CN102639924B - Led灯 - Google Patents

Led灯 Download PDF

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CN102639924B
CN102639924B CN201080054757.9A CN201080054757A CN102639924B CN 102639924 B CN102639924 B CN 102639924B CN 201080054757 A CN201080054757 A CN 201080054757A CN 102639924 B CN102639924 B CN 102639924B
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light
surface area
fin
reinforcing element
devices according
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CN102639924A (zh
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戴维·C·杜迪克
乔舒亚·I·林塔马基
加里·R·艾伦
格伦·H·坤泽勒
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Current Lighting Solutions LLC
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/502Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/506Cooling arrangements characterised by the adaptation for cooling of specific components of globes, bowls or cover glasses
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/75Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/78Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with helically or spirally arranged fins or blades
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/80Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/87Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/86Ceramics or glass
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)

Abstract

一种发光装置(10),包括具有位于透光封套(14)内的基于LED的光源的至少基本上全向的照明组件。电子器件配置来驱动基于LED的光源,电子器件设置在阻挡角不大于45°的基座(16)内。多个散热元件(18)(诸如翅片)与基座热连通并邻近封套延伸。

Description

LED灯
背景技术
下文涉及照明领域、发光领域、固态发光领域、及相关领域。
白炽灯和卤素灯在传统上用作全方位(omni-directional)定向光源。全方位等旨在提供相对于远离灯大于1米的远场中的角度基本上均匀的强度分布,并且发现多种应用,诸如台灯、桌灯、装饰灯、枝形吊灯、吸顶灯及其它应用,这些应用期望光在所有方向上均匀分布。
参照图1,描述了一种坐标系,该坐标系在本文用来描述由白炽灯(更通常地,用于产生全方位照明的任何灯)产生的照明的空间分布。该坐标系是球坐标系,参照白炽A-19式灯L示出。为了描述远场照明分布,可以认为灯L位于L0点,该点例如与白热灯丝的位置相一致。采用地理领域中所传统地使用的球坐标符号,通过高程或纬度坐标以及方位或经度坐标对照明方向进行描述。然而,与地理领域常规不同,本文所用的高程或纬度坐标范围为[0°,180°],其中:θ=0°对应于“地理北”或“N”。这样比较方便,因为其允许沿方向θ=0°的照明对应于前向光。北方,即方向θ=0°,在文中还被称为光轴。利用该符号,θ=180°对应于“地理南”或“S”,或者在照明环境下对应于后向光。高程或纬度θ=90°对应于“地理赤道”,或者在照明环境下对应于侧向光。
继续参照图1,对指定高程或纬度还可以限定方位或经度坐标其各处均与高程或纬度θ正交。依据地理符号,方位或经度坐标的范围为[0°,360°]。
应理解的是,正好在北方或南方,即在θ=0°或θ=180°时(换句话说,沿着光轴),方位或经度坐标没有任何意义,或者也许更准确地说,可以被认为退化。另一“特殊”坐标为θ=90°,其限定横向于光轴包含光源的平面(或者更准确地说,包含用于远场计算的光源的标称位置,例如点L0)。
在实践中,在整个纵向跨度上实现均匀的光强度通常来说不困难,因为其直接构造围绕光轴(即围绕轴线θ=0°)旋转对称的光源。例如,白炽灯L适于采用位于坐标中心L0的白热灯丝,其可设计来发出基本上全向的光,从而提供相对于方位θ对于任何纬度来说均均匀的强度分布。
