JP5026736B2 - 冷凍装置 - Google Patents
冷凍装置 Download PDFInfo
- Publication number
- JP5026736B2 JP5026736B2 JP2006135287A JP2006135287A JP5026736B2 JP 5026736 B2 JP5026736 B2 JP 5026736B2 JP 2006135287 A JP2006135287 A JP 2006135287A JP 2006135287 A JP2006135287 A JP 2006135287A JP 5026736 B2 JP5026736 B2 JP 5026736B2
- Authority
- JP
- Japan
- Prior art keywords
- refrigerant
- heat exchanger
- heat insulation
- refrigerant circuit
- heat insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005057 refrigeration Methods 0.000 title claims description 58
- 239000003507 refrigerant Substances 0.000 claims description 203
- 238000009413 insulation Methods 0.000 claims description 85
- 238000003860 storage Methods 0.000 claims description 44
- 239000011810 insulating material Substances 0.000 claims description 30
- 238000009835 boiling Methods 0.000 claims description 25
- 238000001816 cooling Methods 0.000 claims description 18
- 230000006837 decompression Effects 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 10
- 239000002131 composite material Substances 0.000 claims description 3
- 239000006260 foam Substances 0.000 claims description 3
- 239000012774 insulation material Substances 0.000 claims 1
- 238000001704 evaporation Methods 0.000 description 28
- 230000008020 evaporation Effects 0.000 description 27
- 239000007788 liquid Substances 0.000 description 27
- 239000003921 oil Substances 0.000 description 22
- 239000012071 phase Substances 0.000 description 22
- 238000005259 measurement Methods 0.000 description 21
- MSSNHSVIGIHOJA-UHFFFAOYSA-N pentafluoropropane Chemical compound FC(F)CC(F)(F)F MSSNHSVIGIHOJA-UHFFFAOYSA-N 0.000 description 15
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 13
- 238000007710 freezing Methods 0.000 description 10
- 230000008014 freezing Effects 0.000 description 10
- 238000009434 installation Methods 0.000 description 10
- 239000007791 liquid phase Substances 0.000 description 10
- 239000007789 gas Substances 0.000 description 8
- 238000005192 partition Methods 0.000 description 7
- 238000009833 condensation Methods 0.000 description 4
- 230000005494 condensation Effects 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 4
- 238000004880 explosion Methods 0.000 description 3
- 238000005187 foaming Methods 0.000 description 3
- 239000011491 glass wool Substances 0.000 description 3
- LVGUZGTVOIAKKC-UHFFFAOYSA-N 1,1,1,2-tetrafluoroethane Chemical compound FCC(F)(F)F LVGUZGTVOIAKKC-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- XPDWGBQVDMORPB-UHFFFAOYSA-N Fluoroform Chemical compound FC(F)F XPDWGBQVDMORPB-UHFFFAOYSA-N 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- RWRIWBAIICGTTQ-UHFFFAOYSA-N difluoromethane Chemical compound FCF RWRIWBAIICGTTQ-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000011065 in-situ storage Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- GTLACDSXYULKMZ-UHFFFAOYSA-N pentafluoroethane Chemical compound FC(F)C(F)(F)F GTLACDSXYULKMZ-UHFFFAOYSA-N 0.000 description 2
- 229920005749 polyurethane resin Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical group FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 2
