JP6335159B2 - 分割リードフレームを有する集積回路パッケージ - Google Patents

分割リードフレームを有する集積回路パッケージ Download PDF

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Publication number
JP6335159B2
JP6335159B2 JP2015501720A JP2015501720A JP6335159B2 JP 6335159 B2 JP6335159 B2 JP 6335159B2 JP 2015501720 A JP2015501720 A JP 2015501720A JP 2015501720 A JP2015501720 A JP 2015501720A JP 6335159 B2 JP6335159 B2 JP 6335159B2
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Japan
Prior art keywords
leads
magnetic field
die
die attach
lead
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JP2015501720A
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English (en)
Japanese (ja)
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JP2015517098A5 (enExample
JP2015517098A (ja
Inventor
テイラー，ウィリアム・ピー
デヴィッド，ポール
ヴィグ，ラヴィ
シェラー，ピー・カール
フリードリヒ，アンドレアス・ペー
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アレグロ・マイクロシステムズ・エルエルシー
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Priority claimed from US13/424,618 external-priority patent/US10234513B2/en
Priority claimed from US13/748,999 external-priority patent/US9812588B2/en
Priority claimed from US13/749,776 external-priority patent/US9494660B2/en
Application filed by アレグロ・マイクロシステムズ・エルエルシー filed Critical アレグロ・マイクロシステムズ・エルエルシー
Publication of JP2015517098A publication Critical patent/JP2015517098A/ja
Publication of JP2015517098A5 publication Critical patent/JP2015517098A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00—Galvanomagnetic devices
    • H10N50/80—Constructional details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/0011—Arrangements or instruments for measuring magnetic variables comprising means, e.g. flux concentrators, flux guides, for guiding or concentrating the magnetic flux, e.g. to the magnetic sensor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/0047—Housings or packaging of magnetic sensors ; Holders
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/0052—Manufacturing aspects; Manufacturing of single devices, i.e. of semiconductor magnetic sensor chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/4826—Connecting between the body and an opposite side of the item with respect to the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Measuring Magnetic Variables (AREA)
  • Hall/Mr Elements (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP2015501720A 2012-03-20 2013-03-11 分割リードフレームを有する集積回路パッケージ Active JP6335159B2 (ja)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US13/424,618 US10234513B2 (en) 2012-03-20 2012-03-20 Magnetic field sensor integrated circuit with integral ferromagnetic material
US13/424,618 2012-03-20
US13/748,999 US9812588B2 (en) 2012-03-20 2013-01-24 Magnetic field sensor integrated circuit with integral ferromagnetic material
US13/748,999 2013-01-24
US13/749,776 US9494660B2 (en) 2012-03-20 2013-01-25 Integrated circuit package having a split lead frame
US13/749,776 2013-01-25
US13/788,210 2013-03-07
US13/788,210 US9666788B2 (en) 2012-03-20 2013-03-07 Integrated circuit package having a split lead frame
PCT/US2013/030112 WO2013142112A1 (en) 2012-03-20 2013-03-11 Integrated circuit package having a split lead frame

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2017135582A Division JP2018009991A (ja) 2012-03-20 2017-07-11 分割リードフレームを有する集積回路パッケージ

Publications (3)

Publication Number Publication Date
JP2015517098A JP2015517098A (ja) 2015-06-18
JP2015517098A5 JP2015517098A5 (enExample) 2015-11-05
JP6335159B2 true JP6335159B2 (ja) 2018-05-30

Family

ID=47997861

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2015501720A Active JP6335159B2 (ja) 2012-03-20 2013-03-11 分割リードフレームを有する集積回路パッケージ
JP2017135582A Pending JP2018009991A (ja) 2012-03-20 2017-07-11 分割リードフレームを有する集積回路パッケージ

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2017135582A Pending JP2018009991A (ja) 2012-03-20 2017-07-11 分割リードフレームを有する集積回路パッケージ

Country Status (6)

Country Link
US (1) US9666788B2 (enExample)
EP (1) EP2817647B1 (enExample)
JP (2) JP6335159B2 (enExample)
KR (1) KR101953643B1 (enExample)
CN (1) CN104204833B (enExample)
WO (1) WO2013142112A1 (enExample)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8629539B2 (en) 2012-01-16 2014-01-14 Allegro Microsystems, Llc Methods and apparatus for magnetic sensor having non-conductive die paddle
US10234513B2 (en) 2012-03-20 2019-03-19 Allegro Microsystems, Llc Magnetic field sensor integrated circuit with integral ferromagnetic material
US9812588B2 (en) 2012-03-20 2017-11-07 Allegro Microsystems, Llc Magnetic field sensor integrated circuit with integral ferromagnetic material
US9494660B2 (en) * 2012-03-20 2016-11-15 Allegro Microsystems, Llc Integrated circuit package having a split lead frame
US9666788B2 (en) 2012-03-20 2017-05-30 Allegro Microsystems, Llc Integrated circuit package having a split lead frame
US9411025B2 (en) * 2013-04-26 2016-08-09 Allegro Microsystems, Llc Integrated circuit package having a split lead frame and a magnet
DE102014100119B4 (de) 2014-01-07 2022-07-14 Infineon Technologies Ag Magnetpackage und Verfahren zum Herstellen eines Magnetpackage
DE102014213231A1 (de) * 2014-07-08 2016-01-14 Continental Automotive Gmbh Sensorunterseitig verschaltete passive Bauelemente
US9564423B2 (en) * 2015-06-23 2017-02-07 Infineon Technologies Ag Power package with integrated magnetic field sensor
EP3125290A1 (en) * 2015-07-31 2017-02-01 Nxp B.V. Electronic device
EP3156770A1 (en) * 2015-10-15 2017-04-19 Nxp B.V. Rotational sensor
US10411498B2 (en) 2015-10-21 2019-09-10 Allegro Microsystems, Llc Apparatus and methods for extending sensor integrated circuit operation through a power disturbance
JP6555213B2 (ja) * 2016-08-23 2019-08-07 株式会社デンソー 位置検出装置
US9958292B1 (en) * 2016-10-25 2018-05-01 Nxp B.V. Sensor package with double-sided capacitor attach on same leads and method of fabrication
JP6740863B2 (ja) * 2016-11-04 2020-08-19 アイシン精機株式会社 電子部品
JP6740864B2 (ja) * 2016-11-04 2020-08-19 アイシン精機株式会社 電子部品
EP3331007A1 (en) * 2016-12-05 2018-06-06 Melexis Technologies SA Integrated circuit package comprising lead frame
US10978897B2 (en) 2018-04-02 2021-04-13 Allegro Microsystems, Llc Systems and methods for suppressing undesirable voltage supply artifacts
US10718794B2 (en) 2018-06-20 2020-07-21 Allegro Microsystems, Llc Current sensor with power calculation
US10921391B2 (en) 2018-08-06 2021-02-16 Allegro Microsystems, Llc Magnetic field sensor with spacer
DE102019110570B4 (de) 2019-04-24 2023-05-25 Infineon Technologies Ag Magnetfeldsensorpackage mit integrierter passiver komponente
CN110193460B (zh) * 2019-05-29 2021-04-27 北京工业大学 一种全向型磁集中器式兰姆波电磁声换能器
US10991644B2 (en) 2019-08-22 2021-04-27 Allegro Microsystems, Llc Integrated circuit package having a low profile
US11150273B2 (en) 2020-01-17 2021-10-19 Allegro Microsystems, Llc Current sensor integrated circuits
US11183436B2 (en) 2020-01-17 2021-11-23 Allegro Microsystems, Llc Power module package and packaging techniques
CN114252820A (zh) * 2020-09-24 2022-03-29 迈来芯电子科技有限公司 磁传感器部件和组件
