JP4651702B2 - 照明装置 - Google Patents
照明装置 Download PDFInfo
- Publication number
- JP4651702B2 JP4651702B2 JP2008269055A JP2008269055A JP4651702B2 JP 4651702 B2 JP4651702 B2 JP 4651702B2 JP 2008269055 A JP2008269055 A JP 2008269055A JP 2008269055 A JP2008269055 A JP 2008269055A JP 4651702 B2 JP4651702 B2 JP 4651702B2
- Authority
- JP
- Japan
- Prior art keywords
- base
- support
- light emitting
- lighting device
- led chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 32
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- 230000005855 radiation Effects 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 13
- 238000006243 chemical reaction Methods 0.000 claims description 9
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 28
- 230000017525 heat dissipation Effects 0.000 description 15
- 238000005286 illumination Methods 0.000 description 13
- 239000000463 material Substances 0.000 description 9
- 239000003570 air Substances 0.000 description 7
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- 229910052782 aluminium Inorganic materials 0.000 description 6
- 230000007423 decrease Effects 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
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- 229920000647 polyepoxide Polymers 0.000 description 5
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000020169 heat generation Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920002050 silicone resin Polymers 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000012080 ambient air Substances 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- DGUJJOYLOCXENZ-UHFFFAOYSA-N 4-[2-[4-(oxiran-2-ylmethoxy)phenyl]propan-2-yl]phenol Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C1=CC=C(O)C=C1 DGUJJOYLOCXENZ-UHFFFAOYSA-N 0.000 description 1
- -1 Al and Cu Chemical class 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Description
2 絶縁性ヒートシンク
3 LEDチップ
4 蛍光体入り樹脂モールド部
5 半球状樹脂モールド部
6 支持体
7 放熱フィン
8 交流直流変換回路
9 口金
10 プリント配線基板
11,12 配線部
13,14 ワイヤ
21 ファン用軸受け
22 ファン
23 ベアリング
24 モータ
25 プーリ
26 ファンベルト
31,32 端子
60 絶縁部
91 ねじ部
92 突起部
Claims (6)
- 一面および他面を有する基体と、
前記基体の前記一面上に設けられた複数の発光素子と、
前記基体の前記他面上に設けられた支持体と、
前記基体と反対側の前記支持体の端部に設けられたソケットに接続可能な電極と、
前記支持体から外方に放射状に延びる複数の放熱フィンとを備え、
前記支持体の内部に交流直流変換回路が設けられていることを特徴とする照明装置。 - 前記複数の発光素子を覆うように前記基体の前記一面側が樹脂で封止されたことを特徴とする請求項1記載の照明装置。
- 前記複数の放熱フィンは、前記基体の端面よりも外方に突出するように設けられたことを特徴とする請求項1または2に記載の照明装置。
- 基体上にプリント基板が配置され、発光素子とプリント基板が接続されていることを特徴とする請求項1〜3のいずれかに記載の照明装置。
- 前記電極は、前記支持体の端部に絶縁部を介して設けられていることを特徴とする請求項1〜4のいずれかに記載の照明装置。
- 前記複数の発光素子が直列に接続されることを特徴とする請求項1〜5のいずれかに記載の照明装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008269055A JP4651702B2 (ja) | 2008-10-17 | 2008-10-17 | 照明装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008269055A JP4651702B2 (ja) | 2008-10-17 | 2008-10-17 | 照明装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003320831A Division JP4236544B2 (ja) | 2003-09-12 | 2003-09-12 | 照明装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010243631A Division JP2011060772A (ja) | 2010-10-29 | 2010-10-29 | 照明装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009038039A JP2009038039A (ja) | 2009-02-19 |
JP4651702B2 true JP4651702B2 (ja) | 2011-03-16 |
Family
ID=40439715
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008269055A Expired - Lifetime JP4651702B2 (ja) | 2008-10-17 | 2008-10-17 | 照明装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4651702B2 (ja) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10340424B2 (en) | 2002-08-30 | 2019-07-02 | GE Lighting Solutions, LLC | Light emitting diode component |
