TW473951B - Non-leaded quad flat image sensor package - Google Patents

Non-leaded quad flat image sensor package Download PDF

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Publication number
TW473951B
TW473951B TW090101003A TW90101003A TW473951B TW 473951 B TW473951 B TW 473951B TW 090101003 A TW090101003 A TW 090101003A TW 90101003 A TW90101003 A TW 90101003A TW 473951 B TW473951 B TW 473951B
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TW
Taiwan
Prior art keywords
image sensor
wafer
guide pins
chip
patent application
Prior art date
Application number
TW090101003A
Other languages
Chinese (zh)
Inventor
Chung-Ping Huang
Original Assignee
Siliconware Precision Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siliconware Precision Industries Co Ltd filed Critical Siliconware Precision Industries Co Ltd
Priority to TW090101003A priority Critical patent/TW473951B/en
Priority to US10/037,895 priority patent/US6545332B2/en
Application granted granted Critical
Publication of TW473951B publication Critical patent/TW473951B/en
Priority to US10/341,086 priority patent/US6767753B2/en

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    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

A kind of non-leaded quad flat image sensor package includes the followings: a leadframe, which is provided with a chip base and multiple conducting pins disposed at the periphery of the chip base; a casting mold body, which is disposed on the upper surface of the leadframe to surround the outer edge of the conducting pins and to fill the space between the chip base and the conducting pins such that the chip base of the upper surface as well as the wire bonding part of the conducting pins are exposed and a chip accommodation space is formed by the conducting pins and the mold pressing material body; a chip, which is provided with an active surface and a rear surface, and is placed in the chip accommodation space by adhering the rear surface to the upper surface of the chip base; at least one conducting wire, which is used to electrically connect the bonding pad and the wire bonding part of the conducting pins, respectively, to the upper surface; a liquid package material, which fills the space between the chip and the casting mold body to cover these conducting wire part such that the liquid package material surface is approximately at the same level with the active surface; and a transparent upper cover, which is disposed on the active surface and is used to seal the chip accommodation space.

Description

473951 6874twf.doc/006 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（I ) 本發明係關種影像感應器（image sensor)的構裝 結構及其製程，且特別是有關於一種影像感應器之四方扁 平無接腳構裝(Non-leaded Quad Flat Package)及其製程。 近年來由於多媒體的蓬勃發展，數位影像使用愈趨 頻繁，相對應許多影像處理裝置的需求也愈來愈多。現今 δ午多數位β像產cm ’包括電腦數位攝影機(pc digital video camera)，數位照相機（digital camera)，甚至光學掃描器 (scanner)及影像電目舌等’皆是藉由影像感應器（image sensor) 來擷取影像。影像感應器包括電耦合元件（charge coupled device)及互補式金氧半導體感應元件(CMOS sensor)等，可 以靈敏地接收外部光線，而轉換爲數位訊號。 由於影像感應器需要接收光源，因此其構裝方式與 一般電子產品有所不同。習知影像感應器之構裝採用塑膠 四方扁平構裝(plastic quad Hat package，PQFP)，如美國第 5523608號專利，及美國第5529959號專利所揭露之構裝 結構。由於其體積較大’因此並不適於未來高積集度之應 用。另外，習知亦有諸多影像感應器係採用陶瓷承載器， 比如陶瓷無接腳承載器(ceramic leadless chip carrier，LCC)， 其揭露於美國第5898218、5270491號專利。雖然陶瓷承載 氣的密閉性較佳，可以延長影像感應器的使用壽命’然而 其製造成本較高，製程亦較繁瑣’並不符合市場需求。影 像感應器還有一種塑膠構裝，是利用積層板（laminated substrate)作爲承載器，形成類似無接腳承載器型態，如美 國專利第581 1799號所揭露。雖然其可以縮小體積’然而 3 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注咅？事填寫本頁) 裝 i線· 經濟部智慧財產局員工消費合作社印製 473951 6874twf.doc/〇〇6 A7 B7 五、發明說明（20 由於承載器係採用玻璃環氧基樹脂（flame-retardant epoxyglass fabric composite resin， FR-4 、 FR-5) ， 或雙順丁烯二酸 釀亞胺（Bismaleimide-Triazine，BT)做爲原料，成本較高， 亦不符合市場需求。 如上所述，目前的影像感應器封裝結構通常包括透 光片，模壓封裝體，導線，承載器及影像感應器，其中爲 了使影像感應器接受到光線，影像感應器的作用區域至透 光片之間必須考慮到透光性的問題。 習知解決透光性問題的方式常見的有：利用玻璃片 或透明塑膠片作爲透光片，其中以玻璃的透光性較佳，再 將透光片與影像感應器之間抽真空。由於光線穿透佈滿粒 子的大氣相對於穿透真空環境而言透光性較低，因此在敏 感度極筒的影像感應器構裝裡，多半採用抽真空的方式。 但是，在透光片與影像感應器之間塡充透明材料或樹脂取 代玻璃片及抽真空的作法也曾被提出，但是透明材料或胃 明樹脂的透光性不如真空狀態下的透光性，而且能夠承受 製程期間高溫而不變質的透明材料成本高。由於該結構不 實用，因而未被大量採用。 由於影像感應器逐漸被應用在攜帶型產品，例如 腦數位攝影機，數位相機，甚至將來的影像電話中，影| 感應器的耐震度要求必須相當尚。廠商在產品出廠前的、測 試階段裡，極重視該項測試結果，因此都會進行信賴性 (reliabihty)測試及離心測試。習知之無接影像感應器結構， 如5,523,608所述者，僅利用厚度極薄的封裝材料包覆內 4 本紙張尺度適用中國國家標準（CNS)A4規格（210 χ 297公釐） (請先閱讀背面之注意事填寫本頁) 裝 --線； 473951 6874twf. doc/006 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（$ ) 導腳與晶片座，在進行信賴性測試時容易因結構力不足而 導致結構脫離。而且該結構的導線裸露於模壓封裝體所構 成的空間。若導線的弧線過長，則容易在進行離心測試時 發生變形，導致良率降低。 有鑑於此，本發明係提供一種四方扁平無接腳影像 感應器構裝，藉由將液態封裝材料塡充於該晶片與該鑄模 體之間以包覆該些導線之部分，以防止晶片座及內導腳脫 層，並且可固定導線使其不易發生變形。 根據本發明之一目的，本發明係提供一種四方扁平 無接腳影像感應器構裝，其包括一導線架，其中該導線架 具有一晶片座及多個導腳，且該些導腳配置於晶片座之周 緣；一鑄模體，其配置於該導線架之上表面並環繞該導腳 之外緣，塡充於該晶片座與該導腳之間，且暴露出該上表 面中之晶片座與導腳之打線部分，而使該導線架與該鑄模 體構成一晶片容納空間；一晶片，其置於該晶片容納空間 中’該晶片具有一主動表面及背面，以該晶片之背面貼附 於該晶片座之上表面；至少一導線，用以分別電性連接該 焊墊及該導腳之打線部分於該上表面；一液態封裝材料， 塡充於該晶片與該鑄模體之間至包覆該些導線之部分，並 使該液態封裝材料之表面約略與該主動表面齊平；一透明 上蓋，配置於主動表面上，用以密封該晶片容納空間。 根據本發明之另一目的，本發明係提供一承載器， 該承載器具有一絕緣本體及複數個導腳，且該些導腳係固 定於該絕緣本體中，該絕緣本體具有一凹穴；一影像感應 5 (請先閱讀背面之注意事填寫本頁) ;裝 訂·· _線· 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 473951 6874twf. doc/006 A7 B7 五、發明說明（+) 晶片’具有一主動表面及對應之一背面，且該主動表面配 置有複數個焊墊’該晶片置於凹穴中，並以該背面貼附於 該凹穴之底面；複數條導線，分別電性連接該些焊墊及該 些導腳；一液態封裝材料，塡充於該晶片與該絕緣本體之 間，以包覆該些導線之部分，且該液態封裝材料之表面約 略與該主動表面齊平；以及一透明上蓋，配置於該主動表 面之上，以密封該凹穴。 經濟部智慧財產局員工消費合作社印製 --------------裝 i I (請先閱讀背面之注意事ml填寫本頁) ί線： 根據本發明之又一目的，本發明係提供一種四方扁 平無接腳影像感應器構裝結構的製程，包括：先提供一導 線架’該導線架包括多個構裝單元，每一構裝單元至少具 有晶片座及多個導腳，且該些導腳配置於該晶片座之周 緣。接著進行模壓製程，使鑄模體形成於導線架之上表面， 環繞導腳之外緣，且塡充於晶片座與導腳之間，暴露出上 表面中晶片座與導腳之打線部分，使得導線架與鑄模體於 每一構裝單元構成一晶片容納空間。進行晶片貼附製程， 將多個晶片分別置於對應之晶片容納空間，並以晶片背面 貼附於對應晶片座之上表面。然後進行打線製程，以導線 分別電性連接晶片之焊墊及導腳的該打線部分於上表面。 於該晶片與該鑄模體之間塡充液態封裝材料以包覆該些導 線之部分，使該液態封裝材料之表面約略與該主動表面齊 平。進行密封製程，以一透明材質配置於主動表面之上， 分別密封晶片容納空間。並進行分離製程，將各構裝單元 分離。 爲讓本發明之上述和其他目的、特徵、和優點能更 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 473951 68 7 4twf. doc/00 6 A7 B7 五、發明說明（$ ) 明顯易懂，下文特舉一較佳實施例，並配合所附圖式’作 詳細說明如下： 圖式之簡單說明： 第1圖至第6圖繪示依照本發明一較佳實施例的一 種四方扁平無接腳影像感應器構裝製程剖面圖； 第7圖繪示本發明之封裝方法應用於塑膠四方扁平 構裝（PQFP)的情形； 第8圖繪示本發明之封裝方法應用於陶瓷無接腳承 載器（LCC)的情形； 第9圖繪示本發明四方扁平無接腳影像感應器構裝 之量產結構；及 第10圖繪示本發明四方扁平無接腳影像感應器構 裝之另一量產結構。 