457731 五、創作說明（ C7 D7 補充j 經 齊 部 智 彗 財 產 局 消 費 合 作 杜 印 製 本發明係有關一種發光二極體結構與製法，尤其係指一種能夠利 用於廣告看板、警示板、液晶板照明等多用途之發光二極體^ E 〇之 結構及製法，所生產出之發光二極體可以產生亮度佳之白光。 由於目前L E D燈泡已廣泛使用於日常生活之中，所以到處可見 發光二極體之產品運用於如廣告看板、小型照明設備，警示用之顯示 板，甚至於行動電話液晶面板之照明等等。 由於電子產品之未來發展趨勢以輕巧微小為主，以廣告看板而 吕，較小之發光二極體燈泡可以使得整個看板之解析度提高，使得面 板上能顯示之文字圖樣可以有更多的變化，進而使得其更有吸引人們 注目之功能，以達到廣告宣傳之功效。 習用之發光二極體，如第三圖所示，其製造時係先以鐵片沖製成 型’形成如攔杆狀之支架（2 〇)粗胚，在該支架（2 〇)之粗胚頂 端形成如第四圖所示般呈相間隔的正、負電極（21)( 2 2 )端， 且在負電極（2 2 )端頂部另再以沖壓方式製成一容置杯（2 6 )， 然後依序進行鍍銅、鍍鎳（保護銅，以不使氧化）、鐘鋼、鐘銀等四 道電鐘程私完鼓架（2 G )之加卫，藉輯加導紐轉低阻抗； 接著即可在支架（2 〇)上進行晶片（2 3)之安|，其係將s片（p 3)焊接置於支架（20)負電極（22)的容置杯（26)中，然 後將其晶線（2 4)與正電極（21)端相焊接，此時可將支架（2 0)置入模條（圖中未示）中，再於模條中灌入環氧樹脂（2 5)， 經烘烤成型後即可將模條剝離，最後將支架（2 〇)沖壓裁切以完成 led燈泡的成品。 70 前述之L E D燈泡製作流程依各廠商之安排選擇而有所差異，然 而其所運狀·及其所f成之L E D燈泡均大同小異，所有差異^ 本紙張尺度適用中國國家標準（CNS)A4規格（210 x 297公釐 {請先閲讀背面之注意事項再填寫本頁) 裝----K----訂---------線/ 4 5 7 7 3 C7 D7 五 、創作說明（：> ) 令.4:/心·’ -- 經 濟 部 智 慧 財 產 局 員 工 消 費 合 作 社 印 製 僅在容置杯（2 6)中所灌之物質為單純螢光材料層（2 7)(如第 五圖所示）亦或者為螢光材料層（2 7)與一般A B膠之混合層（2 8)(如第六圖所示）爾爾，但以現有之LED燈泡製作過程及其結 構觀之，尚有下列問題存在： 1 6又備成本尚：現有之支架（2 0 )在電鐘流程中採用鍍銀之步 驟，其雖可提高支架（2 0)之導電效果，但其設備成本高，無法與 傳統之鶴絲燈泡設備相比。 2 ’材料成本高：現有晶片（2 3)晶線（2 4)係以純黃金材質 製成’使得材料成本提昇。 3 ·生產成本高：現有之支架（2 〇)在以鐵片沖製成型後，需另 搭配一沖壓作業流程，以便在負電極（2 2 )端之端面上沖製一容置 杯（2 6 )，此種生產製作流程之增加，必然增加生產成本之提昇。 4 ·結構設計之限制：由於現有L E D燈泡係將晶片（2 3)置於 支架（2 0)負電極（2 2)端之容置杯（2 6 )之中，故其僅可朝 谷置杯（2 6)開口之方向發光，並無法向側面發光。 因為上述原因，便有人以SMD (表面黏著）Ba ckL 土 g h t之方法製作LED’其具備有省電、製程簡單、贿小等之優點， 但其晶月之封裝乃利用灌膠之方式，利用膠餅融化後灌膠於黏有晶片 (3 2)之P C B (3 Q)之上而成如第七圖所示之半成品後，再經 切割完成，然硫法t顧之膠懈融化後即無法再·，費用高， 且灌勝後之成品絲無弧面〇第七、八_示），其聚光力較不良， 且習用之膠餅具有流動性高、誠低，綠f之缺鱗在。 本發明人有鑑於此’便積極研究暖—種能夠改善上述習用l E D之缺點’闕轉之峨與努力，終於研糾極具錢業上利用價 V-裂----K----訂---------線 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱） 457731 7 經濟部智慧財產局員工消費合作社印製 ----------D7 _ ^ 五、創作說明（今） 值之本發明。 本發明之主要目的再於提供一種節省製作成本、製成簡單、亮度 佳、且體積小之發先二極體L· E D之結構及其製法。 為達上述目的，本發明係採用以下手段予以達成，其中乃在一p CB之上以SMD之方式將可發光之藍光晶片黏著於其上，再利用晶 線接通正極後’细定量點膠之紐將縣樹脂轉於“之上而形 成具弧面之L ED半成品後，經切割而成成品。 為使貴審查委員能進一步瞭解本發明之結構及其他目的，茲 附以圖式詳細說明如后： (―)圖式部份： 第一圖：係本創作半成品之立體圖。 第二圖：係本創作之立體圖。 第三圖：係習用之LED燈泡支架結構示意圖。 第四圖U用之led燈泡晶#安置於支架正'貞電極端部分後 放大剖面結構示意圖。 第五圖.係制之LED燈泡貞電極處容置杯中充填物之結構示意 圖。 苐’、圖.仏另一習用之LED燈泡負電極處容置杯中充填物之結構 示意圖。 第七圖：係再一習用半成品之立體圖。 第八圖：係再一習用之立體圖。 (二）圖號部份： (10) P C B (印刷電路板） (11) 銅線路 J.L..I「 2 (请先閱讀背面之注意事項再填寫本頁) ----K-------------r 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐〉 457731 經濟部智慧財產局員工消費合作社印製 五 創作說明（ C7 D7 Ψ } (1 2)晶片 (13) 晶線 (14) 環氧樹脂層 (2 0)支架 (21)正電極 (2 2)負電極 (2 3)晶片 (2 4 )晶線 (2 5)環氧樹脂層 (2 6)容置杯 (2 7)螢光材料層 (2 8) —般AB膠混合層(30) P CB (31) 銅線路 (3 2)晶片 (3 3 )晶線 (3 4 )環氧樹脂層 本發明所用之二液型環】 -/ v m工.片4^尸;I* 且欣，务γ王 劑中之主要成分級態魏她旨與無射填料，㈣化敗主要 為聚胺類，此主劑為極具高搖變性之糊狀液體，當與硬化劑以適^ 例混合後織餘平社’麵成—半雜，_烘烤，林會變二， 以下便是主劑與硬化劑之物性表： 7 L氡樹脂乃由主劑與硬化劑所組成，其中主 Μ氏張尺度適用中國國家標準（CNS)A4規格（210 X 297公楚） (請先閱讀背面之注意事項再填寫本頁) 敦-----..----訂----- 線 457731 C7 D7 五、創作說明（（） 主劑 外觀 淺藍半透明液體 黏度 cps/25°C 25000 〜45000 混合比wt% 1〇〇 硬化條件 膠化時間 硬化劑物性： 引張強度，psi 曲折強度，psi 熱變形HDT °C 吸水率，RT X 24hr，％ 硬度shore D 介電常數1000Hz 100Hz j.