JP5965199B2 - 異方性導電接着剤及びその製造方法、発光装置及びその製造方法 - Google Patents
異方性導電接着剤及びその製造方法、発光装置及びその製造方法 Download PDFInfo
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- JP5965199B2 JP5965199B2 JP2012094141A JP2012094141A JP5965199B2 JP 5965199 B2 JP5965199 B2 JP 5965199B2 JP 2012094141 A JP2012094141 A JP 2012094141A JP 2012094141 A JP2012094141 A JP 2012094141A JP 5965199 B2 JP5965199 B2 JP 5965199B2
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Description
このような光機能素子としては、小型化等のため、LEDチップを配線基板上に直接実装するフリップチップ実装が行われている。
配線基板上にLEDチップをフリップチップ実装する方法としては、図4(a)〜(c)に示すように、従来、種々のものが知られている。
図4(a)に示す発光装置101では、LEDチップ103の第1及び第2の電極104、105を上側(配線基板102と反対側)にした状態で、LEDチップ103を配線基板102上にダイボンド接着剤110、111によって固定する。
そして、ボンディングワイヤ106、108によって配線基板102上の第1及び第2のパターン電極107、109とLEDチップ103の第1及び第2の電極104、105をそれぞれ電気的に接続する。
図4(b)に示す発光装置121では、LEDチップ103の第1及び第2の電極104、105を配線基板102側に向けた状態で、これら第1及び第2の電極104、105と配線基板102の第1及び第2のパターン電極124、125とを、例えば銅ペースト等の導電性ペースト122、123によって電気的に接続するとともに、封止樹脂126、127によってLEDチップ103を配線基板102上に接着する。
図4(c)に示す発光装置131では、LEDチップ103の第1及び第2の電極104、105を配線基板102側に向けた状態で、これら第1及び第2の電極104、105と、配線基板102の第1及び第2のパターン電極124、125上に設けたバンプ132、133とを、異方性導電接着剤134中の導電性粒子135によって電気的に接続するとともに、異方性導電接着剤134中の絶縁性接着剤樹脂136によってLEDチップ103を配線基板102上に接着する。
まず、ワイヤボンディングによる実装方法においては、金からなるボンディングワイヤ106、108が例えば波長が400〜500nmの光を吸収するため、発光効率が低下してしまう。
また、この方法の場合、オーブンを用いてダイボンド接着剤110、111を硬化させるため、硬化時間が長く、生産効率を向上させることが困難である。
また、この方法の場合、オーブンを用いて封止樹脂126、127を硬化させるため、硬化時間が長く、生産効率を向上させることが困難である。
このAg系薄膜合金を導電性粒子の表面に被覆すれば、耐食性、耐マイグレーション性は向上するが、このAg系薄膜合金を最表層に用い、下地層に例えばニッケルを用いると、ニッケルの反射率がAgより低いため、導電性粒子全体の反射率が低下してしまうという問題がある。
本発明では、上述した異方性導電接着剤を製造する方法であって、前記光反射性金属層を、スパッタリング法によって形成する工程を有するものである。
一方、本発明は、対となる接続電極を有する配線基板と、前記配線基板の対となる接続電極にそれぞれ対応する接続電極を有する発光素子とを備え、上述した異方性導電接着剤によって前記発光素子が前記配線基板上に接着され、かつ、当該発光素子の接続電極が、当該異方性導電接着剤の導電性粒子を介して当該配線基板の対応する接続電極に対しそれぞれ電気的に接続されている発光装置である。