圖式之標不說明· 100、500、600 :導線架 102、202 :晶片座 104、204 :導腳 106 :打線部分 108、110 :階梯結構 112 :第一表面（上表面） 114 :第二表面（下表面） 116 :上模具 118 :下模具 7 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事填寫本頁) »一 —裝 經濟部智慧財產局員工消費合作社印製 473951 A7 經濟部智慧財產局員工消費合作社印製 687 4twf. doc/006 _B7_五、發明說明（b ) 120 :模穴 122 :空隙 124、224 :鑄模體 126、226、326 :晶片容納空間 130、230、330 :晶片 132 :主動表面 134 :背面 136 :焊墊 138 :黏著材料 140、240、340 :導線 142、242、342 :透明片 300a、300b、300c、300d、300e :陶瓷片 306 :連接部 400 :注入裝置 402 :液態封裝材料 502、602 ··構裝單元 504 :間隔 506 :沖頭 604 :鋸刀 606 :切割線 較佳具體實施例 請參照第1圖至第6圖，其繪示依照本發明一較佳 實施例的一種四方扁平無接腳影像感應器構裝製程剖面 8 (請先閱讀背面之注意事^一^填寫本頁) •裝473951 6874twf.doc / 006 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the Invention (I) The present invention relates to the structure and process of an image sensor, and is particularly relevant A non-leaded quad flat package for an image sensor and a manufacturing process thereof. In recent years, due to the rapid development of multimedia, the use of digital images has become more frequent, and the demand for many image processing devices has also increased. Today's δ-day majority β image production cm 'includes PC digital video cameras, digital cameras, and even optical scanners and video eyes, etc., all through image sensors ( image sensor) to capture images. The image sensor includes a charge coupled device and a complementary metal-oxide-semiconductor sensor (CMOS sensor). It can sensitively receive external light and convert it into a digital signal. Since the image sensor needs to receive a light source, its structure is different from that of general electronic products. The structure of the conventional image sensor is a plastic quad hat package (PQFP), such as the structure disclosed in US Patent No. 5,523,608 and US Patent No. 5,529,959. Because of its large volume, it is not suitable for future applications with high accumulation. In addition, many image sensors are known to use ceramic carriers, such as ceramic leadless chip carriers (LCC), which are disclosed in US Patent Nos. 5898218 and 5270491. Although the ceramic carrier gas has better airtightness and can prolong the service life of the image sensor ', its manufacturing cost is higher and the manufacturing process is more complicated. It does not meet the market demand. The image sensor also has a plastic structure, which uses a laminated substrate as a carrier to form a pinless carrier, as disclosed in US Patent No. 581 1799. Although it can be reduced in size, however, 3 paper sizes are applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the note on the back first? Please fill out this page) Install i-line · Intellectual Property Bureau of the Ministry of Economic Affairs Printed by the employee consumer cooperative 473951 6874twf.doc / 〇〇6 A7 B7 V. Description of the invention (20 As the carrier is made of flame-retardant epoxyglass fabric composite resin (FR-4, FR-5)), or Bismaleimide-Triazine (BT) is used as a raw material, which has a high cost and does not meet market demand. As mentioned above, the current image sensor package structure usually includes a light transmitting sheet and a molded package. , Wire, carrier and image sensor, in order to allow the image sensor to receive light, the problem of light transmission must be considered between the active area of the image sensor and the light transmitting sheet. Know how to solve the problem of light transmission It is common to use a glass sheet or a transparent plastic sheet as the light-transmitting sheet. Among them, the light-transmitting property of glass is better, and then a vacuum is drawn between the light-transmitting sheet and the image sensor. The atmosphere full of particles is relatively light-transmissive compared to penetrating the vacuum environment. Therefore, in the image sensor structure of the sensitive polar tube, the vacuum method is mostly used. However, in the light-transmitting sheet and the image sensor The practice of filling transparent materials or resins to replace glass sheets and vacuuming has also been proposed, but the transparency of transparent materials or resins is not as good as that of vacuum, and it can withstand high temperatures during the process without deterioration. The cost of transparent materials is high. Because the structure is not practical, it has not been widely used. As image sensors are gradually used in portable products, such as digital brain cameras, digital cameras, and even future video phones, The shock resistance requirements must be quite high. Manufacturers attach great importance to the test results before the product leaves the factory and during the test stage, so they will perform reliabihty tests and centrifugal tests. Known structure of non-connected image sensors, such as 5,523,608 The author only uses the extremely thin packaging material to cover the inside. This paper size applies the Chinese National Standard (CNS) A4 specification (21 0 χ 297 mm) (Please read the notes on the back to fill out this page first) Packing-thread; 473951 6874twf. Doc / 006 A7 B7 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of invention ($) With the wafer holder, when the reliability test is performed, it is easy to cause the structure to detach due to insufficient structural force. Moreover, the wires of the structure are exposed in the space formed by the molded package. If the arc of the wire is too long, it will easily occur during the centrifugal test. Deformation leads to a decrease in yield. In view of this, the present invention provides a square flat, pinless image sensor structure, by filling a liquid packaging material between the chip and the mold body to cover the wires. To prevent delamination of the chip holder and the inner guide pin, and the wire can be fixed so that it is not easily deformed. According to an object of the present invention, the present invention provides a square flat pinless image sensor structure including a lead frame, wherein the lead frame has a chip holder and a plurality of guide pins, and the guide pins are disposed on The periphery of the wafer holder; a mold body arranged on the upper surface of the lead frame and surrounding the outer edge of the guide leg, filled between the wafer holder and the guide leg, and exposing the wafer holder in the upper surface And the lead wire, so that the lead frame and the mold body constitute a wafer receiving space; a wafer is placed in the wafer receiving space 'the wafer has an active surface and a back surface, and the wafer is attached to the back surface of the wafer On the upper surface of the wafer holder; at least one wire for electrically connecting the bonding pad and the