TWI425674B - Light-emitting diode package fabricating method - Google Patents

Description

Method for manufacturing light emitting diode package structure

The present invention relates to a semiconductor light emitting device, and more particularly to a method of fabricating a light emitting diode package structure.

Light-emitting diodes have been used in more and more occasions due to their high luminous efficiency, low energy consumption, and no pollution. They have a tendency to replace traditional light sources.

At present, the light emitting diode package structure generally includes a reflector structure, the reflector cup is standing above the substrate, and the light emitting diode is placed in the reflector. When manufacturing the LED package structure, the water vapor on the substrate, the reflector, and the substrate and the reflector are not removed before dispensing, thereby affecting the life of the LED package structure and even causing the LED The failure of the body.

In view of the above, it is necessary to provide a manufacturing method for improving the life of a light emitting diode package structure.

A method of manufacturing a light emitting diode package structure, comprising the steps of:

Step 1: providing a plurality of connected package bases, each package base comprising a substrate, a reflective cup on the substrate, and an electrode pair attached to the substrate;

Step 2, solid crystal, fixing the light emitting diode chip to one of the electrodes of the electrode pair;

Step 3, bonding wires, electrically connecting the light-emitting diode chip and the electrode pair through a wire;

Step 4, dispensing, injecting a transparent colloid into the reflector;

Step 5, curing, baking the package base to cure the transparent colloid;

Step 6, separating the package bases,

The step a of baking the package base is further included between the step 3 and the step 4. In the step a, the temperature of the package base is controlled within a range of 140±10 ° C until the moisture remaining on the package base is removed.

The package base is baked before dispensing to remove moisture remaining on the package base, thereby improving the life of the LED package structure.

FIG. 1 shows a flow of a method of fabricating a light emitting diode package structure according to an embodiment of the invention. The respective steps of the manufacturing method of the light emitting diode package structure will be specifically described below with reference to FIGS. 2 to 7. Specific steps are as follows:

In step one, a plurality of package pedestals 100 are provided, and the package pedestals 10 are sequentially connected to form a whole piece. Each package base 100 includes a substrate 10, a reflector cup 30 on the upper surface 11 of the substrate 10, and an electrode pair 20 extending from the upper surface 11 of the substrate 10 to the lower surface 12, as shown in FIG.

Step 2, solid crystal, fixing the LED wafer 40 to one of the electrode pairs 20 of the package base 100, as shown in FIG. 3;

Step 3, bonding wires, connecting the positive and negative electrodes of the LED wafer 40 to the electrode pair 20, as shown in FIG. 3;

Step 4, baking the package base 100, the temperature of the package base 100 is controlled within a range of 140±10 ° C, and the temperature of the range is continued for at least 60 minutes to remove the chemical solution and water vapor remaining on the package base 100;

Step 5, baking the package base 100 on a dispensing machine (not shown), so that the temperature of the package base 100 is controlled within a range of 40 ° C to 70 ° C, and the temperature range is continued for at least 10 seconds;

Step 6: Dispensing, injecting the transparent colloid 70 into the reflector cup 30 through the dispensing needle 60, and continuously heating the package base 100 to reduce the viscosity of the transparent colloid 70, thereby avoiding the problem of overflowing glue, as shown in FIG. Show

Step 7: baking the package base 100 on a baking and packaging machine (not shown) to minimize the viscosity of the transparent colloid 70, reducing the internal stress and increasing the airtightness of the transparent colloid 70 and the reflector 30. The temperature is controlled in the range of 50 ° C ~ 100 ° C and continues this temperature range for at least 30 minutes.

Step eight, baking the package base 100 to cure the transparent colloid 70, the baking temperature range is 150 ° C ~ 170 ° C;

In step nine, each package base 100 is separated to form a plurality of package structures, as shown in FIG.

In the present embodiment, the electrode pair 20 and the connection portion 23 between the adjacent package pedestals 100 constitute a PLCC (Plastic Leaded Chip Carrier) holder. The substrate 10 and the reflector cup 30 are injection molded integrally with the electrode pair 20 on the PLCC holder. The PLCC bracket is made of a single formed sheet of metal. Referring again to FIG. 2, each electrode pair 20 includes a first electrode 21 and a second electrode 22. The first electrode 21 and the second electrode 22 are insulated from each other. Each of the reflector cups 30 has a receiving portion 32 around its center. In other embodiments, the substrate 10 is a monolithic ceramic substrate, and the plurality of electrode pairs 20 are spaced apart from each other on the ceramic substrate, and a reflector cup 30 is disposed corresponding to each electrode pair 20, as shown in FIG. Adjacent package bases 100 are connected by a ceramic substrate.

In this embodiment, step 9 separates the package bases 100 by stamping, specifically, the connecting portions 23 between the adjacent package bases 100 are bent by the jig, and then the package base 100 and the PLCC bracket are assembled. Separation. When the substrate 10 is a ceramic substrate, in step 9, the package bases 100 are separated by a cutting method. Specifically, the ceramic substrates are cut by a cutter to separate the package bases 100.

Referring again to FIG. 3, the light emitting diode chip 40 is disposed on the upper surface of each of the first electrodes 21. The LED chip 40 is received in the receiving portion 32 of the reflector cup 30. The reflector cup 30 surrounds the LED chip 40 for reflecting light emitted from the LED chip 40. The light emitting diode wafer 40 includes a semiconductor light emitting structure (not labeled) and a first electrical connection (not labeled) and a second electrical connection (not labeled) disposed on top of the semiconductor light emitting structure. In this embodiment, the first electrical connection portion and the second electrical connection portion are spaced apart from each other on a top surface of the semiconductor light emitting structure away from the substrate 10. The first electrical connection portion is electrically connected to the first electrode 21 through a wire 50. Similarly, the second electrical connection portion is electrically connected to the second electrode 22 through another wire 50. The wire 50 has good electrical conductivity and is usually made of a metallic material. In addition, the two electrical connections of the LED wafer 40 are not limited to the same side of the LED array 40 in the above embodiment, and may be located on opposite sides of the LED wafer 40. In this case, only one wire 50 is required to connect the corresponding electrical connection portion and the electrodes 21, 22. The other electrical connection portion and the electrodes 21, 22 can be electrically connected directly through the conductive adhesive without using the wire 50.

The transparent colloid 70 may be made of silicone, epoxy or other transparent material.

Referring to FIG. 7 at the same time, in the process of dispensing, the phosphor powder 80 can be added to the transparent colloid 70 to receive the light characteristics of the emitted light after receiving the light of the LED chip 40. In step seven, the phosphor powder 80 is uniformly deposited on the bottom of the reflector cup 30 and covers the light-emitting diode wafer 40.

The present invention bakes the package base 100 at a high temperature of 140 ± 10 ° C prior to dispensing to achieve at least the purpose of removing moisture on the package base 100.

The present invention bakes the package base 100 at a low temperature of 40 ° C to 70 ° C before dispensing, and continuously heats the package base 100 during the dispensing process to reduce the viscosity of the transparent colloid 70 and avoid overflow problems. At the same time, the yield of the LED package structure can be improved.

After dispensing, the package base 100 is baked at a low temperature of 50 ° C to 100 ° C to minimize the viscosity of the transparent colloid 70, reduce internal stress and increase the airtightness of the transparent colloid 70 and the reflector cup 30.

In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.

100‧‧‧Package base

10‧‧‧Substrate

11‧‧‧ upper surface

12‧‧‧ Lower surface

20‧‧‧electrode pair

21‧‧‧First electrode

22‧‧‧second electrode

23‧‧‧Connecting Department

30‧‧‧Reflective Cup

32‧‧‧ 容部

40‧‧‧Light Diode Wafer

50‧‧‧ wire

60‧‧‧ dispensing needle

70‧‧‧Transparent colloid

80‧‧‧Flame powder

1 is a flow chart of a method of fabricating a light emitting diode package structure according to an embodiment of the invention.

FIG. 2 is a cross-sectional view showing the light emitting diode package structure obtained in the first step of the manufacturing method of the light emitting diode package structure of FIG.

3 is a cross-sectional view showing the light emitting diode package structure obtained in the second and third steps of the manufacturing method of the light emitting diode package structure of FIG.

4 is a cross-sectional view showing a light emitting diode package structure in the dispensing process of the sixth step of the manufacturing method of the light emitting diode package structure of FIG.

FIG. 5 is a cross-sectional view showing the light emitting diode package structure in which the package base is separated in a manner of step 9 in the manufacturing method of the light emitting diode package structure of FIG.

6 is a cross-sectional view showing the light emitting diode package structure in which the package base is separated in another manner in the step 9 of the manufacturing method of the light emitting diode package structure of FIG.

FIG. 7 is a cross-sectional view showing a light emitting diode package structure obtained by containing phosphor powder in a transparent colloid in the seventh step of the method for manufacturing the light emitting diode package structure of FIG. 1 .

Claims (10)

A method of manufacturing a light emitting diode package structure, comprising the steps of:
Step 1: providing a plurality of connected package bases, each package base comprising a substrate, a reflective cup on the substrate, and an electrode pair attached to the substrate;
Step 2, solid crystal, fixing the light emitting diode chip to one of the electrodes of the electrode pair;
Step 3, bonding wires, electrically connecting the light-emitting diode chip and the electrode pair through a wire;
Step 4, dispensing, injecting a transparent colloid into the reflector;
Step 5, curing, baking the package base to cure the transparent colloid;
Step 6, separating the package bases,
The improvement is that the step a of baking the package base is further included between the step 3 and the step 4. In the step a, the temperature of the package base is controlled within a range of 140±10 ° C until the removal remains on the package base. Water vapor. The method of manufacturing a light emitting diode package structure according to claim 1, wherein in step a, the package base is baked for at least 60 minutes. The manufacturing method of the light emitting diode package structure according to claim 1, wherein the step b of baking the package base is further included between the steps 3 and 4, and the temperature of the package base is controlled at 40 ° C. Within the range of 70 ° C and continue this temperature range for at least 10 seconds. The manufacturing method of the light emitting diode package structure according to claim 3, wherein in the dispensing process of step 4, the package base is continuously heated at the temperature of step b to reduce the viscosity of the transparent colloid. . The method for manufacturing a light emitting diode package structure according to claim 4, further comprising a step c after the step 4, baking the package base at a temperature of 50 ° C to 100 ° C for at least 30 minutes. The method for manufacturing a light-emitting diode package structure according to claim 5, wherein the transparent colloid comprises a phosphor powder, and in step c, the phosphor powder is uniformly deposited on the bottom of the reflector. And covering the light emitting diode chip. The manufacturing method of the light emitting diode package structure according to claim 1, wherein the electrode pair and the connection portion between the adjacent package bases constitute a PLCC bracket, and in step 6, the adjacent package base is stamped. The manner of the connection between the seats separates the individual package bases. The method for manufacturing a light emitting diode package structure according to claim 1, wherein the substrate is a ceramic substrate, the adjacent package pedestals are connected by a ceramic substrate, and in step 6, the ceramic substrate is cut. Separate the individual package bases. The method for manufacturing a light emitting diode package structure according to claim 1, wherein in step 5, the temperature of the transparent colloid is cured between 150 ° C and 170 ° C. The method of manufacturing a light emitting diode package structure according to claim 1, wherein the electrode pair extends from an upper surface to a lower surface of the substrate.