KR102789332B1 - 일렉트로닉스 테스터 내의 디바이스들의 열 제어를 위한 방법 및 시스템 - Google Patents

일렉트로닉스 테스터 내의 디바이스들의 열 제어를 위한 방법 및 시스템 Download PDF

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Publication number
KR102789332B1
KR102789332B1 KR1020187022771A KR20187022771A KR102789332B1 KR 102789332 B1 KR102789332 B1 KR 102789332B1 KR 1020187022771 A KR1020187022771 A KR 1020187022771A KR 20187022771 A KR20187022771 A KR 20187022771A KR 102789332 B1 KR102789332 B1 KR 102789332B1
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South Korea
Prior art keywords
wafer
slot assembly
temperature
slot
closed loop
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KR1020187022771A
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Korean (ko)
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KR20180101476A (ko
Inventor
조반 조바노비치
케네스 더블유 데보
스티븐 씨 스텝스
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에어 테스트 시스템즈
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Priority to KR1020257005434A priority Critical patent/KR102842851B1/ko
Priority to KR1020257005433A priority patent/KR102852850B1/ko
Publication of KR20180101476A publication Critical patent/KR20180101476A/ko
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Publication of KR102789332B1 publication Critical patent/KR102789332B1/ko
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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • H01L22/30—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/003—Environmental or reliability tests
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
    • H01L21/324—
    • H01L21/67103—
    • H01L21/67248—
    • H01L21/68785—
    • H01L22/26—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Manufacturing & Machinery (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
KR1020187022771A 2016-01-08 2017-01-06 일렉트로닉스 테스터 내의 디바이스들의 열 제어를 위한 방법 및 시스템 Active KR102789332B1 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020257005434A KR102842851B1 (ko) 2016-01-08 2017-01-06 일렉트로닉스 테스터 내의 디바이스들의 열 제어를 위한 방법 및 시스템
KR1020257005433A KR102852850B1 (ko) 2016-01-08 2017-01-06 일렉트로닉스 테스터 내의 디바이스들의 열 제어를 위한 방법 및 시스템

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662276746P 2016-01-08 2016-01-08
US62/276,746 2016-01-08
PCT/US2017/012597 WO2017120514A1 (en) 2016-01-08 2017-01-06 Method and system for thermal control of devices in an electronics tester

Related Child Applications (2)

Application Number Title Priority Date Filing Date
KR1020257005434A Division KR102842851B1 (ko) 2016-01-08 2017-01-06 일렉트로닉스 테스터 내의 디바이스들의 열 제어를 위한 방법 및 시스템
KR1020257005433A Division KR102852850B1 (ko) 2016-01-08 2017-01-06 일렉트로닉스 테스터 내의 디바이스들의 열 제어를 위한 방법 및 시스템

Publications (2)

Publication Number Publication Date
KR20180101476A KR20180101476A (ko) 2018-09-12
KR102789332B1 true KR102789332B1 (ko) 2025-03-31

Family

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Family Applications (4)

Application Number Title Priority Date Filing Date
KR1020187022771A Active KR102789332B1 (ko) 2016-01-08 2017-01-06 일렉트로닉스 테스터 내의 디바이스들의 열 제어를 위한 방법 및 시스템
KR1020257005433A Active KR102852850B1 (ko) 2016-01-08 2017-01-06 일렉트로닉스 테스터 내의 디바이스들의 열 제어를 위한 방법 및 시스템
KR1020257005434A Active KR102842851B1 (ko) 2016-01-08 2017-01-06 일렉트로닉스 테스터 내의 디바이스들의 열 제어를 위한 방법 및 시스템
KR1020257025667A Pending KR20250123227A (ko) 2016-01-08 2017-01-06 일렉트로닉스 테스터 내의 디바이스들의 열 제어를 위한 방법 및 시스템

Family Applications After (3)

Application Number Title Priority Date Filing Date
KR1020257005433A Active KR102852850B1 (ko) 2016-01-08 2017-01-06 일렉트로닉스 테스터 내의 디바이스들의 열 제어를 위한 방법 및 시스템
KR1020257005434A Active KR102842851B1 (ko) 2016-01-08 2017-01-06 일렉트로닉스 테스터 내의 디바이스들의 열 제어를 위한 방법 및 시스템
KR1020257025667A Pending KR20250123227A (ko) 2016-01-08 2017-01-06 일렉트로닉스 테스터 내의 디바이스들의 열 제어를 위한 방법 및 시스템

Country Status (6)

Country Link
US (6) US10466292B2 (https=)
JP (8) JP7045995B2 (https=)
KR (4) KR102789332B1 (https=)
CN (1) CN108780114B (https=)
TW (3) TWI729056B (https=)
WO (1) WO2017120514A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102461321B1 (ko) * 2017-08-18 2022-11-02 (주)테크윙 전자부품 테스트용 핸들러
CN120254561B (zh) * 2020-10-07 2026-03-03 雅赫测试系统公司 电子测试器
JP7548670B2 (ja) * 2021-01-19 2024-09-10 東京エレクトロン株式会社 検査装置、制御方法及び制御プログラム
CN117092557A (zh) * 2022-05-19 2023-11-21 群创光电股份有限公司 电子装置
JP2023177687A (ja) 2022-06-02 2023-12-14 株式会社アドバンテスト ヒータ駆動制御装置、電子部品ハンドリング装置、電子部品試験装置、及び、ヒータ駆動制御方法
US12499957B2 (en) * 2022-12-13 2025-12-16 Micron Technology, Inc. Thermal conduction based batch testing system
JP2026501645A (ja) * 2022-12-30 2026-01-16 エイアー テスト システムズ 電子試験器
TWI903543B (zh) * 2024-06-03 2025-11-01 台灣光罩股份有限公司 元件測試系統