KR100919995B1 (ko) | 2009-05-29 | 2009-10-05 | (주)퓨쳐 라이팅 | 표면적 증대 및 통풍 효율이 높은 방열 구조체가 적용된 led 조명 기구 |
KR101120655B1 (ko) | 2009-07-24 | 2012-03-05 | 주식회사 씨에스티 | 발광 다이오드용 히트 싱크 및 이를 구비한 발광 다이오드 모듈 |
KR101092927B1 (ko) * | 2009-07-31 | 2011-12-12 | (주)지피오무역 | 원적외선 세라믹 베이스 및 이를 포함하는 led 램프 |
US8593040B2 (en) | 2009-10-02 | 2013-11-26 | Ge Lighting Solutions Llc | LED lamp with surface area enhancing fins |
CN102042494B (zh) * | 2009-10-09 | 2012-09-26 | 亿光电子工业股份有限公司 | 光源模组 |
JP5073725B2 (ja) * | 2009-10-13 | 2012-11-14 | 麗鴻科技股▲ふん▼有限公司 | Ledランプの電極構造 |
JP2011108493A (ja) * | 2009-11-17 | 2011-06-02 | Nakamura Mfg Co Ltd | 電球形led照明灯の放熱体およびその形成方法 |
JP5499660B2 (ja) * | 2009-11-26 | 2014-05-21 | 東芝ライテック株式会社 | 照明器具 |
JP2011216309A (ja) * | 2010-03-31 | 2011-10-27 | Kobe Steel Ltd | Led電球の放熱部の製造方法およびled電球の放熱部 |
JP2012038691A (ja) * | 2010-08-11 | 2012-02-23 | Iwasaki Electric Co Ltd | Ledランプ |
JP2012169192A (ja) * | 2011-02-16 | 2012-09-06 | Hitachi Appliances Inc | 照明装置 |
US9500355B2 (en) | 2012-05-04 | 2016-11-22 | GE Lighting Solutions, LLC | Lamp with light emitting elements surrounding active cooling device |
JP5695115B2 (ja) * | 2013-03-30 | 2015-04-01 | 三協立山株式会社 | ヒートシンク及びその製造方法 |
JP5785972B2 (ja) * | 2013-03-30 | 2015-09-30 | 三協立山株式会社 | ヒートシンク及びその製造方法 |
KR102186460B1 (ko) * | 2014-01-22 | 2020-12-03 | 삼성전자주식회사 | Led 조명 장치 |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0557860U (ja) * | 1992-01-06 | 1993-07-30 | 日立電線株式会社 | 発光ダイオード及び自動車用ブレーキランプ |
JPH066515Y2 (ja) * | 1983-11-29 | 1994-02-16 | オプトニクス株式会社 | Ledランプ |
JPH0686359U (ja) * | 1993-05-31 | 1994-12-13 | オプトニクス株式会社 | Ledランプ |
JPH0969304A (ja) * | 1995-08-31 | 1997-03-11 | Toshiba Lighting & Technol Corp | 照明装置および航空障害灯 |
JPH1117228A (ja) * | 1997-06-20 | 1999-01-22 | Ushio Inc | 照明灯 |
JP2001325809A (ja) * | 2000-05-15 | 2001-11-22 | Sanaa Electronics Kk | 電球型発光ダイオード |
JP2002102164A (ja) * | 2000-10-04 | 2002-04-09 | Asahi Optical Co Ltd | 電子内視鏡用プロセッサ及び内視鏡用光源装置 |
WO2002097884A1 (en) * | 2001-05-26 | 2002-12-05 | Gelcore, Llc | High power led module for spot illumination |
JP2003100974A (ja) * | 2001-09-25 | 2003-04-04 | Tdk Corp | 空冷式半導体ヒートシンク |
JP2003151306A (ja) * | 2001-11-09 | 2003-05-23 | Sotoyoshi Kanayama | 電球用口金に発光ダイオードを組み込んだ電球 |
WO2003056636A1 (en) * | 2001-12-29 | 2003-07-10 | Hangzhou Fuyang Xinying Dianzi Ltd. | A led and led lamp |
-
2008
- 2008-10-17 JP JP2008269055A patent/JP4651702B2/ja not_active Expired - Lifetime
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH066515Y2 (ja) * | 1983-11-29 | 1994-02-16 | オプトニクス株式会社 | Ledランプ |
JPH0557860U (ja) * | 1992-01-06 | 1993-07-30 | 日立電線株式会社 | 発光ダイオード及び自動車用ブレーキランプ |
JPH0686359U (ja) * | 1993-05-31 | 1994-12-13 | オプトニクス株式会社 | Ledランプ |
JPH0969304A (ja) * | 1995-08-31 | 1997-03-11 | Toshiba Lighting & Technol Corp | 照明装置および航空障害灯 |
JPH1117228A (ja) * | 1997-06-20 | 1999-01-22 | Ushio Inc | 照明灯 |
JP2001325809A (ja) * | 2000-05-15 | 2001-11-22 | Sanaa Electronics Kk | 電球型発光ダイオード |
JP2002102164A (ja) * | 2000-10-04 | 2002-04-09 | Asahi Optical Co Ltd | 電子内視鏡用プロセッサ及び内視鏡用光源装置 |
WO2002097884A1 (en) * | 2001-05-26 | 2002-12-05 | Gelcore, Llc | High power led module for spot illumination |
JP2003100974A (ja) * | 2001-09-25 | 2003-04-04 | Tdk Corp | 空冷式半導体ヒートシンク |
JP2003151306A (ja) * | 2001-11-09 | 2003-05-23 | Sotoyoshi Kanayama | 電球用口金に発光ダイオードを組み込んだ電球 |
WO2003056636A1 (en) * | 2001-12-29 | 2003-07-10 | Hangzhou Fuyang Xinying Dianzi Ltd. | A led and led lamp |
Also Published As
Publication number | Publication date |
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JP2009038039A (ja) | 2009-02-19 |
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