TW440972B - Leadless image sensor package - Google Patents

Leadless image sensor package Download PDF

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Publication number
TW440972B
TW440972B TW089104137A TW89104137A TW440972B TW 440972 B TW440972 B TW 440972B TW 089104137 A TW089104137 A TW 089104137A TW 89104137 A TW89104137 A TW 89104137A TW 440972 B TW440972 B TW 440972B
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Taiwan
Prior art keywords
wafer
image sensor
pinless
scope
patent application
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TW089104137A
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Chinese (zh)
Inventor
Jian-Ping Huang
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Siliconware Precision Industries Co Ltd
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Priority to TW089104137A priority Critical patent/TW440972B/en
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Publication of TW440972B publication Critical patent/TW440972B/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

A leadless image sensor package is constructed on a lead frame, which has a die pad and a plurality of leads arranged on the periphery of the die pad. The mold package material is arranged on the upper surface of the lead frame and surrounds the outer edge of the lead frame to fill in between the die pad and lead frame and expose the bonding wire portion between the die pad and lead frame on the upper surface. The lead frame and mold package material are formed in die receiving space. The die is placed in the die receiving space and adhered to the upper surface of the die pad by its back. The bonding wire portions of the solder pad and lead are electrically connected respectively on the upper surface. A transparent upper lid hermetically seal the die receiving space.

Description

4 4 0 9 7 2 A7 5900twf.d〇c/008 B7 五、發明説明（丨’） --------/ .裝— - (請先閲讀背面之注意事項再填寫本頁} 本發明是有關於一種影像感應器（image sensor)的構 裝結構及其製程，且特別是有關於一種無接腳（leadless)影 像感應器構裝結構及其製程。 近年來由於多媒體的蓬勃發展，數位影像使用愈趨 頻繁’相對應許多影像處理裝置的需求也愈來愈多。現今 許多數位影像產品，包括電腦數位攝影機(PC digital video camera)，數位照相機（digital camera)，甚至光學掃描器 (scanner)及影像電話等，皆是藉由影像感應器(image sensor) 來擷取影像。影像感應器包括電耦合元件（charge coupled device)及互補式金氧半導體感應元件（CMOS sens〇r)等， 可以靈敏地接收影像所發出之光線，而轉換爲數位訊號。 由於影像感應器需要接收光源，因此其構裝方式與一般電 子產品有所不同。 經濟部智慧財產局員工消費合作社印製 習知影像感應器之構裝採用塑膠四方扁平構裝 (plastic quad flat package, PQFP)，如美國第 5523608 號專 利，及美國第5529959號專利所揭露之構裝結構。由於其 體積較大，因此並不適於未來高積集度之應用。另外，習 知亦有諸多影像感應器係採用陶瓷承載器，比如陶瓷無接 腳承載器(ceramic leadless chip carrier, LCC)，其揭露於美 國第5898218、5270491號專利。雖然陶瓷承載氣的密閉 性較佳，可以延長影像感應器的使用壽命，然而其製造成 本較高，製程亦較繁瑣，並不符合市場需求。影像感應器 還有一種塑膨構裝，是利用積層板(laminated substrate)作 爲承載器，形成類似無接腳承載器型態，如美國專利第 3 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公嫠） 5900twf.doc/008 A7 B7 __ 五、發明説明（飞） 581 1799號所揭露。雖然其可以縮小體積，然而由於承載 器係採用玻璃環氧基樹脂（flame_retardant ep0Xy_glass fabne cDmposite rxsin，FR_4、FR_5) ’ 或雙順丁烯二酸醯 亞胺（Bismaleimide-Triazine，BT)做爲原料，成本較高， .亦不符合市場需求。 本發明就是在提供—種無接腳影像感應器構裝，以 導線架及鑄模封裝材料形成承載器，可以顯著降低成本。 此外本發明所提出之無接腳構裝結構，可以縮減構 .裝體積，增加構裝密度。 而本發明所提出對應之構裝製程較爲簡單，且可以 提局生產良率’並適於量產。 本發明提出一種無接腳影像感應器構裝，建構於一 導線架，其具有晶片座及多個導腳配置於晶片座之周緣。 f脣模封裝材料’配置於導線架之上表面，並環繞導線架之 外緣，並塡充於晶片座與導腳之間’且暴露出上表面中之 晶片座與導腳之打線部分，而導線架與鑄模封裝材料構成 一晶片容納空間。晶片置於晶片容納空間中，並以背面貼 附於晶片座之上表面，而利用導線分別電性連接焊塾及導 腳之打線部分於上表面：透明上蓋則密封晶片容納空間。 依照上述之無接腳影像感應器構裝結構，本發明亦 提出對應之製程，包括：先提供一導線架，其包括多個構 裝單元，每一構裝單元至少具有晶片座及多個導腳配置於 該晶片座之周緣。接著進行鑄模製程，以形成鑄模封裝材 料於導線架之上表面，並環繞構裝，單兀之外緣，且填充於 4 I紙張尺度適用中國國家標準（CNS ) A4規^ ( 210X297公釐） '- IL------·}裝------Λ1Τ------J (請先閱讀背面之注$項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 經濟部智慧財產局員工消費合作社印製 440972 A7 5900twf.doc/008 g-y 五、發明説明（&gt; ) 晶片座與導腳之間，暴露出上表面中晶片座與導腳之打線 部分’使得導線架與鑄模封裝材料於每一構裝單元構成一 曰曰片谷納空間。進行晶片貼附製程，將多個晶片分別置於 對應之晶片容納空間，並以晶片背面貼附於對應晶片座之 上表面。然後進行打導線製程，以導線分別電性連接晶片 之焊墊及導腳的該打線部分於上表面。進行密封製程，以 一透明材質分別抗封晶片容納空間；並進行分離製程’將 各構裝單元分離。 依照本發明的一較佳實施例，其中下表面中導腳打 線部分及晶片座之周緣可以形成階梯結構，使得鑄模封裝 材料包覆下表面中厚度較薄之部分，或者晶片座亦可以設 g十厚度小於導腳之厚度，使得鑄模封裝材料包覆晶片座之 下表面，以加強導線架與鑄模封裝材料的接合性^禱模製 程中上模夾持晶片座及打線部分之上表面，且下模夾持整 個下表面’以防止溢膠殘留，以提高產品可靠度，並簡化 製程= 曰 而透明上蓋可以是透明玻璃片或透明塑膝片，配置 於晶片容納空間之頂端，並固定於鑄模封裝材料上；或者 可以是透明液態材料，將其塡充於晶片容納空間中，並㉜ 過固化形成。而構裝單元可採用矩陣方式，彼此繫密相^ 排列，而分離製程則採用切割的方法，以節省付料利於量 產。或者’構裝單元亦可採用條狀排列方式，彼此間保留 一間距’而分離製程則採用沖斷的方法。由於本發^之構 裝結構係直接以導腳之下表面作爲對外接點，形成無接腳 5 }紙浪尺度適财關家CNS )人4腦· ( 21GX2_97公釐） - ——一------}裝------訂------、J (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 440972 A7 5900twf, doc/008 B7 五、發明説明（ψ ) 結構，可以提高構裝密度。而本發明之構裝結構中係以導 線架及鑄模封裝材料（molding compound)形成承載器，因 此顯者降低產品成本，利於量產。 爲讓本發明之上述和其他目的、特徵、和優點能更 明顯易懂，下文特舉一較佳實施例，並配合所附圖式，作 詳細說明如下= 圖式之簡單說明： 第1圖至第5圖繪示依照本發明一較佳實施例的一 種無接腳影像感應器構裝製程剖面圖。 第6圖繪示本發明無接腳影像感應器構裝，另一種 晶片座設計。 第7圖繪示本發明無接腳影像感應器構裝，另一種 導線架設計。 第8圖繪示本發明另一種密封結構及方法。 第9圖繪示本發明無接腳影像感應器構裝之量產結 構。 第10圖繪示本發明無接腳影像感應器構裝之另一 量產結構。 第11圖及第12圖繪示本發明的另一種導線架晶片 座設計。 第13圖繪示本發明之無晶片座導線架設計。 圖式之標示說明： 100、300、500、600 :導線架 102、202、302、702、802二晶片座 6 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） — J------乃装—-----訂------ (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 4 4 0 9 7 2 A7 5900twf.doc/008 B7五、發明説明（f ) 104、304 :導腳106 :打線部分 108、110 :階梯結構112 :第一表面（上表面)Π4 :第二表面（下表面) 116 :上模 118 :下模 120 :模穴 122 :空隙124 :鑄模封裝材料126 :晶片容納空間130:晶片132 :主動表面 134 :背面 136 :焊墊138 :黏著材料 140 :導線 142 :透明上蓋 400 :噴嘴402 :透明液態材料 502、602 :構裝單元 504 :間距 506 :沖頭 604 :鋸刀 (請先閱讀背面之注意事項再填寫本頁) 裝- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 經濟部智慧財產局員工消費合作社印製 44097 2 A7 5900twf,doc/008 B7 五、發明説明（6) 606 :切割線 實施例 請參照第1圖至第5圖，其繪示依照本發明一較佳 實施例的一種無接腳影像感應器構裝製程剖面圖。本發明 .之無接腳影像感應器構裝係建構於導線架l〇〇(lead frame) 上，每一構裝單元(package unit)的導線架100包括一晶片 座102(die pad)及多個導腳104(lead)環繞晶片座102外圍 而配置。而在晶片座102之周緣及導腳104的打線部分 106(bonding portion or finger)，可以形成一階梯結構 1〇8、 110 (step structure)，比如利用半触刻方式（half etching)或 壓印方式（coin)形成，使其部分厚度縮減，此結構將有利 於後續製程中導線架1〇〇與鑄模封裝材料（molding compound)的接合性改善。 請參照第2圖’接著進行鑄模製程（molding)，以形 成構裝之側壁（wall)。鑄模時，將導線架100置於一模具 (mold)中，使導線架1〇〇由上模ii6(t〇p mold)及下模 118(bottommold)所夾持。其中’上模116爲一插入模(insert mold)的形式’夾持導線架100之第一表面112(上表面）中 晶片座102及打線部分106，而在導腳1〇4之外緣上具有 一模穴120(mold cavity);而下模則夾持整個第二表 面114(下表面）。灌模時，鑄模封裝材料124(molding compound)會塡入模八12〇’導腳1〇4間芬道腳104组晶&amp; 座1〇2之間的空隙：122。鑄模封裝材觀比= 環氧樹脂（epoxy) ’可以降低材料成·本g値得一提的是，習 8 本紙張尺度適用中國國家標準（CNS ) A4规格（210Χ297Α^Γ ------ I--------「襞—-----1T------^ (諳先聞讀背面之注意事項再填寫本頁) A7 B7 440972 5900twf.doc/008 五、發明説明（)） 知塑膠類影像感應器構裝在形成承載器的預鑄製程 (premold)中’由於模壓的關係，在打線部分及晶片座上表 面經常產生溢膠（flash)現象，常需要一道淸除步驟，否則 將導致後續晶片貼附困難，打導線製程(wire bonding)時導 線（wire)無法與導腳形成電性導通，使得良率（yield)及可 靠度(reliability)降低。然而，本發明中晶片座1〇2及打線 部分106均被上模116及下模118所夾持，因而不會產生 溢膠現象，可以大幅提高製程良率及產品可靠度。 請參照第3圖，鑄模封裝材料124形成封裝側壁， 與導線架100共同構成一晶片容納空間126。接著即是進 行晶片貼附製程（die attaching)，將晶片l30(chip)置於晶 片容納空間126中，以其背面134(back surface)藉由一黏 著材料138(adhesive)，貼附於晶片座1〇2之第一表面112， 而主動表面132(active surface)朝向開口。然後進行打導線 製程，利用導線140(wire)分別電性連接主動表面132上的 焊墊136(bonding pad)及導腳104之打線部分1〇6。 