CN214203684U

CN214203684U - LED lamp bead with built-in drive IC

Info

Publication number: CN214203684U
Application number: CN202120168193.7U
Authority: CN
Inventors: 刘灿; 李七虎
Original assignee: Shenzhen Jiami Technology Co ltd
Current assignee: Shenzhen Jiami Technology Co ltd
Priority date: 2021-01-21
Filing date: 2021-01-21
Publication date: 2021-09-14
Anticipated expiration: 2031-01-21

Abstract

The utility model discloses a LED lamp bead with a built-in drive IC, which comprises a PCB board, a colloid, an IC wafer, pins, an LED wafer and an insulating glue; the PCB is connected with the colloid, an LED wafer is arranged on the PCB, and the LED wafer is connected with the PCB through insulating glue; the LED wafer is arranged on the front surface of the PCB and comprises three LED wafers with luminous colors of red, green and blue, and the three LED wafers are arranged in a line; the IC wafer sets up at the PCB board back, the pin is connected with the PCB board, and this pin is including turning up the pin. The utility model provides a small power consumption prevents the heat focus, has promoted the product quality, has reduced the technology degree of difficulty, has improved a built-in driver IC's of LED lamp pearl luminance LED lamp pearl.

Description

LED lamp bead with built-in drive IC

Technical Field

The utility model relates to a LED lamp pearl technical field, in particular to built-in drive IC's LED lamp pearl.

Background

The LED lamp bead packaged by the existing developed integrated IC and LED wafer (LED chip) can be widely applied to the fields of brightening, LED display screens, flexible display films and LCD backlight lamps.

The existing LED lamp bead with built-in IC is basically packaged by a normal mounting method in which an IC and an LED chip (LED chip) are on the same surface. This mainly has the following problems:

firstly, more elements are arranged on the same surface, and the layout and process difficulty is high;

the size difference between the IC wafer and the LED chip is large, the size of the IC wafer is large, and the luminous visual angle of the LED chip is influenced.

And thirdly, the IC chip drive adopts a common-anode mode, so that the power consumption is higher, and the heat generation is high (the LED chip is LED by voltage distribution and the electric energy is greatly wasted due to voltage drop).

And fourthly, the IC wafer and the LED CHIP adopt a positive mounting mode, and gold wires or copper wires are required to be punched to be connected to the conducting circuit on the PCB. The process is complex, the cost is high, and the fault is easy to occur.

The Chinese patent application numbers are: 201721072443.7, application date is 08 month 25 in 2017, publication date is: 22/05/2018, with patent names: the patent document discloses an LED lamp bead with a built-in IC (integrated circuit), which comprises a base, wherein the base is of a plate-shaped structure and is provided with an installation cavity with a circular cross section, and a driving IC and an LED chip are arranged in the installation cavity; the base is provided with four pins, and the four pins respectively extend outwards from the side surface of the base and are bent to the lower end surface of the base to form a first bonding pad and a second bonding pad which are symmetrical left and right; the four pins are respectively a ground terminal VSS, a data input terminal DIN, a power input terminal VDD and a data output terminal DOUT; the data input end DIN is connected with the signal input pin of the drive IC through a gold thread, the data output end DOUT is connected with the signal output pin of the drive IC through a gold thread, the power input end VDD is connected with the power pin of the drive IC through a gold thread, and the LED drive end of the drive IC is connected with the LED chip through a gold thread. The problems that the circuit is complex and the replacement is inconvenient due to the fact that the LED chip is driven by an external driver are solved through the technology.

The patent document discloses an LED lamp bead with a built-in IC, but the LED lamp bead has great layout and process difficulties; the luminous visual angle of the LED chip is influenced, the heating is large, the power consumption is high, and the requirements of consumers cannot be met.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a consumption is little, prevents the heat focus, has promoted the product quality, has reduced the technology degree of difficulty, has improved a built-in drive IC's of LED lamp pearl luminance LED lamp pearl.