DE102020006987B3 (de) * 2020-11-09 2021-10-14 Leibniz-Institut für Photonische Technologien e.V. (Engl.Leibniz Institute of Photonic Technology) Magnetisches System zur Zählung von Umdrehungen mit erhöhter magnetischer Störfeldfestigkeit
US11768229B2 (en) 2021-08-23 2023-09-26 Allegro Microsystems, Llc Packaged current sensor integrated circuit
US12163983B2 (en) 2021-08-23 2024-12-10 Allegro Microsystems, Llc Packaged current sensor integrated circuit
US12487254B2 (en) 2021-08-23 2025-12-02 Allegro Microsystems, Llc Packaged current sensor integrated circuit
US12493057B2 (en) 2023-11-17 2025-12-09 Allegro Microsystems, Llc Current sensor integrated circuit
CN117606324B (zh) * 2024-01-22 2024-03-26 四川英创力电子科技股份有限公司 一种电路板双面孔位高效检测装置及方法

Family Cites Families (440)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3195043A (en) 1961-05-19 1965-07-13 Westinghouse Electric Corp Hall effect proximity transducer
DE1514822A1 (de) 1964-08-14 1969-06-26 Telefunken Patent Verfahren zur Herstellung einer Halbleiteranordnung
US3607528A (en) 1968-02-08 1971-09-21 James S Gassaway Magnetic memory members and methods of making the same
US3661061A (en) 1969-05-05 1972-05-09 Atomic Energy Commission Picture position finder
US3627901A (en) 1969-12-19 1971-12-14 Texas Instruments Inc Composite electronic device package-connector unit
FR2114148A5 (enExample) 1970-11-16 1972-06-30 Crouzet Sa
US3762039A (en) * 1971-09-10 1973-10-02 Mos Technology Inc Plastic encapsulation of microcircuits
US4048670A (en) 1975-06-30 1977-09-13 Sprague Electric Company Stress-free hall-cell package
US4204317A (en) 1977-11-18 1980-05-27 The Arnold Engineering Company Method of making a lead frame
US4210926A (en) 1977-12-07 1980-07-01 Siemens Aktiengesellschaft Intermediate member for mounting and contacting a semiconductor body
US4188605A (en) 1978-07-21 1980-02-12 Stout Glenn M Encapsulated Hall effect device
US4283643A (en) 1979-05-25 1981-08-11 Electric Power Research Institute, Inc. Hall sensing apparatus
US4315523A (en) 1980-03-06 1982-02-16 American Flow Systems, Inc. Electronically controlled flow meter and flow control system
US4262275A (en) 1980-03-27 1981-04-14 International Business Machines Corporation Hall effect apparatus for flux concentrator assembly therefor
US4425596A (en) 1980-09-26 1984-01-10 Tokyo Shibaura Denki Kabushiki Kaisha Electric circuit breaker
US4409608A (en) 1981-04-28 1983-10-11 The United States Of America As Represented By The Secretary Of The Navy Recessed interdigitated integrated capacitor
WO1983000949A1 (en) 1981-09-01 1983-03-17 Motorola Inc Improved glass bonding means and method
JPS5979417A (ja) 1982-10-28 1984-05-08 Sony Corp 磁気ヘツド装置
DE3243039A1 (de) 1982-11-22 1984-05-24 Telefunken electronic GmbH, 6000 Frankfurt Magnetempfindliches halbleiterbauelement
US4670715A (en) 1983-01-28 1987-06-02 Caterpillar Inc. Frictionally supported gear tooth sensor with self-adjusting air gap
JPS60152256A (ja) 1984-01-18 1985-08-10 Atsugi Motor Parts Co Ltd モ−タの製造方法
JPS60257546A (ja) 1984-06-04 1985-12-19 Mitsubishi Electric Corp 半導体装置及びその製造方法
JPS6171649A (ja) 1984-09-17 1986-04-12 Seiko Instr & Electronics Ltd Ｉｃパツケ−ジ
US4542259A (en) 1984-09-19 1985-09-17 Olin Corporation High density packages
US4614111A (en) 1985-02-15 1986-09-30 Wolff George D Position sensor for fuel injection apparatus
DE3590792T (enExample) 1985-05-10 1987-07-16
US4719419A (en) 1985-07-15 1988-01-12 Harris Graphics Corporation Apparatus for detecting a rotary position of a shaft
JPS6234316A (ja) 1985-08-07 1987-02-14 Victor Co Of Japan Ltd 磁気抵抗効果素子を用いた磁気ヘツド、及びその製作法
JPS62235523A (ja) 1986-03-19 1987-10-15 Honda Motor Co Ltd 回転角センサの製造方法
JPS62260374A (ja) 1986-05-06 1987-11-12 Toshiba Corp 集磁効果型ホ−ル素子とその製造方法
GB2191632A (en) 1986-06-16 1987-12-16 George D Wolff Position sensor assemblies and methods for fabricating same
US4745363A (en) 1986-07-16 1988-05-17 North American Philips Corporation Non-oriented direct coupled gear tooth sensor using a Hall cell
JPS6351647A (ja) 1986-08-21 1988-03-04 Fujitsu Ltd 半導体装置の製造方法
JPS6384176A (ja) 1986-09-29 1988-04-14 Toshiba Corp 磁界収束型ホ−ル素子及びその製造方法
JPS63191069A (ja) 1986-12-12 1988-08-08 Mitsubishi Electric Corp 電流検出器
US4746859A (en) 1986-12-22 1988-05-24 Sundstrand Corporation Power and temperature independent magnetic position sensor for a rotor
US4772929A (en) 1987-01-09 1988-09-20 Sprague Electric Company Hall sensor with integrated pole pieces
US4789826A (en) 1987-03-19 1988-12-06 Ampex Corporation System for sensing the angular position of a rotatable member using a hall effect transducer
JPS63263782A (ja) 1987-04-22 1988-10-31 Hitachi Ltd 磁電変換素子
US5012322A (en) 1987-05-18 1991-04-30 Allegro Microsystems, Inc. Semiconductor die and mounting assembly
US5078944A (en) 1987-11-02 1992-01-07 Matsushita Electric Industrial Co., Ltd. Method for making permanent magnet type demagnetizing head
JPH01184885A (ja) 1988-01-13 1989-07-24 Murata Mfg Co Ltd 半導体装置
US4983916A (en) 1988-01-26 1991-01-08 Yamaha Corporation Compact magnetic encoder
JPH01207909A (ja) 1988-02-16 1989-08-21 Fuji Electric Co Ltd 半導体集積回路
US5041780A (en) 1988-09-13 1991-08-20 California Institute Of Technology Integrable current sensors
KR0158868B1 (ko) 1988-09-20 1998-12-01 미다 가쓰시게 반도체장치
JPH0248882U (enExample) 1988-09-30 1990-04-04
US4910861A (en) 1988-10-07 1990-03-27 Emerson Electric Co. Method of manufacturing retention structure for electric motor rotor magnets
KR930004094Y1 (ko) 1988-10-11 1993-06-30 미쓰비시전기 주식회사 홀 효과형 센서장치
JPH02124575A (ja) 1988-11-02 1990-05-11 Canon Inc フォトレジストの現像方法
WO1990007176A1 (de) 1988-12-15 1990-06-28 Siemens Aktiengesellschaft Dünnfilm-magnetkopf mit in einem substrat versenkten teilen sowie verfahren zu dessen herstellung
US4893073A (en) 1989-01-30 1990-01-09 General Motors Corporation Electric circuit board current sensor
KR910004884B1 (ko) 1989-02-01 1991-07-15 한국식품개발연구원 유지류의 산화억제방법
US5789915A (en) 1989-02-17 1998-08-04 Nartron Corporation Magnetic field energy responsive position sensing apparatus and method
US5010263A (en) 1989-02-21 1991-04-23 Mitsubishi Denki Kabushiki Kaisha Hall effect type sensing device
US4935698A (en) 1989-03-03 1990-06-19 Sprague Electric Company Sensor having dual Hall IC, pole piece and magnet
JPH02236183A (ja) 1989-03-09 1990-09-19 Mitsubishi Electric Corp ホールセンサ装置及びその製造方法
US5196794A (en) 1989-03-14 1993-03-23 Mitsubishi Denki K.K. Hall-effect sensor with integrally molded frame, magnet, flux guide and insulative film
JPH088330B2 (ja) 1989-07-19 1996-01-29 日本電気株式会社 Ｌｏｃ型リードフレームを備えた半導体集積回路装置
JPH0814617B2 (ja) 1989-08-10 1996-02-14 三洋電機株式会社 磁気センサの製造方法
JP2522214B2 (ja) 1989-10-05 1996-08-07 日本電装株式会社 半導体装置およびその製造方法
US4994731A (en) 1989-11-27 1991-02-19 Navistar International Transportation Corp. Two wire and multiple output Hall-effect sensor
US5124642A (en) 1989-12-21 1992-06-23 Sigma Instruments, Inc. Power line post insulator with dual inductor current sensor