-] π457731 V. Creation instructions (C7 D7 supplement j) Printed by consumer cooperation of the Ministry of Intellectual Property, Department of Intellectual Property, The present invention relates to a light-emitting diode structure and manufacturing method, and particularly refers to a type that can be used in advertising signboards, warning boards, and LCD panels. The structure and manufacturing method of multi-purpose light-emitting diodes ^ E 〇 such as lighting, the produced light-emitting diodes can produce white light with good brightness. Since LED bulbs have been widely used in daily life, light-emitting diodes can be seen everywhere. The products are used in advertising boards, small-sized lighting equipment, warning display boards, and even mobile phone LCD panel lighting. Due to the future development of electronic products, they are mainly light and tiny, with advertising boards instead. The small light-emitting diode bulb can improve the resolution of the whole kanban, so that the text pattern that can be displayed on the panel can be changed more, which makes it more attractive to the people, so as to achieve the effect of advertising. As shown in the third figure, the light-emitting diode is first formed by punching an iron sheet into a shape. If a rod-shaped scaffold (20) rough embryo is formed, the ends of the scaffold (20) rough embryo are formed with positive and negative electrode (21) (22) ends spaced apart as shown in the fourth figure, and At the top of the negative electrode (2 2), another holding cup (2 6) is made by punching, and then copper plating, nickel plating (protect the copper to prevent oxidation), bell steel, bell silver, etc. are sequentially performed. Four electric clocks complete the guarding of the drum rack (2 G), and then use the guide to switch to a low impedance; then the chip (2 3) can be mounted on the bracket (20) | The sheet (p 3) is welded and placed in the receiving cup (26) of the negative electrode (22) of the bracket (20), and then the crystal wire (2 4) is welded to the end of the positive electrode (21). At this time, the bracket can be welded (2 0) Put it into the mold strip (not shown), and then fill the mold strip with epoxy resin (2 5). After baking, the mold strip can be peeled off, and finally the bracket (2 〇) Stamping and cutting to complete the finished product of LED bulbs. 70 The aforementioned manufacturing process of LED bulbs varies according to the arrangements of each manufacturer. However, the shipping status and the resulting LED bulbs are all similar, all differences ^ This paper scale Use China National Standard (CNS) A4 specification (210 x 297 mm (please read the precautions on the back before filling this page)) ---- K ---- Order -------- line / 4 5 7 7 3 C7 D7 V. Creative Instructions (: >) Order .4: / 心 · '-The consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs prints only the substances filled in the container (2 6) It is a pure fluorescent material layer (2 7) (as shown in the fifth figure) or a mixed layer of fluorescent material layer (2 7) and general AB glue (2 8) (as shown in the sixth figure). However, from the perspective of the existing manufacturing process and structure of LED bulbs, the following problems still exist: 1) The cost is still high: The existing bracket (20) uses silver plating steps in the electric clock process, which can improve The conductive effect of the bracket (20), but its equipment cost is high, which cannot be compared with the traditional crane wire bulb equipment. 