CN201425284Y - 具有新型结构的嵌入式散热器及发光二极管及发光二极管灯 - Google Patents

具有新型结构的嵌入式散热器及发光二极管及发光二极管灯 Download PDF

Info

Publication number
CN201425284Y
CN201425284Y CN2008201698491U CN200820169849U CN201425284Y CN 201425284 Y CN201425284 Y CN 201425284Y CN 2008201698491 U CN2008201698491 U CN 2008201698491U CN 200820169849 U CN200820169849 U CN 200820169849U CN 201425284 Y CN201425284 Y CN 201425284Y
Authority
CN
China
Prior art keywords
emitting diode
light emitting
fin
support
radiator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2008201698491U
Other languages
English (en)
Inventor
楼满娥
郭邦俊
李海波
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHUANGYUAN PHOTOELECTRIC SCIENCE AND TECHNOLOGY Co Ltd HANGZHOU
Original Assignee
CHUANGYUAN PHOTOELECTRIC SCIENCE AND TECHNOLOGY Co Ltd HANGZHOU
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHUANGYUAN PHOTOELECTRIC SCIENCE AND TECHNOLOGY Co Ltd HANGZHOU filed Critical CHUANGYUAN PHOTOELECTRIC SCIENCE AND TECHNOLOGY Co Ltd HANGZHOU
Priority to CN2008201698491U priority Critical patent/CN201425284Y/zh
Application granted granted Critical
Publication of CN201425284Y publication Critical patent/CN201425284Y/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/75Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/767Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89Metals
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21WINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2131/00Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
    • F21W2131/10Outdoor lighting
    • F21W2131/103Outdoor lighting of streets or roads
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

具有新型结构的嵌入式散热器及发光二极管及发光二极管灯,涉及一种大功率发光二极管组件(LED)及照明灯具。现有技术存在笨重、成本高、散热性能不佳的缺陷。该散热器包括一热导材料支架,支架顶部设有发光二极管散热底座安装位,所述支架上间隔地固定有若干散热片,散热片外包覆有具备至少一个通风口的外壳。本实用新型采用一种散热片和支架组合的散热器结构,整体都是镂空的,因此利于空气流通带走热量,因此散热效果非常好,并且重量轻,使发光二极管发光效率大大地得以提高,延长使用寿命。

