JP4707593B2 - 熱処理装置と基板吸着方法 - Google Patents
熱処理装置と基板吸着方法 Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
- B25B11/005—Vacuum work holders
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
- H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
- H01L21/477—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
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- H—ELECTRICITY
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
Description
基板と当接する凸部も熱処理プレートと同様に金属であるので、基板へ与えられる熱は主に凸部を介して伝達される。よって、基板面内において凸部の接触部分と非接触部分とで熱履歴が大きく異なるという不都合がある。このような不都合については、先行特許出願(特許願2005−353432)に係る先行発明によって解消が図られている。
すなわち、請求項1に記載の発明は、基板に対して熱処理を行う熱処理装置において、熱処理プレートと、前記熱処理プレートの上面に設けられ、基板を当接支持する凸部が形成されたシート状物と、基板と前記シート状物との間に形成される空間の側方を閉塞する閉塞手段と、前記空間の気体を排出するための排出孔と、前記熱処理プレートに形成され、シート状物を吸引するための吸引孔と、を備えていることを特徴とするものである。
図1は、実施例に係る熱処理装置の概略構成を示す縦断面図であり、図2は、熱処理プレートの平面図である。
制御部61が昇降機構を操作することで、昇降ピン53は図示しない搬送手段から基板Wを受け取る。そして、支持シート11に基板Wを載置する。基板Wは、凸部13とシール部15とに当接支持される。基板Wと支持シート11との間には、気密な微小空間msが形成される。
制御部61は圧力計37の計測結果を参照しつつ開閉弁35を開放させて、微小空間msの圧力を所定の処理圧力Pms(負圧)に制御する。これにより、微小空間msの気体は、排出孔21から排出され、溝部25の気体もプレート孔21pから排出される。
基板Wを吸着すると、予め決められた時間だけこの状態を保持することで、基板Wに対して所定の熱処理を行う。
所定の熱処理を終えると、制御部61は、開閉弁35を閉止するとともに、開閉弁47を開放する。窒素ガスは供給孔41を通じて微小空間msに供給される。このとき、溝部25には窒素ガスが微小空間msから流入するので、溝部25の圧力が微小空間msの圧力より高くなることはない。これにより、基板Wの吸着を解除する。
基板Wの吸着が解除されると、制御部61が図示省略の昇降機構を操作することによって、昇降ピン53が基板Wを上方に持ち上げる。そして、図示しない搬送機構に基板Wを受け渡す。
図6は、実施例2に係る熱処理装置の熱処理プレートの平面図である。なお、実施例2の概略構成は実施例1と同様であるので図示を省略する。また、図6に示す平面図において実施例1と同じ構成については同符号を付すことで詳細な説明を省略する。
図7は、実施例3に係る熱処理装置の概略構成を示す縦断面図である。なお、実施例1と同じ構成については同符号を付すことで詳細な説明を省略する。
図8は、実施例4に係る熱処理装置の概略構成を示す縦断面図である。なお、実施例1と同じ構成については同符号を付すことで詳細な説明を省略する。
11 …支持シート
13 …凸部
15 …シール部
21 …排出孔
21p …プレート孔
21s …シート孔
25、26、27 …溝部
41 …供給孔
61 …制御部
71、72 …吸引孔
W …基板
ms …微小空間
Claims (8)
- 基板に対して熱処理を行う熱処理装置において、
熱処理プレートと、
前記熱処理プレートの上面に設けられ、基板を当接支持する凸部が形成されたシート状物と、
基板と前記シート状物との間に形成される空間の側方を閉塞する閉塞手段と、
前記空間の気体を排出するための排出孔と、
前記熱処理プレートに形成され、シート状物を吸引するための吸引孔と、
を備えていることを特徴とする熱処理装置。 - 請求項1に記載の熱処理装置において、
さらに、前記熱処理プレートの上面に形成され、前記吸引孔に連通する溝部を備えることを特徴とする熱処理装置。 - 請求項1に記載の熱処理装置において、
さらに、前記熱処理プレートの上面に形成され、前記排出孔に連通する溝部を備え、
前記排出孔は前記吸引孔を兼ねることを特徴とする熱処理装置。 - 請求項2または請求項3に記載の熱処理装置において、
前記溝部の底部から前記熱処理プレートの上面までの高さは、前記凸部の高さより高いことを特徴とする熱処理装置。 - 請求項2から請求項4のいずれかに記載の熱処理装置において、
前記溝部は、前記熱処理プレートの周縁側と中央とにわたって形成されていることを特徴とする熱処理装置。 - 請求項1から請求項5のいずれかに記載の熱処理装置において、
前記排出孔は、前記熱処理プレートに形成されるプレート孔と、前記シート状物に形成され、前記プレート孔に連通するシート孔と、を有し、前記シート孔は前記熱処理プレートの周縁側に設けられていることを特徴とする熱処理装置。 - 凸部が形成されたシート状物を熱処理プレートの上面に設けて、前記凸部に当接支持される基板を吸着する基板吸着方法において、
