CN212929629U - COB lamp area and illumination of spotlight are decorated - Google Patents

Abstract

The utility model provides a but COB lamp area and illumination of spotlight are decorated relates to the LED lamp field. This COB lamp area that can spotlight, it includes base plate, LED wafer and reflective wall, and a plurality of LED wafers are fixed in on the base plate, and reflective wall encloses and locates around the LED wafer. This application is through setting up the reflection of light wall around the LED wafer, and the light that the LED wafer sent can be reflected and refract by the reflection of light wall after arriving the reflection of light wall, and the luminous angle and the luminous zone of giving out light of LED wafer can be controlled to height and width through the control reflection of light wall in this application to reach the spotlight effect, avoid the light full angle scattering that the LED wafer sent, promoted light utilization ratio. In addition, its spotlight effect is good for its illumination decoration that this application provided, and light utilization rate obtains promoting.

Description

COB lamp area and illumination of spotlight are decorated

Technical Field

The utility model relates to a LED lamp field particularly, relates to a but COB lamp area and illumination of spotlight are decorated.

Background

COB lamp area is a novel LED lamp area that appears in recent years, is different from the traditional LED lamp area that uses LED paster lamp pearl as the light source, and COB lamp area gets rid of the paster packaging technology, directly binds the LED wafer on the lamp area base plate, because long service life, processing procedure simple process is very energy-conserving again and green and completely exposed corner in various illumination decoration trades gradually. COB lamp area has following characteristics:

1. soft and can be curled at will.

2. Shearing and extension can be performed.

3. The LED wafer is completely wrapped by the silica gel, and has good waterproof airtightness and insulation property.

4. The service life is long.

5. The flip LED chip is directly fixed on the substrate, so that the bonding wire process which is most prone to causing problems in the traditional LED packaging is eliminated, and the product reliability is higher.

6. The modeling of figures, characters and the like is easy to manufacture; it has been widely used to throw and illuminate in the future structures, bridges, approaches, gardens, patios, strata, lie boards, furniture, buses, lakes, underwater surfaces, posters, whiteboards, signs and the like.

Referring to fig. 1, in the COB lamp strip on the market, an LED chip is flip-chip mounted on a substrate, and then a layer of semicircular or flat silica gel is coated on the surface of the chip, so that light emitted from the LED flip-chip is reflected and refracted in the silica gel, giving a visual effect of 180 ° or full surface light emission to people, but many terminal applications do not need such a large light emitting angle or light emitting surface, and no good solution exists at present.

In view of this, the present application is specifically made.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a but COB lamp area of spotlight, it can realize controlling the luminous angle and the luminous region of LED wafer, avoids the light scattering, promotes light utilization ratio.

An object of the utility model is to provide an illumination is decorated, its spotlight effect is good, and light utilization rate obtains promoting.

The embodiment of the utility model is realized like this:

in a first aspect, an embodiment of the present invention provides a COB lamp area that can spotlight, it includes base plate, LED wafer and reflective wall, and is a plurality of the LED wafer is fixed in on the base plate, reflective wall encloses to be located around the LED wafer and with the base plate is connected.

In an alternative embodiment, the height of the light reflecting wall vertically extending on the substrate is greater than the height of the LED chip vertically extending on the substrate, and the light emitting angle of the light emitted from the inside of the light reflecting wall is 90-120 °.

In an optional embodiment, the reflective wall has a connection end surface connected to the substrate and a free end surface extending upward perpendicular to the substrate, an inner side surface of the reflective wall is inclined to form an inclined surface, and an opening surrounded by the connection end surface is smaller than an opening surrounded by the free end surface.

In an optional embodiment, the number of the LED chips is multiple, at least two adjacent LED chips form a light reflecting unit, and the number of the light reflecting walls is less than or equal to the number of the light reflecting units.

In an alternative embodiment, the LED chips in the light reflecting unit have different light emitting colors.

