CN102639924B - Led灯 - Google Patents
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/506—Cooling arrangements characterised by the adaptation for cooling of specific components of globes, bowls or cover glasses
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/75—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/78—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with helically or spirally arranged fins or blades
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/86—Ceramics or glass
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Chemical & Material Sciences (AREA)
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Abstract
一种发光装置(10),包括具有位于透光封套(14)内的基于LED的光源的至少基本上全向的照明组件。电子器件配置来驱动基于LED的光源,电子器件设置在阻挡角不大于45°的基座(16)内。多个散热元件(18)(诸如翅片)与基座热连通并邻近封套延伸。
Description
背景技术
下文涉及照明领域、发光领域、固态发光领域、及相关领域。
白炽灯和卤素灯在传统上用作全方位(omni-directional)定向光源。全方位等旨在提供相对于远离灯大于1米的远场中的角度基本上均匀的强度分布,并且发现多种应用,诸如台灯、桌灯、装饰灯、枝形吊灯、吸顶灯及其它应用,这些应用期望光在所有方向上均匀分布。
参照图1,描述了一种坐标系,该坐标系在本文用来描述由白炽灯(更通常地,用于产生全方位照明的任何灯)产生的照明的空间分布。该坐标系是球坐标系,参照白炽A-19式灯L示出。为了描述远场照明分布,可以认为灯L位于L0点,该点例如与白热灯丝的位置相一致。采用地理领域中所传统地使用的球坐标符号,通过高程或纬度坐标以及方位或经度坐标对照明方向进行描述。然而,与地理领域常规不同,本文所用的高程或纬度坐标范围为[0°,180°],其中:θ=0°对应于“地理北”或“N”。这样比较方便,因为其允许沿方向θ=0°的照明对应于前向光。北方,即方向θ=0°,在文中还被称为光轴。利用该符号,θ=180°对应于“地理南”或“S”,或者在照明环境下对应于后向光。高程或纬度θ=90°对应于“地理赤道”,或者在照明环境下对应于侧向光。
继续参照图1,对指定高程或纬度还可以限定方位或经度坐标其各处均与高程或纬度θ正交。依据地理符号,方位或经度坐标的范围为[0°,360°]。
应理解的是,正好在北方或南方,即在θ=0°或θ=180°时(换句话说,沿着光轴),方位或经度坐标没有任何意义,或者也许更准确地说,可以被认为退化。另一“特殊”坐标为θ=90°,其限定横向于光轴包含光源的平面(或者更准确地说,包含用于远场计算的光源的标称位置,例如点L0)。
在实践中,在整个纵向跨度上实现均匀的光强度通常来说不困难,因为其直接构造围绕光轴(即围绕轴线θ=0°)旋转对称的光源。例如,白炽灯L适于采用位于坐标中心L0的白热灯丝,其可设计来发出基本上全向的光,从而提供相对于方位θ对于任何纬度来说均均匀的强度分布。
然而,相对于高程或纬度坐标实现理想的全方向强度通常是不实际的。例如,灯L被构造成符合标准“爱迪生灯座”的灯具,为此目的,白炽灯L包括螺纹爱迪生灯座EB,其可以例如是E25、E26或E27灯座,其中数字表示基座EB上螺纹绕圈的用毫米表示的外径。爱迪生灯座EB(或更普遍地,位于光源“后面”的任何电力输入系统)位于光源位置L0“后面”的光轴上,并从而阻止向后发出的光(即沿南纬,也就是沿θ=180°阻止照明),并且因此白炽灯L不能相对于纬度坐标提供理想的全向光。
已构造商用白炽灯,例如60W Soft White(淡白)白炽灯(美国纽约通用电气),其提供在纬度跨度θ=[0°,135°]上的强度,该强度在如图2所示的纬度范围上的平均强度(线C)的±20%(区域D)内是均匀的。图示A示出了灯丝与光轴水平地对齐的情况下白炽灯的强度分布,并且图示B示出了灯丝与光轴对齐的情况下白炽灯的强度分布。虽然仍然对均匀性跨度感兴趣,例如θ=[0°,150°]的纬度跨度具有±10%的均匀性,但是普遍考虑的是全向灯的可接受的强度分布均匀性。这些均匀性跨度有效满足了LED灯的当前未决规定,诸如US DoE Energy Star Draft 2(美国能源部能源之星草案2)或US DoE Lighting Prize(美国能源部照明大奖)。
与白炽灯和卤素灯相比,例如发光二极管(LED)器件的固态发光技术本身是高度定向的,因为它们是仅从一侧发光的扁平器件。例如,具有封装或没有封装的LED器件通常以强度随θ=[0°,90°]范围内的cos(θ)变化的方向性朗伯(Lambertian)空间强度分布发光,并在θ>90°时具有零强度。半导体激光器本身甚至更具方向性,并且实际上发出基本上可称为限于约θ=0°的窄光锥的前向光束的分布。
与固体发光相关的另一挑战是与白热灯丝不同,利用标准110V或220V交流电源通常不能有效操作LED芯片或其他固体发光器件。相反,车载电子器件通常设置成将交流输入电源转换为适于驱动LED芯片的低电压直流电源。可替换地,足够数量的一连串LED芯片可以直接在110V或220V的电压下工作,并且具有合适极性控制(例如齐纳二极管)的这些串的并联布置可以在110V或220V交流电源下工作,虽然功率效率大幅降低。在任何一种情况下,与一体式白炽灯或卤素灯中所用的爱迪生灯座相比,电子器件构成灯座的附加部件。
固体发光的又一挑战是需要散热。LED器件与白炽灯或卤素灯相比在性能和可靠性方面对温度都高度敏感。这通过放置与LED器件接触或以其它方式良好热接触的大量散热材料(即散热器)来解决。由散热器所占用的空间阻碍了发光,并且因此进一步限制了产生全向基于LED的灯的能力。当LED灯受到限定所有灯部件(包括光源、电子器件、光学元件、及热管理件)的最大尺寸的当前调节限制(ANSI,NEMA等)的物理尺寸的限制时,该局限性被增强。
电子器件和散热器的组合形成了阻止“向后”照明的大型基座,这迄今明显限制了利用LED替换灯产生全向照明的能力。散热器尤其优选具有大容量以及大表面积,以便通过对流和辐射的组合将热量排出灯。
目前,作为白炽灯替代的大多数商用LED灯未提供类似于白炽灯的均匀强度分布。例如,半球元件可以放置在LED光源上方。由此产生的强度分布主要向上延伸,并且赤道以下只发出很少的光。明显地,这不会提供让人满意地模仿白炽灯的强度分布。
发明内容
本文公开了实施例作为说明性实例。在一个实施例中,发光装置包括围绕LED光源的透光封套。光源与散热基座元件热连通。多个表面积加强元件与基座元件热连通并沿一定方向延伸以使元件邻近发光封套。正确设计的表面加强元件将提供足够的热耗散,同时不会显著干扰来自于LED光源的光强度分布。
根据另一实施例,提供一种包括发光二极管光源的发光装置。发光二极管与基座元件热连通。基座元件的光阻挡角在15°至45°之间。多个表面积加强元件定位成与基座元件热连通并使装置的散热能力增加4倍并吸收小于10%的发光通量。
在另一实施例中,一种发光器件包括多个安装到金属芯印刷电路板(MCPCB)上,并且从金属芯印刷电路板接收电力的发光二极管。设置具有第一圆柱部和第二截头圆锥部的散热器,并且MCPCB与散热器的截头圆锥部热连通。爱迪生螺旋灯座设置成邻近散热器的圆柱部。电连接件设置在螺旋灯座(任何所需的电子器件包含在圆柱部中)与MCPCB之间。光漫射封套从散热器的截头圆锥部延伸,并包围发光二极管。优选地,至少四个导热翅片与散热器热连通并从散热器邻近封套延伸。翅片具有邻近散热器的第一相对较薄部分、邻近封套且远离散热器的第二相对较薄部分以及相对较厚的中间部分。有利地,该器件的尺寸被设计为满足ANSIC78.20-2003。
附图说明
本发明可采取各种部件及部件的布置、以及各种工艺操作及工艺操作的布置的形式。附图的目的仅用于示出实施例且不应被理解为限制本发明。
图1参照传统白炽灯泡示意地示出了本文用来描述照明分布的坐标系。
图2示出了白炽灯在各个纬度的强度分布。
图3示意地示出了本发明的灯。
图4是采用基于LED的平面朗伯光源和球封套外围翅片高镜面反射散热的基于LED的全向灯的侧视图。
图5是可替代的漫射散热的基于LED的全向灯的侧视图。
图6示意地示出了散热器阻碍从光源发出的光的物理阻挡角以及获得可接受光分布均匀性的截止角(cutoff angle)。
图7示出了与平面翅片的几何形状相关联的术语。
图8是利用示出光学光线路径的竖直平面翅片的示例性灯的示意顶部图。
图9示出了图5的全向基于LED的灯在不同纬度角度的光强度。
图10示出了围绕图4和5的灯的赤道的变化纵向角360°的光强度。
图11示出了围绕具有不同表面光洁度(镜面和漫反射)的12个导热翅片的示例性灯的变化纵向角360°的光强度的光学建模数据。
图12示出了表示表面镜面反射率依据纬度角对灯的强度分布的影响的光学光线跟踪建模数据。
图13示出了采用邻近含光源封套的导热翅片的散热器设计的可替换实施例。
图14示出了一优选实施例的可替换实施例,其中具有邻近光源的不同数量的表面积加强元件。
图15示出了增加导热翅片的数量对典型实施例的纬度角的光强度分布的影响。
图16示出了增加导热翅片的厚度对纵向强度分布的影响。
图17示出了表示散热器的阻挡角对设计截止角和强度均匀性的影响的光学光线跟踪建模数据。
图18示出了采用不同长度的导热翅片元件的散热器设计的实施例。
图19示出了采用不同数量和宽度的导热翅片且同时保持类似的散热表面积的散热器设计的实施例。
图20示出了采用不同宽度的导热翅片元件的散热器设计的实施例。
图21示出了采用不同厚度的导热翅片元件的散热器设计的实施例。
图22示出了采用销或非平面翅片形状的表面积加强元件的散热器设计的实施例。
图23示出了采用平面翅片形状的且与光轴相比以一定角度或曲率邻近光源的非竖直表面加强元件的散热器设计的实施例。
图24示出了围绕非球形封套的散热器设计的实施例。
图25示出了由优选实施例的光热限制形成的设计空间。
具体实施方式
LED替换灯的性能可以通过其有效寿命量化,如由光通维持寿命和可靠度与时间的关系确定。然而,白炽灯和卤素灯的寿命通常为1000至5000小时,LED灯可以为>25,000小时,并可能高达100,000小时或更长。
产生光子的半导体材料的p-n结的温度是确定LED灯寿命的重要因素。在大约100°C或更低的温度下获得较长的灯寿命,但在约150°C或更高温度下寿命严重缩短,中间温度下寿命逐渐变化。在大约2009年的典型高亮度LED的半导体材料(~1W,~50-100流明,~1×1平方毫米)中耗散的功率密度大约为100W/cm2。相比之下,在陶瓷金属卤化物(CMH)电弧管的陶瓷封套中耗散的功率通常大约为20-40W/cm2。然而,CMH灯中的陶瓷在其最热点处在大约1200-1400K下工作,LED器件的半导体材料应在大约400K或更低温度下工作,不管是否具有比CMH灯大2倍的较高功率密度。在CMH的情况下,灯中的热点与必须耗散功率的环境之间的温差大约为1000K,但在LED灯的情况下仅为约100K。相应地,对LED灯的热管理必须比典型的HID灯更有效十倍。
在设计散热器时,被动冷却热回路中的限制热阻抗通常为向环境空气的对流阻抗(即热量耗散到环境空气中)。对流阻抗通常与散热器的表面积成正比。在替换灯应用的情况下,当LED灯因为替换了传统爱迪生白炽灯而必须适合相同空间时,对暴露于环境空气的表面积的可利用量有固定的限制。因此,有利的是,尽可能多地使用该可利用表面积将热量耗散到环境中,例如在光源周围或附近放置导热翅片或其他散热结构。
该实施例涉及一种一体式替换LED灯,其中灯的输入为主电源,并且输出为所需的强度分布图,优选在灯的外部无辅助电子或光学部件。参照图3,基于LED的灯10包括基于LED的朗伯光源12以及透光球封套14。然而,应注意的是,“球形”在文中用来描述大致球形的形状。而且,应注意的是,其他形状也可提供类似有用的强度分布。此外,相对于球形的偏差被包含在该描述中,并且实际上在某些实施例中优选的是加强漫射器和散热器之间的相互作用。所示的透光球封套14优选具有漫射光的表面。在一些实施例中,球封套14为玻璃元件,但也可考虑诸如塑料或陶瓷的其他透光材料的漫射器。封套14可以固有地是漫射光的,或能够以不同方式使其漫射光,例如:进行消光(frosting)或其它纹理化处理促进光漫射;用光漫射涂层(如用作某些白炽灯泡的玻璃灯泡上的光漫射涂层的Soft White漫射涂层(可以从美国纽约通用电气公司获得))进行涂覆;将光漫射粒子嵌入到封套的玻璃、塑料、或其他材料中;上述方式的各种组合,等等。然而,应注意的是,基本上为非漫反射的封套也同样在本发明的范围内。此外,如果封套的内部采用了其他光漫射机构,则该设计参数是可行的。
封套14在光学上还可包括荧光层,荧光层例如涂覆在封套表面上的用于将来自于LED的光转化为另一种颜色,例如将来自于LED的蓝光或紫外(UV)光转化为白光。在一些这样的实施例中,可预料的是,荧光层为漫射器14的唯一构成。在这样的实施例中,荧光层可能是漫射荧光层。在其他可预料的实施例中,漫射器包括荧光层加上上述的附加漫射元素(诸如消光层、瓷漆、涂层等等)。可替换地,荧光层可能与LED封装相关联。
基于LED的朗伯光源12包括至少一个发光二极管(LED)器件,其在所示的实施例中包括具有混合以呈现出所需颜色温度和CRI的白光的各自光谱和强度的多个器件。例如,在一些实施例中,第一LED器件输出具有绿色再现的光(例如可利用涂覆有合适“白色”荧光层的发蓝光或紫光的LED芯片而实现的),并且第二LED器件输出红光(例如可利用自然发出红光的GaAsP或AIGaInP或其他外延LED芯片而实现的),并且来自于第一和第二LED器件的光混合在一起以产生改进的白光再现。换句话说,同样可预料的是,平面的基于LED的朗伯光源包括单个LED器件,该LED器件可以是白色LED器件或饱和色LED器件等等。同样可预料的是,激光LED器件并入该灯中。
在一个优选实施例中,透光球封套14包括开口部,该开口部的大小设计为容纳或配合基于LED的朗伯光源12,使得基于LED的朗伯光源12的发光原理表面面向并进入球封套14的内部并将光发射到球封套14的内部内。球封套与基于LED的朗伯光源12的面积相比较大。基于LED的朗伯光源12安装在开口部处或该开口部中,其中其发光表面设置成与球封套14的曲面大致相切。
基于LED的朗伯光源12安装在基座16上,该基座提供散热和用于容纳电子器件的空间。LED器件沿平面方向安装在电路板上,该电路板可选地为金属芯印刷电路板(MCPCB)。该基座元件16为LED器件提供支撑,并且导热(散热)。为了提供充分的散热,基座16与多个导热翅片18热连通。翅片18邻近球封套14朝向灯的北极延伸。翅片18可以由任何导热材料构成,优选具有高热导率的翅片,更优选易于制造的金属或合适的可模制塑料,并且尤其优选铸件或铝或铜。有利地,可以看出该设计提供一种适配于A-19白炽灯泡的ANSI轮廓(ANSI C78.20-2003)内的基于LED的光源。
现在参照图4-5,电子驱动器容纳在灯座20、22内,每个基座的平衡部(即,每个基座不被各个电子器件占据的部分)由散热材料制成。电子驱动器自身足以将爱迪生灯座23所接收的AC电源(例如,美国住宅和办公场所中的爱迪生灯座中传统上可利用类型的110伏AC,或欧洲住宅和办公场所中的爱迪生灯座中传统上可利用类型的220伏AC)转换成形式适宜的格式以驱动基于LED的光源。(还可预料的是,采用另一种类型的电连接器,诸如在欧洲有时用于白炽灯泡的卡口座)。
该灯进一步包括延伸部,该延伸部包括在球封套14的一部分上延伸以进一步增加由LED芯片产生的热量辐射和对流到周边环境的翅片24和26。虽然图4和5的翅片类似,但它们示出了各种设计如何达成所期望的结果。此外,翅片26比翅片24稍微更细长些并分别延伸到基座22和20的更深处。
散热基座的角度有助于保持光均匀分布于大角度(例如至少150°)。图6示出了限定附接到散热器上的典型LED的角度命名的示意图。在该实例中,漫射元件60均匀发光。散热器62以阻挡角α阻挡64阻碍发出的光,该阻挡角从光轴至散热器上的实质地阻碍从光源60的几何中心发出的光的点获取。由于散热器的实质阻碍,很难以小于α阻挡64的角度产生显著的强度。在实践中,存在截止角α截止66,散热器的实质阻碍在该点处的影响最小。
图17示出了根据变化α阻挡值的纬度角的强度分布。在135°的纬度角(等同于45°的α截止),23.6°、30°、36.4°和42.7°的α阻挡值的归一化强度分别为79%、78%、76%和72%,如图17中的H、I、J和K所示。这清楚地表明,当α阻挡接近α截止时,显著地降低了强度均匀性。对强度降低小于5%的实践限制而言,α阻挡应比所期望的α截止小10-15°,其由等式:α截 止=α阻挡+10°表示。45°的α截止的实例显然适用于其他α截止角和其他所期望的强度降低水平。对于A型(A-line like)LED灯的情况,如果截止角>35°,则难以在纬度角中具有高度均匀的强度分布(向前至向后发出的光)。另外,如果截止角太浅<15°,则灯中其余部分中没有足够的空间来容纳LED驱动器电子器件和灯座。20-30°的最佳角度有利于保持光分布均匀性,同时为灯中的实用元件保留空间。当前的LED灯提供0°至至少120°的均匀输出,优选135°,更优选150°。这是对传统A19白炽灯泡的良好替代。
需要使基座20、22更大以适应电子器件的体积,并提供充分散热,但该基座还优选地构造为最小化阻挡角,即由于其他灯部件(如电子器件、散热基座和导热翅片)的存在而显著改变的全向光分布的纬度角。例如,该角可以为135°或类似角度以提供类似于当前白炽光源的均匀光分布。通过应用用于基于LED的光源部28、30的且大小大致与基于LED的光源相同的较小接受区,并使侧边成一定角度、弯曲或以其它方式形成小于所期望的阻挡角的形状(优选利用截头圆锥形状),将这些不同考虑事项包括在各个基座20、22中。基座的侧边从基于LED的光源向外延伸一距离,该距离足以使这些侧边与基座部分32、34配合,所述基座部分的直径为足够大以容纳电子器件并且与合适的电气连接件配合。
散热器的光学特性对由此产生的光强度分布具有重大影响。当光碰撞表面时,其可以被吸收、被传输或被反射。就多数工程材料而言,对可见光来说可透过,并因此可见光可以被吸收或从表面反射。关注的光学效率、光学反射率和反射率在文中是指可见光的效率和反射率。表面的绝对反射率会影响灯的总体效率,并且会影响散热器对光源的内在光强度分布的干扰。虽然只有一小部分光源发出的光会碰到具有设置在光源周围的导热翅片的散热器,如果反射率非常低,则在这散热器表面上会丢失大量通量,并且降低了灯的总体效率。类似地,光强度分布受从光源发出的光的重定向和由散热器吸收的通量的影响。如果反射率保持在高水平,例如大于70%,则可使光强度分布的畸变(distortion)最小化。类似地,经向和纬向强度分布可以受散热器和表面加强元件的表面光洁度的影响。具有高镜面反射率(像镜子一样)的光滑平面使下层强度分布畸变的程度比漫反射(朗伯)表面小,因为光被沿入射角而不是垂直于散热器或导热翅片表面向外引导。
图8示出了典型灯实施例的顶部示意图。源的直径是指透光封套的直径或其他定义的最大直径。这将定义灯的发光区域的大小和与发出的光相互作用的散热器的表面加强元件的宽度或其他特征尺寸之间的关系。100%的发光通量离开透光封套。一部分与表面积加强元件和散热器相互作用。就平面导热翅片而言,这通常由导热翅片的数量、导热翅片的径向宽度、和透光封套的直径确定。碰撞散热器和表面积加强元件的一部分通量与散热器表面的光学反射率的乘积简单降低了总体效率。
散热材料的热性能对由灯系统耗散的总功率、以及LED器件和驱动电子器件产生的温度有很大影响。由于LED器件和驱动电子器件的性能和可靠性一般要受操作温度的限制,所以选择具有合适性能的散热材料至关重要。材料的热导率限定材料导热的能力。由于LED器件具有非常高的热量密度,所以用于LED器件的散热材料应优选具有高热导率,以便产生的热量能够快速离开LED器件。一般地,金属材料具有高热导率,其中常用的结构金属例如合金钢、挤制铝和铜的热导率分别为50W/m-K、170W/m-K和390W/m-K。高导热材料将允许更多热量从热负荷移至周围环境,并使热负荷的温升降低。
例如,在典型的散热器实施例中,如图4和5所示,为了耗散~8W的热负荷,与用作热源的高导热(390W/m-K)材料相比,就低热导率(50W/m-K)而言,与环境温度的温升的差值为高~8°C。其他材料类型也可用于散热用途。已说明了高热导率塑料、塑料复合物、陶瓷、陶瓷复合材料、诸如碳纳米管(CNT)或CNT复合物的纳米材料及其他材料具有有用范围内的热导率,并且等同于或超过铝的热导率。实际的考虑事项(诸如制造过程或成本)也可影响热性能。例如,铸铝(其在量大的情况下通常价格便宜)的热导率值大致是挤制铝的一半。考虑到制造的容易和成本,优选的是将一种散热材料用于多数散热器,但是,相同材料的铸造/挤制方法的组合或甚至将两种或更多种不同的散热材料结合到散热器结构中以最大化地冷却对本领域的技术人员来说是显而易见的。大致5-15微米的电磁辐射谱的远红外区域的发射率或辐射效率对于散热器表面来说也是重要性能。通常,非常有光泽的金属表面具有非常低的发射率,大约为0.0-0.2的级别。因此,涂层的种类或表面光洁度是可取的,例如漆层(0.7-0.95)或阳极氧化涂层(0.55-0.85)。散热器上的高发射率涂层比具有低发射率的裸金属表面散发的热量大约多40%。例如,在典型的散热器实施例中,如图4和5所示,为了耗散~10W的热负荷,与散热器上的高发射率(0.92)表面相比,就低发射率(0.02)而言,与环境温度的温升的差值为15°C。高发射率涂层的选择还必须考虑涂层的光学性能,因为如上所述,低反射率或低镜面反射率会对灯的总体效率和光分布产生负面影响。
翅片可以从“地理北”0°横向延伸至截止角的平面,并且超过截止角达到电子器件和灯座柱体的物理界限。只有位于“地理北”0°至截止角平面之间的翅实质上与发出的光分布在光学上进行相互作用。截止角下方的翅片具有有限的相互作用。翅片的光学相互作用取决于翅片的实际尺寸和表面性能两者。如图7所示,与光分布相互作用的翅片的实际尺寸以翅片的宽度、厚度、高度及数量的简单术语限定。翅片的宽度主要影响光分布的纬度均匀性,翅片的厚度主要影响光分布的经度均匀性,翅片的高度影响干扰了多少纬度均匀性,翅片的数量由于纬度和经度影响而主要确定发出的光的总减少量。在一般术语中,发出的光的相同部分在所有角度均与散热片相互作用。在功能术语中,为了保持源的现有光强度分布,由于翅片的宽度和厚度形成的光源的表面积应与它们包围的发光表面的表面积保持恒定比。
为了使纬度影响最小化,翅片的宽度理想地从在90°赤道处的最大值逐渐缩小为在“地理北”0°处的最小值以及在截止角平面处的分数比(fractional ratio)。然而,在功能方面,可要求优选的翅片宽度改变,以便不仅满足当前规章限制(ANSI、NEMA等)的灯构造轮廓,而且还满足消费者审美或制造约束。任何非理想的宽度都会对纬度强度分布并进而对照度分布产生负面影响。
基本上设计的平面导热翅片通常较薄以最大化表面积,并且沿纵向方向、即沿厚度方向,存在基本上有限的范围。换句话说,每个翅片基本上位于一平面内,并由此基本上不会对纵向强度分布的全向性质产生负面影响。光源的纬向周长与最大单个翅片厚度的比优选等于8:1或更大。为了进一步最大化表面积,可增加翅片的数量。在符合翅片厚度的前述优选比的同时,翅片的最大数量由于通过导热翅片的表面吸收和重定向光而通常由邻近南极的角度处的光学效率和强度水平的减小来限制。图15示出了在标称设计中翅片数量的增加在纬度角方在对强度均匀性的影响。例如,在从北极0°的135°的角处,对于8个、12个和16个导热翅片来说,强度为0°-135°的平均强度的79%、75%、和71%。其示出了翅片具有90%的光学反射率、50%的镜面表面。这种情况下,增加翅片的数量使每增加4个翅片总体光学效率降低~3%。该影响还由于散热器表面的固有反射率而倍增。
如前所述,翅片设置成用于散热。为了沿向上的光轴提供一些光,翅片通常具有较薄的端部,并且中间部相对较厚。对于保持均匀光强度分布来说还至关重要的是散热器的表面光洁度。可以选择从镜面(反射)改变至漫反射(朗伯)表面的表面光洁度范围。镜面设计可以是反射性的基础材料或所施加的高镜面反射率涂层。漫反射表面可以是在基础散热材料上的光洁表面、或可以是所施加的漆层或其他漫反射涂层。每个都具有一定的优点和缺点。例如,强反射表面具有保持光强度分布的能力,但由于裸金属表面的较低发射率而可能对导热不利。此外,在LED灯的通常为25,000-50,000小时的整个寿命期间也难以保持高度镜面。可替换地,具有漫反射表面的散热器与可比较的镜面相比具有降低的光强度分布均匀性。然而,在典型LED灯的整个寿命期间表面的保持性更稳定,并且还提供了类似于现有白炽全向光源的视觉外观。如上所述,与将增加散热器的散热能力的镜面相比,漫反射面还可能具有增加的发射率。优选地,涂层具有高度镜面反射率的表面以及高发射率,其实例为高度镜面反射性漆层、或者位于高度镜面反射性漆层或涂层之上的高发射率的涂层。
所期望的是,散发来自于LED的热量以保持LED的结温足够低以便保证长久寿命。令人意想不到的是,将多个薄导热翅片放置在发光源自身周围不会对纵向角的均匀光强度产生明显干扰。参照图16,示出了不同厚度的导热翅片对灯赤道的纵向强度分布的影响。该实施例具有8个翅片,具有80%的光学反射率、漫反射表面光洁度、及40mm直径的发光封套。均匀强度分布的畸变的大小可以用最小至最大峰值距离表征。就0.5mm厚的导热翅片的情况而言,畸变程度仅为±2%,而在6.5mm厚度时,畸变程度为±9%。中间值提供中间结果。此外,当大量光源的通量碰撞在散热器上时,总体光学效率还随着翅片厚度增加而降低,从0.5mm翅片厚度时的93%变为6.5mm时的76%。再者,中间值产生中间结果。当所期望的畸变水平小于±5%时,光源直径与翅片厚度之比必须保持在大约8:1的比率之上。同样,必须选择所期望的总体光学效率程度,通常大于80%,优选大于90%,这还限制了所期望的翅片厚度。例如,在A19的实施例中,导热翅片保持最大厚度,例如小于5.0毫米,优选小于3.5毫米,最优选在1.0至2.5毫米之间,以免阻挡光并同时仍然提供正确的表面积和截面积来用于散热。对于特定制造技术(诸如机加工、铸造、注射模制成型或该行业的其他技术),可能期望一最小厚度。形状优选为绕光源逐渐缩小,其中在0°(灯上方)处的宽度最小,以便不完全阻挡发出的光。导热翅片在散热器基座开始并且延伸至灯上方的0°之下的某些点,以免阻挡沿光轴的光,同时提供足够的表面积将来自于LED光源的所需数量的热量散发出来。该设计可以融合少量的大宽度导热翅片或大量的小宽度导热翅片,以满足热需求。导热翅片的数量一般由用来散发由灯中的LED光源和电子部件产生的热量所需的导热翅片表面积确定。例如,60W白炽替换LED灯可能会消耗大致10W的功率,该功率的大约80%必须通过散热器散发出来,以便将LED和电子部件保持在足够低的温度以保证长久寿命的产品。
需要高反射率(>70%)散热器表面。完全吸收型散热器(0%反射)表面可吸收标称设计中所发出光的大致30%,同时如果翅片具有80%-90%的反射率,大致1%被阻挡。由于LED灯的LED光源、光学材料、荧光层、封套、及散热材料之间通常存在多次反射,因此反射率对灯的总体光学效率具有倍增效应。散热器表面镜面反射也可以是有利的。镜面表面平滑了使导热翅片邻近球形漫射器产生的纵向强度分布中的峰值,而这些峰值即便在相同的总体效率下的漫反射表面时也较强。由于漫反射表面光洁度散热器中存在导热翅片干扰,大约±5%的峰值可以利用镜面散热器完全消除。如果纵向光强度分布的畸变程度保持在~10%(±5%)以下,人眼将感知到均匀的光分布。类似地,纬度角的强度分布也受益。5-10%的平均强度可以在灯下方的角度(例如135°-150°)处利用漫反射的镜面而获得。