2 'Material cost is high: the existing wafer (2 3) crystal line (2 4) is made of pure gold material', which increases the material cost. 3 · High production cost: After the existing bracket (20) is punched with an iron sheet, it needs to be matched with a stamping operation process in order to punch a receiving cup (2) on the end surface of the negative electrode (2 2) end. 26) The increase of such production process will inevitably increase the production cost. 4 · Structural design limitation: Since the existing LED light bulb is placed in the receiving cup (2 6) on the negative electrode (2 2) end of the holder (20), the chip (2 3) can only be placed toward the valley. The cup (2 6) emits light in the direction of the opening, and cannot emit light to the side. Because of the above reasons, some people have used the SMD (Surface Adhesion) Ba ckL soil ght method to make LEDs. It has the advantages of power saving, simple process, small bribes, etc., but its packaging of the crystal moon is made by glue. After the cake is melted, it is glued on the PCB (3 Q) with the wafer (3 2) and formed into a semi-finished product as shown in the seventh figure, and then the cutting is completed. After the sulfur method melts, the glue is melted. It ca n’t be done anymore, the cost is high, and the finished silk has no arc surface (see seventh and eighth), its light concentration is poor, and the conventional cake has high fluidity, low honesty, and the lack of green f Scales in. In view of this, the present inventor has actively researched the "warm-type that can improve the shortcomings of the conventional ED" and turned the efforts and efforts, and finally researched and corrected the extremely valuable use price V-splitting ---- K --- -Order --------- Line (please read the precautions on the back before filling this page) This paper size applies to China National Standard (CNS) A4 (210 X 297 public love) 457731 7 Intellectual Property of the Ministry of Economic Affairs Printed by the Bureau's Consumer Cooperatives ---------- D7 _ ^ V. The invention (now) is worthwhile. The main object of the present invention is to provide a structure and a manufacturing method of the first diode L · ED, which saves production cost, is simple to manufacture, has good brightness, and has a small volume. In order to achieve the above purpose, the present invention is achieved by the following means, in which a light-emitting blue light chip is adhered to it in a SMD manner on a p CB, and then the crystal wire is connected to the positive electrode, and the fine quantitative dispensing is performed. Zhinuo will transfer