DE10196259T1 - Füllverfahren - Google Patents
FüllverfahrenInfo
- Publication number
- DE10196259T1 DE10196259T1 DE10196259T DE10196259T DE10196259T1 DE 10196259 T1 DE10196259 T1 DE 10196259T1 DE 10196259 T DE10196259 T DE 10196259T DE 10196259 T DE10196259 T DE 10196259T DE 10196259 T1 DE10196259 T1 DE 10196259T1
- Authority
- DE
- Germany
- Prior art keywords
- filling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10204—Dummy component, dummy PCB or template, e.g. for monitoring, controlling of processes, comparing, scanning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0182—Using a temporary spacer element or stand-off during processing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Coating Apparatus (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US20845400P | 2000-05-31 | 2000-05-31 | |
US09/752,629 US6454154B1 (en) | 2000-05-31 | 2000-12-28 | Filling device |
PCT/US2001/016986 WO2001093648A2 (en) | 2000-05-31 | 2001-05-24 | Filling device |
Publications (1)
Publication Number | Publication Date |
---|---|
DE10196259T1 true DE10196259T1 (de) | 2003-05-15 |
Family
ID=26903209
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE10196259T Withdrawn DE10196259T1 (de) | 2000-05-31 | 2001-05-24 | Füllverfahren |
Country Status (8)
Country | Link |
---|---|
US (3) | US6832714B2 (de) |
JP (1) | JP2003535465A (de) |
KR (1) | KR20030007755A (de) |
CN (1) | CN1444840A (de) |
AU (1) | AU2001264968A1 (de) |
DE (1) | DE10196259T1 (de) |
TW (1) | TW486782B (de) |
WO (1) | WO2001093648A2 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102012216101A1 (de) * | 2012-09-12 | 2014-04-03 | Festo Ag & Co. Kg | Verfahren zum Herstellen einer in einem Substrat integrierten oder auf einem Substrat aufgebrachten Spule und elektronisches Gerät |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20030007755A (ko) * | 2000-05-31 | 2003-01-23 | 허니웰 인터내셔날 인코포레이티드 | 채움 장치 |
WO2009147936A1 (ja) * | 2008-06-02 | 2009-12-10 | イビデン株式会社 | 多層プリント配線板の製造方法 |
TWI419282B (zh) * | 2009-10-05 | 2013-12-11 | Advance Materials Corp | 形成窗式球柵陣列封裝預基板的方法 |
WO2012074563A2 (en) * | 2010-01-21 | 2012-06-07 | Henkel Corporation | Ultrasonic assisted filling of cavities |
JP2013171862A (ja) * | 2012-02-17 | 2013-09-02 | Tokyo Electron Ltd | 金属ペースト充填方法及び金属ペースト充填装置及びビアプラグ作製方法 |
WO2015083271A1 (ja) * | 2013-12-05 | 2015-06-11 | 富士機械製造株式会社 | はんだ供給装置 |
US9878390B2 (en) * | 2013-12-05 | 2018-01-30 | Fuji Machine Mfg. Co. Ltd. | Solder supply device including a solder cup and a nozzle section with a flange section that is elastically deformable |
WO2015092877A1 (ja) * | 2013-12-18 | 2015-06-25 | 富士機械製造株式会社 | はんだ供給装置 |
US10068830B2 (en) | 2014-02-13 | 2018-09-04 | Honeywell International Inc. | Compressible thermal interface materials |
US9878391B2 (en) | 2014-03-07 | 2018-01-30 | Fuji Machine Mfg. Co., Ltd. | Solder supply device |
US9974170B1 (en) * | 2015-05-19 | 2018-05-15 | Apple Inc. | Conductive strands for fabric-based items |
CN105499710B (zh) * | 2016-01-13 | 2017-11-14 | 浙江大学台州研究院 | 具有复合轨迹的刮削工具 |
EP3426746B1 (de) | 2016-03-08 | 2021-07-14 | Honeywell International Inc. | Phasenwechselmaterial |