现在参照图10,令人意想不到的是,示出了翅片对灯的纵向光强度分布的有限影响。在这种情况下,该设计由散热器组成,该散热器具有厚度为1.5mm的8个竖直平面翅片以及漫反射或镜面反射表面光洁度。两种设计中的翅片的径向宽度“W”与发光封套直径之比都为~1:4。图4和图5以图形方式表示了这些实施例。清楚地,θ=90°时光强度的变化对漫反射和镜面反射翅片两者来说在时都是最小的,如E处所示,对于漫反射导热翅片而言所测量强度方面具有±5%的偏差,并且当利用镜面反射翅片时偏差小于±2%。其示出了将合适尺寸的表面积加强元件放置在光源周围或附近以便在不干扰纵向光强度分布的情况下获得表面积的优点。此外,实践表明了基本上镜面表面光洁度与漫反射表面相比的优点。F处的强度的大幅减少是测量系统的人为现象。
图11示出了用于典型的8个翅片灯设计的光学建模结果。对完全镜面反射和漫反射翅片表面进行评估。利用光学光线跟踪建模在灯赤道周围的0-360°的纵向角中评估每种表面的强度分布。漫反射翅片表现出强度大约有±4%的变化,而镜面表现出几乎不变化。任何一种表面都可能提供均匀的光分布,而看出明显优选的是镜面或接近镜面光洁度的表面。
现在参照图12,示出了在与从典型LED灯发出的光相互作用的散热区域上应用镜面表面光洁度对于纬度角的光强度分布的均匀性的好处。示出了当与0-135°的平均强度相比时,邻近南极的角度(在该实例中,135°,用箭头标明)处的强度水平对与漫反射表面相比的镜面来说高23%。还示出了50%镜面和50%漫反射表面的强度分布,其在平均强度方面获取了全镜面反射表面的好处的大致一半。不能含蓄陈述表面的镜面反射率的影响,因为其具有有益于光强度分布的均匀性的双重作用。图上的点G限定了被称为强度分布的‘枢’点的点,该点名义上位于该设计的赤道上。当散热器表面的镜面反射率增加时,枢点北方的强度减小,并且枢点右方的强度增加。这降低了平均强度并增加了实现均匀性的向南的角。这对产生向下到达可能邻近南极的最大角的均匀强度分布来说至关重要。
再次参照图8,示出了当前灯设计的有效性。此外,如果设置有镜面(图2)或漫反射(图3)表面的翅片有效引导光,则用光线跟踪来表示。此外,可以看出,当将高反射率散热材料或涂层用于灯的实施例中时,可获得较高的总体光学效率。由于由漫反射LED光源所发出的光的仅一部分(~1/3)碰撞在散热器表面上,因此高反射率散热器表面将仅吸收从漫反射LED光源发出的总通量的一小部分(<5%)。
参照图9,可以看出,当前设计(图5)在邻近其南极处提供足够的光强度。图中的虚线示出在135°和150°(其为用于表征光强度分布的全向特性的有用角度)处测量数据的强度。此外,0°至135°视角范围的平均强度的变化不超过±10%,这将满足或超过多个独立可能的光强度均匀性要求。其也许会超过US DoE Energy Star提出的草案2的规范(在135°处为±20%)、以及与标准Soft White白炽灯(在135°处为±16%)性能的等效性,所述白炽灯是可利用的当前优选的全向光源。在150°视角处,±20%的变化也许会超过标准Soft White白炽灯的性能,并且几乎满足USDoE Bright Tomorrow Lighting Prize的要求(在150°处为±20%)。图9示出了当前灯设计实现该结果的有效性。
图13a-d示出了本公开范围内的另一优选翅片和封套设计。图13a示出了竖直导热翅片包围基本上球形的光漫射器的实施例。导热翅片朝向地理北逐渐缩小,并提供优选的光强度分布。图13b示出了竖直导热翅片仅延伸至透光封套的赤道的实施例。其提供了便于组装和制造的附加好处,因为LED光源和封套可以从散热器顶部(地理北)简单地插入且不是如图13a中那样完全被散热器包围。图13c示出了具有包围发光区域的更小部分的竖直导热翅片的透光封套。图13d示出了图13a和13b的组合,其中通过使竖直导热翅片延伸穿过赤道但与赤道相切来获得附加表面积,以便保留图13b的组装和制造好处。另外,图13b和13c示出了多种封套和光源形状周围的表面积加强元件的应用。
图14a-f示出了在本公开范围内添加附加表面积加强元件的影响。图14a和14d示出了具有8个竖直平面导热翅片的典型灯实施例的侧视图和顶视图。图14b和14e示出了具有12个竖直平面导热翅片的典型灯实施例的侧视图和顶视图。图14c和14f示出了具有16个竖直平面导热翅片的典型灯实施例的侧视图和顶视图。清楚地,通过暴露于周围环境的增加的表面积来增强利用较多数量的翅片的设计的散热能力,但以纬度角的光强度均匀性为代价,如前面图15中所示和所讨论的。一个特别有用的实施例可能是为了改变翅片的数量以解决美观或制造问题,而将导热翅片从完全竖直的方向移至远离光轴的角度θ。假设导热翅片具有相同的竖直高度,则它们具有比完全竖直翅片大1/cosθ倍的表面积。在这种情况下,翅片的数量可减少1/cos(θ)倍,并且该系统将具有大致相同的热性能或光学性能。
图18a-b示出了不同长度的表面积加强元件的可替换实施例。为了达到所需散热水平,可采用不同竖直长度和形状的导热翅片。例如,图18a示出了两种形状和长度的导热翅片,其中较短的一种为锥形且被设计成通过具有与灯发光面积成比例的表面积来使对光强度分布的干扰最小化。提供附加的散热表面积,而对光强度分布没有明显干扰。图18b示出了另一种增加表面积而基本上不降低光强均匀性的方法。如果在α截止下方增设附加的较短长度的导热翅片(参见图6),则对强度分布的影响将最小,但将为散热器添加表面积。
图19a-d示出了具有类似表面积但应用不同表面积加强元件的典型灯实施例的可替换实施例。图19a和19c示出了具有径向宽度大致为发光封套直径的1/6的16个竖直平面翅片的典型实施例的侧视图和顶视图。图19b和19d示出了具有径向宽度大致为发光封套的1/3的8个竖直平面翅片的典型灯实施例的侧视图和顶视图。明显的是,导热翅片的表面积、以及成比例的散热和光学效率在这两种情况下都是相同的。可能需要更大数量或更小数量的翅片来解决美观、制造或其他实际问题。还示出的是,更大量的较小宽度翅片可以在几何结构内部提供用于散热器、电子器件、光源、及光学元件提供更大的内部体积,例如白炽替换灯应用。
图20a-b示出了采用不同宽度的竖直平面导热翅片的组合的典型灯实施例的侧视图和顶视图。
图21a-b示出了采用沿其径向宽度具有不同厚度的导热翅片的典型灯实施例的侧视图和顶视图。诸如铸造、机加工、注射模制成型等的一些制造工艺可以通过具有所示的拔模角获益。由于平面翅片的表面积主要由翅片的径向宽度驱动,因此厚度的逐渐减小对散热、光学效率或光强度分布的影响最小。
图22示出了相对于实心翅片采用销和非平面翅片的灯实施例的侧视图和顶视图。销允许更大的表面积以便占据与翅片相同的等效体积,并且还有助于对流的热量流过导热翅片体积。利用穿过实心翅片的孔或狭槽可获得类似的好处,但这样的方法可能很难进行制造,尤其是难以利用某些金属铸造技术制造。类似地,条形结构、椭圆结构或具有比销大但片材或平面结构小的更细长横截面长宽比的结构也在本申请中适用。
图23示出了采用弯曲翅片的散热器设计的灯实施例的侧视图和顶视图。翅片可以从竖直轴线沿任意方向弯曲。对相同数量的翅片来说,弯曲翅片与完全竖直翅片相比具有增大的表面积。弯曲翅片的物理尺寸(厚度、宽度、高度)将影响光的经向和纬向分布,因为它们将占据竖直和水平空间且不象前述实施例具有竖直翅片一样是完全平面的。
图24示出了由导热翅片包围的长椭球形(图24a和c)、扁椭球形(图24b和d)的透光封套。可设想的是包括在非球形封套范围之内和之外的变化。
对大多数台灯或装饰浴室/枝形吊灯照明来说,环境温度可考虑为25°C,但40°C及更高的环境温度也是可以的,尤其是在封闭的照明器或吊灯使用中。即使环境温度上升,LED灯的结温T结温应保持在100°C以下以便满足可接受的性能。对所有LED来说,散热垫温度T垫与T结温之间存在热阻,通常为5°C~15°C。由于期望理想的T结温温度低于100°C,因此期望T垫温度低于85°C。现在参照图25,示出了40°C大气条件下10WLED灯(8W散热负荷)的LED垫温度T垫和光传输效率。另外,期望高光效率(低吸收)的均匀光强度分布。为了保持高的灯效率,通常期望的是对于给定设计最大化光效效率,优选大于80%,更优选大于90%。光强均匀性可以限定为在邻近南极的某些角度处与平均强度的偏差,优选全向灯在135°时为±20%。图4和5示出了用于图25的优选实施例的翅片形状。导热翅片厚度在0.5mm至2.5mm之间变化,并且导热翅片的数量在8至16之间变化,并测量热和光学响应。散热器表面反射率保持在85%,其为裸铝的平均值,并且表面的镜面反射率保持在75%。当翅片的厚度和数量增加时,T垫有利地降低,并且光传输效率不利地降低。相反,当翅片的厚度和数量减少时,T垫增加,并且光传输效率有利地增加。就该实施例而言,不带任何翅片的截头圆锥圆柱的表面积为~37cm2。如图4或5所示的每对翅片增加大致~27至30cm2的翅片表面积,同时在翅片附接的情况下使圆锥/圆柱表面积减少~1至2cm2。从无任何翅片的基础情况至厚度为1.5mm的8个翅片的标称情况,提供4倍(相对于~37cm2为~148cm2)的加强表面积,这提供了增加的散热能力,并能够使T垫温度达到~80°C,同时保持光传输效率大于90%。参照图25,该实施例的操作的优选区域由<85°C的T垫温度和>90%的光传输效率限定。该区域具有至少2倍的加强表面积,这使散热器的散热能力增加。同样示出的是80%的强度均匀性的界线。清楚地,对其他灯实施例来说,可以基于限制或扩大优选区域的具体应用来为T垫温度、光传输效率、或强度均匀性设置不同的界线。尽管确切的尺寸和物理限制可以改变,但是将比较热设计参数与光学设计参数之间的折衷,以限定可接受的设计极限。
已经说明和描述了优选实施例。显然,阅读并理解前述详细描述后可以进行修改、变化及组合。旨在本发明应被理解为包括在所附权利要求或其等同物范围内的所有这种修改及变化。
Claims (29)
1.一种发光装置,包括:透光封套;发光二极管光源,照明所述透光封套的内部,所述光源与散热器热连通,所述散热器包括基座元件以及多个表面积加强元件,所述表面积加强元件与所述基座元件热连通,使得所述表面积加强元件与从所述透光封套发出的光光连通,并且其中,所述基座元件包括邻近于所述透光封套且在所述透光封套外部的第一直径以及远离所述透光封套的第二直径,所述第一直径比所述第二直径窄,使得所述装置具有在0°至120°的视角范围内的小于±30%的平均光强度变化。
2.根据权利要求1所述的发光装置,具有全向性光强度分布。
3.根据权利要求1所述的装置,其中,所述表面积加强元件具有的表面是镜面的、漫射的或其组合。
4.根据权利要求1所述的装置,其中,所述表面积加强元件的表面积根据纬度角而变化以调节输出光强度分布。
5.根据权利要求1所述的装置,其中,所述表面积加强元件的数量根据纬度角而变化以调节输出光强度分布。
6.根据权利要求1所述的装置,其中,所述表面积加强元件包括从所述光源向外延伸的扁的平面翅片或扁的弯曲翅片、杆、或销。
7.根据权利要求1所述的装置,其中,所述表面积加强元件包括邻近所述基座元件的第一窄宽度部分、邻近所述封套的第二窄宽度部分以及中间相对较宽的宽度部分。
8.根据权利要求1所述的装置,其中,所述封套基本上为球状。
9.根据权利要求1所述的装置,其中,所述表面积加强元件的光反射为至少60%。
10.根据权利要求1所述的装置,其中,所述表面积加强元件的光反射为至少75%。
11.根据权利要求1所述的装置,其中,所述表面积加强元件的光反射为至少90%。
12.根据权利要求9所述的装置,其中,所述表面积加强元件至少具有至少0.5的IR发射率。
13.根据权利要求1所述的装置,其中,所述基座元件具有15°至45°之间的光阻挡角。
14.根据权利要求1所述的装置,其中,所述基座元件包括用于电连接件的基座。
15.根据权利要求14所述的装置,包括由所述基座元件包围的LED驱动电子器件。
16.根据权利要求1所述的装置,提供至少80%的光学效率。
17.根据权利要求1所述的装置,提供至少90%的光学效率。
18.根据权利要求1所述的装置,其中,所述表面积加强元件使所述散热器的散热能力增加至少2倍并吸收小于20%的发光通量。
19.根据权利要求1所述的装置,其中,所述表面积加强元件使所述散热器的散热能力增加至少3倍并吸收小于15%的发光通量。
20.根据权利要求1所述的装置,其中,所述表面积加强元件使所述散热器的散热能力增加至少4倍并吸收小于10%的发光通量。
21.根据权利要求1所述的装置,平均光强度在0°至135°的视角范围内存在小于±20%的变化。
22.根据权利要求6所述的装置,其中,所述透光封套的外直径与翅片厚度的比率大于8:1。
23.根据权利要求1所述的装置,其中,所述表面积加强元件包括翅片,所述翅片具有邻近所述封套的第一较小厚度以及邻近所述基座元件的第二较大厚度。
24.根据权利要求1所述的装置,其中,所述表面积加强元件包括翅片,所述翅片包括弧形外表面。
25.根据权利要求1所述的装置,其中,所述表面积加强元件具有超过50%的镜面反射率。
26.根据权利要求1所述的装置,包括至少四个表面积加强元件。
27.根据权利要求1所述的装置,其中,所述透光封套为漫射的。
28.根据权利要求1所述的装置,其中,所述发光装置的尺寸被设计为满足ANSI C78.20-2003。
29.一种发光装置,包括:基座元件,具有15°至45°之间的光阻挡角;发光二极管光源,与所述基座元件热连通;多个表面积加强元件,与所述基座元件热连通,其中所述表面积加强元件使所述装置的散热能力增加至少4倍并吸收小于10%的发光通量,所述装置的平均光强度在0°至135°的视角范围内存在小于±20%的变化。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/572,480 US8593040B2 (en) | 2009-10-02 | 2009-10-02 | LED lamp with surface area enhancing fins |
US12/572,480 | 2009-10-02 | ||
PCT/US2010/051043 WO2011041626A1 (en) | 2009-10-02 | 2010-10-01 | Led lamp |
Publications (2)
Publication Number | Publication Date |
---|---|
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CN102639924B true CN102639924B (zh) | 2015-10-07 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201080054757.9A Active CN102639924B (zh) | 2009-10-02 | 2010-10-01 | Led灯 |
Country Status (6)
Country | Link |
---|---|
US (2) | US8593040B2 (zh) |
EP (1) | EP2483592A1 (zh) |
KR (1) | KR101873601B1 (zh) |
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Families Citing this family (71)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10340424B2 (en) | 2002-08-30 | 2019-07-02 | GE Lighting Solutions, LLC | Light emitting diode component |
US20120195749A1 (en) | 2004-03-15 | 2012-08-02 | Airius Ip Holdings, Llc | Columnar air moving devices, systems and methods |
US9412926B2 (en) * | 2005-06-10 | 2016-08-09 | Cree, Inc. | High power solid-state lamp |
US9151295B2 (en) | 2008-05-30 | 2015-10-06 | Airius Ip Holdings, Llc | Columnar air moving devices, systems and methods |
US8616842B2 (en) * | 2009-03-30 | 2013-12-31 | Airius Ip Holdings, Llc | Columnar air moving devices, systems and method |
US8593040B2 (en) * | 2009-10-02 | 2013-11-26 | Ge Lighting Solutions Llc | LED lamp with surface area enhancing fins |
US9103507B2 (en) | 2009-10-02 | 2015-08-11 | GE Lighting Solutions, LLC | LED lamp with uniform omnidirectional light intensity output |
US20120306343A1 (en) * | 2010-02-08 | 2012-12-06 | Cheng-Kuang Wu | Light device |
US10359151B2 (en) * | 2010-03-03 | 2019-07-23 | Ideal Industries Lighting Llc | Solid state lamp with thermal spreading elements and light directing optics |
US8562161B2 (en) | 2010-03-03 | 2013-10-22 | Cree, Inc. | LED based pedestal-type lighting structure |
US9310030B2 (en) | 2010-03-03 | 2016-04-12 | Cree, Inc. | Non-uniform diffuser to scatter light into uniform emission pattern |
US9275979B2 (en) | 2010-03-03 | 2016-03-01 | Cree, Inc. | Enhanced color rendering index emitter through phosphor separation |
US9057511B2 (en) | 2010-03-03 | 2015-06-16 | Cree, Inc. | High efficiency solid state lamp and bulb |
US9062830B2 (en) * | 2010-03-03 | 2015-06-23 | Cree, Inc. | High efficiency solid state lamp and bulb |
US8632196B2 (en) | 2010-03-03 | 2014-01-21 | Cree, Inc. | LED lamp incorporating remote phosphor and diffuser with heat dissipation features |
US9316361B2 (en) | 2010-03-03 | 2016-04-19 | Cree, Inc. | LED lamp with remote phosphor and diffuser configuration |
US8882284B2 (en) | 2010-03-03 | 2014-11-11 | Cree, Inc. | LED lamp or bulb with remote phosphor and diffuser configuration with enhanced scattering properties |
US8729781B2 (en) | 2010-03-03 | 2014-05-20 | Koninklijke Philips N.V. | Electric lamp having reflector for transferring heat from light source |
US8931933B2 (en) * | 2010-03-03 | 2015-01-13 | Cree, Inc. | LED lamp with active cooling element |
US20110227102A1 (en) * | 2010-03-03 | 2011-09-22 | Cree, Inc. | High efficacy led lamp with remote phosphor and diffuser configuration |
US9500325B2 (en) * | 2010-03-03 | 2016-11-22 | Cree, Inc. | LED lamp incorporating remote phosphor with heat dissipation features |
US9625105B2 (en) * | 2010-03-03 | 2017-04-18 | Cree, Inc. | LED lamp with active cooling element |
US9024517B2 (en) | 2010-03-03 | 2015-05-05 | Cree, Inc. | LED lamp with remote phosphor and diffuser configuration utilizing red emitters |
US10240772B2 (en) | 2010-04-02 | 2019-03-26 | GE Lighting Solutions, LLC | Lightweight heat sinks and LED lamps employing same |
US8461748B1 (en) * | 2010-04-29 | 2013-06-11 | Lights Of America, Inc. | LED lamp |
CN201696925U (zh) * | 2010-05-27 | 2011-01-05 | 江苏史福特光电科技有限公司 | 一种led灯泡 |
TWM397474U (en) * | 2010-06-24 | 2011-02-01 | Jade Yang Co Ltd | Improved structure for LED (light emitting diode) lamp bulb |
US10451251B2 (en) | 2010-08-02 | 2019-10-22 | Ideal Industries Lighting, LLC | Solid state lamp with light directing optics and diffuser |
US8506105B2 (en) | 2010-08-25 | 2013-08-13 | Generla Electric Company | Thermal management systems for solid state lighting and other electronic systems |
US8487518B2 (en) * | 2010-12-06 | 2013-07-16 | 3M Innovative Properties Company | Solid state light with optical guide and integrated thermal guide |
US9068701B2 (en) | 2012-01-26 | 2015-06-30 | Cree, Inc. | Lamp structure with remote LED light source |
US9234655B2 (en) | 2011-02-07 | 2016-01-12 | Cree, Inc. | Lamp with remote LED light source and heat dissipating elements |
US11251164B2 (en) | 2011-02-16 | 2022-02-15 | Creeled, Inc. | Multi-layer conversion material for down conversion in solid state lighting |
US8922108B2 (en) * | 2011-03-01 | 2014-12-30 | Cree, Inc. | Remote component devices, systems, and methods for use with light emitting devices |
US8395310B2 (en) * | 2011-03-16 | 2013-03-12 | Bridgelux, Inc. | Method and apparatus for providing omnidirectional illumination using LED lighting |
RU2604660C2 (ru) | 2011-04-29 | 2016-12-10 | Конинклейке Филипс Н.В. | Светодиодное осветительное устройство с нижней теплорассеивающей конструкцией |
US20120307498A1 (en) * | 2011-06-03 | 2012-12-06 | Chung Wai Paul Lo | Light bulb with thermally conductive glass globe |
AU2012271641B2 (en) | 2011-06-15 | 2015-10-01 | Airius Ip Holdings, Llc | Columnar air moving devices and systems |
CA2838934C (en) | 2011-06-15 | 2016-08-16 | Airius Ip Holdings, Llc | Columnar air moving devices, systems and methods |
TWI439633B (zh) | 2011-06-24 | 2014-06-01 | Amtran Technology Co Ltd | 發光二極體燈源 |
DE102011083564A1 (de) * | 2011-09-27 | 2013-03-28 | Osram Gmbh | Led-lichtsystem mit verschiedenen leuchtstoffen |
US9222640B2 (en) * | 2011-10-18 | 2015-12-29 | Tsmc Solid State Lighting Ltd. | Coated diffuser cap for LED illumination device |
US9182082B2 (en) * | 2011-12-02 | 2015-11-10 | Boe Technology Group Co., Ltd. | LED-light heatsink and LED lamp |
US8944639B2 (en) * | 2011-12-14 | 2015-02-03 | Leroy E. Anderson | LED room light with multiple LEDs and radiator fins |