the county resin to "to form a semi-finished LED product with a curved surface, and then cut it into a finished product. In order to allow your review committee to further understand the structure and other purposes of the present invention, detailed illustrations are attached with drawings As follows: (―) Schematic part: The first picture: a three-dimensional view of the semi-finished product of the creation. The second picture: a three-dimensional view of the creation. The third picture: a schematic diagram of the structure of a conventional LED light bulb bracket. Zhiled bulb crystal # is placed on the positive electrode end portion of the bracket, and the enlarged sectional structure is shown in the fifth figure. Fig. 5 is a schematic diagram showing the structure of the filling material in the cup at the positive electrode of the LED bulb. 苐 '、 图. 仏 Another Schematic diagram of the structure of the filling in the containing cup at the negative electrode of a conventional LED bulb. Figure 7: A perspective view of a semi-finished product used again. Figure 8: A perspective view of a customary used part. (2) Drawing number part: (10 ) PCB (Printed Electrical Board) (11) Copper line JL.I 「2 (Please read the precautions on the back before filling this page) ---- K ------------- r This paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 mm) 457731 Five creative instructions printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs (C7 D7 Ψ) (1 2) Wafer (13) Crystalline (14) Epoxy layer (2 0) holder (21) positive electrode (2 2) negative electrode (2 3) wafer (2 4) crystal line (2 5) epoxy layer (2 6) container cup (2 7) fluorescent material layer (2 8)-general AB glue mixed layer (30) P CB (31) copper circuit (3 2) wafer (3 3) crystal line (3 4) epoxy resin layer two liquid ring used in the present invention]-/ vm 工. 片 4 ^ corpse; I * He Xin, the main component of the γ King agent Wei Shezhi and non-radiating filler, the main failure is polyamines, this main agent is highly shaken Pasty liquid, when mixed with hardening agent in suitable examples, the surface of Zhiyu Pingsha's surface will be semi-hybrid, _ baking, Lin will become two, the following is the physical properties of the main agent and hardener: 7 L 氡 resin It is composed of a main agent and a hardener. The main M's scale is applicable to China National Standard (CNS) A4. 210 X 297 Gongchu) (Please read the notes on the back before filling out this page) Tun -----..---- Order ----- Line 457731 C7 D7 V. Creative Instructions (() Master Agent Appearance Light blue translucent liquid viscosity cps / 25 ° C 25000 ~ 45000 Mixing ratio wt% 100 Hardening conditions Gelation time Hardener physical properties: tensile strength, psi flexural strength, psi thermal deformation HDT ° C water absorption, RT X 24hr ，% Hardness shore D dielectric constant 1000Hz 100Hz j.-] π
