JP6044473B2 - 電子装置およびその電子装置の製造方法 - Google Patents
電子装置およびその電子装置の製造方法 Download PDFInfo
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- JP6044473B2 JP6044473B2 JP2013136894A JP2013136894A JP6044473B2 JP 6044473 B2 JP6044473 B2 JP 6044473B2 JP 2013136894 A JP2013136894 A JP 2013136894A JP 2013136894 A JP2013136894 A JP 2013136894A JP 6044473 B2 JP6044473 B2 JP 6044473B2
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- 238000000034 method Methods 0.000 title description 6
- 238000004519 manufacturing process Methods 0.000 title description 4
- 239000000758 substrate Substances 0.000 claims description 112
- 229920005989 resin Polymers 0.000 claims description 86
- 239000011347 resin Substances 0.000 claims description 86
- 229910000679 solder Inorganic materials 0.000 claims description 59
- 239000004020 conductor Substances 0.000 claims description 23
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 238000000465 moulding Methods 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 238000000748 compression moulding Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- -1 polybutylene terephthalate Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20127—Natural convection
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/34—Moulds having venting means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Description
図1〜図4を参照して、本発明の第1実施形態にかかる電子装置S1の全体構成について説明する。この電子装置S1は、例えば自動車などの車両に搭載され、車両用の各装置を駆動するための装置として適用される。
本発明の第2実施形態について説明する。本実施形態は、第1実施形態に対してソルダレジスト17の構造を変更したものであり、その他については第1実施形態と同様であるため、第1実施形態と異なる部分についてのみ説明する。
本発明の第3実施形態について説明する。本実施形態は、第1実施形態に対して他面12に形成される配線パターン形状およびソルダレジスト17の構造を変更したものであり、その他については第1実施形態と同様であるため、第1実施形態と異なる部分についてのみ説明する。
本発明の第4実施形態について説明する。本実施形態は、第3実施形態に対してエアベント16の周りに配置する導体パターン12aのレイアウトを変更したものであり、その他については第3実施形態と同様であるため、第3実施形態と異なる部分についてのみ説明する。
本発明は上記した実施形態に限定されるものではなく、特許請求の範囲に記載した範囲内において適宜変更が可能である。
11 一面
12 他面
12a 導体パターン
16 エアベント
17 ソルダレジスト
17a 開口部
17b 溝部
18 空間
20、30 電子部品
40 モールド樹脂
90 金型
Claims (3)
- 一面(11)および前記一面の反対面となる他面(12)とを有する基板(10)と、
前記基板の一面側に実装された電子部品(20、30)と、
前記基板の一面側に設けられ、前記電子部品を封止するモールド樹脂(40)と、を備え、
前記基板のうち前記モールド樹脂で覆われる位置に、該基板の一面と他面との間を貫通する貫通孔にて構成されたエアベント(16)が形成されていると共に、前記基板の他面は前記エアベントと対応する位置に開口部(17a)が形成されたソルダレジスト(17)で覆われており、該ソルダレジストによって前記エアベントの周囲が囲まれていて、
前記ソルダレジストには前記開口部に繋がる溝部(17b)が形成されていることを特徴とする電子装置。 - 一面(11)および前記一面の反対面となる他面(12)とを有する基板(10)と、
前記基板の一面側に実装された電子部品(20、30)と、
前記基板の一面側に設けられ、前記電子部品を封止するモールド樹脂(40)と、を備え、
前記基板のうち前記モールド樹脂で覆われる位置に、該基板の一面と他面との間を貫通する貫通孔にて構成されたエアベント(16)が形成されていると共に、前記基板の他面は前記エアベントと対応する位置に開口部(17a)が形成されたソルダレジスト(17)で覆われており、該ソルダレジストによって前記エアベントの周囲が囲まれていて、
前記基板の他面には、前記エアベントの周囲を1周全周を囲んで配置された導体パターン(12a)が形成されており、
前記ソルダレジストは、前記導体パターンを覆うことで、該導体パターンを覆っている部分が前記導体パターンを覆っていない部分よりも、前記基板の他面からの高さが高くされていることを特徴とする電子装置。 - 一面(11)および前記一面の反対面となる他面(12)とを有する基板(10)と、
前記基板の一面側に実装された電子部品(20、30)と、
前記基板の一面側に設けられ、前記電子部品を封止するモールド樹脂(40)と、を備え、
前記基板のうち前記モールド樹脂で覆われる位置に、該基板の一面と他面との間を貫通する貫通孔にて構成されたエアベント(16)が形成されていると共に、前記基板の他面は前記エアベントと対応する位置に開口部(17a)が形成されたソルダレジスト(17)で覆われており、該ソルダレジストによって前記エアベントの周囲が囲まれていて、
前記基板の他面には、前記エアベントの周囲を一部切り欠いた状態で囲む導体パターン(12a)が形成されており、
前記ソルダレジストは、前記導体パターンを覆うことで、該導体パターンを覆っている部分において前記導体パターンが切り欠かれた部分よりも、前記基板の他面からの高さが高くされていることを特徴とする電子装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013136894A JP6044473B2 (ja) | 2013-06-28 | 2013-06-28 | 電子装置およびその電子装置の製造方法 |
US14/392,135 US9795053B2 (en) | 2013-06-28 | 2014-06-17 | Electronic device and method for manufacturing the electronic device |
