JP7430489B2 - 静電チャック、静電チャック装置 - Google Patents
静電チャック、静電チャック装置 Download PDFInfo
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- JP7430489B2 JP7430489B2 JP2019005052A JP2019005052A JP7430489B2 JP 7430489 B2 JP7430489 B2 JP 7430489B2 JP 2019005052 A JP2019005052 A JP 2019005052A JP 2019005052 A JP2019005052 A JP 2019005052A JP 7430489 B2 JP7430489 B2 JP 7430489B2
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- 239000000758 substrate Substances 0.000 claims description 64
- 238000001179 sorption measurement Methods 0.000 claims description 36
- 239000000463 material Substances 0.000 claims description 22
- 229910052594 sapphire Inorganic materials 0.000 claims description 21
- 239000010980 sapphire Substances 0.000 claims description 21
- 239000007767 bonding agent Substances 0.000 claims description 17
- 239000000919 ceramic Substances 0.000 claims description 13
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 11
- 239000004020 conductor Substances 0.000 claims description 11
- 230000003746 surface roughness Effects 0.000 claims description 10
- 239000003507 refrigerant Substances 0.000 claims description 5
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 claims description 5
- 239000002131 composite material Substances 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 4
- 230000005496 eutectics Effects 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 13
- 238000004519 manufacturing process Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000000428 dust Substances 0.000 description 5
- 238000010304 firing Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 238000000605 extraction Methods 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- 239000002826 coolant Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- UZLYXNNZYFBAQO-UHFFFAOYSA-N oxygen(2-);ytterbium(3+) Chemical compound [O-2].[O-2].[O-2].[Yb+3].[Yb+3] UZLYXNNZYFBAQO-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
Description
上記の静電チャックにおいて、前記誘電板の上面の表面粗さは、表面粗さRaで0.05μm以下であることが好ましい。
本開示の静電チャック装置は、上記の静電チャックと、前記静電チャックを冷却する冷媒が流れる流路を有する支持台と、前記静電チャックを前記支持台に接合する接合剤と、を有する。
なお、添付図面は、理解を容易にするために構成要素を拡大して示している場合がある。構成要素の寸法比率は実際のものと、または別の図面中のものと異なる場合がある。また、断面図では、理解を容易にするために、一部の構成要素のハッチングを省略している場合がある。
静電チャック20は、誘電板21と、吸着電極22と、絶縁層23と、ベース板24とを含む。
なお、説明の便宜上、最終的に静電チャック20の各構成要素となる部材については、最終的な構成要素の符号を付して説明する。
図6に示すように、Al2O3の基板24を所定の形状に機械加工する。所望の形状としては、例えば貫通孔24xを有する円形板状である。
図10に示すように、基板21,24と、基板21,24に挟まれた導電ペースト22及び絶縁ペースト23を、焼成炉にて熱処理を行う。焼成炉としては、加圧焼結装置(ホットプレス)、放電プラズマ焼結炉、等を用いることができる。焼成条件として、プレス圧は例えば10MPaであり、焼成温度は例えば1700℃であり、焼成時間は例えば2時間である。
次に、静電チャック20を、図1に示す接合剤30を介して支持台40に接合する。これにより、静電チャック20と支持台40を有する静電チャック装置10が形成される。
上記のように構成した静電チャック装置10において、静電チャック20にワーク基板Wを吸着固定する。この状態で、環境温度を所定範囲で変化させる。環境温度の範囲としては、例えば、-200℃から200℃までとする。
図4は、比較例の静電チャック装置100を示す。なお、説明の便宜上、この比較例の静電チャック装置100の構成部材について、上記した本実施形態の静電チャック装置100と同様の構成部材には同じ符号を付す。
(1)静電チャック20は、ワーク基板Wが載置される誘電板21と、誘電板21を支持するベース板24と、誘電板21とベース板24との間に配設され、ワーク基板Wを吸着する静電気力を生じさせるための吸着電極22と、を備える。誘電板21はサファイア基板であり、ベース板24はアルミナセラミックスである。吸着電極22は、-200℃以上、400℃以下の範囲において抵抗変化率が20%以下である。そして、誘電板21とベース板24とが吸着電極22を介して一体接合されている。サファイア基板は、酸化アルミニウム(Al2O3)の単結晶材料であり、粒界がなく、耐プラズマ性にすぐれている。そして、静電チャック20に接合剤が用いられていないため、発塵や放電の発生を抑制できる。
