KR100551641B1 - 반도체 장치의 제조 방법 및 반도체 장치 - Google Patents

반도체 장치의 제조 방법 및 반도체 장치 Download PDF

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KR100551641B1
KR100551641B1 KR1020010081051A KR20010081051A KR100551641B1 KR 100551641 B1 KR100551641 B1 KR 100551641B1 KR 1020010081051 A KR1020010081051 A KR 1020010081051A KR 20010081051 A KR20010081051 A KR 20010081051A KR 100551641 B1 KR100551641 B1 KR 100551641B1
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South Korea
Prior art keywords
substrate
semiconductor device
mold
semiconductor chips
conductor pattern
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Korean (ko)
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KR20020050148A (ko
Inventor
다까하시노리유끼
스즈끼마사유끼
쯔찌야고우지
마쯔우라다까오
하시즈메다까노리
이찌따니마사히로
스즈끼가즈나리
니시따다까후미
이무라겐이찌
미와다까시
Original Assignee
가부시키가이샤 히타치세이사쿠쇼
가부시기가이샤 히다치초엘에스아이시스템즈
히타치 요네자와 덴시 가부시키가이샤
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Publication of KR20020050148A publication Critical patent/KR20020050148A/ko
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    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
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CN1230882C (zh) 2005-12-07
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JP2002190488A (ja) 2002-07-05
CN1360344A (zh) 2002-07-24
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US6872597B2 (en) 2005-03-29
US20040164428A1 (en) 2004-08-26
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US7015069B2 (en) 2006-03-21

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