CN103307467B (zh) * | 2012-03-14 | 2017-04-26 | 欧司朗股份有限公司 | 照明装置 |
US9366422B2 (en) | 2012-03-22 | 2016-06-14 | Makersled Llc | Slotted heatsinks and systems and methods related thereto |
US9488359B2 (en) | 2012-03-26 | 2016-11-08 | Cree, Inc. | Passive phase change radiators for LED lamps and fixtures |
EP2839204B1 (en) | 2012-04-20 | 2016-12-14 | Philips Lighting Holding B.V. | Lighting device with smooth outer appearance |
US9587820B2 (en) | 2012-05-04 | 2017-03-07 | GE Lighting Solutions, LLC | Active cooling device |
US9500355B2 (en) | 2012-05-04 | 2016-11-22 | GE Lighting Solutions, LLC | Lamp with light emitting elements surrounding active cooling device |
CN103423721B (zh) * | 2012-05-14 | 2018-02-13 | 欧司朗股份有限公司 | 散热装置和具有该散热装置的照明装置 |
USD698916S1 (en) | 2012-05-15 | 2014-02-04 | Airius Ip Holdings, Llc | Air moving device |
US8864339B2 (en) | 2012-09-06 | 2014-10-21 | GE Lighting Solutions, LLC | Thermal solution for LED candelabra lamps |
WO2014037908A1 (en) | 2012-09-07 | 2014-03-13 | Koninklijke Philips N.V. | Lighting device with integrated lens heat sink |
US8764247B2 (en) | 2012-11-07 | 2014-07-01 | Palo Alto Research Center Incorporated | LED bulb with integrated thermal and optical diffuser |
CN103123104B (zh) * | 2013-02-05 | 2015-11-25 | 东莞汉旭五金塑胶科技有限公司 | 全周光投射的led散热灯座及其散热模组 |
US9310063B1 (en) * | 2013-03-12 | 2016-04-12 | Mark A. Lauer | Lighting device with fins that conduct heat and reflect light outward from light sources |
US9010966B2 (en) | 2013-08-22 | 2015-04-21 | Palo Alto Research Center Incorporated | Optical array for LED bulb with thermal optical diffuser |
US9702576B2 (en) | 2013-12-19 | 2017-07-11 | Airius Ip Holdings, Llc | Columnar air moving devices, systems and methods |
US10024531B2 (en) | 2013-12-19 | 2018-07-17 | Airius Ip Holdings, Llc | Columnar air moving devices, systems and methods |
US10221861B2 (en) | 2014-06-06 | 2019-03-05 | Airius Ip Holdings Llc | Columnar air moving devices, systems and methods |
US9401468B2 (en) | 2014-12-24 | 2016-07-26 | GE Lighting Solutions, LLC | Lamp with LED chips cooled by a phase transformation loop |
TWM508646U (zh) * | 2015-05-18 | 2015-09-11 | Unity Opto Technology Co Ltd | 軸對稱發光之led球泡燈 |
USD805176S1 (en) | 2016-05-06 | 2017-12-12 | Airius Ip Holdings, Llc | Air moving device |
USD820967S1 (en) | 2016-05-06 | 2018-06-19 | Airius Ip Holdings Llc | Air moving device |
US10487852B2 (en) | 2016-06-24 | 2019-11-26 | Airius Ip Holdings, Llc | Air moving device |
USD886275S1 (en) | 2017-01-26 | 2020-06-02 | Airius Ip Holdings, Llc | Air moving device |
USD885550S1 (en) | 2017-07-31 | 2020-05-26 | Airius Ip Holdings, Llc | Air moving device |
US10802182B2 (en) * | 2017-10-17 | 2020-10-13 | Intel Corporation | Technologies for enhancing contrast of an illumination marker |
USD887541S1 (en) | 2019-03-21 | 2020-06-16 | Airius Ip Holdings, Llc | Air moving device |
CA3136808A1 (en) | 2019-04-17 | 2020-10-22 | Airius Ip Holdings, Llc | Air moving device with bypass intake |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007037820A1 (de) * | 2007-08-10 | 2009-02-12 | Osram Gesellschaft mit beschränkter Haftung | LED-Lampe |
Family Cites Families (621)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1500912A (en) | 1923-10-23 | 1924-07-08 | Williams Lewis Garfield | Lamp for vehicle headlights and the like |
US1811782A (en) | 1929-12-31 | 1931-06-23 | Jr Thomas P Duncan | Light projector |
US3180981A (en) | 1961-10-12 | 1965-04-27 | Zeiss Ikon Ag | Air cooled projection lamp |
US3341689A (en) | 1965-03-24 | 1967-09-12 | Bruno E Reichenbach | Air heating and circulating device having an oscillating fan blade |
GB1423012A (en) | 1972-02-22 | 1976-01-28 | Northern Electric Co | Light emitting devices |
US4042522A (en) | 1975-03-24 | 1977-08-16 | Ciba-Geigy Corporation | Aqueous wetting and film forming compositions |
US4107238A (en) | 1976-01-22 | 1978-08-15 | Exxon Research & Engineering Co. | Graft copolymerization process |
US4120565A (en) | 1977-06-16 | 1978-10-17 | The United States Of America As Represented By The United States Department Of Energy | Prisms with total internal reflection as solar reflectors |
US4141941A (en) | 1977-09-21 | 1979-02-27 | American Optical Corporation | Contact lens casting method |
US4211955A (en) | 1978-03-02 | 1980-07-08 | Ray Stephen W | Solid state lamp |
US4337506A (en) | 1978-12-20 | 1982-06-29 | Terada James I | Adjustable lamp |
US4320268A (en) | 1980-02-19 | 1982-03-16 | General Electric Company | Illuminated keyboard for electronic devices and the like |
US4388678A (en) | 1980-10-14 | 1983-06-14 | Turner Wheeler M | Reading and viewing lamp |
US4506316A (en) | 1983-08-18 | 1985-03-19 | Gte Products Corporation | Par spot lamp |
US4562018A (en) | 1985-01-28 | 1985-12-31 | Neefe Charles W | Method of casting optical surfaces on lens blanks |
JPH0447976Y2 (zh) | 1985-07-04 | 1992-11-12 | ||
JPH0416447Y2 (zh) | 1985-07-22 | 1992-04-13 | ||
US4826424A (en) | 1985-09-25 | 1989-05-02 | Canon Kabushiki Kaisha | Lens barrel made by injection molding |
US5140220A (en) | 1985-12-02 | 1992-08-18 | Yumi Sakai | Light diffusion type light emitting diode |
JPH066960B2 (ja) | 1986-02-27 | 1994-01-26 | 日本電装株式会社 | 圧電フアン式送風装置 |
DE3762562D1 (de) | 1986-03-11 | 1990-06-07 | Philips Nv | Geblasener lampenkolben und mit einem solchen kolben versehene elektrische lampe. |
JPS6333879A (ja) | 1986-07-28 | 1988-02-13 | Mitsubishi Cable Ind Ltd | 発光ダイオ−ド構造物 |
GB2195047B (en) | 1986-08-13 | 1991-04-17 | Canon Kk | Flash device for camera |
JPS63126103A (ja) | 1986-11-15 | 1988-05-30 | 中松 義郎 | 光等放射線装置 |
US5753730A (en) | 1986-12-15 | 1998-05-19 | Mitsui Toatsu Chemicals, Inc. | Plastic lenses having a high-refractive index, process for the preparation thereof and casting polymerization process for preparing sulfur-containing urethane resin lens and lens prepared thereby |
US4803394A (en) | 1987-02-25 | 1989-02-07 | U.S. Philips Corporation | Lamp vessel for multiple lamp types |
JPH01233796A (ja) | 1988-03-14 | 1989-09-19 | Murata Mfg Co Ltd | 放熱器 |
US5132045A (en) | 1988-03-16 | 1992-07-21 | Mitsubishi Rayon Co., Ltd. | Acrylic phosphor paste compositions and phosphor coatings obtained therefrom |
CN1040810A (zh) | 1988-04-30 | 1990-03-28 | 三井东圧化学株式会社 | 多硫化合物基树脂透镜及其制备方法 |
US4988911A (en) | 1988-10-17 | 1991-01-29 | Miller Jack V | Lamp with improved photometric distribution |
ES2108208T3 (es) | 1988-11-02 | 1997-12-16 | British Tech Group | Moldeado por vaciado y envasado de lentes de contacto. |
US5027168A (en) | 1988-12-14 | 1991-06-25 | Cree Research, Inc. | Blue light emitting diode formed in silicon carbide |
US4918497A (en) | 1988-12-14 | 1990-04-17 | Cree Research, Inc. | Blue light emitting diode formed in silicon carbide |
US4992704A (en) | 1989-04-17 | 1991-02-12 | Basic Electronics, Inc. | Variable color light emitting diode |
US5087949A (en) | 1989-06-27 | 1992-02-11 | Hewlett-Packard Company | Light-emitting diode with diagonal faces |
US4966862A (en) | 1989-08-28 | 1990-10-30 | Cree Research, Inc. | Method of production of light emitting diodes |
US5055892A (en) | 1989-08-29 | 1991-10-08 | Hewlett-Packard Company | High efficiency lamp or light accepter |
US4972308A (en) | 1990-01-16 | 1990-11-20 | Chen I Ming | Innovated lamp fitting set without welding |
US5210051A (en) | 1990-03-27 | 1993-05-11 | Cree Research, Inc. | High efficiency light emitting diodes from bipolar gallium nitride |
US5110278A (en) | 1990-11-30 | 1992-05-05 | Pilkington Visioncare, Inc. | Injection molding apparatus for producing a toric lens casting mold arbor |
US5093576A (en) | 1991-03-15 | 1992-03-03 | Cree Research | High sensitivity ultraviolet radiation detector |
JP2572192Y2 (ja) | 1991-03-19 | 1998-05-20 | 株式会社シチズン電子 | チップ型発光ダイオード |
US5134550A (en) | 1991-06-28 | 1992-07-28 | Young Richard A | Indirect lighting fixture |
JPH05152609A (ja) | 1991-11-25 | 1993-06-18 | Nichia Chem Ind Ltd | 発光ダイオード |
US5335157A (en) | 1992-01-07 | 1994-08-02 | Whelen Technologies, Inc. | Anti-collision light assembly |
US5595440A (en) | 1992-01-14 | 1997-01-21 | Musco Corporation | Means and method for highly controllable lighting of areas or objects |
US5217600A (en) * | 1992-05-01 | 1993-06-08 | Mcdonnell Douglas Corporation | Process for producing a high emittance coating and resulting article |
US5405251A (en) | 1992-09-11 | 1995-04-11 | Sipin; Anatole J. | Oscillating centrifugal pump |
JP2822819B2 (ja) | 1992-11-09 | 1998-11-11 | 日亜化学工業株式会社 | 多色発光素子 |
JPH06177429A (ja) | 1992-12-08 | 1994-06-24 | Nichia Chem Ind Ltd | 青色led素子 |
CA2152678A1 (en) | 1992-12-31 | 1994-07-21 | Roger H. Appeldorn | Pole light having a programmable footprint |
JP2964822B2 (ja) | 1993-02-19 | 1999-10-18 | 日亜化学工業株式会社 | 発光ダイオードの製造方法 |
US5416342A (en) | 1993-06-23 | 1995-05-16 | Cree Research, Inc. | Blue light-emitting diode with high external quantum efficiency |
WO1995003935A1 (en) | 1993-07-27 | 1995-02-09 | Physical Optics Corporation | Light source destructuring and shaping device |
JP3448670B2 (ja) | 1993-09-02 | 2003-09-22 | 株式会社ニコン | 露光装置及び素子製造方法 |
US5526455A (en) | 1993-09-17 | 1996-06-11 | Sumitomo Electric Industries, Ltd. | Connector including opposing lens surfaces, side surfaces, and contact surfaces for coupling optical devices |
US5338944A (en) | 1993-09-22 | 1994-08-16 | Cree Research, Inc. | Blue light-emitting diode with degenerate junction structure |
US5393993A (en) | 1993-12-13 | 1995-02-28 | Cree Research, Inc. | Buffer structure between silicon carbide and gallium nitride and resulting semiconductor devices |
JPH07193281A (ja) | 1993-12-27 | 1995-07-28 | Mitsubishi Materials Corp | 指向性の少ない赤外可視変換発光ダイオード |
JP2596709B2 (ja) | 1994-04-06 | 1997-04-02 | 都築 省吾 | 半導体レーザ素子を用いた照明用光源装置 |
CA2134902C (en) | 1994-04-07 | 2000-05-16 | Friedrich Bertignoll | Light diffusing apparatus |
US5416683A (en) | 1994-05-25 | 1995-05-16 | Kenall Manufacturing Co. | Drop dish lighting fixture with rectangular beam pattern |
US5632551A (en) | 1994-07-18 | 1997-05-27 | Grote Industries, Inc. | LED vehicle lamp assembly |
US5561346A (en) | 1994-08-10 | 1996-10-01 | Byrne; David J. | LED lamp construction |
US5899557A (en) | 1994-08-11 | 1999-05-04 | Mcdermott; Kevin | Multi-source lighting device |
US5604135A (en) | 1994-08-12 | 1997-02-18 | Cree Research, Inc. | Method of forming green light emitting diode in silicon carbide |
ES2153488T3 (es) * | 1994-08-29 | 2001-03-01 | Koninkl Philips Electronics Nv | Lampara reflectora electrica. |
US5523589A (en) | 1994-09-20 | 1996-06-04 | Cree Research, Inc. | Vertical geometry light emitting diode with group III nitride active layer and extended lifetime |
US5631190A (en) | 1994-10-07 | 1997-05-20 | Cree Research, Inc. | Method for producing high efficiency light-emitting diodes and resulting diode structures |
JP2829567B2 (ja) | 1994-11-21 | 1998-11-25 | スタンレー電気株式会社 | チップマウント型led |
JPH08162676A (ja) | 1994-12-02 | 1996-06-21 | Nichia Chem Ind Ltd | 発光ダイオード |
US5660461A (en) | 1994-12-08 | 1997-08-26 | Quantum Devices, Inc. | Arrays of optoelectronic devices and method of making same |
US5477430A (en) | 1995-03-14 | 1995-12-19 | Delco Electronics Corporation | Fluorescing keypad |
US5739554A (en) | 1995-05-08 | 1998-04-14 | Cree Research, Inc. | Double heterojunction light emitting diode with gallium nitride active layer |
JPH08330635A (ja) | 1995-05-30 | 1996-12-13 | Canon Inc | 発光装置 |
EP0751339A3 (en) | 1995-06-30 | 1998-05-06 | CUNNINGHAM, David W. | Lighting fixture having a cast reflector |
JPH0950728A (ja) | 1995-08-07 | 1997-02-18 | Fuji Polymertech Kk | 照光式スイッチ |
KR100326496B1 (ko) | 1995-11-08 | 2002-05-09 | 추후제출 | 무선통신모듈및그제조방법 |
US5688042A (en) | 1995-11-17 | 1997-11-18 | Lumacell, Inc. | LED lamp |
US6141034A (en) | 1995-12-15 | 2000-10-31 | Immersive Media Co. | Immersive imaging method and apparatus |
US5812717A (en) | 1996-01-18 | 1998-09-22 | Methode Electronics, Inc. | Optical package with alignment means and method of assembling an optical package |
JP3264615B2 (ja) | 1996-02-29 | 2002-03-11 | ホーヤ株式会社 | プラスチックレンズの射出成形方法 |