また、本発明は、対となる接続電極を有する配線基板と、前記配線基板の接続電極にそれぞれ対応する接続電極を有する発光素子とを用意し、前記配線基板の接続電極と前記発光素子の接続電極を対向する方向に配置した状態で、当該発光素子と当該発光素子との間に上述した異方性導電接着剤を配置し、前記配線基板に対して前記発光素子を熱圧着する工程を有する発光装置の製造方法である。
本発明の場合、異方性導電接着剤の導電性粒子が、核となる樹脂粒子の表面に、銀と、金と、ハフニウムとを含有する合金からなる光反射性金属層が形成されており、銀と同等の反射率を有することから、異方性導電接着剤による光の吸収を最小限に抑えることができる。
その結果、本発明の異方性導電接着剤を用いて配線基板上に発光素子を実装すれば、発光素子の発光効率を低下させることがなく、効率良く光を取り出すことが可能な発光装置を提供することができる。
また、本発明の異方性導電接着剤は、導電性粒子の光反射性金属層がマイグレーションの起こりにくいハフニウム及び金を含む合金からなることから、耐マイグレーション性を向上させることができる。
一方、本発明の方法によれば、異方性導電接着剤の配置と熱圧着工程という簡素で迅速な工程により、上述した顕著な効果を奏する発光装置を製造することができるので、生産効率を大幅に向上させることができる。
なお、本発明は、ペースト状の異方導電性接着剤に特に好ましく適用することができるものである。
本発明の場合、絶縁性接着剤樹脂2としては、特に限定されることはないが、透明性、接着性、耐熱性、機械的強度、電気絶縁性に優れる観点からは、エポキシ樹脂と、その硬化剤とを含む組成物を好適に用いることができる。
複素環系エポキシ化合物としては、トリアジン環を有するエポキシ化合物を挙げることができ、特に好ましくは1,3,5−トリス(2,3−エポキシプロピル)−1,3,5−トリアジン−2,4,6−(1H,3H,5H)−トリオンを挙げることができる。
水素添加エポキシ化合物としては、先述の脂環式エポキシ化合物や複素環式エポキシ化合物の水素添加物や、その他公知の水素添加エポキシ樹脂を使用することができる。
また、これらのエポキシ化合物に加えて本発明の効果を損なわない限り、他のエポキシ樹脂を併用してもよい。例えば、ビスフェノールA、ビスフェノールF、ビスフェノールS、テトラメチルビスフェノールA、ジアリールビスフェノールA、ハイドロキノン、カテコール、レゾルシン、クレゾール、テトラブロモビスフェノールA、トリヒドロキシビフェニル、ベンゾフェノン、ビスレゾルシノール、ビスフェノールヘキサフルオロアセトン、テトラメチルビスフェノールA、テトラメチルビスフェノールF、トリス(ヒドロキシフェニル)メタン、ビキシレノール、フェノールノボラック、クレゾールノボラックなどの多価フェノールとエピクロルヒドリンとを反応させて得られるグリシジルエーテル1グリセリン、ネオペンチルグリコール、エチレングリコール、プロピレングリコール、チレングリコール、ヘキシレングリコール、ポリエチレングリコール、ポリプロピレングリコールなどの脂肪族多価アルコールとエピクロルヒドリンとを反応させて得られるポリグリシジルエーテルlp−オキシ安息香酸、β−オキシナフトエ酸のようなヒドロキシカルボン酸とエピクロルヒドリンとを反応させて得られるグリシジルエーテルエステル1フタル酸、メチルフタル酸、イソフタル酸、テレフタル酸、テトラハイドロフタル酸、エンドメチレンテトラハイドロフタル酸、エンドメチレンヘキサハイドロフタル酸、トリメリット酸、重合脂肪酸のようなポリカルボン酸から得られるポリグリシジルエステル1アミノフェノール、アミノアルキルフェノールから得られるグリシジルアミノグリシジルエーテル1アミノ安息香酸から得られるグリシジルアミノグリシジルエステル1アニリン、トルイジン、トリブロムアニリン、キシリレンジアミン、ジアミノシクロヘキサン、ビスアミノメチルシクロヘキサン、4,4'−ジアミノジフェニルメタン、4,4'−ジアミノジフェニルスルホンなどから得られるグリシジルアミン1エポキシ化ポリオレフィン等の公知のエポキシ樹脂類が挙げられる。
