JP7329917B2 - 基板固定装置 - Google Patents
基板固定装置 Download PDFInfo
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- JP7329917B2 JP7329917B2 JP2018224483A JP2018224483A JP7329917B2 JP 7329917 B2 JP7329917 B2 JP 7329917B2 JP 2018224483 A JP2018224483 A JP 2018224483A JP 2018224483 A JP2018224483 A JP 2018224483A JP 7329917 B2 JP7329917 B2 JP 7329917B2
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- metal layer
- fixing device
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- insulating layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
[基板固定装置の構造]
図1は、第1実施形態に係る基板固定装置を簡略化して例示する断面図である。図1を参照するに、基板固定装置1は、主要な構成要素として、ベースプレート10と、接着層20と、発熱部30と、静電チャック40とを有している。
図2~図4は、第1実施形態に係る基板固定装置の製造工程を例示する図である。図2~図4を参照しながら、基板固定装置1の製造工程について、発熱部30の形成工程を中心に説明する。なお、図2(a)~図4(a)は、図1とは上下を反転した状態で描いている。
第1実施形態の変形例では、金属層のパターンのバリエーションを例示する。なお、第1実施形態の変形例において、既に説明した実施形態と同一構成部についての説明は省略する場合がある。
10 ベースプレート
15 水路
15a 冷却水導入部
15b 冷却水排出部
20 接着層
30 発熱部
31 絶縁層
32 発熱体
33、33A、33B、33C、33D、33E、33F 金属層
40 静電チャック
41 基体
41a 載置面
42 静電電極
311、312、313 絶縁樹脂フィルム
Claims (8)
- ベースプレートと、
前記ベースプレート上に設けられた発熱部と、
前記発熱部上に設けられた静電チャックと、を有し、
前記発熱部は、発熱体と、前記発熱体よりも前記静電チャックに近い側に配置された金属層と、前記発熱体及び前記金属層を被覆する樹脂製の絶縁層と、を備え、
前記金属層の側面及び上下面は、全体が前記絶縁層により被覆され、
前記金属層は、電気的に独立しており、
前記金属層は、前記絶縁層よりも熱伝導率の高い材料から形成されている基板固定装置。 - ベースプレートと、
前記ベースプレート上に設けられた発熱部と、
前記発熱部上に設けられた静電チャックと、を有し、
前記発熱部は、発熱体と、前記発熱体よりも前記静電チャックに近い側に配置された金属層と、前記発熱体及び前記金属層を被覆する樹脂製の絶縁層と、を備え、
前記金属層の側面及び上下面は前記絶縁層により被覆され、
前記金属層は、前記絶縁層よりも熱伝導率の高い材料から形成され、
前記発熱体と前記金属層とが同一の材料により形成され、
前記材料は、コンスタンタンである基板固定装置。 - 前記絶縁層は、ビスマレイミドトリアジン樹脂から形成されている請求項1又は2に記載の基板固定装置。
- 前記絶縁層は、エポキシ樹脂から形成されている請求項1又は2に記載の基板固定装置。
- 前記絶縁層は、アルミナ又は窒化アルミニウムのフィラーを含有し、
前記絶縁層の熱伝導率は、3W/mK以上である請求項1乃至4の何れか一項に記載の基板固定装置。 - 前記金属層は、隙間を介して隣接する部分を有する所定形状のパターンである請求項1乃至5の何れか一項に記載の基板固定装置。
- 前記所定形状のパターンは、同心円状又は渦巻き状のパターンである請求項6に記載の基板固定装置。
- 前記発熱体は、同心円状のパターンである請求項7に記載の基板固定装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018224483A JP7329917B2 (ja) | 2018-11-30 | 2018-11-30 | 基板固定装置 |
US16/691,885 US11631598B2 (en) | 2018-11-30 | 2019-11-22 | Substrate fixing device |
TW108143125A TWI826597B (zh) | 2018-11-30 | 2019-11-27 | 基板固定裝置 |
KR1020190154139A KR20200066203A (ko) | 2018-11-30 | 2019-11-27 | 기판 고정 장치 |
CN201911193144.2A CN111261571A (zh) | 2018-11-30 | 2019-11-28 | 基板固定装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018224483A JP7329917B2 (ja) | 2018-11-30 | 2018-11-30 | 基板固定装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020088304A JP2020088304A (ja) | 2020-06-04 |
JP7329917B2 true JP7329917B2 (ja) | 2023-08-21 |
Family
ID=70849378
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Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018224483A Active JP7329917B2 (ja) | 2018-11-30 | 2018-11-30 | 基板固定装置 |
Country Status (5)
Country | Link |
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US (1) | US11631598B2 (ja) |
JP (1) | JP7329917B2 (ja) |
KR (1) | KR20200066203A (ja) |
CN (1) | CN111261571A (ja) |
TW (1) | TWI826597B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114388323A (zh) * | 2020-10-20 | 2022-04-22 | 中微半导体设备(上海)股份有限公司 | 一种静电夹盘及其等离子体处理装置 |