US20170266948A1 (en) * | 2016-03-16 | 2017-09-21 | Intel Corporation | Modular squeegee head apparatus for printing materials |
CN108883430B (zh) * | 2016-03-18 | 2020-12-25 | 株式会社富士 | 粘性流体供给装置 |
US11041103B2 (en) | 2017-09-08 | 2021-06-22 | Honeywell International Inc. | Silicone-free thermal gel |
US11072706B2 (en) | 2018-02-15 | 2021-07-27 | Honeywell International Inc. | Gel-type thermal interface material |
US11373921B2 (en) | 2019-04-23 | 2022-06-28 | Honeywell International Inc. | Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing |
CN116217258B (zh) * | 2023-01-03 | 2024-01-16 | 东阳东磁自动化科技有限公司 | 一种陶瓷基片全自动填孔设备及其填孔方法 |
Family Cites Families (110)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3601523A (en) | 1970-06-19 | 1971-08-24 | Buckbee Mears Co | Through hole connectors |
GB1475031A (en) | 1975-01-18 | 1977-06-01 | Marconi Co Ltd | Curved rigid printed circuit boards |
JPS5210487A (en) | 1975-07-09 | 1977-01-26 | Nippon Soda Co Ltd | Production of gluconic acid or salts thereof by fermentation |
JPS5928260B2 (ja) | 1976-07-15 | 1984-07-11 | 松下電器産業株式会社 | 超音波プロ−ブ位置検出方法および装置 |
JPS53104857A (en) | 1977-02-25 | 1978-09-12 | Hitachi Ltd | Method of producing printed circuit board |
DE2963050D1 (en) | 1978-02-17 | 1982-07-29 | Du Pont | Use of photosensitive stratum to create through-hole connections in circuit boards |
JPS54139065A (en) | 1978-04-20 | 1979-10-29 | Japan Styrene Paper Corp | Resist for production of metalic through hole type printed circuit board |
JPS54139006A (en) | 1978-04-20 | 1979-10-29 | Toshiba Corp | Stator for rotary electric machine |
US4283243A (en) | 1978-10-24 | 1981-08-11 | E. I. Du Pont De Nemours And Company | Use of photosensitive stratum to create through-hole connections in circuit boards |
US4498275A (en) | 1979-04-16 | 1985-02-12 | Lykes Pasco Packing Company | Rotary filling and capping apparatus |
JPS5811172A (ja) | 1981-07-14 | 1983-01-21 | Canon Inc | インクジェットヘッドの製造方法 |
DE3217983C2 (de) | 1982-05-13 | 1984-03-29 | Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern | Verfahren zum Herstellen einer Abdeckmaske |
US4549387A (en) * | 1982-07-07 | 1985-10-29 | Aci Australia Limited | Flexible container filling apparatus |
SE453708B (sv) | 1985-03-05 | 1988-02-22 | Svecia Silkscreen Maskiner Ab | Stenciltryckmaskin for att bilda ett materialskikt pa ett inre veggparti for ett genomgaende hal i en platta |
US4964948A (en) | 1985-04-16 | 1990-10-23 | Protocad, Inc. | Printed circuit board through hole technique |
DE3514093A1 (de) | 1985-04-16 | 1986-10-23 | Kaspar 5241 Gebhardshain Eidenberg | Verfahren zum verschliessen von in einer leiterplatte vorgesehenen bohrungen |
DE3517796A1 (de) | 1985-05-17 | 1986-11-20 | Hoechst Ag, 6230 Frankfurt | Verfahren zur herstellung von elektrisch isolierendem basismaterial fuer die fertigung von durchkontaktierten leiterplatten |
US4664308A (en) * | 1985-10-30 | 1987-05-12 | Hollis Automation, Inc. | Mass soldering system providing an oscillating air blast |
US4622239A (en) * | 1986-02-18 | 1986-11-11 | At&T Technologies, Inc. | Method and apparatus for dispensing viscous materials |