In order to achieve the purpose of the utility model, the utility model provides a LED lamp bead with a built-in driving IC, which comprises a PCB, a colloid, an IC wafer, pins, an LDE wafer and an insulating glue; the PCB is connected with the colloid, an LED wafer is arranged on the PCB, and the LED wafer is connected with the PCB through insulating glue; the LED chips are arranged on the front surface of the PCB and comprise three LED chips with luminous colors of red, green and blue, and the three LED chips with the luminous colors of red, green and blue are arranged in a straight line or in a delta shape; the IC wafer is arranged on the back of the PCB, the pins are connected with the PCB, and the pins comprise outward-turning pins;

the light-emitting color red LED wafer comprises a first voltage for providing a power supply voltage for the light-emitting color red LED wafer, the light-emitting color green LED wafer comprises a second voltage for providing the power supply voltage for the light-emitting color green LED wafer, and the light-emitting color blue LED wafer comprises a third voltage for providing the power supply voltage for the light-emitting color blue LED wafer;

the first voltage passes through the luminous red LED wafer, and the negative voltage passing through the luminous red LED wafer is reduced through the IC wafer;

the second voltage passes through the luminous color green LED wafer, and the negative voltage passing through the luminous color green LED wafer is reduced through the IC wafer;

the third voltage passes through the light-emitting color blue LED wafer, and the negative voltage passing through the light-emitting color blue LED wafer is reduced through the IC wafer.

The IC wafer sets up at the PCB board back, is provided with the heat-conducting layer in the bottom surface of this IC wafer.

The heat conduction layer is a copper foil.

And a gold plating layer is arranged on the surface of the heat conduction layer.

The IC wafer is arranged on the front surface of the PCB.

The pins include inverted pins.

The number of pins includes 4 or 6.

The insulating glue comprises silver glue.

The external dimension of the LED lamp bead is 1.5mm x 1.5 mm-50 mm x 50 mm.

The utility model has the advantages that 1) the utility model arranges the IC on the back of the PCB, thereby solving the influence of the IC wafer on the luminous visual angle of the LED chip and being more beneficial to the arrangement of the lamp beads; meanwhile, heating elements are dispersed, so that heat accumulation is effectively prevented, and the stability of the product is improved; 2) the utility model discloses the IC drive adopts totally negative mode. Compared with a common-anode mode, the efficiency and brightness of the lamp bead can be improved by 20% -50% under the same current condition, and the overall power consumption is lower. The heat productivity is reduced by more than 25%; 3) the IC wafer of the utility model adopts an inverted installation mode, thus directly saving the cost and welding procedure of gold threads and greatly reducing the difficulty of the manufacturing process; meanwhile, the brightness of the lamp beads can be improved by 20-50%.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a prior art of a LED lamp bead with a built-in driving IC of the embodiment of the present invention;

FIG. 2 is a diagram of a power supply circuit of the prior art of a built-in drive IC LED lamp bead;

fig. 3 is a structural schematic diagram of the LED lamp bead with a built-in driving IC according to the embodiment of the present invention, in which an IC wafer is disposed on the back side;

fig. 4 is a structure diagram of a common-cathode power supply circuit of an LED lamp bead with a built-in driving IC of the embodiment of the present invention;

fig. 5 is a schematic structural view of an IC wafer of an LED lamp bead with a built-in driver IC according to another embodiment of the present invention, which is disposed on the back of a PCB;

fig. 6 is a disassembly schematic diagram of the IC wafer of the LED lamp bead with the built-in driving IC of the embodiment of the present invention, which is arranged on the back of the PCB;

fig. 7 is a cross-sectional view of an LED lamp bead with a built-in driver IC of the embodiment of the present invention;

fig. 8 is a schematic structural view of the LED lamp bead with a built-in driver IC according to the embodiment of the present invention, in which an IC wafer is disposed on the front surface of a PCB;

fig. 9 is the utility model discloses another embodiment embeds drive IC's LED lamp pearl's IC wafer setting is at PCB board positive surface structure schematic diagram.

The reference numbers illustrate:

1. a PCB board; 2. a colloid; 3. an IC wafer; 4. a pin; 5. an LED wafer; 50. gold thread; 51. A red LED wafer; 52. green LED chips, 53, blue LED chips; 6. insulating glue; 7. a heat conductive layer; 8. A voltage; 81. a first voltage; 82. a second voltage; 83. a third voltage;

the objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.

In the present application, unless expressly stated or limited otherwise, the terms "connected" and "fixed" are to be construed broadly, e.g., "fixed" may be fixedly connected or detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In addition, descriptions in the present application as to "first", "second", and the like are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

The utility model provides a built-in drive IC's LED lamp pearl.

Referring to fig. 1 and 2, the conventional IC-embedded LED lamp bead includes a PCB board 1, a gel 2, an IC chip 3, a pin 4, an LDE chip (LED chip)5, and an insulating gel 6; the PCB 1 is connected with the colloid 2, the PCB 1 is provided with an LED wafer 5, the IC wafer 3 is arranged on the front surface of the PCB, and the LED wafer 5 is connected with the PCB 1 through an insulating glue 6; the LED wafer 5 is arranged on the front surface of the PCB board 1; the LED chip 5 is provided with gold wires 50;

the existing built-in IC LED lamp bead is basically packaged by adopting a normal mounting mode that an IC wafer 3 and an LED wafer (LED chip)5 are on the same surface.