US5121289A (en) 1990-01-31 1992-06-09 Honeywell Inc. Encapsulatable sensor assembly
US5021493A (en) 1990-03-21 1991-06-04 The Goodyear Tire & Rubber Company Rubber composition and tire with component(s) thereof
US5583375A (en) 1990-06-11 1996-12-10 Hitachi, Ltd. Semiconductor device with lead structure within the planar area of the device
US5045920A (en) 1990-06-28 1991-09-03 Allegro Microsystems, Inc. Dual-Hall ferrous-article-proximity sensor
JPH0497370A (ja) 1990-08-14 1992-03-30 Ricoh Co Ltd 電子写真装置
JPH04152688A (ja) 1990-10-17 1992-05-26 Fujitsu Ltd 磁気抵抗素子
US5185919A (en) 1990-11-19 1993-02-16 Ford Motor Company Method of manufacturing a molded fuel injector
US5139973A (en) 1990-12-17 1992-08-18 Allegro Microsystems, Inc. Method for making a semiconductor package with the distance between a lead frame die pad and heat spreader determined by the thickness of an intermediary insulating sheet
US5216405A (en) 1991-01-14 1993-06-01 General Motors Corporation Package for the magnetic field sensitive device
US5167896A (en) 1991-01-16 1992-12-01 Kyowa Electric & Chemical Co., Ltd. Method of manufacturing a front cabinet for use with a display
JPH05206185A (ja) 1991-04-16 1993-08-13 Fujitsu Miyagi Electron:Kk 半導体装置の製造装置
JPH04329682A (ja) 1991-05-01 1992-11-18 Matsushita Electron Corp 磁電変換装置
US5349743A (en) 1991-05-02 1994-09-27 At&T Bell Laboratories Method of making a multilayer monolithic magnet component
US5491633A (en) 1991-05-20 1996-02-13 General Motors Corporation Position sensor for electromechanical suspension
JPH04357858A (ja) 1991-06-04 1992-12-10 Sharp Corp 半導体装置
JPH04364472A (ja) 1991-06-12 1992-12-16 Fuji Electric Co Ltd 磁電変換装置
US5366816A (en) 1991-06-20 1994-11-22 Titan Kogyo Kabushiki Kaisha Potassium hexatitanate whiskers having a tunnel structure
JP2958821B2 (ja) 1991-07-08 1999-10-06 株式会社村田製作所 ソリッドインダクタ
WO1993002479A1 (fr) 1991-07-16 1993-02-04 Asahi Kasei Kogyo Kabushiki Kaisha Capteur a semiconductor et son procede de fabrication
EP0537419A1 (de) 1991-10-09 1993-04-21 Landis & Gyr Business Support AG Anordnung mit einem integrierten Magnetfeldsensor sowie einem ferromagnetischen ersten und zweiten Magnetfluss-Konzentrator und Verfahren zum Einbau einer Vielzahl von Anordnungen in je einem Kunststoffgehäuse
JPH05126865A (ja) 1991-10-22 1993-05-21 Hitachi Ltd 電流検出装置あるいは電流検出方法
KR940007757Y1 (ko) 1991-11-14 1994-10-24 금성일렉트론 주식회사 반도체 패키지
DE4141386C2 (de) 1991-12-16 1995-06-29 Itt Ind Gmbh Deutsche Hallsensor
CA2080177C (en) 1992-01-02 1997-02-25 Edward Allan Highum Electro-magnetic shield and method for making the same
JPH05226566A (ja) * 1992-02-12 1993-09-03 Nec Corp リードフレーム
US5210493A (en) 1992-02-27 1993-05-11 General Motors Corporation Method for embedding wires within a powder metal core and sensor assembly produced by such a method
US5196821A (en) 1992-03-09 1993-03-23 General Motors Corporation Integrated magnetic field sensor
US5286426A (en) 1992-04-01 1994-02-15 Allegro Microsystems, Inc. Assembling a lead frame between a pair of molding cavity plates
US5442228A (en) 1992-04-06 1995-08-15 Motorola, Inc. Monolithic shielded integrated circuit
US5250925A (en) 1992-05-11 1993-10-05 General Motors Corporation Package for speed sensing device having minimum air gap
US5497081A (en) 1992-06-22 1996-03-05 Durakool Incorporated Mechanically adjustable linear-output angular position sensor
US5757181A (en) 1992-06-22 1998-05-26 Durakool Incorporated Electronic circuit for automatically compensating for errors in a sensor with an analog output signal
US5332965A (en) 1992-06-22 1994-07-26 Durakool Incorporated Contactless linear angular position sensor having an adjustable flux concentrator for sensitivity adjustment and temperature compensation
CH683469A5 (de) 1992-07-03 1994-03-15 Landis & Gyr Business Support Anordnung mit einem einen Magnetfeldsensor enthaltenden Halbleiterplättchen zwischen einem ersten und einem zweiten Polschuh und Verfahren zur Herstellung einer Vielzahl der Anordnungen.
JP2691665B2 (ja) 1992-07-07 1997-12-17 日本精機株式会社 指針の製造方法
JPH0655971A (ja) 1992-08-05 1994-03-01 Anden Kk 電子式方向指示器
US5691637A (en) 1992-08-28 1997-11-25 True Position Magnetics, Inc. Magnetic field position transducer for two or more dimensions
US5289344A (en) 1992-10-08 1994-02-22 Allegro Microsystems Inc. Integrated-circuit lead-frame package with failure-resistant ground-lead and heat-sink means
JP2979865B2 (ja) 1992-10-27 1999-11-15 三菱電機株式会社 注水タイミング検出装置
GB2273782A (en) 1992-12-24 1994-06-29 Hocking Ndt Limited Eddy current flaw detection of sheet metal adjacent fasteners
JPH06216308A (ja) 1993-01-14 1994-08-05 Mitsubishi Electric Corp 樹脂封止型半導体装置
WO1994017558A1 (en) 1993-01-29 1994-08-04 The Regents Of The University Of California Monolithic passive component
ZA941138B (en) 1993-02-26 1994-08-29 Westinghouse Electric Corp Circuit breaker responsive to repeated in-rush currents produced by a sputtering arc fault.
JP3238004B2 (ja) 1993-07-29 2001-12-10 株式会社東芝 半導体装置の製造方法
US5619012A (en) 1993-12-10 1997-04-08 Philips Electronics North America Corporation Hinged circuit assembly with multi-conductor framework
JPH07203645A (ja) 1993-12-30 1995-08-04 Mabuchi Motor Co Ltd 小型モータ及びその回転子の製造方法
US5414355A (en) 1994-03-03 1995-05-09 Honeywell Inc. Magnet carrier disposed within an outer housing
US5434105A (en) 1994-03-04 1995-07-18 National Semiconductor Corporation Process for attaching a lead frame to a heat sink using a glob-top encapsulation
US5508611A (en) 1994-04-25 1996-04-16 General Motors Corporation Ultrathin magnetoresistive sensor package
DE19520700B4 (de) 1994-06-09 2004-09-09 Samsung Electronics Co., Ltd., Suwon Halbleiterbausteinanordnung
JPH08102563A (ja) 1994-08-02 1996-04-16 Toshiba Corp 半導体ホール素子
DE9414104U1 (de) 1994-08-31 1994-11-03 Siemens AG, 80333 München Näherungsschalter mit magnetempfindlichem Sensor
JPH0897486A (ja) 1994-09-22 1996-04-12 Hitachi Cable Ltd ホールセンサ
US5666004A (en) 1994-09-28 1997-09-09 Intel Corporation Use of tantalum oxide capacitor on ceramic co-fired technology
JPH08116016A (ja) 1994-10-15 1996-05-07 Toshiba Corp リードフレーム及び半導体装置
US5581170A (en) 1994-12-12 1996-12-03 Unitrode Corporation Battery protector
US5579194A (en) 1994-12-13 1996-11-26 Eaton Corporation Motor starter with dual-slope integrator
US5500589A (en) 1995-01-18 1996-03-19 Honeywell Inc. Method for calibrating a sensor by moving a magnet while monitoring an output signal from a magnetically sensitive component
US5488294A (en) 1995-01-18 1996-01-30 Honeywell Inc. Magnetic sensor with means for retaining a magnet at a precise calibrated position
DE59607223D1 (de) 1995-02-02 2001-08-09 Siemens Ag Einrichtung zur drehzahlmessung oder drehrichtungserkennung eines drehmagnetfeldes
JPH08264569A (ja) 1995-03-22 1996-10-11 Hitachi Ltd 樹脂封止型半導体装置の製造方法
JP3007553B2 (ja) 1995-03-24 2000-02-07 日本レム株式会社 電流センサ
US5627315A (en) 1995-04-18 1997-05-06 Honeywell Inc. Accelerometer with a cantilever beam formed as part of the housing structure