wire bonding portion of the guide pin to the upper surface; a liquid packaging material filled between the wafer and the mold body to A portion of the wires is covered and the surface of the liquid packaging material is approximately flush with the active surface; a transparent upper cover is disposed on the active surface to seal the chip receiving space. According to another object of the present invention, the present invention provides a carrier having an insulating body and a plurality of guide pins, and the guide pins are fixed in the insulating body, and the insulating body has a recess; Image sensing 5 (Please read the notes on the back first and fill in this page); Binding ·· _line · This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 473951 6874twf. Doc / 006 A7 B7 5 2. Description of the invention (+) The wafer 'has an active surface and a corresponding back surface, and the active surface is provided with a plurality of pads' The wafer is placed in a cavity, and the back surface is attached to the bottom surface of the cavity; A plurality of wires are electrically connected to the solder pads and the guide pins respectively; a liquid packaging material is filled between the chip and the insulating body to cover a part of the wires, and the liquid packaging material is The surface is approximately flush with the active surface; and a transparent cover is disposed on the active surface to seal the cavity. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs -------------- Install i I (please read the note on the back first and fill in this page) ί Line: According to another object of the present invention The invention provides a manufacturing process of a square flat pinless image sensor mounting structure, including: first providing a lead frame; the lead frame includes a plurality of mounting units, each mounting unit has at least a wafer holder and a plurality of mounting units; The guide pins are disposed on the periphery of the wafer holder. Next, a molding process is performed so that the mold body is formed on the upper surface of the lead frame, surrounds the outer edge of the guide pin, and is filled between the wafer seat and the guide pin, exposing the wire portion of the wafer seat and the guide pin in the upper surface, so that The lead frame and the mold body form a wafer accommodating space in each mounting unit. The wafer attaching process is performed, and a plurality of wafers are respectively placed in corresponding wafer accommodating spaces, and the wafer back is attached to the upper surface of the corresponding wafer holder. Then, a wire bonding process is performed, and the wire bonding portions of the die pads and the guide pins of the chip are electrically connected to the upper surface by wires. A liquid packaging material is filled between the wafer and the mold body to cover the portions of the wires, so that the surface of the liquid packaging material is approximately flush with the active surface. The sealing process is performed, and a transparent material is arranged on the active surface to seal the wafer accommodation spaces respectively. A separation process is performed to separate each structural unit. In order to make the above and other objects, features, and advantages of the present invention more applicable to this paper size, the Chinese National Standard (CNS) A4 specification (210 X 297 mm) is applicable. 473951 68 7 4twf. Doc / 00 6 A7 B7 V. Description of the invention ($) Obviously easy to understand. The following is a detailed description of a preferred embodiment in conjunction with the accompanying drawings' as follows: Brief description of the drawings: Figures 1 to 6 show a preferred implementation according to the present invention. Example is a cross-sectional view of a quad flat flat pinless image sensor assembly process; FIG. 7 illustrates a case where the packaging method of the present invention is applied to a plastic quad flat assembly (PQFP); FIG. 8 illustrates a packaging method of the present invention Applied to the case of ceramic pinless carrier (LCC); FIG. 9 shows the mass production structure of the quadrangular flat pinless image sensor structure of the present invention; and FIG. 10 illustrates the quadrangular flat pinless image of the present invention Another mass production structure of the sensor structure. Symbols of the drawings are not explained. 100, 500, 600: lead frames 102, 202: wafer holders 104, 204: guide pins 106: wire bonding portions 108, 110: stepped structure 112: first surface (upper surface) 114: second Surface (lower surface) 116: upper mold 118: lower mold 7 This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) (Please read the notes on the back first and fill in this page) Printed by the Employees 'Cooperatives of the Ministry of Intellectual Property Bureau 473951 A7 Printed by the Consumers' Cooperatives of the Ministry of Economic Affairs ’Intellectual Property Bureau 687 4twf. Doc / 006 _B7_ V. Invention Description (b) 120: Cavity 122: Void 124, 224: Mold Body 126 226, 326: Wafer accommodating spaces 130, 230, 330: Wafer 132: Active surface 134: Back surface 136: Pads 138: Adhesive materials 140, 240, 340: Conductors 142, 242, 342: Transparent sheets 300a, 300b, 300c , 300d, 300e: ceramic sheet 306: connection part 400: injection device 402: liquid encapsulation material 502, 602. · Construction unit 504: interval 506: punch 604: saw blade 606: cutting line FIG. 1 to FIG. 6 are diagrams illustrating a first aspect of the present invention. One kind of the preferred embodiment four flat no-lead package as the image sensor 8 are cross-sectional (Read a back surface of the precautions ^ ^ fill page) • means