U:· I 補充 硬化劑 無色透明液體 5〜15 30 〜33 80 〜100 C X 2〜lhr 12 〜18min (15gx80°C) 9800 454, 000 75 2.7 74 〜77 3.6 4.7 -------------i (請先閱讀背面之注意事項再填寫本頁) ----訂------.---線 經 濟 部 智 慧 財 產 局 員 工 消 費 合 作 社 印 製 上述之二液型環氧樹脂與螢光粉調和後可改變發光二極體之發光 色系，使用於點膠機中用於製作成品’而螢光粉之製法步驟如下. (1 )將單離出來的螢光粉先以真空方式進行乾燥製程 (2) 取出乾燥後的螢光粉以球磨機進行研磨。 (3) 將研磨好的螢光粉取出，置於搖篩機内，進彳_ ^ 篩選’每5 〇 μni為一個分佈，取出粒徑範圍在1 〇肇光粉杈捏之 m間的螢光粉末備用。大於2 5 0 Am粒徑之馨也心^功至2 5 〇以 軍允I 士留 辑主下次繼續 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）U: · I Colorless transparent liquid supplementary hardener 5 ~ 15 30 ~ 33 80 ~ 100 CX 2 ~ lhr 12 ~ 18min (15gx80 ° C) 9800 454, 000 75 2.7 74 ~ 77 3.6 4.7 ------------ ----- i (Please read the precautions on the back before filling this page) ---- Order ------.--- The Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs printed the above two liquid types After the epoxy resin and the fluorescent powder are blended, the light emitting color system of the light-emitting diode can be changed and used in a dispensing machine to produce a finished product. The manufacturing method of the fluorescent powder is as follows. (1) The fluorescent light that is separated out The powder is first dried in a vacuum process (2) The dried fluorescent powder is taken out and ground with a ball mill. (3) Take out the ground fluorescent powder, place it in a shaker, and filter it into a distribution every 50 μni. Take out the fluorescent light with a particle size in the range between 10 and 100 m. Powder is ready. The size of particles larger than 2 5 0 Am is also ^ Gong to 2 5 0 Jun Jun I Shiliu editor next time to continue This paper size applies Chinese National Standard (CNS) A4 (210 X 297 mm)
I » ί - I 457731 C7 D7 補充 五、創作說明（fe;) 研磨使用。 請 先 聞 讀 背 之 注 意 事 項 再 填 寫 頁 (4)取研磨好之螢光粉（10 /m至2 5 0 # m間皆可，但以7 5±2 5 粒徑範圍為最佳）’以重量百分比方式計算秤取膠劑之 0 _ 01%至3% (其中以0 * 5±〇 . 〇5%的比例為最佳）以電 磁攪拌器（攪拌子應避免使用金屬材質，以鐵弗龍包覆之攪拌子為佳） 充分混合。 (5)將混和好的螢光膠劑置於溫、濕度控制（控制範圍溫度在工 0eC±2°C ’溼度在3 0%RH±1 〇%rH内）的環境靜置至少6 小時後備用。 P C B在銅線路印刷於其上完成之後，即將晶片利用SMD (表 面點著）之技術將晶片雜著於P C B之上，再將晶線置於其上，而後 再將前述之二液型環氧樹脂混合螢光粉置入點膠機之中，透過點膠之 方式將混合後之環氧樹脂點置於晶片之上，由於此混合之環氧樹脂黏 度高’在點置於晶片上時會凝聚為一半球體，之後再將點置完成之含 晶片之P C B板置入一高溫烘烤，烘烤條件如下： 短烤溫度為110〜13CTC，時間2111·; 長烤溫度為約1 5 0°C，時間1 5〜2 h r 經濟部智慧財產局員Η消費合作社印製 經烘烤而使環氧樹脂硬化，其硬化時間與溫度如前所述。最後再 將P C B切割後即成。 本創作之產品請參看第—圖，此為本創作之半成品，其中乃於— 附有所欲銅線路（11)於其上之p c B (丄⑴上，以SMD方式 將晶片（12)黏貼於銅線路（1^之負電極上，之後再由晶片（1 2 )處牽-晶線（1 3 )至正電極之處’完錢再侧—點勝機，將 二液型環氧樹脂灌膠以轉之方式，—顯的轉於晶片（1 2 )之 本紙張尺錢財國國家標準（CNSU4 “故w；：I »ί-I 457731 C7 D7 Supplement V. Creation Instructions (fe;) Grinding. Please read the precautions before reading and then fill in the page (4) to take the ground fluorescent powder (10 / m to 2 5 0 # m is fine, but the particle size range of 7 5 ± 2 5 is the best) Calculate the weight of the glue from 0 _ 01% to 3% (the ratio of 0 * 5 ± 0.05% is the best). Use an electromagnetic stirrer (avoid using metal materials for stirrers and iron (Front-coated stir bar is preferred) Mix well. (5) Put the mixed fluorescent adhesive in a temperature and humidity control (control range temperature is within 0eC ± 2 ° C 'humidity is within 30% RH ± 100% rH) and let it stand for at least 6 hours for backup use. After the PCB is printed on the copper circuit, the