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020048826A1 (en) * 1999-07-14 2002-04-25 Richmond Donald Paul Wafer level burn-in and electrical test system and method
US20050125712A1 (en) * 2003-05-12 2005-06-09 Kingston Technology Corp. Manifold-Distributed Air Flow Over Removable Test Boards in a Memory-Module Burn-In System With Heat Chamber Isolated by Backplane
JP2015103552A (ja) * 2013-11-21 2015-06-04 株式会社東京精密 プローバ

Family Cites Families (262)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3149897A (en) 1961-08-29 1964-09-22 Hans G Martineck Printed cable connector
US3413613A (en) 1966-06-17 1968-11-26 Gen Electric Reconfigurable data processing system
US3482201A (en) 1967-08-29 1969-12-02 Thomas & Betts Corp Controlled impedance connector
US3757219A (en) 1971-12-15 1973-09-04 A Aksu Circuit board testing equipment
US3970934A (en) 1974-08-12 1976-07-20 Akin Aksu Printed circuit board testing means
US4240021A (en) 1977-05-20 1980-12-16 Citizen Watch Co., Ltd. Solar cell battery charging control system
US4298237A (en) 1979-12-20 1981-11-03 Bell Telephone Laboratories, Incorporated Printed wiring board interconnection apparatus
US4400049A (en) 1981-08-12 1983-08-23 Ncr Corporation Connector for interconnecting circuit boards
US4419626A (en) 1981-08-25 1983-12-06 Daymarc Corporation Broad band contactor assembly for testing integrated circuit devices
JPS5863927A (ja) 1981-10-13 1983-04-16 Canon Inc 閃光撮影装置
US4517512A (en) 1982-05-24 1985-05-14 Micro Component Technology, Inc. Integrated circuit test apparatus test head
US4591217A (en) 1983-08-29 1986-05-27 Gte Communication Systems Corporation Low insertion force connection arrangement
US4608679A (en) 1984-07-11 1986-08-26 Filenet Corporation Optical storage and retrieval device
JPH06105417B2 (ja) 1984-09-06 1994-12-21 日本電気株式会社 多重化電源装置における障害検出方式
US4582386A (en) 1984-11-01 1986-04-15 Elfab Corp. Connector with enlarged power contact
SU1247600A1 (ru) 1985-01-14 1986-07-30 Всесоюзный научно-исследовательский и конструкторско-технологический институт компрессорного машиностроения Установка дл испытани уплотнений
US4719411A (en) 1985-05-13 1988-01-12 California Institute Of Technology Addressable test matrix for measuring analog transfer characteristics of test elements used for integrated process control and device evaluation
US4814573A (en) 1986-04-07 1989-03-21 Ex-Cell-O Corporation Electrical discharge machining apparatus with exchangeable electrode refeed cartridge
US5247521A (en) 1986-04-23 1993-09-21 Hitachi, Ltd. Data processor
US4816754A (en) 1986-04-29 1989-03-28 International Business Machines Corporation Contactor and probe assembly for electrical test apparatus
US4746861A (en) 1986-08-21 1988-05-24 Tti Testron, Inc. Test fixture for printed circuit board assembly
US4899208A (en) 1987-12-17 1990-02-06 International Business Machines Corporation Power distribution for full wafer package
FR2631165B1 (fr) 1988-05-05 1992-02-21 Moulene Daniel Support conditionneur de temperature pour petits objets tels que des composants semi-conducteurs et procede de regulation thermique utilisant ce support
JPH0238808A (ja) 1988-07-27 1990-02-08 Tokyo Seimitsu Co Ltd 光センサ
DE3914669C2 (de) 1989-05-03 1999-07-15 Max Liebich Vorrichtung und Verfahren zur Selbstverfertigung von Zigaretten durch den Verbraucher
US5008615A (en) 1989-11-03 1991-04-16 Motorola, Inc. Means and method for testing integrated circuits attached to a leadframe
US4968931A (en) 1989-11-03 1990-11-06 Motorola, Inc. Apparatus and method for burning in integrated circuit wafers
US4995814A (en) 1989-12-15 1991-02-26 Amp Incorporated Connector for mating blade-shaped members
US4981449A (en) 1990-04-27 1991-01-01 Amp Incorporated Connector for mating multi-layer blade-shaped members
US5086269A (en) 1991-03-08 1992-02-04 Hewlett-Packard Company Burn-in process and apparatus
US5108302A (en) 1991-06-17 1992-04-28 Pfaff Wayne Test socket
JP3203817B2 (ja) 1992-10-20 2001-08-27 富士通株式会社 キャリア及びこれを用いた半導体チップの試験方法
JPH06186283A (ja) 1992-11-30 1994-07-08 Ando Electric Co Ltd テストヘッドの冷却制御装置