La. •線， 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 473951 6874twf.doc/006 A7 B7 五、發明說明（η ) 圖。 本發明之無接腳影像感應器構裝係建構於導線架 lOOUead frame)上，每一構裝單元（package unit)的導線架 100 包括一晶片座l〇2(die pad)及多個導腳104(kad)環繞晶片座 102外圍而配置。而在晶片座102之周緣及導腳104的打 線部分106(bonding portion or finger)，可以形成一階梯結 構 108、110 (step structure)，比如利用半蝕刻方式（half etching) 或壓印方式（coin)形成，使其部分厚度縮減，此結構將有 利於後續製程中導線架100與鑄模體(molding body)的接合 性改善。 請參照第2圖，接著進行模壓製程(molding)，以形 成構裝之側壁(wall)。模壓時，將導線架1〇〇置於一模具 (mold)中，使導線架100由上模具116(top mold)及下模具 118(bottom mold)所夾持。其中，上模具116爲一插入模(insert mold)的形式，夾持導線架1〇〇之第一表面112(上表面）中 晶片座102及打線部分106，而在導腳104之外緣上具有 一模穴120(mold cavity);而下模具118則夾持整個第二表 面114(下表面）。灌模時，模壓材料124會塡入模穴120， 導腳104間及導腳104與晶片座102之間的空隙122。鑄 模體124的材料比如是環氧樹脂(epoxy)。由於該環氧樹脂 成本低，因此用於大量生產可以降低製造成本。値得一提 的是，習知塑膠影像感應器構裝在形成承載器的預鑄製程 (premold)中，由於模壓的關係，在打線部分及晶片座上表 面經常產生溢膠（flash)現象，常需要一道淸除步驟，否則 9 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注音？事|^填寫本頁)La. • line, this paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 473951 6874twf.doc / 006 A7 B7 V. Description of the invention (η). The pinless image sensor structure of the present invention is constructed on a lead frame (10OUead frame). The lead frame 100 of each package unit includes a die pad 102 and a plurality of guide pins. 104 (kad) is arranged around the periphery of the wafer holder 102. On the periphery of the wafer holder 102 and the bonding portion or finger 106 of the guide pin 104, a step structure 108, 110 can be formed, such as a half etching method or a coin method. ) Is formed to reduce the thickness of a part thereof, and this structure is beneficial to the improvement of the bonding between the lead frame 100 and the molding body in the subsequent process. Referring to FIG. 2, a molding process is performed to form a structured wall. During molding, the lead frame 100 is placed in a mold, and the lead frame 100 is held between a top mold 116 and a bottom mold 118. The upper mold 116 is in the form of an insert mold, which holds the wafer holder 102 and the wire bonding portion 106 in the first surface 112 (upper surface) of the lead frame 100, and is on the outer edge of the guide pin 104. There is a mold cavity 120 (mold cavity); and the lower mold 118 holds the entire second surface 114 (lower surface). During the mold filling, the molding material 124 will be inserted into the cavity 120, the space 122 between the guide pins 104 and the space 122 between the guide pins 104 and the wafer holder 102. The material of the mold body 124 is, for example, epoxy. Since the epoxy resin is low in cost, it can be used for mass production to reduce manufacturing costs. It is worth mentioning that the conventional plastic image sensor is installed in a premold forming a carrier. Due to the relationship of molding, flash phenomenon often occurs on the wire bonding part and the upper surface of the wafer holder. Often a step of elimination is required, otherwise 9 paper sizes are applicable to China National Standard (CNS) A4 (210 X 297 mm) (please read the note on the back first? Matt | ^ Fill in this page)

I Γ 經濟部智慧財產局員工消費合作社印製 6874twf. doc/006 A7I Γ Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economy 6874twf. Doc / 006 A7

五、發明說明（2) 經濟部智慧財產局員工消費合作社印製 473951 將導致後I買晶片貼附困難’打線製程(wire b〇nding)時導線 (wire)無法與導腳形成電性導通，使得良率（yield)及可靠度 (reliability)降低。然而’本發明中晶片座1〇2及打線部分1〇6 均被上f吴具116及下f吴具118所夾持，因而不會產生溢膠 現象，可以大幅提尚製程良率及產品可靠度。 g靑爹照桌3 0，igf旲體124形成封裝側壁後，與導 線架100共问構成一*晶片谷納空間126。接著進行晶片貼 附製程(die attaching)。將晶片13〇(chip)置於晶片容納空間 126中’以其背面134(back surface)藉由一黏著材料 138(adhesive)貼附於晶片座102之第一表面112，而主動表 面132(active surface)朝向開口。然後進行打線製程。利用 導線140(wire) ’例如細錦線、銅線或金線，分別電性連接 主動表面132上的焊墊136(bonding pad)及導腳1〇4之打線 部分106。 請參照第4圖，進行點膠（dispensing)製程。當完 成晶片貼附及打線後，可以透過一注入裝置4〇〇，例如噴 嘴，滴管或注射器等，將液態封裝材料（liquid c〇mp〇und) 402注入該晶片谷納空間126內的該晶片130與該鑄模體 124之間，以包覆該些導線14〇之部分。該液態封裝材料 之表面可以不高於該晶片的主動表面，較佳約略與該主動 表面齊平。該液態封裝材料402可爲一般常用於封裝之材 料，例如環氧樹脂，並加熱使其固化(cunng)。然而，該點 膠步驟(dispensing)可以在適當的真空環境中進行。經過固 化後的液態封裝材料402係用以固定晶片及部分的導線， 10 本紙張尺度適用中國國豕標準（CNS)A4規格（21〇 X 297公釐） -------------裝—— (請先閱讀背面之注意事HI填寫本頁) 訂： A7 473951 6874twf.doc/006 五、發明說明（^() 但是仍然保持該晶片130的主動表面132及銲墊136暴露 於真空。 請參考第5圖，進行密封製程（sealing)。將晶片容 納空間126抽真空，將一透明片142密封於晶片容納空間 126之開口，以避免晶片與外界接觸並且使晶片的影像感 應區域接收到來自外部的光線。透明片142比如是透明玻 璃片，或者透明塑膠片，甚至可以是提高聚光能力之鏡片。 該透明片142則以黏著劑（adhesive)固定於鑄模體124之上 表面。 請參照第6圖，進行分離製程(singulation)，將導線 架1〇〇多餘的部分切除，使其導腳1〇4切齊鑄模體124， 形成無接腳構裝結構。此時無接腳影像感應器構裝係以導 腳104之第二表面114作爲對外之接點。 本發明利用液態封裝材料塡充於該晶片與該鑄模體 之間至包覆該些導線之部分，其中該液態封裝材料之表面 約略與δ亥主動表面齊平的作法同樣可適用於塑膠四方扁平 構裝（PQFP)及陶瓷無接腳承載器（LCC)。 請參考第7圖，其繪示本發明之封裝方法應用於塑 膠四方扁平構裝的情形。首先，提供一四方扁平構裝所用 的‘線木利用如則所述之模壓方法，以一上模具及一下 模具夾ί寸阳片座202及導腳204的前端，灌入熱固性環氧 樹脂或相似材料，形成鑄模體224，如第7圖所示。該鑄 丰吴體224可爲一船形結構，其中央部份爲一晶片容納空間 226用以放置晶片於其底部。將鏡模體取出上、下模 (請先閱讀背面之注意事HI填寫本頁) -丨裝 --線. 經濟部智慧財產局員工消費合作社印製 11 經濟部智慧財產局員工消費合作社印製 473951 6874twf.doc/〇〇6 A7 r----------B7 五、發明說明（㈧） 具之後’可視需要地進一步加熱固化直到該鑄模體224完 全固化。接著，進行成型及修邊，形成特定形狀，如第7 圖所示之L型導腳204。將影像感應器晶片230貼附於晶 片座202上。進行打線製程，以導線240，例如細鋁線、 銅線或金線電性連接晶片230與導腳204。將液態封裝材 料402注入於液態封裝材料塡充於該晶片與該鑄模體之間 至包覆該些導線240之部分，以固定晶片與部份導線。該 液封裝材料402之表面較佳約略與該晶片230的上表面 齊平。然後，在晶片容納空間226抽真空之後，將透光片 242覆蓋於鑄模體224上、晶片容納空間226之頂端，並 以黏著材料固定於該鑄模體224上。 _ 胃#考第8圖，其繪示本發明之封裝方法應用於陶 妾腦1承載器的情形。一般的陶瓷無接腳承載器係由數 個陶瓷片，例如300a，300b，300c，300d及300e堆疊而成， 形成對應欲放置之電子元件例如本實施例之感應器晶 片330的空間，如第8圖所示之晶片容納空間326。該陶 瓷無接腳承載器係利用連接部306來電性連接感應器晶片 ^0’取代了導線架類型之導腳的作用，並縮小構裝體積。 連接部306係由導體材料，例如鎢、鎳、金及其合金做 $ ’並且依照電子元件所需設計對應圖案於各個陶瓷片之 間:導線340係從該連接部306暴露於該晶片容納空間326 的部份_接於感應器晶片330上的連接部份。接著，同樣 士’在晶片330與晶片容納空間326側壁之間塡入液態封 衣材料402，例如環氧樹脂，並且經過固化。該環氧樹脂 _ 12 (請先閱讀背面之注意事^1|填寫本頁)， 裝 訂： 本氏張尺度適^(CNS)A4規格（210 X 297公釐） 473951 6874twf·doc/006 pj __ —一 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（1' ) 的塡入可以視需要地在真空ί哀境下進行。在將剩餘的晶片 谷納空間326抽真空之後，以黏著材料將透光片342固定 於陶瓷構裝的頂端，亦即固定於陶瓷片3〇〇a上。 上述實施例中，晶片座之周緣及導腳之打線部分具 有階梯結構之設計，然而本發明之四方扁平無接腳影像感 應器構裝並不受限於此設計，可依據需求而做些許更動， 例如將鑄模體124進一步包覆晶片座102之下表面114。 另外，針對導線架中晶片座，可根據產品需求而有各種不 同設計。例如，爲了改善晶片與晶片座之間的熱應力 (thermal stress)，晶片座可以設計比晶片面積更小，或者設 計成環狀環繞晶片之周圍，甚至可以採用無晶片座設計。 上述實施例係以單一構裝單元（single package unit)作 說明，然而在量產時，同一導線架則包含多個構裝單元， 以利於同時進行多個晶片之構裝，及封裝自動化。 請參照第9圖，其繪示本發明四方扁平無接腳影像 感應器構裝之量產結構。導線架500具有多個構裝單元 5〇2 ’可以採條狀配置，構裝單元502間則保留一定間隔 504，可利於自動化生產；而且模壓製程可以多個構裝單 兀502同時進行。然而此種結構在分離製程中，則是利用 沖斷(punch out)的方式進行，以沖頭506將構裝單元502 逐一由導線架500上分離。 請參照第10圖，其繪示本發明無接腳影像感應器 構裝之另一量產結構。本發明之無接腳影像感應器構裝量 產時亦可以採用矩陣配置（array)的方式，將多個構裝單元 13 (請先閱讀背面之注意事 •-裝i 鲁填寫本頁： J-T· 線· 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 473951 6874twf.doc/〇〇6 A7 B7 五、發明說明（〇 602緊鄰排列於導線架6〇〇上，而模壓製程則是多個構裝 單兀602同時進行。至於後續分離製程則採用切割方式 (sawing) ’利用鋸刀604或雷射，沿切割線606(scribe line) 切割’使各構裝單元分離。此種結構由於排列緊密，可以 充分利用材料，因此降低成本，且適於量產。 上述之變化設計均可利用與前述實施例中相同之模 具來進行封裝，因此不會增加額外成本，可依產品需求而 加以變化利用，以提高產品之可靠度。 綜上所述，本發明之無接腳影像感應器構裝及其製 利用液態封裝材料塡充於該晶片與該鑄模體之間以包覆該 些導線之部分，可以避免在測試階段由於結構力不足而導 致晶片座與內導腳脫層，並且利用固定導線的方式防止導 線變形等現象，因而可以提高產品的良率。除此之外，本 發明之封裝方法不但可以用於以導線架及鑄模體作爲承載 器的封裝，而且可以也可以應用於PQFP及LCC。 雖然本發明已以一較佳實施例揭露如上，然其並非 用以限定本發明，任何熟習此技藝者，在不脫離本發明之 精神和範圍內，當可作些許之更動與潤飾，因此本發明之 保護範圍當視後附之申請專利範圍所界定者爲準。 (請先閱讀背面之注咅？事？