Description

具有新型结构的嵌入式散热器及发光二极管及发光二极管灯 技术领域
本实用新型涉及一种大功率发光二极管组件(LED)及照明灯具,具 体是一种具有新型结构的散热器及发光二极管及发光二极管灯。
背景技术
发光二极管(LED)中的LED的发光芯片是一种半导体器件,它对热很 敏感,热会使它的电光转换效率降低,还会縮短LED的工作寿命,所以LED 在工作时都带有一个散热器。因此对于如何将发光二极管产生的大量的热 有效地散发掉,使发光二极管在较低的温度下工作,已成为制造发光二极 管和发光二极管灯的关键。为此,申请号为02826127. 5的发明专利"发光 二极管及其发光二极管灯",公开了一种具有新的散热底座的发光二极管和 发光二极管灯,该发光二极管包括:至少一个安装在高热导率的底座上的 发光二极管芯片,该发光二极管芯片通过一电路板与电源电连接,发光二 极管芯片上方有透光介质;所述的底座上表面为光反射面或底座四周安装 有光反射面,电路板安装在底座的上方,在底座下部设有至少一个螺丝或 螺丝孔,所述底座通过所述螺丝或螺丝孔直接与一散热器机械连接。由于 散热器和底座的直接紧密热连接,使芯片与散热器之间的热阻几乎等于零, 从而使芯片产生的热有效地散发掉,另外,金属底座与散热器用金属螺丝 连接,热连接十分可靠,长期工作不会变,所以,可制成功率大、效率高、 寿命长的发光二极管。但是该散热器为一实心金属块,外部加工成翅片状, 散热器结构笨重,与空气的接触面有限,散热性能不佳,消耗的金属材料 多,成本高。 实用新型内容
为了克服现有技术中存在的上述缺陷,本实用新型提供具有新型结构
的嵌入式散热器及发光二极管及发光二极管灯,通过采用散热片和一层状 支架相结合的结构达到改善散热性能、减轻重量、降低成本的目的。为此,本实用新型采用以下技术方案:
一种用于发光二极管的散热器,包括散热片,它还包括一热导材料支 架,支架顶部设有发光二极管散热底座安装位,所述支架上间隔地固定有 若千散热片,散热片外包覆有具备通风口的外壳。支架易采用高导热材料 制成。支架顶部可设有散热片。
本实用新型提供的应用散热器制作的发光二极管,它包括至少一个 发光二极管和连于发光二极管上的散热底座,该发光二极管通过电线与驱 动电路电连接,发光二极管的散热底座紧贴安装在所述的支架顶部的散热 片上。发光二极管的散热底座直接粘接紧贴安装在所述的支架顶部的散热 片上,或者发光二极管的散热底座的螺杆插装在所述的支架顶部,散热底 座和散热片紧贴。
在上述的技术方案中,还包括一罩设于LED上的透光泡壳,所述的驱动电 路设于绝缘电路室内,驱动电路与设于灯尾部的电连接器相连接,电连接器 用于与外电源连接,如此就构成了一种LED灯。
在上述的技术方案中,所述的支架由至少一支热超导管、或高导热率材 料或高导热率的复合材料或金属棒构成支架,该支架的形状为圆形、方形 或其它顶部为平的多面体的框架;所述的金属材料为铜、铝。
在上述的技术方案中,所述的散热片由具有高导热率高散热性能的纳米 碳管或其它纳米碳材料制成,也可以采用铜片、铝片或其它复合材料制成, 这种材料在平面上必须有很好的导热散热特性;该散热片的形状以安装在 所述的支架内相适应为准,其形状可以是圆形矩形等各种形状,视支架的 需要而定;该散热片的厚度在0.2ram〜10咖之间,其大小也依需要散热的
功率而定。
在上述的技术方案中,所述的纳米碳材料制成的散热片3上,可以在该 散热片上设置至少两根加强筋,该加强筋可以平行或交叉设置在散热片上。
在上述的技术方案中,所述的散热片和支架的连接方式可以是相互垂直 的,或相互平行的,或成-角度的连接固定,这个角度符合使用时热气流 上升方向的,有利于空气流通带走热量的。
在上述的技术方案中,安装在散热器顶端的发光二极管芯片为白光LED、也可以是各种单色可见光LED,或是各种波长的LED的组合它们可以 是直流驱动的,也可以是交流驱动的。
在上述的技术方案中,为了安全和使用方便,所述的多孔的或网状的外 壳用可以是绝缘材料或是金属材料制成,绝缘材料可以是塑料,金属材料 可以是铜、铁其表面可作适当处理例如镀铬,并有一定强度;网状材料上 的孔足以保证空气的流通,实现散热效果。支架、散热片、外壳三者构成了 一个嵌入式散热器,起到了高效散热、重量轻用材少的目的。
本实用新型的优点在于:
1. 由于本实用新型的散热器,采用一种散热片和支架组合的嵌入结 构,散热片和支架的连接方式可以是相互垂直的、相互平行的、或成一角 度的。当角度符合使用时热气流上升方向的时,有利于空气流通带走热量 的。并且该支架是镂空的,热气流极易空气流通带走热量的,因此散热效 果非常好。
2. 由于本实用新型中使用的散热片,具有高导热率和高散热率的纳 米碳管或其它纳米碳材料制成,也可以采用铜片、铝片或其它复合材料制 成,LED就紧贴固定在散热片上面;另外,散热片与散热片之间留有之适当 空隙,让空气能充分自由流通;所以LED在工作时产生的热量首先是通过 第一层的散热片散热,同时热量沿支架向下传,经过一小段距离就会又遇 到一张散热片发散掉一部份热量,如此经过几个循环热量就很快散发到周 围的空间中。因此,LED芯片或LED发光二极管的散热效果好,从而提高了 发光效率和延长了 LED或LED灯的使用寿命。
3. 本实用新型采用的散热片和支架组合组成的散热器结构,大大减 少了整体材料用量,降低了成本;更主要是重量大大地减轻了,散热效果 更好了,使LED发光效率提高。
4. 本实用新型还采用了一种对散热片添加强筋的结构,对用纳米碳 管做的散热片而言,强度较差可以在制作散热片时在内部或外部增添加强 筋。
5. 为了安全和使用方便,整个散热器用一多孔或网状的材料把外层围起 来,这个材料可以是绝缘的,也可以是金属,并有一定强度;网状材料上的孔足以保证空气的流通,实现散热效果。 附图说明