JPH09246603A (ja) | 1996-03-08 | 1997-09-19 | Nichia Chem Ind Ltd | 発光ダイオード及びそれを用いた表示装置 |
US6600175B1 (en) | 1996-03-26 | 2003-07-29 | Advanced Technology Materials, Inc. | Solid state white light emitter and display using same |
FI100205B (fi) | 1996-05-03 | 1997-10-15 | Aki Tukia | Lipputangon valaisin |
JP3009626B2 (ja) | 1996-05-20 | 2000-02-14 | 日吉電子株式会社 | Led発光球 |
DE19638667C2 (de) | 1996-09-20 | 2001-05-17 | Osram Opto Semiconductors Gmbh | Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
CN1534803B (zh) | 1996-06-26 | 2010-05-26 | 奥斯兰姆奥普托半导体股份有限两合公司 | 具有发光变换元件的发光半导体器件 |
TW383508B (en) | 1996-07-29 | 2000-03-01 | Nichia Kagaku Kogyo Kk | Light emitting device and display |
JP2927279B2 (ja) | 1996-07-29 | 1999-07-28 | 日亜化学工業株式会社 | 発光ダイオード |
US5858227A (en) | 1996-09-23 | 1999-01-12 | Parker-Hannifin Corporation | Fuel filter assembly with in-line valve |
US5851063A (en) | 1996-10-28 | 1998-12-22 | General Electric Company | Light-emitting diode white light source |
JPH10145476A (ja) | 1996-11-08 | 1998-05-29 | Casio Comput Co Ltd | 表示部及び操作部付き電子機器 |
US6274890B1 (en) | 1997-01-15 | 2001-08-14 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device and its manufacturing method |
US6517213B1 (en) | 1997-03-31 | 2003-02-11 | Idec Izumi Corporation | Indicator device and illumination device |
JP3167641B2 (ja) | 1997-03-31 | 2001-05-21 | 和泉電気株式会社 | Led球 |
US5850126A (en) | 1997-04-11 | 1998-12-15 | Kanbar; Maurice S. | Screw-in led lamp |
JP3378465B2 (ja) | 1997-05-16 | 2003-02-17 | 株式会社東芝 | 発光装置 |
US5813753A (en) | 1997-05-27 | 1998-09-29 | Philips Electronics North America Corporation | UV/blue led-phosphor device with efficient conversion of UV/blues light to visible light |
US5882553A (en) | 1997-06-09 | 1999-03-16 | Guide Corporation | Multi-color lens assembly injection molding process and apparatus |
AU8140698A (en) | 1997-06-30 | 1999-01-19 | Bausch & Lomb Incorporated | Injection molding process for rotationally asymmetric contact lens surfaces |
US6806659B1 (en) | 1997-08-26 | 2004-10-19 | Color Kinetics, Incorporated | Multicolored LED lighting method and apparatus |
US6016038A (en) | 1997-08-26 | 2000-01-18 | Color Kinetics, Inc. | Multicolored LED lighting method and apparatus |
US7161313B2 (en) | 1997-08-26 | 2007-01-09 | Color Kinetics Incorporated | Light emitting diode based products |
US7352339B2 (en) | 1997-08-26 | 2008-04-01 | Philips Solid-State Lighting Solutions | Diffuse illumination systems and methods |
US5962971A (en) | 1997-08-29 | 1999-10-05 | Chen; Hsing | LED structure with ultraviolet-light emission chip and multilayered resins to generate various colored lights |
US6340824B1 (en) | 1997-09-01 | 2002-01-22 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device including a fluorescent material |
US6201262B1 (en) | 1997-10-07 | 2001-03-13 | Cree, Inc. | Group III nitride photonic devices on silicon carbide substrates with conductive buffer interlay structure |
DE19755734A1 (de) | 1997-12-15 | 1999-06-24 | Siemens Ag | Verfahren zur Herstellung eines oberflächenmontierbaren optoelektronischen Bauelementes |
US6105177A (en) | 1997-12-26 | 2000-08-22 | Paulson Manufacturing Corp. | Protective goggles |
JP3241338B2 (ja) | 1998-01-26 | 2001-12-25 | 日亜化学工業株式会社 | 半導体発光装置 |
DE19803936A1 (de) | 1998-01-30 | 1999-08-05 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Ausdehnungskompensiertes optoelektronisches Halbleiter-Bauelement, insbesondere UV-emittierende Leuchtdiode und Verfahren zu seiner Herstellung |
US6252254B1 (en) | 1998-02-06 | 2001-06-26 | General Electric Company | Light emitting device with phosphor composition |
US6294800B1 (en) | 1998-02-06 | 2001-09-25 | General Electric Company | Phosphors for white light generation from UV emitting diodes |
JP3541709B2 (ja) | 1998-02-17 | 2004-07-14 | 日亜化学工業株式会社 | 発光ダイオードの形成方法 |
EP0942474B1 (de) | 1998-03-11 | 2006-04-19 | Siemens Aktiengesellschaft | Leuchtdiode |
JP3618221B2 (ja) | 1998-04-13 | 2005-02-09 | 日亜化学工業株式会社 | 発光装置 |
JP2001035239A (ja) | 1998-06-08 | 2001-02-09 | System Denki Sangyo Kk | 照明器具 |
US6142652A (en) | 1998-06-15 | 2000-11-07 | Richardson; Brian Edward | Color filter module for projected light |
JP2907286B1 (ja) | 1998-06-26 | 1999-06-21 | サンケン電気株式会社 | 蛍光カバーを有する樹脂封止型半導体発光装置 |
US5959316A (en) | 1998-09-01 | 1999-09-28 | Hewlett-Packard Company | Multiple encapsulation of phosphor-LED devices |
US6335548B1 (en) | 1999-03-15 | 2002-01-01 | Gentex Corporation | Semiconductor radiation emitter package |
JP3490906B2 (ja) | 1998-09-22 | 2004-01-26 | 日亜化学工業株式会社 | 半導体装置及びその製造方法 |
JP2000101148A (ja) | 1998-09-25 | 2000-04-07 | Rohm Co Ltd | 発光ダイオ−ド |
EP1046196B9 (en) | 1998-09-28 | 2013-01-09 | Koninklijke Philips Electronics N.V. | Lighting system |
US6404125B1 (en) | 1998-10-21 | 2002-06-11 | Sarnoff Corporation | Method and apparatus for performing wavelength-conversion using phosphors with light emitting diodes |
US6309054B1 (en) | 1998-10-23 | 2001-10-30 | Hewlett-Packard Company | Pillars in a printhead |
US6204523B1 (en) | 1998-11-06 | 2001-03-20 | Lumileds Lighting, U.S., Llc | High stability optical encapsulation and packaging for light-emitting diodes in the green, blue, and near UV range |
JP4306846B2 (ja) | 1998-11-20 | 2009-08-05 | 株式会社朝日ラバー | 照明装置 |
US6391231B1 (en) | 1998-11-23 | 2002-05-21 | Younger Mfg. Co. | Method for side-fill lens casting |
AUPP729298A0 (en) | 1998-11-24 | 1998-12-17 | Showers International Pty Ltd | Housing and mounting system for a strip lighting device |
US6177688B1 (en) | 1998-11-24 | 2001-01-23 | North Carolina State University | Pendeoepitaxial gallium nitride semiconductor layers on silcon carbide substrates |
DE19854899C1 (de) | 1998-11-27 | 1999-12-30 | Siemens Ag | Beleuchtungseinheit |
US6429583B1 (en) | 1998-11-30 | 2002-08-06 | General Electric Company | Light emitting device with ba2mgsi2o7:eu2+, ba2sio4:eu2+, or (srxcay ba1-x-y)(a1zga1-z)2sr:eu2+phosphors |
EP1009017A3 (en) | 1998-12-07 | 2001-04-04 | Matsushita Electric Industrial Co., Ltd. | Fluorescent lamp |
JP3667125B2 (ja) | 1998-12-07 | 2005-07-06 | 日亜化学工業株式会社 | 光半導体装置とその製造方法 |
JP3613041B2 (ja) | 1998-12-16 | 2005-01-26 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
US6373188B1 (en) | 1998-12-22 | 2002-04-16 | Honeywell International Inc. | Efficient solid-state light emitting device with excited phosphors for producing a visible light output |
JP3366586B2 (ja) | 1998-12-28 | 2003-01-14 | 日亜化学工業株式会社 | 発光ダイオード |
JP4680334B2 (ja) | 1999-01-13 | 2011-05-11 | 株式会社朝日ラバー | 発光装置 |
US6683325B2 (en) | 1999-01-26 | 2004-01-27 | Patent-Treuhand-Gesellschaft-für Elektrische Glühlampen mbH | Thermal expansion compensated opto-electronic semiconductor element, particularly ultraviolet (UV) light emitting diode, and method of its manufacture |
US6680569B2 (en) | 1999-02-18 | 2004-01-20 | Lumileds Lighting U.S. Llc | Red-deficiency compensating phosphor light emitting device |
US6351069B1 (en) | 1999-02-18 | 2002-02-26 | Lumileds Lighting, U.S., Llc | Red-deficiency-compensating phosphor LED |
US6329676B1 (en) | 1999-03-01 | 2001-12-11 | Toru Takayama | Flat panel solid state light source |
US6155699A (en) | 1999-03-15 | 2000-12-05 | Agilent Technologies, Inc. | Efficient phosphor-conversion led structure |
WO2000057490A1 (de) | 1999-03-19 | 2000-09-28 | Eurolight Illumination Technologies Gmbh | Leuchte |
US6218785B1 (en) | 1999-03-19 | 2001-04-17 | Incerti & Simonini Di Incerti Edda & C. S.N.C. | Low-tension lighting device |
JP2000304908A (ja) | 1999-04-20 | 2000-11-02 | Matsushita Electric Works Ltd | 導光制御素子 |
JP2000315824A (ja) | 1999-04-30 | 2000-11-14 | Runaraito Kk | 発光ダイオードおよびその製造方法 |
JP2000315822A (ja) | 1999-04-30 | 2000-11-14 | Runaraito Kk | 発光ダイオードおよびその製造方法 |
US6222207B1 (en) | 1999-05-24 | 2001-04-24 | Lumileds Lighting, U.S. Llc | Diffusion barrier for increased mirror reflectivity in reflective solderable contacts on high power LED chip |
US6193392B1 (en) | 1999-05-27 | 2001-02-27 | Pervaiz Lodhie | Led array with a multi-directional, multi-functional light reflector |
JP2003501793A (ja) | 1999-06-03 | 2003-01-14 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | ランプ/リフレクタユニット |
JP3690968B2 (ja) | 1999-06-30 | 2005-08-31 | 日亜化学工業株式会社 | 発光装置及びその形成方法 |
US6367949B1 (en) | 1999-08-04 | 2002-04-09 | 911 Emergency Products, Inc. | Par 36 LED utility lamp |
JP2001053341A (ja) | 1999-08-09 | 2001-02-23 | Kazuo Kobayashi | 面発光表示器 |
JP3798195B2 (ja) | 1999-08-12 | 2006-07-19 | ローム株式会社 | チップ型発光装置 |
JP2001057445A (ja) | 1999-08-19 | 2001-02-27 | Rohm Co Ltd | 発光ダイオ−ド |
JP3833019B2 (ja) | 1999-08-31 | 2006-10-11 | 日亜化学工業株式会社 | 発光ダイオード |
US6504301B1 (en) | 1999-09-03 | 2003-01-07 | Lumileds Lighting, U.S., Llc | Non-incandescent lightbulb package using light emitting diodes |
US6227679B1 (en) | 1999-09-16 | 2001-05-08 | Mule Lighting Inc | Led light bulb |
JP4326086B2 (ja) | 1999-10-04 | 2009-09-02 | 株式会社イノアックコーポレーション | ヒートシンクの製造方法 |
JP2001111115A (ja) | 1999-10-12 | 2001-04-20 | Rohm Co Ltd | 半導体発光装置 |
US7079367B1 (en) | 1999-11-04 | 2006-07-18 | Abb Technology Ag | Electric plant and method and use in connection with such plant |
JP3175739B2 (ja) | 1999-11-08 | 2001-06-11 | 日亜化学工業株式会社 | 面状光源 |
JP2001144334A (ja) | 1999-11-17 | 2001-05-25 | Nichia Chem Ind Ltd | 光半導体装置及び形成方法 |
US7202506B1 (en) | 1999-11-19 | 2007-04-10 | Cree, Inc. | Multi element, multi color solid state LED/laser |
US6350041B1 (en) | 1999-12-03 | 2002-02-26 | Cree Lighting Company | High output radial dispersing lamp using a solid state light source |
JP3685057B2 (ja) | 1999-12-08 | 2005-08-17 | 日亜化学工業株式会社 | Ledランプ及びその製造方法 |
JP2001173239A (ja) | 1999-12-16 | 2001-06-26 | Nippon Kayaku Co Ltd | 補修剤注入用プラグ |
TW457731B (en) | 1999-12-29 | 2001-10-01 | Taiwan Oasis Entpr Co Ltd | Structure and manufacturing method of a light emitting diode |
US6626557B1 (en) | 1999-12-29 | 2003-09-30 | Spx Corporation | Multi-colored industrial signal device |
US6504171B1 (en) | 2000-01-24 | 2003-01-07 | Lumileds Lighting, U.S., Llc | Chirped multi-well active region LED |
US6796680B1 (en) | 2000-01-28 | 2004-09-28 | Lumileds Lighting U.S., Llc | Strip lighting |
JP3802724B2 (ja) | 2000-01-31 | 2006-07-26 | ローム株式会社 | 発光表示装置およびその製法 |
JP2001218378A (ja) | 2000-01-31 | 2001-08-10 | Oki Electric Ind Co Ltd | 電池充電装置 |
US6305821B1 (en) | 2000-02-08 | 2001-10-23 | Gen-Home Technology Co., Ltd. | Led lamp having ball-shaped light diffusing modifier |
DE10006738C2 (de) | 2000-02-15 | 2002-01-17 | Osram Opto Semiconductors Gmbh | Lichtemittierendes Bauelement mit verbesserter Lichtauskopplung und Verfahren zu seiner Herstellung |
JP2001237462A (ja) | 2000-02-22 | 2001-08-31 | Sanyo Electric Co Ltd | Led発光装置 |
DE10008203B4 (de) | 2000-02-23 | 2008-02-07 | Vishay Semiconductor Gmbh | Verfahren zum Herstellen elektronischer Halbleiterbauelemente |
JP2001243807A (ja) | 2000-02-28 | 2001-09-07 | Mitsubishi Electric Lighting Corp | Led電球 |
JP2001243809A (ja) | 2000-02-28 | 2001-09-07 | Mitsubishi Electric Lighting Corp | Led電球 |
JP4406490B2 (ja) | 2000-03-14 | 2010-01-27 | 株式会社朝日ラバー | 発光ダイオード |
US6538371B1 (en) | 2000-03-27 | 2003-03-25 | The General Electric Company | White light illumination system with improved color output |
US6522065B1 (en) | 2000-03-27 | 2003-02-18 | General Electric Company | Single phosphor for creating white light with high luminosity and high CRI in a UV led device |
CN2425428Y (zh) | 2000-04-30 | 2001-03-28 | 苏州半导体总厂 | 内置恒流源的led发光器件 |
TWI240788B (en) | 2000-05-04 | 2005-10-01 | Koninkl Philips Electronics Nv | Illumination system, light mixing chamber and display device |
US8360615B2 (en) | 2000-05-08 | 2013-01-29 | Farlight, Llc | LED light module for omnidirectional luminaire |
US6814470B2 (en) | 2000-05-08 | 2004-11-09 | Farlight Llc | Highly efficient LED lamp |
US6501100B1 (en) | 2000-05-15 | 2002-12-31 | General Electric Company | White light emitting phosphor blend for LED devices |
US6621211B1 (en) | 2000-05-15 | 2003-09-16 | General Electric Company | White light emitting phosphor blends for LED devices |
DE10026435A1 (de) | 2000-05-29 | 2002-04-18 | Osram Opto Semiconductors Gmbh | Kalzium-Magnesium-Chlorosilikat-Leuchtstoff und seine Anwendung bei Lumineszenz-Konversions-LED |
US6410940B1 (en) | 2000-06-15 | 2002-06-25 | Kansas State University Research Foundation | Micro-size LED and detector arrays for minidisplay, hyper-bright light emitting diodes, lighting, and UV detector and imaging sensor applications |
JP2002190622A (ja) | 2000-12-22 | 2002-07-05 | Sanken Electric Co Ltd | 発光ダイオード用透光性蛍光カバー |
DE10036940A1 (de) | 2000-07-28 | 2002-02-07 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Lumineszenz-Konversions-LED |
JP3589187B2 (ja) | 2000-07-31 | 2004-11-17 | 日亜化学工業株式会社 | 発光装置の形成方法 |
JP2002076434A (ja) | 2000-08-28 | 2002-03-15 | Toyoda Gosei Co Ltd | 発光装置 |
US6345903B1 (en) | 2000-09-01 | 2002-02-12 | Citizen Electronics Co., Ltd. | Surface-mount type emitting diode and method of manufacturing same |
US6614103B1 (en) | 2000-09-01 | 2003-09-02 | General Electric Company | Plastic packaging of LED arrays |
GB2366610A (en) | 2000-09-06 | 2002-03-13 | Mark Shaffer | Electroluminscent lamp |
US7053419B1 (en) | 2000-09-12 | 2006-05-30 | Lumileds Lighting U.S., Llc | Light emitting diodes with improved light extraction efficiency |
US6635987B1 (en) | 2000-09-26 | 2003-10-21 | General Electric Company | High power white LED lamp structure using unique phosphor application for LED lighting products |
US6650044B1 (en) | 2000-10-13 | 2003-11-18 | Lumileds Lighting U.S., Llc | Stenciling phosphor layers on light emitting diodes |
JP2002133938A (ja) | 2000-10-24 | 2002-05-10 | Toyoda Gosei Co Ltd | 蛍光体照明器具 |
JP2002133925A (ja) | 2000-10-25 | 2002-05-10 | Sanken Electric Co Ltd | 蛍光カバー及び半導体発光装置 |
JP2002150821A (ja) | 2000-11-06 | 2002-05-24 | Citizen Electronics Co Ltd | 面状光源 |
JP2002141558A (ja) | 2000-11-06 | 2002-05-17 | Matsushita Electric Ind Co Ltd | チップ型led |
US20020063520A1 (en) | 2000-11-29 | 2002-05-30 | Huei-Che Yu | Pre-formed fluorescent plate - LED device |
JP2002170989A (ja) | 2000-12-04 | 2002-06-14 | Sharp Corp | 窒化物系化合物半導体発光素子 |
US20020070643A1 (en) | 2000-12-13 | 2002-06-13 | Chao-Chin Yeh | Structure of lamp |
JP3614776B2 (ja) | 2000-12-19 | 2005-01-26 | シャープ株式会社 | チップ部品型ledとその製造方法 |
US6547416B2 (en) | 2000-12-21 | 2003-04-15 | Koninklijke Philips Electronics N.V. | Faceted multi-chip package to provide a beam of uniform white light from multiple monochrome LEDs |
JP5110744B2 (ja) | 2000-12-21 | 2012-12-26 | フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー | 発光装置及びその製造方法 |
AT410266B (de) | 2000-12-28 | 2003-03-25 | Tridonic Optoelectronics Gmbh | Lichtquelle mit einem lichtemittierenden element |
US20020084748A1 (en) | 2000-12-28 | 2002-07-04 | Ayala Raul E. | UV Reflecting materials for LED lamps using UV-emitting diodes |
US20020084745A1 (en) | 2000-12-29 | 2002-07-04 | Airma Optoelectronics Corporation | Light emitting diode with light conversion by dielectric phosphor powder |
MY131962A (en) | 2001-01-24 | 2007-09-28 | Nichia Corp | Light emitting diode, optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same |
JP3636079B2 (ja) | 2001-01-26 | 2005-04-06 | 日亜化学工業株式会社 | パッケージ成形体と発光装置 |
US6791119B2 (en) | 2001-02-01 | 2004-09-14 | Cree, Inc. | Light emitting diodes including modifications for light extraction |
US6601984B2 (en) | 2001-02-14 | 2003-08-05 | Estec Co., Ltd. | LED illuminating device and lighting apparatus employing the same |
US7027304B2 (en) | 2001-02-15 | 2006-04-11 | Integral Technologies, Inc. | Low cost thermal management device or heat sink manufactured from conductive loaded resin-based materials |
US6541800B2 (en) | 2001-02-22 | 2003-04-01 | Weldon Technologies, Inc. | High power LED |
JP2002324919A (ja) | 2001-02-26 | 2002-11-08 | Sharp Corp | 発光ダイオードおよびその製造方法 |
TW516247B (en) | 2001-02-26 | 2003-01-01 | Arima Optoelectronics Corp | Light emitting diode with light conversion using scattering optical media |
US6661167B2 (en) | 2001-03-14 | 2003-12-09 | Gelcore Llc | LED devices |
JP4066608B2 (ja) | 2001-03-16 | 2008-03-26 | 日亜化学工業株式会社 | パッケージ成形体及びその製造方法 |
JP2002278674A (ja) | 2001-03-21 | 2002-09-27 | Polymatech Co Ltd | リサイクル性の高いキートップ付キーパッドおよびその分離方法 |
GB2373846A (en) | 2001-03-30 | 2002-10-02 | Advance Ind Sdn Bhd | Metal-Coated Plastics Light Reflector with Integral Mounting Means |
JP2002304902A (ja) | 2001-04-04 | 2002-10-18 | Matsushita Electric Works Ltd | 光源装置 |
US6844903B2 (en) | 2001-04-04 | 2005-01-18 | Lumileds Lighting U.S., Llc | Blue backlight and phosphor layer for a color LCD |
TWI243095B (en) | 2001-04-24 | 2005-11-11 | Mitsui Chemicals Inc | Lamp reflector and reflector |
US6949771B2 (en) | 2001-04-25 | 2005-09-27 | Agilent Technologies, Inc. | Light source |
US6685852B2 (en) | 2001-04-27 | 2004-02-03 | General Electric Company | Phosphor blends for generating white light from near-UV/blue light-emitting devices |
US6686676B2 (en) | 2001-04-30 | 2004-02-03 | General Electric Company | UV reflectors and UV-based light sources having reduced UV radiation leakage incorporating the same |
US20020163001A1 (en) | 2001-05-04 | 2002-11-07 | Shaddock David Mulford | Surface mount light emitting device package and fabrication method |
JP4114331B2 (ja) | 2001-06-15 | 2008-07-09 | 豊田合成株式会社 | 発光装置 |
US6758587B2 (en) | 2001-06-25 | 2004-07-06 | Grote Industries, Inc. | Light emitting diode license lamp with reflector |
US6578986B2 (en) | 2001-06-29 | 2003-06-17 | Permlight Products, Inc. | Modular mounting arrangement and method for light emitting diodes |
JP2003023183A (ja) | 2001-07-06 | 2003-01-24 | Stanley Electric Co Ltd | 面実装型ledランプ |
WO2003006875A1 (en) | 2001-07-10 | 2003-01-23 | Tsung-Wen Chan | A high intensity light source with variable colours |
DE10133352A1 (de) | 2001-07-16 | 2003-02-06 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Beleuchtungseinheit mit mindestens einer LED als Lichtquelle |
US6495961B1 (en) | 2001-07-24 | 2002-12-17 | Lockheed Martin Corporation | TWT power supply with improved dynamic range |
JP2003037298A (ja) | 2001-07-25 | 2003-02-07 | Stanley Electric Co Ltd | 面実装型ledランプ |
TW552726B (en) | 2001-07-26 | 2003-09-11 | Matsushita Electric Works Ltd | Light emitting device in use of LED |
JP2003110146A (ja) | 2001-07-26 | 2003-04-11 | Matsushita Electric Works Ltd | 発光装置 |
JP4076329B2 (ja) | 2001-08-13 | 2008-04-16 | エイテックス株式会社 | Led電球 |
US20040256630A1 (en) | 2001-08-24 | 2004-12-23 | Densen Cao | Illuminating light |
US7976211B2 (en) | 2001-08-24 | 2011-07-12 | Densen Cao | Light bulb utilizing a replaceable LED light source |
US6719446B2 (en) * | 2001-08-24 | 2004-04-13 | Densen Cao | Semiconductor light source for providing visible light to illuminate a physical space |
US6634771B2 (en) | 2001-08-24 | 2003-10-21 | Densen Cao | Semiconductor light source using a primary and secondary heat sink combination |
US6634770B2 (en) | 2001-08-24 | 2003-10-21 | Densen Cao | Light source using semiconductor devices mounted on a heat sink |
US6746885B2 (en) | 2001-08-24 | 2004-06-08 | Densen Cao | Method for making a semiconductor light source |
US6465961B1 (en) | 2001-08-24 | 2002-10-15 | Cao Group, Inc. | Semiconductor light source using a heat sink with a plurality of panels |
US7224001B2 (en) | 2001-08-24 | 2007-05-29 | Densen Cao | Semiconductor light source |
AU2002323471B2 (en) | 2001-08-31 | 2005-01-06 | Ticona Polymers, Inc. | Thermally conductive lamp reflector |
JP3645207B2 (ja) | 2001-09-03 | 2005-05-11 | 日亜化学工業株式会社 | 発光ダイオード |
DE50209685D1 (de) | 2001-09-13 | 2007-04-19 | Lucea Ag | Leuchtdioden-leuchtpaneel und leiterplatte |
US6871981B2 (en) | 2001-09-13 | 2005-03-29 | Heads Up Technologies, Inc. | LED lighting device and system |
DE10146719A1 (de) | 2001-09-20 | 2003-04-17 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Beleuchtungseinheit mit mindestens einer LED als Lichtquelle |
US20030058650A1 (en) | 2001-09-25 | 2003-03-27 | Kelvin Shih | Light emitting diode with integrated heat dissipater |
DE10147040A1 (de) | 2001-09-25 | 2003-04-24 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Beleuchtungseinheit mit mindestens einer LED als Lichtquelle |
DE20115914U1 (de) | 2001-09-27 | 2003-02-13 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH, 81543 München | Beleuchtungseinheit mit mindestens einer LED als Lichtquelle |
JP3985486B2 (ja) | 2001-10-01 | 2007-10-03 | 松下電器産業株式会社 | 半導体発光素子とこれを用いた発光装置 |
JP2003110151A (ja) | 2001-10-01 | 2003-04-11 | Okaya Electric Ind Co Ltd | 発光ダイオード |
JP3948650B2 (ja) | 2001-10-09 | 2007-07-25 | アバゴ・テクノロジーズ・イーシービーユー・アイピー(シンガポール)プライベート・リミテッド | 発光ダイオード及びその製造方法 |
US6498355B1 (en) | 2001-10-09 | 2002-12-24 | Lumileds Lighting, U.S., Llc | High flux LED array |
US7588699B2 (en) | 2001-11-02 | 2009-09-15 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Electrically conductive, optically transparent polymer/carbon nanotube composites and process for preparation thereof |
TW533750B (en) | 2001-11-11 | 2003-05-21 | Solidlite Corp | LED lamp |
US6734465B1 (en) | 2001-11-19 | 2004-05-11 | Nanocrystals Technology Lp | Nanocrystalline based phosphors and photonic structures for solid state lighting |
TW582555U (en) | 2001-11-21 | 2004-04-01 | Hon Hai Prec Ind Co Ltd | Optical sub-assembly |
US6812503B2 (en) | 2001-11-29 | 2004-11-02 | Highlink Technology Corporation | Light-emitting device with improved reliability |
US6965513B2 (en) | 2001-12-20 | 2005-11-15 | Intel Corporation | Carbon nanotube thermal interface structures |
DE10163116B4 (de) | 2001-12-24 | 2008-04-10 | G.L.I. Global Light Industries Gmbh | Verfahren zum Herstellen von lichtleitenden LED-Körpern in zwei räumlich und zeitlich getrennten Stufen |
KR100991827B1 (ko) | 2001-12-29 | 2010-11-10 | 항조우 후양 신잉 띠앤즈 리미티드 | Led 및 led램프 |
US6936855B1 (en) | 2002-01-16 | 2005-08-30 | Shane Harrah | Bendable high flux LED array |
CN1266776C (zh) | 2002-01-21 | 2006-07-26 | 诠兴开发科技股份有限公司 | 白色发光二极管的制造方法 |
JP2003224304A (ja) | 2002-01-28 | 2003-08-08 | Kasei Optonix Co Ltd | 発光装置 |
US20030141563A1 (en) | 2002-01-28 | 2003-07-31 | Bily Wang | Light emitting diode package with fluorescent cover |
US7108055B2 (en) | 2002-03-29 | 2006-09-19 | Advanced Energy Technology Inc. | Optimized heat sink using high thermal conducting base and low thermal conducting fins |
US6932496B2 (en) | 2002-04-16 | 2005-08-23 | Farlight Llc | LED-based elevated omnidirectional airfield light |
US7208191B2 (en) | 2002-04-23 | 2007-04-24 | Freedman Philip D | Structure with heat dissipating device and method |
US20030210555A1 (en) | 2002-05-07 | 2003-11-13 | Gelcore, Llc | Decorative lighting apparatus and method |
US7358679B2 (en) | 2002-05-09 | 2008-04-15 | Philips Solid-State Lighting Solutions, Inc. | Dimmable LED-based MR16 lighting apparatus and methods |
US6715900B2 (en) | 2002-05-17 | 2004-04-06 | A L Lightech, Inc. | Light source arrangement |
JP2003346526A (ja) | 2002-05-27 | 2003-12-05 | Matsushita Electric Works Ltd | 光制御素子およびそれを用いた照明装置 |
US7230271B2 (en) | 2002-06-11 | 2007-06-12 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device comprising film having hygroscopic property and transparency and manufacturing method thereof |
JP2003017755A (ja) | 2002-06-13 | 2003-01-17 | Nichia Chem Ind Ltd | 発光装置 |
CA2489237A1 (en) | 2002-06-13 | 2003-12-24 | Cree, Inc. | Semiconductor emitter comprising a saturated phosphor |
TW558775B (en) | 2002-06-27 | 2003-10-21 | Solidlite Corp | Package of compound type LED |
US6809471B2 (en) | 2002-06-28 | 2004-10-26 | General Electric Company | Phosphors containing oxides of alkaline-earth and Group-IIIB metals and light sources incorporating the same |
US7094367B1 (en) | 2002-08-13 | 2006-08-22 | University Of Florida | Transparent polymer carbon nanotube composites and process for preparation |
KR100622209B1 (ko) | 2002-08-30 | 2006-09-19 | 젤코어 엘엘씨 | 개선된 효율을 갖는 코팅된 발광다이오드 |
US7768189B2 (en) | 2004-08-02 | 2010-08-03 | Lumination Llc | White LEDs with tunable CRI |
US7244965B2 (en) | 2002-09-04 | 2007-07-17 | Cree Inc, | Power surface mount light emitting die package |
US7264378B2 (en) | 2002-09-04 | 2007-09-04 | Cree, Inc. | Power surface mount light emitting die package |
US6744077B2 (en) | 2002-09-27 | 2004-06-01 | Lumileds Lighting U.S., Llc | Selective filtering of wavelength-converted semiconductor light emitting devices |