請參照第4圖，進行密封製程（sealing)，將晶片容 納空間126抽真空，將一透明上蓋142密封於晶片容納空 間126之開口。透明上蓋142比如是透明玻璃片，或者透 明塑膠片，甚至可以是提高聚光能力鏡片。而透明上蓋142 則以黏著劑(adhesive)固定於鑄模封裝材料124之上表面。 請參照第5圖，進行分離製程(singulation)，將導線 架100多餘的部分切除，使其導腳104切齊鑄模封裝材料 124，形成無接腳構裝結構。此時無接腳影像感應器構裝 9 本紙張尺度適用中囤國家標準（CNS &gt; A4規格（210X297公釐） ---------〈 裝------訂 (請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 A7 B7 4409724 4 0 9 7 2 A7 5900twf.d〇c / 008 B7 V. Description of the invention (丨 ') -------- /. 装 —-(Please read the precautions on the back before filling this page} This The invention relates to an image sensor structure and its manufacturing process, and in particular to a leadless image sensor structure and its manufacturing process. In recent years, due to the booming development of multimedia, The more frequent the use of digital imaging, the more demand for many image processing devices. Many digital imaging products today include PC digital video cameras, digital cameras, and even optical scanners ( Scanners and image phones are used to capture images through image sensors. Image sensors include charge coupled devices and complementary metal-oxide-semiconductor sensors (CMOS sensors). It can sensitively receive the light emitted by the image and convert it into a digital signal. Since the image sensor needs to receive the light source, its construction method is different from that of general electronic products. Economy The Intellectual Property Bureau employee consumer cooperative prints the conventional image sensor structure using a plastic quad flat package (PQFP), such as U.S. Patent No. 5523608 and U.S. Patent No. 5529959. Because of its large size, it is not suitable for future applications with high accumulation. In addition, many image sensors are known to use ceramic carriers, such as ceramic leadless chip carrier (LCC) It is disclosed in US Patent Nos. 5898218 and 5270491. Although ceramic carrier gas has better airtightness and can prolong the service life of the image sensor, it has higher manufacturing cost and more complicated manufacturing process, which does not meet the market demand. The sensor also has a plastic expansion structure, which uses a laminated substrate as a carrier to form a similar pinless carrier. For example, the third paper in the US patent applies Chinese National Standard (CNS) A4 specifications ( 210X297 male) 5900twf.doc / 008 A7 B7 __ V. Invention Description (Fly) 581 1799 disclosed. Although it can be reduced in size However, as the carrier uses glass epoxy resin (flame_retardant ep0Xy_glass fabne cDmposite rxsin (FR_4, FR_5) 'or bismaleimide-triazine (BT) as the raw material, the cost is higher. Nor does it meet market demand. The present invention is to provide a pinless image sensor structure, which uses a lead frame and a mold packaging material to form a carrier, which can significantly reduce costs. In addition, the pinless structure proposed by the present invention can reduce the structure volume and increase the structure density. The corresponding fabrication process proposed by the present invention is relatively simple, and it can improve the local production yield 'and is suitable for mass production. The invention proposes a pinless image sensor structure, which is constructed on a lead frame, which has a chip holder and a plurality of guide pins arranged on the periphery of the chip holder. f Lip mold packaging material 'is arranged on the upper surface of the lead frame, surrounds the outer edge of the lead frame, and fills between the chip holder and the guide pin', and exposes the wiring part of the chip holder and the guide pin on the upper surface The lead frame and the mold packaging material constitute a wafer receiving space. The wafer is placed in the wafer accommodating space, and is attached to the upper surface of the wafer holder with a back surface. The wires are used to electrically connect the soldering pads and the wire bonding portions of the guide pins to the upper surface, respectively. The transparent upper cover seals the wafer accommodating space. According to the above-mentioned pinless image sensor structure, the present invention also proposes a corresponding process, including: first providing a lead frame, which includes a plurality of structure units, each structure unit has at least a wafer holder and a plurality of guides. The feet are arranged on the periphery of the wafer holder. Next, a molding process is performed to form a mold packaging material on the upper surface of the lead frame and surround the structure. The outer edge of the unit is filled with 4 I paper. The standard of China National Standards (CNS) A4 is applicable. (210X297 mm) '-IL ------ ·} pack ------ Λ1Τ ------ J (Please read the note on the back before filling in this page) Printed by the Employees ’Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 440972 A7 5900twf.doc / 008 gy 5. Description of the invention (&gt;) Between the chip holder and the guide pin, the upper surface of the chip holder and the guide pin are exposed to make the wire The frame and the mold encapsulation material form a piece of grain space in each of the structural units. The wafer attaching process is performed, and a plurality of wafers are respectively placed in corresponding wafer accommodating spaces, and the back surface of the wafer is attached to the upper surface of the corresponding wafer holder. Then, a wire bonding process is performed, and the wire is electrically connected to the bonding pad of the chip and the wire bonding portion of the guide pin on the upper surface, respectively. A sealing process is performed, and the wafer accommodating spaces are respectively sealed with a transparent material; and a separation process is performed to separate each structural unit. According to a preferred embodiment of the present invention, a stepped structure can be formed on the lower surface of the lead wire and the periphery of the wafer holder, so that the mold packaging material covers the thinner portion of the lower surface, or the wafer holder can also be provided with g. The thickness is less than the thickness of the guide pin, so that the mold packaging material covers the lower surface of the wafer holder to enhance the bonding between the lead frame and the mold packaging material. ^ During the molding process, the upper mold holds the upper surface of the wafer holder and the wire bonding part, and The lower mold clamps the entire lower surface to prevent spillage residue, to improve product reliability, and to simplify