US5949132A (en) 1995-05-02 1999-09-07 Texas Instruments Incorporated Dambarless leadframe for molded component encapsulation
JP3605880B2 (ja) 1995-05-12 2004-12-22 株式会社デンソー 非接触型回転センサ
US5615075A (en) 1995-05-30 1997-03-25 General Electric Company AC/DC current sensor for a circuit breaker
US5581179A (en) 1995-05-31 1996-12-03 Allegro Microsystems, Inc. Hall-effect ferrous-article-proximity sensor assembly
US5691869A (en) 1995-06-06 1997-11-25 Eaton Corporation Low cost apparatus for detecting arcing faults and circuit breaker incorporating same
US5818222A (en) 1995-06-07 1998-10-06 The Cherry Corporation Method for adjusting ferrous article proximity detector
US5781005A (en) 1995-06-07 1998-07-14 Allegro Microsystems, Inc. Hall-effect ferromagnetic-article-proximity sensor
US5719496A (en) 1995-06-07 1998-02-17 Durakool Incorporated Dual-element proximity sensor for sensing the direction of rotation of a ferrous target wheel
JP3603406B2 (ja) 1995-09-11 2004-12-22 株式会社デンソー 磁気検出センサおよびその製造方法
US5712562A (en) 1995-10-13 1998-01-27 Bently Nevada Corporation Encapsulated transducer with an alignment plug and method of manufacture
EP0772046B1 (de) 1995-10-30 2002-04-17 Sentron Ag Magnetfeldsensor und Strom- oder Energiesensor
DE19540674C2 (de) 1995-10-31 1999-01-28 Siemens Ag Adaptionsverfahren zur Korrektur von Toleranzen eines Geberrades
US6066890A (en) 1995-11-13 2000-05-23 Siliconix Incorporated Separate circuit devices in an intra-package configuration and assembly techniques
JPH09166612A (ja) 1995-12-18 1997-06-24 Nissan Motor Co Ltd 磁気センサ
US5770479A (en) 1996-01-11 1998-06-23 Micron Technology, Inc. Bonding support for leads-over-chip process
US5729130A (en) 1996-01-17 1998-03-17 Moody; Kristann L. Tracking and holding in a DAC the peaks in the field-proportional voltage in a slope activated magnetic field sensor
US5631557A (en) 1996-02-16 1997-05-20 Honeywell Inc. Magnetic sensor with encapsulated magnetically sensitive component and magnet
JP3651104B2 (ja) 1996-03-29 2005-05-25 ソニー株式会社 磁気トンネリング接合素子
US5726577A (en) 1996-04-17 1998-03-10 Eaton Corporation Apparatus for detecting and responding to series arcs in AC electrical systems
FR2748105B1 (fr) 1996-04-25 1998-05-29 Siemens Automotive Sa Capteur magnetique et procede de realisation d'un tel capteur
JP2816668B2 (ja) 1996-07-04 1998-10-27 愛知製鋼株式会社 磁気異方性樹脂結合型磁石の製造方法
JPH1022422A (ja) 1996-07-04 1998-01-23 Nippon Motorola Ltd ２層樹脂封止型集積回路装置及びその製造方法
US5817540A (en) 1996-09-20 1998-10-06 Micron Technology, Inc. Method of fabricating flip-chip on leads devices and resulting assemblies
US5943557A (en) 1996-09-25 1999-08-24 Micron Technology, Inc. Method and structure for attaching a semiconductor die to a lead frame
US6175233B1 (en) 1996-10-18 2001-01-16 Cts Corporation Two axis position sensor using sloped magnets to generate a variable magnetic field and hall effect sensors to detect the variable magnetic field
US6072228A (en) 1996-10-25 2000-06-06 Micron Technology, Inc. Multi-part lead frame with dissimilar materials and method of manufacturing
US5804880A (en) 1996-11-04 1998-09-08 National Semiconductor Corporation Solder isolating lead frame
US5912556A (en) 1996-11-06 1999-06-15 Honeywell Inc. Magnetic sensor with a chip attached to a lead assembly within a cavity at the sensor's sensing face
US5729128A (en) 1996-11-22 1998-03-17 Honeywell Inc. Magnetic sensor with a magnetically sensitive component that is movable during calibration and rigidly attachable to a formed magnet
US5859387A (en) 1996-11-29 1999-01-12 Allegro Microsystems, Inc. Semiconductor device leadframe die attach pad having a raised bond pad
JPH10221114A (ja) 1997-02-10 1998-08-21 Mitsubishi Electric Corp 検出装置
US5839185A (en) 1997-02-26 1998-11-24 Sundstrand Corporation Method of fabricating a magnetic flux concentrating core
JPH10267965A (ja) 1997-03-24 1998-10-09 Nana Electron Kk 電流センサ
IT1293839B1 (it) 1997-08-08 1999-03-10 Cazzaniga Spa Raccordo per il collegamento di tubi lisci ad attacchi filettati di apparecchiature idrauliche e simili
US5963028A (en) 1997-08-19 1999-10-05 Allegro Microsystems, Inc. Package for a magnetic field sensing device
US6198373B1 (en) 1997-08-19 2001-03-06 Taiyo Yuden Co., Ltd. Wire wound electronic component
US6353268B1 (en) * 1997-08-22 2002-03-05 Micron Technology, Inc. Semiconductor die attachment method and apparatus
JP3745509B2 (ja) 1997-08-27 2006-02-15 株式会社Ｎｅｏｍａｘ 円筒状樹脂磁石の成形装置
ATE322023T1 (de) 1997-09-15 2006-04-15 Ams Internat Ag Eine stromüberwachungseinrichtung und ein verfahren zu ihrer herstellung
US6150714A (en) 1997-09-19 2000-11-21 Texas Instruments Incorporated Current sense element incorporated into integrated circuit package lead frame
US5883567A (en) 1997-10-10 1999-03-16 Analog Devices, Inc. Packaged integrated circuit with magnetic flux concentrator
DE19746546C1 (de) 1997-10-22 1999-03-04 Telefunken Microelectron Verfahren und Schaltungsanordnung zur kurzzeitigen Aufrechterhaltung einer Ausgangsspannung bei Ausfällen einer Eingangsspannung mittels eines Autarkiekondensators
US6452381B1 (en) 1997-11-28 2002-09-17 Denso Corporation Magnetoresistive type position detecting device
US6359331B1 (en) 1997-12-23 2002-03-19 Ford Global Technologies, Inc. High power switching module
MY118338A (en) 1998-01-26 2004-10-30 Motorola Semiconductor Sdn Bhd A leadframe, a method of manufacturing a leadframe and a method of packaging an electronic component utilising the leadframe.
US6136250A (en) 1998-01-30 2000-10-24 Comair Rotron, Inc. Apparatus and method of encapsulating motors
US6396712B1 (en) 1998-02-12 2002-05-28 Rose Research, L.L.C. Method and apparatus for coupling circuit components
US6324048B1 (en) 1998-03-04 2001-11-27 Avx Corporation Ultra-small capacitor array
JPH11265649A (ja) 1998-03-18 1999-09-28 Mitsubishi Electric Corp 電流検出器及び電流検出器を備えた電力開閉器
US6316736B1 (en) 1998-06-08 2001-11-13 Visteon Global Technologies, Inc. Anti-bridging solder ball collection zones
US6178514B1 (en) 1998-07-31 2001-01-23 Bradley C. Wood Method and apparatus for connecting a device to a bus carrying power and a signal
JP2000058740A (ja) 1998-07-31 2000-02-25 Kankyo Denji Gijutsu Kenkyusho:Kk コモンモードフィルタ素子内蔵半導体デバイス
US6545456B1 (en) 1998-08-12 2003-04-08 Rockwell Automation Technologies, Inc. Hall effect current sensor package for sensing electrical current in an electrical conductor
US6480699B1 (en) 1998-08-28 2002-11-12 Woodtoga Holdings Company Stand-alone device for transmitting a wireless signal containing data from a memory or a sensor
US6424018B1 (en) 1998-10-02 2002-07-23 Sanken Electric Co., Ltd. Semiconductor device having a hall-effect element
JP2000174357A (ja) 1998-10-02 2000-06-23 Sanken Electric Co Ltd ホ―ル効果素子を有する半導体装置
TW434411B (en) 1998-10-14 2001-05-16 Tdk Corp Magnetic sensor apparatus, current sensor apparatus and magnetic sensing element
TW534999B (en) 1998-12-15 2003-06-01 Tdk Corp Magnetic sensor apparatus and current sensor apparatus
JP3378816B2 (ja) 1998-12-21 2003-02-17 三洋電機株式会社 半導体装置およびその製造方法