US6787999B2 (en) | 2002-10-03 | 2004-09-07 | Gelcore, Llc | LED-based modular lamp |
US6717353B1 (en) | 2002-10-14 | 2004-04-06 | Lumileds Lighting U.S., Llc | Phosphor converted light emitting device |
US20040070001A1 (en) | 2002-10-15 | 2004-04-15 | Jung-Tai Lee | LED element |
JP2004140185A (ja) | 2002-10-17 | 2004-05-13 | Matsushita Electric Ind Co Ltd | 発光装置 |
US7011432B2 (en) | 2002-11-05 | 2006-03-14 | Quarton, Inc. | Lighting source structure |
CN1296994C (zh) | 2002-11-14 | 2007-01-24 | 清华大学 | 一种热界面材料及其制造方法 |
JP2004185997A (ja) | 2002-12-04 | 2004-07-02 | Hitachi Lighting Ltd | 電球形蛍光ランプ |
JP4135485B2 (ja) | 2002-12-06 | 2008-08-20 | 東芝ライテック株式会社 | 発光ダイオード光源及び発光ダイオード照明器具 |
JP4167048B2 (ja) | 2002-12-10 | 2008-10-15 | 愛三工業株式会社 | 熱伝導性被膜及びその形成方法 |
JP2004207690A (ja) | 2002-12-13 | 2004-07-22 | Usui Kokusai Sangyo Kaisha Ltd | 樹脂材製ヒートシンク |
US7258464B2 (en) | 2002-12-18 | 2007-08-21 | General Electric Company | Integral ballast lamp thermal management method and apparatus |
TW569479B (en) | 2002-12-20 | 2004-01-01 | Ind Tech Res Inst | White-light LED applying omnidirectional reflector |
WO2004057925A1 (en) | 2002-12-20 | 2004-07-08 | Ifire Technology Corp. | Aluminum nitride passivated phosphors for electroluminescent displays |
AU2003301055A1 (en) | 2002-12-20 | 2004-07-22 | Cree, Inc. | Methods of forming semiconductor devices having self aligned semiconductor mesas and contact layers and related devices |
US6917057B2 (en) | 2002-12-31 | 2005-07-12 | Gelcore Llc | Layered phosphor coatings for LED devices |
US6764200B1 (en) | 2003-01-15 | 2004-07-20 | Hsiang Lan Wu Liu | Decorative lantern |
US7042020B2 (en) | 2003-02-14 | 2006-05-09 | Cree, Inc. | Light emitting device incorporating a luminescent material |
US6936857B2 (en) | 2003-02-18 | 2005-08-30 | Gelcore, Llc | White light LED device |
CN2637885Y (zh) | 2003-02-20 | 2004-09-01 | 高勇 | 发光面为曲面的led灯泡 |
EP2262006A3 (en) | 2003-02-26 | 2012-03-21 | Cree, Inc. | Composite white light source and method for fabricating |
US6767111B1 (en) | 2003-02-26 | 2004-07-27 | Kuo-Yen Lai | Projection light source from light emitting diodes |
JP2004273798A (ja) | 2003-03-10 | 2004-09-30 | Toyoda Gosei Co Ltd | 発光デバイス |
US7204615B2 (en) | 2003-03-31 | 2007-04-17 | Lumination Llc | LED light with active cooling |
US7543961B2 (en) | 2003-03-31 | 2009-06-09 | Lumination Llc | LED light with active cooling |
DE10316506A1 (de) | 2003-04-09 | 2004-11-18 | Schott Glas | Lichterzeugende Vorrichtung mit Reflektor |
CA2523544A1 (en) | 2003-04-30 | 2004-11-18 | Cree, Inc. | High powered light emitter packages with compact optics |
US7005679B2 (en) | 2003-05-01 | 2006-02-28 | Cree, Inc. | Multiple component solid state white light |
CN1802533B (zh) | 2003-05-05 | 2010-11-24 | 吉尔科有限公司 | 基于led的灯泡 |
US6864513B2 (en) | 2003-05-07 | 2005-03-08 | Kaylu Industrial Corporation | Light emitting diode bulb having high heat dissipating efficiency |
US7021797B2 (en) | 2003-05-13 | 2006-04-04 | Light Prescriptions Innovators, Llc | Optical device for repositioning and redistributing an LED's light |
US7329029B2 (en) | 2003-05-13 | 2008-02-12 | Light Prescriptions Innovators, Llc | Optical device for LED-based lamp |
GB2421506B (en) | 2003-05-22 | 2008-07-09 | Zyvex Corp | Nanocomposites and methods thereto |
US7040774B2 (en) | 2003-05-23 | 2006-05-09 | Goldeneye, Inc. | Illumination systems utilizing multiple wavelength light recycling |
CN100511732C (zh) | 2003-06-18 | 2009-07-08 | 丰田合成株式会社 | 发光器件 |
EP1644985A4 (en) | 2003-06-24 | 2006-10-18 | Gelcore Llc | FULL SPECTRUM FLUID MIXTURES FOR WHITE GENERATION WITH LED CHIPS |
US6921181B2 (en) | 2003-07-07 | 2005-07-26 | Mei-Feng Yen | Flashlight with heat-dissipation device |
KR100405453B1 (en) | 2003-07-25 | 2003-11-12 | Seoul Semiconductor Co Ltd | Chip light emitting diode(led) and manufacturing method thereof |
US7026755B2 (en) | 2003-08-07 | 2006-04-11 | General Electric Company | Deep red phosphor for general illumination applications |
CN100379706C (zh) | 2003-08-26 | 2008-04-09 | 松下电器产业株式会社 | 高导热性部件及其制造方法和使用该部件的散热系统 |
GB2405409A (en) | 2003-08-29 | 2005-03-02 | Gen Electric | Phosphor blends for high-CRI fluorescent lamps |
US7029935B2 (en) | 2003-09-09 | 2006-04-18 | Cree, Inc. | Transmissive optical elements including transparent plastic shell having a phosphor dispersed therein, and methods of fabricating same |
US20050116336A1 (en) | 2003-09-16 | 2005-06-02 | Koila, Inc. | Nano-composite materials for thermal management applications |
TW200519346A (en) | 2003-09-16 | 2005-06-16 | Koila Inc | Nanostructure augmentation of surfaces for enhanced thermal transfer |
JP2005108700A (ja) | 2003-09-30 | 2005-04-21 | Toshiba Lighting & Technology Corp | 光源 |
US6982518B2 (en) | 2003-10-01 | 2006-01-03 | Enertron, Inc. | Methods and apparatus for an LED light |
US6841804B1 (en) | 2003-10-27 | 2005-01-11 | Formosa Epitaxy Incorporation | Device of white light-emitting diode |
US20050110384A1 (en) | 2003-11-24 | 2005-05-26 | Peterson Charles M. | Lighting elements and methods |
US20050116597A1 (en) | 2003-12-02 | 2005-06-02 | Yung-Hsiang Hsu | Light bulb |
JP2005167091A (ja) | 2003-12-04 | 2005-06-23 | Nitto Denko Corp | 光半導体装置 |
JP2005166578A (ja) | 2003-12-05 | 2005-06-23 | Hamai Denkyu Kogyo Kk | 電球形ledランプ |
US7196459B2 (en) | 2003-12-05 | 2007-03-27 | International Resistive Co. Of Texas, L.P. | Light emitting assembly with heat dissipating support |
EP1700350A2 (en) | 2003-12-09 | 2006-09-13 | Gelcore LLC | Surface mount light emitting chip package |
JP4482728B2 (ja) | 2003-12-28 | 2010-06-16 | 株式会社新井製作所 | 光拡散素子 |
KR200350484Y1 (ko) | 2004-02-06 | 2004-05-13 | 주식회사 대진디엠피 | 콘상 엘이디 조명등 |
CN1934214A (zh) | 2004-02-06 | 2007-03-21 | 三菱化学株式会社 | 发光装置和使用该发光装置的照明装置和图像显示装置 |
JP2005228855A (ja) | 2004-02-12 | 2005-08-25 | Yamagishi Kogyo:Kk | 放熱器 |
JP3931239B2 (ja) | 2004-02-18 | 2007-06-13 | 独立行政法人物質・材料研究機構 | 発光素子及び照明器具 |
CN100491810C (zh) | 2004-03-03 | 2009-05-27 | 约翰逊父子公司 | 散发活性成分的led灯泡 |
EP1754121A4 (en) | 2004-03-15 | 2014-02-12 | Philips Solid State Lighting | METHODS AND SYSTEMS FOR PROVIDING LIGHTING SYSTEMS |
US7553051B2 (en) | 2004-03-18 | 2009-06-30 | Brasscorp Limited | LED work light |
US7086756B2 (en) | 2004-03-18 | 2006-08-08 | Lighting Science Group Corporation | Lighting element using electronically activated light emitting elements and method of making same |
USD528227S1 (en) | 2004-03-24 | 2006-09-12 | Enertron, Inc. | Light bulb |
US7327078B2 (en) | 2004-03-30 | 2008-02-05 | Lumination Llc | LED illumination device with layered phosphor pattern |
CN100383213C (zh) | 2004-04-02 | 2008-04-23 | 清华大学 | 一种热界面材料及其制造方法 |
US7868343B2 (en) | 2004-04-06 | 2011-01-11 | Cree, Inc. | Light-emitting devices having multiple encapsulation layers with at least one of the encapsulation layers including nanoparticles and methods of forming the same |
WO2005103555A1 (en) | 2004-04-15 | 2005-11-03 | Gelcore Llc | A fluorescent bulb replacement with led system |
EP1740090B1 (en) | 2004-04-20 | 2014-06-25 | Koninklijke Philips N.V. | A hair-detection device |
US7064424B2 (en) | 2004-05-06 | 2006-06-20 | Wilson Robert E | Optical surface mount technology package |
TWI263008B (en) | 2004-06-30 | 2006-10-01 | Ind Tech Res Inst | LED lamp |
US20090167192A1 (en) | 2004-06-30 | 2009-07-02 | Koninklijke Philips Electronics, N.V. | Active frame system for ambient lighting using a video display as a signal source |
EP1763700A1 (en) | 2004-06-30 | 2007-03-21 | Koninklijke Philips Electronics N.V. | Active frame system for ambient lighting using a video display as a signal s0urce |
USD508575S1 (en) | 2004-07-07 | 2005-08-16 | Osram Sylvania Inc. | Tungsten halogen lamp |
US7878232B2 (en) | 2004-07-09 | 2011-02-01 | GE Lighting Solutions, LLC | Light emitting chip apparatuses with a thermally superconducting heat transfer medium for thermal management |
US7201497B2 (en) | 2004-07-15 | 2007-04-10 | Lumination, Llc | Led lighting system with reflective board |
CN101010260B (zh) | 2004-07-27 | 2010-09-29 | 独立行政法人产业技术综合研究所 | 单层碳纳米管以及取向单层碳纳米管块结构体以及它们的制造方法、装置以及用途 |
US7453195B2 (en) | 2004-08-02 | 2008-11-18 | Lumination Llc | White lamps with enhanced color contrast |
US7273300B2 (en) | 2004-08-06 | 2007-09-25 | Lumination Llc | Curvilinear LED light source |
US20060034077A1 (en) | 2004-08-10 | 2006-02-16 | Tsu-Kang Chang | White light bulb assembly using LED as a light source |
DE202004013773U1 (de) * | 2004-09-04 | 2004-11-11 | Zweibrüder Optoelectronics GmbH | Lampe |
TWM268733U (en) | 2004-09-10 | 2005-06-21 | Sen Tech Co Ltd | LED packaging structure containing fluorescent plate |
US7144131B2 (en) | 2004-09-29 | 2006-12-05 | Advanced Optical Technologies, Llc | Optical system using LED coupled with phosphor-doped reflective materials |
US8278816B2 (en) | 2004-09-30 | 2012-10-02 | Global Tungsten & Powders Corp. | High CRI electroluminescent lamp |
DE102004049134A1 (de) | 2004-10-07 | 2006-04-13 | Schott Ag | Metallreflektor und Verfahren zu dessen Herstellung |
EP1662197B1 (de) | 2004-10-07 | 2010-04-21 | Auer Lighting GmbH | Metallreflektor und Verfahren zu dessen Herstellung |
US7329027B2 (en) | 2004-10-29 | 2008-02-12 | Eastman Kodak Company | Heat conducting mounting fixture for solid-state lamp |
US7165866B2 (en) | 2004-11-01 | 2007-01-23 | Chia Mao Li | Light enhanced and heat dissipating bulb |
US7303315B2 (en) | 2004-11-05 | 2007-12-04 | 3M Innovative Properties Company | Illumination assembly using circuitized strips |
US20060098440A1 (en) * | 2004-11-05 | 2006-05-11 | David Allen | Solid state lighting device with improved thermal management, improved power management, adjustable intensity, and interchangable lenses |
US8128267B2 (en) | 2004-11-17 | 2012-03-06 | Koninklijke Philips Electronics N.V. | Light source and illumination device comprising at least one light-emitting element |
MX2007006642A (es) | 2004-12-03 | 2008-02-22 | Acuity Brands Inc | Reflector de luminaria con transicion de prisma mejorada. |
WO2006067885A1 (ja) | 2004-12-24 | 2006-06-29 | Kyocera Corporation | 発光装置および照明装置 |
US7278749B2 (en) | 2005-01-06 | 2007-10-09 | Sullivan John T | Gauge with large illuminated gauge face |
US7304694B2 (en) | 2005-01-12 | 2007-12-04 | Cree, Inc. | Solid colloidal dispersions for backlighting of liquid crystal displays |
US20060187653A1 (en) | 2005-02-10 | 2006-08-24 | Olsson Mark S | LED illumination devices |
US7284882B2 (en) | 2005-02-17 | 2007-10-23 | Federal-Mogul World Wide, Inc. | LED light module assembly |
US7144140B2 (en) | 2005-02-25 | 2006-12-05 | Tsung-Ting Sun | Heat dissipating apparatus for lighting utility |
KR20060095345A (ko) | 2005-02-28 | 2006-08-31 | 엘지.필립스 엘시디 주식회사 | 백라이트 어셈블리 및 이를 이용한 액정표시장치 |
JP2006244725A (ja) | 2005-02-28 | 2006-09-14 | Atex Co Ltd | Led照明装置 |
US7271963B2 (en) | 2005-03-07 | 2007-09-18 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Bi-curvature lens for light emitting diodes and photo detectors |
WO2006104553A1 (en) | 2005-03-25 | 2006-10-05 | Five Star Import Group L.L.C. | Led light bulb |
EP1872053A2 (en) | 2005-04-06 | 2008-01-02 | Tir Systems Ltd. | Lighting module with compact colour mixing and collimating optics |
US7758223B2 (en) * | 2005-04-08 | 2010-07-20 | Toshiba Lighting & Technology Corporation | Lamp having outer shell to radiate heat of light source |
USD534665S1 (en) | 2005-04-15 | 2007-01-02 | Toshiba Lighting & Technology Corporation | Light emitting diode lamp |
US7226189B2 (en) * | 2005-04-15 | 2007-06-05 | Taiwan Oasis Technology Co., Ltd. | Light emitting diode illumination apparatus |
JP2006310057A (ja) | 2005-04-27 | 2006-11-09 | Arumo Technos Kk | Led照明灯及びled点灯制御回路 |
FR2885210A1 (fr) | 2005-04-29 | 2006-11-03 | Univ Joseph Fourier Etablissem | Procede de realisation d'une paroi, en particulier d'un micro-echangeur thermique, et micro-echangeur thermique, comprenant en particulier des nanotubes |
USD531741S1 (en) | 2005-05-23 | 2006-11-07 | Toshiba Lighting & Technology Corporation | Fluorescent lamp |
ATE519066T1 (de) | 2005-06-01 | 2011-08-15 | Koninkl Philips Electronics Nv | Künstliches fenster |
JP4459863B2 (ja) | 2005-06-01 | 2010-04-28 | 株式会社小糸製作所 | 車両用灯具 |