US5461326A (en) 1993-02-25 1995-10-24 Hughes Aircraft Company Self leveling and self tensioning membrane test probe
JPH0792479B2 (ja) 1993-03-18 1995-10-09 東京エレクトロン株式会社 プローブ装置の平行度調整方法
JP3308346B2 (ja) 1993-06-08 2002-07-29 日置電機株式会社 基板検査装置用のエアプローブピンボード
US5517125A (en) 1993-07-09 1996-05-14 Aehr Test Systems, Inc. Reusable die carrier for burn-in and burn-in process
US5559446A (en) 1993-07-19 1996-09-24 Tokyo Electron Kabushiki Kaisha Probing method and device
JPH0763788A (ja) 1993-08-21 1995-03-10 Hewlett Packard Co <Hp> プローブおよび電気部品／回路検査装置ならびに電気部品／回路検査方法
US5467024A (en) 1993-11-01 1995-11-14 Motorola, Inc. Integrated circuit test with programmable source for both AC and DC modes of operation
JP3395304B2 (ja) * 1993-12-16 2003-04-14 松下電器産業株式会社 半導体集積回路の検査方法
KR0140034B1 (ko) 1993-12-16 1998-07-15 모리시다 요이치 반도체 웨이퍼 수납기, 반도체 웨이퍼의 검사용 집적회로 단자와 프로브 단자와의 접속방법 및 그 장치, 반도체 집적회로의 검사방법, 프로브카드 및 그 제조방법
JP2544084B2 (ja) 1993-12-28 1996-10-16 山一電機株式会社 電気部品の接続器
JP2925964B2 (ja) * 1994-04-21 1999-07-28 松下電器産業株式会社 半導体ウェハ収納器及び半導体集積回路の検査方法
US5515126A (en) 1994-09-28 1996-05-07 Eastman Kodak Company Convertible flash camera and method
US5550466A (en) 1994-09-30 1996-08-27 Hewlett-Packard Company Hinged conduit for routing cables in an electronic circuit tester
US6421754B1 (en) 1994-12-22 2002-07-16 Texas Instruments Incorporated System management mode circuits, systems and methods
US5773986A (en) 1995-04-03 1998-06-30 Motorola, Inc Semiconductor wafer contact system and method for contacting a semiconductor wafer
JPH08340030A (ja) 1995-04-13 1996-12-24 Tokyo Electron Ltd バーンイン装置およびバーンイン用ウエハトレイ
US5666288A (en) 1995-04-21 1997-09-09 Motorola, Inc. Method and apparatus for designing an integrated circuit
JP3106102B2 (ja) 1995-05-19 2000-11-06 松下電器産業株式会社 半導体装置の検査方法
US5600257A (en) 1995-08-09 1997-02-04 International Business Machines Corporation Semiconductor wafer test and burn-in
WO1997017619A1 (en) 1995-11-06 1997-05-15 Advantest Corporation Ic conveyor, ic posture changer and ic takeout apparatus
US5851143A (en) * 1996-05-10 1998-12-22 Thermal Industries Disk drive test chamber
US5808896A (en) 1996-06-10 1998-09-15 Micron Technology, Inc. Method and system for creating a netlist allowing current measurement through a sub-circuit
DE19781822B4 (de) 1996-07-08 2004-09-09 Speedfam-Ipec Corp.(N.D.Ges.D.Staates Delaware), Chandler Reinigungsstation zur Verwendung bei einem System zum Reinigen, Spülen und Trocknen von Halbleiterscheiben
US6203582B1 (en) 1996-07-15 2001-03-20 Semitool, Inc. Modular semiconductor workpiece processing tool
JPH10116867A (ja) 1996-10-11 1998-05-06 Orion Mach Co Ltd 半導体ウェーハの試験方法及び試験装置用温度調節器
US5894225A (en) 1996-10-31 1999-04-13 Coffin; Harry S. Test fixture
US5886535A (en) 1996-11-08 1999-03-23 W. L. Gore & Associates, Inc. Wafer level burn-in base unit substrate and assembly
US5966022A (en) 1996-11-08 1999-10-12 W. L. Gore & Associates, Inc. Wafer level burn-in system
US5949246A (en) 1997-01-28 1999-09-07 International Business Machines Test head for applying signals in a burn-in test of an integrated circuit
EP0860704A3 (en) 1997-02-24 2000-01-19 Tokyo Electron Limited Method and apparatus for inspecting semiconductor integrated circuits, and contactor incorporated in the apparatus
JPH10256325A (ja) 1997-03-07 1998-09-25 Orion Mach Co Ltd 半導体ウェーハの試験装置用温度調節プレート
US6023173A (en) 1997-04-30 2000-02-08 Credence Systems Corporation Manipulator with expanded range of motion
US5821440A (en) 1997-04-30 1998-10-13 Credence Systems Corporation Cable tray assembly for testing device
US6040700A (en) 1997-09-15 2000-03-21 Credence Systems Corporation Semiconductor tester system including test head supported by wafer prober frame
MY128129A (en) 1997-09-16 2007-01-31 Tan Yin Leong Electrical contactor for testing integrated circuit devices
GB2346703B (en) 1997-10-07 2002-06-19 Reliability Inc Burn-in board with adaptable heat sink device
JP3364134B2 (ja) 1997-10-20 2003-01-08 松下電器産業株式会社 ウェハカセット
JP3249078B2 (ja) 1997-10-20 2002-01-21 松下電器産業株式会社 半導体ウェハの取出し装置
