KR102487816B1 - 실리콘-무함유 열 겔 - Google Patents
실리콘-무함유 열 겔 Download PDFInfo
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- KR102487816B1 KR102487816B1 KR1020227012192A KR20227012192A KR102487816B1 KR 102487816 B1 KR102487816 B1 KR 102487816B1 KR 1020227012192 A KR1020227012192 A KR 1020227012192A KR 20227012192 A KR20227012192 A KR 20227012192A KR 102487816 B1 KR102487816 B1 KR 102487816B1
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- South Korea
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- thermal gel
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- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
- C08L61/26—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds
- C08L61/28—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds with melamine
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- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2312/00—Crosslinking
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Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
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| US201762555954P | 2017-09-08 | 2017-09-08 | |
| US62/555,954 | 2017-09-08 | ||
| US16/105,456 | 2018-08-20 | ||
| US16/105,456 US11041103B2 (en) | 2017-09-08 | 2018-08-20 | Silicone-free thermal gel |
| KR1020207006299A KR102388580B1 (ko) | 2017-09-08 | 2018-08-31 | 실리콘-무함유 열 겔 |
| PCT/US2018/049218 WO2019050806A1 (en) | 2017-09-08 | 2018-08-31 | THERMAL GEL WITHOUT SILICONE |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| KR1020207006299A Division KR102388580B1 (ko) | 2017-09-08 | 2018-08-31 | 실리콘-무함유 열 겔 |
Publications (2)
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| KR20220050241A KR20220050241A (ko) | 2022-04-22 |
| KR102487816B1 true KR102487816B1 (ko) | 2023-01-12 |
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| KR1020227012192A Active KR102487816B1 (ko) | 2017-09-08 | 2018-08-31 | 실리콘-무함유 열 겔 |
| KR1020207006299A Active KR102388580B1 (ko) | 2017-09-08 | 2018-08-31 | 실리콘-무함유 열 겔 |
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| KR1020207006299A Active KR102388580B1 (ko) | 2017-09-08 | 2018-08-31 | 실리콘-무함유 열 겔 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US11041103B2 (enExample) |
| EP (1) | EP3679087B1 (enExample) |
| JP (1) | JP6902163B2 (enExample) |
| KR (2) | KR102487816B1 (enExample) |
| CN (1) | CN111051392B (enExample) |
| TW (1) | TWI780220B (enExample) |
| WO (1) | WO2019050806A1 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017152353A1 (en) | 2016-03-08 | 2017-09-14 | Honeywell International Inc. | Phase change material |
| US10501671B2 (en) | 2016-07-26 | 2019-12-10 | Honeywell International Inc. | Gel-type thermal interface material |
| JP6973875B2 (ja) * | 2017-08-22 | 2021-12-01 | エルジー・ケム・リミテッド | 放熱素材の混合方法 |
| US10428256B2 (en) | 2017-10-23 | 2019-10-01 | Honeywell International Inc. | Releasable thermal gel |
| US11072706B2 (en) | 2018-02-15 | 2021-07-27 | Honeywell International Inc. | Gel-type thermal interface material |
| US11373921B2 (en) | 2019-04-23 | 2022-06-28 | Honeywell International Inc. | Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing |
| EP4077516A4 (en) * | 2019-12-19 | 2024-01-24 | Henkel AG & Co. KGaA | SILICONE-FREE THERMAL INTERFACE MATERIAL WITH REACTIVE THINNER |
| CN111777993B (zh) * | 2020-07-14 | 2022-03-25 | 深圳陆祥科技股份有限公司 | 一种无硅导热膏及其制备方法 |
| US20230051813A1 (en) * | 2021-08-11 | 2023-02-16 | Ford Global Technologies, Llc | Graphene/carbon nanostructure heating element |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040097635A1 (en) * | 2002-11-14 | 2004-05-20 | Shoushan Fan | Thermal interface material and method for making same |
| JP2005508767A (ja) | 2001-05-30 | 2005-04-07 | ハネウエル・インターナシヨナル・インコーポレーテツド | インターフェース材料、ならびにその製造方法および使用方法 |
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| US11072706B2 (en) | 2018-02-15 | 2021-07-27 | Honeywell International Inc. | Gel-type thermal interface material |
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2018
- 2018-08-20 US US16/105,456 patent/US11041103B2/en active Active
- 2018-08-31 KR KR1020227012192A patent/KR102487816B1/ko active Active
- 2018-08-31 CN CN201880057543.3A patent/CN111051392B/zh active Active
- 2018-08-31 EP EP18853151.1A patent/EP3679087B1/en active Active
- 2018-08-31 WO PCT/US2018/049218 patent/WO2019050806A1/en not_active Ceased
- 2018-08-31 KR KR1020207006299A patent/KR102388580B1/ko active Active
- 2018-08-31 JP JP2020513513A patent/JP6902163B2/ja active Active
- 2018-09-07 TW TW107131409A patent/TWI780220B/zh active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005508767A (ja) | 2001-05-30 | 2005-04-07 | ハネウエル・インターナシヨナル・インコーポレーテツド | インターフェース材料、ならびにその製造方法および使用方法 |
| US20040097635A1 (en) * | 2002-11-14 | 2004-05-20 | Shoushan Fan | Thermal interface material and method for making same |
| JP2004161996A (ja) | 2002-11-14 | 2004-06-10 | Kofukin Seimitsu Kogyo (Shenzhen) Yugenkoshi | 熱伝導性界面材料及びその製造方法 |
Also Published As
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|---|---|
| KR20200028488A (ko) | 2020-03-16 |
| TWI780220B (zh) | 2022-10-11 |
| WO2019050806A1 (en) | 2019-03-14 |
| TW201920447A (zh) | 2019-06-01 |
| US20190078007A1 (en) | 2019-03-14 |
| KR20220050241A (ko) | 2022-04-22 |
| EP3679087B1 (en) | 2024-02-14 |
| JP2020532632A (ja) | 2020-11-12 |
| KR102388580B1 (ko) | 2022-04-20 |
| EP3679087A1 (en) | 2020-07-15 |
| JP6902163B2 (ja) | 2021-07-14 |
| US11041103B2 (en) | 2021-06-22 |
| EP3679087A4 (en) | 2021-05-26 |
| CN111051392A (zh) | 2020-04-21 |
| CN111051392B (zh) | 2022-08-30 |
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