the manufacturing process. = The transparent upper cover can be a transparent glass sheet or a transparent plastic knee sheet. On the mold packaging material; or it can be a transparent liquid material, which is filled in the wafer accommodating space and is formed by curing. The structural units can be arranged in a matrix manner and arranged in close relation with each other. The separation process uses a cutting method to save materials and facilitate mass production. Alternatively, the 'assembly units can also be arranged in a stripe manner, leaving a space between each other', and the separation process uses a punching method. Because the structure of the hairpin ^ is directly using the lower surface of the guide as the external contact point to form a non-pin 5} paper wave scale Shicaiguanjia CNS) human 4 brain · (21GX2_97 mm)-—— one- -----} Installation ------ Order ------, J (Please read the notes on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 440972 A7 5900twf, doc / 008 B7 V. Description of the invention (ψ) structure can increase the density of the structure. In the structure of the present invention, the carrier is formed by a wire frame and a molding compound, so that the cost of the product is significantly reduced and mass production is facilitated. In order to make the above and other objects, features, and advantages of the present invention more comprehensible, a preferred embodiment is exemplified below, and in conjunction with the accompanying drawings, the detailed description is as follows = Brief description of the drawings: FIG. 1 FIG. 5 to FIG. 5 are cross-sectional views of a pinless image sensor assembly process according to a preferred embodiment of the present invention. FIG. 6 illustrates a pinless image sensor structure of the present invention, and another chip holder design. FIG. 7 illustrates a pinless image sensor structure of the present invention, and another lead frame design. FIG. 8 illustrates another sealing structure and method of the present invention. FIG. 9 shows a mass production structure of the pinless image sensor structure of the present invention. FIG. 10 illustrates another mass production structure of the pinless image sensor structure of the present invention. Figures 11 and 12 illustrate another leadframe wafer holder design of the present invention. FIG. 13 shows the design of the chipless leadframe of the present invention. Description of the drawings: 100, 300, 500, 600: Lead frame 102, 202, 302, 702, 802 Two chip holders 6 This paper size applies to China National Standard (CNS) A4 specification (210X297 mm) — J-- ---- It's a dress ------- Order ------ (Please read the notes on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 4 4 0 9 7 2 A7 5900twf .doc / 008 B7 V. Description of the invention (f) 104, 304: Guide pins 106: Wire-forming portions 108, 110: Stepped structure 112: First surface (upper surface) Π4: Second surface (lower surface) 116: Upper mold 118: lower mold 120: cavity 122: void 124: mold packaging material 126: wafer receiving space 130: wafer 132: active surface 134: back surface 136: pad 138: adhesive material 140: wire 142: transparent cover 400: nozzle 402 : Transparent liquid material 502, 602: Structure unit 504: Pitch 506: Punch 604: Saw blade (please read the precautions on the back before filling this page) Packing-This paper size applies to China National Standard (CNS) A4 specifications ( 210X297 mm) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 44097 2 A7 5900twf, doc / 008 B7 V. Description Ming (6) 606: Example 1 Referring to FIGS. 5 through FIG embodiment cut lines, which illustrates the image sensor package as cross-sectional views of a preferred embodiment according to one embodiment of the present invention, no-lead. The pinless image sensor structure of the present invention is constructed on a lead frame 100. The lead frame 100 of each package unit includes a die pad 102 and a plurality of die pads. Each guide pin 104 (lead) is arranged around the periphery of the wafer holder 102. On the periphery of the wafer base 102 and the bonding portion or finger 106 of the guide pin 104, a step structure 108, 110 can be formed, such as using half etching or embossing. A coin is formed to reduce a part of the thickness, and this structure will help improve the bonding between the lead frame 100 and a molding compound in a subsequent process. Please refer to FIG. 2 'and then perform a molding process to form a structured wall. When casting a mold, the lead frame 100 is placed in a mold, and the lead frame 100 is held between an upper mold ii6 (top mold) and a lower mold 118 (bottommold). The 'upper mold 116 is in the form of an insert mold' is used to clamp the wafer holder 102 and the wire bonding portion 106 in the first surface 112 (upper surface) of the lead frame 100, and on the outer edge of the guide pin 104 There is a mold cavity 120 (mold cavity); the lower mold holds the entire second surface 114 (lower surface). During the mold filling, the mold packaging material 124 (molding compound) will be inserted into the gap between the 104 group crystals 104 and the pedestal 102 of the mold foot 1212: 122. Viewing ratio of mold packaging material = epoxy resin 'can reduce material cost. The cost is worth mentioning. The paper size of this paper is applicable to China National Standard (CNS) A4 specification (210 × 297Α ^ Γ -----) -I -------- 「襞 ——----- 1T ------ ^ (谙 Please read the notes on the back before filling this page) A7 B7 440972 5900twf.doc / 008 V. Explanation of the invention ()) It is known that plastic image sensors are installed in a premold forming a carrier. 'Because of the molding relationship, flash phenomenon often occurs on the wire bonding part and the upper surface of the wafer holder. One elimination step, otherwise it will cause subsequent wafer attachment difficulties, and the wire cannot be electrically connected to the guide pin during the wire bonding process, which reduces yield and reliability. However, In the present invention, the wafer holder 102 and the wire bonding portion 106 are both held by the upper mold 116 and the lower mold 118, so there is no overflow of glue, which can greatly improve the process yield and product reliability. Please refer to FIG. 3 The mold packaging material 124 forms a package side wall, and together with the lead frame 100, forms a wafer to accommodate the space. 