また、硬化剤としては、酸無水物、イミダゾール化合物、ジシアンなどを挙げることができる。中でも、硬化剤を変色させ難い酸無水物、特に脂環式酸無水物系硬化剤を好ましく使用することができる。具体的には、メチルヘキサヒドロフタル酸無水物等を好ましく挙げることができる。
なお、脂環式のエポキシ化合物と脂環式酸無水物系硬化剤とを使用する場合、それぞれの使用量は、脂環式酸無水物形硬化剤が少なすぎると未硬化エポキシ化合物が多くなり、多すぎると余剰の硬化剤の影響で被着体材料の腐食が促進される傾向があるので、脂環式エポキシ化合物100質量部に対し、好ましくは80〜120質量部、より好ましくは95〜105質量部の割合で使用することができる。
樹脂粒子30の大きさは、特に限定されることはないが、高い導通信頼性を得る観点からは、平均粒径で3μm〜5μmのものを好適に用いることができる。
この場合、銀としては、純度(金属中における割合)が98重量%以上のものを用いることが好ましい。
ここで、本発明のような微小な粒子にスパッタリングによって薄膜を形成する方法としては、一次粒子まで分散させた微粒子を装置内の容器にセットし、容器を回転させて微粒子を流動させるとよい。すなわち、このような流動状態の微粒子に対してスパッタリングを行うことにより、各微粒子の全面にターゲット材料のスパッタ粒子が衝突し、各微粒子の全面に薄膜を形成させることができる。
また、本発明に適用するスパッタリング法としては、二極スパッタリング法、マグネトロンスパッタリング法、高周波スパッタリング法、反応性スパッタリング法を含む公知のスパッタリング法を採用することが可能である。
なお、光反射性金属層31において、他に含有する金属としては、例えば、ビスマス、ネオジム等があげられる。
第1及び第2の接続電極21、22の例えば隣接する端部には、例えばスタッドバンプからなる凸状の端子部21b、22bがそれぞれ設けられている。
本発明は、特に、ピーク波長が460nm近傍の青色用のLEDを好適に用いることができる。
そして、発光素子40が、硬化させた上記異方性導電接着剤1によって配線基板20上に接着されている。
まず、図2(a)に示すように、対となる第1及び第2の接続電極21、22を有する配線基板20と、配線基板20の第1及び第2の接続電極21、22にそれぞれ対応する第1及び第2の接続電極41、42を有する発光素子40とを用意する。
そして、以上の工程により、目的とする発光装置10が得られる。
その結果、本実施の形態の異方性導電接着剤1を用いて配線基板20上に発光素子40を実装すれば、発光素子40の発光効率を低下させることがなく、効率良く光を取り出すことが可能な発光装置10を提供することができる。
また、本発明の異方性導電接着剤1は、導電性粒子3の光反射性金属層31がマイグレーションの起こりにくいハフニウム及び金を含む合金からなることから、耐マイグレーション性を向上させることができる。
一方、本実施の形態の方法によれば、異方性導電接着剤1の配置工程と、熱圧着工程という簡素で迅速な工程により、発光装置10を製造することができるので、生産効率を大幅に向上させることができる。
例えば、図1(c)及び図2(a)〜(c)に示す発光装置10は、その形状や大きさを簡略化して模式的に示したもので、配線基板並びに発光素子の接続電極の形状、大きさ及び数等については、適宜変更することができる。
また、本発明は例えばピーク波長が460nm近傍の青色用の発光素子のみならず、種々のピーク波長を有する発光素子に適用することができる。
ただし、本発明は、ピーク波長が460nm近傍の発光素子に適用した場合に最も効果があるものである。