In an alternative embodiment, the light reflecting unit is composed of 3 LED chips with different emitting colors and corresponding to three primary colors.

In an alternative embodiment, the substrate is a flexible FPC board, a rigid substrate, or a metal substrate.

In an alternative embodiment, the spotlightable COB strip further includes an encapsulation adhesive coated on the surface of the LED chip.

In an alternative embodiment, the encapsulation adhesive is semi-circular or flat.

In a second aspect, an embodiment of the present invention provides a lighting decoration, which includes a COB strip that can condense light as in any one of the foregoing embodiments.

The embodiment of the utility model provides a beneficial effect is:

the application provides but COB lamp area of spotlight is through setting up the reflection of light wall around the LED wafer, and the light that the LED wafer sent can be reflected and refract by the reflection of light wall after arriving the reflection of light wall, and the luminous angle and the luminous region of emitting light area of LED wafer can be controlled to height and width through the control reflection of light wall in this application to reach the spotlight effect, avoid the light full angle scattering that the LED wafer sent, promoted light utilization ratio. In addition, its spotlight effect of illumination decoration that this application provided is good, and light utilization ratio obtains promoting, but wide application carries out whitewashed decoration and illumination on bridge, route, garden, courtyard, stratum, furniture, bus, lake, submarine, poster, whitewashed tablet, sign etc..

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic structural diagram of a COB lamp strip in the prior art;

fig. 2 is a schematic structural view of a COB lamp strip capable of condensing light according to an embodiment of the present invention;

fig. 3 is a schematic structural view of a COB lamp strip capable of condensing light provided by an embodiment of the present invention, which has a larger light-emitting angle;

fig. 4 is a schematic structural view of a COB lamp strip capable of condensing light provided by an embodiment of the present invention, which has a smaller light-emitting angle;

fig. 5 is a schematic structural view of a COB lamp strip capable of condensing light provided in embodiment 1 of the present invention;

fig. 6 is a schematic structural view of a COB lamp strip capable of condensing light provided in embodiment 2 of the present invention;

fig. 7 is a schematic structural view of a COB lamp strip capable of condensing light provided in embodiment 3 of the present invention;

fig. 8 is a schematic structural view of a COB lamp strip capable of condensing light provided in embodiment 4 of the present invention;

fig. 9 is a schematic structural view of a COB lamp strip capable of condensing light provided in embodiment 5 of the present invention;

fig. 10 is a schematic structural view of a COB lamp strip capable of condensing light according to embodiment 6 of the present invention;

fig. 11 is a schematic structural view of a COB lamp strip capable of condensing light according to embodiment 7 of the present invention;

fig. 12 is a schematic structural view of a COB lamp strip capable of condensing light according to embodiment 8 of the present invention;

fig. 13 is a schematic structural diagram of a COB lamp strip that can gather light that embodiment 9 of the present invention provides.

Icon: 100-COB lamp strip capable of condensing light; 110-a substrate; 120-LED chip; 121-a light reflecting unit; 130-packaging glue; 140-reflective walls; 141-medial side; 150-electronic components; 160-positive and negative electrode pads.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the product of the present invention is used, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are required to be absolutely horizontal or pendant, but rather may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 2, the present embodiment provides a spotlightable COB lamp strip 100, which includes a substrate 110, an LED chip 120, a packaging adhesive 130, and a reflective wall 140.

The substrate 110 is an FPC flexible board, a rigid substrate 110 or a metal substrate 110, on which a circuit is disposed, the LED chip 120 is flip-chip mounted on the substrate 110, and the LED chip 120 has a plurality of colors, such as red, blue, green, yellow, white, and the like. The packaging adhesive 130 is coated on the surface of the LED chip 120 to protect the LED chip 120 or adjust the light emitting color of the LED chip 120 by adding phosphor, the packaging adhesive 130 is semi-circular or flat, and the light emitted from the LED flip chip can be reflected and refracted in the silica gel. It should be understood that the spotlightable COB lamp strip 100 in this application also includes the electronic components 150 (resistors, control ICs, etc., set according to actual requirements, and the placement position is not limited) and the positive and negative electrode pads 160 (for external input line connection or interconnection between lamp strips) that the conventional COB lamp strip has.