PCT/JP2014/003220 WO2014208044A1 (ja) | 2013-06-28 | 2014-06-17 | 電子装置およびその電子装置の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013136894A JP6044473B2 (ja) | 2013-06-28 | 2013-06-28 | 電子装置およびその電子装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
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JP2015009466A JP2015009466A (ja) | 2015-01-19 |
JP6044473B2 true JP6044473B2 (ja) | 2016-12-14 |
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Application Number | Title | Priority Date | Filing Date |
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JP2013136894A Expired - Fee Related JP6044473B2 (ja) | 2013-06-28 | 2013-06-28 | 電子装置およびその電子装置の製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9795053B2 (ja) |
JP (1) | JP6044473B2 (ja) |
WO (1) | WO2014208044A1 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6274058B2 (ja) * | 2014-09-22 | 2018-02-07 | 株式会社デンソー | 電子装置、及び電子装置を備えた電子構造体 |
JP6245204B2 (ja) * | 2015-03-17 | 2017-12-13 | トヨタ自動車株式会社 | ステータ及びステータの樹脂封止方法 |
DE112016005508B4 (de) * | 2015-12-03 | 2021-08-19 | Mitsubishi Electric Corporation | Halbleitereinrichtung |
US10954762B2 (en) | 2016-09-13 | 2021-03-23 | Schlumberger Technology Corporation | Completion assembly |
JP6693376B2 (ja) * | 2016-10-03 | 2020-05-13 | トヨタ自動車株式会社 | モータの製造方法 |
JP2019102485A (ja) * | 2017-11-28 | 2019-06-24 | 株式会社村田製作所 | 電子装置 |
JP2019145610A (ja) * | 2018-02-19 | 2019-08-29 | 株式会社デンソー | 電子装置 |
JP7252436B2 (ja) * | 2019-03-04 | 2023-04-05 | 株式会社翔栄 | 金型 |
JP7252437B2 (ja) * | 2019-03-04 | 2023-04-05 | 株式会社翔栄 | 樹脂成形品及び樹脂成形品の製造方法 |
CN110223992B (zh) * | 2019-06-27 | 2021-09-03 | 武汉华星光电半导体显示技术有限公司 | 显示面板、显示面板的成型模具及显示面板的制备方法 |
JP6960984B2 (ja) * | 2019-12-26 | 2021-11-05 | 三菱電機株式会社 | 電子装置及びその絶縁部材 |
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JPH07226414A (ja) * | 1994-02-10 | 1995-08-22 | Toshiba Corp | 半導体素子の樹脂封止方法および樹脂封止型半導体装置 |
US6228688B1 (en) | 1997-02-03 | 2001-05-08 | Kabushiki Kaisha Toshiba | Flip-chip resin-encapsulated semiconductor device |
US6324069B1 (en) * | 1997-10-29 | 2001-11-27 | Hestia Technologies, Inc. | Chip package with molded underfill |
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JP3619773B2 (ja) | 2000-12-20 | 2005-02-16 | 株式会社ルネサステクノロジ | 半導体装置の製造方法 |
JP2002270638A (ja) * | 2001-03-06 | 2002-09-20 | Nec Corp | 半導体装置および樹脂封止方法および樹脂封止装置 |
JP4626919B2 (ja) * | 2001-03-27 | 2011-02-09 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US6693239B2 (en) * | 2001-09-06 | 2004-02-17 | Delphi Technologies Inc. | Overmolded circuit board with underfilled surface-mount component and method therefor |
JP2003229443A (ja) | 2002-02-01 | 2003-08-15 | Hitachi Ltd | 半導体装置およびその製造方法 |
US6908784B1 (en) * | 2002-03-06 | 2005-06-21 | Micron Technology, Inc. | Method for fabricating encapsulated semiconductor components |
JP2004172647A (ja) * | 2004-03-11 | 2004-06-17 | Renesas Technology Corp | 半導体装置 |
TWI240397B (en) * | 2004-11-15 | 2005-09-21 | Advanced Semiconductor Eng | BGA package having substrate with exhaust function for molding |
JP4535969B2 (ja) * | 2005-08-24 | 2010-09-01 | 新光電気工業株式会社 | 半導体装置 |
JP5054440B2 (ja) * | 2007-06-15 | 2012-10-24 | 新光電気工業株式会社 | 電子部品内蔵基板の製造方法及び電子部品内蔵基板 |
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2013
- 2013-06-28 JP JP2013136894A patent/JP6044473B2/ja not_active Expired - Fee Related
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