126. Next, a die attaching process is performed, and a chip l30 (chip) is placed in the wafer accommodating space 126, and a back surface 134 (back surface) thereof is affixed to it with an adhesive material 138 (adhesive). The first surface 112 of the wafer holder 102 and the active surface 132 (the active surface) face the opening. Then, a wire bonding process is performed, and the bonding pads 136 on the active surface 132 are electrically connected by wires 140 (wire), respectively. And the wire bonding portion 10 of the guide pin 104. Please refer to FIG. 4 to perform a sealing process, vacuumize the wafer accommodating space 126, and seal a transparent upper cover 142 to the opening of the wafer accommodating space 126. The transparent upper cover 142, for example, It is a transparent glass sheet, or a transparent plastic sheet, or even a lens that enhances the light condensing ability. The transparent upper cover 142 is fixed to the upper surface of the mold packaging material 124 with an adhesive. Please refer to FIG. 5 for the separation process ( singulation), the excess part of the lead frame 100 is cut off, so that the guide pins 104 thereof are cut into the mold packaging material 124 to form a pinless structure. At this time, 9 paper rulers are configured without the pin image sensor Applicable national standard (CNS &gt; A4 specification (210X297mm) --------- <Packing ------ Order (please read the precautions on the back before filling this page)) Printed by the property bureau employee consumer cooperative A7 B7 440972

5900twf.doc/00S 五、發明説明（X) 係以導腳104之第二表面114作爲對外之接點。 上述實施例中，晶片座之周緣及導腳之打線部分具 有階梯結構之設計，然而本發明之無接腳影像感應器構裝 並不受限於此設計’可依據需求而做些許更動。請參照第 .6圖’其繪示本發明無接腳影像感應器構裝，另一種晶片 .座設計。爲進一步加強鑄模封裝材料124與導線架1〇〇之 接合性，還可將晶片座2〇2設計爲厚度較薄於導腳1〇4之 型％’使得在f#模製程中’銳模封裝材料丨24會進一步包 覆晶片座202之下表面114。 請參照第7圖，其繪示本發明無接腳影像感應器構 裝，另一種導線架設計。然而，若導線架之材料適當，或 者經過適當之電鍍處理，以改善其與鑄模封裝材料之接合 性’則導線架並無須特別之結構設計。如第7圖所示，導 線架300中晶片座扣2及導腳3〇4即無特別之結構設計， 仍可以構成本發明之無接腳影像感應器構裝。 、 此外，上述實施例中，密封製程係以透明玻璃片或 透明塑膠片爲例，然而亦可以由透明液態材料取代。請杂 照第8圖，其繪示本發明另一種密封結構及方法。隹&quot;完^ 晶片貼附及打導線後，可以腿〜_ 4(KKnQzzie)= 態材料402注入晶片容納空間126中，而形成透明上蓋。 透明$態材料包括液態玻璃或液態膠’其通常含有溶劑， 加熱使其固化(curing)。然而點入透明液態材料 可以在適度真空環境中進行。 上述實施麵以單-構__ingle _ _I______ 10 ( 210X297^-* ) f請先聞讀背面之注項再填寫本頁} 、&quot;5900twf.doc / 00S V. Description of the Invention (X) The second surface 114 of the guide pin 104 is used as the external contact point. In the above embodiment, the peripheral edge of the chip holder and the wire bonding portion of the guide pin have a stepped structure design. However, the pinless image sensor structure of the present invention is not limited to this design. It can be changed according to requirements. Please refer to FIG. 6 ', which shows the structure of the pinless image sensor of the present invention, and another chip holder design. In order to further strengthen the bonding between the mold packaging material 124 and the lead frame 100, the chip holder 202 can also be designed to have a thinner thickness than the guide pin 104.% 'so that in the f # molding process, the sharp mold package The material 24 will further cover the lower surface 114 of the wafer holder 202. Please refer to FIG. 7, which illustrates a pinless image sensor structure of the present invention, and another lead frame design. However, if the material of the lead frame is appropriate, or after proper plating treatment to improve its bonding with the mold packaging material, the lead frame does not need a special structural design. As shown in FIG. 7, the wafer holder buckle 2 and the guide pin 304 in the wire guide 300 have no special structural design, and can still constitute the pinless image sensor structure of the present invention. In addition, in the above embodiment, the sealing process uses a transparent glass sheet or a transparent plastic sheet as an example, but it may also be replaced by a transparent liquid material. Please refer to Fig. 8, which shows another sealing structure and method of the present invention. Quot &quot; After the chip is attached and the wires are connected, the legs can be injected into the chip accommodating space 126 with the legs ~ _ 4 (KKnQzzie) = state, so as to form a transparent upper cover. Transparent materials include liquid glass or liquid glue 'which usually contains a solvent and is heated to cure. However, the introduction of transparent liquid materials can be performed in a moderate vacuum environment. The above implementation is based on a single-structure __ingle _ _I______ 10 (210X297 ^-*) f Please read the notes on the back before filling out this page} 、 &quot;

-、1T 經濟部智慧財產局員工消費合作社印製 440 97 2 A7 5900twf.doc/008 37 五、發明説明（q) 作說明，然而在量產時，同一導線架則包含多個構裝單元’ 以利於同時進行多個晶片之構裝，及封裝自動化。請參照 第9圖’其繪示本發明無接腳影像感應器構裝之量產結構。 導線架500具有多個構裝單元502，可以採條狀配置，構 裝單元502間則保留一定間距504,可利於自動化生產； 而且鑄模製程可以多個構裝單元502同時進行。然而此種 結構在分離製程中，則是利用沖斷(punch out)的方式進行， 以沖頭506將構裝單元502逐一由導線架500上分離。 請參照第10圖，其繪示本發明無接腳影像感應器 構裝之另一量產結構。本發明之無接腳影像感應器構裝量 產時亦可以採用矩陣配置（array)的方式，將多個構裝單元 602緊鄰排列於導線架600上，而鑄模製程則是多個構裝 單元602同時進行。至於後續分離製程則採用切割方式 (sawing)，利用鋸刀604或雷射，沿切割線606(scr化e line) 切割’使各構裝單元分離。此種結構由於排列緊密，可以 充分利用材料，因此降低成本，且適於量產。 經濟部智慧財產局員工消費合作社印製 ------η ί - .. I - - I - I ^ (請先閱讀背面之注意事項再填寫本頁) 另外’針對導線架中晶片座，可根據產品需求而有 各種不同設計。請參照第11圖及第12圖，其繪示本發明 的另一種導線架晶片座設計。爲了改善晶片與晶片座之間 的熱應力（thermal stress)，如第11圖所示，晶片座702可 以設計比晶片130之面積小。或者如第12圖所示，可以 將晶片座802設計成環狀環繞晶片130之周圍。更甚者， 請參照第13圖，其繪示本發明之無晶片座導線架設計。 本發明甚至可以採用無晶片座設計導線架僅由導腳1〇4 11 _1紙浪；?及適用中國國家標準（〇叫八4規格（210父297公釐) A7 B7 440 9 7 2 5900twf.d〇c/〇〇g 五、發明説明（（〇 )-、 1T printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 440 97 2 A7 5900twf.doc / 008 37 V. Description of Invention (q) for explanation, however, in mass production, the same lead frame contains multiple structural units' To facilitate the simultaneous assembly of multiple wafers and packaging automation. Please refer to FIG. 9 ', which illustrates the mass production structure of the pinless image sensor structure of the present invention. The lead frame 500 has a plurality of structural units 502, which can be arranged in a strip shape. A certain distance 504 is reserved between the structural units 502, which is conducive to automated production; and the molding process can be performed simultaneously by multiple structural units 502. However, in the separation process, such a structure is carried out by punching out. The punching unit 506 separates the assembly unit 502 from the lead frame 500 one by one. Please refer to FIG. 10, which illustrates another mass production structure of the pinless image sensor structure of the present invention. In mass production of the pinless image sensor of the present invention, a matrix configuration (array) method can also be used to arrange a plurality of mounting units 602 next to the lead frame 600, and the molding process is a plurality of mounting units. 