图1为本实用新型的散热器和发光二极管的一种安装示意图; 图2 (a)为本实用新型的一种网状外壳材料的结构示意图; 图2 (b)为本实用新型的一种多孔外壳材料的结构示意图;
图3 (a)为带螺杆结构的LED与支架连接图;
图3 (b)为一般LED与顶层散热板连接图;
图3 (c)为贴片LED与顶层散热板连接图;
图4 (a)是一种外形和白炽灯泡接近的LED球泡灯;
图4 (b)是图4 (a)中灯泡的分解图;
图5 (a)是圆形散热片示意图;
图5 (b)是矩形散热片示意图;
图5 (c)是梯形散热片示意图;
图5 (d)是竖直形散热片示意图;
图6 (a)是散热片和支架垂直方向安装示意图;
图6 (b)散热片以成角度方式安装在支架上;
图6 (c)是散热片与支架成平行方式安装示意图;
图7 (a)是单个LED为光源的路灯结构示意图;
图7 (b)是多个LED为光源的路灯结构示意图。
图中:
以下结合附图和具体实施例对本实用新型进行详细描述,但不作为对本
实用新型的限定:
具体实施方式
实施例1
参照图5a、图5b、图5c、图5d和图6a、图6b、图6c,制作一本实 用新型的用于发光二极管的散热器。散热片3用碳纳米管、或碳纳米材 料制成的薄片,也可以用铜片,该散热片3的厚度在0.2咖〜10腿之间, 其形状与支架2相适应。用高热导材料例如用一根超导热管为主体做成支 架2的立柱,在该立柱顶上固定一块散热片3,在支架四周安装三层散热片,三层散热片3与该立柱垂直安装,并且散热片3之间的空隙为2〜10ram,让 空气能充分自由流通丄ED在工作时产生的热量首先是通过第一层的散热片 散热。同时热量沿支架向下传,经过一小段距离就会遇到一张散热片发散 掉一部份热量。如此经过几个循环热量就很快散发到周围的空间中。或者 用三根或五根超导热管交叉搭成一个圆形支架2,在该支架2顶部为平的, 在其上固定一块带有孔的铜散热片3,在支架四周平行安装五道散热片3, 六层散热片3之间的空隙为5mm〜10 ram,之间的空隙4可以让空气能充分 自由流通。用塑料编织成网状的圆筒外壳6 (如图2a、图2b所示)包裹在 支架外,与支架成为一体;或金属制作的一多孔的圆筒外壳6包裹在支架
另外的实施例中的支架2,还可以用铜、铝等高导热率材料搭建成一个 多面提的框架,其顶部微片。
发光二极管的芯片安装在支架2顶部的散热片3上, 一块芯片或多块芯 片阵列式排列在散热片3上(如图3c所示),底面都必须紧贴在散热片上。 实施例2
参照图1,用实施例1制作的嵌入式散热器做一本实用新型的嵌入式 发光二极管,该组合式发光二极管包括一发光二极管1 (如图3a);或包 括三个、五个发光二极管1 (如图7b),或者也可以组合安装,可用集成 封装的LED,该发光二极管1紧贴安装在实施例1制作的散热器的散热片3 上表面上,该发光二极管1通过一电路与该发光二极管的驱动电源电连接; 本实施例的散热器以圆柱形铜棒为支架2,在该支架2的顶部固定一碳纳米 材料制作的散热片3,以及在支架内的等间距地固定一组碳纳米材料制作的 散热片3,并且散热片与散热片之间留有间隔4, LED固定在铜柱上(图(a)) 或顶层散热片上(图l(b), 一有网格(或小孔)的塑料圆筒6将固定有散 热片的支架2整体围起来成为一体,(图l (b))组成了高性能散热模组 8。由于支架和外壳都是镂空的,可以让空气能充分自由流通;这样LED在 工作 时产生的热量首先是通过第一层的散热片散热,同时热量沿支架向下 传,经过一小段距离就会遇到一张散热片发散掉一部份热量,如此经过几 个循环热量就很快散发到周围的空间中。支架2用碳纳米管热超导管或铜等高导热材料制作。用绝缘材料或金属制作的一网状的外壳包裹在支架2 外成为一体的散热器。发光二极管无论是安装在支架上还是顶部的散热片 上,它的底座的底面都必须紧贴在散热片上。
在其他的实施例中,散热片安装在支架的方式,还可以是散热片与支架呈
平行设置(图6 (c)、垂直设置(图6 (a))、有一定的角度设置(即散 热片倾斜设置,图6 (b))。图中13为散热片间隙的缝可以在立柱支架上 套垫片或螺丝作固定,如果是竖直安装的在支架圆周上开槽插入。LED与支 架的之间的连接件可采用如图3 (a)、图3 (b)、图3 (c)等方式。可以 在立柱支架上制作螺孔或打孔,用螺丝固定LED。 实施例3
参照图4,制作一具有组合式散热器的发光二极管灯泡,即室内使用的 球泡灯,这种灯大部份功率不大,以3、 5、 7、 IOW最多。图4 (a)是一种 外形和白炽灯泡接近的LED灯泡。
该发光二极管灯泡在实施例1制作的发光二极管组件基础上,还包括一 个泡壳7它可以是透明的,或磨砂的乳白的,也可以是或二次光学系统或 透明保护罩。使用的发光二极管为3-7W的、安装在发光二极管组件的支架 顶端。其中,支架2由铜棒构成,由纳米碳制成的厚度0.5mm散热片(3) 固定在支架上,散热片与散热片之间有为一定的间隔, 一网格(或小孔) 状的塑料圆筒做的外壳6,将外壳6固定有散热片的支架外围成为一体,组 成了叠层式散热模组8。与LED相匹配的驱动电路,安装在绝缘电路室9 内再下面是和传统灯具通用的电接头10,通常是E27或E14等(图4(b)是 分部件的示意图)。装在前端的泡壳可以有多种形状。
电连接器10使用E27或和传统灯具兼容的接口 。 实施例4
利用本(实用新型)散热器结构制作的LED路灯,如图7a和图7b。 这一类的灯具所使用的LED光源功率都比较大,常常有几十瓦,所用的
散热器往往十分笨重,利用本发明可以大幅度减轻灯具的重量。
在本例中列举了两个例子, 一个是用1颗LED作光源的(图7 (a)) LED 1用螺杆固定在导热支架上2散热片3呈宝塔形分布,下面大上面小充 分利用材料的特性,外圈6是通风防水的功能。图7b所示的是用几个LED作光源利用叠层式散热器的结构示意图。散热片是按立体锥状分布,这样 可以降低一些成本。

