JP5492875B2 - 静電チャック - Google Patents

静電チャック Download PDF

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Publication number
JP5492875B2
JP5492875B2 JP2011510500A JP2011510500A JP5492875B2 JP 5492875 B2 JP5492875 B2 JP 5492875B2 JP 2011510500 A JP2011510500 A JP 2011510500A JP 2011510500 A JP2011510500 A JP 2011510500A JP 5492875 B2 JP5492875 B2 JP 5492875B2
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Japan
Prior art keywords
electrostatic chuck
substrate
protrusion
group
layer
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JP2011510500A
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Japanese (ja)
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JP2011521470A5 (https=
JP2011521470A (ja
Inventor
クツク，リチヤード・エイ
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Entegris Inc
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Entegris Inc
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Publication of JP2011521470A5 publication Critical patent/JP2011521470A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7614—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
JP2011510500A 2008-05-19 2009-05-15 静電チャック Active JP5492875B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US5425908P 2008-05-19 2008-05-19
US61/054,259 2008-05-19
US9470008P 2008-09-05 2008-09-05
US61/094,700 2008-09-05
PCT/US2009/003015 WO2009142710A1 (en) 2008-05-19 2009-05-15 Electrostatic chuck

Publications (3)

Publication Number Publication Date
JP2011521470A JP2011521470A (ja) 2011-07-21
JP2011521470A5 JP2011521470A5 (https=) 2012-05-24
JP5492875B2 true JP5492875B2 (ja) 2014-05-14

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ID=40810870

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011510500A Active JP5492875B2 (ja) 2008-05-19 2009-05-15 静電チャック

Country Status (8)

Country Link
US (2) US9543187B2 (https=)
EP (1) EP2286448B1 (https=)
JP (1) JP5492875B2 (https=)
KR (1) KR101673039B1 (https=)
CN (2) CN103236413B (https=)
SG (1) SG190668A1 (https=)
TW (1) TWI475594B (https=)
WO (1) WO2009142710A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
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KR20240154615A (ko) * 2022-02-28 2024-10-25 엔테그리스, 아이엔씨. 전하 소산 구조를 갖는 정전 척

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KR20240154615A (ko) * 2022-02-28 2024-10-25 엔테그리스, 아이엔씨. 전하 소산 구조를 갖는 정전 척
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US9543187B2 (en) 2017-01-10
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KR20110020269A (ko) 2011-03-02
CN102067302A (zh) 2011-05-18
KR101673039B1 (ko) 2016-11-04
JP2011521470A (ja) 2011-07-21
TW200949897A (en) 2009-12-01
US20090284894A1 (en) 2009-11-19
TWI475594B (zh) 2015-03-01
CN103236413A (zh) 2013-08-07
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US20170098568A1 (en) 2017-04-06
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CN102067302B (zh) 2013-06-05
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