US4696096A (en) * | 1986-02-21 | 1987-09-29 | Micro Electronic Systems, Inc. | Reworking methods and apparatus for surface mounted technology circuit boards |
JPS62277794A (ja) | 1986-05-27 | 1987-12-02 | 日立化成工業株式会社 | 内層回路板の製造方法 |
JPS62287696A (ja) | 1986-06-05 | 1987-12-14 | 日本電気株式会社 | 多層印刷配線板の製造方法 |
US4700474A (en) | 1986-11-26 | 1987-10-20 | Multitek Corporation | Apparatus and method for temporarily sealing holes in printed circuit boards |
US4884337A (en) | 1986-11-26 | 1989-12-05 | Epicor Technology, Inc. | Method for temporarily sealing holes in printed circuit boards utilizing a thermodeformable material |
US4777721A (en) | 1986-11-26 | 1988-10-18 | Multitek Corporation | Apparatus and method for temporarily sealing holes in printed circuit boards utilizing a thermodeformable material |
JPS63295057A (ja) * | 1987-05-27 | 1988-12-01 | Hitachi Ltd | はんだコ−ティング装置 |
JPH01173696A (ja) | 1987-12-26 | 1989-07-10 | Nissha Printing Co Ltd | 積層回路基板 |
JPH01236694A (ja) | 1988-03-17 | 1989-09-21 | Toshiba Corp | セラミックス基板の製造方法 |
US5117069A (en) | 1988-03-28 | 1992-05-26 | Prime Computer, Inc. | Circuit board fabrication |
EP0345881B1 (de) | 1988-06-08 | 1995-11-22 | Philips Patentverwaltung GmbH | Synchrondemodulator |
US4954313A (en) | 1989-02-03 | 1990-09-04 | Amdahl Corporation | Method and apparatus for filling high density vias |
US4995941A (en) | 1989-05-15 | 1991-02-26 | Rogers Corporation | Method of manufacture interconnect device |
US5053921A (en) | 1989-05-15 | 1991-10-01 | Rogers Corporation | Multilayer interconnect device and method of manufacture thereof |
JP2662440B2 (ja) | 1989-06-01 | 1997-10-15 | 田中貴金属工業株式会社 | プラインドスルホール多層基板の製造方法 |
US5066216A (en) * | 1989-09-22 | 1991-11-19 | Binney & Smith Inc. | Apparatus for injection of viscous material |
US5058265A (en) | 1990-05-10 | 1991-10-22 | Rockwell International Corporation | Method for packaging a board of electronic components |
DD296375B5 (de) * | 1990-06-28 | 1994-02-17 | Thaelmann Schwermaschbau Veb | Vorrichtung zur realisierung der laengswasserdichtheit von aus plastisolierten adern aufgebauten fernmeldekabeln |
GB2246912B (en) | 1990-07-11 | 1994-01-26 | Nippon Cmk Kk | Apparatus for packing filler into through holes or the like of a printed circuit board |
JPH0471293A (ja) | 1990-07-11 | 1992-03-05 | Cmk Corp | プリント配線板におけるスルーホール等への導電性物質等の充填方法 |
JPH0475398A (ja) * | 1990-07-18 | 1992-03-10 | Cmk Corp | プリント配線板のスルーホール等に対する充填材の充填装置 |
JPH0494593A (ja) * | 1990-08-10 | 1992-03-26 | Cmk Corp | プリント配線板におけるスルーホールの形成方法 |
JP2739726B2 (ja) | 1990-09-27 | 1998-04-15 | インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン | 多層プリント回路板 |
JP2874329B2 (ja) | 1990-11-05 | 1999-03-24 | 日本電気株式会社 | 多層印刷配線板の製造方法 |
JPH04186792A (ja) | 1990-11-20 | 1992-07-03 | Nec Toyama Ltd | プリント配線板およびその製造方法 |
US5290396A (en) | 1991-06-06 | 1994-03-01 | Lsi Logic Corporation | Trench planarization techniques |
JPH04239193A (ja) | 1991-01-14 | 1992-08-27 | Nec Corp | スルーホールのヴィア充填方法 |
EP0506403B1 (de) * | 1991-03-25 | 1995-08-23 | Tektronix, Inc. | Verfahren und Vorrichtung zum Zuführen einer Phasenaustausch-Tinte an einen Tintenstrahldrucker |