然而,相对于高程或纬度坐标实现理想的全方向强度通常是不实际的。例如,灯L被构造成符合标准“爱迪生灯座”的灯具,为此目的,白炽灯L包括螺纹爱迪生灯座EB,其可以例如是E25、E26或E27灯座,其中数字表示基座EB上螺纹绕圈的用毫米表示的外径。爱迪生灯座EB(或更普遍地,位于光源“后面”的任何电力输入系统)位于光源位置L0“后面”的光轴上,并从而阻止向后发出的光(即沿南纬,也就是沿θ=180°阻止照明),并且因此白炽灯L不能相对于纬度坐标提供理想的全向光。
已构造商用白炽灯,例如60W Soft White(淡白)白炽灯(美国纽约通用电气),其提供在纬度跨度θ=[0°,135°]上的强度,该强度在如图2所示的纬度范围上的平均强度(线C)的±20%(区域D)内是均匀的。图示A示出了灯丝与光轴水平地对齐的情况下白炽灯的强度分布,并且图示B示出了灯丝与光轴对齐的情况下白炽灯的强度分布。虽然仍然对均匀性跨度感兴趣,例如θ=[0°,150°]的纬度跨度具有±10%的均匀性,但是普遍考虑的是全向灯的可接受的强度分布均匀性。这些均匀性跨度有效满足了LED灯的当前未决规定,诸如US DoE Energy Star Draft 2(美国能源部能源之星草案2)或US DoE Lighting Prize(美国能源部照明大奖)。
与白炽灯和卤素灯相比,例如发光二极管(LED)器件的固态发光技术本身是高度定向的,因为它们是仅从一侧发光的扁平器件。例如,具有封装或没有封装的LED器件通常以强度随θ=[0°,90°]范围内的cos(θ)变化的方向性朗伯(Lambertian)空间强度分布发光,并在θ>90°时具有零强度。半导体激光器本身甚至更具方向性,并且实际上发出基本上可称为限于约θ=0°的窄光锥的前向光束的分布。
与固体发光相关的另一挑战是与白热灯丝不同,利用标准110V或220V交流电源通常不能有效操作LED芯片或其他固体发光器件。相反,车载电子器件通常设置成将交流输入电源转换为适于驱动LED芯片的低电压直流电源。可替换地,足够数量的一连串LED芯片可以直接在110V或220V的电压下工作,并且具有合适极性控制(例如齐纳二极管)的这些串的并联布置可以在110V或220V交流电源下工作,虽然功率效率大幅降低。在任何一种情况下,与一体式白炽灯或卤素灯中所用的爱迪生灯座相比,电子器件构成灯座的附加部件。
固体发光的又一挑战是需要散热。LED器件与白炽灯或卤素灯相比在性能和可靠性方面对温度都高度敏感。这通过放置与LED器件接触或以其它方式良好热接触的大量散热材料(即散热器)来解决。由散热器所占用的空间阻碍了发光,并且因此进一步限制了产生全向基于LED的灯的能力。当LED灯受到限定所有灯部件(包括光源、电子器件、光学元件、及热管理件)的最大尺寸的当前调节限制(ANSI,NEMA等)的物理尺寸的限制时,该局限性被增强。
电子器件和散热器的组合形成了阻止“向后”照明的大型基座,这迄今明显限制了利用LED替换灯产生全向照明的能力。散热器尤其优选具有大容量以及大表面积,以便通过对流和辐射的组合将热量排出灯。
目前,作为白炽灯替代的大多数商用LED灯未提供类似于白炽灯的均匀强度分布。例如,半球元件可以放置在LED光源上方。由此产生的强度分布主要向上延伸,并且赤道以下只发出很少的光。明显地,这不会提供让人满意地模仿白炽灯的强度分布。
发明内容
本文公开了实施例作为说明性实例。在一个实施例中,发光装置包括围绕LED光源的透光封套。光源与散热基座元件热连通。多个表面积加强元件与基座元件热连通并沿一定方向延伸以使元件邻近发光封套。正确设计的表面加强元件将提供足够的热耗散,同时不会显著干扰来自于LED光源的光强度分布。
根据另一实施例,提供一种包括发光二极管光源的发光装置。发光二极管与基座元件热连通。基座元件的光阻挡角在15°至45°之间。多个表面积加强元件定位成与基座元件热连通并使装置的散热能力增加4倍并吸收小于10%的发光通量。
在另一实施例中,一种发光器件包括多个安装到金属芯印刷电路板(MCPCB)上,并且从金属芯印刷电路板接收电力的发光二极管。设置具有第一圆柱部和第二截头圆锥部的散热器,并且MCPCB与散热器的截头圆锥部热连通。爱迪生螺旋灯座设置成邻近散热器的圆柱部。电连接件设置在螺旋灯座(任何所需的电子器件包含在圆柱部中)与MCPCB之间。光漫射封套从散热器的截头圆锥部延伸,并包围发光二极管。优选地,至少四个导热翅片与散热器热连通并从散热器邻近封套延伸。翅片具有邻近散热器的第一相对较薄部分、邻近封套且远离散热器的第二相对较薄部分以及相对较厚的中间部分。有利地,该器件的尺寸被设计为满足ANSIC78.20-2003。
附图说明
本发明可采取各种部件及部件的布置、以及各种工艺操作及工艺操作的布置的形式。附图的目的仅用于示出实施例且不应被理解为限制本发明。
图1参照传统白炽灯泡示意地示出了本文用来描述照明分布的坐标系。
图2示出了白炽灯在各个纬度的强度分布。
图3示意地示出了本发明的灯。
图4是采用基于LED的平面朗伯光源和球封套外围翅片高镜面反射散热的基于LED的全向灯的侧视图。
图5是可替代的漫射散热的基于LED的全向灯的侧视图。
图6示意地示出了散热器阻碍从光源发出的光的物理阻挡角以及获得可接受光分布均匀性的截止角(cutoff angle)。
图7示出了与平面翅片的几何形状相关联的术语。
图8是利用示出光学光线路径的竖直平面翅片的示例性灯的示意顶部图。
图9示出了图5的全向基于LED的灯在不同纬度角度的光强度。