In the prior art, a common-anode power supply mode is generally adopted, and referring to fig. 2, the common-anode power supply mode refers to that the same voltage 8 is used for uniformly supplying power to three LED chips, namely a red LED chip, a green LED chip and a blue LED chip, so that the forward voltage drop is increased; for example: the same voltage 8 is used for inputting a voltage (for example, 5 volts) higher than 3.8 volts to the three LED chips of the red LED chip, the green LED chip and the blue LED chip to uniformly supply power, at this time, the voltages of the three LED chips of the red LED chip, the green LED chip and the blue LED chip are all uniform 5 volts, but the optimal operating voltages required by the red LED chip, the green LED chip and the blue LED chip are much lower than 5 volts, and according to a power formula P ═ UI, under the condition that the current is not changed, the higher the voltage is, the higher the power is, and the power consumption is also larger.

This mainly has the following problems:

And fourthly, routing is needed in the normal assembly, the number of leads is large, the process difficulty is high, the yield is low, and the cost is high.

Referring to fig. 3 to 7, in an embodiment of the present invention, the LED lamp bead with a built-in driver IC includes a PCB board 1, a colloid 2, an IC chip 3, a pin 4, an LDE chip 5, and an insulating glue 6; the PCB 1 is connected with the colloid 2, the LED wafer 5 is arranged on the PCB 1, and the LED wafer 5 is connected with the PCB 1 through an insulating adhesive 6; the LED wafer 5 is arranged on the front surface of the PCB 1, the LED wafer 5 comprises three LED wafers of a red LED wafer 51, a green LED wafer 52 and a blue LED wafer 53, and the three LED wafers 5 of the red LED wafer 51, the green LED wafer 52 and the blue LED wafer 53 are arranged in a straight line or in a delta shape; the IC wafer 3 is arranged on the back of the PCB board 1, the pins 4 are connected with the PCB board 1, and the pins 4 comprise outward-turning pins; referring to fig. 4, the first voltage 81 passes through the red LED chip 51, and the negative voltage passing through the red LED chip 51 is stepped down by the IC chip 3;

the second voltage 82 passes through the green LED chip 52, and the negative voltage passing through the green LED chip 52 is reduced by the IC chip 3;

the third voltage 83 passes through the blue LED chip 53, and the negative voltage passing through the blue LED chip 53 is stepped down by the IC chip 3.

In the embodiment, the IC wafer 3 is arranged on the back surface of the PCB 1, so that the influence of the IC wafer 3 on the luminous visual angle of the LDE wafer 5 is avoided, and the arrangement of lamp beads is facilitated; meanwhile, heating elements are dispersed, heat accumulation is effectively prevented, and the stability of the product is improved.

In this embodiment, the LED chip 5 includes three LED chips, i.e., a red LED chip 51, a green LED chip 52, and a blue LED chip 53, the three LED chips 5, i.e., the red LED chip 51, the green LED chip 52, and the blue LED chip 53, are arranged in a straight line or in a delta shape on the front surface 1 of the PCB, and the IC chip 3 is disposed on the back surface of the PCB board 1 and flip-chip mounted thereon.

In this embodiment, the present invention adopts a common cathode power supply mode, wherein the first voltage 81, the second voltage 82, and the third voltage 83 are different voltages, and the first voltage 81, the second voltage 82, and the third voltage 83 respectively provide current and voltage to the red LED chip 51, the green LED chip 52, and the blue LED chip 53; because the red LED wafer 51, the green LED wafer 52 and the blue LED wafer 53 respectively have different requirements on voltage, for example, the red LED wafer 51 needs 2.8 volts; the green LED chip 52 requires a voltage of 3.8 volts; the blue LED chip 53 requires about 3.8 v, and different voltages are input to different color LED chips, so that accurate power supply can be achieved with less power consumption, and thus the heat loss is low.

In this embodiment, the first voltage 81, the second voltage 82, and the third voltage 83 respectively provide current voltages to the red LED chip 51, the green LED chip 52, and the blue LED chip 53, and the current flows through the red LED chip 51, the green LED chip 52, and the blue LED chip 53, respectively, and then to the negative electrode of the IC chip 3, so that the forward voltage drop is reduced and the on-resistance is also reduced.

In this embodiment, the utility model discloses a totally cloudy power supply mode. Compared with a common-anode mode, the efficiency and brightness of the lamp bead can be improved by 20% -50% under the same current condition, and the overall power consumption is lower. The heat productivity is reduced by more than 25%.