Claims (9)

1.一种用于发光二极管的散热器,包括散热片,其特征在于:它还包括一热导材料支架,支架顶部设有发光二极管散热底座安装位,所述支架上间隔地固定有若干散热片,散热片外包覆有具备至少一个通风口的外壳。
2. 按权利要求1所述的用于发光二极管的散热器,其特征在于:所述的 支架顶部设有散热片。
3.按权利要求1所述的用于发光二极管的散热器,其特征在于:所述 的支架由至少一热超导管或金属棒构成,该支架的形状为圆形、方形或其 它顶部为平的多面体框架,所述的金属材料为铜或铝。
4. 按权利要求1所述的用于发光二极管的散热器,其特征在于:所述 的散热片为纳米碳管散热片或铜片或铝片或氧化铝片或钙化铝片,散热片的形状与支架相对应,散热片的厚度在0.2mm〜10ram之间。
5. 按权利要求1所述的用于发光二极管的散热器,其特征在于:所述 的散热片为纳米碳材料散热片,散热片上设有加强筋,这些加强筋可以 平行或交叉设置在散热片上。
6. 按权利要求1所述的用于发光二极管的散热器,其特征在于:所述的散热片和支架之间相互垂直、相互平行、或成一角度连接固定。
7. 按权利要求1至6任一项所述的用于发光二极管的散热器,其特征在于:所述的外壳为多孔或网状的绝缘材料或金属材料壳体。
8. —种应用权利要求2所述的散热器制作的发光二极管,其特征在于:它包括至少一个发光二极管和连于发光二极管上的散热底座,该发光二极管通过电线与驱动电路电连接,发光二极管的散热底座紧贴安装在 所述的支架顶部的散热片上。
9.按权利要求8所述的发光二极管制成的发光二极管灯,其特征在 于:它还包括一罩设于LED上的透光泡壳,所述的驱动电路设于一绝缘 电路室内,驱动电路与设于灯尾部的电连接器相连接。
CN2008201698491U 2008-12-15 2008-12-15 具有新型结构的嵌入式散热器及发光二极管及发光二极管灯 Expired - Fee Related CN201425284Y (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2008201698491U CN201425284Y (zh) 2008-12-15 2008-12-15 具有新型结构的嵌入式散热器及发光二极管及发光二极管灯

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2008201698491U CN201425284Y (zh) 2008-12-15 2008-12-15 具有新型结构的嵌入式散热器及发光二极管及发光二极管灯

Publications (1)

Publication Number Publication Date
CN201425284Y true CN201425284Y (zh) 2010-03-17