- UJPMYEOUBPIPHQ-UHFFFAOYSA-N 1,1,1-trifluoroethane Chemical compound CC(F)(F)F UJPMYEOUBPIPHQ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- WMIYKQLTONQJES-UHFFFAOYSA-N hexafluoroethane Chemical compound FC(F)(F)C(F)(F)F WMIYKQLTONQJES-UHFFFAOYSA-N 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000010687 lubricating oil Substances 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 244000005700 microbiome Species 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
- F25D19/02—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors plug-in type
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B7/00—Compression machines, plants or systems, with cascade operation, i.e. with two or more circuits, the heat from the condenser of one circuit being absorbed by the evaporator of the next circuit
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B9/00—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point
- F25B9/002—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point characterised by the refrigerant
- F25B9/006—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point characterised by the refrigerant the refrigerant containing more than one component
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Description
2 断熱箱体
3 機械室
4 貯蔵室
10 高温側圧縮機
11 真空断熱パネル
20 低温側圧縮機
25 高温側冷媒回路
26 補助凝縮器
28、31 凝縮器
32、44、51、54、60 乾燥器
33、52、55、61 キャピラリーチューブ
34 蒸発器
35 アキュムレータ
36 凝縮器用送風機
38 低温側冷媒回路
39 放熱器
42 凝縮パイプ
43 カスケード熱交換器
46 第1の気液分離器
48 第1の中間熱交換器
49 第2の気液分離器
56 第2の中間熱交換器
58 第3の中間熱交換器
59 第4の中間熱交換器
62 蒸発パイプ
70 断熱構造体
71 開口
72 切欠
73 カバー部材
Claims (3)
- それぞれ圧縮機から吐出された冷媒を凝縮した後蒸発せしめて冷却作用を発揮する独立した冷媒閉回路を構成する高温側冷媒回路と低温側冷媒回路とを備え、該低温側冷媒回路は、前記圧縮機、凝縮器、蒸発器、該蒸発器からの帰還冷媒が流通するように直列接続された複数の中間熱交換器及び複数の減圧装置を有し、複数種の冷媒からなる非共沸混合冷媒が封入され、前記凝縮器を経た冷媒中の凝縮冷媒を前記減圧装置を介して前記中間熱交換器に合流させ、該中間熱交換器で前記冷媒中の未凝縮冷媒を冷却することにより、順次より低い沸点の冷媒を凝縮させ、最終段の前記減圧装置を介して最低沸点の冷媒を前記蒸発器に流入させると共に、前記高温側冷媒回路の蒸発器と前記低温側冷媒回路の凝縮器とでカスケード熱交換器を構成し、前記低温側冷媒回路の蒸発器にて断熱箱体内に構成された貯蔵室を超低温に冷却して成る冷凍装置において、
前記断熱箱体の側方に構成されて前記各圧縮機が設置される機械室と、該機械室側に位置する前記断熱箱体の側壁に前後方向に延在して形成され、後方に開放する開口と、前記カスケード熱交換器及び前記各中間熱交換器の周囲を断熱材にて囲繞して成る断熱構造体とを備え、
前記カスケード熱交換器は、前記断熱構造体の一端に配設され、該断熱構造体内の機器と断熱構造体外の機器とを接続する配管は、前記カスケード熱交換器が配設される側とは反対側の一端側面に臨ませて配設されると共に、
前記断熱構造体は、前記カスケード熱交換器が配設されている側から前記開口内に挿脱可能に挿入されて前記断熱箱体の前記機械室側の側壁に配設されることを特徴とする冷凍装置。 - 前記開口に対応する前記断熱箱体の前記機械室側の側壁後部に切欠を形成したことを特徴とする請求項1に記載の冷凍装置。
- 前記断熱箱体は、真空断熱パネルと発泡断熱材との複合構成で形成されており、前記真空断熱パネルを、前記断熱箱体の前後壁及び前記機械室とは反対側の側壁内に配置したことを特徴とする請求項1又は請求項2に記載の冷凍装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006135287A JP5026736B2 (ja) | 2006-05-15 | 2006-05-15 | 冷凍装置 |
US12/300,700 US8826686B2 (en) | 2006-05-15 | 2007-05-14 | Refrigeration apparatus |
CN2007800177207A CN101443603B (zh) | 2006-05-15 | 2007-05-14 | 冷冻装置 |
KR1020087027846A KR101364381B1 (ko) | 2006-05-15 | 2007-05-14 | 냉동 장치 |
PCT/JP2007/059845 WO2007132804A1 (ja) | 2006-05-15 | 2007-05-14 | 冷凍装置 |
EP07743280.5A EP2019270B1 (en) | 2006-05-15 | 2007-05-14 | Refrigeration system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006135287A JP5026736B2 (ja) | 2006-05-15 | 2006-05-15 | 冷凍装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007303793A JP2007303793A (ja) | 2007-11-22 |
