JPH0214244A - 加熱硬化性オルガノポリシロキサン組成物 - Google Patents

加熱硬化性オルガノポリシロキサン組成物

Info

Publication number
JPH0214244A
JPH0214244A JP63163877A JP16387788A JPH0214244A JP H0214244 A JPH0214244 A JP H0214244A JP 63163877 A JP63163877 A JP 63163877A JP 16387788 A JP16387788 A JP 16387788A JP H0214244 A JPH0214244 A JP H0214244A
Authority
JP
Japan
Prior art keywords
platinum
molecule
organopolysiloxane composition
catalyst
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63163877A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0558458B2 (member.php
Inventor
Atsushi Togashi
敦 冨樫
Toshio Saruyama
俊夫 猿山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Dow Corning Toray Silicone Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Silicone Co Ltd filed Critical Dow Corning Toray Silicone Co Ltd
Priority to JP63163877A priority Critical patent/JPH0214244A/ja
Priority to US07/372,579 priority patent/US5017654A/en
Priority to CA000604148A priority patent/CA1339328C/en
Priority to EP89111841A priority patent/EP0352493B1/en
Priority to AU37171/89A priority patent/AU621904B2/en
Priority to DE89111841T priority patent/DE68907659T2/de
Publication of JPH0214244A publication Critical patent/JPH0214244A/ja
Publication of JPH0558458B2 publication Critical patent/JPH0558458B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/10—Encapsulated ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/24—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/44—Block-or graft-polymers containing polysiloxane sequences containing only polysiloxane sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP63163877A 1988-06-30 1988-06-30 加熱硬化性オルガノポリシロキサン組成物 Granted JPH0214244A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP63163877A JPH0214244A (ja) 1988-06-30 1988-06-30 加熱硬化性オルガノポリシロキサン組成物
US07/372,579 US5017654A (en) 1988-06-30 1989-06-28 Thermosetting organosiloxane composition
CA000604148A CA1339328C (en) 1988-06-30 1989-06-28 Thermosetting organosiloxane composition
EP89111841A EP0352493B1 (en) 1988-06-30 1989-06-29 Thermosetting organosiloxane composition
AU37171/89A AU621904B2 (en) 1988-06-30 1989-06-29 Thermosetting organosiloxane composition
DE89111841T DE68907659T2 (de) 1988-06-30 1989-06-29 Warmhärtende Organosiloxanzusammensetzung.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63163877A JPH0214244A (ja) 1988-06-30 1988-06-30 加熱硬化性オルガノポリシロキサン組成物

Publications (2)

Publication Number Publication Date
JPH0214244A true JPH0214244A (ja) 1990-01-18
JPH0558458B2 JPH0558458B2 (member.php) 1993-08-26

Family

ID=15782483

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63163877A Granted JPH0214244A (ja) 1988-06-30 1988-06-30 加熱硬化性オルガノポリシロキサン組成物

Country Status (6)

Country Link
US (1) US5017654A (member.php)
EP (1) EP0352493B1 (member.php)
JP (1) JPH0214244A (member.php)
AU (1) AU621904B2 (member.php)
CA (1) CA1339328C (member.php)
DE (1) DE68907659T2 (member.php)

