JP3993182B2 - 2個の物品ホルダを有する二次元バランス位置決め装置及びこの位置決め装置を有するリソグラフ装置 - Google Patents
2個の物品ホルダを有する二次元バランス位置決め装置及びこの位置決め装置を有するリソグラフ装置 Download PDFInfo
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- JP3993182B2 JP3993182B2 JP2004192847A JP2004192847A JP3993182B2 JP 3993182 B2 JP3993182 B2 JP 3993182B2 JP 2004192847 A JP2004192847 A JP 2004192847A JP 2004192847 A JP2004192847 A JP 2004192847A JP 3993182 B2 JP3993182 B2 JP 3993182B2
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- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
- B23Q1/25—Movable or adjustable work or tool supports
- B23Q1/44—Movable or adjustable work or tool supports using particular mechanisms
- B23Q1/56—Movable or adjustable work or tool supports using particular mechanisms with sliding pairs only, the sliding pairs being the first two elements of the mechanism
- B23Q1/60—Movable or adjustable work or tool supports using particular mechanisms with sliding pairs only, the sliding pairs being the first two elements of the mechanism two sliding pairs only, the sliding pairs being the first two elements of the mechanism
- B23Q1/62—Movable or adjustable work or tool supports using particular mechanisms with sliding pairs only, the sliding pairs being the first two elements of the mechanism two sliding pairs only, the sliding pairs being the first two elements of the mechanism with perpendicular axes, e.g. cross-slides
- B23Q1/621—Movable or adjustable work or tool supports using particular mechanisms with sliding pairs only, the sliding pairs being the first two elements of the mechanism two sliding pairs only, the sliding pairs being the first two elements of the mechanism with perpendicular axes, e.g. cross-slides a single sliding pair followed perpendicularly by a single sliding pair
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
- B23Q1/25—Movable or adjustable work or tool supports
- B23Q1/44—Movable or adjustable work or tool supports using particular mechanisms
- B23Q1/56—Movable or adjustable work or tool supports using particular mechanisms with sliding pairs only, the sliding pairs being the first two elements of the mechanism
- B23Q1/60—Movable or adjustable work or tool supports using particular mechanisms with sliding pairs only, the sliding pairs being the first two elements of the mechanism two sliding pairs only, the sliding pairs being the first two elements of the mechanism
- B23Q1/62—Movable or adjustable work or tool supports using particular mechanisms with sliding pairs only, the sliding pairs being the first two elements of the mechanism two sliding pairs only, the sliding pairs being the first two elements of the mechanism with perpendicular axes, e.g. cross-slides