602 is performed simultaneously. As for the subsequent separation process, a sawing method is used, and a saw blade 604 or a laser is used to cut along the cutting line 606 to separate the constituent units. Due to the close arrangement of this structure, materials can be fully utilized, thus reducing costs and being suitable for mass production. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs ---- η ί-.. I--I-I ^ (Please read the precautions on the back before filling out this page) In addition, 'for the chip holder in the lead frame, Various designs are available according to product requirements. Please refer to FIG. 11 and FIG. 12, which show another design of the lead frame chip holder of the present invention. In order to improve the thermal stress between the wafer and the wafer holder, as shown in FIG. 11, the wafer holder 702 can be designed to have a smaller area than the wafer 130. Alternatively, as shown in FIG. 12, the wafer holder 802 may be designed to surround the periphery of the wafer 130 in a ring shape. Furthermore, please refer to FIG. 13, which shows the design of the chipless lead frame of the present invention. The present invention can even use a chipless design lead frame consisting only of the guide pins 104 11 _1 paper waves;? And applicable Chinese national standards (〇 called eight 4 specifications (210 father 297 mm) A7 B7 440 9 7 2 5900twf. d〇c / 〇〇g V. Description of the invention ((〇)

環繞晶片130之外圍所構成，而將晶片130直接貼附於底 部之禱模封裝材料之表面。上述之三種導線架的變化 設計’均可利用與前述實施例中相同之模具來進行封裝， 因此不會增加額外成本，可依產品需求而加以變化利用， 以提商產品之可靠度D 綜上所述’本發明之無接腳影像感應器構裝及其製 程至少具有下列優點： I本發明之無接腳影像感應器構裝，係以導線架及 鑄模封裝材料形成承載器，可以顯著降低產品成本。 2‘本發明之無接腳構裝結構，採用無接腳構裝結構， 可以縮減構裝體積，增加構裝密度。 3.本發明之構裝製程較爲簡單，可以提高生產良率， 且構裝單元可以矩陣方式排列，適於量產並降低成本。 4·本發明之鑄模製程，由於上、下模同時夾持晶片 座及打線部分，可以改善晶片貼附及打導線製程的良率， 且避免額外之溢膠處理，以簡化製程。 雖然本發明已以一較佳實施例揭露如上，然其並非 用以限定本發明，任何熟習此技藝者，在不脫離本發明之 精神和範圍內，當可作些許之更動與潤飾，因此本發明之 保護範圍當視後附之申請專利範圍所界定者爲準。 12 本紙張尺度適用中國國家標準（CNS ) Μ規格（210X2.97公釐） ---------s)^i-----、訂------上 (讀先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製It is formed around the periphery of the wafer 130, and the wafer 130 is directly attached to the bottom of the surface of the prayer mold packaging material. The three design variations of the three lead frames mentioned above can all be packaged with the same mold as in the previous embodiment, so there is no additional cost, and it can be changed and utilized according to the product demand to improve the reliability of the product. D In summary The 'pinless image sensor structure of the present invention and its manufacturing process have at least the following advantages: I The pinless image sensor structure of the present invention is formed by using a lead frame and a mold packaging material to form a carrier, which can significantly reduce Product Cost. 2 ’The pinless structure of the present invention adopts a pinless structure, which can reduce the volume of the structure and increase the density of the structure. 3. The fabrication process of the present invention is relatively simple, which can improve the production yield, and the fabrication units can be arranged in a matrix manner, which is suitable for mass production and reduces costs. 4. The casting process of the present invention, because the upper and lower molds hold the wafer holder and the wire bonding portion at the same time, can improve the yield of the wafer attaching and wire routing process, and avoid extra glue overflow processing to simplify the manufacturing process. Although the present invention has been disclosed as above with a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art can make some modifications and retouching without departing from the spirit and scope of the present invention. The scope of protection of the invention shall be determined by the scope of the attached patent application. 12 This paper size is applicable to Chinese National Standard (CNS) M specifications (210X2.97 mm) --------- s) ^ i -----, order ------ up (read first (Read the notes on the back and fill in this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs

Claims (1)

經濟部智慧財產局員工消費合作社印製 4 4 〇 9 7 2 --—5900twf.d〇c/008 D8 - _ _ 六、申請專利範圍 1. 一種無接腳影像感應器構裝，包括： ,、一導線架，其中該導線架具有—晶片座及複數個導 腳配置於該晶片座之周緣，該導線架還包括一第一表面及 對應之一第二表面’每一該些導腳分別具有一打線部分； 一鑄模封裝材料，配置於該導線架之該第一表面， 並環繞該導線架之外緣，並塡充於該晶片座與該些導腳之 間’且暴露出該第〜袠面中之該晶片座與該些導腳之該打 線部分’該導線架與該鑄模封裝材料構成一晶片容納空 間； 一晶片’具有一主動表面及對應之—背面，旦該主 動表面配置有複數個焊墊，該晶片置於該晶片容納空間， 並以該背面配置於該晶片座之該第一表面； 複數條導線’分別電性連接該些焊墊及該些導腳之 該打線部分於該第一表面；以及 一透明上蓋，配置於該主動表面之上，以密封該晶 片容納空間。 2. 如申請專利範圍第1項所述之無接腳影像感應器 構裝，其中該第二表面中該些導腳之該打線部分及該晶片 座之周緣具有一階梯結構，使得該鑄模封裝材料包覆該第 二表面中該打線部分的部分表面及該晶片座之周緣。 3. 如申請專利範圍第1項所述之無接腳影像感應器 構裝，其中該晶片座之厚度小於該些導腳之厚度，使得該 鑄模封裝材料包覆該晶片座之該第二表面。 4. 如申請專利範圍第1項所述之無接腳影像感應器 --I-------I Γ Ϊ i 1 1 I 1--訂---------梦 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 0 9 ' 5900twf.doc/008 A8 B8 C8 D8 經濟部智慧財產局員Η消費合作社印製 六、申請專利範圍 構裝，其中該晶片座之面積小於該晶片面積。 5.如申請專利範圍第1項所述之無接脚影像感應器 構裝，其中該晶片座呈環狀結構，環繞該晶片之周圍配置。 6·如申請專利範圍第1項所述之無接卿影像感應器 構裝，其中該鑄模封裝材料包括環氧樹脂。 7. 如申請專利範圍第1項所述之無接_影像感應器 構裝，其中該透明上蓋包括一透明玻璃片配窻於該晶片容 納空間之頂端’並固定於該鑄模封裝材料上。 8. 如申請專利範圍第1項所述之無接脚影像感應器 構裝，其中該透明上蓋包括一透明塑膠片配麾於該晶片容 納空間之頂端’並固定於該鑄模封裝材料上。 9. 如申請專利範圍第1項所述之無接脚影像感應器 構裝，其中該透明上蓋係由一透明液態材料，塡充於該晶 片容納空間，而經過固化形成。 10. —種無接腳影像感應器構裝製程，包括. 提供一導線架’包括複數個構裝單元，每一構裝單 元至少具有一晶片座及複數個導腳配置於該晶片座之周 緣，該導線架還包括一第一表面及對應之一篥〜&quot; 艰〜表面，每 一該些導腳分別具有一打線部分； 進行一鑄模製程，以形成一鑄模封裝材料於氕導線 架之該第一表面，並環繞該些構裝單元之外緣，且g充於 該晶片座與該些導腳之間，且暴露出該第一表面中之該晶 片座與該些導腳之該打線部分’使得該導線架與該禱模封 裝材料於每一該些構裝單元構成一.晶片容納空間； 請 先 閲 讀 背 事 項 再 填 寫 頁 裝' 訂 綠 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） A8B8C8D8 440972 5900twf.d〇c/0Q8 六、申請專利範圍 提供複數個晶片，每一該些晶片具有一主動表面及 對應之一背面，且該主動表面配置有複數個焊墊； 進行一晶片貼附製程，將每一該些晶片分別置於對 應之該些晶片容納空間之一，並以該背面貼附於對應之該 晶片座的該第一表面； 進行一打導線製程，以複數條導線分別電性連接該 些焊墊及該些導腳之該打線部分於該第一表面； 進行一密封製程，以一透明材質分別密封該些晶片 容納空間；以及 進行一分離製程，將該些構裝單元分離。 π.如申請專利範圍第10項所述之無接腳影像感應 器構裝製程，其中該第二表面中該些導腳之該打線部分及 該晶片座之周緣具有一階梯結構，使得該鑄模封裝材料包 覆該第二表面中該打線部分的部分表面及該晶片座之周 緣。 12. 如申請專利範圍第10項所述之無接腳影像感應 器構裝製程，其中該晶片座之厚度小於該些導腳之厚度， 使得該鑄模封裝材料包覆該晶片座之該第二表面。 13. 如申請專利範圍第10項所述之無接腳影像感應 器構裝製程，其中該晶片座之面積小於該晶片面積。 14. 如申請專利範圍第10項所述之無接腳影像感應 器構裝製程，其中該晶片座呈環狀結構，環繞該晶片之周 圍配置。 15. 如申請專利範圍第H)項所述之無接腳影像感應 15 本紙張尺度適用中國®家標準（CNS&gt;A4規格（210 X 297公釐） ------------I --- (請先閱讀背面之注意事項再填寫本頁) 訂_ # 經濟部智慧財產局員工消費合作社印製 440 97 2 59〇〇twf.doc/008 A8 Βδ C8 D8 經濟部智慧財產局員工消費合作社印製 六、申請專利範圍 器構裝製程’其中該鑄模封裝材料包括環氧樹脂。 16. 如申請專利範圍第1〇項所述之無接腳影像感應 请構裝製程，其中該鑄模製程係由一上模與一下模分別夾 持該導線架之該第一表面及該第二表面，然後將該鑄模封 裝材料灌入該上模及該下模中，其中該上模至少夾持該晶 片座及該打線部分之該第一表面，且該下模夾持整個該第 —表面。 17. 如申請專利範圍第1〇項所述之無接腳影像感應 器構裝製程，其中該透明材質包括一透明玻璃片，該密封 製程係將該透明玻璃片配置於該晶片容納空間之頂端，並 固定於該鑄麵裝材料上。 而並 18. 