ρρ填寫本頁)V. Description of the invention (2) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, printed by 473951, which will cause difficulties in attaching chips after buying chips. 'Wires cannot be electrically connected to the guide pins during the wire bonding process. This reduces yield and reliability. However, in the present invention, the wafer holder 102 and the wire bonding portion 106 are both held by the upper f Wu 116 and the lower f Wu 118, so there is no overflow of glue, which can greatly improve the yield and product of the process. Reliability. After taking the photo according to the table 30, the igf body 124 forms a package side wall and then forms a * chip valley space 126 together with the lead frame 100. Then, a die attaching process is performed. The chip 13 (chip) is placed in the wafer receiving space 126 'with its back surface 134 (adhesive) attached to the first surface 112 of the wafer holder 102, and the active surface 132 (active surface) toward the opening. Then, a wire bonding process is performed. Wires 140 (wire), such as fine wires, copper wires, or gold wires, are used to electrically connect the bonding pads 136 on the active surface 132 and the wire bonding portions 106 of the guide pins 104, respectively. Please refer to Figure 4 for the dispensing process. After the wafer is attached and wired, a liquid packaging material (liquid commpund) 402 can be injected into the wafer valley space 126 through an injection device 400, such as a nozzle, a dropper or a syringe. Between the chip 130 and the mold body 124, a portion of the wires 14 is covered. The surface of the liquid packaging material may not be higher than the active surface of the wafer, and is preferably approximately flush with the active surface. The liquid encapsulation material 402 can be a material commonly used for encapsulation, such as epoxy resin, and is heated to make it cunng. However, this dispensing step can be performed in a suitable vacuum environment. The cured liquid packaging material 402 is used to fix the chip and some of the wires. 10 paper sizes are applicable to China National Standard (CNS) A4 (21 × X 297 mm) ---------- --- Load—— (Please read the note on the back HI to fill out this page) Order: A7 473951 6874twf.doc / 006 V. Description of the invention (^ () But still keep the active surface 132 and pad 136 of the wafer 130 Exposed to vacuum. Please refer to Figure 5 for sealing. Vacuum the wafer accommodating space 126 and seal a transparent sheet 142 to the opening of the wafer accommodating space 126 to prevent the wafer from contacting the outside world and make the wafer image The sensing area receives light from the outside. The transparent sheet 142 is, for example, a transparent glass sheet, or a transparent plastic sheet, or even a lens for improving the light collecting ability. The transparent sheet 142 is fixed to the mold body 124 with an adhesive. Upper surface: Please refer to Fig. 6 to perform a singulation process. The excess part of the lead frame 100 is cut off, so that its guide pins 104 are cut into the mold body 124 to form a pinless structure. This No pin image The structure of the reactor uses the second surface 114 of the guide pin 104 as an external contact. The present invention uses a liquid packaging material to fill the space between the chip and the mold body to the portion covering the wires, wherein the liquid package The method of making the surface of the material approximately flush with the delta active surface can also be applied to plastic square flat packaging (PQFP) and ceramic pinless carrier (LCC). Please refer to FIG. 7, which illustrates the packaging method of the present invention. It is applied to the case of plastic square flat structure. First, the “wire wood” used for a square flat structure is provided with a molding method as described in the above. The front end of 204 is filled with thermosetting epoxy resin or similar material to form a casting mold body 224, as shown in Fig. 7. The casting Feng Wu body 224 can be a boat-shaped structure, and a central portion thereof is a wafer receiving space 226 for Place the wafer on its bottom. Take out the upper and lower molds of the mirror phantom (please read the note on the back HI to fill out this page)-丨 installation-line. Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, Consumer Cooperatives 11 Intellectual Property Bureau employee consumption Printed by Sakusha Co., Ltd. 473951 6874twf.doc / 〇〇6 A7 r ---------- B7 V. Description of the invention (㈧) After the mold is used, it may be further heated and cured as required until the mold body 224 is completely cured. , Forming and trimming to form a specific shape, such as the L-shaped guide pin 204 shown in Fig. 7. The image sensor chip 230 is attached to the wafer holder 202. The wire bonding process is performed with a wire 240 such as a thin aluminum wire The copper wire or the gold wire electrically connects the chip 230 and the guide pin 204. A liquid packaging material 402 is injected into the liquid packaging material and filled between the chip and the mold body to a part covering the wires 240 to fix the chip. With partial wires. The surface of the liquid packaging material 402 is preferably approximately flush with the upper surface of the wafer 230. Then, after the wafer accommodating space 226 is evacuated, the light-transmitting sheet 242 covers the mold body 224, the top of the wafer accommodating space 226, and is fixed to the mold body 224 with an adhesive material. _ Wei # FIG. 8 shows a case where the packaging method of the present invention is applied to a carrier of Tao Yannao 1. A general ceramic pinless carrier is formed by stacking several ceramic sheets, such as 300a, 300b, 300c, 300d, and 300e, to form a space corresponding to an electronic component to be placed, such as the sensor chip 330 of this embodiment, as described in the first section. The wafer accommodation space 326 shown in FIG. 8. The ceramic pinless carrier uses the connection part 306 to electrically connect the sensor chip ^ 0 'to replace the role of the lead frame type lead and reduce the installation volume. The connecting portion 306 is made of a conductive material, such as tungsten, nickel, gold, and its alloys, and the corresponding pattern is designed between the ceramic pieces according to the