图10示出了围绕图4和5的灯的赤道的变化纵向角360°的光强度。
图11示出了围绕具有不同表面光洁度(镜面和漫反射)的12个导热翅片的示例性灯的变化纵向角360°的光强度的光学建模数据。
图12示出了表示表面镜面反射率依据纬度角对灯的强度分布的影响的光学光线跟踪建模数据。
图13示出了采用邻近含光源封套的导热翅片的散热器设计的可替换实施例。
图14示出了一优选实施例的可替换实施例,其中具有邻近光源的不同数量的表面积加强元件。
图15示出了增加导热翅片的数量对典型实施例的纬度角的光强度分布的影响。
图16示出了增加导热翅片的厚度对纵向强度分布的影响。
图17示出了表示散热器的阻挡角对设计截止角和强度均匀性的影响的光学光线跟踪建模数据。
图18示出了采用不同长度的导热翅片元件的散热器设计的实施例。
图19示出了采用不同数量和宽度的导热翅片且同时保持类似的散热表面积的散热器设计的实施例。
图20示出了采用不同宽度的导热翅片元件的散热器设计的实施例。
图21示出了采用不同厚度的导热翅片元件的散热器设计的实施例。
图22示出了采用销或非平面翅片形状的表面积加强元件的散热器设计的实施例。
图23示出了采用平面翅片形状的且与光轴相比以一定角度或曲率邻近光源的非竖直表面加强元件的散热器设计的实施例。
图24示出了围绕非球形封套的散热器设计的实施例。
图25示出了由优选实施例的光热限制形成的设计空间。
具体实施方式
LED替换灯的性能可以通过其有效寿命量化,如由光通维持寿命和可靠度与时间的关系确定。然而,白炽灯和卤素灯的寿命通常为1000至5000小时,LED灯可以为>25,000小时,并可能高达100,000小时或更长。
产生光子的半导体材料的p-n结的温度是确定LED灯寿命的重要因素。在大约100°C或更低的温度下获得较长的灯寿命,但在约150°C或更高温度下寿命严重缩短,中间温度下寿命逐渐变化。在大约2009年的典型高亮度LED的半导体材料(~1W,~50-100流明,~1×1平方毫米)中耗散的功率密度大约为100W/cm2。相比之下,在陶瓷金属卤化物(CMH)电弧管的陶瓷封套中耗散的功率通常大约为20-40W/cm2。然而,CMH灯中的陶瓷在其最热点处在大约1200-1400K下工作,LED器件的半导体材料应在大约400K或更低温度下工作,不管是否具有比CMH灯大2倍的较高功率密度。在CMH的情况下,灯中的热点与必须耗散功率的环境之间的温差大约为1000K,但在LED灯的情况下仅为约100K。相应地,对LED灯的热管理必须比典型的HID灯更有效十倍。
在设计散热器时,被动冷却热回路中的限制热阻抗通常为向环境空气的对流阻抗(即热量耗散到环境空气中)。对流阻抗通常与散热器的表面积成正比。在替换灯应用的情况下,当LED灯因为替换了传统爱迪生白炽灯而必须适合相同空间时,对暴露于环境空气的表面积的可利用量有固定的限制。因此,有利的是,尽可能多地使用该可利用表面积将热量耗散到环境中,例如在光源周围或附近放置导热翅片或其他散热结构。
该实施例涉及一种一体式替换LED灯,其中灯的输入为主电源,并且输出为所需的强度分布图,优选在灯的外部无辅助电子或光学部件。参照图3,基于LED的灯10包括基于LED的朗伯光源12以及透光球封套14。然而,应注意的是,“球形”在文中用来描述大致球形的形状。而且,应注意的是,其他形状也可提供类似有用的强度分布。此外,相对于球形的偏差被包含在该描述中,并且实际上在某些实施例中优选的是加强漫射器和散热器之间的相互作用。所示的透光球封套14优选具有漫射光的表面。在一些实施例中,球封套14为玻璃元件,但也可考虑诸如塑料或陶瓷的其他透光材料的漫射器。封套14可以固有地是漫射光的,或能够以不同方式使其漫射光,例如:进行消光(frosting)或其它纹理化处理促进光漫射;用光漫射涂层(如用作某些白炽灯泡的玻璃灯泡上的光漫射涂层的Soft White漫射涂层(可以从美国纽约通用电气公司获得))进行涂覆;将光漫射粒子嵌入到封套的玻璃、塑料、或其他材料中;上述方式的各种组合,等等。然而,应注意的是,基本上为非漫反射的封套也同样在本发明的范围内。此外,如果封套的内部采用了其他光漫射机构,则该设计参数是可行的。
封套14在光学上还可包括荧光层,荧光层例如涂覆在封套表面上的用于将来自于LED的光转化为另一种颜色,例如将来自于LED的蓝光或紫外(UV)光转化为白光。在一些这样的实施例中,可预料的是,荧光层为漫射器14的唯一构成。在这样的实施例中,荧光层可能是漫射荧光层。在其他可预料的实施例中,漫射器包括荧光层加上上述的附加漫射元素(诸如消光层、瓷漆、涂层等等)。可替换地,荧光层可能与LED封装相关联。
基于LED的朗伯光源12包括至少一个发光二极管(LED)器件,其在所示的实施例中包括具有混合以呈现出所需颜色温度和CRI的白光的各自光谱和强度的多个器件。例如,在一些实施例中,第一LED器件输出具有绿色再现的光(例如可利用涂覆有合适“白色”荧光层的发蓝光或紫光的LED芯片而实现的),并且第二LED器件输出红光(例如可利用自然发出红光的GaAsP或AIGaInP或其他外延LED芯片而实现的),并且来自于第一和第二LED器件的光混合在一起以产生改进的白光再现。换句话说,同样可预料的是,平面的基于LED的朗伯光源包括单个LED器件,该LED器件可以是白色LED器件或饱和色LED器件等等。同样可预料的是,激光LED器件并入该灯中。