如申請專利範圍第ίο項所述之無接腳影像感應 器樽裝製程，其中該透明材質包括一透明塑膠片，該 製程係將該透明塑膠片配置於該晶片容納空間之頂^^ 固定於該鑄模封裝材料上。 19_如申請專利範圍第10項所述之無接腳影像感應 器櫞裝製程’其中該透明材質包括一透明液態材料^， 封製程係將該透明液態材料塡充於該晶片容納空間，^經 過固化形成。 ^ 20‘如申請專利範圍第1〇項所述之無接脚影像感應 器構裝製程，其中該些構裝單元係採用矩陣方式，彼 密相鄰排列，而該分離製程係採用切割的方法， 裝單元分離。 二 21.如申請專利範圍第10項所述之無揆_影丨象 請 先 閱 讀 背 意 事 項 再 填二 寫裝 本 · 頁 訂 綠 16 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐&gt; ---- A8 B8 C8 D8 經濟部智慧財產局員工消費合作社印製 44〇972 、申請專利範圍 器構裝製程，其中該些構裝單元係採用條狀排列方式，彼 此間保留一預定間距，而該分離製程係採用沖斷的方法， 將該些構裝單元分離。 22. —種無接腳影像感應器構裝，包括： 一導線架’其中該導線架具有複數個導腳配置呈環 狀排列，該導線架還包括一第一表面及對應之一第二表 面，每一該些導腳分別具有一打線部分； 一鑄模封裝材料，配置於該導線架之該第一表面， 並環繞該導線架之外緣，並塡充於該些導腳之間，且暴露 出該第一表面中該些導腳之該打線部分，該導線架與該鑄 模封裝材料構成一晶片容納空間； 一晶片’具有一主動表面及對應之一背面，且該主 動表面配置有複數個焊墊，該晶片置於該晶片容納空間， 並以該背面貼附於該晶片容納空間底部之該鑄模封裝材 料； 複數條導線，分別電性連接該些焊墊及該些導腳之 該打線部分於該第一表面；以及 一透明上蓋，配置於該主動表面之上，以密封該晶 片容納空間。 23. 如申請專利範圍第22項所述之無接腳影像感應 器構裝，其中該第二表面中該些導腳之該打線部分之周緣 具有一階梯結構，使得該鑄模封裝材料包覆該第二表面中 該打線部分的部分表面。 24. 如申請專利範圍第22項所述之無接腳影像感應 β-0 (請先閱讀背面之注意事項再填寫本頁)Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 4 4 009 9 2 --- 5900twf.doc / 008 D8-_ _ VI. Application for patent scope 1. A non-pin image sensor structure, including:, A lead frame, wherein the lead frame has a wafer base and a plurality of guide pins arranged on the periphery of the wafer base. The lead frame further includes a first surface and a corresponding second surface. A die-casting packaging material is arranged on the first surface of the lead frame, surrounds the outer edge of the lead frame, and fills between the chip holder and the guide pins; and exposes the first ~ The wafer holder and the wire bonding portions of the guide pins in the plane 'the lead frame and the mold packaging material constitute a wafer accommodating space; a wafer' has an active surface and a corresponding-back, once the active surface is configured There are a plurality of bonding pads, the wafer is placed in the wafer accommodation space, and the back surface is arranged on the first surface of the wafer holder; a plurality of wires are electrically connected to the bonding pads and the bonding wires of the guide pins, respectively. Part of that Surface; and a transparent cover disposed over the active surface of the wafer to seal the receiving space. 2. The pinless image sensor structure described in item 1 of the scope of the patent application, wherein the wire bonding portions of the guide pins and the periphery of the chip holder in the second surface have a stepped structure, so that the mold package is packaged The material covers a part of the surface of the wired portion of the second surface and the periphery of the wafer holder. 3. The pinless image sensor structure described in item 1 of the scope of patent application, wherein the thickness of the wafer holder is smaller than the thickness of the guide pins, so that the mold packaging material covers the second surface of the wafer holder . 4. The pinless image sensor described in item 1 of the scope of patent application --I ------- I Γ Ϊ i 1 1 I 1--order --------- dream ( Please read the notes on the back before filling in this page) This paper size applies to Chinese National Standard (CNS) A4 (210 X 297 mm) 0 9 '5900twf.doc / 008 A8 B8 C8 D8 Member of the Intellectual Property Bureau of the Ministry of Economic Affairs Η Consumption Cooperative printed 6. Structure of patent application scope, wherein the area of the wafer holder is smaller than the area of the wafer. 5. The pinless image sensor structure described in item 1 of the scope of the patent application, wherein the wafer holder has a ring structure and is arranged around the periphery of the wafer. 6. The non-connected image sensor structure described in item 1 of the scope of patent application, wherein the mold packaging material includes epoxy resin. 7. The contactless_image sensor structure described in item 1 of the scope of the patent application, wherein the transparent cover includes a transparent glass sheet arranged on the top of the chip receiving space 'and fixed on the mold packaging material. 8. The pinless image sensor structure described in item 1 of the scope of the patent application, wherein the transparent cover includes a transparent plastic sheet placed on top of the chip receiving space 'and fixed on the mold packaging material. 9. The pinless image sensor structure described in item 1 of the scope of patent application, wherein the transparent upper cover is made of a transparent liquid material, filled in the wafer accommodation space, and cured. 10. —A pinless image sensor assembly process, including. Provide a lead frame 'including a plurality of assembly units, each assembly unit has at least one wafer holder and a plurality of guide pins arranged on the periphery of the wafer holder The lead frame also includes a first surface and a corresponding surface. Each of the guide pins has a wire-bonding portion. A molding process is performed to form a mold packaging material on the lead frame. The first surface surrounds the outer edges of the structural units, and g is filled between the wafer holder and the guide pins, and the wafer holder and the guide pins in the first surface are exposed. The wiring section 'makes the lead frame and the prayer mold packaging material to form a wafer holding space in each of these mounting units; please read the back matter first and then fill in the page mounting'. The green paper size applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) A8B8C8D8 440972 5900twf.d0c / 0Q8 6. The scope of patent application provides a plurality of wafers, each of which has an active surface and a corresponding one of the back, and the active meter A plurality of bonding pads are arranged; a wafer attaching process is performed, each of the wafers is placed in one of the corresponding wafer accommodation spaces, and the back surface is attached to the first surface of the corresponding wafer holder. ; Performing a dozen wire process, electrically connecting the bonding pads and the wire bonding portions of the guide pins to the first surface with a plurality of wires; performing a sealing process, respectively sealing the wafer receiving spaces with a transparent material And performing a separation process to separate the assembly units. π. The pinless image sensor assembly process described in item 10 of the scope of patent application, wherein the wire bonding portions of the guide pins in the second surface and the periphery of the wafer holder have a stepped structure, so that the mold The encapsulating material covers a part of the surface of the wire bonding portion in the second surface and a peripheral edge of the chip holder. 