SG116510A1 - - Google Patents

Info

Publication number
SG116510A1
SG116510A1 SG200306758A SG200306758A SG116510A1 SG 116510 A1 SG116510 A1 SG 116510A1 SG 200306758 A SG200306758 A SG 200306758A SG 200306758 A SG200306758 A SG 200306758A SG 116510 A1 SG116510 A1 SG 116510A1
Authority
SG
Singapore
Application number
SG200306758A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of SG116510A1 publication Critical patent/SG116510A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70125—Use of illumination settings tailored to particular mask patterns

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Lenses (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
SG200306758A 2002-11-12 2003-11-11 SG116510A1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US42530902P 2002-11-12 2002-11-12

Publications (1)

Publication Number Publication Date
SG116510A1 true SG116510A1 (ja) 2005-11-28

Family

ID=32176754

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200306758A SG116510A1 (ja) 2002-11-12 2003-11-11

Country Status (7)

Country Link
US (1) US7034919B2 (ja)
EP (1) EP1420301A3 (ja)
JP (2) JP4606732B2 (ja)
KR (1) KR100592575B1 (ja)
CN (1) CN1510520A (ja)
SG (1) SG116510A1 (ja)
TW (1) TWI277767B (ja)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7245356B2 (en) * 2003-02-11 2007-07-17 Asml Netherlands B.V. Lithographic apparatus and method for optimizing illumination using a photolithographic simulation
US7471375B2 (en) * 2003-02-11 2008-12-30 Asml Netherlands B.V. Correction of optical proximity effects by intensity modulation of an illumination arrangement
SG125232A1 (en) * 2005-02-23 2006-09-29 Asml Masktools Bv Method, program product and apparatus for optimizing illumination for full-chip layer
US7379170B2 (en) * 2005-05-02 2008-05-27 Invarium, Inc. Apparatus and method for characterizing an image system in lithography projection tool
US7934172B2 (en) * 2005-08-08 2011-04-26 Micronic Laser Systems Ab SLM lithography: printing to below K1=.30 without previous OPC processing
US20090213354A1 (en) * 2005-08-08 2009-08-27 Micronic Laser Systems Ab Method and apparatus for projection printing
US8237913B2 (en) * 2007-05-08 2012-08-07 Asml Netherlands B.V. Lithographic apparatus and method
US20080278698A1 (en) * 2007-05-08 2008-11-13 Asml Netherlands B.V. Lithographic apparatus and method
US8570485B2 (en) * 2008-06-03 2013-10-29 Asml Netherlands B.V. Lens heating compensation systems and methods
CN102224459B (zh) * 2008-11-21 2013-06-19 Asml荷兰有限公司 用于优化光刻过程的方法及设备
EP2207064A1 (en) 2009-01-09 2010-07-14 Takumi Technology Corporation Method of selecting a set of illumination conditions of a lithographic apparatus for optimizing an integrated circuit physical layout
NL2007577A (en) 2010-11-10 2012-05-14 Asml Netherlands Bv Optimization of source, mask and projection optics.
DE102011076145B4 (de) * 2011-05-19 2013-04-11 Carl Zeiss Smt Gmbh Verfahren zum Zuordnen einer Pupillenfacette eines Pupillenfacettenspiegels einer Beleuchtungsoptik einer Projektionsbelichtungsanlage zu einer Feldfacette eines Feldfacettenspiegels der Beleuchtungsoptik
JP5835968B2 (ja) 2011-07-05 2015-12-24 キヤノン株式会社 決定方法、プログラム及び露光方法
US9529268B2 (en) * 2014-04-03 2016-12-27 Taiwan Semiconductor Manufacturing Company, Ltd. Systems and methods for improving pattern transfer
US10785394B2 (en) 2015-08-28 2020-09-22 Kla Corporation Imaging performance optimization methods for semiconductor wafer inspection
CN105487248B (zh) * 2015-12-16 2018-11-23 宁波舜宇光电信息有限公司 通过调整镜片实现光学系统成像质量的补偿方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07111239A (ja) * 1993-10-12 1995-04-25 Canon Inc 露光装置
US20020036758A1 (en) * 2000-06-14 2002-03-28 Asml Netherlands Bv Method of operating an optical imaging system, lithographic projection apparatus, device manufacturing method, and device manufactured thereby
EP1217448A2 (en) * 2000-12-20 2002-06-26 Hitachi, Ltd. Exposure method and system