JPH11121569A (ja) 1997-10-21 1999-04-30 Matsushita Electric Ind Co Ltd バーンイン装置
US5928036A (en) 1997-10-30 1999-07-27 The Whitaker Corporation Dual row memory card connector
JP3294174B2 (ja) 1997-11-05 2002-06-24 東京エレクトロン株式会社 ウエハ保持体の温度測定装置及びウエハ収納室
JP3400692B2 (ja) 1997-11-05 2003-04-28 東京エレクトロン株式会社 ウエハ温度制御装置及びウエハ収納室
DE69842191D1 (de) 1997-11-05 2011-05-05 Tokyo Electron Ltd Halbleiterscheibenhaltevorrichtung
JPH11145216A (ja) 1997-11-12 1999-05-28 Matsushita Electric Ind Co Ltd ウェハバーンイン装置、検査用基板及びポゴピン
US5973285A (en) 1997-11-26 1999-10-26 Computer Service Technology, Inc. Connector alignment assembly for an electronic memory module tester
JPH11163066A (ja) * 1997-11-29 1999-06-18 Tokyo Electron Ltd ウエハ試験装置
US6091060A (en) * 1997-12-31 2000-07-18 Temptronic Corporation Power and control system for a workpiece chuck
TW455978B (en) 1998-02-16 2001-09-21 Amic Technology Taiwan Inc Method for testing wafers
US6057696A (en) 1998-03-24 2000-05-02 Cypress Semiconductor Corp. Apparatus, method and kit for aligning an integrated circuit to a test socket
JP3611174B2 (ja) * 1998-03-30 2005-01-19 オリオン機械株式会社 半導体ウェーハの温度試験装置
JP3430015B2 (ja) 1998-05-20 2003-07-28 東京エレクトロン株式会社 信頼性試験システム
TW432221B (en) 1998-05-29 2001-05-01 Advantest Corp Tray for electronic device, the transporting apparatus of tray for electronic device and testing apparatus for electronic device
US6625557B1 (en) 1998-07-10 2003-09-23 Ltx Corporation Mixed signal device under test board interface
US6381283B1 (en) 1998-10-07 2002-04-30 Controlnet, Inc. Integrated socket with chip carrier
US6627483B2 (en) 1998-12-04 2003-09-30 Formfactor, Inc. Method for mounting an electronic component
JP2002532717A (ja) 1998-12-11 2002-10-02 サイミックス テクノロジーズ、インク 迅速な物質特性評価のためのセンサ配列に基づくシステム及びその方法
US6137303A (en) 1998-12-14 2000-10-24 Sony Corporation Integrated testing method and apparatus for semiconductor test operations processing
US6888343B1 (en) 1999-01-13 2005-05-03 Intest Ip Corporation Test head manipulator
US6329603B1 (en) 1999-04-07 2001-12-11 International Business Machines Corporation Low CTE power and ground planes
US7349223B2 (en) 2000-05-23 2008-03-25 Nanonexus, Inc. Enhanced compliant probe card systems having improved planarity
US7382142B2 (en) 2000-05-23 2008-06-03 Nanonexus, Inc. High density interconnect system having rapid fabrication cycle
US6799976B1 (en) 1999-07-28 2004-10-05 Nanonexus, Inc. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
US6917525B2 (en) 2001-11-27 2005-07-12 Nanonexus, Inc. Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs
AU7329200A (en) 1999-07-14 2001-01-30 Aehr Test Systems Inc. Wafer level burn-in and electrical test system and method
US6340895B1 (en) * 1999-07-14 2002-01-22 Aehr Test Systems, Inc. Wafer-level burn-in and test cartridge
US6318243B1 (en) 1999-08-31 2001-11-20 D. Kent Jones Two-piece piston assembly
US20010012726A1 (en) 1999-10-14 2001-08-09 O'neal Sean P. Stacked module connector
US6255834B1 (en) 1999-10-21 2001-07-03 Dell Usa, L.P. Test fixture having a floating self-centering connector
US6358061B1 (en) 1999-11-09 2002-03-19 Molex Incorporated High-speed connector with shorting capability
JP2001166006A (ja) 1999-12-09 2001-06-22 Nec Corp フィクスチャおよびその実装基板接続方法
US6657455B2 (en) 2000-01-18 2003-12-02 Formfactor, Inc. Predictive, adaptive power supply for an integrated circuit under test
JP2001203244A (ja) 2000-01-19 2001-07-27 Matsushita Electric Ind Co Ltd 半導体集積回路の検査方法、半導体集積回路の検査装置及びアライメント装置
WO2001063738A2 (en) 2000-02-23 2001-08-30 Sri International Electroactive polymer thermal electric generators
US6509751B1 (en) 2000-03-17 2003-01-21 Formfactor, Inc. Planarizer for a semiconductor contactor
US7262611B2 (en) 2000-03-17 2007-08-28 Formfactor, Inc. Apparatuses and methods for planarizing a semiconductor contactor
JP2001281293A (ja) * 2000-03-31 2001-10-10 Matsushita Electric Ind Co Ltd バーンイン装置
JP2004505443A (ja) 2000-07-10 2004-02-19 テンプトロニック　コーポレイション 交互配置された加熱および冷却要素と交換可能な上面アセンブリと硬膜層表面とをもつ熱プレートを有するウェーハチャック
JP2002043381A (ja) 2000-07-19 2002-02-08 Tokyo Electron Ltd ウエハ温度制御装置