Family

ID=42024734

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008201698491U Expired - Fee Related CN201425284Y (zh) 2008-12-15 2008-12-15 具有新型结构的嵌入式散热器及发光二极管及发光二极管灯

Country Status (1)

Country Link
CN (1) CN201425284Y (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011088003A3 (en) * 2010-01-12 2011-10-06 Ge Lighting Solutions, Llc. Transparent thermally conductive polymer composites for light source thermal management
US9841175B2 (en) 2012-05-04 2017-12-12 GE Lighting Solutions, LLC Optics system for solid state lighting apparatus
US9951938B2 (en) 2009-10-02 2018-04-24 GE Lighting Solutions, LLC LED lamp
CN108899305A (zh) * 2018-06-26 2018-11-27 江苏奥尼克电气股份有限公司 二极管封装结构及封装方法
US10340424B2 (en) 2002-08-30 2019-07-02 GE Lighting Solutions, LLC Light emitting diode component

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10340424B2 (en) 2002-08-30 2019-07-02 GE Lighting Solutions, LLC Light emitting diode component
US9951938B2 (en) 2009-10-02 2018-04-24 GE Lighting Solutions, LLC LED lamp
US8541933B2 (en) 2010-01-12 2013-09-24 GE Lighting Solutions, LLC Transparent thermally conductive polymer composites for light source thermal management
WO2011088003A3 (en) * 2010-01-12 2011-10-06 Ge Lighting Solutions, Llc. Transparent thermally conductive polymer composites for light source thermal management
US9841175B2 (en) 2012-05-04 2017-12-12 GE Lighting Solutions, LLC Optics system for solid state lighting apparatus
US10139095B2 (en) 2012-05-04 2018-11-27 GE Lighting Solutions, LLC Reflector and lamp comprised thereof
CN108899305A (zh) * 2018-06-26 2018-11-27 江苏奥尼克电气股份有限公司 二极管封装结构及封装方法
CN108899305B (zh) * 2018-06-26 2019-11-15 江苏奥尼克电气股份有限公司 二极管封装结构及封装方法

Similar Documents

Publication Publication Date Title
CN101408298B (zh) 立柱型led散热器
CN101752359A (zh) 一种具有散热组件的发光二极管及发光二极管灯
CN104421682B (zh) Led光源模块和包含该模块的led球泡灯
CN201425284Y (zh) 具有新型结构的嵌入式散热器及发光二极管及发光二极管灯
CN101334155A (zh) 高散热性发光二极管灯具散热模块
CN101788112A (zh) 三维散热大功率led照明装置
CN101825242A (zh) 一种液冷真空led灯
CN201215303Y (zh) 高散热性发光二极管灯具散热模块
CN101893176A (zh) Led照明灯具
CN202049991U (zh) 用于发光二极管的散热组件和发光二极管及发光二极管灯
KR101231658B1 (ko) 방열기능을 개선한 엘이디 전구
CN208720001U (zh) 一种大功率led工矿灯
CN203478063U (zh) 一种模块式led路灯
CN206291009U (zh) 一种新型多孔上下通透散热led灯具
CN101334150B (zh) 发光二极管灯具
CN201875446U (zh) 一种液冷真空led灯
KR101149795B1 (ko) 엘이디 등기구 구조체
CN204100014U (zh) Led射灯结构
CN203757671U (zh) 一种导热防水硅胶垫
CN107255264A (zh) 一种led灯具的散热结构
CN208154131U (zh) 一种高效散热的柱形led集成照明灯具
CN206530888U (zh) Led灯具
CN102011971A (zh) 一种led照明模块
CN216521008U (zh) 一种采用导热复合材料的led球泡灯
CN208935906U (zh) 一种散热型led灯

Legal Events

Date Code Title Description
GR01 Patent grant
C14 Grant of patent or utility model
PP01 Preservation of patent right

Effective date of registration: 20140529

Granted publication date: 20100317

RINS Preservation of patent right or utility model and its discharge
PD01 Discharge of preservation of patent

Date of cancellation: 20141129

Granted publication date: 20100317

RINS Preservation of patent right or utility model and its discharge
PP01 Preservation of patent right

Effective date of registration: 20150609

Granted publication date: 20100317

RINS Preservation of patent right or utility model and its discharge
PD01 Discharge of preservation of patent

Date of cancellation: 20151209

Granted publication date: 20100317

RINS Preservation of patent right or utility model and its discharge
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100317

Termination date: 20141215

EXPY Termination of patent right or utility model