在一个优选实施例中,透光球封套14包括开口部,该开口部的大小设计为容纳或配合基于LED的朗伯光源12,使得基于LED的朗伯光源12的发光原理表面面向并进入球封套14的内部并将光发射到球封套14的内部内。球封套与基于LED的朗伯光源12的面积相比较大。基于LED的朗伯光源12安装在开口部处或该开口部中,其中其发光表面设置成与球封套14的曲面大致相切。
基于LED的朗伯光源12安装在基座16上,该基座提供散热和用于容纳电子器件的空间。LED器件沿平面方向安装在电路板上,该电路板可选地为金属芯印刷电路板(MCPCB)。该基座元件16为LED器件提供支撑,并且导热(散热)。为了提供充分的散热,基座16与多个导热翅片18热连通。翅片18邻近球封套14朝向灯的北极延伸。翅片18可以由任何导热材料构成,优选具有高热导率的翅片,更优选易于制造的金属或合适的可模制塑料,并且尤其优选铸件或铝或铜。有利地,可以看出该设计提供一种适配于A-19白炽灯泡的ANSI轮廓(ANSI C78.20-2003)内的基于LED的光源。
现在参照图4-5,电子驱动器容纳在灯座20、22内,每个基座的平衡部(即,每个基座不被各个电子器件占据的部分)由散热材料制成。电子驱动器自身足以将爱迪生灯座23所接收的AC电源(例如,美国住宅和办公场所中的爱迪生灯座中传统上可利用类型的110伏AC,或欧洲住宅和办公场所中的爱迪生灯座中传统上可利用类型的220伏AC)转换成形式适宜的格式以驱动基于LED的光源。(还可预料的是,采用另一种类型的电连接器,诸如在欧洲有时用于白炽灯泡的卡口座)。
该灯进一步包括延伸部,该延伸部包括在球封套14的一部分上延伸以进一步增加由LED芯片产生的热量辐射和对流到周边环境的翅片24和26。虽然图4和5的翅片类似,但它们示出了各种设计如何达成所期望的结果。此外,翅片26比翅片24稍微更细长些并分别延伸到基座22和20的更深处。
散热基座的角度有助于保持光均匀分布于大角度(例如至少150°)。图6示出了限定附接到散热器上的典型LED的角度命名的示意图。在该实例中,漫射元件60均匀发光。散热器62以阻挡角α阻挡64阻碍发出的光,该阻挡角从光轴至散热器上的实质地阻碍从光源60的几何中心发出的光的点获取。由于散热器的实质阻碍,很难以小于α阻挡64的角度产生显著的强度。在实践中,存在截止角α截止66,散热器的实质阻碍在该点处的影响最小。
图17示出了根据变化α阻挡值的纬度角的强度分布。在135°的纬度角(等同于45°的α截止),23.6°、30°、36.4°和42.7°的α阻挡值的归一化强度分别为79%、78%、76%和72%,如图17中的H、I、J和K所示。这清楚地表明,当α阻挡接近α截止时,显著地降低了强度均匀性。对强度降低小于5%的实践限制而言,α阻挡应比所期望的α截止小10-15°,其由等式:α 阻挡+10°表示。45°的α截止的实例显然适用于其他α截止角和其他所期望的强度降低水平。对于A型(A-line like)LED灯的情况,如果截止角>35°,则难以在纬度角中具有高度均匀的强度分布(向前至向后发出的光)。另外,如果截止角太浅<15°,则灯中其余部分中没有足够的空间来容纳LED驱动器电子器件和灯座。20-30°的最佳角度有利于保持光分布均匀性,同时为灯中的实用元件保留空间。当前的LED灯提供0°至至少120°的均匀输出,优选135°,更优选150°。这是对传统A19白炽灯泡的良好替代。
需要使基座20、22更大以适应电子器件的体积,并提供充分散热,但该基座还优选地构造为最小化阻挡角,即由于其他灯部件(如电子器件、散热基座和导热翅片)的存在而显著改变的全向光分布的纬度角。例如,该角可以为135°或类似角度以提供类似于当前白炽光源的均匀光分布。通过应用用于基于LED的光源部28、30的且大小大致与基于LED的光源相同的较小接受区,并使侧边成一定角度、弯曲或以其它方式形成小于所期望的阻挡角的形状(优选利用截头圆锥形状),将这些不同考虑事项包括在各个基座20、22中。基座的侧边从基于LED的光源向外延伸一距离,该距离足以使这些侧边与基座部分32、34配合,所述基座部分的直径为足够大以容纳电子器件并且与合适的电气连接件配合。
散热器的光学特性对由此产生的光强度分布具有重大影响。当光碰撞表面时,其可以被吸收、被传输或被反射。就多数工程材料而言,对可见光来说可透过,并因此可见光可以被吸收或从表面反射。关注的光学效率、光学反射率和反射率在文中是指可见光的效率和反射率。表面的绝对反射率会影响灯的总体效率,并且会影响散热器对光源的内在光强度分布的干扰。虽然只有一小部分光源发出的光会碰到具有设置在光源周围的导热翅片的散热器,如果反射率非常低,则在这散热器表面上会丢失大量通量,并且降低了灯的总体效率。类似地,光强度分布受从光源发出的光的重定向和由散热器吸收的通量的影响。如果反射率保持在高水平,例如大于70%,则可使光强度分布的畸变(distortion)最小化。类似地,经向和纬向强度分布可以受散热器和表面加强元件的表面光洁度的影响。具有高镜面反射率(像镜子一样)的光滑平面使下层强度分布畸变的程度比漫反射(朗伯)表面小,因为光被沿入射角而不是垂直于散热器或导热翅片表面向外引导。
图8示出了典型灯实施例的顶部示意图。源的直径是指透光封套的直径或其他定义的最大直径。这将定义灯的发光区域的大小和与发出的光相互作用的散热器的表面加强元件的宽度或其他特征尺寸之间的关系。100%的发光通量离开透光封套。一部分与表面积加强元件和散热器相互作用。就平面导热翅片而言,这通常由导热翅片的数量、导热翅片的径向宽度、和透光封套的直径确定。碰撞散热器和表面积加强元件的一部分通量与散热器表面的光学反射率的乘积简单降低了总体效率。