JP5026736B2 true JP5026736B2 (ja) | 2012-09-19 |
Family
ID=38693895
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006135287A Active JP5026736B2 (ja) | 2006-05-15 | 2006-05-15 | 冷凍装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8826686B2 (ja) |
EP (1) | EP2019270B1 (ja) |
JP (1) | JP5026736B2 (ja) |
KR (1) | KR101364381B1 (ja) |
CN (1) | CN101443603B (ja) |
WO (1) | WO2007132804A1 (ja) |
Cited By (2)
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WO2017033680A1 (ja) * | 2015-08-26 | 2017-03-02 | パナソニックヘルスケアホールディングス株式会社 | 超低温フリーザ |
WO2017033679A1 (ja) * | 2015-08-26 | 2017-03-02 | パナソニックヘルスケアホールディングス株式会社 | 超低温フリーザ |
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US8970028B2 (en) | 2011-12-29 | 2015-03-03 | Invensas Corporation | Embedded heat spreader for package with multiple microelectronic elements and face-down connection |
US9013033B2 (en) | 2011-04-21 | 2015-04-21 | Tessera, Inc. | Multiple die face-down stacking for two or more die |
US8823165B2 (en) | 2011-07-12 | 2014-09-02 | Invensas Corporation | Memory module in a package |
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US8513817B2 (en) | 2011-07-12 | 2013-08-20 | Invensas Corporation | Memory module in a package |
US8441111B2 (en) | 2011-10-03 | 2013-05-14 | Invensas Corporation | Stub minimization for multi-die wirebond assemblies with parallel windows |
US8659139B2 (en) | 2011-10-03 | 2014-02-25 | Invensas Corporation | Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate |
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2006
- 2006-05-15 JP JP2006135287A patent/JP5026736B2/ja active Active
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2007
- 2007-05-14 US US12/300,700 patent/US8826686B2/en active Active
- 2007-05-14 CN CN2007800177207A patent/CN101443603B/zh active Active
- 2007-05-14 WO PCT/JP2007/059845 patent/WO2007132804A1/ja active Application Filing
- 2007-05-14 EP EP07743280.5A patent/EP2019270B1/en active Active
- 2007-05-14 KR KR1020087027846A patent/KR101364381B1/ko active IP Right Grant
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017033680A1 (ja) * | 2015-08-26 | 2017-03-02 | パナソニックヘルスケアホールディングス株式会社 | 超低温フリーザ |
WO2017033679A1 (ja) * | 2015-08-26 | 2017-03-02 | パナソニックヘルスケアホールディングス株式会社 | 超低温フリーザ |
JPWO2017033679A1 (ja) * | 2015-08-26 | 2018-04-26 | パナソニックヘルスケアホールディングス株式会社 | 超低温フリーザ |
JPWO2017033680A1 (ja) * | 2015-08-26 | 2018-06-14 | Phcホールディングス株式会社 | 超低温フリーザ |
US10704808B2 (en) | 2015-08-26 | 2020-07-07 | Phc Holdings Corporation | Ultra-low temperature freezer |
Also Published As
Publication number | Publication date |
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CN101443603B (zh) | 2011-04-20 |
EP2019270A4 (en) | 2014-01-01 |
EP2019270B1 (en) | 2017-12-13 |
JP2007303793A (ja) | 2007-11-22 |
EP2019270A1 (en) | 2009-01-28 |
KR20090008341A (ko) | 2009-01-21 |
KR101364381B1 (ko) | 2014-02-17 |
WO2007132804A1 (ja) | 2007-11-22 |
US20090113917A1 (en) | 2009-05-07 |
US8826686B2 (en) | 2014-09-09 |
CN101443603A (zh) | 2009-05-27 |
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