomas Thomas
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of SG11202109533QA publication Critical patent/SG11202109533QA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1886—Multistep pretreatment
    • C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
SG11202109533Q 2019-04-04 2020-04-01 A method for activating a surface of a non-conductive or carbon-fibres containing substrate for metallization SG11202109533QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP19167282 2019-04-04
PCT/EP2020/059313 WO2020201387A1 (en) 2019-04-04 2020-04-01 A method for activating a surface of a non-conductive or carbon-fibres containing substrate for metallization

Publications (1)

Publication Number Publication Date
SG11202109533QA true SG11202109533QA (en) 2021-10-28

Family

ID=66092168

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202109533Q SG11202109533QA (en) 2019-04-04 2020-04-01 A method for activating a surface of a non-conductive or carbon-fibres containing substrate for metallization

Country Status (11)

Country Link
US (1) US20220154343A1 (en)
EP (1) EP3947772A1 (en)
JP (1) JP7455859B2 (en)
KR (1) KR20210143882A (en)
CN (1) CN113614283A (en)
BR (1) BR112021016763A2 (en)
CA (1) CA3135816A1 (en)
MX (1) MX2021012121A (en)
SG (1) SG11202109533QA (en)
TW (1) TWI764121B (en)
WO (1) WO2020201387A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA3190848A1 (en) 2020-08-27 2022-03-03 Andre Beyer A method for activating a surface of a non-conductive or carbon-fibres containing substrate for metallization

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4278712A (en) * 1978-08-31 1981-07-14 Surface Technology, Inc. Method for activating non-noble metal colloidal dispersion by controlled oxidation for electroless plating
US4600699A (en) * 1983-02-14 1986-07-15 Enthone, Incorporated Reclamation of a palladium-tin based electroless plating catalyst from the exhausted catalyst solution and accompanying rinse waters
US4820547A (en) * 1987-04-24 1989-04-11 Surface Technology, Inc. Activators for colloidal catalysts in electroless plating processes
US5421989A (en) * 1993-08-31 1995-06-06 Atotech Deutschland Gmbh Process for the metallization of nonconductive substrates with elimination of electroless metallization
KR20060128739A (en) * 2005-06-10 2006-12-14 엔쏜 인코포레이티드 Method for direct metallization of non-conducting substrates
US20080245184A1 (en) 2006-06-15 2008-10-09 Woo Ram Lee Preparation method of metal nano particle using micro mixer
EP1876262A1 (en) 2006-07-07 2008-01-09 Rohm and Haas Electronic Materials, L.L.C. Environmentally friendly electroless copper compositions
FR2958944B1 (en) * 2010-04-19 2014-11-28 Pegastech METHOD FOR COATING A SURFACE OF A SUBSTRATE OF NON-METALLIC MATERIAL WITH A METAL LAYER
EP2764135A2 (en) 2011-10-05 2014-08-13 Atotech Deutschland GmbH Formaldehyde-free electroless copper plating solution
JP6145681B2 (en) * 2014-02-07 2017-06-14 石原ケミカル株式会社 Aqueous copper colloid catalyst solution for electroless copper plating and electroless copper plating method
EP3181724A3 (en) * 2015-12-14 2017-08-16 Rohm and Haas Electronic Materials LLC Environmentally friendly stable catalysts for electroless metallization of printed circuit boards and through-holes
US10151035B2 (en) * 2016-05-26 2018-12-11 Rohm And Haas Electronic Materials Llc Electroless metallization of through-holes and vias of substrates with tin-free ionic silver containing catalysts
CN107460459A (en) 2017-06-29 2017-12-12 深圳安德万斯新材料科技有限公司 A kind of Nanometer Copper activating solution and preparation method thereof

Also Published As

Publication number Publication date
TWI764121B (en) 2022-05-11
EP3947772A1 (en) 2022-02-09
CA3135816A1 (en) 2020-10-08
WO2020201387A1 (en) 2020-10-08
JP2022527973A (en) 2022-06-07
TW202041712A (en) 2020-11-16
US20220154343A1 (en) 2022-05-19
KR20210143882A (en) 2021-11-29
JP7455859B2 (en) 2024-03-26
CN113614283A (en) 2021-11-05
BR112021016763A2 (en) 2021-10-13
MX2021012121A (en) 2021-11-03

Similar Documents

Publication Publication Date Title
EP3648151C0 (en) Substrate processing apparatus for processing substrates
HUE056316T2 (en) Device for the surface treatment of a substrate having a metallic conveyor belt
SG11202100013TA (en) Surface modified depth controlled deposition for plasma based deposition
FI3875248T3 (en) Method for producing a three-dimensional structure on a surface of a flat substrate
SG10201910561UA (en) Method Of Treating A Workpiece Surface
ZA202007502B (en) Vacuum deposition facility and method for coating a substrate
ZA202007642B (en) Vacuum deposition facility and method for coating a substrate
EP3815475A4 (en) Methods of making metal patterns on flexible substrate
GB2584825B (en) Substrates for electronic skins
SG11202109533QA (en) A method for activating a surface of a non-conductive or carbon-fibres containing substrate for metallization
EP3774519A4 (en) Systems and methods for treating a submerged surface of a target structure
ZA202102795B (en) Method of treatment of a surface
ZA202007614B (en) Vacuum deposition facility and method for coating a substrate
EP3581004A4 (en) Method of finishing a metallic conductive layer
EP3932574A4 (en) Method for treating waste electronic substrate
EP3344796A4 (en) Apparatus and method for providing a coating to a surface of a substrate
SG11202108054WA (en) Method of processing a substrate
EP3529827A4 (en) Method of plating a metallic substrate to achieve a desired surface coarseness
GB201814181D0 (en) Method of treating a substrate
ZA202102697B (en) Method of treatment of a surface
SG10202012351UA (en) A substrate processing apparatus
ZA202003072B (en) Vacuum deposition facility and method for coating a substrate
EP3715502C0 (en) Coating of 3-dimensional substrates
EP3900020A4 (en) A method of forming devices on a substrate
GB201910988D0 (en) Touchenable coated substrate