US5277854A (en) | 1991-06-06 | 1994-01-11 | Hunt John F | Methods and apparatus for making grids from fibers |
JP2504643B2 (ja) | 1991-08-23 | 1996-06-05 | 株式会社日立製作所 | 導電性ペ―スト充填装置 |
US5532516A (en) | 1991-08-26 | 1996-07-02 | Lsi Logic Corportion | Techniques for via formation and filling |
FR2684836B3 (fr) | 1991-12-04 | 1994-03-18 | Assistance Prod Envi Lab | Procede de fabrication de cartes de circuits imprimes a trous de via. |
JP3166251B2 (ja) | 1991-12-18 | 2001-05-14 | 株式会社村田製作所 | セラミック多層電子部品の製造方法 |
JP2524278B2 (ja) | 1992-01-31 | 1996-08-14 | タツタ電線株式会社 | プリント配線基板 |
EP0565151A3 (en) | 1992-04-09 | 1993-11-24 | Ibm | Manufacture of multi-layer ceramic interconnect structures |
US5249436A (en) * | 1992-04-09 | 1993-10-05 | Indugas, Inc. | Simplified, low cost absorption heat pump |
US5766670A (en) * | 1993-11-17 | 1998-06-16 | Ibm | Via fill compositions for direct attach of devices and methods for applying same |
US5410806A (en) | 1993-09-15 | 1995-05-02 | Lsi Logic Corporation | Method for fabricating conductive epoxy grid array semiconductors packages |
JPH07176871A (ja) | 1993-12-21 | 1995-07-14 | Matsushita Electric Ind Co Ltd | 樹脂多層基板の製造方法 |
FR2714567B1 (fr) | 1993-12-28 | 1996-01-26 | Thomson Hybrides | Procédé de bouchage de trous métallisés de circuits de connexion. |
US5456004A (en) | 1994-01-04 | 1995-10-10 | Dell Usa, L.P. | Anisotropic interconnect methodology for cost effective manufacture of high density printed circuit boards |
JP3034180B2 (ja) | 1994-04-28 | 2000-04-17 | 富士通株式会社 | 半導体装置及びその製造方法及び基板 |
JP2963843B2 (ja) * | 1994-06-06 | 1999-10-18 | 株式会社ミツバ | 車両用ウオッシャノズル |
US5707575A (en) | 1994-07-28 | 1998-01-13 | Micro Substrates Corporation | Method for filling vias in ceramic substrates with composite metallic paste |
US5591353A (en) | 1994-08-18 | 1997-01-07 | Texas Instruments Incorporated | Reduction of surface copper thickness on surface mount printed wire boards with copper plated through holes by the chemical planarization method |
SE9403574L (sv) * | 1994-10-19 | 1996-04-20 | Ericsson Telefon Ab L M | Optokomponentkapsel med optiskt gränssnitt |
US5745333A (en) * | 1994-11-21 | 1998-04-28 | International Business Machines Corporation | Laminar stackable circuit board structure with capacitor |
EP0713358A3 (de) | 1994-11-21 | 1997-11-05 | International Business Machines Corporation | Leiterplatte |
US5622216A (en) | 1994-11-22 | 1997-04-22 | Brown; Stuart B. | Method and apparatus for metal solid freeform fabrication utilizing partially solidified metal slurry |
JPH08172265A (ja) | 1994-12-20 | 1996-07-02 | Fuji Elelctrochem Co Ltd | セラミックスシートの導通電極形成方法 |
JPH08191184A (ja) | 1995-01-11 | 1996-07-23 | Matsushita Electric Ind Co Ltd | プリント配線板の製造方法および製造装置 |
JP3311899B2 (ja) | 1995-01-20 | 2002-08-05 | 松下電器産業株式会社 | 回路基板及びその製造方法 |
US5637834A (en) | 1995-02-03 | 1997-06-10 | Motorola, Inc. | Multilayer circuit substrate and method for forming same |
JP3290041B2 (ja) | 1995-02-17 | 2002-06-10 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 多層プリント基板、多層プリント基板の製造方法 |