chip is mixed with the PCB using SMD (surface spotting) technology, and then the crystal line is placed on it, and then the aforementioned two-liquid epoxy The resin mixed fluorescent powder is placed in the dispenser, and the mixed epoxy resin is placed on the wafer by way of dispensing. Due to the high viscosity of the mixed epoxy resin, when the dot is placed on the wafer, it will Condensed into half spheres, and then placed the finished PCB board with wafers into a high temperature baking, the baking conditions are as follows: short baking temperature is 110 ~ 13CTC, time 2111 ·; long baking temperature is about 150 ° C, time 1 5 ~ 2 hr The member of the Intellectual Property Bureau of the Ministry of Economic Affairs and the Consumer Cooperatives printed and baked the hardened epoxy resin. The hardening time and temperature are as described above. Finally, P C B is cut into pieces. For the product of this creation, please refer to the figure—this is the semi-finished product of the creation. Among them— there is a pc B (丄 ⑴) on which the copper circuit (11) is attached. The chip (12) is pasted by SMD. On the copper circuit (1 ^ of the negative electrode, and then pull the crystal line (1 3) from the wafer (1 2) to the positive electrode. In turn, the national paper standard (CNSU4 "therefore ;;
,u, * 4 f I 457731 C7 D7 五、創作說明（ 上，以形成一半球型之環氧樹脂層（14)。 由於此二液型環氧樹脂之黏度及内聚力極高，在點膠於卩c 6上 之後會凝聚為半球型（如第二圖所示），此—環氧樹脂層（：4 )具 有藏面，猶良好之縣絲，且藍光晶㈣合混合有螢光粉之環氧 継可以發ώ光度佳之域，且船謂後之產^體積小，但卻具有更 優良之發光效果。 由上述製法所生產之發光二極體不僅製程簡單，產量大，更具有 不需要多組模具’如支架，料，且以轉之方式製作發光二 極體可節省材料，不會導致如轉之方式般之浪費原料，故可大量節 省成本，為一極具產業上利用價值之新發明，爰依法提出申請。 (請先閱讀背面之注意事項再填寫本頁) 教·--. -„----訂---------線/ 經濟部智慧財產局員工消費合作社印製 適 度 尺 張 紙 本 一格 一覘 4 λ -\1/ 5 Ν (C 準 標 家 釐 1公 17 29, u, * 4 f I 457731 C7 D7 V. Creation instructions (above, to form a hemispherical epoxy resin layer (14). Due to the extremely high viscosity and cohesion of this two-liquid epoxy resin, After 6c 6 will condense into a hemisphere type (as shown in the second picture), this—the epoxy resin layer (: 4) has a hiding surface, which is still a good county silk, and the blue light crystal is mixed with a fluorescent powder. Epoxy resin can emit light with good luminosity, and the volume after the boat is small, but it has a better luminous effect. The light-emitting diode produced by the above method not only has a simple process, a large output, but also does not require Multiple sets of molds, such as brackets and materials, and the production of light-emitting diodes in a rotating manner can save materials and do not cause waste of raw materials as in the rotating manner. Therefore, it can save a lot of costs and is a very valuable industrial utilization value. New invention, apply in accordance with the law. (Please read the notes on the back before filling out this page.) Teach ··.----------/-Intellectual Property Bureau staff of the Ministry of Economic Affairs Consumption cooperative prints moderate ruled paper, one box and one box 4 λ-\ 1/5 Ν (C quasi standard house 1 1729