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5300786A (en) 1992-10-28 1994-04-05 International Business Machines Corporation Optical focus phase shift test pattern, monitoring system and process
JPH0729813A (ja) * 1993-07-07 1995-01-31 Nippon Telegr & Teleph Corp <Ntt> 投影露光の最適化方法
US5680588A (en) * 1995-06-06 1997-10-21 International Business Machines Corporation Method and system for optimizing illumination in an optical photolithography projection imaging system
WO1997033205A1 (en) 1996-03-06 1997-09-12 Philips Electronics N.V. Differential interferometer system and lithographic step-and-scan apparatus provided with such a system
US5805290A (en) 1996-05-02 1998-09-08 International Business Machines Corporation Method of optical metrology of unresolved pattern arrays
DE69735016T2 (de) 1996-12-24 2006-08-17 Asml Netherlands B.V. Lithographisches Gerät mit zwei Objekthaltern
US5822066A (en) * 1997-02-26 1998-10-13 Ultratech Stepper, Inc. Point diffraction interferometer and pin mirror for use therewith
USRE40043E1 (en) 1997-03-10 2008-02-05 Asml Netherlands B.V. Positioning device having two object holders
US5965309A (en) 1997-08-28 1999-10-12 International Business Machines Corporation Focus or exposure dose parameter control system using tone reversing patterns
US6033814A (en) 1998-02-26 2000-03-07 Micron Technology, Inc. Method for multiple process parameter matching
US6128067A (en) 1998-04-28 2000-10-03 Kabushiki Kaisha Toshiba Correcting method and correcting system for mask pattern
US6466304B1 (en) 1998-10-22 2002-10-15 Asm Lithography B.V. Illumination device for projection system and method for fabricating
JP2000232057A (ja) 1999-02-10 2000-08-22 Hitachi Ltd レジストパターンのシミュレーション方法およびパターン形成方法
US6563566B2 (en) 2001-01-29 2003-05-13 International Business Machines Corporation System and method for printing semiconductor patterns using an optimized illumination and reticle
TWI285295B (en) 2001-02-23 2007-08-11 Asml Netherlands Bv Illumination optimization in lithography
US6525302B2 (en) * 2001-06-06 2003-02-25 The Regents Of The University Of Colorado Wavefront coding phase contrast imaging systems

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07111239A (ja) * 1993-10-12 1995-04-25 Canon Inc 露光装置
US20020036758A1 (en) * 2000-06-14 2002-03-28 Asml Netherlands Bv Method of operating an optical imaging system, lithographic projection apparatus, device manufacturing method, and device manufactured thereby
EP1217448A2 (en) * 2000-12-20 2002-06-26 Hitachi, Ltd. Exposure method and system

Also Published As

Publication number Publication date
EP1420301A2 (en) 2004-05-19
US20040184030A1 (en) 2004-09-23
TW200416414A (en) 2004-09-01
CN1510520A (zh) 2004-07-07
JP2004289129A (ja) 2004-10-14
JP2008294456A (ja) 2008-12-04
JP4974972B2 (ja) 2012-07-11
KR100592575B1 (ko) 2006-06-26
US7034919B2 (en) 2006-04-25
JP4606732B2 (ja) 2011-01-05
TWI277767B (en) 2007-04-01
EP1420301A3 (en) 2005-11-23
KR20040044340A (ko) 2004-05-28

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