KR100405453B1 - Chip light emitting diode(led) and manufacturing method thereof - Google Patents

Chip light emitting diode(led) and manufacturing method thereof Download PDF

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Publication number
KR100405453B1
KR100405453B1 KR1020030057331A KR20030057331A KR100405453B1 KR 100405453 B1 KR100405453 B1 KR 100405453B1 KR 1020030057331 A KR1020030057331 A KR 1020030057331A KR 20030057331 A KR20030057331 A KR 20030057331A KR 100405453 B1 KR100405453 B1 KR 100405453B1
Authority
KR
South Korea
Prior art keywords
light emitting
molding part
manufacturing
led
chip
Prior art date
Application number
KR1020030057331A
Other languages
Korean (ko)
Inventor
Kwan Young Han
Do Hyung Kim
Seung Man Yang
Original Assignee
Seoul Semiconductor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seoul Semiconductor Co Ltd filed Critical Seoul Semiconductor Co Ltd
Application granted granted Critical
Publication of KR100405453B1 publication Critical patent/KR100405453B1/en
Priority to MYPI20040006A priority Critical patent/MY135367A/en
Priority to DE102004001312A priority patent/DE102004001312B4/en
Priority to TW093100501A priority patent/TWI239660B/en
Priority to US10/754,389 priority patent/US7042022B2/en
Priority to CNB2004100003576A priority patent/CN100382340C/en
Priority to JP2004007357A priority patent/JP2005045199A/en
Priority to US11/652,468 priority patent/USRE42112E1/en
Priority to JP2007161732A priority patent/JP2007235182A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Led Device Packages (AREA)

Abstract

PURPOSE: A chip LED(Light Emitting Diode) and a manufacturing method thereof are provided to be capable of maximizing light path and increasing visible angle for reducing the number of chips used per unit surface area. CONSTITUTION: A chip LED(10) is provided with a PCB(Printed Circuit Board)(11), a metal pad and lead(12,15) spaced apart from each other on the PCB, and a light emitting chip(13) mounted on the metal pad. The chip LED further includes a wire(14) for electrically connecting the light emitting chip with the lead and a package molding part(16) for selectively enclosing the resultant structure. At this time, the package molding part is roundly protruded. Preferably, the round shape of the package molding part has a cross-section of semi-circle.
KR1020030057331A 2003-07-25 2003-08-19 Chip light emitting diode(led) and manufacturing method thereof KR100405453B1 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
MYPI20040006A MY135367A (en) 2003-07-25 2004-01-02 Chip light emitting diode and fabrication method thereof
DE102004001312A DE102004001312B4 (en) 2003-07-25 2004-01-07 Chip light-emitting diode and method for its production
TW093100501A TWI239660B (en) 2003-07-25 2004-01-09 Chip light emitting diode and fabrication method thereof
US10/754,389 US7042022B2 (en) 2003-07-25 2004-01-09 Chip light emitting diode and fabrication method thereof
CNB2004100003576A CN100382340C (en) 2003-07-25 2004-01-09 Chip light emitting diode and fabrication method thereof
JP2004007357A JP2005045199A (en) 2003-07-25 2004-01-14 Chip light emitting diode and its manufacturing method
US11/652,468 USRE42112E1 (en) 2003-07-25 2007-01-11 Chip light emitting diode and fabrication method thereof
JP2007161732A JP2007235182A (en) 2003-07-25 2007-06-19 Chip light emitting diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR20030051365 2003-07-25

Publications (1)

Publication Number Publication Date
KR100405453B1 true KR100405453B1 (en) 2003-11-12

Family

ID=37422649

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020030057331A KR100405453B1 (en) 2003-07-25 2003-08-19 Chip light emitting diode(led) and manufacturing method thereof

Country Status (1)

Country Link
KR (1) KR100405453B1 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100609734B1 (en) * 2004-07-02 2006-08-08 럭스피아 주식회사 Led package for use in back light of lcd and method of the same
US7153000B2 (en) 2004-08-12 2006-12-26 Samsung Electro-Mechanics Co., Ltd. Multi-lens light emitting diode
KR100809658B1 (en) 2007-06-27 2008-03-05 김재을 Lens for led and led display device using thereof it
US7479662B2 (en) 2002-08-30 2009-01-20 Lumination Llc Coated LED with improved efficiency
US7572036B2 (en) 2004-10-18 2009-08-11 Samsung Electronics Co., Ltd. Light emitting diode and lens for the same
US7800121B2 (en) 2002-08-30 2010-09-21 Lumination Llc Light emitting diode component
US7842960B2 (en) 2006-09-06 2010-11-30 Lumination Llc Light emitting packages and methods of making same
US9841175B2 (en) 2012-05-04 2017-12-12 GE Lighting Solutions, LLC Optics system for solid state lighting apparatus
US9951938B2 (en) 2009-10-02 2018-04-24 GE Lighting Solutions, LLC LED lamp

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8436380B2 (en) 2002-08-30 2013-05-07 GE Lighting Solutions, LLC Light emitting diode component
US7479662B2 (en) 2002-08-30 2009-01-20 Lumination Llc Coated LED with improved efficiency
US8362695B2 (en) 2002-08-30 2013-01-29 GE Lighting Solutions, LLC Light emitting diode component
US7800121B2 (en) 2002-08-30 2010-09-21 Lumination Llc Light emitting diode component
KR100609734B1 (en) * 2004-07-02 2006-08-08 럭스피아 주식회사 Led package for use in back light of lcd and method of the same
US7153000B2 (en) 2004-08-12 2006-12-26 Samsung Electro-Mechanics Co., Ltd. Multi-lens light emitting diode
US7572036B2 (en) 2004-10-18 2009-08-11 Samsung Electronics Co., Ltd. Light emitting diode and lens for the same
US7963680B2 (en) 2004-10-18 2011-06-21 Samsung Electronics Co., Ltd. Light emitting diode and lens for the same
US8696175B2 (en) 2004-10-18 2014-04-15 Samsung Display Co., Ltd. Light emitting diode and lens for the same
US9200778B2 (en) 2004-10-18 2015-12-01 Samsung Display Co., Ltd. Light emitting diode and lens for the same
US7842960B2 (en) 2006-09-06 2010-11-30 Lumination Llc Light emitting packages and methods of making same
KR100809658B1 (en) 2007-06-27 2008-03-05 김재을 Lens for led and led display device using thereof it
US9951938B2 (en) 2009-10-02 2018-04-24 GE Lighting Solutions, LLC LED lamp
US9841175B2 (en) 2012-05-04 2017-12-12 GE Lighting Solutions, LLC Optics system for solid state lighting apparatus
US10139095B2 (en) 2012-05-04 2018-11-27 GE Lighting Solutions, LLC Reflector and lamp comprised thereof

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