散热材料的热性能对由灯系统耗散的总功率、以及LED器件和驱动电子器件产生的温度有很大影响。由于LED器件和驱动电子器件的性能和可靠性一般要受操作温度的限制,所以选择具有合适性能的散热材料至关重要。材料的热导率限定材料导热的能力。由于LED器件具有非常高的热量密度,所以用于LED器件的散热材料应优选具有高热导率,以便产生的热量能够快速离开LED器件。一般地,金属材料具有高热导率,其中常用的结构金属例如合金钢、挤制铝和铜的热导率分别为50W/m-K、170W/m-K和390W/m-K。高导热材料将允许更多热量从热负荷移至周围环境,并使热负荷的温升降低。
例如,在典型的散热器实施例中,如图4和5所示,为了耗散~8W的热负荷,与用作热源的高导热(390W/m-K)材料相比,就低热导率(50W/m-K)而言,与环境温度的温升的差值为高~8°C。其他材料类型也可用于散热用途。已说明了高热导率塑料、塑料复合物、陶瓷、陶瓷复合材料、诸如碳纳米管(CNT)或CNT复合物的纳米材料及其他材料具有有用范围内的热导率,并且等同于或超过铝的热导率。实际的考虑事项(诸如制造过程或成本)也可影响热性能。例如,铸铝(其在量大的情况下通常价格便宜)的热导率值大致是挤制铝的一半。考虑到制造的容易和成本,优选的是将一种散热材料用于多数散热器,但是,相同材料的铸造/挤制方法的组合或甚至将两种或更多种不同的散热材料结合到散热器结构中以最大化地冷却对本领域的技术人员来说是显而易见的。大致5-15微米的电磁辐射谱的远红外区域的发射率或辐射效率对于散热器表面来说也是重要性能。通常,非常有光泽的金属表面具有非常低的发射率,大约为0.0-0.2的级别。因此,涂层的种类或表面光洁度是可取的,例如漆层(0.7-0.95)或阳极氧化涂层(0.55-0.85)。散热器上的高发射率涂层比具有低发射率的裸金属表面散发的热量大约多40%。例如,在典型的散热器实施例中,如图4和5所示,为了耗散~10W的热负荷,与散热器上的高发射率(0.92)表面相比,就低发射率(0.02)而言,与环境温度的温升的差值为15°C。高发射率涂层的选择还必须考虑涂层的光学性能,因为如上所述,低反射率或低镜面反射率会对灯的总体效率和光分布产生负面影响。
翅片可以从“地理北”0°横向延伸至截止角的平面,并且超过截止角达到电子器件和灯座柱体的物理界限。只有位于“地理北”0°至截止角平面之间的翅实质上与发出的光分布在光学上进行相互作用。截止角下方的翅片具有有限的相互作用。翅片的光学相互作用取决于翅片的实际尺寸和表面性能两者。如图7所示,与光分布相互作用的翅片的实际尺寸以翅片的宽度、厚度、高度及数量的简单术语限定。翅片的宽度主要影响光分布的纬度均匀性,翅片的厚度主要影响光分布的经度均匀性,翅片的高度影响干扰了多少纬度均匀性,翅片的数量由于纬度和经度影响而主要确定发出的光的总减少量。在一般术语中,发出的光的相同部分在所有角度均与散热片相互作用。在功能术语中,为了保持源的现有光强度分布,由于翅片的宽度和厚度形成的光源的表面积应与它们包围的发光表面的表面积保持恒定比。
为了使纬度影响最小化,翅片的宽度理想地从在90°赤道处的最大值逐渐缩小为在“地理北”0°处的最小值以及在截止角平面处的分数比(fractional ratio)。然而,在功能方面,可要求优选的翅片宽度改变,以便不仅满足当前规章限制(ANSI、NEMA等)的灯构造轮廓,而且还满足消费者审美或制造约束。任何非理想的宽度都会对纬度强度分布并进而对照度分布产生负面影响。
基本上设计的平面导热翅片通常较薄以最大化表面积,并且沿纵向方向、即沿厚度方向,存在基本上有限的范围。换句话说,每个翅片基本上位于一平面内,并由此基本上不会对纵向强度分布的全向性质产生负面影响。光源的纬向周长与最大单个翅片厚度的比优选等于8:1或更大。为了进一步最大化表面积,可增加翅片的数量。在符合翅片厚度的前述优选比的同时,翅片的最大数量由于通过导热翅片的表面吸收和重定向光而通常由邻近南极的角度处的光学效率和强度水平的减小来限制。图15示出了在标称设计中翅片数量的增加在纬度角方在对强度均匀性的影响。例如,在从北极0°的135°的角处,对于8个、12个和16个导热翅片来说,强度为0°-135°的平均强度的79%、75%、和71%。其示出了翅片具有90%的光学反射率、50%的镜面表面。这种情况下,增加翅片的数量使每增加4个翅片总体光学效率降低~3%。该影响还由于散热器表面的固有反射率而倍增。
如前所述,翅片设置成用于散热。为了沿向上的光轴提供一些光,翅片通常具有较薄的端部,并且中间部相对较厚。对于保持均匀光强度分布来说还至关重要的是散热器的表面光洁度。可以选择从镜面(反射)改变至漫反射(朗伯)表面的表面光洁度范围。镜面设计可以是反射性的基础材料或所施加的高镜面反射率涂层。漫反射表面可以是在基础散热材料上的光洁表面、或可以是所施加的漆层或其他漫反射涂层。每个都具有一定的优点和缺点。例如,强反射表面具有保持光强度分布的能力,但由于裸金属表面的较低发射率而可能对导热不利。此外,在LED灯的通常为25,000-50,000小时的整个寿命期间也难以保持高度镜面。可替换地,具有漫反射表面的散热器与可比较的镜面相比具有降低的光强度分布均匀性。然而,在典型LED灯的整个寿命期间表面的保持性更稳定,并且还提供了类似于现有白炽全向光源的视觉外观。如上所述,与将增加散热器的散热能力的镜面相比,漫反射面还可能具有增加的发射率。优选地,涂层具有高度镜面反射率的表面以及高发射率,其实例为高度镜面反射性漆层、或者位于高度镜面反射性漆层或涂层之上的高发射率的涂层。
