CN1230882C - 一种半导体器件的制造方法和一种半导体器件 - Google Patents

一种半导体器件的制造方法和一种半导体器件 Download PDF

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Publication number
CN1230882C
CN1230882C CNB011338032A CN01133803A CN1230882C CN 1230882 C CN1230882 C CN 1230882C CN B011338032 A CNB011338032 A CN B011338032A CN 01133803 A CN01133803 A CN 01133803A CN 1230882 C CN1230882 C CN 1230882C
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China
Prior art keywords
substrate
semiconductor device
pattern
strip
mold
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Expired - Lifetime
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CNB011338032A
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Chinese (zh)
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CN1360344A (zh
Inventor
高桥典之
铃木雅之
土屋孝司
松浦隆男
桥爪孝则
一谷昌弘
铃木一成
西田隆文
井村健一
三轮孝志
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Hitachi Ltd
Renesas Electronics Corp
Renesas Semiconductor Package and Test Solutions Co Ltd
Hitachi Solutions Technology Ltd
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Hitachi Ltd
Hitachi ULSI Systems Co Ltd
Hitachi Yonezawa Electronics Co Ltd
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Publication of CN1360344A publication Critical patent/CN1360344A/zh
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
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    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
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    • H01L2924/14—Integrated circuits
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
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    • H01L2924/20—Parameters
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    • H01L2924/20752—Diameter ranges larger or equal to 20 microns less than 30 microns
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  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
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TW526598B (en) 2003-04-01
US20050127535A1 (en) 2005-06-16
KR100551641B1 (ko) 2006-02-14
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CN1360344A (zh) 2002-07-24
JP3619773B2 (ja) 2005-02-16
US6872597B2 (en) 2005-03-29
US20040164428A1 (en) 2004-08-26
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SG92821A1 (en) 2002-11-19
US7015069B2 (en) 2006-03-21

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