JP6908528B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP6908528B2 JP6908528B2 JP2017555098A JP2017555098A JP6908528B2 JP 6908528 B2 JP6908528 B2 JP 6908528B2 JP 2017555098 A JP2017555098 A JP 2017555098A JP 2017555098 A JP2017555098 A JP 2017555098A JP 6908528 B2 JP6908528 B2 JP 6908528B2
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Description
次に、図4Bに示すように、ベース基板31が除去されることによって、半導体層2の裏面4全体が露出する。この工程は、たとえば、裏面4側からの研削によってベース基板31をほぼ完全に除去した後、研磨(たとえばCMP)によって仕上げてもよい。研磨工程では、研削後に露出している半導体層2をさらに薄化させてもよい。具体的には、350μm厚さのベース基板31を裏面研削によって除去し、その後、50μm厚さの半導体層2を40μm厚さになるまで研磨してもよい。最終的に研磨工程を施すことによって、露出する半導体層2の裏面4の表面状態を滑らかにすることができるので、ドレイン電極24を良好にショットキー接合させることができる。
<裏面終端構造27のバリエーション>
図11および図12は、図3の裏面終端構造27の他の形態を示す図である。
<パンチスルーを防ぐ構造>
図13および図14は、フィールドストップ層42,43を備える半導体装置1の模式的な断面図である。
<裏面ショットキーリークの低減>
図15および図16は、ショットキー界面に形成された電界緩和領域44を説明するための図である。図15および図16は、図3の破線で囲まれた領域Aの拡大図に相当する。
<裏面終端構造27および電界緩和領域44の平面パターン>
図17〜図19は、裏面終端構造27の平面パターンのバリエーションを説明するための図である。図20〜図22は、裏面終端構造27と電界緩和領域44との組み合わせパターンの一例を示す図である。
(式(1)中、Vは、ソース電極18とドレイン電極24との間に逆方向に印加される電圧を示している。)
たとえば、保護絶縁膜53がSiO2である場合、ソース−ドレイン間の印加電圧Vと保護絶縁膜53の厚さtとの関係は次の通りであってもよい。
印加電圧V=1200V:厚さt>4.0μm
印加電圧V=1700V:厚さt>5.7μm
印加電圧V=3000V:厚さt>10.0μm
そして、この半導体装置52によれば、金属基板50へのボンディング側のドレイン電極24の周縁25から半導体層2の端面5までの半導体領域26が保護絶縁膜53で覆われている。これにより、ドレイン電極24を金属基板50に接合して実装したときに、半導体層2の半導体領域26と、接合材51および金属基板50との接触を防止できるので、半導体層2と金属基板50との間の短絡を防止することができる。
<保護絶縁膜53のバリエーション>
図29および図30は、図27の保護絶縁膜53の他の形態を示す図である。
<素子構造のバリエーション>
図31〜図34は、図27の半導体装置52の素子構造のバリエーションを説明するための図である。図31〜図34において、図27の構成要素と同一の要素については共通の参照符号を付し、その説明を省略する。
<半導体層と金属基板との間の短絡を防止できる他の実施形態>
図27〜図34では、半導体層と金属基板との間の短絡を防止できる実施形態の一例を示したが、当該効果は他の実施形態で発現することもできる。
(式(1)中、Vは、前記第1電極と前記第2電極との間に印加される電圧を示している。)
前記他の形態に係る半導体装置では、前記半導体層の第2面側の表面部に形成されたMISFET構造を含み、前記第1電極は、前記半導体層の第1面において前記半導体層にショットキー接合されていてもよい。
2 半導体層
3 (半導体層の)表面
4 (半導体層の)裏面
5 (半導体層の)端面
8 MISトランジスタ構造
9 p型ボディ領域
10 n+型ソース領域
11 ゲート絶縁膜
12 ゲート電極
15 n−型ドリフト領域
18 ソース電極
20 表面終端構造
24 ドレイン電極
25 (ドレイン電極の)周縁
27 裏面終端構造
28 内側周縁
29 外側周縁
31 ベース基板
34 金属膜
36 ダイシングライン
40 リサーフ層
41 ガードリング層
42 表面側フィールドストップ層
43 裏面側フィールドストップ層
44 電界緩和領域
45 平坦部
46 トレンチ
50 金属基板
51 接合材
52 半導体装置
53 保護絶縁膜
54 第1膜
55 第2膜
56 オーバーラップ部
57 内側周縁
58 内側周縁
59 IGBT構造
66 JFET構造
71 半導体パッケージ
72 半導体チップ
73 基板端子
74 スペーサ
75 樹脂パッケージ
76 不純物領域パターン
77 ドレイン端子
78 ソース端子
79 ゲート端子
80 アイランド部
81 端子部
82 接合材
83 周面
84 空間
85 ボンディングワイヤ
86 ボンディングワイヤ
87 接合材
88 外周部
89 p+型アード領域
90 n+型カソード領域
91 カソード電極