12. The pinless image sensor assembly process described in item 10 of the scope of patent application, wherein the thickness of the wafer holder is smaller than the thickness of the guide pins, so that the mold packaging material covers the second of the wafer holder surface. 13. The pinless image sensor assembly process described in item 10 of the scope of patent application, wherein the area of the wafer holder is smaller than the area of the wafer. 14. The pinless image sensor assembly process as described in item 10 of the scope of patent application, wherein the wafer holder has a ring structure and is arranged around the periphery of the wafer. 15. The pinless image sensor described in item H) of the scope of patent application 15 This paper size is applicable to China® Home Standard (CNS &gt; A4 specification (210 X 297 mm) ----------- -I --- (Please read the notes on the back before filling out this page) Order_ # Printed by the Employees ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 440 97 2 59〇twf.doc / 008 A8 Βδ C8 D8 Intellectual Property of the Ministry of Economic Affairs Printed by the Bureau's Consumer Cooperatives 6. The patent application scope device fabrication process' where the mold packaging material includes epoxy resin. 16. Please refer to the patent application scope of item 10 for the pinless image sensing please fabricate the fabrication process, where The casting mold is formed by an upper mold and a lower mold respectively clamping the first surface and the second surface of the lead frame, and then filling the mold packaging material into the upper mold and the lower mold, wherein the upper mold is at least Clamp the wafer holder and the first surface of the wire bonding portion, and the lower mold clamps the entire first surface. 17. The pinless image sensor construction process described in item 10 of the scope of patent application, The transparent material includes a transparent glass sheet, and the sealing system The transparent glass sheet is arranged on the top of the wafer accommodating space, and is fixed on the casting surface mounting material. And 18. The process of bottleless image sensor bottle mounting as described in the patent application No. ίο, wherein The transparent material includes a transparent plastic sheet, and the manufacturing process is to arrange the transparent plastic sheet on the top of the chip receiving space ^^ and fix the transparent plastic sheet on the mold packaging material. 19_ No pin as described in item 10 of the scope of patent application The image sensor mounting process 'wherein the transparent material includes a transparent liquid material ^, and the sealing process is to fill the transparent liquid material into the wafer receiving space, and ^ is formed by curing. ^ 20' as in the patent application scope No. 10 In the described mounting process of the non-pin image sensor, the mounting units are arranged in a matrix manner and are arranged next to each other, and the separation process uses a cutting method to separate the mounting units. Nothing mentioned in item 10 of the scope _ shadow 丨 image Please read the memorandum first and then fill in the second hardcover · Page order green 16 This paper size applies to China National Standard (CNS) A4 210 X 297 mm &gt; ---- A8 B8 C8 D8 Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 44,972, and applied for a patent scope device assembly process, in which these assembly units are arranged in strips, A predetermined distance is kept from each other, and the separation process uses a punching method to separate the assembly units. 22. —A pinless image sensor assembly including: a lead frame, wherein the lead frame has A plurality of guide pins are arranged in a ring arrangement. The lead frame further includes a first surface and a corresponding second surface, and each of the guide pins has a wire-bonding portion; a mold packaging material is arranged on the lead frame. The first surface surrounds the outer edge of the lead frame, fills between the guide pins, and exposes the wired portions of the guide pins in the first surface. The lead frame and the mold packaging material A wafer accommodating space is formed; a wafer 'has an active surface and a corresponding back surface, and the active surface is provided with a plurality of solder pads, the wafer is placed in the wafer accommodating space, and the wafer is attached to the crystal with the back surface The mold packaging material at the bottom of the sheet accommodating space; a plurality of wires, respectively, electrically connecting the solder pads and the wire bonding portions of the guide pins to the first surface; and a transparent cover disposed on the active surface To seal the wafer receiving space. 23. The pinless image sensor structure according to item 22 of the scope of patent application, wherein the periphery of the wire-bonding portion of the guide pins in the second surface has a stepped structure, so that the mold packaging material covers the A part of the surface of the wired portion of the second surface. 24. Pinless image sensor β-0 as described in item 22 of the scope of patent application (please read the precautions on the back before filling this page) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐〉 440972 _5900twf.dnr/nnp Αδ Β8 C8 D8 六、申請專利範圍 器構裝’其中該鑄模封裝材料包括環氧樹脂。 25. 如申請專利範圍第22項所述之無接腳影像感應 器構裝’其中該透明上蓋包括一透明玻璃片配置於該晶片 容納空間之頂端，並固定於該鑄模封裝材料上。 26. 如申請專利範圍第22項所述之無接腳影像感應 器構裝，其中該透明上蓋包括一透明塑膠片配置於該晶片 容納空間之頂端，並固定於該鑄模封裝材料上。 27. 如申請專利範圍第22項所述之無接腳影像感應 器構裝，其中該透明上蓋係由一透明液態材料，塡充於該 晶片容納空間，而經過固化形成。 28. —種無接腳影像感應器構裝製程，包括： 提供一導線架，包括複數個構裝單元，每一構裝單 元至少具有複數個導腳配置呈環狀排列，該導線架還包括 一第一表面及對應之一第二表面’每一該些導腳分別具有 一打線部分； 經濟部智慧財產局員工消費合作社印製 進行一鑄模製程，以形成一鑄模封裝材料於該導線 架之該第一表面，並環繞該些構裝單兀之外緣，且塡充於 該些導腳之間’且暴露出該第一表面中之該些導腳之該打 線部分，使得該導線架與該鑄模封裝材料於每一該些構裝 單元構成一晶片容納空間； 提供複數個晶片，每一該些晶片具有一主動表面及 對應之一背面，且該主動表面配置有複數個焊墊； 進行一晶片貼附製程，將每—該些晶片分別置於對 應之該些晶片容納空間之一’並以該背面貼附於對應之該 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） A8 B8 CS m ^-0972 5900twf,doc/0Q8 六、申請專利範圍 晶片容納空間的底部； 進行一打導線製程，以複數條導線分別電性連接該 些焊墊及該些導腳之該打線部分於該第一表面； 進行一密封製程，以一透明材質分別密封該些晶片 容納空間；以及 進行一分離製程，將該些構裝單元分離。 29_如申請專利範圍第28項所述之無接腳影像感應 器構裝製程，其中該第二表面中該些導腳之該打線部分具 有一階梯結構，使得該鑄模封裝材料包覆該第二表面中該 打線部分的部分表面。 3〇.如申請專利範圍第28項所述之無接腳影像感應 器構裝製程’其中該鑄模封裝材料包括環氧樹脂。 31. 如申請專利範圍第28項所述之無接腳影像感應 器構裝製程’其中該鑄模製程係由一上模與一下模分別夾 持該導線架之該第一表面及該第二表面，然後將該鑄模封 裝材料灌入該上模及該下模中，其中該上模至少夾持該打 線部分之該第一表面，且該下模夾持整個該第二表面。 32. 如申請專利範圍第28項所述之無接腳影像感應 器構裝製程，其中該透明材質包括一透明玻璃片，該密封 製程係將該透明玻璃片配置於該晶片容納空間之頂端，並 固定於該鑄模封裝材料上。 33. 