Cited By (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03250052A (ja) * 1990-01-31 1991-11-07 Toray Dow Corning Silicone Co Ltd 加熱硬化性オルガノポリシロキサン組成物
JPH03250051A (ja) * 1990-01-30 1991-11-07 Toray Dow Corning Silicone Co Ltd 加熱硬化性オルガノポリシロキサン組成物
JPH03285956A (ja) * 1990-03-26 1991-12-17 Toray Dow Corning Silicone Co Ltd １液型加熱硬化性オルガノポリシロキサン組成物
JPH0436354A (ja) * 1990-05-31 1992-02-06 Toray Dow Corning Silicone Co Ltd 加熱硬化性オルガノポリシロキサン組成物
JPH0436355A (ja) * 1990-05-31 1992-02-06 Toray Dow Corning Silicone Co Ltd シリコーンゴム組成物
JPH0441562A (ja) * 1990-06-08 1992-02-12 Toray Dow Corning Silicone Co Ltd 加熱硬化性オルガノポリシロキサン組成物
JPH0455471A (ja) * 1990-06-22 1992-02-24 Toray Dow Corning Silicone Co Ltd 加圧成形用シリコーンゴム組成物
JPH0459873A (ja) * 1990-06-29 1992-02-26 Toray Dow Corning Silicone Co Ltd 押出成形用シリコーンゴム組成物
JPH0493364A (ja) * 1990-08-08 1992-03-26 Kanegafuchi Chem Ind Co Ltd 貯蔵安定性の優れた硬化性組成物
JPH055062A (ja) * 1990-11-30 1993-01-14 Toray Dow Corning Silicone Co Ltd 電線被覆用シリコーンゴム組成物
JPH055063A (ja) * 1991-04-22 1993-01-14 Toray Dow Corning Silicone Co Ltd 複合成形用液状シリコーンゴム組成物
JPH06157913A (ja) * 1992-08-31 1994-06-07 Dow Corning Corp 有機チタン化合物／マイクロカプセル化白金共触媒を含有する硬化性オルガノシロキサン組成物
JPH07196921A (ja) * 1993-12-29 1995-08-01 Toray Dow Corning Silicone Co Ltd 加熱硬化性シリコーン組成物
JPH07247436A (ja) * 1990-10-30 1995-09-26 Toray Dow Corning Silicone Co Ltd シリコーンゴムスポンジ組成物
JPH1033971A (ja) * 1996-07-22 1998-02-10 Toray Dow Corning Silicone Co Ltd シリコーンレジン中空体およびその製造方法
JPH10158587A (ja) * 1996-11-28 1998-06-16 Toray Dow Corning Silicone Co Ltd 剥離性硬化皮膜形成性オルガノポリシロキサン組成物
JPH11166122A (ja) * 1997-09-12 1999-06-22 Shin Etsu Chem Co Ltd オルガノポリシロキサン組成物
JPH11236508A (ja) * 1997-11-19 1999-08-31 Shin Etsu Chem Co Ltd オルガノポリシロキサン組成物
US6140446A (en) * 1997-11-18 2000-10-31 Shin-Etsu Chemical Co., Ltd. Hydrosilylation catalysts and silicone compositions using the same
JP2005146288A (ja) * 2004-12-17 2005-06-09 Shin Etsu Chem Co Ltd オルガノポリシロキサン組成物
WO2006028198A1 (ja) * 2004-09-10 2006-03-16 Dow Corning Toray Co., Ltd. シリコーンゴム成形体およびその製造方法
JP2007260659A (ja) * 2006-03-02 2007-10-11 Japan Science & Technology Agency ポリシラン担持遷移金属触媒
CN103747855A (zh) * 2011-06-06 2014-04-23 道康宁公司 由含有聚醚和含硅填料的有机硅组合物制得的膜
WO2016052521A3 (ja) * 2014-09-29 2016-05-19 住友理工株式会社 シリコーンゴム組成物およびシリコーンゴム架橋体ならびに一体成形体および一体成形体の製造方法
KR20160113625A (ko) 2014-01-31 2016-09-30 신에쓰 가가꾸 고교 가부시끼가이샤 오가노폴리실록세인 화합물 및 그 제조 방법, 그리고 부가 경화형 실리콘 조성물
WO2017170474A1 (ja) * 2016-03-29 2017-10-05 住友理工株式会社 シリコーンゴム組成物およびシリコーンゴム架橋体
WO2018151033A1 (ja) * 2017-02-14 2018-08-23 信越化学工業株式会社 付加硬化型シリコーン組成物
WO2018180704A1 (ja) * 2017-03-27 2018-10-04 信越化学工業株式会社 付加硬化型シリコーン組成物
US10125236B2 (en) 2015-11-30 2018-11-13 Sumitomo Riko Company Limited Elastic roll for electrophotographic apparatus and method for manufacturing the same
KR20180128413A (ko) 2016-03-29 2018-12-03 신에쓰 가가꾸 고교 가부시끼가이샤 담지 백금촉매를 함유하는 수지 조성물, 및 그것을 이용한 열경화성 오가노폴리실록산 조성물 그리고 그 경화방법
JP2021042132A (ja) * 2019-09-06 2021-03-18 信越化学工業株式会社 アルキニル基含有オルガノポリシロキサン及びヒドロシリル化反応制御剤
WO2022004463A1 (ja) 2020-06-30 2022-01-06 ダウ・東レ株式会社 硬化性オルガノポリシロキサン組成物およびその使用
US11390715B2 (en) 2017-11-07 2022-07-19 Dow Toray Co., Ltd. Organopolysiloxane composition
US11655367B2 (en) 2017-11-07 2023-05-23 Dow Toray Co., Ltd. Organopolysiloxane composition
WO2025225108A1 (ja) * 2024-04-25 2025-10-30 富士高分子工業株式会社 樹脂に内包された鉄錯体触媒、それを含む付加硬化型組成物、および樹脂に内包された鉄錯体触媒の製造方法