92 アノード電極
Claims (16)
- ダイボンディング側の第1面、前記第1面の反対側の第2面、および前記第1面および前記第2面に交差する方向に延びる端面を有する半導体層、前記第1面に形成され、前記端面よりも内側に離れた位置に周縁を有する第1電極、および前記第2面に形成された第2電極を有する半導体チップと、
前記半導体チップがダイボンディングされる導電性基板と、
前記導電性基板上で前記半導体チップを支持する、前記第1電極よりも小さな平面面積を有する導電性スペーサと、
前記半導体チップおよび前記導電性スペーサを少なくとも封止する樹脂パッケージとを含み、
前記半導体チップは、前記第1面側の前記半導体層の表面部に、前記第1電極に電気的に接続された第1導電型の第1不純物領域と、前記第1電極よりも外側で露出する第2導電型の第2不純物領域とを有し、
前記第2不純物領域は、前記第1電極と前記第2電極との間に逆方向電圧が印加されたときに、前記第2電極と同電位となる部分を有しており、
前記半導体チップの前記導電性スペーサよりも外側の部分と前記導電性基板との間の空間に前記樹脂パッケージの一部が入り込んでいる半導体装置であって、
前記半導体装置の耐圧をVB1(V)とし、前記樹脂パッケージの単位長さ当たりの耐圧をVB2(V/mm)とし、前記導電性スペーサの周面と前記第2不純物領域の周面との距離をLとしたとき、前記距離LがVB1/VB2を超える大きさである、半導体装置。 - 前記導電性スペーサは、前記導電性基板上に前記導電性基板と一体的に形成された柱状スペーサを含む、請求項1に記載の半導体装置。
- 前記柱状スペーサは、前記導電性基板の表面に対して垂直な側面を有する直方体形状に形成されている、請求項2に記載の半導体装置。
- 前記柱状スペーサは、前記導電性基板の表面に対して傾斜したテーパ側面を有する形状に形成されている、請求項2に記載の半導体装置。
- 前記柱状スペーサは、当該柱状スペーサの内方へ凹む曲面からなる側面を有する形状に形成されている、請求項2に記載の半導体装置。
- 前記導電性スペーサは、第2接合材を介して前記導電性基板に接合されている、請求項1に記載の半導体装置。
- 前記導電性スペーサおよび前記導電性基板は、互いに異なる材料で形成されている、請求項6に記載の半導体装置。
- ダイボンディング側の第1面、前記第1面の反対側の第2面、および前記第1面および前記第2面に交差する方向に延びる端面を有する半導体層、前記第1面に形成され、前記端面よりも内側に離れた位置に周縁を有する第1電極、および前記第2面に形成された第2電極を有する半導体チップと、
前記半導体チップがダイボンディングされる導電性基板と、
前記導電性基板の一部を選択的に突出させて形成された中空の導電性スペーサであって、前記第1電極よりも小さな平面面積を有する導電性スペーサと、
前記半導体チップおよび前記導電性スペーサを少なくとも封止する樹脂パッケージとを含み、
前記半導体チップは、前記第1面側の前記半導体層の表面部に、前記第1電極に電気的に接続された第1導電型の第1不純物領域と、前記第1電極よりも外側で露出する第2導電型の第2不純物領域とを有し、
前記第2不純物領域は、前記第1電極と前記第2電極との間に逆方向電圧が印加されたときに、前記第2電極と同電位となる部分を有しており、
前記半導体チップの前記導電性スペーサよりも外側の部分と前記導電性基板との間の空間に前記樹脂パッケージの一部が入り込んでいる半導体装置であって、
前記半導体装置の耐圧をVB1(V)とし、前記樹脂パッケージの単位長さ当たりの耐圧をVB2(V/mm)とし、前記導電性スペーサの周面と前記第2不純物領域の周面との距離をLとしたとき、前記距離LがVB1/VB2を超える大きさである、半導体装置。 - 前記導電性スペーサと前記半導体チップの前記第1電極との間に設けられた接合材であって、前記導電性スペーサからはみ出し部が前記第1電極の内側に収まっている接合材を含む、請求項1〜8のいずれか一項に記載の半導体装置。
- 少なくとも前記第1電極の周縁部に接するように形成され、前記第1電極の周縁から前記半導体層の端面までを覆う保護絶縁膜をさらに含む、請求項1〜9のいずれか一項に記載の半導体装置。
- 前記半導体チップの前記導電性スペーサよりも外側の部分と前記導電性基板との間の空間に前記樹脂パッケージの一部が入り込んでおり、
前記半導体チップと前記導電性基板との高さ距離をHとしたとき、前記高さHはVB1/VB2を超える、請求項1〜10のいずれか一項に記載の半導体装置。 - 前記導電性スペーサは、CuまたはCuを含む合金、または表面をCuでめっきした金属からなる、請求項1〜11のいずれか一項に記載の半導体装置。
- 前記導電性基板は、前記半導体チップが配置されるアイランド部と、前記アイランド部から延びる端子部とを含む、請求項1〜12のいずれか一項に記載の半導体装置。
- 前記半導体チップは、前記半導体層の表面部に複数のトランジスタ形成された活性領域と、前記活性領域を囲むように保護素子が形成された外周領域とを有している、請求項1〜13のいずれか一項に記載の半導体装置。
- 前記半導体層は、ワイドバンドギャップ型の半導体層である、請求項1〜14のいずれか一項に記載の半導体装置。
- 請求項1〜15のいずれか一項に記載の半導体装置を双方向スイッチ回路として用いた、電力変換装置。
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