JP6510461B2 - 基板保持装置 - Google Patents
基板保持装置 Download PDFInfo
- Publication number
- JP6510461B2 JP6510461B2 JP2016104660A JP2016104660A JP6510461B2 JP 6510461 B2 JP6510461 B2 JP 6510461B2 JP 2016104660 A JP2016104660 A JP 2016104660A JP 2016104660 A JP2016104660 A JP 2016104660A JP 6510461 B2 JP6510461 B2 JP 6510461B2
- Authority
- JP
- Japan
- Prior art keywords
- convex portion
- base
- groove
- substrate holding
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 title claims description 49
- 238000004891 communication Methods 0.000 description 3
- 238000005422 blasting Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000009751 slip forming Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
Description
本発明の第1の実施形態に係る基板保持装置100について図1及び図2を参照して、説明する。
本発明の第2の実施形態に係る基板保持装置100Aについて図3及び図4を参照して、説明する。基板保持装置100Aは、上述した基板保持装置100と類似するので、相違点についてのみ説明する。
Claims (3)
- 上面に開口する1又は複数の通気孔が形成された平板状の基体に、前記基体の上面から上方に向って突出する複数の上面凸部が形成された基板保持装置であって、
下面に開口し前記通気孔と連通する溝が前記基体に形成されており、前記溝に下方に突出する複数の第1の下面凸部が形成されていることを特徴とする基板保持装置。 - 前記溝を環状に取り囲む第1の下面環状凸部、及び前記第1の下面環状凸部を環状に取り囲む第2の下面環状凸部が前記基体の下面から下方に突出して形成されており、
前記第1の下面環状凸部と前記第2の下面環状凸部の間に、前記基体の下面から下方に向って突出する第2の下面凸部が形成されていることを特徴とする請求項1に記載の基板保持装置。 - 前記第1の下面凸部の下端面及び前記第2の下面凸部の下端面は、ほぼ同一平面上に位置し、且つ、前記第1の下面環状凸部の下端面及び前記第2の下面環状凸部の下端面は前記第1及び第2の下面凸部と比較して1μm以上5μm以下低く位置していることを特徴とする請求項2に記載の基板保持装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016104660A JP6510461B2 (ja) | 2016-05-25 | 2016-05-25 | 基板保持装置 |
KR1020170062501A KR102104300B1 (ko) | 2016-05-25 | 2017-05-19 | 기판유지장치 |
TW106116816A TWI690017B (zh) | 2016-05-25 | 2017-05-22 | 基板保持裝置 |
US15/600,867 US10770334B2 (en) | 2016-05-25 | 2017-05-22 | Substrate holding device |
CN201710379326.3A CN107452665B (zh) | 2016-05-25 | 2017-05-25 | 基板保持装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016104660A JP6510461B2 (ja) | 2016-05-25 | 2016-05-25 | 基板保持装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017212343A JP2017212343A (ja) | 2017-11-30 |
JP6510461B2 true JP6510461B2 (ja) | 2019-05-08 |
Family
ID=60418222
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016104660A Active JP6510461B2 (ja) | 2016-05-25 | 2016-05-25 | 基板保持装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10770334B2 (ja) |
JP (1) | JP6510461B2 (ja) |
KR (1) | KR102104300B1 (ja) |
CN (1) | CN107452665B (ja) |
TW (1) | TWI690017B (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102456532B1 (ko) * | 2017-11-20 | 2022-10-18 | 에이에스엠엘 네델란즈 비.브이. | 기판 홀더, 기판 지지체, 및 기판을 클램핑 시스템에 클램핑시키는 방법 |
JP2020021922A (ja) * | 2018-07-24 | 2020-02-06 | 住友電気工業株式会社 | 基板加熱ユニットおよび表面板 |
JP7178831B2 (ja) * | 2018-08-30 | 2022-11-28 | 日本特殊陶業株式会社 | 基板保持部材 |
JP7260984B2 (ja) * | 2018-09-21 | 2023-04-19 | 日本特殊陶業株式会社 | 基板保持部材 |
JP7125326B2 (ja) * | 2018-10-25 | 2022-08-24 | 日本特殊陶業株式会社 | 基板保持部材 |
JP7190326B2 (ja) * | 2018-10-29 | 2022-12-15 | 日本特殊陶業株式会社 | 基板保持部材 |
Family Cites Families (57)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4333065A (en) | 1980-10-09 | 1982-06-01 | Zenith Radio Corporation | Low reflectivity apodized surface acoustic transducer with means to prevent wavefront distortion |
JPS5943539A (ja) * | 1982-09-03 | 1984-03-10 | Hitachi Ltd | 真空吸着台 |
US5088006A (en) * | 1991-04-25 | 1992-02-11 | International Business Machines Corporation | Liquid film interface cooling system for semiconductor wafer processing |
US5155652A (en) * | 1991-05-02 | 1992-10-13 | International Business Machines Corporation | Temperature cycling ceramic electrostatic chuck |
JPH0521584A (ja) * | 1991-07-16 | 1993-01-29 | Nikon Corp | 保持装置 |
JPH0851143A (ja) * | 1992-07-20 | 1996-02-20 | Nikon Corp | 基板保持装置 |
JPH06196381A (ja) * | 1992-12-22 | 1994-07-15 | Canon Inc | 基板保持装置 |
US5730803A (en) * | 1996-02-23 | 1998-03-24 | Applied Materials, Inc. | Apparatus and method for transferring heat from a hot electrostatic chuck to an underlying cold body |
JPH1072249A (ja) * | 1996-05-23 | 1998-03-17 | Ngk Spark Plug Co Ltd | アルミナ系セラミック焼結体及びアルミナ系セラミック部品 |
JPH10242255A (ja) * | 1997-02-28 | 1998-09-11 | Kyocera Corp | 真空吸着装置 |
JPH11163109A (ja) * | 1997-12-01 | 1999-06-18 | Kyocera Corp | ウエハ保持装置 |
US6073681A (en) * | 1997-12-31 | 2000-06-13 | Temptronic Corporation | Workpiece chuck |
US6257564B1 (en) * | 1998-05-15 | 2001-07-10 | Applied Materials, Inc | Vacuum chuck having vacuum-nipples wafer support |
US6164633A (en) * | 1999-05-18 | 2000-12-26 | International Business Machines Corporation | Multiple size wafer vacuum chuck |
US6464795B1 (en) * | 1999-05-21 | 2002-10-15 | Applied Materials, Inc. | Substrate support member for a processing chamber |
JP3805134B2 (ja) * | 1999-05-25 | 2006-08-02 | 東陶機器株式会社 | 絶縁性基板吸着用静電チャック |
US6468098B1 (en) * | 1999-08-17 | 2002-10-22 | Formfactor, Inc. | Electrical contactor especially wafer level contactor using fluid pressure |
TW473792B (en) * | 2000-01-20 | 2002-01-21 | Ngk Insulators Ltd | Electrostatic chuck |
DE60125935T2 (de) * | 2000-01-28 | 2007-08-02 | Hitachi Tokyo Electronics Co. Ltd., Ome | Wafer-spannfutter, belichtungssystem und verfahren zur herstellung eines halbleiterbauelements |
WO2001078455A1 (fr) * | 2000-04-10 | 2001-10-18 | Ibiden Co., Ltd. | Plaque ceramique |
US6628503B2 (en) * | 2001-03-13 | 2003-09-30 | Nikon Corporation | Gas cooled electrostatic pin chuck for vacuum applications |
US7396236B2 (en) * | 2001-03-16 | 2008-07-08 | Formfactor, Inc. | Wafer level interposer |
JP4333065B2 (ja) * | 2001-11-14 | 2009-09-16 | レーザーテック株式会社 | 基板保持装置 |
JP2003174077A (ja) * | 2001-12-04 | 2003-06-20 | Lintec Corp | 吸着保持装置 |
JP4090313B2 (ja) * | 2002-09-11 | 2008-05-28 | 大日本スクリーン製造株式会社 | 基板保持装置および基板処理装置 |
US6722642B1 (en) * | 2002-11-06 | 2004-04-20 | Tokyo Electron Limited | High pressure compatible vacuum chuck for semiconductor wafer including lift mechanism |
US6802761B1 (en) * | 2003-03-20 | 2004-10-12 | Hitachi Global Storage Technologies Netherlands B.V. | Pattern-electroplated lapping plates for reduced loads during single slider lapping and process for their fabrication |
US6885541B2 (en) * | 2003-06-20 | 2005-04-26 | Ngk Spark Plug Co., Ltd. | Capacitor, and capacitor manufacturing process |
JP4744855B2 (ja) * | 2003-12-26 | 2011-08-10 | 日本碍子株式会社 | 静電チャック |
JP5119666B2 (ja) * | 2004-06-21 | 2013-01-16 | 株式会社ニコン | 露光装置、液体除去方法、及びデバイス製造方法 |
US7292427B1 (en) * | 2004-10-12 | 2007-11-06 | Kla-Tencor Technologies Corporation | Pin lift chuck assembly for warped substrates |
US7532310B2 (en) * | 2004-10-22 | 2009-05-12 | Asml Netherlands B.V. | Apparatus, method for supporting and/or thermally conditioning a substrate, a support table, and a chuck |
US7126091B1 (en) * | 2005-03-23 | 2006-10-24 | Eclipse Energy Systems, Inc. | Workpiece holder for vacuum processing |