US9412926B2 (en) | 2005-06-10 | 2016-08-09 | Cree, Inc. | High power solid-state lamp |
CN2800701Y (zh) | 2005-06-10 | 2006-07-26 | 华为技术有限公司 | 移动终端壳体 |
US8669572B2 (en) | 2005-06-10 | 2014-03-11 | Cree, Inc. | Power lamp package |
US7229196B2 (en) | 2005-06-10 | 2007-06-12 | Ilight Technologies, Inc. | Illumination device for simulating neon or similar lighting in the shape of a toroid |
US7980743B2 (en) | 2005-06-14 | 2011-07-19 | Cree, Inc. | LED backlighting for displays |
US7784956B2 (en) | 2005-06-23 | 2010-08-31 | Rsr Industries, Inc. | Gazing globes and other ornamental objects including light sources and light-activated materials |
KR20070000835A (ko) | 2005-06-28 | 2007-01-03 | 엘지.필립스 엘시디 주식회사 | 백라이트 유닛 |
USD541442S1 (en) | 2005-09-16 | 2007-04-24 | Koninklijke Philips Electronics N.V. | LED bulb |
US7932535B2 (en) | 2005-11-02 | 2011-04-26 | Nuventix, Inc. | Synthetic jet cooling system for LED module |
US8030886B2 (en) | 2005-12-21 | 2011-10-04 | Nuventix, Inc. | Thermal management of batteries using synthetic jets |
US7637639B2 (en) | 2005-12-21 | 2009-12-29 | 3M Innovative Properties Company | LED emitter with radial prismatic light diverter |
EP1969633B1 (en) | 2005-12-22 | 2018-08-29 | Cree, Inc. | Lighting device |
US7413325B2 (en) | 2005-12-28 | 2008-08-19 | International Development Corporation | LED bulb |
US7569406B2 (en) | 2006-01-09 | 2009-08-04 | Cree, Inc. | Method for coating semiconductor device using droplet deposition |
USD538950S1 (en) | 2006-02-17 | 2007-03-20 | Lighting Science Group Corporation | LED light bulb |
USD538951S1 (en) | 2006-02-17 | 2007-03-20 | Lighting Science Corporation | LED light bulb |
JP2007234462A (ja) | 2006-03-02 | 2007-09-13 | Stanley Electric Co Ltd | 照明装置 |
CN101427617A (zh) | 2006-02-23 | 2009-05-06 | 纽文迪斯公司 | 用于合成射流喷射器的电子封装 |
CN101438057A (zh) | 2006-03-07 | 2009-05-20 | 流体公司 | 流体能量传递装置 |
US7549772B2 (en) | 2006-03-31 | 2009-06-23 | Pyroswift Holding Co., Limited | LED lamp conducting structure with plate-type heat pipe |
US9084328B2 (en) | 2006-12-01 | 2015-07-14 | Cree, Inc. | Lighting device and lighting method |
CN101427388B (zh) | 2006-04-24 | 2010-08-18 | 旭硝子株式会社 | 发光装置 |
ITRE20060052A1 (it) | 2006-04-28 | 2007-10-29 | Incerti Simonini Snc | DISPOSITIVO OTTICO SECONDARIO PER LAMPADE A LEDs |
MX2008013868A (es) | 2006-05-02 | 2009-02-03 | Superbulbs Inc | Metodo de dispersion de luz y difraccion preferencial de ciertas longitudes de onda de luz para diodos emisores de luz y bulbos construidos a partir de los mismos. |
US7549782B2 (en) | 2006-05-11 | 2009-06-23 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Semiconductor light source configured as a light tube |
USD541440S1 (en) | 2006-05-23 | 2007-04-24 | Feit Electric Company | Light bulb |
US7736020B2 (en) | 2006-06-16 | 2010-06-15 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Illumination device and method of making the device |
US8136576B2 (en) | 2006-06-22 | 2012-03-20 | Nuventix, Inc. | Vibration isolation system for synthetic jet devices |
US8646701B2 (en) | 2006-07-05 | 2014-02-11 | Nuventix, Inc. | Moldable housing design for synthetic jet ejector |
CN200955687Y (zh) | 2006-07-07 | 2007-10-03 | 祝子荣 | 大功率单体半导体灯泡 |
EP1878767A1 (en) | 2006-07-12 | 2008-01-16 | Shin-Etsu Chemical Co., Ltd. | Heat conductive silicone grease composition and cured product thereof |
JP2008021505A (ja) | 2006-07-12 | 2008-01-31 | Stanley Electric Co Ltd | 照明装置 |
US7943952B2 (en) | 2006-07-31 | 2011-05-17 | Cree, Inc. | Method of uniform phosphor chip coating and LED package fabricated using method |
US8581158B2 (en) | 2006-08-02 | 2013-11-12 | Battelle Memorial Institute | Electrically conductive coating composition |
US7396146B2 (en) | 2006-08-09 | 2008-07-08 | Augux Co., Ltd. | Heat dissipating LED signal lamp source structure |
US20080049445A1 (en) | 2006-08-25 | 2008-02-28 | Philips Lumileds Lighting Company, Llc | Backlight Using High-Powered Corner LED |
CN101517755A (zh) | 2006-09-21 | 2009-08-26 | 3M创新有限公司 | 导热led组件 |
US8581393B2 (en) | 2006-09-21 | 2013-11-12 | 3M Innovative Properties Company | Thermally conductive LED assembly |
WO2008038924A1 (en) | 2006-09-28 | 2008-04-03 | Seoul Opto Device Co., Ltd. | Ultraviolet light emitting diode package |
CN101553928B (zh) | 2006-10-02 | 2011-06-01 | 伊鲁米特克有限公司 | Led系统和方法 |
KR20090063251A (ko) | 2006-10-12 | 2009-06-17 | 디에스엠 아이피 어셋츠 비.브이. | 조명 장치 |
CN100572908C (zh) | 2006-11-17 | 2009-12-23 | 富准精密工业(深圳)有限公司 | 发光二极管灯具 |
US7784972B2 (en) | 2006-12-22 | 2010-08-31 | Nuventix, Inc. | Thermal management system for LED array |
US20110128742A9 (en) * | 2007-01-07 | 2011-06-02 | Pui Hang Yuen | High efficiency low cost safety light emitting diode illumination device |
US7806560B2 (en) | 2007-01-31 | 2010-10-05 | 3M Innovative Properties Company | LED illumination assembly with compliant foil construction |
EP2109887B1 (en) | 2007-02-02 | 2018-06-27 | DSM IP Assets B.V. | Heat transport assembly |
USD553267S1 (en) * | 2007-02-09 | 2007-10-16 | Wellion Asia Limited | LED light bulb |
JP5194480B2 (ja) | 2007-02-20 | 2013-05-08 | 東レ株式会社 | カーボンナノチューブコーティング膜およびその製造方法 |
JP2008211060A (ja) | 2007-02-27 | 2008-09-11 | Fujifilm Corp | 金属膜付基板の製造方法 |
USD560286S1 (en) * | 2007-03-23 | 2008-01-22 | Lighting Science Group Corporation | LED light bulb |
US8045093B2 (en) | 2007-03-30 | 2011-10-25 | Lg Display Co., Ltd. | Backlight unit and liquid crystal display device having the same |
CN101652602B (zh) | 2007-04-03 | 2012-02-22 | 皇家飞利浦电子股份有限公司 | 光输出设备 |
US7581856B2 (en) | 2007-04-11 | 2009-09-01 | Tamkang University | High power LED lighting assembly incorporated with a heat dissipation module with heat pipe |
WO2008134056A1 (en) | 2007-04-26 | 2008-11-06 | Deak-Lam Inc. | Photon energy coversion structure |
CN101296564B (zh) | 2007-04-27 | 2010-11-10 | 富士迈半导体精密工业(上海)有限公司 | 具良好散热性能的光源模组 |
US7677766B2 (en) | 2007-05-07 | 2010-03-16 | Lsi Industries, Inc. | LED lamp device and method to retrofit a lighting fixture |
US7622795B2 (en) | 2007-05-15 | 2009-11-24 | Nichepac Technology Inc. | Light emitting diode package |
JP5037683B2 (ja) | 2007-05-25 | 2012-10-03 | モレックス インコーポレイテド | 発熱体及び電源用のヒートシンク |
US7494246B2 (en) | 2007-06-06 | 2009-02-24 | Philips Lumileds Lighting Company, Llc | Thin luminaire for general lighting applications |
US8075172B2 (en) | 2007-06-08 | 2011-12-13 | A66, Incorporated | Durable super-cooled intelligent light bulb |
USD570504S1 (en) * | 2007-06-18 | 2008-06-03 | Lighting Science Group Corporation | LED light bulb |
JP4631877B2 (ja) | 2007-07-02 | 2011-02-16 | スターライト工業株式会社 | 樹脂製ヒートシンク |
JP5029893B2 (ja) | 2007-07-06 | 2012-09-19 | 東芝ライテック株式会社 | 電球形ledランプおよび照明装置 |
US7758214B2 (en) | 2007-07-12 | 2010-07-20 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | LED lamp |
US7434964B1 (en) | 2007-07-12 | 2008-10-14 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | LED lamp with a heat sink assembly |
JP2009032466A (ja) | 2007-07-25 | 2009-02-12 | Toshiba Lighting & Technology Corp | 照明装置 |
US7791093B2 (en) | 2007-09-04 | 2010-09-07 | Koninklijke Philips Electronics N.V. | LED with particles in encapsulant for increased light extraction and non-yellow off-state color |
JP5008506B2 (ja) | 2007-09-14 | 2012-08-22 | スタンレー電気株式会社 | Ledランプユニット |
JP2009099533A (ja) | 2007-09-25 | 2009-05-07 | Hitachi Maxell Ltd | 放熱部材、反射部材および照明ユニット |
US8444299B2 (en) | 2007-09-25 | 2013-05-21 | Enertron, Inc. | Dimmable LED bulb with heatsink having perforated ridges |
US7588351B2 (en) * | 2007-09-27 | 2009-09-15 | Osram Sylvania Inc. | LED lamp with heat sink optic |
USD570505S1 (en) * | 2007-09-27 | 2008-06-03 | Lighting Science Group Corporation | LED light bulb |
US7806569B2 (en) | 2007-09-28 | 2010-10-05 | Osram Sylvania Inc. | Lighting system with removable light modules |
US20090084866A1 (en) | 2007-10-01 | 2009-04-02 | Nuventix Inc. | Vibration balanced synthetic jet ejector |
JP2011500487A (ja) | 2007-10-12 | 2011-01-06 | バッテル メモリアル インスティテュート | カーボンナノチューブの導電性改善用コーティング |
US7984999B2 (en) | 2007-10-17 | 2011-07-26 | Xicato, Inc. | Illumination device with light emitting diodes and moveable light adjustment member |
US9086213B2 (en) | 2007-10-17 | 2015-07-21 | Xicato, Inc. | Illumination device with light emitting diodes |
US8845138B2 (en) | 2007-10-24 | 2014-09-30 | Nuventix, Inc. | Light fixture with multiple LEDs and synthetic jet thermal management system |
US8066410B2 (en) | 2007-10-24 | 2011-11-29 | Nuventix, Inc. | Light fixture with multiple LEDs and synthetic jet thermal management system |
US7637635B2 (en) | 2007-11-21 | 2009-12-29 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | LED lamp with a heat sink |
US7726836B2 (en) | 2007-11-23 | 2010-06-01 | Taiming Chen | Light bulb with light emitting elements for use in conventional incandescent light bulb sockets |
ITVR20070172A1 (it) | 2007-11-26 | 2009-05-27 | Sergio Macchioni | Dispositivo di illuminazione |
WO2009071111A1 (en) | 2007-12-07 | 2009-06-11 | Osram Gesellschaft mit beschränkter Haftung | Heat sink and lighting device comprising a heat sink |
US7585090B2 (en) | 2007-12-21 | 2009-09-08 | Tsu Yao Wu | Light-emitting-diode lamp |
JP4945433B2 (ja) | 2007-12-28 | 2012-06-06 | シャープ株式会社 | 照明装置 |
JP5353216B2 (ja) | 2008-01-07 | 2013-11-27 | 東芝ライテック株式会社 | Led電球及び照明器具 |
CN101940061A (zh) | 2008-01-10 | 2011-01-05 | 戈肯集团公司 | 低功率白炽灯的led灯替换 |
JP2009170114A (ja) | 2008-01-10 | 2009-07-30 | Toshiba Lighting & Technology Corp | Led電球及び照明器具 |
JP2009181838A (ja) | 2008-01-31 | 2009-08-13 | Ushio Inc | 光放射装置 |
US8274241B2 (en) | 2008-02-06 | 2012-09-25 | C. Crane Company, Inc. | Light emitting diode lighting device |
US8350499B2 (en) * | 2008-02-06 | 2013-01-08 | C. Crane Company, Inc. | High efficiency power conditioning circuit for lighting device |
US8246202B2 (en) | 2008-02-13 | 2012-08-21 | Mart Gary K | Light emitting diode bulb |
US7710663B2 (en) | 2008-03-10 | 2010-05-04 | A.L.P. Lighting & Ceiling Products, Inc. | Prismatic lens and reflector/refractor device for lighting fixtures having enhanced performance characteristics |
CN101977976B (zh) | 2008-03-20 | 2014-08-27 | 帝斯曼知识产权资产管理有限公司 | 导热塑料材料的热沉 |
RU2010146632A (ru) | 2008-04-17 | 2012-05-27 | Конинклейке Филипс Электроникс Н.В. (Nl) | Источник света на основе светоизлучающих диодов |
DE102008019926B4 (de) | 2008-04-21 | 2011-07-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V., 80686 | Beleuchtungsvorrichtung und Verfahren zur Erzeugung einer flächigen Lichtausgabe |
CN101566326B (zh) | 2008-04-23 | 2012-09-19 | 富准精密工业(深圳)有限公司 | 照明装置及其光引擎 |
CN101567342B (zh) | 2008-04-23 | 2013-07-03 | 富准精密工业(深圳)有限公司 | 均热板散热装置 |
US20090279314A1 (en) | 2008-05-06 | 2009-11-12 | Chung Wu | Heat dissipating device with protection function and heat dissipating fins thereof |
CN101576205B (zh) | 2008-05-09 | 2011-01-12 | 范金晶 | 用于替代反光杯形卤素灯泡的led灯泡 |
USD590523S1 (en) | 2008-05-23 | 2009-04-14 | Toshiba Lighting & Technology Corporation | Light emitting diode lamp |
US20090296387A1 (en) | 2008-05-27 | 2009-12-03 | Sea Gull Lighting Products, Llc | Led retrofit light engine |
US7748870B2 (en) | 2008-06-03 | 2010-07-06 | Li-Hong Technological Co., Ltd. | LED lamp bulb structure |
US8013501B2 (en) | 2008-06-04 | 2011-09-06 | Forever Bulb, Llc | LED-based light bulb device |
US7766514B2 (en) | 2008-06-05 | 2010-08-03 | Hon-Wen Chen | Light emitting diode lamp with high heat-dissipation capacity |
CN102119346B (zh) | 2008-06-13 | 2014-01-29 | 光处方革新有限公司 | 由沟槽构成的反射器 |
US20100002432A1 (en) * | 2008-07-07 | 2010-01-07 | Hubbell Incorporated | Indirect luminaire utilizing led light sources |
US8299691B2 (en) | 2008-07-15 | 2012-10-30 | Nuventix, Inc. | Advanced synjet cooler design for LED light modules |
US8579476B2 (en) | 2008-07-15 | 2013-11-12 | Nuventix, Inc. | Thermal management of led-based illumination devices with synthetic jet ejectors |
KR20100009909A (ko) | 2008-07-21 | 2010-01-29 | 삼성에스디아이 주식회사 | 플라즈마 표시 장치 및 그 구동 방법 |
TWM346745U (en) | 2008-07-25 | 2008-12-11 | Forcecon Technology Co Ltd | LED Lamp with heat-dissipation toward the terminal direction |
JP5218751B2 (ja) | 2008-07-30 | 2013-06-26 | 東芝ライテック株式会社 | 電球型ランプ |
KR100883346B1 (ko) | 2008-08-08 | 2009-02-12 | 김현민 | 패널형 led 조명장치 |