DE69920890T2 (de) 1999-01-21 2005-02-03 Tdk Corp. Stromsensor
US6377464B1 (en) 1999-01-29 2002-04-23 Conexant Systems, Inc. Multiple chip module with integrated RF capabilities
JP3581268B2 (ja) 1999-03-05 2004-10-27 株式会社東芝 ヒートシンク付半導体装置およびその製造方法
US6278269B1 (en) 1999-03-08 2001-08-21 Allegro Microsystems, Inc. Magnet structure
DE19910411C2 (de) 1999-03-10 2001-08-30 Daimler Chrysler Ag Verfahren und Vorrichtung zur Offset-kompensierten Magnetfeldmessung mittels eines Hallsensors
JP2000294692A (ja) 1999-04-06 2000-10-20 Hitachi Ltd 樹脂封止型電子装置及びその製造方法並びにそれを使用した内燃機関用点火コイル装置
SE9901629L (sv) 1999-05-05 2000-11-06 Ericsson Telefon Ab L M Anordning i en strömförsörjningsenhet
US6429652B1 (en) 1999-06-21 2002-08-06 Georgia Tech Research Corporation System and method of providing a resonant micro-compass
JP3062192B1 (ja) 1999-09-01 2000-07-10 松下電子工業株式会社 リ―ドフレ―ムとそれを用いた樹脂封止型半導体装置の製造方法
US6420779B1 (en) 1999-09-14 2002-07-16 St Assembly Test Services Ltd. Leadframe based chip scale package and method of producing the same
US6388336B1 (en) 1999-09-15 2002-05-14 Texas Instruments Incorporated Multichip semiconductor assembly
DE19946935B4 (de) 1999-09-30 2004-02-05 Daimlerchrysler Ag Vorrichtung zur induktiven Strommessung mit mindestens einem Differenzsensor
JP3534017B2 (ja) 1999-10-18 2004-06-07 株式会社デンソー センサ装置及びセンサ装置の製造方法
JP2001289610A (ja) 1999-11-01 2001-10-19 Denso Corp 回転角度検出装置
US6445171B2 (en) 1999-10-29 2002-09-03 Honeywell Inc. Closed-loop magnetoresistive current sensor system having active offset nulling
US6331451B1 (en) 1999-11-05 2001-12-18 Amkor Technology, Inc. Methods of making thin integrated circuit device packages with improved thermal performance and substrates for making the packages
US6580159B1 (en) 1999-11-05 2003-06-17 Amkor Technology, Inc. Integrated circuit device packages and substrates for making the packages
JP3813775B2 (ja) 1999-11-05 2006-08-23 ローム株式会社 マルチチップモジュール
JP2001141738A (ja) 1999-11-18 2001-05-25 Sumitomo Electric Ind Ltd 回転センサ及びその製造方法
JP3852554B2 (ja) 1999-12-09 2006-11-29 サンケン電気株式会社 ホール素子を備えた電流検出装置
JP2001165963A (ja) 1999-12-09 2001-06-22 Sanken Electric Co Ltd ホール素子を備えた電流検出装置
JP2001165702A (ja) 1999-12-10 2001-06-22 Sumitomo Electric Ind Ltd 磁気変量検出センサ
JP4164615B2 (ja) 1999-12-20 2008-10-15 サンケン電気株式会社 ホ−ル素子を備えた電流検出装置
AU2453701A (en) 1999-12-22 2001-07-03 Wabash Technology Corporation Vehicle axle end wheel speed sensor
DE10007868B4 (de) 2000-02-21 2010-02-18 Robert Bosch Gmbh Elektronische Steuerschaltung
US6468891B2 (en) 2000-02-24 2002-10-22 Micron Technology, Inc. Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
US6828220B2 (en) 2000-03-10 2004-12-07 Chippac, Inc. Flip chip-in-leadframe package and process
JP3429246B2 (ja) 2000-03-21 2003-07-22 株式会社三井ハイテック リードフレームパターン及びこれを用いた半導体装置の製造方法
KR100583494B1 (ko) 2000-03-25 2006-05-24 앰코 테크놀로지 코리아 주식회사 반도체패키지
JP3980807B2 (ja) 2000-03-27 2007-09-26 株式会社東芝 半導体装置及び半導体モジュール
JP3553457B2 (ja) 2000-03-31 2004-08-11 シャープ株式会社 半導体装置およびその製造方法
US6492697B1 (en) 2000-04-04 2002-12-10 Honeywell International Inc. Hall-effect element with integrated offset control and method for operating hall-effect element to reduce null offset
JP2001289865A (ja) 2000-04-05 2001-10-19 Matsushita Electric Ind Co Ltd 回転数センサ
JP2001296127A (ja) 2000-04-13 2001-10-26 Aichi Steel Works Ltd 磁場検出装置
US6501270B1 (en) 2000-05-15 2002-12-31 Siemens Vdo Automotive Corporation Hall effect sensor assembly with cavities for integrated capacitors
JP4025958B2 (ja) 2000-05-17 2007-12-26 サンケン電気株式会社 ホ−ル素子を備えた電流検出装置
JP2001339109A (ja) 2000-05-26 2001-12-07 Sanken Electric Co Ltd ホ−ル素子を備えた電流検出装置
US6853178B2 (en) 2000-06-19 2005-02-08 Texas Instruments Incorporated Integrated circuit leadframes patterned for measuring the accurate amplitude of changing currents
JP2002026419A (ja) 2000-07-07 2002-01-25 Sanken Electric Co Ltd 磁電変換装置
KR100376892B1 (ko) 2000-07-26 2003-03-28 주식회사 레이콤 2차원 배열의 자기센서와 3차원 자성유체를 이용한자속밀도 표시장치
WO2002013135A2 (en) 2000-08-04 2002-02-14 Hei, Inc. Structures and assembly methods for radio-frequency-identification modules
US6501268B1 (en) 2000-08-18 2002-12-31 The United States Of America As Represented By The Secretary Of The Army Magnetic sensor with modulating flux concentrator for 1/f noise reduction
JP4936299B2 (ja) 2000-08-21 2012-05-23 メレクシス・テクノロジーズ・ナムローゼフェンノートシャップ 磁場方向検出センサ
JP2002071728A (ja) 2000-08-28 2002-03-12 Yazaki Corp 電流検出装置及び電流検出方法並びにこれらを用いた電源供給システム
US6617846B2 (en) 2000-08-31 2003-09-09 Texas Instruments Incorporated Method and system for isolated coupling
US6770163B1 (en) 2000-09-08 2004-08-03 Asm Technology Singapore Pte Ltd Mold and method for encapsulation of electronic device
JP2002131342A (ja) 2000-10-19 2002-05-09 Canon Electronics Inc 電流センサ
JP2002202327A (ja) 2000-10-23 2002-07-19 Sanken Electric Co Ltd ホール素子を備えた電流検出装置
JP3549833B2 (ja) 2000-11-27 2004-08-04 行政院原子能委員會核能研究所 アフラトキシンとアルブミンの結合物の検出用放射免疫試薬セット及びその検出方法
US6798044B2 (en) 2000-12-04 2004-09-28 Fairchild Semiconductor Corporation Flip chip in leaded molded package with two dies
JP2002189069A (ja) 2000-12-22 2002-07-05 Murata Mfg Co Ltd 磁気センサおよびその製造方法
TW473951B (en) 2001-01-17 2002-01-21 Siliconware Precision Industries Co Ltd Non-leaded quad flat image sensor package
US6486535B2 (en) 2001-03-20 2002-11-26 Advanced Semiconductor Engineering, Inc. Electronic package with surface-mountable device built therein
US6504366B2 (en) 2001-03-29 2003-01-07 Honeywell International Inc. Magnetometer package
US6583572B2 (en) 2001-03-30 2003-06-24 Lam Research Corporation Inductive plasma processor including current sensor for plasma excitation coil
US6608375B2 (en) 2001-04-06 2003-08-19 Oki Electric Industry Co., Ltd. Semiconductor apparatus with decoupling capacitor
US6744121B2 (en) 2001-04-19 2004-06-01 Walton Advanced Electronics Ltd Multi-chip package
US20040038452A1 (en) 2001-05-30 2004-02-26 Siliconware Precision Industries Co., Ltd. Connection between semiconductor unit and device carrier
JP2002365350A (ja) 2001-06-06 2002-12-18 Fuji Electric Co Ltd 磁気検出装置
EP1267173A3 (en) 2001-06-15 2005-03-23 Sanken Electric Co., Ltd. Hall-effect current detector
JP4164626B2 (ja) 2001-06-15 2008-10-15 サンケン電気株式会社 ホ−ル素子を備えた電流検出装置
TW488054B (en) 2001-06-22 2002-05-21 Advanced Semiconductor Eng Semiconductor package for integrating surface mount devices
DE60219561T2 (de) 2001-07-06 2008-01-03 Sanken Electric Co. Ltd., Niiza Hall-Effekt-Stromdetektor
US6482680B1 (en) 2001-07-20 2002-11-19 Carsem Semiconductor Sdn, Bhd. Flip-chip on lead frame
US6593545B1 (en) 2001-08-13 2003-07-15 Amkor Technology, Inc. Laser defined pads for flip chip on leadframe package fabrication method
DE10141371A1 (de) 2001-08-23 2003-03-13 Philips Corp Intellectual Pty Magnetoresistive Sensoreinrichtung
JP4187085B2 (ja) 2001-08-24 2008-11-26 三菱電機株式会社 車両用乗員保護装置
JP3955195B2 (ja) 2001-08-24 2007-08-08 株式会社日立グローバルストレージテクノロジーズ 磁界センサー及び磁気ヘッド
DE10141877B4 (de) 2001-08-28 2007-02-08 Infineon Technologies Ag Halbleiterbauteil und Konvertereinrichtung