Through set up reflection wall 140 around LED wafer 120 in this application, the light that LED wafer 120 sent can be reflected and refract by reflection wall 140 after arriving reflection wall 140, thereby reach the spotlight effect, through the height and the width of control reflection wall 140, the luminous angle and the luminous region that can control the wafer, avoid the light full angle scattering that LED wafer 120 sent, promote the utilization ratio of light.

It should be understood that the height and width of the reflective wall 140 in the present application can be adjusted according to actual needs, so as to change the light emitting angle of the light emitted from the reflective wall 140. Referring to fig. 3 and 4, it can be seen that the light emitting angle of the LED chip 120 can be changed by adjusting the height of the reflective wall 140, and can be adjusted according to actual requirements in practical applications. Preferably, the light emission angle in this application is 10-170 °, more preferably 60-150 °, more preferably 90-120 °. The height of the reflective wall 140 extending vertically on the substrate 110 needs to be greater than the height of the LED chip 120 extending vertically on the substrate 110 to achieve light condensation, and the height and width of the reflective wall 140 can be adjusted adaptively by selecting the light emitting angle.

Further, the shape of the reflective wall 140 may also be adjusted according to actual requirements, specifically, the shape of the reflective wall 140 includes but is not limited to a circular ring shape, a bowl shape, a triangular frame structure, a rectangular frame structure or other polygonal frame structures, and in this application, the reflective wall 140 surrounds the periphery of the LED chip 120 to realize light condensation on the LED chip 120.

Further, a side of the reflective wall 140 close to the LED chip 120 is defined as an inner side 141, a side far away from the LED chip 120 is defined as an outer side, the reflective wall 140 has a connection end connected to the substrate 110 and a free end extending upward perpendicular to the substrate 110, in this application, the inner side 141 is inclined to form an inclined plane, and an opening surrounded by the connection end is smaller than an opening surrounded by the free end. The slope is more favorable for the reflection of the light of the LED chip 120 by the reflective wall 140. However, in other embodiments of the present application, the shape of the inner side 141 of the reflective wall 140 may be selected from other forms, such as a plane, an arc surface, or a corrugated surface.

In addition, the material of the reflective wall 140 is not limited, as long as the material used can achieve the reflective and light-shielding effect, and the material reflectivity, the light transmittance, and the like are not limited.

Since there are a plurality of LED chips 120 on the substrate 110, some or all of the LED chips 120 may be condensed according to actual needs (as shown in fig. 2). The number of the LED chips 120 surrounded by the reflective wall 140 is not limited in the present application, and the number of rows and positions of the LED chips 120 are not limited, and can be adjusted according to actual requirements.

Specifically, in an embodiment of the present application, referring to fig. 5, when the light reflecting unit 121 is composed of all the LED chips 120, one light reflecting wall 140 is disposed around the light reflecting unit 121. In other words, the reflective walls 140 are disposed on two sides of the LED chip 120, and the middle of the substrate 110 is not disposed, so that the light emitted from the adjacent chips can be mixed with each other, and the light is more continuous and uniform, and the reflective walls 140 on two sides can concentrate the emitted light.

In another embodiment of the present application, when the light reflecting unit 121 is composed of 1 to 5 LED chips 120, the number of the light reflecting walls 140 is less than or equal to the number of the light reflecting units 121. When the number of the reflective walls 140 is plural, the plural reflective walls 140 are independently provided (see fig. 6 to 9) or integrally provided (see fig. 10 to 13).