US8525418B2 (en) * | 2005-03-31 | 2013-09-03 | Ngk Spark Plug Co., Ltd. | Electrostatic chuck |
KR20060108975A (ko) * | 2005-04-14 | 2006-10-19 | 삼성전자주식회사 | 로컬 포커스 불량을 방지하기 위한 웨이퍼 로딩 장치 |
JP4675213B2 (ja) * | 2005-11-01 | 2011-04-20 | 信越ポリマー株式会社 | 半導体ウェーハ用吸着パッド |
JP4950688B2 (ja) * | 2006-03-13 | 2012-06-13 | 東京エレクトロン株式会社 | 載置装置 |
WO2007105611A1 (ja) * | 2006-03-15 | 2007-09-20 | Shin-Etsu Polymer Co., Ltd. | 保持治具、半導体ウエハの研削方法、半導体ウエハの保護構造及びこれを用いた半導体ウエハの研削方法、並びに半導体チップの製造方法 |
JP4827569B2 (ja) * | 2006-03-23 | 2011-11-30 | 大日本スクリーン製造株式会社 | 基板支持構造とこれを用いた熱処理装置と基板支持構造に用いられるシート状物と基板支持構造の製造方法 |
JP2007329008A (ja) * | 2006-06-07 | 2007-12-20 | Tokyo Electron Ltd | 熱板及びその製造方法 |
US8322696B2 (en) * | 2006-07-10 | 2012-12-04 | Mcclaran Michael | Multi-seal vacuum hold down |
JP2008034723A (ja) * | 2006-07-31 | 2008-02-14 | Shin Etsu Polymer Co Ltd | 半導体ウェーハ用接触部品 |
WO2008075340A1 (en) * | 2006-12-18 | 2008-06-26 | Camtek Ltd. | A chuck and a method for supporting an object |
JP2008198739A (ja) * | 2007-02-09 | 2008-08-28 | Tokyo Electron Ltd | 載置台構造、これを用いた処理装置及びこの装置の使用方法 |
JP5196838B2 (ja) * | 2007-04-17 | 2013-05-15 | リンテック株式会社 | 接着剤付きチップの製造方法 |
EP2587529B1 (en) * | 2010-06-23 | 2018-01-17 | Hamamatsu Photonics K.K. | Suction apparatus, semiconductor device observation device, and semiconductor device observation method |
WO2012043349A1 (ja) * | 2010-09-28 | 2012-04-05 | 富士電機株式会社 | 吸着プレート |
FR2969024B1 (fr) * | 2010-12-20 | 2014-01-17 | Thibaut | Dispositif formant plot de bridage. |
TWI485286B (zh) * | 2011-11-16 | 2015-05-21 | Ebara Corp | Electroless plating and electroless plating |
US9017060B2 (en) * | 2011-12-28 | 2015-04-28 | Huang-Nan Huang | Arc blade-shaped processing surface structure of pad conditioner and manufacturing mold structure thereof |
JP5872998B2 (ja) * | 2012-04-26 | 2016-03-01 | 日本特殊陶業株式会社 | アルミナ焼結体、それを備える部材、および半導体製造装置 |
WO2014007758A1 (en) * | 2012-07-03 | 2014-01-09 | Heptagon Micro Optics Pte. Ltd. | Use of vacuum chucks to hold a wafer or wafer sub-stack |
JP5943742B2 (ja) * | 2012-07-04 | 2016-07-05 | 三菱電機株式会社 | 半導体試験治具およびそれを用いた半導体試験方法 |
DE102012019389B4 (de) * | 2012-10-02 | 2018-03-29 | Atotech Deutschland Gmbh | Haltevorrichtung für eine Ware und Behandlungsverfahren |
USD716742S1 (en) * | 2013-09-13 | 2014-11-04 | Asm Ip Holding B.V. | Substrate supporter for semiconductor deposition apparatus |
USD724553S1 (en) * | 2013-09-13 | 2015-03-17 | Asm Ip Holding B.V. | Substrate supporter for semiconductor deposition apparatus |
CN204997683U (zh) * | 2015-09-14 | 2016-01-27 | 昆山龙腾光电有限公司 | 一种真空吸盘和带有真空吸盘的机械手 |
-
2016
- 2016-05-25 JP JP2016104660A patent/JP6510461B2/ja active Active
-
2017
- 2017-05-19 KR KR1020170062501A patent/KR102104300B1/ko active IP Right Grant
- 2017-05-22 US US15/600,867 patent/US10770334B2/en active Active
- 2017-05-22 TW TW106116816A patent/TWI690017B/zh active
- 2017-05-25 CN CN201710379326.3A patent/CN107452665B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
KR102104300B1 (ko) | 2020-04-24 |
US20170345701A1 (en) | 2017-11-30 |
TW201810513A (zh) | 2018-03-16 |
TWI690017B (zh) | 2020-04-01 |
CN107452665A (zh) | 2017-12-08 |
CN107452665B (zh) | 2021-09-24 |
KR20170133261A (ko) | 2017-12-05 |
US10770334B2 (en) | 2020-09-08 |
JP2017212343A (ja) | 2017-11-30 |
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