KR100716871B1 - 반도체패키지용 캐리어프레임 및 이를 이용한반도체패키지와 그 제조 방법 - Google Patents
반도체패키지용 캐리어프레임 및 이를 이용한반도체패키지와 그 제조 방법 Download PDFInfo
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- KR100716871B1 KR100716871B1 KR1020010019341A KR20010019341A KR100716871B1 KR 100716871 B1 KR100716871 B1 KR 100716871B1 KR 1020010019341 A KR1020010019341 A KR 1020010019341A KR 20010019341 A KR20010019341 A KR 20010019341A KR 100716871 B1 KR100716871 B1 KR 100716871B1
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Abstract
Description
Claims (19)
- 반도체패키지용 섭스트레이트와 접착수단으로 접착되는 사각판 모양의 아웃터프레임;상기 아웃터프레임의 내측 상부를 향하여 일정한 경사각을 가지며 연장된 경사면;상기 경사면의 내측을 향하여 상기 아웃터프레임과 평행한 면을 가지며 연장되고, 중앙에는 상기 섭스트레이트에 부착될 반도체칩이 외부에서 보일수 있도록 개구가 형성된 인너프레임을 포함하고,상기 인너프레임은 모서리에서 상기 개구까지 절개부가 더 형성된 것을 특징으로 하는 반도체패키지용 캐리어프레임.
- 제1항에 있어서, 상기 인너프레임은 표면에 다수의 요홈이 더 형성된 것을 특징으로 하는 반도체패키지용 캐리어프레임.
- 제1항에 있어서, 상기 개구는 상기 인너프레임에 행과 열을 가지며 다수가 배열되어 형성된 것을 특징으로 하는 반도체패키지용 캐리어프레임.
- 삭제
- 제1항에 있어서, 상기 인너프레임 상면에는, 상기 인너프레임과 평행한 면을 갖되, 상기 인너프레임의 모서리와 대응되는 모서리에는 챔퍼가 형성된 플랜지가 구비되고, 상기 플랜지 내측으로는 경사면이 형성되며, 상기 경사면 내측에는 상기 개구를 덮는 커버로 이루어진 보조프레임이 더 위치됨을 특징으로 하는 반도체패키지용 캐리어프레임.
- 제5항에 있어서, 상기 보조프레임의 플랜지 하면에는 다수의 돌기가 형성되고, 상기 돌기와 대응되는 상기 캐리어프레임의 인너프레임에는 다수의 통공이 형성된 것을 특징으로 하는 반도체패키지용 캐리어프레임.
- 상면에 다수의 입출력패드가 형성된 반도체칩;상기 반도체칩의 하면에 접착수단이 개재되어 접착된 동시에, 표면에는 다수의 본드핑거 및 볼랜드를 갖는 회로패턴이 형성된 섭스트레이트;상기 반도체칩의 입출력패드와 섭스트레이트의 회로패턴중 본드핑거를 상호 전기적으로 연결하는 도전성와이어;상기 섭스트레이트의 상면과 일정 거리 이격되어 위치된 동시에 상기 반도체칩이 위치하도록 개구가 형성된 인너프레임;상기 섭스트레이트 상면의 반도체칩, 도전성와이어 및 인너프레임이 봉지재로 봉지되어 형성된 봉지부; 및,상기 섭스트레이트의 회로패턴중 볼랜드에 융착된 다수의 도전성볼을 포함하고,상기 인너프레임은 모서리에서 상기 개구까지 절개부가 더 형성된 것을 특징으로 하는 반도체패키지.
- 제7항에 있어서, 상기 인너프레임은 상기 도전성와이어와 쇼트(Short)되지 않도록 상기 도전성와이어의 외주연에 위치됨을 특징으로 하는 반도체패키지.
- 제7항에 있어서, 상기 인너프레임은 상기 봉지부와 더욱 강하게 결합될 수 있도록 표면에 다수의 요홈이 형성된 것을 특징으로 하는 반도체패키지.