US6822469B1 (en) 2000-07-31 2004-11-23 Eaglestone Partners I, Llc Method for testing multiple semiconductor wafers
JP4743944B2 (ja) 2000-08-25 2011-08-10 鎮男 角田 シミュレーションモデル作成方法及びそのシステムと記憶媒体
DE10042224C2 (de) 2000-08-28 2003-09-25 Infineon Technologies Ag Modultestsockel für Prüfadapter
JP2002151558A (ja) 2000-08-31 2002-05-24 Seiko Epson Corp 半導体検査装置の製造方法および半導体検査装置、ならびに半導体装置の検査方法
US20090143923A1 (en) 2000-09-08 2009-06-04 Breed David S Arrangement and Method for Monitoring Shipping Containers
JP3998169B2 (ja) 2000-09-14 2007-10-24 株式会社ルネサステクノロジ 回路の設計方法および回路の設計支援プログラム並びに回路設計装置
JP2002090426A (ja) 2000-09-14 2002-03-27 Advantest Corp 半導体試験装置
JP2002111267A (ja) 2000-09-26 2002-04-12 Ando Electric Co Ltd 基板冷却装置
US6828810B2 (en) 2000-10-03 2004-12-07 Renesas Technology Corp. Semiconductor device testing apparatus and method for manufacturing the same
US6551122B2 (en) 2000-10-04 2003-04-22 Teradyne, Inc. Low profile pneumatically actuated docking module with power fault release
US6472895B2 (en) 2000-12-06 2002-10-29 Advanced Micro Devices, Inc. Method and system for adapting burn-in boards to multiple burn-in systems
US6885205B2 (en) 2000-12-13 2005-04-26 Seagate Technology Llc Test fixture assembly for printed circuit boards
US6553542B2 (en) 2000-12-29 2003-04-22 Texas Instruments Incorporated Semiconductor device extractor for electrostatic discharge and latch-up applications
US6552560B2 (en) 2001-03-20 2003-04-22 Despatch Industries, L.L.P. Wafer-level burn-in oven
US6640610B2 (en) 2001-03-30 2003-11-04 Analog Devices, Inc. Automatic integrated mechanical and electrical angular motion detector test system
US6617844B2 (en) 2001-06-01 2003-09-09 Texas Instruments Incorporated Compare path bandwith control for high performance automatic test systems
CN100492037C (zh) 2001-07-12 2009-05-27 株式会社爱德万测试 电子部件处理设备以及电子部件温度控制方法
JP4119104B2 (ja) 2001-07-12 2008-07-16 株式会社アドバンテスト ヒータ付プッシャ、電子部品ハンドリング装置および電子部品の温度制御方法
US6512387B1 (en) 2001-07-31 2003-01-28 Agilent Technologies, Inc. Pressure-sensitive system and method of testing electronic device interconnections
US6817823B2 (en) 2001-09-11 2004-11-16 Marian Corporation Method, device and system for semiconductor wafer transfer
US20030077932A1 (en) 2001-10-22 2003-04-24 Lewinnek David W. Floating blind mate interface for automatic test system
US6861859B1 (en) 2001-10-22 2005-03-01 Electroglas, Inc. Testing circuits on substrates
JP3543089B2 (ja) 2001-10-31 2004-07-14 株式会社コガネイ コンタクトユニット
JP4173306B2 (ja) 2001-11-30 2008-10-29 東京エレクトロン株式会社 信頼性評価試験装置、信頼性評価試験システム及び信頼性評価試験方法
KR100448913B1 (ko) 2002-01-07 2004-09-16 삼성전자주식회사 반도체 디바이스 테스트 시스템
US6628520B2 (en) 2002-02-06 2003-09-30 Hewlett-Packard Development Company, L.P. Method, apparatus, and system for cooling electronic components
JP2003243490A (ja) * 2002-02-18 2003-08-29 Hitachi High-Technologies Corp ウエハ処理装置とウエハステージ及びウエハ処理方法
US7694246B2 (en) 2002-06-19 2010-04-06 Formfactor, Inc. Test method for yielding a known good die
US6815966B1 (en) 2002-06-27 2004-11-09 Aehr Test Systems System for burn-in testing of electronic devices
KR20050024395A (ko) 2002-06-27 2005-03-10 에어 테스트 시스템즈 전자 장치의 번인 검사를 위한 시스템
US6867608B2 (en) 2002-07-16 2005-03-15 Aehr Test Systems Assembly for electrically connecting a test component to a testing machine for testing electrical circuits on the test component
JP2005533254A (ja) 2002-07-16 2005-11-04 エイアー テスト システムズ 被試験部品上の電気回路を試験するために被試験部品を試験機械に電気的に接続するための組立体
US6853209B1 (en) 2002-07-16 2005-02-08 Aehr Test Systems Contactor assembly for testing electrical circuits
JP3657250B2 (ja) 2002-09-03 2005-06-08 ホシデン株式会社 コネクタ
CN1224090C (zh) 2002-09-09 2005-10-19 中芯国际集成电路制造(上海)有限公司 测试加烧机系统
TWI236723B (en) 2002-10-02 2005-07-21 Renesas Tech Corp Probe sheet, probe card, semiconductor inspection device, and manufacturing method for semiconductor device
JP4659328B2 (ja) 2002-10-21 2011-03-30 東京エレクトロン株式会社 被検査体を温度制御するプローブ装置
US7084650B2 (en) 2002-12-16 2006-08-01 Formfactor, Inc. Apparatus and method for limiting over travel in a probe card assembly
US6897666B2 (en) 2002-12-31 2005-05-24 Intel Corporation Embedded voltage regulator and active transient control device in probe head for improved power delivery and method