如申請專利範圍第28項所述之無接腳影像感應 器構裝製程，其中該透明材質包括一透明塑膠片，該密封 製程係將該透明塑膠片配置於該晶片容納空間之頂端，並 本紙張尺度適用中國國家標準（CNS)A4規格（21〇 χ 297公楚 ------------裝--------訂---------綠 (請先閱讀背面之注意事項再填寫本買) 經濟部智慧財產局員Η消費合作社印製 440 97 2 AS B8 C8 5900twf.doc/008 D8 t、申請專利範圍 固定於該鑄模封裝材料上。 34. 如申請專利範圍第28項所述之無接腳影像感應 器構裝製程，其中該透明材質包括一透明液態材料，該密 封製程係將該透明液態材料塡充於該晶片容納空間，並經 過固化形成。 35. 如申請專利範圍第28項所述之無接腳影像感應 器構裝製程，其中該些構裝單元係採用矩陣方式，彼此緊 密相鄰排列，而該分離製程係採用切割的方法，將該些構 裝單元分離。 36. 如申請專利範圍第28項所述之無接腳影像感應 器構裝製程，其中該些構裝單元係採用條狀排列方式，彼 此間保留一預定間距，而該分離製程係採用沖斷的方法， 將該些構裝單元分離。 -------------裝.-------訂---------絲 (請先閱讀背面之注意事項再填寫本頁)This paper size applies to China National Standard (CNS) A4 specification (210 X 297 mm) 440972 _5900twf.dnr / nnp Αδ Β8 C8 D8 VI. Patent application device structure 'where the mold packaging material includes epoxy resin. 25. The pinless image sensor structure described in item 22 of the scope of application for patent, wherein the transparent cover includes a transparent glass sheet disposed on the top of the chip receiving space and fixed on the mold packaging material. The pinless image sensor structure described in item 22 of the patent scope, wherein the transparent upper cover includes a transparent plastic sheet disposed on the top of the chip receiving space and fixed on the mold packaging material. The pinless image sensor structure described in item 22, wherein the transparent upper cover is made of a transparent liquid material, filled in the chip receiving space, and solidified. 28. —A pinless image sensor structure The assembly process includes: providing a lead frame, including a plurality of structural units, each structural unit having at least a plurality of guide pins configured in a circular arrangement, the lead frame Including a first surface and a corresponding one of the second surfaces, each of the guide pins has a wire portion respectively; the consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs prints a molding process to form a mold packaging material on the lead frame The first surface, and surrounds the outer edges of the structured units, and fills between the guide pins, and exposes the wired portions of the guide pins in the first surface, so that the wire The rack and the mold packaging material constitute a wafer receiving space in each of the mounting units; a plurality of wafers are provided, each of the wafers has an active surface and a corresponding back surface, and the active surface is provided with a plurality of solder pads Carry out a wafer attaching process, placing each of the wafers in one of the corresponding wafer accommodating spaces', and attaching the back to the corresponding paper size applicable to the Chinese National Standard (CNS) A4 specification ( 210 X 297 mm) A8 B8 CS m ^ -0972 5900twf, doc / 0Q8 VI. The bottom of the patent-receiving space for the patent application; Conduct a dozen wire process, using a plurality of wires to electrically The wire bonding portions connected to the bonding pads and the guide pins are on the first surface; a sealing process is performed to respectively seal the wafer receiving spaces with a transparent material; and a separation process is performed to separate the assembly units 29_ The pinless image sensor assembly process described in item 28 of the scope of patent application, wherein the wire bonding portions of the guide pins in the second surface have a stepped structure, so that the mold packaging material covers the A part of the surface of the wired part in the second surface. 30. The pinless image sensor construction process described in item 28 of the scope of patent application, wherein the mold packaging material includes epoxy resin. 31. If the scope of patent application is The pinless image sensor assembly process described in item 28, wherein the casting process is an upper mold and a lower mold respectively clamping the first surface and the second surface of the lead frame, and then packaging the mold. Material is poured into the upper mold and the lower mold, wherein the upper mold holds at least the first surface of the wire-bonding portion, and the lower mold holds the entire second surface. 32. The pinless image sensor assembly process as described in item 28 of the scope of patent application, wherein the transparent material includes a transparent glass sheet, and the sealing process is to arrange the transparent glass sheet on the top of the chip accommodation space, And fixed on the mold packaging material. 33. The pinless image sensor assembly process described in item 28 of the scope of the patent application, wherein the transparent material includes a transparent plastic sheet, and the sealing process is to arrange the transparent plastic sheet on the top of the chip accommodation space, And this paper size is applicable to China National Standard (CNS) A4 specification (21〇χ297297) ------------ installation -------- order -------- -Green (Please read the precautions on the back before filling in this purchase) Printed by 440 97 2 AS B8 C8 5900twf.doc / 008 D8, a member of the Intellectual Property Bureau of the Ministry of Economic Affairs and Consumer Cooperatives. The scope of patent application is fixed on the mold packaging material. 34. The pinless image sensor assembly process as described in item 28 of the scope of the patent application, wherein the transparent material includes a transparent liquid material, and the sealing process is to fill the transparent liquid material into the chip accommodation space, and Formed after curing. 35. The pinless image sensor assembly process described in item 28 of the scope of the patent application, wherein the assembly units are arranged in a matrix manner next to each other, and the separation process is cut Method, put these construction orders 36. The pinless image sensor assembly process described in item 28 of the scope of the patent application, wherein the assembly units are arranged in a stripe arrangement with a predetermined distance between each other, and the separation process uses The method of punching is to separate these structural units. ------------- Installation .--------- Order --------- Silk (Please read first (Notes on the back then fill out this page) 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper is sized to the Chinese National Standard (CNS) A4 (210 X 297 mm)
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI825546B (en) * 2022-01-03 2023-12-11 美商矽成積體電路股份有限公司 Package structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI825546B (en) * 2022-01-03 2023-12-11 美商矽成積體電路股份有限公司 Package structure

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