- B23Q1/621—Movable or adjustable work or tool supports using particular mechanisms with sliding pairs only, the sliding pairs being the first two elements of the mechanism two sliding pairs only, the sliding pairs being the first two elements of the mechanism with perpendicular axes, e.g. cross-slides a single sliding pair followed perpendicularly by a single sliding pair
- B23Q1/623—Movable or adjustable work or tool supports using particular mechanisms with sliding pairs only, the sliding pairs being the first two elements of the mechanism two sliding pairs only, the sliding pairs being the first two elements of the mechanism with perpendicular axes, e.g. cross-slides a single sliding pair followed perpendicularly by a single sliding pair followed perpendicularly by a single rotating pair
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
- B23Q11/0032—Arrangements for preventing or isolating vibrations in parts of the machine
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- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70766—Reaction force control means, e.g. countermass
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/7084—Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T74/00—Machine element or mechanism
- Y10T74/20—Control lever and linkage systems
- Y10T74/20207—Multiple controlling elements for single controlled element
- Y10T74/20213—Interconnected
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- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
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Description
図1に線図的に示す本発明リソグラフ装置は、光学リソグラフ法により、及びいわゆる「ステップアンドレピート」の原理に従うイメージング法によって集積半導体回路の製作に使用される。図1に線図的に示すように、このリソグラフ装置はフレーム1を具え、垂直Z方向に平行に示すように、本発明位置決め装置3、集束ユニット5、マスクホルダ7、及び放射源9の順序でフレーム1に支持する。位置決め装置3は第1基材ホルダ11と、同一の第2基材ホルダ13とを具える。図1に示すリソグラフ装置は光学リソグラフ装置であり、その放射源9は光源15を有する。基材ホルダ11は、それぞれZ方向に垂直に延在する支持面17を有し、この支持面上に第1半導体基材19を設置することができると共に、基材ホルダ13は、Z方向に垂直に延在する支持面21を有し、この支持面上に第2半導体基材23を設置することができる。第1基材ホルダ11は、Z方向に垂直なX方向に平行に、X方向、及びZ方向に垂直なY方向にも平行に、位置決め装置3の第1移動ユニット25によって、フレーム1に対し相対的に移動することができると共に、第2基材ホルダ13は、X方向、及びY方向に平行に、位置決め装置3の第2移動ユニット27によってフレーム1に対し相対的に移動することができる。集束ユニット5は撮像システム、又は投影システムであって、Z方向に平行に指向する主光学軸線31を有する光学レンズ系29を具え、例えば4、又は5のような光学縮小率を有する。マスクホルダ7はZ方向に垂直に延在する支持面33を具え、この上にマスク35を設置することができる。マスク35は集積半導体回路のパターン、又はサブパターンを有する。作動中、光源15から発生する光線ビームはマスク35を通じて案内され、レンズ系29によって第1半導体基材19上に集束し、即ち焦点合せし、マスク35上にあるパターンを縮小した寸法で、第1半導体基材19上に結像させる。
Claims (10)
- ベースと、第1移動ユニットと、第2移動ユニットとを具え、前記第1移動ユニットはX方向、および当該X方向に垂直なY方向に平行に前記ベースに対し移動し得る第1物品ホルダを有し、前記第2移動ユニットはX方向およびY方向に平行に前記ベースに対し移動し得る第2物品ホルダを有し、前記第1物品ホルダと第2物品ホルダとは測定位置から作動位置に前記ベースに対し連続的に移動可能であり、前記第1移動ユニットおよび第2移動ユニットはそれぞれ作動中、相互に移動可能な位置決め装置において、
X方向およびY方向に平行に前記ベースに対して移動可能なバランスユニットが設けられ、
前記バランスユニットに対して回転可能に支持された回転可能ユニットが設けられ、
前記回転可能ユニット上に前記第1移動ユニットおよび前記第2移動ユニットが設けられており、
前記第1移動ユニットおよび前記第2移動ユニットはそれぞれXアクチュエータとYアクチュエータを備え、
各前記Xアクチュエータは第1部分および第2部分を備え、当該第1部分が前記物品ホルダに連結され、かつ、前記第2部分に対し移動可能に構成されており、