required design of the electronic component: The lead 340 is exposed from the connecting portion 306 to the wafer accommodation space. Part 326 is connected to the connection part on the sensor chip 330. Next, a liquid coating material 402, such as epoxy resin, is poured between the wafer 330 and the side wall of the wafer receiving space 326, and cured. The epoxy resin _ 12 (Please read the note on the back ^ 1 | Fill this page first), Binding: Ben's sheet size is ^ (CNS) A4 (210 X 297 mm) 473951 6874twf · doc / 006 pj __ —One B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. The introduction of the invention statement (1 ') can be performed in a vacuum as needed. After evacuating the remaining wafer valley space 326, the light transmitting sheet 342 is fixed to the top of the ceramic structure with an adhesive material, that is, fixed to the ceramic sheet 300a. In the above embodiment, the periphery of the chip holder and the wire bonding part of the guide pin have a stepped structure design. However, the structure of the square flat pinless image sensor of the present invention is not limited to this design, and some changes can be made according to requirements. For example, the mold body 124 further covers the lower surface 114 of the wafer holder 102. In addition, there are various designs for chip holders in lead frames according to product requirements. For example, in order to improve the thermal stress between the wafer and the wafer holder, the wafer holder can be designed to have a smaller area than the wafer, or can be designed to surround the wafer in a ring shape, or even a waferless design can be used. The above embodiments are described with a single package unit. However, in mass production, the same lead frame includes multiple package units to facilitate the simultaneous assembly of multiple wafers and packaging automation. Please refer to FIG. 9, which illustrates the mass production structure of the quadrangular flat pinless image sensor structure of the present invention. The lead frame 500 has a plurality of structural units 502 ′, which can be arranged in a strip shape, and a certain interval 504 is maintained between the structural units 502, which is conducive to automated production; and the molding process can be performed simultaneously by multiple structural units 502. However, in the separation process, such a structure is carried out by punching out, and the structure unit 502 is separated from the lead frame 500 one by one by the punch 506. Please refer to FIG. 10, which illustrates another mass production structure of the pinless image sensor structure of the present invention. The mass production of the pinless image sensor of the present invention can also be performed in an array manner in the form of an array. A plurality of structural units 13 (please read the precautions on the back first-install i) and fill in this page: JT · Wire · This paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) 473951 6874twf.doc / 〇〇6 A7 B7 V. Description of the invention (〇602 is arranged next to the lead frame 600, and The molding process is performed simultaneously by a plurality of structural units 602. As for the subsequent separation process, a cutting method (sawing) 604 or laser is used to cut along the scribe line 606 to separate the structural units. .This structure is compact because it can make full use of materials, so it reduces costs and is suitable for mass production. The above-mentioned changed designs can be packaged with the same mold as in the previous embodiment, so there is no additional cost. According to the needs of the product, it can be changed and utilized to improve the reliability of the product. In summary, the structure of the pinless image sensor of the present invention and its manufacturing use liquid packaging materials to fill the chip and the mold body. By covering these wires in time, it is possible to avoid delamination of the chip holder and the inner guide pin due to insufficient structural force during the test phase, and to prevent the deformation of the wires by fixing the wires, so that the yield of the product can be improved. In addition, the packaging method of the present invention can be used not only for packaging using a lead frame and a mold body as a carrier, but also for PQFP and LCC. Although the present invention has been disclosed above with a preferred embodiment, then It is not intended to limit the present invention. Any person skilled in the art can make some modifications and retouching without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be defined by the scope of the attached patent application. (Please read the note on the back? Matters? ΡρFill in this page)

P ί 言· Τ ί 經濟部智慧財產局員工消費合作社印製 14 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）P ί Speech · Τ ί Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 14 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)

Claims (1)

73951 6874twf. doc/006 A8 B8 C8 D8 六 經濟部智慧財產局員工消費合作社印製 申清專利範圍 一種四方扁平無接腳影像感應器構裝，包括· 導線架’其中g亥導線架具有一晶片座及複數個導 -----------裝 i I (請先閱讀背面之注意事寫本頁) T ’該些導腳配置於該晶片座之周緣，該導線架還包括一 第一表面及對應之一第二表面，每一該些導腳分別具有一 打線部分； ^ 金# f吴體’配置於s亥導線架之該第一表面，並環繞 該導腳之外緣，並塡充於該晶片座與該些導腳之間，且暴 露出該第一表面中之該晶片座與該些導腳之該打線部分， 該導線架與該鑄模體構成一晶片容納空間； 一晶片，具有一主動表面及對應之一背面，且該主 動表面配置有複數個焊墊，該晶片置於該晶片容納空間， 並以該㈣面貼附於§亥晶片座之該第一^表面； 複數條導線，分別電性連接該些焊墊及該些導腳之 該打線部分於該第一表面； ;線. 一液態封裝材料，塡充於該晶片與該鑄模體之間， 以包覆該些導線之部分，且該液態封裝材料之表面約略與 該主動表面齊平；以及 一透明上蓋，配置於該主動表面之上，以密封該晶 片容納空間。 2·如申請專利範圍第1項所述之四方扁平無接腳影 像感應器構裝，其中該第二表面中該些導腳之該打線部分 及該晶片座之周緣凹陷以形成一階梯結構，使得該鑄模體 包覆該第二表面中該些導腳之該打線部分的部分表面及該 晶片座之周緣。 15 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱） 473951 6874twf.doc/006 A8 B8 C8 D8 六、申請專利範圍 3. 如申請專利範圍第1項所述之四方扁平無接腳影 像感應器構裝，其中該鑄模體包括環氧樹脂。 4. 如申請專利範圍第1項所述之四方扁平無接腳影 像感應器構裝，其中該透明上蓋包括一透明玻璃片配置於 該晶片容納空間之頂端，並固定於該鑄模體上。 5. 如申請專利範圍第1項所述之四方扁平無接腳影 像感應器構裝，其中該透明上蓋包括一透明塑膠片配置於 該晶片容納空間之頂端，並固定於該鑄模體上。 6. —種四方扁平無接腳影像感應器構裝製程，包括： 提供一導線架，包括複數個構裝單元，每一構裝單 元至少具有一晶片座及複數個導腳，且該些導腳配置於該 晶片座之周緣，該導線架還包括一第一表面及對應之一第 二表面，每一該些導腳分別具有一打線部分； 進行一模壓製程，以形成一鑄模體於該導線架之該 第一表面，並環繞該些導腳之外緣，且塡充於該晶片座與 該些導腳之間，且暴露出該第一表面中之該晶片座與該些 導腳之該打線部分，使得該導線架與該鑄模體於每一該些 構裝單元構成一晶片容納空間； 經濟部智慧財產局員工消費合作社印製 --------------裝—— (請先閱讀背面之注意事寫本頁) 線· 提供複數個晶片，每一該些晶片具有一主動表面及 對應之一背面，且該主動表面配置有複數個焊墊； 進行一晶片貼附製程，將每一該些晶片分別置於對 應之該些晶片容納空間，並以該背面貼附於對應之該晶片 座的該第一表面； 進行一打線製程，以複數條導線分別電性連接該些 16 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） A8B8C8D8 473951 6874twf.doc/〇〇6 六、申請專利範圍 焊墊及該些導腳之該打線部分於該第一表面； 進行一點膠製程，將一液態封裝材料塡充於該晶片 與Μί#丨吴體之間，以包覆該些導線之部分，且該液熊封裝 材料之表面約略與該主動表面齊平； 進行一密封製程，以一透明材質配置於該主動表面 上，分別密封該些晶片容納空間；以及 進行一分離製程，將該些構裝單元分離。 