<接着剤組成物>
エポキシ樹脂(ダイセル化学工業社製 CEL2021P)100重量部、硬化剤として、メチルヘキサヒドロフタル酸無水物(新日本理化社製 MH−700)100重量部、硬化促進剤(四国化学社製 2E4MZ)2重量部及び溶剤であるトルエンを用いて接着剤組成物を調製した。
<導電性粒子の作成>
〔実施例粒子1〕
平均粒径5μmの架橋アクリル樹脂からなる樹脂粒子(根上工業社製 アートパール J−6P)の表面に、スパッタリング法により、厚さ0.2μmの銀合金(銀:金:ハフニウム=60:30:20)からなる光反射性金属層を形成した。
この場合、スパッタリング装置としては、(共立社製 粉体スパッタリング装置)を用い、スパッタターゲットとしては、溶解、鋳造法により作製したAg・Au・Hf合金ターゲットを用いた。
光反射性金属層の組成比を銀:金:ハフニウム=50:10:40とした以外は実施例粒子1と同一の条件で実施例粒子2を作成した。
光反射性金属層の組成比を銀:金:ハフニウム=50:40:10とした以外は実施例粒子1と同一の条件で実施例粒子3を作成した。
光反射性金属層の組成比を銀:金:ハフニウム=80:10:10とした以外は実施例粒子1と同一の条件で実施例粒子4を作成した。
厚さ0.2μmのニッケルめっきを施した平均粒径4.6μmのアクリル樹脂からなる樹脂粒子(日本化学社製)を用いた以外は実施例粒子1と同一の条件で実施例粒子5を作成した。
樹脂粒子の表面に金からなる光反射性金属層を形成した以外は実施例粒子1と同一の条件で比較例粒子1を作成した。
樹脂粒子の表面に銀からなる光反射性金属層を形成した以外は実施例粒子1と同一の条件で比較例粒子2を作成した。
光反射性金属層の組成比を銀:金:ハフニウム=98:1:1とした以外は実施例粒子1と同一の条件で比較例粒子3を作成した。
光反射性金属層の組成比を銀:金:ハフニウム=30:5:65とした以外は実施例粒子1と同一の条件で実施例粒子4を作成した。
光反射性金属層の組成比を銀:金:ハフニウム=30:62:8とした以外は実施例粒子1と同一の条件で比較例粒子5を作成した。
上述した接着剤組成物100重量部(溶剤を除く)に、上述した実施例粒子1〜5及び比較例粒子1〜5をそれぞれ15重量部混入して、実施例1〜5並びに比較例1〜5の異方性導電接着剤を得た。
(1)反射率
実施例1〜5及び比較例1〜5の異方性導電接着剤を平滑な白色板上に乾燥後の厚さが100μmとなるように塗布し、温度200℃で1分間加熱硬化させて反射率測定用のサンプルを作成した。
各サンプルについて、分光測色計(コニカミノルタ社製 CM−3600d)を用い、青色波長である波長460nmにおける反射率を測定した。その結果を表1に示す。
実施例1〜5及び比較例1〜5の異方性導電接着剤を、平滑化処理がなされた金バンプ付きの配線基板上に塗布した。この配線基板の電極間ピッチは、100μmで、ニッケル/金めっき=5.0μm/0.3μmが施されている。また、金バンプの厚さは15μmとした。
上述した配線基板上に青色LEDチップ(Vf=3.2V(If=20mA))をアライメントして搭載し、温度200℃、1チップ当たり1kgの圧力で20秒間加熱圧着を行い、実施例1〜5及び比較例1〜5のLED実装サンプルを作成した。
積分全球型の全光束量測定システム(大塚電子社製 LE−2100)を用い、If=20mAの定電流制御の条件下で、実施例1〜5及び比較例1〜5のLED実装サンプルの全光束量を測定した。その結果を表1に示す。
上述した実施例1〜5及び比較例1〜5のLED実装サンプルに対し、それぞれ温度85℃、相対湿度85%RHの環境下で通電させる高温高湿試験を500時間行った後の全光束量を測定し、それぞれの変化率を算出した。その結果を表1に示す。
上述した耐マイグレーション性試験の前後において電気測定を行い、導通の破断(オープン)の有無、短絡発生の有無を確認した。ここで、導通の破断が確認できた場合は「○」として評価し、測定パターンの一部がショートした場合を「△」として評価した。その結果を表1に示す。