各前記Yアクチュエータは第1部分を備え、当該第1部分が関連する前記移動ユニットの前記Xアクチュエータの前記第2部分に連結されており、前記Yアクチュエータには各前記第1部分を沿わせて移動可能に案内する共通直線案内部が設けられており、前記共通直線案内部が前記回転可能ユニットに固定されていることを特徴とする、
位置決め装置。 - ベースと、第1移動ユニットと、第2移動ユニットとを具え、前記第1移動ユニットはX方向、および当該X方向に垂直なY方向に平行に前記ベースに対し移動し得る第1物品ホルダを有し、前記第2移動ユニットはX方向およびY方向に平行に前記ベースに対し移動し得る第2物品ホルダを有し、前記第1物品ホルダと第2物品ホルダとは測定位置から作動位置に前記ベースに対し連続的に移動可能であり、前記第1移動ユニットおよび第2移動ユニットはそれぞれ作動中、相互に移動可能な位置決め装置において、
X方向およびY方向に平行に前記ベースに対して移動可能なバランスユニットが設けられ、
前記バランスユニット上に前記第1移動ユニットおよび前記第2移動ユニットが設けられており、
前記第1移動ユニットおよび前記第2移動ユニットは、それぞれXアクチュエータとYアクチュエータを備え、
各前記Xアクチュエータは第1部分および第2部分を備え、当該第1部分が前記物品ホルダに連結され、かつ、前記第2部分に対し移動可能に構成されており、
各前記Yアクチュエータは第1部分および第2部分を備え、当該第1部分が関連する前記移動ユニットのXアクチュエータの前記第2部分に連結されており、かつ、関連する前記Yアクチュエータの第2部分に対し移動可能に構成されており、前記第2部分が前記バランスユニットに固定されており、
前記物品ホルダの両方にローレンツ力アクチュエータを備える継手部材を設け、この継手部材により関連する前記物品ホルダが、前記第1移動ユニットの前記Xアクチュエータの前記第1部分、及び前記第2移動ユニットの前記Xアクチュエータの前記第1部分に着脱可能に構成されていることを特徴とする、
位置決め装置。 - 前記Xアクチュエータおよび前記Yアクチュエータは、専らローレンツ力を発生するように構成されていることを特徴とする、
請求項1または2に記載の位置決め装置。 - X方向に平行に、Y方向に平行に延在するベースの案内面上を静的空気軸受によって前記バランスユニットが移動可能に案内されるよう構成したことを特徴とする、
請求項1から3までのいずれか1項に記載の位置決め装置。 - 少なくとも1個のアクチュエータを制御する制御ユニットを前記位置決め装置に設け、この制御ユニットによって2個の前記移動ユニットの前記Xアクチュエータの少なくとも前記第2部分をX方向に平行な位置に保持し得るようにしたことを特徴とする、
請求項1から4までのいずれか1項に記載の位置決め装置。 - 前記制御ユニットが前記回転可能ユニットを制御するよう構成したことを特徴とする、
請求項5に記載の位置決め装置。 - 2個の前記移動ユニットにはY方向に平行に延在する第2部分をそれぞれ設けた2個のYアクチュエータをそれぞれ設け、X方向に垂直に、Y方向に垂直に延びる回動軸の周りに、2個の前記移動ユニットの前記Xアクチュエータの前記第2部分を関連する前記Yアクチュエータの2個の前記第1部分に対しそれぞれ回動可能に構成し、前記制御ユニットにより両方の前記移動ユニットの前記Yアクチュエータを制御するようにしたことを特徴とする、
請求項5または6に記載の位置決め装置。 - 放射源と、マスクホルダと、集束ユニットと、位置決め装置とを固定するフレームを具え、前記集束ユニットは主軸線を有し、前記位置決め装置はこの主軸線に垂直なX方向に平行に、及びX方向に垂直で前記主軸線にも垂直なY方向に平行に、前記集束ユニットに対し移動可能な基材ホルダを具えるリソグラフ装置において、
前記位置決め装置の2個の前記物品ホルダのおのおのが前記リソグラフ装置の基材ホルダであり、前記位置決め装置の前記ベースが前記フレームに固定されている間、前記集束ユニットを介して前記放射源により基材ホルダ上に設置し得る基材を照射し得る位置が前記基材ホルダの前記作動位置であり、
請求項1から請求項7までのいずれか1項に記載の位置決め装置がここに使用する前記位置決め装置であることを特徴とする、
リソグラフ装置。 - 前記リソグラフ装置が別個の位置決め装置を具え、この別個の位置決め装置により前記マスクホルダを少なくともX方向に平行に前記集束ユニットに対し移動可能に構成したことを特徴とする、
請求項8に記載のリソグラフ装置。 - 位置決め装置と、集束ユニットと、別個の位置決め装置と、放射源とを固定するフレームを具え、前記集束ユニットは主軸線を有し、前記位置決め装置はこの主軸線に垂直なX方向に平行に、及びX方向に垂直で前記主軸線にも垂直なY方向に平行に、前記集束ユニットに対し移動可能な基材ホルダを具え、前記別個の位置決め装置は少なくともX方向に平行に前記集束ユニットに対し移動可能なマスクホルダを具えているリソグラフ装置において、
前記別個の位置決め装置の2個の前記物品ホルダのそれぞれがX方向に平行に、Y方向にも平行に前記別個の位置決め装置によって位置決めされ得る前記リソグラフ装置のマスクホルダであり、前記別個の位置決め装置の前記ベースが前記フレームに固定されている間、マスクホルダ上に設置し得るマスクを前記放射源によって照射し得る位置が前記マスクホルダの作動位置であり、
請求項1から請求項9までのいずれか1項に記載の位置決め装置が前記別個の位置決め装置であることを特徴とする、
リソグラフ装置。
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DE69735016D1 (de) | 2006-02-02 |
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EP0890136B9 (en) | 2003-12-10 |
EP0890136B1 (en) | 2002-12-18 |
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JP2000505958A (ja) | 2000-05-16 |
EP1197801A1 (en) | 2002-04-17 |
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