JP2011086921A - 半導体装置及び半導体装置の作製方法 - Google Patents
半導体装置及び半導体装置の作製方法 Download PDFInfo
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- JP2011086921A JP2011086921A JP2010205011A JP2010205011A JP2011086921A JP 2011086921 A JP2011086921 A JP 2011086921A JP 2010205011 A JP2010205011 A JP 2010205011A JP 2010205011 A JP2010205011 A JP 2010205011A JP 2011086921 A JP2011086921 A JP 2011086921A
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/7869—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1222—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer
- H01L27/1225—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer with semiconductor materials not belonging to the group IV of the periodic table, e.g. InGaZnO
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Thin Film Transistor (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
- Manufacturing & Machinery (AREA)
- Liquid Crystal (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Drying Of Semiconductors (AREA)
- Electrodes Of Semiconductors (AREA)
- Weting (AREA)
- Formation Of Insulating Films (AREA)
- Recrystallisation Techniques (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Bipolar Transistors (AREA)
- Noodles (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010205011A JP2011086921A (ja) | 2009-09-16 | 2010-09-14 | 半導体装置及び半導体装置の作製方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
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| JP2009214485 | 2009-09-16 | ||
| JP2010205011A JP2011086921A (ja) | 2009-09-16 | 2010-09-14 | 半導体装置及び半導体装置の作製方法 |
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| JP2015173591A Division JP2016026386A (ja) | 2009-09-16 | 2015-09-03 | 半導体装置 |
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| JP2011086921A true JP2011086921A (ja) | 2011-04-28 |
| JP2011086921A5 JP2011086921A5 (fr) | 2013-10-31 |
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| JP2015173591A Withdrawn JP2016026386A (ja) | 2009-09-16 | 2015-09-03 | 半導体装置 |
| JP2017109991A Withdrawn JP2017152746A (ja) | 2009-09-16 | 2017-06-02 | 半導体装置 |
| JP2018187615A Active JP6758354B2 (ja) | 2009-09-16 | 2018-10-02 | 半導体装置の作製方法 |
| JP2020146728A Withdrawn JP2020194983A (ja) | 2009-09-16 | 2020-09-01 | 半導体装置 |
| JP2021190059A Withdrawn JP2022031780A (ja) | 2009-09-16 | 2021-11-24 | 表示装置 |
| JP2023185323A Pending JP2024016108A (ja) | 2009-09-16 | 2023-10-30 | 表示装置 |
| JP2023186247A Pending JP2024020259A (ja) | 2009-09-16 | 2023-10-31 | 表示装置 |
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| Application Number | Title | Priority Date | Filing Date |
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| JP2015173591A Withdrawn JP2016026386A (ja) | 2009-09-16 | 2015-09-03 | 半導体装置 |
| JP2017109991A Withdrawn JP2017152746A (ja) | 2009-09-16 | 2017-06-02 | 半導体装置 |
| JP2018187615A Active JP6758354B2 (ja) | 2009-09-16 | 2018-10-02 | 半導体装置の作製方法 |
| JP2020146728A Withdrawn JP2020194983A (ja) | 2009-09-16 | 2020-09-01 | 半導体装置 |
| JP2021190059A Withdrawn JP2022031780A (ja) | 2009-09-16 | 2021-11-24 | 表示装置 |
| JP2023185323A Pending JP2024016108A (ja) | 2009-09-16 | 2023-10-30 | 表示装置 |
| JP2023186247A Pending JP2024020259A (ja) | 2009-09-16 | 2023-10-31 | 表示装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (5) | US20110062433A1 (fr) |
| JP (8) | JP2011086921A (fr) |
| KR (9) | KR102246529B1 (fr) |
| TW (8) | TWI488305B (fr) |
| WO (1) | WO2011033915A1 (fr) |
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|---|---|---|---|---|
| JP2013030730A (ja) * | 2011-06-20 | 2013-02-07 | Sony Corp | 半導体素子およびその製造方法、表示装置ならびに電子機器 |
| WO2013042696A1 (fr) * | 2011-09-23 | 2013-03-28 | Semiconductor Energy Laboratory Co., Ltd. | Dispositif à semi-conducteurs |
| JP2013135003A (ja) * | 2011-12-23 | 2013-07-08 | Semiconductor Energy Lab Co Ltd | 半導体装置、及び半導体装置の作製方法 |
| JP2014103379A (ja) * | 2012-11-20 | 2014-06-05 | Samsung Display Co Ltd | 表示装置 |
| JP2014520396A (ja) * | 2011-06-08 | 2014-08-21 | シーブライト・インコーポレイテッド | 改善されたソース／ドレイン接点を有する金属酸化物薄膜トランジスタ |
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| JP2018046140A (ja) * | 2016-09-14 | 2018-03-22 | 株式会社ジャパンディスプレイ | 表示装置及びその製造方法 |
| KR101908383B1 (ko) | 2018-04-25 | 2018-12-11 | 삼성디스플레이 주식회사 | 유기발광표시장치 및 그 제조방법 |
| JP2019054260A (ja) * | 2012-12-25 | 2019-04-04 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
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