尚、上記各実施形態は、以下の態様で実施してもよい。
・上記実施形態に対し、静電チャック20を支持台40に直接接合してもよい。
・上記実施形態に対し、静電チャック20にヒータが埋め込まれても良い。なお、ヒータは、支持台40に埋め込まれもよい。
・以上の説明は本発明の技術思想を例示的に説明したものに過ぎず、当業者であれば、本発明の本質から逸脱しない範囲で多様な修正及び変形が可能である。したがって、開示した実施形態は本発明の技術思想を限定するためのものでなく、単に説明するためのものであり、このような実施形態によって本発明の技術思想の範囲は限定されない。本発明の保護範囲は特許請求の範囲によって解釈しなければならず、それと同等な範囲内にある全て技術思想は本発明の権利範囲に含まれる。
Claims (8)
- 静電気力によってワーク基板を固定する静電チャックであって、
前記ワーク基板が載置される誘電板と、
前記誘電板を支持するベース板と、
前記誘電板と前記ベース板との間に配設され前記ワーク基板を吸着する静電気力を生じさせるための吸着電極と、
を備え、
前記誘電板はサファイア基板であり、
前記ベース板はアルミナセラミックスであり、
前記誘電板と前記ベース板とが前記吸着電極を介して一体接合されており、
前記吸着電極は、アルミナセラミックス、導電材料及び酸化物系共晶点材料からなる複合セラミックスであり、
前記誘電板及び前記ベース板は、前記吸着電極と再焼結しており、
前記吸着電極は、-200℃以上、400℃以下の範囲において抵抗変化率が20%以下であり、
前記導電材料は、アルミナチタンカーバイト材からなる、
静電チャック。 - 前記ベース板は、厚さ方向に貫通する貫通孔と、前記貫通孔に配設されて前記吸着電極に電気的に接続される給電電極とを有し、
前記給電電極は、前記吸着電極と同じ材料にて形成されている、
請求項1に記載の静電チャック。 - 前記誘電板、前記吸着電極、及び前記ベース板の線熱膨張率は8.0×10-6/K以下である、請求項1または請求項2に記載の静電チャック。
- 前記誘電板の上面の表面粗さは、表面粗さRaで0.05μm以下である、請求項1~請求項3のいずれか一項に記載の静電チャック。
- 前記誘電板は、上面から突出する凸部を有し、前記凸部の直径は0.3mm以上、3.0mm以下であり、前記凸部の高さは0.05mm以下であり、前記凸部の上面端部は前記凸部の側面にかけて湾曲した稜線部であり、前記稜線部の半径は0.03mm以下である、請求項1~請求項3のいずれか一項に記載の静電チャック。
- 前記誘電板の上面の表面粗さは、表面粗さRaで0.3μm以下である、請求項5に記載の静電チャック。
- 請求項1~請求項6のいずれか一項に記載の静電チャックと、
前記静電チャックを冷却する冷媒が流れる流路を有する支持台と、
前記静電チャックを前記支持台に接合する接合剤と、
を有する静電チャック装置。 - 請求項1~請求項6のいずれか一項に記載の静電チャックと、
前記静電チャックを冷却する冷媒が流れる流路を有する支持台と、
を備え、
前記静電チャックは、前記支持台と直接接合されている、
静電チャック装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019005052A JP7430489B2 (ja) | 2019-01-16 | 2019-01-16 | 静電チャック、静電チャック装置 |
KR1020190066936A KR102257529B1 (ko) | 2019-01-16 | 2019-06-05 | 정전 척 및 정전 척 장치 |
US16/741,178 US11367646B2 (en) | 2019-01-16 | 2020-01-13 | Electrostatic chuck and electrostatic chuck apparatus including the same |
CN202010041910.XA CN111446197B (zh) | 2019-01-16 | 2020-01-15 | 静电吸盘和包括其的静电吸盘装置 |
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JP2019005052A JP7430489B2 (ja) | 2019-01-16 | 2019-01-16 | 静電チャック、静電チャック装置 |
Publications (3)
Publication Number | Publication Date |
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JP2020113692A JP2020113692A (ja) | 2020-07-27 |
JP2020113692A5 JP2020113692A5 (ja) | 2022-01-20 |
JP7430489B2 true JP7430489B2 (ja) | 2024-02-13 |
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JP2002170871A (ja) | 2000-12-04 | 2002-06-14 | Kyocera Corp | 静電チャック |
JP2005524247A (ja) | 2002-05-01 | 2005-08-11 | トレック・インコーポレーテッド | 静電ウェハクランプ装置のための進歩したプラテン |
JP2009272646A (ja) | 2007-09-11 | 2009-11-19 | Canon Anelva Corp | スパッタリング装置 |
JP2014198662A (ja) | 2013-03-15 | 2014-10-23 | 日本碍子株式会社 | 緻密質複合材料、その製法及び半導体製造装置用部材 |
JP6291175B2 (ja) | 2013-07-05 | 2018-03-14 | 株式会社リケン | バルブシート及びその製造方法 |
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JP2017206436A (ja) | 2016-01-27 | 2017-11-24 | 住友大阪セメント株式会社 | セラミックス材料、静電チャック装置 |
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JP2020113692A (ja) | 2020-07-27 |
CN111446197B (zh) | 2023-07-07 |
KR20200089584A (ko) | 2020-07-27 |
CN111446197A (zh) | 2020-07-24 |
KR102257529B1 (ko) | 2021-06-01 |
US11367646B2 (en) | 2022-06-21 |
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