所期望的是,散发来自于LED的热量以保持LED的结温足够低以便保证长久寿命。令人意想不到的是,将多个薄导热翅片放置在发光源自身周围不会对纵向角的均匀光强度产生明显干扰。参照图16,示出了不同厚度的导热翅片对灯赤道的纵向强度分布的影响。该实施例具有8个翅片,具有80%的光学反射率、漫反射表面光洁度、及40mm直径的发光封套。均匀强度分布的畸变的大小可以用最小至最大峰值距离表征。就0.5mm厚的导热翅片的情况而言,畸变程度仅为±2%,而在6.5mm厚度时,畸变程度为±9%。中间值提供中间结果。此外,当大量光源的通量碰撞在散热器上时,总体光学效率还随着翅片厚度增加而降低,从0.5mm翅片厚度时的93%变为6.5mm时的76%。再者,中间值产生中间结果。当所期望的畸变水平小于±5%时,光源直径与翅片厚度之比必须保持在大约8:1的比率之上。同样,必须选择所期望的总体光学效率程度,通常大于80%,优选大于90%,这还限制了所期望的翅片厚度。例如,在A19的实施例中,导热翅片保持最大厚度,例如小于5.0毫米,优选小于3.5毫米,最优选在1.0至2.5毫米之间,以免阻挡光并同时仍然提供正确的表面积和截面积来用于散热。对于特定制造技术(诸如机加工、铸造、注射模制成型或该行业的其他技术),可能期望一最小厚度。形状优选为绕光源逐渐缩小,其中在0°(灯上方)处的宽度最小,以便不完全阻挡发出的光。导热翅片在散热器基座开始并且延伸至灯上方的0°之下的某些点,以免阻挡沿光轴的光,同时提供足够的表面积将来自于LED光源的所需数量的热量散发出来。该设计可以融合少量的大宽度导热翅片或大量的小宽度导热翅片,以满足热需求。导热翅片的数量一般由用来散发由灯中的LED光源和电子部件产生的热量所需的导热翅片表面积确定。例如,60W白炽替换LED灯可能会消耗大致10W的功率,该功率的大约80%必须通过散热器散发出来,以便将LED和电子部件保持在足够低的温度以保证长久寿命的产品。
需要高反射率(>70%)散热器表面。完全吸收型散热器(0%反射)表面可吸收标称设计中所发出光的大致30%,同时如果翅片具有80%-90%的反射率,大致1%被阻挡。由于LED灯的LED光源、光学材料、荧光层、封套、及散热材料之间通常存在多次反射,因此反射率对灯的总体光学效率具有倍增效应。散热器表面镜面反射也可以是有利的。镜面表面平滑了使导热翅片邻近球形漫射器产生的纵向强度分布中的峰值,而这些峰值即便在相同的总体效率下的漫反射表面时也较强。由于漫反射表面光洁度散热器中存在导热翅片干扰,大约±5%的峰值可以利用镜面散热器完全消除。如果纵向光强度分布的畸变程度保持在~10%(±5%)以下,人眼将感知到均匀的光分布。类似地,纬度角的强度分布也受益。5-10%的平均强度可以在灯下方的角度(例如135°-150°)处利用漫反射的镜面而获得。
现在参照图10,令人意想不到的是,示出了翅片对灯的纵向光强度分布的有限影响。在这种情况下,该设计由散热器组成,该散热器具有厚度为1.5mm的8个竖直平面翅片以及漫反射或镜面反射表面光洁度。两种设计中的翅片的径向宽度“W”与发光封套直径之比都为~1:4。图4和图5以图形方式表示了这些实施例。清楚地,θ=90°时光强度的变化对漫反射和镜面反射翅片两者来说在时都是最小的,如E处所示,对于漫反射导热翅片而言所测量强度方面具有±5%的偏差,并且当利用镜面反射翅片时偏差小于±2%。其示出了将合适尺寸的表面积加强元件放置在光源周围或附近以便在不干扰纵向光强度分布的情况下获得表面积的优点。此外,实践表明了基本上镜面表面光洁度与漫反射表面相比的优点。F处的强度的大幅减少是测量系统的人为现象。
图11示出了用于典型的8个翅片灯设计的光学建模结果。对完全镜面反射和漫反射翅片表面进行评估。利用光学光线跟踪建模在灯赤道周围的0-360°的纵向角中评估每种表面的强度分布。漫反射翅片表现出强度大约有±4%的变化,而镜面表现出几乎不变化。任何一种表面都可能提供均匀的光分布,而看出明显优选的是镜面或接近镜面光洁度的表面。
现在参照图12,示出了在与从典型LED灯发出的光相互作用的散热区域上应用镜面表面光洁度对于纬度角的光强度分布的均匀性的好处。示出了当与0-135°的平均强度相比时,邻近南极的角度(在该实例中,135°,用箭头标明)处的强度水平对与漫反射表面相比的镜面来说高23%。还示出了50%镜面和50%漫反射表面的强度分布,其在平均强度方面获取了全镜面反射表面的好处的大致一半。不能含蓄陈述表面的镜面反射率的影响,因为其具有有益于光强度分布的均匀性的双重作用。图上的点G限定了被称为强度分布的‘枢’点的点,该点名义上位于该设计的赤道上。当散热器表面的镜面反射率增加时,枢点北方的强度减小,并且枢点右方的强度增加。这降低了平均强度并增加了实现均匀性的向南的角。这对产生向下到达可能邻近南极的最大角的均匀强度分布来说至关重要。
再次参照图8,示出了当前灯设计的有效性。此外,如果设置有镜面(图2)或漫反射(图3)表面的翅片有效引导光,则用光线跟踪来表示。此外,可以看出,当将高反射率散热材料或涂层用于灯的实施例中时,可获得较高的总体光学效率。由于由漫反射LED光源所发出的光的仅一部分(~1/3)碰撞在散热器表面上,因此高反射率散热器表面将仅吸收从漫反射LED光源发出的总通量的一小部分(<5%)。