JP3431729B2 (ja) * | 1995-07-12 | 2003-07-28 | 松下電器産業株式会社 | 回路基板の製造方法及び製造装置 |
US5678752A (en) * | 1995-08-01 | 1997-10-21 | International Business Machines Corporation | Wave soldering process |
US5851644A (en) | 1995-08-01 | 1998-12-22 | Loctite (Ireland) Limited | Films and coatings having anisotropic conductive pathways therein |
JPH0983135A (ja) | 1995-09-18 | 1997-03-28 | Matsushita Electric Ind Co Ltd | スルーホール基板の製造装置 |
US5699613A (en) | 1995-09-25 | 1997-12-23 | International Business Machines Corporation | Fine dimension stacked vias for a multiple layer circuit board structure |
US5906042A (en) | 1995-10-04 | 1999-05-25 | Prolinx Labs Corporation | Method and structure to interconnect traces of two conductive layers in a printed circuit board |
US5824155A (en) * | 1995-11-08 | 1998-10-20 | Ford Motor Company | Method and apparatus for dispensing viscous material |
GB9523555D0 (en) * | 1995-11-17 | 1996-01-17 | Cambridge Consultants | Filling containers with particulate material |
US5610103A (en) | 1995-12-12 | 1997-03-11 | Applied Materials, Inc. | Ultrasonic wave assisted contact hole filling |
JP3197213B2 (ja) | 1996-05-29 | 2001-08-13 | 松下電器産業株式会社 | プリント配線板およびその製造方法 |
US5753976A (en) | 1996-06-14 | 1998-05-19 | Minnesota Mining And Manufacturing Company | Multi-layer circuit having a via matrix interlayer connection |
US5761803A (en) | 1996-06-26 | 1998-06-09 | St. John; Frank | Method of forming plugs in vias of a circuit board by utilizing a porous membrane |
US5822856A (en) | 1996-06-28 | 1998-10-20 | International Business Machines Corporation | Manufacturing circuit board assemblies having filled vias |
US5744285A (en) | 1996-07-18 | 1998-04-28 | E. I. Du Pont De Nemours And Company | Composition and process for filling vias |
JPH1065339A (ja) | 1996-08-22 | 1998-03-06 | Sony Corp | 多層プリント配線板及びその製造方法 |
US5925414A (en) * | 1996-11-20 | 1999-07-20 | International Business Corpration | Nozzle and method for extruding conductive paste into high aspect ratio openings |
DE69725689T2 (de) | 1996-12-26 | 2004-04-29 | Matsushita Electric Industrial Co., Ltd., Kadoma | Gedruckte Leiterplatte und elektronische Bauteile |
JPH10256687A (ja) | 1997-03-14 | 1998-09-25 | Matsushita Electric Ind Co Ltd | ビアホール充填用導体ペースト組成物とそれを用いたプリント配線基板 |
US5994779A (en) | 1997-05-02 | 1999-11-30 | Advanced Micro Devices, Inc. | Semiconductor fabrication employing a spacer metallization technique |
US6015520A (en) | 1997-05-15 | 2000-01-18 | International Business Machines Corporation | Method for filling holes in printed wiring boards |
JP3410639B2 (ja) * | 1997-07-23 | 2003-05-26 | 株式会社日立製作所 | ペースト充填方法及びはんだ付け方法及びペースト印刷機 |
JPH1154909A (ja) * | 1997-08-04 | 1999-02-26 | Tdk Corp | スルーホール用ペースト充填方法及び装置 |
JP3017485B2 (ja) | 1998-01-23 | 2000-03-06 | アピックヤマダ株式会社 | 半導体装置の樹脂封止方法及び樹脂封止装置 |
US6079100A (en) | 1998-05-12 | 2000-06-27 | International Business Machines Corporation | Method of making a printed circuit board having filled holes and fill member for use therewith |
US6009620A (en) | 1998-07-15 | 2000-01-04 | International Business Machines Corporation | Method of making a printed circuit board having filled holes |