CN201246616Y (zh) | 2008-08-19 | 2009-05-27 | 鑫谷光电股份有限公司 | 一种新型大功率led烛型灯 |
CN101660737A (zh) | 2008-08-27 | 2010-03-03 | 富准精密工业(深圳)有限公司 | 发光二极管灯具 |
CN101363610A (zh) | 2008-09-08 | 2009-02-11 | 广州南科集成电子有限公司 | Led灯泡 |
TWI349087B (en) | 2008-09-15 | 2011-09-21 | Sunon Electronics Foshan Co Ltd | Lamp |
JP2010073438A (ja) | 2008-09-17 | 2010-04-02 | Panasonic Corp | ランプ |
KR101007913B1 (ko) | 2008-10-01 | 2011-01-14 | 주식회사 아모럭스 | 나선형 방열장치 및 이를 이용한 전구형 led 조명장치 |
JP4651702B2 (ja) | 2008-10-17 | 2011-03-16 | 三洋電機株式会社 | 照明装置 |
US7800909B2 (en) * | 2008-10-27 | 2010-09-21 | Edison Opto Corporation | Lamp base having a heat sink |
US20100103666A1 (en) | 2008-10-28 | 2010-04-29 | Kun-Jung Chang | Led lamp bulb structure |
US8287147B2 (en) | 2008-11-15 | 2012-10-16 | Rongsheng Tian | LED based omni-directional light engine |
CN102216669B (zh) | 2008-11-18 | 2015-03-18 | 皇家飞利浦电子股份有限公司 | 电灯 |
US8506103B2 (en) | 2008-11-26 | 2013-08-13 | Keiji Iimura | Semiconductor lamp and light bulb type LED lamp |
CN201425284Y (zh) | 2008-12-15 | 2010-03-17 | 杭州创元光电科技有限公司 | 具有新型结构的嵌入式散热器及发光二极管及发光二极管灯 |
US20100170657A1 (en) | 2009-01-06 | 2010-07-08 | United Technologies Corporation | Integrated blower diffuser-fin heat sink |
US7600882B1 (en) | 2009-01-20 | 2009-10-13 | Lednovation, Inc. | High efficiency incandescent bulb replacement lamp |
US8449150B2 (en) | 2009-02-03 | 2013-05-28 | Osram Sylvania Inc. | Tir lens for light emitting diodes |
DE202009001828U1 (de) | 2009-02-12 | 2009-07-16 | Zumtobel Lighting Gmbh | Leuchte, insbesondere Decken- oder Wandleuchte |
EP2399070B1 (en) | 2009-02-17 | 2017-08-23 | Epistar Corporation | Led light bulbs for space lighting |
US8057075B2 (en) | 2009-03-13 | 2011-11-15 | Sunonwealth Electric Machine Industry Co., Ltd. | Lamp device |
CN201936911U (zh) | 2009-03-16 | 2011-08-17 | 莫列斯公司 | 光学模块及具有光学模块的光学系统 |
DE102009014486A1 (de) | 2009-03-23 | 2010-09-30 | Zumtobel Lighting Gmbh | Anordnung zur Lichtabgabe mit Leuchtelementen |
WO2010128419A1 (en) | 2009-05-04 | 2010-11-11 | Koninklijke Philips Electronics N.V. | Light source comprising a light emitter arranged inside a translucent outer envelope |
US7760499B1 (en) | 2009-05-14 | 2010-07-20 | Nuventix, Inc. | Thermal management system for card cages |
US8152318B2 (en) | 2009-06-11 | 2012-04-10 | Rambus International Ltd. | Optical system for a light emitting diode with collection, conduction, phosphor directing, and output means |
KR100934440B1 (ko) | 2009-06-17 | 2009-12-29 | 최연주 | 방열장치 |
WO2010146518A1 (en) | 2009-06-19 | 2010-12-23 | Koninklijke Philips Electronics N.V. | Lamp assembly |
KR101169209B1 (ko) | 2009-07-21 | 2012-07-27 | 주식회사 엔이알 | 복수의 방열 홀을 갖는 led 조명 장치 |
CN101963337B (zh) | 2009-07-21 | 2013-04-24 | 富士迈半导体精密工业(上海)有限公司 | 照明装置 |
KR101414639B1 (ko) | 2009-09-14 | 2014-07-03 | 엘지전자 주식회사 | 방열 장치 |
JP5683799B2 (ja) | 2009-09-14 | 2015-03-11 | スターライト工業株式会社 | 自動車用led用ヒートシンク |
US8414151B2 (en) * | 2009-10-02 | 2013-04-09 | GE Lighting Solutions, LLC | Light emitting diode (LED) based lamp |
US9103507B2 (en) * | 2009-10-02 | 2015-08-11 | GE Lighting Solutions, LLC | LED lamp with uniform omnidirectional light intensity output |
US8593040B2 (en) * | 2009-10-02 | 2013-11-26 | Ge Lighting Solutions Llc | LED lamp with surface area enhancing fins |
US9030120B2 (en) | 2009-10-20 | 2015-05-12 | Cree, Inc. | Heat sinks and lamp incorporating same |
US9217542B2 (en) | 2009-10-20 | 2015-12-22 | Cree, Inc. | Heat sinks and lamp incorporating same |
EP2491296A4 (en) * | 2009-10-22 | 2013-10-09 | Light Prescriptions Innovators | SEMICONDUCTOR ELECTRIC BULB |
USD613887S1 (en) * | 2009-11-06 | 2010-04-13 | Cal-Comp Electronics & Communications Company Limited | Light emitting diode lamp |
KR101414642B1 (ko) | 2009-11-20 | 2014-07-03 | 엘지전자 주식회사 | 방열 장치 |
CN102080772A (zh) | 2009-11-30 | 2011-06-01 | 富准精密工业(深圳)有限公司 | 发光二极管灯具 |
KR101017349B1 (ko) | 2009-12-03 | 2011-02-28 | 테크룩스 주식회사 | 벌브타입의 엘이디램프 |
USD615220S1 (en) | 2009-12-07 | 2010-05-04 | C. Crane Company, Inc. | Light bulb |
WO2011076724A2 (en) | 2009-12-23 | 2011-06-30 | Bayer Cropscience Ag | Pesticidal compound mixtures |
US8695686B2 (en) | 2010-01-07 | 2014-04-15 | General Electric Company | Method and apparatus for removing heat from electronic devices using synthetic jets |
JP5174835B2 (ja) | 2010-01-08 | 2013-04-03 | シャープ株式会社 | Led電球 |
US8541933B2 (en) * | 2010-01-12 | 2013-09-24 | GE Lighting Solutions, LLC | Transparent thermally conductive polymer composites for light source thermal management |
DE102010001046A1 (de) | 2010-01-20 | 2011-07-21 | Osram Gesellschaft mit beschränkter Haftung, 81543 | Leuchtvorrichtung |
DE102010001047A1 (de) | 2010-01-20 | 2011-07-21 | Osram Gesellschaft mit beschränkter Haftung, 81543 | Leuchtvorrichtung |
US8434906B2 (en) | 2010-02-23 | 2013-05-07 | General Electric Company | Lighting system with thermal management system |
US8931933B2 (en) * | 2010-03-03 | 2015-01-13 | Cree, Inc. | LED lamp with active cooling element |
US10359151B2 (en) | 2010-03-03 | 2019-07-23 | Ideal Industries Lighting Llc | Solid state lamp with thermal spreading elements and light directing optics |
US9523488B2 (en) | 2010-09-24 | 2016-12-20 | Cree, Inc. | LED lamp |
US8882284B2 (en) | 2010-03-03 | 2014-11-11 | Cree, Inc. | LED lamp or bulb with remote phosphor and diffuser configuration with enhanced scattering properties |
US9052067B2 (en) | 2010-12-22 | 2015-06-09 | Cree, Inc. | LED lamp with high color rendering index |
US8562161B2 (en) | 2010-03-03 | 2013-10-22 | Cree, Inc. | LED based pedestal-type lighting structure |
US10240772B2 (en) | 2010-04-02 | 2019-03-26 | GE Lighting Solutions, LLC | Lightweight heat sinks and LED lamps employing same |
USD629153S1 (en) * | 2010-04-02 | 2010-12-14 | Yi-jin Industrial Co., Ltd. | Lampshade |
US8125126B2 (en) | 2010-05-07 | 2012-02-28 | Industrial Technology Research Institute | Multi-facet light emitting lamp |
CN102472461B (zh) | 2010-05-19 | 2014-10-15 | 松下电器产业株式会社 | Led灯及照明装置 |
US8896198B2 (en) * | 2010-05-20 | 2014-11-25 | Light Prescriptions Innovators, Llc | LED light bulb with translucent spherical diffuser and remote phosphor thereupon |
US8227961B2 (en) | 2010-06-04 | 2012-07-24 | Cree, Inc. | Lighting device with reverse tapered heatsink |
US8227964B2 (en) | 2010-06-04 | 2012-07-24 | Lg Innotek Co., Ltd. | Lighting device |
US8575836B2 (en) | 2010-06-08 | 2013-11-05 | Cree, Inc. | Lighting devices with differential light transmission regions |
US20130155680A1 (en) | 2010-06-16 | 2013-06-20 | Nuventix, Inc. | Low Form Factor Synthetic Jet Thermal Management System |
US8480269B2 (en) | 2010-07-07 | 2013-07-09 | Sunonwealth Electric Machine Industry Co., Ltd. | Lamp and heat sink thereof |
US8324645B2 (en) | 2010-07-15 | 2012-12-04 | Pinecone Energies, Inc. | Optical device for semiconductor based lamp |
US20110140148A1 (en) | 2010-07-15 | 2011-06-16 | Pinecone Energies, Inc. | Optical device for semiconductor based lamp |
US10451251B2 (en) | 2010-08-02 | 2019-10-22 | Ideal Industries Lighting, LLC | Solid state lamp with light directing optics and diffuser |
US8282249B2 (en) | 2010-08-20 | 2012-10-09 | Siltek Electronic (Guangzhou) Co., Ltd. | Luminaire |
US8506105B2 (en) | 2010-08-25 | 2013-08-13 | Generla Electric Company | Thermal management systems for solid state lighting and other electronic systems |
US20120051088A1 (en) | 2010-08-25 | 2012-03-01 | Qualcomm Mems Technologies, Inc. | Methods of manufacturing illumination systems |
TWI397650B (zh) | 2010-09-15 | 2013-06-01 | Sunonwealth Electr Mach Ind Co | 燈具 |
US8672516B2 (en) * | 2010-09-30 | 2014-03-18 | GE Lighting Solutions, LLC | Lightweight heat sinks and LED lamps employing same |
US8602607B2 (en) | 2010-10-21 | 2013-12-10 | General Electric Company | Lighting system with thermal management system having point contact synthetic jets |
US10400959B2 (en) * | 2010-11-09 | 2019-09-03 | Lumination Llc | LED lamp |
US8297799B2 (en) | 2010-12-02 | 2012-10-30 | Aether Systems Inc. | Omnidirectional LED lamp and complex, unitary lens |
USD653365S1 (en) | 2010-12-19 | 2012-01-31 | Cree, Inc. | LED lamp |
DE102010063926A1 (de) | 2010-12-22 | 2012-06-28 | Tridonic Jennersdorf Gmbh | LED-Lampe mit piezoelektrischem Kühlelement |
US8757836B2 (en) | 2011-01-13 | 2014-06-24 | GE Lighting Solutions, LLC | Omnidirectional LED based solid state lamp |
US8421321B2 (en) | 2011-01-24 | 2013-04-16 | Sheng-Yi CHUANG | LED light bulb |
US20120194054A1 (en) | 2011-02-02 | 2012-08-02 | 3M Innovative Properties Company | Solid state light with optical diffuser and integrated thermal guide |
US9068701B2 (en) | 2012-01-26 | 2015-06-30 | Cree, Inc. | Lamp structure with remote LED light source |
JP5296122B2 (ja) | 2011-02-28 | 2013-09-25 | 株式会社東芝 | 照明装置 |
US8608341B2 (en) | 2011-03-07 | 2013-12-17 | Lighting Science Group Corporation | LED luminaire |
US9004724B2 (en) | 2011-03-21 | 2015-04-14 | GE Lighting Solutions, LLC | Reflector (optics) used in LED deco lamp |
US20120262915A1 (en) | 2011-04-18 | 2012-10-18 | Jade Yang Co., Ltd. | Led (light-emitting diode) lamp with light reflection |
KR101377965B1 (ko) | 2011-05-02 | 2014-03-25 | 엘지전자 주식회사 | 조명 장치 |
TWI408313B (zh) | 2011-05-23 | 2013-09-11 | Sunonwealth Electr Mach Ind Co | Led燈 |
CN202065902U (zh) | 2011-06-07 | 2011-12-07 | 北京中智锦成科技有限公司 | 一种低功率led灯罩 |
US8324790B1 (en) | 2011-06-07 | 2012-12-04 | Wen-Sung Hu | High illumination LED bulb with full emission angle |
US8414160B2 (en) | 2011-06-13 | 2013-04-09 | Tsmc Solid State Lighting Ltd. | LED lamp and method of making the same |
TWI439633B (zh) | 2011-06-24 | 2014-06-01 | Amtran Technology Co Ltd | 發光二極體燈源 |
USD660991S1 (en) | 2011-07-22 | 2012-05-29 | Ge Lighting Solutions, Llc. | Lamp |
WO2013023023A2 (en) | 2011-08-09 | 2013-02-14 | Rambus Inc. | Light bulb with thermal features |
KR101227527B1 (ko) | 2011-09-05 | 2013-01-31 | 엘지전자 주식회사 | 조명 장치 |
US8523407B2 (en) | 2011-09-13 | 2013-09-03 | Chun Kuang Optics Corp. | Optical element and illuminant device using the same |
US20130088848A1 (en) | 2011-10-06 | 2013-04-11 | Intematix Corporation | Solid-state lamps with improved radial emission and thermal performance |
US9476566B2 (en) | 2012-01-06 | 2016-10-25 | Cree, Inc. | Light fixture with textured reflector |
US9488329B2 (en) | 2012-01-06 | 2016-11-08 | Cree, Inc. | Light fixture with textured reflector |
WO2013123128A1 (en) | 2012-02-17 | 2013-08-22 | Intematix Corporation | Solid-state lamps with improved emission efficiency and photoluminescence wavelength conversion components therefor |
DE202012101158U1 (de) | 2012-03-30 | 2012-04-17 | Cooler Master Co., Ltd. | Leuchtvorrichtung und deren Lampengehäuse |
US20140218892A1 (en) * | 2013-02-05 | 2014-08-07 | Intematix Corporation | Wide emission angle led package with remote phosphor component |
US20140340899A1 (en) * | 2013-05-18 | 2014-11-20 | Edward E. Bailey | Integrated Solid-State Lamp |
JP6210456B2 (ja) | 2014-05-28 | 2017-10-11 | 公益財団法人若狭湾エネルギー研究センター | 長距離レーザ切断装置 |
-
2009
- 2009-10-02 US US12/572,480 patent/US8593040B2/en active Active
-
2010
- 2010-10-01 WO PCT/US2010/051043 patent/WO2011041626A1/en active Application Filing
- 2010-10-01 EP EP10763295A patent/EP2483592A1/en not_active Withdrawn
- 2010-10-01 KR KR1020127011460A patent/KR101873601B1/ko active IP Right Grant
- 2010-10-01 AU AU2010300489A patent/AU2010300489B2/en not_active Ceased
- 2010-10-01 CN CN201080054757.9A patent/CN102639924B/zh active Active
-
2013
- 2013-10-24 US US14/062,317 patent/US9951938B2/en active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007037820A1 (de) * | 2007-08-10 | 2009-02-12 | Osram Gesellschaft mit beschränkter Haftung | LED-Lampe |
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US8593040B2 (en) | 2013-11-26 |
KR101873601B1 (ko) | 2018-07-02 |
AU2010300489A1 (en) | 2012-05-24 |
CN102639924A (zh) | 2012-08-15 |
EP2483592A1 (en) | 2012-08-08 |
US9951938B2 (en) | 2018-04-24 |
US20110080096A1 (en) | 2011-04-07 |
AU2010300489B2 (en) | 2015-01-22 |
WO2011041626A1 (en) | 2011-04-07 |
KR20120110093A (ko) | 2012-10-09 |
US20140160763A1 (en) | 2014-06-12 |
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