参照图9,可以看出,当前设计(图5)在邻近其南极处提供足够的光强度。图中的虚线示出在135°和150°(其为用于表征光强度分布的全向特性的有用角度)处测量数据的强度。此外,0°至135°视角范围的平均强度的变化不超过±10%,这将满足或超过多个独立可能的光强度均匀性要求。其也许会超过US DoE Energy Star提出的草案2的规范(在135°处为±20%)、以及与标准Soft White白炽灯(在135°处为±16%)性能的等效性,所述白炽灯是可利用的当前优选的全向光源。在150°视角处,±20%的变化也许会超过标准Soft White白炽灯的性能,并且几乎满足USDoE Bright Tomorrow Lighting Prize的要求(在150°处为±20%)。图9示出了当前灯设计实现该结果的有效性。
图13a-d示出了本公开范围内的另一优选翅片和封套设计。图13a示出了竖直导热翅片包围基本上球形的光漫射器的实施例。导热翅片朝向地理北逐渐缩小,并提供优选的光强度分布。图13b示出了竖直导热翅片仅延伸至透光封套的赤道的实施例。其提供了便于组装和制造的附加好处,因为LED光源和封套可以从散热器顶部(地理北)简单地插入且不是如图13a中那样完全被散热器包围。图13c示出了具有包围发光区域的更小部分的竖直导热翅片的透光封套。图13d示出了图13a和13b的组合,其中通过使竖直导热翅片延伸穿过赤道但与赤道相切来获得附加表面积,以便保留图13b的组装和制造好处。另外,图13b和13c示出了多种封套和光源形状周围的表面积加强元件的应用。
图14a-f示出了在本公开范围内添加附加表面积加强元件的影响。图14a和14d示出了具有8个竖直平面导热翅片的典型灯实施例的侧视图和顶视图。图14b和14e示出了具有12个竖直平面导热翅片的典型灯实施例的侧视图和顶视图。图14c和14f示出了具有16个竖直平面导热翅片的典型灯实施例的侧视图和顶视图。清楚地,通过暴露于周围环境的增加的表面积来增强利用较多数量的翅片的设计的散热能力,但以纬度角的光强度均匀性为代价,如前面图15中所示和所讨论的。一个特别有用的实施例可能是为了改变翅片的数量以解决美观或制造问题,而将导热翅片从完全竖直的方向移至远离光轴的角度θ。假设导热翅片具有相同的竖直高度,则它们具有比完全竖直翅片大1/cosθ倍的表面积。在这种情况下,翅片的数量可减少1/cos(θ)倍,并且该系统将具有大致相同的热性能或光学性能。
图18a-b示出了不同长度的表面积加强元件的可替换实施例。为了达到所需散热水平,可采用不同竖直长度和形状的导热翅片。例如,图18a示出了两种形状和长度的导热翅片,其中较短的一种为锥形且被设计成通过具有与灯发光面积成比例的表面积来使对光强度分布的干扰最小化。提供附加的散热表面积,而对光强度分布没有明显干扰。图18b示出了另一种增加表面积而基本上不降低光强均匀性的方法。如果在α截止下方增设附加的较短长度的导热翅片(参见图6),则对强度分布的影响将最小,但将为散热器添加表面积。
图19a-d示出了具有类似表面积但应用不同表面积加强元件的典型灯实施例的可替换实施例。图19a和19c示出了具有径向宽度大致为发光封套直径的1/6的16个竖直平面翅片的典型实施例的侧视图和顶视图。图19b和19d示出了具有径向宽度大致为发光封套的1/3的8个竖直平面翅片的典型灯实施例的侧视图和顶视图。明显的是,导热翅片的表面积、以及成比例的散热和光学效率在这两种情况下都是相同的。可能需要更大数量或更小数量的翅片来解决美观、制造或其他实际问题。还示出的是,更大量的较小宽度翅片可以在几何结构内部提供用于散热器、电子器件、光源、及光学元件提供更大的内部体积,例如白炽替换灯应用。
图20a-b示出了采用不同宽度的竖直平面导热翅片的组合的典型灯实施例的侧视图和顶视图。
图21a-b示出了采用沿其径向宽度具有不同厚度的导热翅片的典型灯实施例的侧视图和顶视图。诸如铸造、机加工、注射模制成型等的一些制造工艺可以通过具有所示的拔模角获益。由于平面翅片的表面积主要由翅片的径向宽度驱动,因此厚度的逐渐减小对散热、光学效率或光强度分布的影响最小。
图22示出了相对于实心翅片采用销和非平面翅片的灯实施例的侧视图和顶视图。销允许更大的表面积以便占据与翅片相同的等效体积,并且还有助于对流的热量流过导热翅片体积。利用穿过实心翅片的孔或狭槽可获得类似的好处,但这样的方法可能很难进行制造,尤其是难以利用某些金属铸造技术制造。类似地,条形结构、椭圆结构或具有比销大但片材或平面结构小的更细长横截面长宽比的结构也在本申请中适用。
图23示出了采用弯曲翅片的散热器设计的灯实施例的侧视图和顶视图。翅片可以从竖直轴线沿任意方向弯曲。对相同数量的翅片来说,弯曲翅片与完全竖直翅片相比具有增大的表面积。弯曲翅片的物理尺寸(厚度、宽度、高度)将影响光的经向和纬向分布,因为它们将占据竖直和水平空间且不象前述实施例具有竖直翅片一样是完全平面的。
图24示出了由导热翅片包围的长椭球形(图24a和c)、扁椭球形(图24b和d)的透光封套。可设想的是包括在非球形封套范围之内和之外的变化。