7.如申請專利_第6麵述之四方翻無接腳影 像感應器構裝製程，其中該第一表面中該些導腳之該打線 部分及該晶片座之周緣凹陷以形成—階梯結構，使得該鑄 模體包覆該第二表面中該些導腳之該打線部分的部分麵 及該晶片座之周緣。 8·如申請糊糊第6項所心四方跡無接腳影 像感應器構裝製程，其中該鑄模體的材料包括環氧樹脂。 9.如申請專__ 6麵”四方評無接腳影 像感應器構裝製程，其中該模壓製程係由一上模具與一下 模具分別夾持該導線架之該第-表商及該第二麵了然後 將該模壓材料灌入該上模具及該下換具中，其中該上模具 至少夾持該晶片座及該打線部分之該第一表面，且該下模 具夾持整個該第二表面。 申請__第6項所•四方扁平無接腳影 像感應描構裝製程，其中該透明材實包括一透明玻璃片， 該密封製醜將該透明坡璃片配置於該晶片容納空間之頂 端，並固疋於該鑄模體上。 17 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） --------------裝—— (請先閱讀背面之注意事寫本頁) 訂·· •線· 經濟部智慧財產局員工消費合作社印製 473951 68 74twf. doc/00 6 A8 B8 C8 D8 六、申請專利範圍 11. 如申請專利範圍第6項所述之四方扁平無接腳影 像感應器構裝製程，其中該透明材質包括一透明塑膠片， 該密封製程係將該透明塑膠片配置於該晶片容納空間之頂 端，並固定於該鑄模體上。73951 6874twf. Doc / 006 A8 B8 C8 D8 Six employees of the Intellectual Property Bureau of the Ministry of Economic Affairs printed a patent application for a patent application. A quadrangular flat pinless image sensor structure, including the lead frame, where the ghai lead frame has a chip. Holder and multiple guides ----------- install i I (please read the note on the back to write this page) T 'The guide pins are arranged on the periphery of the chip holder, and the lead frame also includes A first surface and a corresponding one of the second surfaces, each of the guide pins has a wire-line part; ^ 金 #f 吴 体 'is disposed on the first surface of the lead frame and surrounds the guide leg Edge, filled between the wafer holder and the guide pins, and exposing the chip holder and the wire bonding portions of the guide pins in the first surface, the lead frame and the mold body constitute a wafer accommodation Space; a wafer with an active surface and a corresponding back surface, and the active surface is provided with a plurality of pads, the wafer is placed in the wafer accommodation space, and the first surface is attached to the first surface of the wafer holder A surface; a plurality of wires, each electrically connected to the The bonding pads and the wire bonding portions of the guide pins are on the first surface; a wire. A liquid packaging material is filled between the chip and the mold body to cover the wires, and the liquid package The surface of the material is approximately flush with the active surface; and a transparent cover is disposed on the active surface to seal the wafer receiving space. 2. The quadrangular flat pinless image sensor structure described in item 1 of the scope of the patent application, wherein the wired portions of the guide pins and the peripheral edge of the wafer holder in the second surface are recessed to form a stepped structure, The mold body covers a part of the surface of the wire bonding portions of the guide pins in the second surface and the periphery of the wafer holder. 15 This paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 public love) 473951 6874twf.doc / 006 A8 B8 C8 D8 VI. Patent Application Scope 3. The Quartet Flat as described in item 1 of the patent application scope The pin image sensor structure, wherein the mold body includes epoxy resin. 4. The quadrangular flat pinless image sensor structure described in item 1 of the scope of the patent application, wherein the transparent upper cover includes a transparent glass sheet disposed on the top of the wafer receiving space and fixed on the mold body. 5. The quadrangular flat pinless image sensor structure described in item 1 of the scope of patent application, wherein the transparent upper cover includes a transparent plastic sheet disposed on the top of the wafer receiving space and fixed on the mold body. 6. —A square flat pinless image sensor assembly process including: providing a lead frame including a plurality of mounting units, each mounting unit having at least a wafer holder and a plurality of guide pins, and the guides The pins are disposed on the periphery of the wafer holder. The lead frame further includes a first surface and a corresponding second surface, and each of the guide pins has a wire-bonding portion; a molding process is performed to form a casting mold body on the lead frame. The first surface of the lead frame surrounds the outer edges of the guide pins and fills between the chip holder and the guide pins, and exposes the chip holder and the guide pins in the first surface. The wire bonding part makes the lead frame and the mold body form a wafer accommodating space in each of the structural units; printed by the consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs ------------- -Installation-(Please read the note on the back first to write this page) Line · Provide a plurality of wafers, each of which has an active surface and a corresponding one of the back, and the active surface is configured with a plurality of pads; A wafer attach process The wafers are respectively placed in the corresponding wafer accommodating spaces, and the back surface is attached to the corresponding first surface of the wafer holder; a wire drawing process is performed, and a plurality of wires are electrically connected to the 16 paper sizes respectively. China National Standard (CNS) A4 specification (210 X 297 mm) A8B8C8D8 473951 6874twf.doc / 〇〇6. Patent application scope The solder pads and the wire bonding parts of the guide pins are on the first surface; In the manufacturing process, a liquid packaging material is filled between the chip and Μί # 丨 吴 体 to cover a part of the wires, and the surface of the liquid bear packaging material is approximately flush with the active surface; a sealing process is performed to A transparent material is disposed on the active surface to seal the wafer receiving spaces respectively; and a separation process is performed to separate the structural units. 7. If applying for a patent _ the process of assembling the square-shaped flip-out image sensor described in the sixth aspect, wherein the wire bonding portions of the guide pins and the peripheral edge of the wafer holder in the first surface are recessed to form a step structure, The mold body covers a part of the wire surface of the guide pins of the second surface and a peripheral edge of the wafer holder. 