JP3820226B2 (ja) 2003-01-22 2006-09-13 オリオン機械株式会社 半導体ウェーハ用検査装置
DE04705321T1 (de) 2003-01-28 2006-08-31 Intest Ip Corp. Handgelenk zum Positionieren eines Testkopfes
US7235964B2 (en) 2003-03-31 2007-06-26 Intest Corporation Test head positioning system and method
JP2004327561A (ja) 2003-04-22 2004-11-18 Ebara Corp 基板処理方法及び基板処理装置
US6998862B2 (en) 2003-04-28 2006-02-14 Micron Technology, Inc. Test socket for semiconductor components having serviceable nest
US6891132B2 (en) * 2003-10-09 2005-05-10 Micro Control Company Shutters for burn-in-board connector openings
US7317324B2 (en) 2003-11-04 2008-01-08 Canon Kabushiki Kaisha Semiconductor integrated circuit testing device and method
US7296430B2 (en) * 2003-11-14 2007-11-20 Micro Control Company Cooling air flow control valve for burn-in system
US20050111944A1 (en) 2003-11-25 2005-05-26 Marc Aho Compact wafer handling system with single axis robotic arm and prealigner-cassette elevator
US6994563B2 (en) 2003-12-19 2006-02-07 Lenovo (Singapore) Pte. Ltd. Signal channel configuration providing increased capacitance at a card edge connection
US7260303B2 (en) 2004-01-02 2007-08-21 Finisar Corporation Systems, devices and methods for thermal testing of an optoelectronic module
US7071715B2 (en) 2004-01-16 2006-07-04 Formfactor, Inc. Probe card configuration for low mechanical flexural strength electrical routing substrates
US6876321B1 (en) 2004-02-06 2005-04-05 The United States Of America As Represented By The Secretary Of The Navy Pulse descriptor word collector
JP2005265786A (ja) 2004-03-22 2005-09-29 Seiko Epson Corp 押圧方法、押圧装置、ｉｃハンドラ及びｉｃ検査装置
US7697260B2 (en) 2004-03-31 2010-04-13 Applied Materials, Inc. Detachable electrostatic chuck
US7230437B2 (en) 2004-06-15 2007-06-12 Formfactor, Inc. Mechanically reconfigurable vertical tester interface for IC probing
JP2006032593A (ja) 2004-07-15 2006-02-02 Renesas Technology Corp プローブカセット、半導体検査装置および半導体装置の製造方法
US7108517B2 (en) 2004-09-27 2006-09-19 Wells-Cti, Llc Multi-site chip carrier and method
JP2006098064A (ja) 2004-09-28 2006-04-13 Elpida Memory Inc プローブカード
WO2006038257A1 (ja) 2004-09-30 2006-04-13 Renesas Technology Corp. 半導体装置の製造方法
US20060091212A1 (en) 2004-10-28 2006-05-04 International Currency Technologies Corporation Chip card acceptor
JP2006145396A (ja) 2004-11-19 2006-06-08 Sharp Corp バーンイン装置
JP3945527B2 (ja) 2004-11-30 2007-07-18 住友電気工業株式会社 ウェハプローバ用ウェハ保持体およびそれを搭載したウェハプローバ
US7053644B1 (en) 2004-12-15 2006-05-30 Aehr Test Systems System for testing and burning in of integrated circuits
JP4719460B2 (ja) 2004-12-27 2011-07-06 株式会社シキノハイテック バーンイン装置
JP4145293B2 (ja) 2004-12-28 2008-09-03 株式会社ルネサステクノロジ 半導体検査装置および半導体装置の製造方法
US7245134B2 (en) 2005-01-31 2007-07-17 Formfactor, Inc. Probe card assembly including a programmable device to selectively route signals from channels of a test system controller to probes
DE102005005101A1 (de) 2005-02-04 2006-08-17 Infineon Technologies Ag Testsystem zum Testen von integrierten Schaltungen sowie ein Verfahren zum Konfigurieren eines Testsystems
EP1861759B1 (en) 2005-03-04 2008-12-03 Temptronic Corporation Apparatus and method for controlling temperature in a chuck system
CN101137947A (zh) * 2005-03-04 2008-03-05 天普桑尼克公司 卡盘系统中用于控制温度的装置和方法
JP2006250579A (ja) * 2005-03-08 2006-09-21 Denso Corp 湿度センサの検査装置及び特性調整方法
US7285968B2 (en) * 2005-04-19 2007-10-23 Formfactor, Inc. Apparatus and method for managing thermally induced motion of a probe card assembly
KR100956472B1 (ko) 2005-04-27 2010-05-07 에어 테스트 시스템즈 전자 장치들을 테스트하기 위한 장치
US7279911B2 (en) 2005-05-03 2007-10-09 Sv Probe Pte Ltd. Probe card assembly with dielectric structure
US20060263925A1 (en) 2005-05-10 2006-11-23 Chandler David L Ethernet-powered particle counting system
US7498825B2 (en) 2005-07-08 2009-03-03 Formfactor, Inc. Probe card assembly with an interchangeable probe insert
US7323898B2 (en) 2005-07-18 2008-01-29 Teradyne, Inc. Pin electronics driver
JP4602181B2 (ja) 2005-07-19 2010-12-22 株式会社シスウェーブ 半導体検査用ソケット