- 삭제
- 제7항에 있어서, 상기 인너프레임의 상면에는, 모서리에 챔퍼가 형성된 대략 판상의 플랜지와, 상기 플랜지의 내측 상부를 향하여 형성된 경사면과, 상기 경사면의 내측으로 상기 개구를 덮도록 형성된 커버로 이루어진, 보조프레임이 더 위치된 것을 특징으로 하는 반도체패키지.
- 제11항에 있어서, 상기 보조프레임은 커버의 상면이 상기 봉지부 외측으로 노출된 것을 특징으로 하는 반도체패키지.
- 제11항 또는 제12항에 있어서, 상기 인너프레임에는 다수의 통공이 형성되고, 상기 통공과 대응되는 보조프레임의 플랜지 하면에는 다수의 돌기가 더 형성되 어 상호 결합된 것을 특징으로 하는 반도체패키지.
- 사각판 모양의 아웃터프레임과, 상기 아웃터프레임의 내측 상부를 향하여 일정한 경사각을 가지며 연장된 경사면과, 상기 경사면의 내측을 향하여 상기 아웃터프레임과 평행한 면을 가지며 연장되고, 중앙에는 일정크기의 개구가 형성된 인너프레임으로 이루어진 캐리어프레임을 구비하고, 상기 캐리어프레임의 아웃터프레임 하면에는 접착수단을 개재하여 다수의 본드핑거 및 볼랜드를 갖는 회로패턴이 형성된 섭스트레이트를 상호 접착하는 단계;상기 캐리어프레임의 개구를 통해 상부로 노출된 섭스트레이트의 상면에 다수의 입출력패드를 갖는 반도체칩을 접착수단으로 접착하고, 상기 반도체칩의 입출력패드와 상기 섭스트레이트의 회로패턴중 본드핑거를 도전성와이어로 상호 본딩하는 단계;상기 섭스트레이트 상면의 캐리어프레임, 반도체칩 및 도전성와이어를 봉지재로 봉지하여 일정 형태의 봉지부를 형성하는 단계;상기 섭스트레이트의 회로패턴중 볼랜드에 도전성볼을 융착하는 단계;상기 캐리어프레임중 인너프레임이 상기 봉지부 내측에 위치하도록 소잉하여 상기 캐리어프레임 및 섭스트레이트에서 낱개의 반도체패키지가 분리되도록 하는 단계를 포함하고,상기 인너프레임은 모서리에서 상기 개구까지 절개부가 더 형성된 것이 이용됨을 특징으로 하는 반도체패키지의 제조 방법.
- 제14항에 있어서, 상기 인너프레임에는 다수의 요홈이 더 형성된 캐리어프레 임이 이용됨을 특징으로 하는 반도체패키지의 제조 방법.
- 삭제
- 제14항에 있어서, 상기 반도체칩 접착 및 와이어 본딩 단계후에는 상기 캐리어프레임의 인너프레임 상면에, 모서리에 챔퍼가 형성된 대략 판상의 플랜지와, 상기 플랜지의 내측 상부를 향하여 형성된 경사면과, 상기 경사면의 내측으로 상기 개구를 덮도록 형성된 커버로 이루어진 보조프레임을 위치시키는 단계가 더 포함됨을 특징으로 하는 반도체패키지의 제조 방법.
- 제17항에 있어서, 상기 봉지 단계는 상기 보조프레임의 커버 상면이 봉지부 외측으로 노출되도록 함을 특징으로 하는 반도체패키지의 제조 방법.
- 제17항에 있어서, 상기 인너프레임에는 다수의 통공이 더 형성된 캐리어프레임을 이용하고, 상기 통공과 대응되는 플랜지 하면에는 다수의 돌기가 더 형성된 보조프레임이 이용됨을 특징으로 하는 반도체패키지의 제조 방법.
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US10/115,218 US6770961B2 (en) | 2001-04-11 | 2002-04-02 | Carrier frame and semiconductor package including carrier frame |
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