对大多数台灯或装饰浴室/枝形吊灯照明来说,环境温度可考虑为25°C,但40°C及更高的环境温度也是可以的,尤其是在封闭的照明器或吊灯使用中。即使环境温度上升,LED灯的结温T结温应保持在100°C以下以便满足可接受的性能。对所有LED来说,散热垫温度T与T结温之间存在热阻,通常为5°C~15°C。由于期望理想的T结温温度低于100°C,因此期望T温度低于85°C。现在参照图25,示出了40°C大气条件下10WLED灯(8W散热负荷)的LED垫温度T和光传输效率。另外,期望高光效率(低吸收)的均匀光强度分布。为了保持高的灯效率,通常期望的是对于给定设计最大化光效效率,优选大于80%,更优选大于90%。光强均匀性可以限定为在邻近南极的某些角度处与平均强度的偏差,优选全向灯在135°时为±20%。图4和5示出了用于图25的优选实施例的翅片形状。导热翅片厚度在0.5mm至2.5mm之间变化,并且导热翅片的数量在8至16之间变化,并测量热和光学响应。散热器表面反射率保持在85%,其为裸铝的平均值,并且表面的镜面反射率保持在75%。当翅片的厚度和数量增加时,T有利地降低,并且光传输效率不利地降低。相反,当翅片的厚度和数量减少时,T增加,并且光传输效率有利地增加。就该实施例而言,不带任何翅片的截头圆锥圆柱的表面积为~37cm2。如图4或5所示的每对翅片增加大致~27至30cm2的翅片表面积,同时在翅片附接的情况下使圆锥/圆柱表面积减少~1至2cm2。从无任何翅片的基础情况至厚度为1.5mm的8个翅片的标称情况,提供4倍(相对于~37cm2为~148cm2)的加强表面积,这提供了增加的散热能力,并能够使T温度达到~80°C,同时保持光传输效率大于90%。参照图25,该实施例的操作的优选区域由<85°C的T温度和>90%的光传输效率限定。该区域具有至少2倍的加强表面积,这使散热器的散热能力增加。同样示出的是80%的强度均匀性的界线。清楚地,对其他灯实施例来说,可以基于限制或扩大优选区域的具体应用来为T温度、光传输效率、或强度均匀性设置不同的界线。尽管确切的尺寸和物理限制可以改变,但是将比较热设计参数与光学设计参数之间的折衷,以限定可接受的设计极限。
已经说明和描述了优选实施例。显然,阅读并理解前述详细描述后可以进行修改、变化及组合。旨在本发明应被理解为包括在所附权利要求或其等同物范围内的所有这种修改及变化。

Claims (29)

1.一种发光装置,包括:透光封套;发光二极管光源,照明所述透光封套的内部,所述光源与散热器热连通,所述散热器包括基座元件以及多个表面积加强元件,所述表面积加强元件与所述基座元件热连通,使得所述表面积加强元件与从所述透光封套发出的光光连通,并且其中,所述基座元件包括邻近于所述透光封套且在所述透光封套外部的第一直径以及远离所述透光封套的第二直径,所述第一直径比所述第二直径窄,使得所述装置具有在0°至120°的视角范围内的小于±30%的平均光强度变化。
2.根据权利要求1所述的发光装置,具有全向性光强度分布。
3.根据权利要求1所述的装置,其中,所述表面积加强元件具有的表面是镜面的、漫射的或其组合。
4.根据权利要求1所述的装置,其中,所述表面积加强元件的表面积根据纬度角而变化以调节输出光强度分布。
5.根据权利要求1所述的装置,其中,所述表面积加强元件的数量根据纬度角而变化以调节输出光强度分布。
6.根据权利要求1所述的装置,其中,所述表面积加强元件包括从所述光源向外延伸的扁的平面翅片或扁的弯曲翅片、杆、或销。
7.根据权利要求1所述的装置,其中,所述表面积加强元件包括邻近所述基座元件的第一窄宽度部分、邻近所述封套的第二窄宽度部分以及中间相对较宽的宽度部分。
8.根据权利要求1所述的装置,其中,所述封套基本上为球状。
9.根据权利要求1所述的装置,其中,所述表面积加强元件的光反射为至少60%。
10.根据权利要求1所述的装置,其中,所述表面积加强元件的光反射为至少75%。
11.根据权利要求1所述的装置,其中,所述表面积加强元件的光反射为至少90%。
12.根据权利要求9所述的装置,其中,所述表面积加强元件至少具有至少0.5的IR发射率。
13.根据权利要求1所述的装置,其中,所述基座元件具有15°至45°之间的光阻挡角。
14.根据权利要求1所述的装置,其中,所述基座元件包括用于电连接件的基座。
15.根据权利要求14所述的装置,包括由所述基座元件包围的LED驱动电子器件。
16.根据权利要求1所述的装置,提供至少80%的光学效率。
17.根据权利要求1所述的装置,提供至少90%的光学效率。
18.根据权利要求1所述的装置,其中,所述表面积加强元件使所述散热器的散热能力增加至少2倍并吸收小于20%的发光通量。
19.根据权利要求1所述的装置,其中,所述表面积加强元件使所述散热器的散热能力增加至少3倍并吸收小于15%的发光通量。
20.根据权利要求1所述的装置,其中,所述表面积加强元件使所述散热器的散热能力增加至少4倍并吸收小于10%的发光通量。
21.根据权利要求1所述的装置,平均光强度在0°至135°的视角范围内存在小于±20%的变化。
22.根据权利要求6所述的装置,其中,所述透光封套的外直径与翅片厚度的比率大于8:1。
23.根据权利要求1所述的装置,其中,所述表面积加强元件包括翅片,所述翅片具有邻近所述封套的第一较小厚度以及邻近所述基座元件的第二较大厚度。
24.根据权利要求1所述的装置,其中,所述表面积加强元件包括翅片,所述翅片包括弧形外表面。
25.根据权利要求1所述的装置,其中,所述表面积加强元件具有超过50%的镜面反射率。
26.根据权利要求1所述的装置,包括至少四个表面积加强元件。
27.根据权利要求1所述的装置,其中,所述透光封套为漫射的。
28.根据权利要求1所述的装置,其中,所述发光装置的尺寸被设计为满足ANSI C78.20-2003。
29.一种发光装置,包括:基座元件,具有15°至45°之间的光阻挡角;发光二极管光源,与所述基座元件热连通;多个表面积加强元件,与所述基座元件热连通,其中所述表面积加强元件使所述装置的散热能力增加至少4倍并吸收小于10%的发光通量,所述装置的平均光强度在0°至135°的视角范围内存在小于±20%的变化。
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