For example, when the light reflecting unit 121 is composed of 1 LED chip 120, the light reflecting walls 140 may surround the outer side of each LED chip 120, and at this time, the light reflecting walls 140 may be independently disposed (i.e., the outer side of each LED chip 120 surrounds the light reflecting walls 140 and there is a gap between adjacent light reflecting walls 140, as shown in fig. 6), or may be integrally disposed (i.e., the outer side of each LED chip 120 surrounds the light reflecting walls 140 and there is no gap between adjacent light reflecting walls 140, as shown in fig. 10).

For example, when the light reflecting unit 121 is composed of 2 LED chips 120, the 2 LED chips 120 in the region surrounded by the light reflecting wall 140 may be chips with the same light emitting color or chips with different light emitting colors. In the present application, light emitting chips with different colors are preferred, and at this time, under the action of the reflective wall 140, the light emitted from the two LED chips 120 can be more uniformly mixed into another target color. Further, the LED chips 120 are distributed in at least one row on the substrate 110. The 2 LED chips 120 surrounded by the reflective wall 140 may be two LED chips located in the same row (as shown in fig. 7 or fig. 11) or two LED chips located in the same column (as shown in fig. 8 or fig. 12).

For example, when the light reflecting unit 121 is composed of 3 LED chips 120, the 3 LED chips 120 in the region surrounded by the light reflecting wall 140 may be chips with the same light emitting color or chips with different light emitting colors. In the present application, light emitting chips with different colors are preferred, and the 3 LED chips 120 conform to three primary colors of RGB, and under the reflective color mixing effect of the reflective wall 140, all visible lights can be mixed by adjusting the light emitting intensity of different colors (the external driving power source adjusts the current passing through each chip). If the reflective wall 140 is not added, the color mixing is not uniform in the conventional case, the light emitted from the LED chip 120 is scattered in all angles, and only a small portion of the light can be mixed. Similarly, the number of the 3 LED chips 120 surrounded by the reflective wall 140 may be three in the same row, three in the same column, or three in two adjacent rows (as shown in fig. 9 or fig. 13).

The working principle of the COB lamp strip 100 capable of condensing light is as follows: through set up reflection wall 140 around LED wafer 120 in this application, the light that LED wafer 120 sent can be reflected and refract by reflection wall 140 after arriving reflection wall 140 to reach the spotlight effect, avoid the light full angle scattering that LED wafer 120 sent, promoted light utilization ratio.

Example 1

The present embodiment provides a spotlightable COB lamp strip 100, which includes a substrate 110, a plurality of LED chips 120, an encapsulant 130, and a reflective wall 140. In this embodiment, the light reflecting unit 121 is composed of all the LED chips 120, and the light reflecting walls 140 are disposed around the light reflecting unit 121, and at this time, there is only one light reflecting wall 140. Please refer to fig. 5 for the structure diagram.

Example 2

The present embodiment provides a spotlightable COB lamp strip 100, which includes a substrate 110, a plurality of LED chips 120, an encapsulant 130, and a reflective wall 140. In this embodiment, the light reflecting unit 121 is composed of one LED chip 120, the light reflecting wall 140 surrounds the light reflecting unit 121, and the light reflecting walls 140 are independently disposed. Please refer to fig. 6 for the structure diagram.

Example 3

The present embodiment provides a spotlightable COB lamp strip 100, which includes a substrate 110, a plurality of LED chips 120, an encapsulant 130, and a reflective wall 140. In this embodiment, the light reflecting unit 121 is composed of two LED chips 120, the two LED chips 120 are located in the same row, the light reflecting wall 140 surrounds the light reflecting unit 121, and the light reflecting walls 140 are independently disposed. Please refer to fig. 7 for the structure diagram.

Example 4

The present embodiment provides a spotlightable COB lamp strip 100, which includes a substrate 110, a plurality of LED chips 120, an encapsulant 130, and a reflective wall 140. In this embodiment, the light reflecting unit 121 is composed of two LED chips 120 with different light emitting colors, the two LED chips 120 are located in the same row, the light reflecting walls 140 are disposed around the light reflecting unit 121, and the light reflecting walls 140 are independently disposed. Please refer to fig. 8 for the structure diagram.