8. The application process for the construction of the square-shaped, square-footed, non-pink image sensor as described in the application, wherein the material of the mold body includes epoxy resin. 9. If you apply for the __ 6-sided "Quartet evaluation of the non-pin image sensor assembly process, the molding process is a first mold and a lower mold to hold the first-second and the second-side quotient of the lead frame respectively. The surface is then filled with the molding material into the upper mold and the lower mold, wherein the upper mold clamps at least the wafer holder and the first surface of the wire-bonding portion, and the lower mold clamps the entire second surface . Application __ Item 6 • The Quartet flat flat pinless image sensor structure construction process, where the transparent material actually includes a transparent glass sheet, and the sealing system arranges the transparent sloped glass sheet on the top of the wafer accommodation space. , And it is fixed on the mold body. 17 This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) -------------- installation-(please first Read the note on the back and write this page) Order ·· • Line · Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 473951 68 74twf. Doc / 00 6 A8 B8 C8 D8 6. Application for patent scope 11. If the scope of patent application is the sixth The process of assembling the four-sided flat contactless image sensor described in the item above, The transparent material includes a transparent plastic sheet, and the sealing process is to arrange the transparent plastic sheet on the top end of the wafer receiving space and fix the transparent plastic sheet on the mold body. 固化製程，將 扁平無接腳影 ---— — — — — — — — — — — R · I I (請先閱讀背面之注意事寫本頁) 12. 如申請專利範圍第6項所述之四方扁平無接腳影 像感應器構裝製程，其中該點膠製程，將該液態封裝材料 塡充於該晶片與該鑄模體之間後，還 該液態封裝材料固化。 13. 如申請專利範圍第6項所述 像感應器構裝製程，其中該些構裝單另_用矩陣方式， 彼此緊密相鄰排列，而該分離製程係割的方法，將 該些構裝單元分離。 -線· 14. 如申請專利範圍第6項所述之四方扁平無接腳影 像感應器構裝製程，其中該些構裝單元係採用條狀排列方 式，彼此間保留一預定間隔，而該分離製程係採用沖斷的 方法，將該些構裝單元分離。 15. —種影像感應器構裝，包括： 經濟部智慧財產局員工消費合作社印製 一承載器，該承載器具有一絕緣本體及複數個導 腳，且該些導腳固定於該絕緣本體中，該絕緣本體具有一 凹穴； 一影像感應晶片，具有一主動表面及對應之一背 面，且該主動表面配置有複數個焊墊，該晶片置於凹穴中， 並以該背面貼附於該凹穴之底面； 複數條導線，分別電性連接該些焊墊及該些導腳； 18 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 473951 687 4twf. doc/00 6 A8 B8 C8 D8 六、申請專利範圍 一液態封裝材料，塡充於該晶片與該絕緣本體之 間，以包覆該些導線之部分，且該液態封裝材料之表面約 略與該主動表面齊平；以及 一上蓋，配置於該主動表面之上，以密封該凹穴。 16. 如申請專利範圍第15項所述之影像感應器構 裝，其中該絕緣本體之材質包括塑膠，而該影像感應器構 裝之型態爲塑膠四方扁平構裝。 17. 如申請專利範圍第15項所述之影像感應器構 裝，其中該絕緣本體之材質包括陶瓷，而該影像感應器構 裝之型態爲陶瓷無接腳承載器構裝。 18. 如申請專利範圍第15項所述之影像感應器構 裝，其中該上蓋包括一透明玻璃片配置於該凹穴之頂端， 並固定於該絕緣本體上。 19. 如申請專利範圍第15項所述之影像感應器構 裝，其中該上蓋包括一透明塑膠片配置於該凹穴之頂端， 並固定於該絕緣本體上。 (請先閱讀背面之注意· I I 事寫本頁： 言 r 良 經濟部智慧財產局員工消費合作社印製 19 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）The curing process will make the flat contactless shadows ----- — — — — — — — — — — R · II (Please read the cautions on the back first to write this page) 12. As described in item 6 of the scope of patent application The Sifang flat pinless image sensor construction process, wherein in the dispensing process, the liquid packaging material is filled between the wafer and the mold body, and then the liquid packaging material is cured. 13. The image sensor assembly process as described in item 6 of the scope of the patent application, wherein the assembly orders are arranged in close proximity to each other in a matrix manner, and the separation process is a method of cutting the assemblies. Units are separated. -Line · 14. According to the process of assembling the Quartet flat flat pinless image sensor as described in item 6 of the scope of the patent application, the units are arranged in a stripe arrangement with a predetermined interval between each other, and the separation The manufacturing process adopts a punching method to separate the structural units. 15. An image sensor structure comprising: a carrier printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, the carrier having an insulating body and a plurality of guide pins, and the guide pins are fixed in the insulating body, The insulating body has a cavity; an image sensing chip having an active surface and a corresponding back surface, and the active surface is provided with a plurality of solder pads, the chip is placed in the cavity, and the back surface is attached to the cavity. The bottom surface of the cavity; a plurality of wires, which are electrically connected to the pads and the guide pins, respectively; 18 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 473951 687 4twf. Doc / 00 6 A8 B8 C8 D8 VI. Patent application scope A liquid packaging material is filled between the chip and the insulating body to cover parts of the wires, and the surface of the liquid packaging material is approximately flush with the active surface And an upper cover disposed on the active surface to seal the cavity. 16. The image sensor structure described in item 15 of the scope of the patent application, wherein the material of the insulating body includes plastic, and the image sensor structure is a plastic square flat structure. 17. The image sensor structure described in item 15 of the scope of patent application, wherein the material of the insulating body includes ceramics, and the type of the image sensor structure is a ceramic non-pin carrier structure. 18. The image sensor structure according to item 15 of the scope of patent application, wherein the upper cover includes a transparent glass sheet disposed on the top of the cavity and fixed on the insulating body. 19. The image sensor structure according to item 15 of the scope of patent application, wherein the upper cover includes a transparent plastic sheet disposed on the top of the cavity and fixed on the insulating body. (Please read the note on the back first. I I write this page: 言 r 良 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 19 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)
TW090101003A 2001-01-17 2001-01-17 Non-leaded quad flat image sensor package TW473951B (en)

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TW090101003A TW473951B (en) 2001-01-17 2001-01-17 Non-leaded quad flat image sensor package
US10/037,895 US6545332B2 (en) 2001-01-17 2001-10-22 Image sensor of a quad flat package
US10/341,086 US6767753B2 (en) 2001-01-17 2003-01-13 Image sensor of a quad flat package

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