DE10148042B4 (de) 2001-09-28 2006-11-09 Infineon Technologies Ag Elektronisches Bauteil mit einem Kunststoffgehäuse und Komponenten eines höhenstrukturierten metallischen Systemträgers und Verfahren zu deren Herstellung
US6661087B2 (en) 2001-10-09 2003-12-09 Siliconware Precision Industries Co., Ltd. Lead frame and flip chip semiconductor package with the same
TWI273266B (en) 2001-11-01 2007-02-11 Asahi Kasei Emd Corp Current sensor and current sensor manufacturing method
JP2003177171A (ja) 2001-12-11 2003-06-27 Sumitomo Electric Ind Ltd 磁気変量センサ及びその製造方法
JP2003177168A (ja) 2001-12-13 2003-06-27 Murata Mfg Co Ltd 磁気センサ
US6667682B2 (en) 2001-12-26 2003-12-23 Honeywell International Inc. System and method for using magneto-resistive sensors as dual purpose sensors
US6737298B2 (en) 2002-01-23 2004-05-18 St Assembly Test Services Ltd Heat spreader anchoring & grounding method & thermally enhanced PBGA package using the same
US6796485B2 (en) 2002-01-24 2004-09-28 Nas Interplex Inc. Solder-bearing electromagnetic shield
US6714003B2 (en) 2002-01-25 2004-03-30 American Electronic Components, Inc. Frequency compensation for rotating target sensor
US6815944B2 (en) 2002-01-31 2004-11-09 Allegro Microsystems, Inc. Method and apparatus for providing information from a speed and direction sensor
US6747300B2 (en) 2002-03-04 2004-06-08 Ternational Rectifier Corporation H-bridge drive utilizing a pair of high and low side MOSFETs in a common insulation housing
SG115459A1 (en) 2002-03-04 2005-10-28 Micron Technology Inc Flip chip packaging using recessed interposer terminals
AU2003236348A1 (en) 2002-04-02 2003-10-27 Asahi Kasei Emd Corporation Inclination sensor, method of manufacturing inclination sensor, and method of measuring inclination
US8236612B2 (en) 2002-04-29 2012-08-07 Unisem (Mauritius) Holdings Limited Partially patterned lead frames and methods of making and using the same in semiconductor packaging
US6828658B2 (en) 2002-05-09 2004-12-07 M/A-Com, Inc. Package for integrated circuit with internal matching
US6605491B1 (en) 2002-05-21 2003-08-12 Industrial Technology Research Institute Method for bonding IC chips to substrates with non-conductive adhesive
US6809416B1 (en) 2002-05-28 2004-10-26 Intersil Corporation Package for integrated circuit with thermal vias and method thereof
JP4052111B2 (ja) 2002-06-07 2008-02-27 ソニー株式会社 無線情報記憶媒体
TW540123B (en) 2002-06-14 2003-07-01 Siliconware Precision Industries Co Ltd Flip-chip semiconductor package with lead frame as chip carrier
WO2003107018A1 (ja) 2002-06-18 2003-12-24 旭化成株式会社 電流測定方法および電流測定装置
DE10231194A1 (de) 2002-07-10 2004-02-05 Infineon Technologies Ag Anschlussleitrahmen für eine in einem Halbleiterchip ausgeführte Sonde und Magnetfeldsensor
JP4402865B2 (ja) 2002-07-22 2010-01-20 旭化成エレクトロニクス株式会社 磁電変換素子及びその作製方法
JP2004063688A (ja) 2002-07-26 2004-02-26 Mitsubishi Electric Corp 半導体装置及び半導体アセンブリモジュール
DE10236175B4 (de) 2002-08-07 2005-05-19 Dornier Medtech Systems Gmbh Lasersystem mit fasergebundener Kommunikation
US6798193B2 (en) 2002-08-14 2004-09-28 Honeywell International Inc. Calibrated, low-profile magnetic sensor
US20040046248A1 (en) 2002-09-05 2004-03-11 Corning Intellisense Corporation Microsystem packaging and associated methods
US20040094826A1 (en) 2002-09-20 2004-05-20 Yang Chin An Leadframe pakaging apparatus and packaging method thereof
US6781359B2 (en) 2002-09-20 2004-08-24 Allegro Microsystems, Inc. Integrated current sensor
FR2845469B1 (fr) 2002-10-07 2005-03-11 Moving Magnet Tech Capteur de position analogique a reluctance variable
US6775140B2 (en) 2002-10-21 2004-08-10 St Assembly Test Services Ltd. Heat spreaders, heat spreader packages, and fabrication methods for use with flip chip semiconductor devices
JP3720801B2 (ja) 2002-10-24 2005-11-30 三菱電機株式会社 磁気検出装置
JP3896590B2 (ja) 2002-10-28 2007-03-22 サンケン電気株式会社 電流検出装置
DE10250538B4 (de) 2002-10-29 2008-02-21 Infineon Technologies Ag Elektronisches Bauteil als Multichipmodul und Verfahren zu dessen Herstellung
US6798057B2 (en) 2002-11-05 2004-09-28 Micron Technology, Inc. Thin stacked ball-grid array package
US6825067B2 (en) 2002-12-10 2004-11-30 St Assembly Test Services Pte Ltd Mold cap anchoring method for molded flex BGA packages
JP2004207477A (ja) 2002-12-25 2004-07-22 Sanken Electric Co Ltd ホール素子を有する半導体装置
US7259545B2 (en) 2003-02-11 2007-08-21 Allegro Microsystems, Inc. Integrated sensor
JP4055609B2 (ja) 2003-03-03 2008-03-05 株式会社デンソー 磁気センサ製造方法
US6819542B2 (en) 2003-03-04 2004-11-16 Taiwan Semiconductor Manufacturing Co., Ltd. Interdigitated capacitor structure for an integrated circuit
JP4128473B2 (ja) 2003-03-07 2008-07-30 松下電器産業株式会社 半導体装置
US6995957B2 (en) 2003-03-18 2006-02-07 Hitachi Global Storage Technologies Netherland B.V. Magnetoresistive sensor having a high resistance soft magnetic layer between sensor stack and shield
JP4131183B2 (ja) 2003-03-25 2008-08-13 株式会社デンソー 磁気検出装置の製造方法
DE10314602B4 (de) 2003-03-31 2007-03-01 Infineon Technologies Ag Integrierter differentieller Magnetfeldsensor
US7239000B2 (en) 2003-04-15 2007-07-03 Honeywell International Inc. Semiconductor device and magneto-resistive sensor integration
US7265543B2 (en) 2003-04-15 2007-09-04 Honeywell International Inc. Integrated set/reset driver and magneto-resistive sensor
US6921975B2 (en) 2003-04-18 2005-07-26 Freescale Semiconductor, Inc. Circuit device with at least partial packaging, exposed active surface and a voltage reference plane
US7781873B2 (en) 2003-04-28 2010-08-24 Kingston Technology Corporation Encapsulated leadframe semiconductor package for random access memory integrated circuits
JP2004356338A (ja) 2003-05-28 2004-12-16 Res Inst Electric Magnetic Alloys 薄膜磁気センサ及びその製造方法
US6927479B2 (en) 2003-06-25 2005-08-09 St Assembly Test Services Ltd Method of manufacturing a semiconductor package for a die larger than a die pad
JP4258430B2 (ja) 2003-06-27 2009-04-30 日本ビクター株式会社 電流センサ
TWI297938B (en) 2003-07-15 2008-06-11 Advanced Semiconductor Eng Semiconductor package
DE10335153B4 (de) 2003-07-31 2006-07-27 Siemens Ag Schaltungsanordnung auf einem Substrat, die einen Bestandteil eines Sensors aufweist, und Verfahren zum Herstellen der Schaltungsanordnung auf dem Substrat
TWI236112B (en) 2003-08-14 2005-07-11 Via Tech Inc Chip package structure
US6995315B2 (en) 2003-08-26 2006-02-07 Allegro Microsystems, Inc. Current sensor
US7476816B2 (en) 2003-08-26 2009-01-13 Allegro Microsystems, Inc. Current sensor
US7166807B2 (en) 2003-08-26 2007-01-23 Allegro Microsystems, Inc. Current sensor
US7075287B1 (en) 2003-08-26 2006-07-11 Allegro Microsystems, Inc. Current sensor
US7709754B2 (en) 2003-08-26 2010-05-04 Allegro Microsystems, Inc. Current sensor
US20060219436A1 (en) 2003-08-26 2006-10-05 Taylor William P Current sensor
JP2005123383A (ja) * 2003-10-16 2005-05-12 Asahi Kasei Electronics Co Ltd 磁電変換素子
US6867573B1 (en) 2003-11-07 2005-03-15 National Semiconductor Corporation Temperature calibrated over-current protection circuit for linear voltage regulators