基板と前記シート状物との間に形成される空間を第1空間とし、前記シート状物と前記熱処理プレートとの間に形成される空間を第2空間として、前記第2空間の圧力を前記第1空間の圧力以下に保ちつつ、前記第1空間および前記第2空間の気体をそれぞれ排出することを特徴とする基板吸着方法。 - 請求項7に記載の基板吸着方法において、
排出時に前記第2空間内に生じる気体の流れに対する流動抵抗は、前記第1空間内に比べて小さいことを特徴とする基板吸着方法。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006080863A JP4781867B2 (ja) | 2006-03-23 | 2006-03-23 | 熱処理装置 |
JP2006080864A JP4827569B2 (ja) | 2006-03-23 | 2006-03-23 | 基板支持構造とこれを用いた熱処理装置と基板支持構造に用いられるシート状物と基板支持構造の製造方法 |
JP2006080865A JP4707593B2 (ja) | 2006-03-23 | 2006-03-23 | 熱処理装置と基板吸着方法 |
TW096108433A TWI360858B (en) | 2006-03-23 | 2007-03-12 | Substrate support structure, heat treatment appara |
TW100135471A TWI453861B (zh) | 2006-03-23 | 2007-03-12 | 熱處理裝置及基板吸附方法 |
US11/688,006 US7927096B2 (en) | 2006-03-23 | 2007-03-19 | Substrate support structure, heat treatment apparatus using same, first sheet-like object for use in the substrate support structure, method of manufacturing the substrate support structure, heat treatment apparatus, and substrate sucking method |
KR1020070027648A KR100831446B1 (ko) | 2006-03-23 | 2007-03-21 | 기판지지구조와, 이것을 사용한 열처리장치와,기판지지구조에 사용되는 제1시트형상물과, 기판지지구조의제조방법과, 열처리장치와, 기판흡착방법 |
CN2007100918085A CN101043018B (zh) | 2006-03-23 | 2007-03-23 | 基板支撑结构及其制造方法、热处理装置及基板吸附方法 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006080863A JP4781867B2 (ja) | 2006-03-23 | 2006-03-23 | 熱処理装置 |
JP2006080864A JP4827569B2 (ja) | 2006-03-23 | 2006-03-23 | 基板支持構造とこれを用いた熱処理装置と基板支持構造に用いられるシート状物と基板支持構造の製造方法 |
JP2006080865A JP4707593B2 (ja) | 2006-03-23 | 2006-03-23 | 熱処理装置と基板吸着方法 |
Publications (2)
Publication Number | Publication Date |
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JP2007258443A JP2007258443A (ja) | 2007-10-04 |
JP4707593B2 true JP4707593B2 (ja) | 2011-06-22 |
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JP2006080864A Active JP4827569B2 (ja) | 2006-03-23 | 2006-03-23 | 基板支持構造とこれを用いた熱処理装置と基板支持構造に用いられるシート状物と基板支持構造の製造方法 |
JP2006080865A Active JP4707593B2 (ja) | 2006-03-23 | 2006-03-23 | 熱処理装置と基板吸着方法 |
JP2006080863A Active JP4781867B2 (ja) | 2006-03-23 | 2006-03-23 | 熱処理装置 |
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JP2006080863A Active JP4781867B2 (ja) | 2006-03-23 | 2006-03-23 | 熱処理装置 |
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US (1) | US7927096B2 (ja) |
JP (3) | JP4827569B2 (ja) |
KR (1) | KR100831446B1 (ja) |
CN (1) | CN101043018B (ja) |
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