表1から明らかなように、銀:金:ハフニウム=60:30:20からなる光反射性金属層を形成した実施例1の異方性導電接着剤を用いた樹脂硬化物は、反射率が45%を示すとともに、LED実装サンプルの全光束量は330mlmを示した。これは、金からなる光反射性金属層を樹脂粒子表面に形成した導電性粒子を用いた比較例1のものより高い値を示し、LED実装サンプルからの光の取り出し効率の向上がみられた。
さらに、500時間の高温高湿試験後において初期全光束量の変化はなく、また、電気特性についてはも初期状態から変化がなかった。これらの結果から、導電性粒子の変色及びマイグレーションが発生していないことを確認した。
銀:金:ハフニウム=50:10:40からなる光反射性金属層を形成した実施例2の異方性導電接着剤を用いた樹脂硬化物は、反射率が40%を示すとともに、LED実装サンプルの全光束量は300mlmを示した。これは、金からなる光反射性金属層を樹脂粒子表面に形成した導電性粒子を用いた比較例1のものより高い値を示し、LED実装サンプルからの光の取り出し効率の向上がみられた。
さらに、500時間の高温高湿試験後において初期全光束量の変化はなく、また、電気特性についてはも初期状態から変化がなく、導電性粒子の変色及びマイグレーションが発生していないことを確認した。
銀:金:ハフニウム=50:40:10からなる光反射性金属層を形成した実施例3の異方性導電接着剤を用いた樹脂硬化物は、反射率が35%を示すとともに、LED実装サンプルの全光束量は280mlmを示した。これは、金からなる光反射性金属層を樹脂粒子表面に形成した導電性粒子を用いた比較例1のものより高い値を示し、LED実装サンプルからの光の取り出し効率の向上がみられた。
さらに、500時間の高温高湿試験後において初期全光束量の変化はなく、また、電気特性についてはも初期状態から変化がなく、導電性粒子の変色及びマイグレーションが発生していないことを確認した。
銀:金:ハフニウム=80:10:10からなる光反射性金属層を形成した実施例4の異方性導電接着剤を用いた樹脂硬化物は、反射率が50%を示すとともに、LED実装サンプルの全光束量は360mlmを示した。これは、金からなる光反射性金属層を樹脂粒子表面に形成した導電性粒子を用いた比較例1のものより高い値を示し、LED実装サンプルからの光の取り出し効率の向上がみられた。
さらに、500時間の高温高湿試験後において初期全光束量の変化はなく、また、電気特性についてはも初期状態から変化がなく、導電性粒子の変色及びマイグレーションが発生していないことを確認した。
ニッケルめっきを施した樹脂粒子表面に銀:金:ハフニウム=60:30:20からなる光反射性金属層を形成した実施例5の異方性導電接着剤を用いた樹脂硬化物は、反射率が50%を示すとともに、LED実装サンプルの全光束量は370mlmを示した。これは、金からなる光反射性金属層を樹脂粒子表面に形成した導電性粒子を用いた比較例1のものより高い値を示し、LED実装サンプルからの光の取り出し効率の向上がみられた。
さらに、500時間の高温高湿試験後において初期全光束量の変化はなく、また、電気特性についてはも初期状態から変化がなく、導電性粒子の変色及びマイグレーションが発生していないことを確認した。
樹脂粒子の表面に金からなる光反射性金属層を形成した導電性粒子を用いた比較例1の異方性導電接着剤を用いた樹脂硬化物は、反射率が8%を示すとともに、LED実装サンプルの全光束量は200mlmを示し、LEDチップからの光の取り出し効率が実施例1〜5のものと比較して小さかった。これは、LEDチップから発生した光が導電性粒子表面の金に吸収されるためであると考えられる。
樹脂粒子の表面に銀からなる光反射性金属層を形成した比較例2のものは、反射率が55%を示すとともに、LED実装サンプルの全光束量は390mlmを示し、LEDチップからの光の取り出し効率は大きかった。