US6090474A (en) | 1998-09-01 | 2000-07-18 | International Business Machines Corporation | Flowable compositions and use in filling vias and plated through-holes |
US6276055B1 (en) | 1998-09-02 | 2001-08-21 | Hadco Santa Clara, Inc. | Method and apparatus for forming plugs in vias of a circuit board layer |
GB9903146D0 (en) * | 1998-09-10 | 1999-04-07 | Williams David G | Method and apparatus for applying a viscous or paste material onto a substrate |
US6281488B1 (en) * | 1998-12-09 | 2001-08-28 | Sandia Corporation | Fiber optic coupled optical sensor |
JP4110663B2 (ja) * | 1999-04-13 | 2008-07-02 | 旭硝子株式会社 | 溶融ガラス流の減圧脱泡方法 |
JP2000318711A (ja) * | 1999-05-12 | 2000-11-21 | Kao Corp | 液体充填方法 |
US6491204B1 (en) * | 1999-11-30 | 2002-12-10 | Gunter Erdmann | Stencil wiping device |
KR20030007755A (ko) * | 2000-05-31 | 2003-01-23 | 허니웰 인터내셔날 인코포레이티드 | 채움 장치 |
US6454154B1 (en) * | 2000-05-31 | 2002-09-24 | Honeywell Advanced Circuits, Inc. | Filling device |
CN1444839A (zh) * | 2000-05-31 | 2003-09-24 | Ttm先进电路公司 | 填充方法 |
US6589594B1 (en) * | 2000-08-31 | 2003-07-08 | Micron Technology, Inc. | Method for filling a wafer through-via with a conductive material |
US6638363B2 (en) * | 2000-11-22 | 2003-10-28 | Gunter Erdmann | Method of cleaning solder paste |
-
2001
- 2001-05-24 KR KR1020027016198A patent/KR20030007755A/ko not_active Application Discontinuation
- 2001-05-24 CN CN01813666A patent/CN1444840A/zh active Pending
- 2001-05-24 DE DE10196259T patent/DE10196259T1/de not_active Withdrawn
- 2001-05-24 JP JP2001588300A patent/JP2003535465A/ja not_active Withdrawn
- 2001-05-24 AU AU2001264968A patent/AU2001264968A1/en not_active Abandoned
- 2001-05-24 WO PCT/US2001/016986 patent/WO2001093648A2/en active Application Filing
- 2001-08-28 TW TW090113057A patent/TW486782B/zh active
- 2001-12-20 US US10/026,135 patent/US6832714B2/en not_active Expired - Fee Related
- 2001-12-20 US US10/026,338 patent/US6840425B2/en not_active Expired - Fee Related
-
2002
- 2002-01-03 US US10/039,942 patent/US6995321B2/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102012216101A1 (de) * | 2012-09-12 | 2014-04-03 | Festo Ag & Co. Kg | Verfahren zum Herstellen einer in einem Substrat integrierten oder auf einem Substrat aufgebrachten Spule und elektronisches Gerät |
DE102012216101B4 (de) * | 2012-09-12 | 2016-03-24 | Festo Ag & Co. Kg | Verfahren zum Herstellen einer in einem Substrat integrierten Spule, Verfahren zur Herstellung einer mehrschichtigen Leiterplatte und elektronisches Gerät |
Also Published As
Publication number | Publication date |
---|---|
US20020088840A1 (en) | 2002-07-11 |
AU2001264968A1 (en) | 2001-12-11 |
KR20030007755A (ko) | 2003-01-23 |
CN1444840A (zh) | 2003-09-24 |
JP2003535465A (ja) | 2003-11-25 |
US6832714B2 (en) | 2004-12-21 |
US6995321B2 (en) | 2006-02-07 |
US6840425B2 (en) | 2005-01-11 |
WO2001093648A2 (en) | 2001-12-06 |
WO2001093648A3 (en) | 2002-05-23 |
US20020084305A1 (en) | 2002-07-04 |
TW486782B (en) | 2002-05-11 |
US20020084306A1 (en) | 2002-07-04 |
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