JP4349952B2 - ウェハ支持部材とその製造方法 - Google Patents
ウェハ支持部材とその製造方法 Download PDFInfo
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- JP4349952B2 JP4349952B2 JP2004087694A JP2004087694A JP4349952B2 JP 4349952 B2 JP4349952 B2 JP 4349952B2 JP 2004087694 A JP2004087694 A JP 2004087694A JP 2004087694 A JP2004087694 A JP 2004087694A JP 4349952 B2 JP4349952 B2 JP 4349952B2
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- 239000011248 coating agent Substances 0.000 description 3
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- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 3
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
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- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 1
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- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D5/00—Sheets united without binding to form pads or blocks
- B42D5/04—Calendar blocks
- B42D5/06—Tear-off calendar blocks
- B42D5/065—Tear-off calendar blocks having plural perforation lines, e.g. for detaching parts of the sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D1/00—Books or other bound products
- B42D1/003—Books or other bound products characterised by shape or material of the sheets
- B42D1/006—Books or other bound products characterised by shape or material of the sheets with at least one foldable or folded sheet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R11/00—Arrangements for holding or mounting articles, not otherwise provided for
- B60R2011/0001—Arrangements for holding or mounting articles, not otherwise provided for characterised by position
- B60R2011/0003—Arrangements for holding or mounting articles, not otherwise provided for characterised by position inside the vehicle
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R7/00—Stowing or holding appliances inside vehicle primarily intended for personal property smaller than suit-cases, e.g. travelling articles, or maps
- B60R7/08—Disposition of racks, clips, holders, containers or the like for supporting specific articles
Description
そして、このウェハ支持部材を用いてウェハWにエッチング加工を施すには、まず、載置面にウェハWを載せ、ウェハWと静電吸着用電極との間に電圧を印加して静電気力を発生させることにより、ウェハWを載置面に吸着固定させる。次に、ヒータ電極に通電して載置面を加熱し、載置面に吸着保持したウェハWを加熱するとともに、ベース部とウェハ支持部材の上方に配置される不図示のプラズマ電極との間に高周波電圧を印加してプラズマを発生させ、この状態でエチッチングガスを供給することにより、ウェハWに対してエッチング加工を施すようになっていた。
さらに、上記接着剤からなるエポキシ樹脂の表面をロータリー加工機にて研削加工し、接着剤表面の平面度が10μm以下の平滑な面を形成した。このとき、表面粗さを算術平均粗さ(Ra)0.1〜5μmとなるように研削加工を行った。尚、ポリイミドフィルムの熱伝導率は0.34W/(m・K)、エポキシ樹脂の熱伝導率は金属フィラーを添加し、ポリイミドフィルムと同等になるように調整した。
また、図3に示す接合容器を用いて、試料No.6の導電性ベース部とヒータ部の接着を、図4に示す手順で行なった。
2:板状体
3、105a:載置面
4:吸着用電極
5、105:ヒータ部
6、106:絶縁性樹脂
7、107:ヒータ
8、108:凹部
9:絶縁性樹脂と異なる組成の樹脂
10、110:導電性ベース部
11、111:通路
12:均熱板状体
13:接着剤層(エポキシ)
14:接着剤塗布面
15:導電性ベース部とヒータ部間の接着剤層(シリコーン)
16:ヒータ部と保持部間の接着剤層(シリコーン)
20:保持部
51:非接着部(気泡、空隙)
52:非接着部(隙間)
200:接合容器
201:底板
202:側壁
203:蓋
204:バックアップ板
205:Oリング
206:導電性ベース固定金具
207:減圧ポンプ
208:支持棒
t:樹脂の平均厚み
Claims (12)
- 板状体の一方の主面を、ウェハを載せる載置面とした保持部と、絶縁性樹脂にヒータが埋設され、前記絶縁性樹脂の表面に凹部を有し、該凹部を埋めるように前記絶縁性樹脂と異なる組成の樹脂を充填したヒータ部と、導電性ベース部とを備え、前記保持部と前記ヒータ部と前記導電性ベース部との各間を接着層を介して接着し、前記ヒータ部へ充填した樹脂の表面粗さが算術平均粗さ(Ra)0.2〜2.0μmであることを特徴とするウェハ支持部材。
- 前記板状体の内部或いは他方の主面に吸着電極を備えたことを特徴とする請求項1に記載のウェハ支持部材。
- 前記絶縁性樹脂がポリイミド樹脂であることを特徴とする請求項1または2に記載のウェハ支持部材。
- 前記絶縁性樹脂の熱伝導率と、前記凹部を充填する樹脂の熱伝導率とが同等であることを特徴とする請求項1〜3の何れかに記載のウェハ支持部材。
- 前記凹部を充填する樹脂がエポキシまたはシリコーン樹脂から成ることを特徴とする請求項1〜4の何れかに記載のウェハ支持部材。
- 前記ヒータ部の樹脂の平均厚みが0.01〜1mmであることを特徴とする請求項1〜5の何れかに記載のウェハ支持部材。
- 上記保持部の載置面と平行な方向の熱伝導率が50〜419W/(m・K)であることを特徴とする請求項1〜6の何れかに記載のウェハ支持部材。
- 前記ヒータ部と前記導電性ベース部の間の接着層の厚みが0.01〜1mmであることを特徴とする請求項1〜7の何れかに記載のウェハ支持部材。
- 前記ヒータ部と前記導電性ベース部の間の接着層を、該接着層より厚みの小さい樹脂層で複数回に渡り積層して形成したことを特徴とする請求項8に記載のウェハ支持部材の製造方法。