US20050270748A1 (en) 2003-12-16 2005-12-08 Phoenix Precision Technology Corporation Substrate structure integrated with passive components
US8330258B2 (en) 2003-12-24 2012-12-11 Stmicroelectronics, Inc. System and method for improving solder joint reliability in an integrated circuit package
US20050146057A1 (en) 2003-12-31 2005-07-07 Khor Ah L. Micro lead frame package having transparent encapsulant
JP4270095B2 (ja) 2004-01-14 2009-05-27 株式会社デンソー 電子装置
US7005325B2 (en) 2004-02-05 2006-02-28 St Assembly Test Services Ltd. Semiconductor package with passive device integration
JP4433820B2 (ja) 2004-02-20 2010-03-17 Ｔｄｋ株式会社 磁気検出素子およびその形成方法ならびに磁気センサ、電流計
JP3910598B2 (ja) 2004-03-04 2007-04-25 松下電器産業株式会社 樹脂封止型半導体装置およびその製造方法
WO2005088259A1 (de) 2004-03-11 2005-09-22 Robert Bosch Gmbh Magnetsensoranordnung
US7193412B2 (en) 2004-03-24 2007-03-20 Stoneridge Control Devices, Inc. Target activated sensor
US6943061B1 (en) 2004-04-12 2005-09-13 Ns Electronics Bangkok (1993) Ltd. Method of fabricating semiconductor chip package using screen printing of epoxy on wafer
US7279391B2 (en) 2004-04-26 2007-10-09 Intel Corporation Integrated inductors and compliant interconnects for semiconductor packaging
JP4372022B2 (ja) 2004-04-27 2009-11-25 株式会社東芝 半導体装置
US7129569B2 (en) 2004-04-30 2006-10-31 St Assembly Test Services Ltd. Large die package structures and fabrication method therefor
JP4240306B2 (ja) 2004-05-13 2009-03-18 旭化成エレクトロニクス株式会社 回転検出器
JP4148182B2 (ja) 2004-05-17 2008-09-10 ソニー株式会社 表示装置
US7242076B2 (en) 2004-05-18 2007-07-10 Fairchild Semiconductor Corporation Packaged integrated circuit with MLP leadframe and method of making same
JP2005337866A (ja) 2004-05-26 2005-12-08 Asahi Kasei Corp 磁性体検出器及び半導体パッケージ
US20050266611A1 (en) 2004-06-01 2005-12-01 Jack Tu Flip chip packaging method and flip chip assembly thereof
JP4274051B2 (ja) 2004-06-03 2009-06-03 株式会社デンソー 回転検出装置及び回転検出装置の製造方法
EP1610384A3 (en) 2004-06-14 2008-11-19 Denso Corporation Electronic unit with a substrate where an electronic circuit is fabricated
JP4969026B2 (ja) 2004-06-15 2012-07-04 三菱電機株式会社 磁気検出装置
US7112957B2 (en) 2004-06-16 2006-09-26 Honeywell International Inc. GMR sensor with flux concentrators
KR101053864B1 (ko) 2004-06-23 2011-08-03 엘지디스플레이 주식회사 백라이트 유닛과 이를 이용한 액정표시장치
JP4617762B2 (ja) 2004-08-04 2011-01-26 株式会社デンソー 回転検出装置の製造方法
JP4453485B2 (ja) 2004-08-19 2010-04-21 株式会社デンソー 磁石装置
US7279424B2 (en) 2004-08-27 2007-10-09 Hitachi Global Storage Technologies Netherlands B.V. Method for fabricating thin film magnetic heads using CMP with polishing stop layer
KR101091896B1 (ko) 2004-09-04 2011-12-08 삼성테크윈 주식회사 플립칩 반도체 패키지 및 그 제조방법
US8288046B2 (en) 2004-09-29 2012-10-16 GM Global Technology Operations LLC Integrated current sensors for a fuel cell stack
DE102004047784A1 (de) 2004-10-01 2006-04-06 Robert Bosch Gmbh Sensor zur Detektion der Richtung eines Magnetfeldes
JP4360998B2 (ja) 2004-10-01 2009-11-11 Ｔｄｋ株式会社 電流センサ
US7777607B2 (en) 2004-10-12 2010-08-17 Allegro Microsystems, Inc. Resistor having a predetermined temperature coefficient
JP4105142B2 (ja) 2004-10-28 2008-06-25 Ｔｄｋ株式会社 電流センサ
DE102004054317B4 (de) 2004-11-10 2014-05-15 Mitsubishi Denki K.K. Strommessvorrichtung
US7046002B1 (en) 2004-11-26 2006-05-16 The United States Of America As Represented By The Secretary Of The Army Magnetic sensor with variable sensitivity
US7173412B2 (en) 2004-11-30 2007-02-06 Honeywell International Inc. Quadrature sensor systems and methods
JP4105145B2 (ja) 2004-11-30 2008-06-25 Ｔｄｋ株式会社 電流センサ
JP4329682B2 (ja) 2004-12-02 2009-09-09 パナソニック株式会社 ボタン形空気亜鉛電池
JP4105147B2 (ja) 2004-12-06 2008-06-25 Ｔｄｋ株式会社 電流センサ
DE102004060298A1 (de) 2004-12-15 2006-06-22 Robert Bosch Gmbh Magnetsensoranordnung
EP1846771B1 (en) 2005-01-19 2013-08-07 Power Measurement Ltd Sensor apparatus
JP4131869B2 (ja) 2005-01-31 2008-08-13 Ｔｄｋ株式会社 電流センサ
US7476953B2 (en) 2005-02-04 2009-01-13 Allegro Microsystems, Inc. Integrated sensor having a magnetic flux concentrator
WO2006090769A1 (ja) 2005-02-23 2006-08-31 Asahi Kasei Emd Corporation 電流測定装置
DE102005047413B8 (de) 2005-02-23 2012-05-10 Infineon Technologies Ag Magnetfeldsensorelement und Verfahren zum Durchführen eines On-Wafer-Funktionstests, sowie Verfahren zur Herstellung von Magnetfeldsensorelementen und Verfahren zur Herstellung von Magnetfeldsensorelementen mit On-Wafer-Funktionstest
US7259624B2 (en) 2005-02-28 2007-08-21 Texas Instruments Incorporated Low noise AC coupled amplifier with low band-pass corner and low power
US7259553B2 (en) 2005-04-13 2007-08-21 Sri International System and method of magnetically sensing position of a moving component
JP2006300779A (ja) 2005-04-21 2006-11-02 Denso Corp 回転検出装置
US7148086B2 (en) 2005-04-28 2006-12-12 Stats Chippac Ltd. Semiconductor package with controlled solder bump wetting and fabrication method therefor
US7358724B2 (en) 2005-05-16 2008-04-15 Allegro Microsystems, Inc. Integrated magnetic flux concentrator
US7425824B2 (en) 2005-05-20 2008-09-16 Honeywell International Inc. Magnetoresistive sensor
DE102005027767A1 (de) 2005-06-15 2006-12-28 Infineon Technologies Ag Integriertes magnetisches Sensorbauteil
US7269992B2 (en) 2005-06-15 2007-09-18 Honeywell International Inc. Magnet orientation and calibration for small package turbocharger speed sensor
JP4466487B2 (ja) 2005-06-27 2010-05-26 Ｔｄｋ株式会社 磁気センサおよび電流センサ
KR20080027920A (ko) 2005-07-08 2008-03-28 엔엑스피 비 브이 반도체 디바이스
US7808074B2 (en) 2005-07-08 2010-10-05 Infineon Technologies Ag Advanced leadframe having predefined bases for attaching passive components
JP2007064851A (ja) 2005-08-31 2007-03-15 Tdk Corp コイル、コイルモジュールおよびその製造方法、ならびに電流センサおよびその製造方法
JP4415923B2 (ja) 2005-09-30 2010-02-17 Ｔｄｋ株式会社 電流センサ
JP4298691B2 (ja) 2005-09-30 2009-07-22 Ｔｄｋ株式会社 電流センサおよびその製造方法
US7361531B2 (en) 2005-11-01 2008-04-22 Allegro Microsystems, Inc. Methods and apparatus for Flip-Chip-On-Lead semiconductor package
US7323780B2 (en) 2005-11-10 2008-01-29 International Business Machines Corporation Electrical interconnection structure formation
US7518493B2 (en) 2005-12-01 2009-04-14 Lv Sensors, Inc. Integrated tire pressure sensor system
US7378721B2 (en) 2005-12-05 2008-05-27 Honeywell International Inc. Chip on lead frame for small package speed sensor
US8018056B2 (en) 2005-12-21 2011-09-13 International Rectifier Corporation Package for high power density devices
US7768083B2 (en) 2006-01-20 2010-08-03 Allegro Microsystems, Inc. Arrangements for an integrated sensor
JP2007218700A (ja) 2006-02-15 2007-08-30 Tdk Corp 磁気センサおよび電流センサ
JP4754985B2 (ja) 2006-02-17 2011-08-24 旭化成エレクトロニクス株式会社 磁気センサモジュール
JP4607049B2 (ja) 2006-02-23 2011-01-05 株式会社デンソー 回転角検出装置
US7687882B2 (en) 2006-04-14 2010-03-30 Allegro Microsystems, Inc. Methods and apparatus for integrated circuit having multiple dies with at least one on chip capacitor
US7573112B2 (en) 2006-04-14 2009-08-11 Allegro Microsystems, Inc. Methods and apparatus for sensor having capacitor on chip
US20080018261A1 (en) 2006-05-01 2008-01-24 Kastner Mark A LED power supply with options for dimming
