TW516247B - Light emitting diode with light conversion using scattering optical media - Google Patents

Light emitting diode with light conversion using scattering optical media Download PDF

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Publication number
TW516247B
TW516247B TW090126701A TW90126701A TW516247B TW 516247 B TW516247 B TW 516247B TW 090126701 A TW090126701 A TW 090126701A TW 90126701 A TW90126701 A TW 90126701A TW 516247 B TW516247 B TW 516247B
Authority
TW
Taiwan
Prior art keywords
optical media
dpp
light emitting
light
dielectric
Prior art date
Application number
TW090126701A
Inventor
Wang-Nang Wang
Wen-Chieh Huang
Original Assignee
Arima Optoelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US09/794,899 priority Critical patent/US6614170B2/en
Application filed by Arima Optoelectronics Corp filed Critical Arima Optoelectronics Corp
Application granted granted Critical
Publication of TW516247B publication Critical patent/TW516247B/en

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Abstract

The invention provides a light emitting diode (LED) or other light emitting means such as a laser diode (LD) comprising a light emitting component and scattering optical media such as dielectric phosphor powder (DPP) which absorbs a part of light emitted by the light emitting component and emits light of a wavelength that is different from that of the absorbed light. The scattering optical media such as dielectric phosphor powder (DPP) is made of a mixture of crystalline phosphor particles and microscopic, nearly spherical dielectric particles with a band gap larger than 3 eV (which do not absorb blue light in the spectrum). The scattering optical media such as DPP can also include phosphor particles, and bubbles (or voids) instead of the dielectric particles. An exemplary structure of an LED according to a preferred embodiment of the invention comprises a crystalline semiconductor chip encapsulated into epoxy, wires connected to the semiconductor chip, metallic leads connected to the wires, and an epoxy encapsulation covering the scattering optical media such as dielectric phosphor powder (DPP). The DPP is made of a mixture of nearly spherical dielectric particles with crystalline phosphor particles.
TW090126701A 2000-12-29 2001-10-29 Light emitting diode with light conversion using scattering optical media TW516247B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US09/794,899 US6614170B2 (en) 2000-12-29 2001-02-26 Light emitting diode with light conversion using scattering optical media

Publications (1)

Publication Number Publication Date
TW516247B true TW516247B (en) 2003-01-01

Family

ID=25164032

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090126701A TW516247B (en) 2000-12-29 2001-10-29 Light emitting diode with light conversion using scattering optical media

Country Status (3)

Country Link
JP (1) JP2002261328A (en)
CN (1) CN1215575C (en)
TW (1) TW516247B (en)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7224000B2 (en) 2002-08-30 2007-05-29 Lumination, Llc Light emitting diode component
CA2517009A1 (en) 2003-02-26 2004-09-10 Cree, Inc. White light source using emitting diode and phosphor and method of fabrication
US7915085B2 (en) 2003-09-18 2011-03-29 Cree, Inc. Molded chip fabrication method
US7061026B2 (en) 2004-04-16 2006-06-13 Arima Optoelectronics Corp. High brightness gallium nitride-based light emitting diode with transparent conducting oxide spreading layer
CN100485976C (en) 2004-07-14 2009-05-06 凯鼎科技股份有限公司 LED encapsulation body
US7217583B2 (en) * 2004-09-21 2007-05-15 Cree, Inc. Methods of coating semiconductor light emitting elements by evaporating solvent from a suspension
CN100405621C (en) 2005-09-29 2008-07-23 上海乐金广电电子有限公司 Manufacturing method of white light source
KR100693463B1 (en) * 2005-10-21 2007-03-05 한국광기술원 Light diffusion type light emitting diode
DE102006005042A1 (en) * 2006-02-03 2007-08-09 Tridonic Optoelectronics Gmbh A light emitting device with non-activated phosphor
US7842960B2 (en) 2006-09-06 2010-11-30 Lumination Llc Light emitting packages and methods of making same
US8143770B2 (en) * 2006-09-13 2012-03-27 Helio Optoelectronics Corporation LED bulb structure having insertion end, and/or heat dissipation element, and/or heat-and-electricity separated element
US9159888B2 (en) 2007-01-22 2015-10-13 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US9024349B2 (en) 2007-01-22 2015-05-05 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
TWI342628B (en) * 2007-08-02 2011-05-21 Lextar Electronics Corp Light emitting diode package, direct type back light module and side type backlight module
TW200921929A (en) * 2007-11-02 2009-05-16 Innolux Display Corp Light emitting diode
RU2481672C2 (en) 2007-12-11 2013-05-10 Конинклейке Филипс Электроникс Н.В. Side-emitting device with hybrid top reflector
US9041285B2 (en) 2007-12-14 2015-05-26 Cree, Inc. Phosphor distribution in LED lamps using centrifugal force
US8878219B2 (en) 2008-01-11 2014-11-04 Cree, Inc. Flip-chip phosphor coating method and devices fabricated utilizing method
CN101872819A (en) * 2009-04-21 2010-10-27 富士迈半导体精密工业(上海)有限公司;沛鑫能源科技股份有限公司 Yellow light emitting diode and light emitting device
US8593040B2 (en) 2009-10-02 2013-11-26 Ge Lighting Solutions Llc LED lamp with surface area enhancing fins
JP5795481B2 (en) 2010-03-05 2015-10-14 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC A method of forming a photolithographic pattern
CN101882615A (en) * 2010-07-12 2010-11-10 陕西科技大学 Nano particle light distribution LED
CN101924177A (en) * 2010-08-03 2010-12-22 陕西科技大学 Light-emitting diode with light distributing function and preparation method thereof
CN102468395A (en) * 2010-11-04 2012-05-23 浙江雄邦节能产品有限公司 Ceramic substrate LED apparatus
US9500355B2 (en) 2012-05-04 2016-11-22 GE Lighting Solutions, LLC Lamp with light emitting elements surrounding active cooling device
CN103622190A (en) * 2012-08-21 2014-03-12 李伟 High simulation flower with optical excitation chemistry color light emission and light-emitting method thereof

Also Published As

Publication number Publication date
JP2002261328A (en) 2002-09-13
CN1372330A (en) 2002-10-02
CN1215575C (en) 2005-08-17

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GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees