JP2014512688A - フリップチップ、フェイスアップおよびフェイスダウンセンターボンドメモリワイヤボンドアセンブリ - Google Patents

フリップチップ、フェイスアップおよびフェイスダウンセンターボンドメモリワイヤボンドアセンブリ Download PDF

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JP2014512688A
JP2014512688A JP2014506450A JP2014506450A JP2014512688A JP 2014512688 A JP2014512688 A JP 2014512688A JP 2014506450 A JP2014506450 A JP 2014506450A JP 2014506450 A JP2014506450 A JP 2014506450A JP 2014512688 A JP2014512688 A JP 2014512688A
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microelectronic
lead
assembly
microelectronic element
front surface
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JP2014512688A5 (enExample
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ハーバ，ベルガセム
クリスプ，リチャード・デューイット
ゾーニ，ワエル
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テッセラ，インコーポレイテッド
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    • H10W72/00—
    • H10W70/68—
    • H10W74/10—
    • H10W74/117—
    • H10W90/00—
    • H10W90/701—
    • H10W70/40—
    • H10W70/60—
    • H10W70/655—
    • H10W70/656—
    • H10W70/681—
    • H10W70/685—
    • H10W72/251—
    • H10W72/252—
    • H10W72/29—
    • H10W72/352—
    • H10W72/354—
    • H10W72/5363—
    • H10W72/5366—
    • H10W72/5445—
    • H10W72/5473—
    • H10W72/551—
    • H10W72/59—
    • H10W72/856—
    • H10W72/865—
    • H10W72/877—
    • H10W72/884—
    • H10W72/9445—
    • H10W72/951—
    • H10W72/952—
    • H10W74/00—
    • H10W74/15—
    • H10W90/231—
    • H10W90/24—
    • H10W90/288—
    • H10W90/722—
    • H10W90/724—
    • H10W90/726—
    • H10W90/732—
    • H10W90/734—
    • H10W90/736—
    • H10W90/752—
    • H10W90/753—
    • H10W90/754—
    • H10W90/756—

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Semiconductor Memories (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)
  • Manufacturing & Machinery (AREA)
JP2014506450A 2011-04-21 2012-04-11 フリップチップ、フェイスアップおよびフェイスダウンセンターボンドメモリワイヤボンドアセンブリ Pending JP2014512688A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201161477967P 2011-04-21 2011-04-21
US61/477,967 2011-04-21
US13/306,099 2011-11-29
US13/306,099 US8928153B2 (en) 2011-04-21 2011-11-29 Flip-chip, face-up and face-down centerbond memory wirebond assemblies
PCT/US2012/032997 WO2012145201A1 (en) 2011-04-21 2012-04-11 Flip-chip, face-up and face-down centerbond memory wirebond assemblies

Publications (2)

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JP2014512688A true JP2014512688A (ja) 2014-05-22
JP2014512688A5 JP2014512688A5 (enExample) 2015-05-28

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JP2014506450A Pending JP2014512688A (ja) 2011-04-21 2012-04-11 フリップチップ、フェイスアップおよびフェイスダウンセンターボンドメモリワイヤボンドアセンブリ

Country Status (8)

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US (3) US8928153B2 (enExample)
EP (1) EP2700100A1 (enExample)
JP (1) JP2014512688A (enExample)
KR (1) KR102005830B1 (enExample)
CN (1) CN103620778B (enExample)
BR (1) BR112013027142A2 (enExample)
TW (2) TWI505420B (enExample)
WO (1) WO2012145201A1 (enExample)

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KR102078936B1 (ko) * 2018-11-07 2020-02-19 주식회사 프로텍 도전성 볼 탑재 방법
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JP7521458B2 (ja) * 2021-03-04 2024-07-24 住友電気工業株式会社 光コネクタケーブル
JP2024023002A (ja) * 2022-08-08 2024-02-21 住友電気工業株式会社 光モジュール及び光モジュールの製造方法
US12456664B2 (en) 2022-10-19 2025-10-28 Nxp B.V. Semiconductor device with thermal dissipation and method therefor
TWI839059B (zh) * 2023-01-03 2024-04-11 力晶積成電子製造股份有限公司 半導體封裝
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US8928153B2 (en) 2015-01-06
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