JP6588101B2 - 電気素子および電気素子の製造方法 - Google Patents
電気素子および電気素子の製造方法 Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 239000000463 material Substances 0.000 claims description 73
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 72
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 11
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- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
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- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
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- H—ELECTRICITY
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- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
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- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01G4/00—Fixed capacitors; Processes of their manufacture
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- H—ELECTRICITY
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- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
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- H—ELECTRICITY
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- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/248—Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
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- H—ELECTRICITY
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- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/26—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for engaging or disengaging the two parts of a coupling device
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10757—Bent leads
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10818—Flat leads
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/10886—Other details
- H05K2201/10909—Materials of terminal, e.g. of leads or electrodes of components
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
- Powder Metallurgy (AREA)
- Multi-Conductor Connections (AREA)
- Connector Housings Or Holding Contact Members (AREA)
- Connecting Device With Holders (AREA)
Description
2 部分体
3 台座
4 接続用接点
5 接続用接点
6 接触領域
7 部分接点
8 連結領域
9 接続領域
10 部分接続部
11 空気間隙
12 素子システム
13 担体
14 接点ポイント
15 結合材料
16 基材
17 さらなる層
18 さらなる層
19 迫台
20 間隙
21 基体
22 より小さい素子
23 より小さい素子
Claims (17)
- 複数の部分体(2)と、前記部分体(2)が上に配置されている台座(3)と、前記部分体(2)を担体(13)に電気的に接続するための少なくとも1つの接続用接点(5)とを有し、
前記接続用接点(4、5)が、迫台(19)により互いに連結された複数の部分接点(7)を有し、前記接続用接点(4、5)は一体片として形成されており、各前記部分接点(7)が前記部分体(2)のうちの1つと接触し、
2つの前記部分体(2)の間かつ2つの前記部分接点(7)の間にある平面に沿った切断により、より小さな素子(22、23)に分割可能であり、これにより、2つの前記部分接点(7)の間の前記迫台(19)を破断し、前記より小さな素子(22、23)のそれぞれが、少なくとも1つの部分体(2)を有し、前記部分体(2)が台座(3)上に配置されていて、かつ接続用接点(4、5)と連結されている電気素子。 - 前記台座は非導電性材料を有する請求項1に記載の電気素子。
- 前記接続用接点(4、5)は、前記担体(13)に連結するための少なくとも1つの接続領域(9)を有し、前記接続領域(9)は前記台座(3)の下方にある、請求項1または2に記載の電気素子。
- 前記部分体(2)が、互いに固定されていない請求項1〜3のいずれか1項に記載の電気素子。
- 前記接続用接点(4、5)が、前記台座(3)を貫通している請求項1〜4のいずれか1項に記載の電気素子。
- 前記接続用接点(4、5)が、SMDまたはピン実装用に形成されている請求項1〜5のいずれか1項に記載の電気素子。
- 2つの接続用接点(4、5)を有し、前記部分体(2)が前記接続用接点(4、5)の間に挟み込まれている請求項1〜6のいずれか1項に記載の電気素子。
- 前記接続用接点(4、5)は、前記担体(13)と電気的に連結するための複数の部分接続部(10)を有する請求項1〜7のいずれか1項に記載の電気素子。
- 前記接続用接点(4、5)は、第1材料(M1)と、その上に配置された第2材料(M2)とを有し、前記第1材料(M1)は銅を有し、かつ、前記第2材料(M2)はインバールを有する請求項1〜8のいずれか1項に記載の電気素子。
- 前記接続用接点(4、5)は、金属薄板から形成されている請求項1〜9のいずれか1項に記載の電気素子。
- 請求項1〜10のいずれか1項に記載の電気素子(1)と、前記素子(1)が固定されている担体(13)とを備えた素子システム。
- 請求項1に記載の素子の製造方法において、以下の工程を含み、すなわち
A) 接続用接点(4、5)を設ける工程であって、前記接続用接点(4、5)が、迫台(19)により互いに連結された複数の部分接点(7)を有し、前記接続用接点(4、5)は一体片として形成されている、前記接続用接点(4、5)を設ける工程と、
B) 前記接続用接点(4、5)を台座(3)と連結する工程と、
C) 前記接続用接点(4、5)と前記台座(3)を1つのプロセス工程で分割し、これにより、2つの前記部分接点(7)の間の前記迫台(19)を破断する工程と
を含み、
さらなる工程中で、1つまたは複数の部分体(2)を設け、前記台座(3)上に配置し、前記部分接点(7)が前記部分体(2)に接続され、
前記工程C)は、前記1つまたは複数の部分体(2)を前記台座(3)上に配置した後または配置する前に行う方法。 - 前記分割工程C)は、前記部分体(2)を前記台座(3)上に配置した後に行う請求項12に記載の方法。
- 前記分割工程C)は、前記部分体(2)を前記台座(3)上に配置する前に行う請求項12に記載の方法。
- 前記素子(1)は2つの接続用接点(4、5)を有し、かつ、前記部分体(2)を前記接続用接点(4、5)間で挟むことにより固定する請求項12〜14のいずれか1項に記載の方法。
- 1つまたは複数の部分体(2)と、前記部分体(2)が上に配置されている台座(3)と、前記部分体(2)を担体(13)に電気的に接続するための少なくとも1つの接続用接点(4、5)とを有する素子の製造方法であって、
請求項1に記載の素子を設ける工程と、2つの前記部分体(2)の間かつ2つの前記部分接点(7)の間にある平面に沿った切断により前記素子をより小さな素子(22、23)に分割し、これにより、2つの前記部分接点(7)の間の前記迫台(19)を破断する工程とを含む方法。 - 前記接続用接点(4、5)は、金属薄板から形成されている請求項12〜16のいずれか1項に記載の方法。
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PCT/EP2015/080853 WO2016134804A1 (de) | 2015-02-27 | 2015-12-21 | Elektrisches bauelement und verfahren zur herstellung eines elektrischen bauelements |
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DE102015102866B4 (de) * | 2015-02-27 | 2023-02-02 | Tdk Electronics Ag | Keramisches Bauelement, Bauelementanordnung und Verfahren zur Herstellung eines keramischen Bauelements |
DE102016107931A1 (de) * | 2016-04-28 | 2017-11-02 | Epcos Ag | Elektronisches Bauelement zur Einschaltstrombegrenzung und Verwendung eines elektronischen Bauelements |
DE102016110742A1 (de) * | 2016-06-10 | 2017-12-14 | Epcos Ag | Filterbauelement zur Filterung eines Störsignals |
JP7108605B2 (ja) * | 2016-09-27 | 2022-07-28 | パーキンエルマー・ヘルス・サイエンシーズ・カナダ・インコーポレイテッド | コンデンサ及び無線周波発生器、ならびにこれらを使用する他のデバイス |
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JPWO2018207856A1 (ja) | 2017-05-10 | 2020-05-14 | ローム株式会社 | パワー半導体装置 |
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