US20070279053A1 (en) 2006-05-12 2007-12-06 Taylor William P Integrated current sensor
US20080013298A1 (en) * 2006-07-14 2008-01-17 Nirmal Sharma Methods and apparatus for passive attachment of components for integrated circuits
US7750447B2 (en) 2007-06-11 2010-07-06 Alpha & Omega Semiconductor, Ltd High voltage and high power boost converter with co-packaged Schottky diode
US7378733B1 (en) 2006-08-29 2008-05-27 Xilinx, Inc. Composite flip-chip package with encased components and method of fabricating same
US7816772B2 (en) 2007-03-29 2010-10-19 Allegro Microsystems, Inc. Methods and apparatus for multi-stage molding of integrated circuit package
US8283772B1 (en) 2007-03-30 2012-10-09 Cypress Semiconductor Corporation Flip-flop semiconductor device packaging using bent leadfingers
US7939372B1 (en) 2007-03-30 2011-05-10 Cypress Semiconductor Corporation Semiconductor device packaging using etched leadfingers
DE102007018238A1 (de) 2007-04-18 2008-10-23 Robert Bosch Gmbh Vorrichtung zur Erfassung der Drehzahl eines rotierbaren Teils
DE102007025000B3 (de) 2007-05-30 2008-12-11 Infineon Technologies Ag Magnetfeldsensor
US20080308886A1 (en) 2007-06-15 2008-12-18 Infineon Technologies Ag Semiconductor Sensor
DE102007029817B9 (de) 2007-06-28 2017-01-12 Infineon Technologies Ag Magnetfeldsensor und Verfahren zur Kalibration eines Magnetfeldsensors
US7839141B2 (en) 2007-08-14 2010-11-23 Infineon Technologies Ag Method of biasing a magneto resistive sensor element
WO2009055365A2 (en) 2007-10-22 2009-04-30 Analog Devices, Inc. Packaged microchip with spacer for mitigating electrical leakage between components
US7616398B2 (en) 2007-11-09 2009-11-10 Hitachi Global Storage Technologies Netherlands B.V. Fly height adjustment device calibration
US8587297B2 (en) 2007-12-04 2013-11-19 Infineon Technologies Ag Integrated circuit including sensor having injection molded magnetic material
US7923996B2 (en) 2008-02-26 2011-04-12 Allegro Microsystems, Inc. Magnetic field sensor with automatic sensitivity adjustment
US8080993B2 (en) 2008-03-27 2011-12-20 Infineon Technologies Ag Sensor module with mold encapsulation for applying a bias magnetic field
US8106654B2 (en) 2008-05-27 2012-01-31 Infineon Technologies Ag Magnetic sensor integrated circuit device and method
US8610430B2 (en) 2008-05-30 2013-12-17 Infineon Technologies Ag Bias field generation for a magneto sensor
US8058870B2 (en) 2008-05-30 2011-11-15 Infineon Technologies Ag Methods and systems for magnetic sensing
US7816905B2 (en) 2008-06-02 2010-10-19 Allegro Microsystems, Inc. Arrangements for a current sensing circuit and integrated current sensor
US7956604B2 (en) 2008-07-09 2011-06-07 Infineon Technologies, Ag Integrated sensor and magnetic field concentrator devices
US8093670B2 (en) 2008-07-24 2012-01-10 Allegro Microsystems, Inc. Methods and apparatus for integrated circuit having on chip capacitor with eddy current reductions
US8063634B2 (en) 2008-07-31 2011-11-22 Allegro Microsystems, Inc. Electronic circuit and method for resetting a magnetoresistance element
FR2936307B1 (fr) 2008-09-24 2010-09-17 Moving Magnet Tech Mmt Capteur de position lineaire ou rotatifa aimant permanent pour la detection d'une cible ferromagnetique
DE102008064047A1 (de) * 2008-10-02 2010-04-08 Continental Teves Ag & Co. Ohg Sensorelement und Trägerelement zur Herstellung eines Sensors
DE102008064046A1 (de) 2008-10-02 2010-04-08 Continental Teves Ag & Co. Ohg Verfahren zur Herstellung eines Geschwindigkeits-Sensorelementes
US8486755B2 (en) 2008-12-05 2013-07-16 Allegro Microsystems, Llc Magnetic field sensors and methods for fabricating the magnetic field sensors
DE102009000460A1 (de) 2009-01-28 2010-07-29 Robert Bosch Gmbh Stromgeführter Hall-Sensor
US20100188078A1 (en) 2009-01-28 2010-07-29 Andrea Foletto Magnetic sensor with concentrator for increased sensing range
US8289019B2 (en) 2009-02-11 2012-10-16 Infineon Technologies Ag Sensor
US8447556B2 (en) 2009-02-17 2013-05-21 Allegro Microsystems, Inc. Circuits and methods for generating a self-test of a magnetic field sensor
US8253210B2 (en) 2009-04-30 2012-08-28 Infineon Technologies Ag Semiconductor device including a magnetic sensor chip
US8362579B2 (en) 2009-05-20 2013-01-29 Infineon Technologies Ag Semiconductor device including a magnetic sensor chip
US8400784B2 (en) 2009-08-10 2013-03-19 Silergy Technology Flip chip package for monolithic switching regulator
JP5524540B2 (ja) 2009-09-01 2014-06-18 株式会社東海理化電機製作所 電流センサ
US7919360B1 (en) 2009-09-18 2011-04-05 Stats Chippac Ltd. Integrated circuit packaging system with circuitry stacking and method of manufacture thereof
US10107875B2 (en) 2009-11-30 2018-10-23 Infineon Technologies Ag GMR sensor within molded magnetic material employing non-magnetic spacer
US20110133732A1 (en) 2009-12-03 2011-06-09 Allegro Microsystems, Inc. Methods and apparatus for enhanced frequency response of magnetic sensors
US8717016B2 (en) 2010-02-24 2014-05-06 Infineon Technologies Ag Current sensors and methods
EP2366976A1 (en) 2010-03-18 2011-09-21 Nxp B.V. Sensor package having shaped lead frame
US8680843B2 (en) 2010-06-10 2014-03-25 Infineon Technologies Ag Magnetic field current sensors
US9121885B2 (en) 2010-08-16 2015-09-01 Infineon Technologies Ag Sensor package and method of manufacturing thereof
US8167625B2 (en) 2010-09-23 2012-05-01 Apple Inc. Integrated noise reduction connector
US8283758B2 (en) 2010-12-16 2012-10-09 Monolithic Power Systems, Inc. Microelectronic packages with enhanced heat dissipation and methods of manufacturing
US8361899B2 (en) 2010-12-16 2013-01-29 Monolithic Power Systems, Inc. Microelectronic flip chip packages with solder wetting pads and associated methods of manufacturing
DE102011114773B4 (de) 2011-09-30 2017-09-21 Infineon Technologies Ag Vorrichtung mit einem Backbias-Magneten und einem Halbleiterchipelement und zugehöriges Herstellungsverfahren
US9201123B2 (en) 2011-11-04 2015-12-01 Infineon Technologies Ag Magnetic sensor device and a method for fabricating the same
US9121880B2 (en) 2011-11-04 2015-09-01 Infineon Technologies Ag Magnetic sensor device
US8629539B2 (en) 2012-01-16 2014-01-14 Allegro Microsystems, Llc Methods and apparatus for magnetic sensor having non-conductive die paddle
US9666788B2 (en) 2012-03-20 2017-05-30 Allegro Microsystems, Llc Integrated circuit package having a split lead frame
US9494660B2 (en) 2012-03-20 2016-11-15 Allegro Microsystems, Llc Integrated circuit package having a split lead frame
US9812588B2 (en) 2012-03-20 2017-11-07 Allegro Microsystems, Llc Magnetic field sensor integrated circuit with integral ferromagnetic material
US9153369B2 (en) 2012-04-23 2015-10-06 Infineon Technologies Ag Bias field generator including a body having two body parts and holding a packaged magnetic sensor
US9411025B2 (en) 2013-04-26 2016-08-09 Allegro Microsystems, Llc Integrated circuit package having a split lead frame and a magnet

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