Referring to fig. 3, 5, 6, and 7, in the present embodiment, the IC die 3 is disposed on the back surface of the PCB board 1, and a heat conductive layer 7 is disposed on the bottom surface of the IC die 3.

Further, preferably, the heat conductive layer 7 is a copper foil.

Further, preferably, the surface of the heat conduction layer 7 is provided with a gold plating layer.

This embodiment, insulating cement 6 is connected with PCB board 1, and the PCB board back increases dedicated heat-conducting layer 7, and this heat-conducting layer 5 adopts the surface gild, increases heat conduction area, is convenient for derive the heat of IC wafer 3 and LED wafer 5.

In this embodiment, the IC die 3 controls the LED die 5 to be implemented by a circuit inside the PCB board 1;

in this embodiment, preferably, the pin 4 further includes an inverted pin.

Further, preferably, the number of the pins 4 includes 4 or 6.

In this embodiment, it is further preferable that the insulating paste 6 includes silver paste.

The utility model discloses can pass through epoxy encapsulation in colloid 2 with each components such as PCB board 1, IC wafer 3, LED wafer 5, pin 4, heat-conducting layer 7.

Referring to fig. 8 and 9, in this embodiment, the IC die 3 of the present invention can be further disposed on the front surface of the PCB board 1.

In this embodiment, preferably, the external dimension of the LED lamp bead is 1.5mm by 1.5mm to 50mm by 50 mm.

The utility model discloses mainly explain the product framework that changes integrated packaging scheme to make the example with 1515 lamp pearl (namely the overall dimension 1.5 of lamp pearl is 1.5 mm). Because the sizes of the IC dies 3 are different and the external dimensions of the beads are different, the LED beads commonly used in the industry have different specifications 5050, 3535, 3528, 3030, 2727, 2525, 2020, 1820, 1921, 1515, 1415, and the like, and are all within the protection scope of the present patent.

The IC wafer of the utility model adopts an inverted installation mode, thus directly saving the cost and welding procedure of gold threads and greatly reducing the difficulty of the manufacturing process; meanwhile, the brightness of the lamp beads can be improved by 20-50%.

The utility model provides a LED lamp pearl that a section is applicable to flexible transparent display or flexible display or film LED display screen realizes the product design of the high density pixel of above-mentioned product, reduces the technology degree of difficulty and promotes the reliability of product. The product designed according to the scheme can reduce the overall power consumption by 20-50% under the same brightness.

The above only is the preferred embodiment of the present invention, not so limiting the patent scope of the present invention, without departing from the spirit and scope of the present invention, the present invention can also have various changes and improvements, all under the inventive concept, utilize the equivalent structure transformation made by the contents of the specification and the drawings, or directly/indirectly use in other related technical fields all included in the patent protection scope of the present invention.

Claims

1. An LED lamp bead with a built-in drive IC comprises a PCB, a colloid, an IC wafer, pins, an LED wafer and an insulating adhesive; the PCB is connected with the colloid, an LED wafer is arranged on the PCB, and the LED wafer is connected with the PCB through insulating glue; the LED wafer sets up openly at the PCB board, and this LED wafer includes three LED wafer of luminescent color red, green, blue, its characterized in that: the three LED chips with the light-emitting colors of red, green and blue are arranged in a straight line or in a delta shape; the IC wafer is arranged on the back of the PCB, the pins are connected with the PCB, and the pins comprise outward-turning pins;

2. The LED lamp bead with the built-in driver IC according to claim 1, characterized in that: the IC wafer sets up at the PCB board back, is provided with the heat-conducting layer in the bottom surface of this IC wafer.

3. The LED lamp bead with the built-in driver IC according to claim 2, characterized in that: the heat conduction layer is a copper foil.

4. The LED lamp bead with the built-in driver IC according to claim 2, characterized in that: and a gold plating layer is arranged on the surface of the heat conduction layer.

5. The LED lamp bead with the built-in driver IC according to claim 1, characterized in that: the IC wafer is arranged on the front surface of the PCB.

6. The LED lamp bead with the built-in driver IC according to claim 1, characterized in that: the pins include inverted pins.

7. The LED lamp bead with the built-in driver IC according to claim 1 or 6, characterized in that: the number of pins includes 4 or 6.

8. The LED lamp bead with the built-in driver IC according to claim 1, characterized in that: the insulating glue comprises silver glue.

9. The LED lamp bead with the built-in driver IC according to any one of claims 1 to 6, wherein: the external dimension of the LED lamp bead is 1.5mm x 1.5 mm-50 mm x 50 mm.