しかし、500時間の高温高湿試験後における全光束量が20%減少した。さらに、同試験後において軽度のリーク(短絡)が発生するとともに、顕微鏡による外観観察において、導電性粒子の変色を確認した。
光反射性金属層の組成比を銀:金:ハフニウム=98:1:1とした比較例3のものは、反射率が52%を示すとともに、LED実装サンプルの全光束量は370mlmを示しLEDチップからの光の取り出し効率は大きかった。
しかし、500時間の高温高湿試験後における全光束量が15%減少した。さらに、同試験後において軽度のリーク(短絡)が発生するとともに、顕微鏡による外観観察において、導電性粒子の変色を確認した。
光反射性金属層の組成比を銀:金:ハフニウム=30:5:65とした比較例4のものは、反射率が35%を示すとともに、LED実装サンプルの全光束量は280mlmを示しLEDチップからの光の取り出し効率は実施例3のものと同等であった。
しかし、初期及び500時間の高温高湿試験後において、導通抵抗が大きくなることを確認した。
光反射性金属層の組成比を銀:金:ハフニウム=30:62:8とした比較例5のものは、反射率が15%を示すとともに、LED実装サンプルの全光束量は230mlmを示し、LEDチップからの光の取り出し効率が実施例1〜5のものと比較して小さかった。
図3におけるグラフの曲線aは、上記実施例5の異方性導電接着剤の反射率を示すものであり、図3のグラフの曲線bは、上記比較例1の異方性導電接着剤の反射率を示すものである。
2…絶縁性接着剤樹脂
3…導電性粒子
10…発光装置
20…配線基板
21…第1の接続電極
22…第2の接続電極
30…樹脂粒子
31…光反射性金属層
32…下地めっき層
40…発光素子
41…第1の接続電極
42…第2の接続電極
Claims (4)
- 絶縁性接着剤樹脂中に光反射性の導電性粒子を含有する異方性導電接着剤であって、
前記導電性粒子が、核となる樹脂粒子の表面に、銀と、金と、ハフニウムとを含有する合金からなる光反射性金属層が形成されてなるものであり、前記導電性粒子における光反射性金属層の組成比が、銀が50重量%以上80重量%以下、金が10重量%以上45重量%以下、ハフニウムが10重量%以上40重量%以下で、全体として100重量%を超えない範囲である異方性導電接着剤。 - 請求項1記載の異方性導電接着剤を製造する方法であって、
前記光反射性金属層を、スパッタリング法によって形成する工程を有する異方性導電接着剤の製造方法。 - 対となる接続電極を有する配線基板と、
前記配線基板の対となる接続電極にそれぞれ対応する接続電極を有する発光素子とを備え、
請求項1記載の異方性導電接着剤によって前記発光素子が前記配線基板上に接着され、かつ、当該発光素子の接続電極が、当該異方性導電接着剤の導電性粒子を介して当該配線基板の対応する接続電極に対しそれぞれ電気的に接続されている発光装置。 - 対となる接続電極を有する配線基板と、前記配線基板の接続電極にそれぞれ対応する接続電極を有する発光素子とを用意し、
前記配線基板の接続電極と前記発光素子の接続電極を対向する方向に配置した状態で、当該発光素子と当該発光素子との間に請求項1記載の異方性導電接着剤を配置し、
前記配線基板に対して前記発光素子を熱圧着する工程を有する発光装置の製造方法。
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US10504767B2 (en) | 2016-11-23 | 2019-12-10 | Rohinni, LLC | Direct transfer apparatus for a pattern array of semiconductor device die |
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