Families Citing this family (256)

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JP2665941B2 (ja) * 1988-06-29 1997-10-22 東レ・ダウコーニング・シリコーン株式会社 ヒドロシリル化反応用白金系触媒含有粒状物
US5015691A (en) * 1989-05-22 1991-05-14 General Electric Company One part heat curable organopolysiloxane compositions
US5089582A (en) * 1990-02-26 1992-02-18 General Electric Company Encapsulated palladium complexes and one part heat curable organopolysiloxane compositions
US5142035A (en) * 1990-02-26 1992-08-25 General Electric Company Encapsulated palladium complexes and one part heat curable organopolysiloxane compositions
JP2608484B2 (ja) * 1990-05-24 1997-05-07 東レ・ダウコーニング・シリコーン株式会社 ヒドロシリル化反応用触媒含有熱可塑性樹脂微粒子の製造方法
US5321058A (en) * 1990-05-31 1994-06-14 Dow Corning Toray Silicone Co., Ltd. Curable organosiloxane compositions exhibiting reduced mold staining and scorching
US5066699A (en) * 1990-08-31 1991-11-19 Dow Corning Corporation Storage stable heat curable organosiloxane compositions containing a microencapsulated catalyst and method for preparing said catalyst
US5231158A (en) * 1990-10-01 1993-07-27 General Electric Company One part heat curable organopolysiloxane compositions and method
JP2668471B2 (ja) * 1991-09-27 1997-10-27 信越化学工業株式会社 硬化性樹脂組成物及びその硬化物
JPH05287206A (ja) * 1992-04-14 1993-11-02 Nippon Paint Co Ltd 硬化性樹脂組成物
US5332313A (en) * 1993-03-12 1994-07-26 Dow Corning Corporation Nozzle mixer assembly
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EP0699717A3 (en) 1994-08-30 1997-01-02 Dow Corning Organopolysiloxane compositions curable into products having good adhesiveness and reduced flammability
JP3763484B2 (ja) * 1995-08-31 2006-04-05 東レ・ダウコーニング株式会社 ヒドロシリル化反応用微粒子触媒およびこれを含有してなる加熱硬化性シリコーン組成物
JP3368161B2 (ja) * 1996-11-27 2003-01-20 東レ・ダウコーニング・シリコーン株式会社 剥離性硬化皮膜形成性オルガノポリシロキサン組成物
US20100273011A1 (en) * 1996-12-20 2010-10-28 Bianxiao Zhong Silicone Composition, Silicone Adhesive, Coated and Laminated Substrates
US6020409A (en) * 1997-09-19 2000-02-01 Dow Corning Corporation Routes to dielectric gel for protection of electronic modules
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US6169155B1 (en) 1999-01-14 2001-01-02 Dow Corning Corporation Silicone gel composition and silicone gel produced therefrom
US6201055B1 (en) 1999-03-11 2001-03-13 Dow Corning Corporation Silicone composition and silicone pressure sensitive adhesive
US6433057B1 (en) 2000-03-28 2002-08-13 Dow Corning Corporation Silicone composition and electrically conductive silicone adhesive formed therefrom
US7074481B2 (en) 2001-09-17 2006-07-11 Dow Corning Corporation Adhesives for semiconductor applications efficient processes for producing such devices and the devices per se produced by the efficient processes
US6784555B2 (en) 2001-09-17 2004-08-31 Dow Corning Corporation Die attach adhesives for semiconductor applications utilizing a polymeric base material with inorganic insulator particles of various sizes
US6793759B2 (en) 2001-10-09 2004-09-21 Dow Corning Corporation Method for creating adhesion during fabrication of electronic devices
US6791839B2 (en) * 2002-06-25 2004-09-14 Dow Corning Corporation Thermal interface materials and methods for their preparation and use
US20050038188A1 (en) * 2003-08-14 2005-02-17 Dongchan Ahn Silicones having improved chemical resistance and curable silicone compositions having improved migration resistance
US20050038183A1 (en) * 2003-08-14 2005-02-17 Dongchan Ahn Silicones having improved surface properties and curable silicone compositions for preparing the silicones
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ATE409207T1 (de) * 2004-11-19 2008-10-15 Dow Corning Zusammensetzung aus organohydrogenpolysiloxanharz und silizium
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US7718158B2 (en) * 2005-10-13 2010-05-18 Lyondell Chemical Technology, L.P. Polymer-encapsulated ion-exchange resin
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