JP2022100570A (ja) | 2020-12-24 | 2022-07-06 | 新光電気工業株式会社 | 静電チャック及びその製造方法、基板固定装置 |
CN112864079B (zh) * | 2021-01-25 | 2024-02-27 | 北京北方华创微电子装备有限公司 | 静电卡盘及半导体加工设备 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001102436A (ja) | 1999-05-07 | 2001-04-13 | Applied Materials Inc | 静電チャック及びその製造方法 |
JP2003229344A (ja) | 2002-10-15 | 2003-08-15 | Ibiden Co Ltd | 半導体製品加熱用ヒータ |
JP2005277074A (ja) | 2004-03-24 | 2005-10-06 | Kyocera Corp | ウェハ支持部材とその製造方法 |
US20090165956A1 (en) | 2007-12-27 | 2009-07-02 | Jusung Engineering Co., Ltd | Electrostatic chuck and apparatus for treating substrate including the same |
JP2011086919A (ja) | 2009-09-17 | 2011-04-28 | Ngk Insulators Ltd | 静電チャック及びその製法 |
JP2015035485A (ja) | 2013-08-08 | 2015-02-19 | 株式会社東芝 | 静電チャック、載置プレート支持台及び静電チャックの製造方法 |
JP2016058748A (ja) | 2010-01-29 | 2016-04-21 | 住友大阪セメント株式会社 | 静電チャック装置 |
JP2017163157A (ja) | 2014-11-20 | 2017-09-14 | 住友大阪セメント株式会社 | 静電チャック装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06151322A (ja) * | 1992-11-05 | 1994-05-31 | Nippon Sanso Kk | 薄膜製造装置用加熱装置 |
JPH10112437A (ja) * | 1996-10-04 | 1998-04-28 | Hitachi Ltd | 半導体基板処理装置 |
US6538872B1 (en) | 2001-11-05 | 2003-03-25 | Applied Materials, Inc. | Electrostatic chuck having heater and method |
JP5423632B2 (ja) * | 2010-01-29 | 2014-02-19 | 住友大阪セメント株式会社 | 静電チャック装置 |
JP5962833B2 (ja) * | 2015-01-16 | 2016-08-03 | Toto株式会社 | 静電チャック |
JP6708518B2 (ja) * | 2016-08-09 | 2020-06-10 | 新光電気工業株式会社 | 基板固定装置及びその製造方法 |
JP7278035B2 (ja) * | 2018-06-20 | 2023-05-19 | 新光電気工業株式会社 | 静電チャック、基板固定装置 |
-
2018
- 2018-11-30 JP JP2018224483A patent/JP7329917B2/ja active Active
-
2019
- 2019-11-22 US US16/691,885 patent/US11631598B2/en active Active
- 2019-11-27 KR KR1020190154139A patent/KR20200066203A/ko not_active Application Discontinuation
- 2019-11-27 TW TW108143125A patent/TWI826597B/zh active
- 2019-11-28 CN CN201911193144.2A patent/CN111261571A/zh active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001102436A (ja) | 1999-05-07 | 2001-04-13 | Applied Materials Inc | 静電チャック及びその製造方法 |
JP2003229344A (ja) | 2002-10-15 | 2003-08-15 | Ibiden Co Ltd | 半導体製品加熱用ヒータ |
JP2005277074A (ja) | 2004-03-24 | 2005-10-06 | Kyocera Corp | ウェハ支持部材とその製造方法 |
US20090165956A1 (en) | 2007-12-27 | 2009-07-02 | Jusung Engineering Co., Ltd | Electrostatic chuck and apparatus for treating substrate including the same |
JP2011086919A (ja) | 2009-09-17 | 2011-04-28 | Ngk Insulators Ltd | 静電チャック及びその製法 |
JP2016058748A (ja) | 2010-01-29 | 2016-04-21 | 住友大阪セメント株式会社 | 静電チャック装置 |
JP2015035485A (ja) | 2013-08-08 | 2015-02-19 | 株式会社東芝 | 静電チャック、載置プレート支持台及び静電チャックの製造方法 |
JP2017163157A (ja) | 2014-11-20 | 2017-09-14 | 住友大阪セメント株式会社 | 静電チャック装置 |
Also Published As
Publication number | Publication date |
---|---|
CN111261571A (zh) | 2020-06-09 |
US11631598B2 (en) | 2023-04-18 |
TWI826597B (zh) | 2023-12-21 |
US20200176282A1 (en) | 2020-06-04 |
KR20200066203A (ko) | 2020-06-09 |
TW202022981A (zh) | 2020-06-16 |
JP2020088304A (ja) | 2020-06-04 |
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