JPWO2007010610A1 (ja) 2005-07-21 2009-01-29 株式会社アドバンテスト プッシャ、プッシャユニットおよび半導体試験装置
JP2007042911A (ja) * 2005-08-04 2007-02-15 Sumitomo Electric Ind Ltd ウェハ保持体およびそれを搭載したウェハプローバ
US7851945B2 (en) 2005-08-08 2010-12-14 Hewlett-Packard Development Company, L.P. System and method of providing power
TW200721244A (en) 2005-11-17 2007-06-01 Beam Corp E Substrate treatment apparatus and substrate treatment method
US7821283B2 (en) 2005-12-22 2010-10-26 Jsr Corporation Circuit board apparatus for wafer inspection, probe card, and wafer inspection apparatus
US20070273216A1 (en) 2006-05-24 2007-11-29 Farbarik John M Systems and Methods for Reducing Power Losses in a Medical Device
US7557592B2 (en) 2006-06-06 2009-07-07 Formfactor, Inc. Method of expanding tester drive and measurement capability
US20080022695A1 (en) 2006-07-26 2008-01-31 Welle Richard P Input Power Control for Thermoelectric-Based Refrigerator Apparatuses
US7611358B2 (en) 2006-09-08 2009-11-03 Siemens Energy & Automation, Inc. Method of coupling circuit board connectors
US7826995B2 (en) 2006-09-14 2010-11-02 Aehr Test Systems Apparatus for testing electronic devices
US7646093B2 (en) 2006-12-20 2010-01-12 Intel Corporation Thermal management of dies on a secondary side of a package
JP2008166306A (ja) * 2006-12-26 2008-07-17 Stk Technology Co Ltd 半導体デバイスの検査装置
TWI439709B (zh) 2006-12-29 2014-06-01 Intest Corp 用於使負載沿平移軸線平移之操縱器與負載定位系統
JP2008185403A (ja) 2007-01-29 2008-08-14 Advantest Corp 試験装置
KR100843273B1 (ko) 2007-02-05 2008-07-03 삼성전자주식회사 반도체 패키지를 테스트하기 위한 테스트 소켓 및 이를구비하는 테스트 장치, 반도체 패키지를 테스트하는 방법
MY152599A (en) 2007-02-14 2014-10-31 Eles Semiconductor Equipment S P A Test of electronic devices at package level using test boards without sockets
EP1959265A1 (en) 2007-02-16 2008-08-20 Eles Semiconductor Equipment S.P.A. Testing integrated circuits on a wafer with a cartridge leaving exposed a surface thereof
JP2008227148A (ja) * 2007-03-13 2008-09-25 Micronics Japan Co Ltd 半導体ウエハの試験方法およびその装置
JP2008232667A (ja) 2007-03-16 2008-10-02 Nec Electronics Corp 半導体試験装置および試験方法
EP2132580B1 (en) 2007-04-05 2014-05-21 AEHR Test Systems Method of testing a microelectronic circuit
US8367471B2 (en) * 2007-06-15 2013-02-05 Micron Technology, Inc. Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices
US8462471B2 (en) 2007-09-30 2013-06-11 Huadao Huang Circuit interrupting device with high voltage surge protection
WO2009048618A1 (en) 2007-10-11 2009-04-16 Veraconnex, Llc Probe card test apparatus and method
JP5417338B2 (ja) * 2007-10-31 2014-02-12 ラム リサーチ コーポレーション 冷却液と構成部品本体との間の熱伝導性を制御するためにガス圧を使用する温度制御モジュール及び温度制御方法
JP2009115971A (ja) 2007-11-05 2009-05-28 Bridgestone Corp 表示媒体用粒子およびそれを用いた情報表示用パネル
US7800382B2 (en) 2007-12-19 2010-09-21 AEHR Test Ststems System for testing an integrated circuit of a device and its method of use
JP5088167B2 (ja) 2008-02-22 2012-12-05 東京エレクトロン株式会社 プローブ装置、プロービング方法及び記憶媒体
US7675307B2 (en) 2008-03-18 2010-03-09 Star Technologies Inc. Heating apparatus for semiconductor devices
WO2009124223A1 (en) 2008-04-02 2009-10-08 Twilio Inc. System and method for processing telephony sessions
JP5538697B2 (ja) 2008-09-10 2014-07-02 ルネサスエレクトロニクス株式会社 半導体装置のテスト方法
DE112008003714T5 (de) 2008-10-29 2010-11-25 Advantest Corp. Temperatursteuerung für elektronische Bauelemente
JP2010151794A (ja) 2008-11-27 2010-07-08 Panasonic Corp 電子部品試験装置
US8030957B2 (en) 2009-03-25 2011-10-04 Aehr Test Systems System for testing an integrated circuit of a device and its method of use
JP5391776B2 (ja) 2009-03-27 2014-01-15 富士通株式会社 ヒートシンク
US7969175B2 (en) * 2009-05-07 2011-06-28 Aehr Test Systems Separate test electronics and blower modules in an apparatus for testing an integrated circuit
JP4482616B1 (ja) * 2009-08-07 2010-06-16 株式会社アドバンテスト 試験装置および試験方法
US8465327B2 (en) 2009-11-02 2013-06-18 Apple Inc. High-speed memory connector
US9804223B2 (en) 2009-11-30 2017-10-31 Essai, Inc. Systems and methods for conforming test tooling to integrated circuit device with heater socket
US8872532B2 (en) 2009-12-31 2014-10-28 Formfactor, Inc. Wafer test cassette system