Example 5

The present embodiment provides a spotlightable COB lamp strip 100, which includes a substrate 110, a plurality of LED chips 120, an encapsulant 130, and a reflective wall 140. In the present embodiment, the light reflecting unit 121 is composed of three LED chips 120 with different light emitting colors and conforming to RGB three primary colors, the light reflecting walls 140 are disposed around the light reflecting unit 121, and the light reflecting walls 140 are independently disposed. Please refer to fig. 9 for the structure diagram.

Example 6

Embodiment 6 is the same as embodiment 2 except that a plurality of light reflecting walls 140 are integrally provided in embodiment 6. Please refer to fig. 10 for the structure diagram.

Example 7

Embodiment 7 is the same as embodiment 3 except that a plurality of light reflecting walls 140 are integrally provided in embodiment 7. Please refer to fig. 11 for the structure diagram.

Example 8

Embodiment 8 is the same as embodiment 4 except that a plurality of light reflecting walls 140 are integrally provided in embodiment 8. Please refer to fig. 12 for the structure diagram.

Example 9

Embodiment 9 is the same as embodiment 5 except that a plurality of light reflecting walls 140 are integrally provided in embodiment 9. Please refer to fig. 13 for the structure diagram.

To sum up, this application is through setting up reflection wall 140 around LED wafer 120, and the light that LED wafer 120 sent can be reflected and refract by reflection wall 140 after arriving reflection wall 140, and the luminous angle and the luminous region that can control LED wafer 120 through the height and the width of control reflection wall 140 in this application to reach the spotlight effect, avoid the full angle scattering of the light that LED wafer 120 sent, promoted light utilization ratio. In addition, through constitute a reflection of light unit 121 with a plurality of LED wafers 120 of different colours in this application, the operation of spotlight not only can be realized to the setting of reflection of light wall 140 this moment, can also let the light that adjacent wafer sent mix light each other, makes light more continuous even to the light of different colours can more evenly mix becomes another target color, thereby satisfies more application scenes.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. The utility model provides a COB lamp area that can spotlight, its characterized in that, it includes base plate, LED wafer and reflective wall, and is a plurality of the LED wafer is fixed in on the base plate, reflective wall encloses to be located around the LED wafer and with the base plate is connected.

2. The spotlightable COB lamp strip of claim 1, wherein the height of the reflective wall extending vertically above the substrate is greater than the height of the LED chip extending vertically above the substrate, and the light emitted within the reflective wall has an emission angle of 90-120 °.

3. Light-concentrating COB lamp strip according to claim 1, characterized in that the light-reflecting wall has a connecting end face connected to the substrate and a free end face extending upwards perpendicular to the substrate, the inner side face of the light-reflecting wall is inclined to form an inclined face, and the opening enclosed by the connecting end face is smaller than the opening enclosed by the free end face.

4. The spotlightable COB lamp strip according to claim 1, wherein the number of the LED chips is multiple, at least two adjacent LED chips constitute a reflecting unit, and the number of the reflecting walls is less than or equal to that of the reflecting units.

5. Spotlightable COB light strip according to claim 4, wherein the LED chips in the reflector unit have different emission colors.

6. Spotlightable COB lamp strip according to claim 4, characterized in that, the reflection unit comprises 3 LED chips of different emission colors and corresponding to three primary colors.

7. The spotlightable COB light strip of claim 1, wherein the substrate is an FPC flex, a rigid substrate, or a metal substrate.

8. The spotlighted COB strip of claim 1, further comprising an encapsulant applied to the LED die surface.

9. Light-spoonable COB strip according to claim 8, wherein the encapsulant is semi-circular or flat.

10. Illuminated decoration, characterized in that it comprises a spotlightable COB strip according to any one of claims 1 to 9.

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