- 前記ヒータ部と前記導電性ベース部の間の接着層をスクリーン印刷により複数回に渡り積層して形成したことを特徴とする請求項9に記載のウェハ支持部材の製造方法。
- 請求項1〜10の何れかに記載のウェハ支持部材の製造方法であって、保持部とヒータ部、またはヒータ部と導電性ベース部の接合面に接着層を形成した後、上記接着層を接合容器に入れて、接合容器内で減圧した後、前記接着層を押圧して接着し、その後、前記接合容器内の圧力を大きくして接着することを特徴とする請求項1〜10の何れかのウェハ支持部材の製造方法。
- 前記接着層の外周部を先に接触させ、前記接着層と被接着面とからなる閉じた空間を形成した後、前記接合容器内の圧力を高めることで接着することを特徴とする請求項11に記載のウェハ支持部材の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004087694A JP4349952B2 (ja) | 2004-03-24 | 2004-03-24 | ウェハ支持部材とその製造方法 |
US11/090,950 US20050215073A1 (en) | 2004-03-24 | 2005-03-24 | Wafer supporting member |
CNB2005100590160A CN100346463C (zh) | 2004-03-24 | 2005-03-24 | 晶片支撑部件 |
KR1020050024652A KR100681253B1 (ko) | 2004-03-24 | 2005-03-24 | 웨이퍼 지지부재 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004087694A JP4349952B2 (ja) | 2004-03-24 | 2004-03-24 | ウェハ支持部材とその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005277074A JP2005277074A (ja) | 2005-10-06 |
JP4349952B2 true JP4349952B2 (ja) | 2009-10-21 |
Family
ID=34990574
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004087694A Expired - Lifetime JP4349952B2 (ja) | 2004-03-24 | 2004-03-24 | ウェハ支持部材とその製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20050215073A1 (ja) |
JP (1) | JP4349952B2 (ja) |
KR (1) | KR100681253B1 (ja) |
CN (1) | CN100346463C (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016001757A (ja) * | 2015-09-02 | 2016-01-07 | 新光電気工業株式会社 | 静電チャック |
Families Citing this family (92)
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KR100929471B1 (ko) * | 2005-02-03 | 2009-12-02 | 신에츠 폴리머 가부시키가이샤 | 고정 캐리어, 고정 캐리어의 제조 방법, 고정 캐리어의 사용 방법, 및 기판 수납 용기 |
JP4707593B2 (ja) | 2006-03-23 | 2011-06-22 | 大日本スクリーン製造株式会社 | 熱処理装置と基板吸着方法 |
JP2007258615A (ja) | 2006-03-24 | 2007-10-04 | Ngk Insulators Ltd | 静電チャック |
US20080009417A1 (en) * | 2006-07-05 | 2008-01-10 | General Electric Company | Coating composition, article, and associated method |
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US20080029032A1 (en) * | 2006-08-01 | 2008-02-07 | Sun Jennifer Y | Substrate support with protective layer for plasma resistance |
US8284538B2 (en) * | 2006-08-10 | 2012-10-09 | Tokyo Electron Limited | Electrostatic chuck device |
JP5064069B2 (ja) | 2007-03-20 | 2012-10-31 | 株式会社Sokudo | 基板搬送装置および熱処理装置 |
JP2008277609A (ja) * | 2007-05-01 | 2008-11-13 | Ulvac Japan Ltd | 被処理体の加熱冷却方法 |
JP5061751B2 (ja) * | 2007-06-26 | 2012-10-31 | 住友電気工業株式会社 | ウェハプローバ用ウェハ保持体 |
US7667944B2 (en) * | 2007-06-29 | 2010-02-23 | Praxair Technology, Inc. | Polyceramic e-chuck |
TWI459851B (zh) | 2007-09-10 | 2014-11-01 | Ngk Insulators Ltd | heating equipment |
KR100888358B1 (ko) * | 2007-12-18 | 2009-03-11 | 주식회사 코미코 | 용사코팅방법 및 용사코팅장치 |
JP2009152475A (ja) * | 2007-12-21 | 2009-07-09 | Shinko Electric Ind Co Ltd | 基板温調固定装置 |
KR101358858B1 (ko) | 2008-05-01 | 2014-02-05 | 주식회사 뉴파워 프라즈마 | 정전척 장치 및 이를 구비한 기판 처리 장치 |
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JP5116855B2 (ja) * | 2008-11-25 | 2013-01-09 | 京セラ株式会社 | ウエハ加熱装置、静電チャック |
CN102308378A (zh) * | 2008-11-25 | 2012-01-04 | M丘比德技术公司 | 静电吸盘 |
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- 2005-03-24 KR KR1020050024652A patent/KR100681253B1/ko active IP Right Grant
- 2005-03-24 CN CNB2005100590160A patent/CN100346463C/zh active Active
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JP2016001757A (ja) * | 2015-09-02 | 2016-01-07 | 新光電気工業株式会社 | 静電チャック |
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CN100346463C (zh) | 2007-10-31 |
JP2005277074A (ja) | 2005-10-06 |
KR20060044706A (ko) | 2006-05-16 |
KR100681253B1 (ko) | 2007-02-09 |
CN1674247A (zh) | 2005-09-28 |
US20050215073A1 (en) | 2005-09-29 |
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