JP2011220924A (ja) 2010-04-13 2011-11-04 Advantest Corp 試験装置および接続装置
KR101641108B1 (ko) 2010-04-30 2016-07-20 삼성전자주식회사 디버깅 기능을 지원하는 타겟 장치 및 그것을 포함하는 테스트 시스템
US8279606B2 (en) 2010-05-07 2012-10-02 Dell Products L.P. Processor loading system including a heat dissipater
US8057263B1 (en) 2010-07-12 2011-11-15 Tyco Electronics Corporation Edge connectors having stamped signal contacts
US8456185B2 (en) 2010-08-17 2013-06-04 Avago Technologies General Ip (Singapore) Pte. Ltd. Test adapter and method for achieving optical alignment and thermal coupling thereof with a device under test
US8472190B2 (en) 2010-09-24 2013-06-25 Ati Technologies Ulc Stacked semiconductor chip device with thermal management
TWI440114B (zh) 2010-11-30 2014-06-01 King Yuan Electronics Co Ltd 晶圓檢測系統
US8465312B2 (en) 2010-12-07 2013-06-18 Centipede Systems, Inc. Socket cartridge and socket cartridge assembly
KR101228207B1 (ko) 2010-12-08 2013-01-30 세크론 주식회사 반도체 소자 테스트용 푸싱 기구 및 이를 포함하는 테스트 핸들러
KR20120102451A (ko) 2011-03-08 2012-09-18 삼성전자주식회사 테스트 인터페이스 보드 및 이를 포함하는 테스트 시스템
US8713498B2 (en) 2011-08-24 2014-04-29 Freescale Semiconductor, Inc. Method and system for physical verification using network segment current
KR101283387B1 (ko) * 2011-10-05 2013-07-08 파워테크 테크놀로지 인코포레이티드 멀티칩 적층 패키지들의 테스트 방법
JP5615852B2 (ja) * 2012-01-27 2014-10-29 東京エレクトロン株式会社 電子デバイス試験システム
JP5851878B2 (ja) 2012-02-21 2016-02-03 ルネサスエレクトロニクス株式会社 半導体モジュールの製造方法
KR20140000855A (ko) 2012-06-26 2014-01-06 삼성전자주식회사 테스트 인터페이스 보드 및 테스트 시스템
US9766285B2 (en) 2012-06-29 2017-09-19 Eles Semiconductor Equipment S.P.A. Test board with local thermal conditioning elements
ITMI20121157A1 (it) 2012-06-29 2013-12-30 Eles Semiconductor Equipment S P A Test di dispositivi elettronici con riscaldatori disposti tra scheda di test e dispositivi elettronici da testare
US20140125371A1 (en) 2012-11-05 2014-05-08 Hermes Testing Solutions Inc. Stand alone multi-cell probe card for at-speed functional testing
US10566080B2 (en) 2013-03-14 2020-02-18 Cerner Innovation, Inc. Expression of clinical logic with positive and negative explainability
JP5528617B1 (ja) 2013-11-29 2014-06-25 株式会社ウイング プロービングユニット、及びプロービングユニットを用いたバーンインスクリーニングシステム及びバーンインスクリーニング方法
US10297339B2 (en) 2014-02-19 2019-05-21 Advantest Corporation Integrated cooling system for electronics testing apparatus
US9594113B2 (en) 2014-02-21 2017-03-14 Sensata Technologies, Inc. Package on package thermal forcing device
TWM480762U (zh) 2014-03-12 2014-06-21 Chroma Ate Inc 具散熱模組之堆疊封裝構造測試裝置
JP6392010B2 (ja) 2014-07-03 2018-09-19 株式会社アドバンテスト 試験用キャリア
US9905400B2 (en) 2014-10-17 2018-02-27 Applied Materials, Inc. Plasma reactor with non-power-absorbing dielectric gas shower plate assembly
KR102433967B1 (ko) 2014-11-28 2022-08-22 (주)테크윙 전자부품 테스트용 핸들러
JP6447553B2 (ja) 2016-03-18 2019-01-09 株式会社東京精密 プローバ
EP3465238A4 (en) 2016-06-02 2020-01-22 KES Systems, Inc. SEMICONDUCTOR AGING TEST SYSTEM AND METHODS
US9911678B2 (en) 2016-06-13 2018-03-06 Qorvo Us, Inc. Substrate with integrated heat spreader
EP4632390A3 (en) 2017-03-03 2026-01-14 AEHR Test Systems Electronics tester
JP6895772B2 (ja) 2017-03-07 2021-06-30 東京エレクトロン株式会社 検査装置およびコンタクト方法
US10269678B1 (en) 2017-12-05 2019-04-23 Nxp Usa, Inc. Microelectronic components having integrated heat dissipation posts, systems including the same, and methods for the fabrication thereof
JP6740301B2 (ja) 2018-08-31 2020-08-12 シスメックス株式会社 搬送システム、検体分析装置、検体ラック、および搬送規制方法
US11646244B2 (en) 2019-06-27 2023-05-09 Intel Corporation Socket loading mechanism for passive or active socket and package cooling
CN120254561B (zh) * 2020-10-07 2026-03-03 雅赫测试系统公司 电子测试器

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020048826A1 (en) * 1999-07-14 2002-04-25 Richmond Donald Paul Wafer level burn-in and electrical test system and method
US20050125712A1 (en) * 2003-05-12 2005-06-09 Kingston Technology Corp. Manifold-Distributed Air Flow Over Removable Test Boards in a Memory-Module Burn-In System With Heat Chamber Isolated by Backplane
JP2015103552A (ja) * 2013-11-21 2015-06-04 株式会社東京精密 プローバ

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