DE102015102866B4 - Keramisches Bauelement, Bauelementanordnung und Verfahren zur Herstellung eines keramischen Bauelements - Google Patents

Keramisches Bauelement, Bauelementanordnung und Verfahren zur Herstellung eines keramischen Bauelements Download PDF

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Publication number
DE102015102866B4
DE102015102866B4 DE102015102866.2A DE102015102866A DE102015102866B4 DE 102015102866 B4 DE102015102866 B4 DE 102015102866B4 DE 102015102866 A DE102015102866 A DE 102015102866A DE 102015102866 B4 DE102015102866 B4 DE 102015102866B4
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DE
Germany
Prior art keywords
contact
connection
connection contact
base body
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE102015102866.2A
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German (de)
English (en)
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DE102015102866A1 (de
Inventor
Markus Koini
Christoph Auer
Jürgen Konrad
Franz Rinner
Markus Puff
Monika Stadlober
Thomas Wippel
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TDK Electronics AG
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TDK Electronics AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Electronics AG filed Critical TDK Electronics AG
Priority to DE102015102866.2A priority Critical patent/DE102015102866B4/de
Priority to EP15816184.4A priority patent/EP3262666B1/de
Priority to KR1020177026745A priority patent/KR20170118900A/ko
Priority to KR1020197033132A priority patent/KR102164139B1/ko
Priority to PCT/EP2015/080853 priority patent/WO2016134804A1/de
Priority to JP2017545252A priority patent/JP6588101B2/ja
Priority to CN201580076969.XA priority patent/CN107278322B/zh
Priority to US15/553,430 priority patent/US11342126B2/en
Priority to US15/550,672 priority patent/US10395843B2/en
Priority to PCT/EP2016/054007 priority patent/WO2016135255A1/de
Priority to EP16708957.2A priority patent/EP3262667B8/de
Priority to CN201680012634.6A priority patent/CN107408455B/zh
Priority to KR1020177024564A priority patent/KR102003626B1/ko
Priority to JP2017544948A priority patent/JP2018510507A/ja
Priority to CN202010106693.8A priority patent/CN111508707B/zh
Priority to KR1020197016161A priority patent/KR102088606B1/ko
Publication of DE102015102866A1 publication Critical patent/DE102015102866A1/de
Priority to JP2019032867A priority patent/JP7030730B2/ja
Priority to JP2019091391A priority patent/JP6929321B2/ja
Priority to US16/447,639 priority patent/US10943740B2/en
Priority to JP2021128500A priority patent/JP7223814B2/ja
Application granted granted Critical
Publication of DE102015102866B4 publication Critical patent/DE102015102866B4/de
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/248—Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/26—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for engaging or disengaging the two parts of a coupling device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10757—Bent leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10818—Flat leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10909—Materials of terminal, e.g. of leads or electrodes of components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Multi-Conductor Connections (AREA)
  • Laminated Bodies (AREA)
  • Powder Metallurgy (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
DE102015102866.2A 2015-02-27 2015-02-27 Keramisches Bauelement, Bauelementanordnung und Verfahren zur Herstellung eines keramischen Bauelements Active DE102015102866B4 (de)

Priority Applications (20)

Application Number Priority Date Filing Date Title
DE102015102866.2A DE102015102866B4 (de) 2015-02-27 2015-02-27 Keramisches Bauelement, Bauelementanordnung und Verfahren zur Herstellung eines keramischen Bauelements
KR1020177026745A KR20170118900A (ko) 2015-02-27 2015-12-21 전기 부품 및 전기 부품의 제조 방법
KR1020197033132A KR102164139B1 (ko) 2015-02-27 2015-12-21 전기 부품 및 전기 부품의 제조 방법
PCT/EP2015/080853 WO2016134804A1 (de) 2015-02-27 2015-12-21 Elektrisches bauelement und verfahren zur herstellung eines elektrischen bauelements
JP2017545252A JP6588101B2 (ja) 2015-02-27 2015-12-21 電気素子および電気素子の製造方法
CN201580076969.XA CN107278322B (zh) 2015-02-27 2015-12-21 电器件和用于制造电器件的方法
US15/553,430 US11342126B2 (en) 2015-02-27 2015-12-21 Electrical component and a method for producing an electrical component
EP15816184.4A EP3262666B1 (de) 2015-02-27 2015-12-21 Elektrisches bauelement und verfahren zur herstellung eines elektrischen bauelements
CN201680012634.6A CN107408455B (zh) 2015-02-27 2016-02-25 用于陶瓷器件的电的联接接触件、陶瓷器件和器件装置
EP16708957.2A EP3262667B8 (de) 2015-02-27 2016-02-25 Elektrischer anschlusskontakt fuer ein keramisches bauelement, keramisches bauelement, bauelementanordnung und verfahren zu deren herstellung
US15/550,672 US10395843B2 (en) 2015-02-27 2016-02-25 Electrical connection contact for a ceramic component, a ceramic component, and a component arrangement
KR1020177024564A KR102003626B1 (ko) 2015-02-27 2016-02-25 세라믹 부품의 전기 연결 접점, 세라믹 부품 및 부품의 배열
JP2017544948A JP2018510507A (ja) 2015-02-27 2016-02-25 セラミック素子用の電気接続用接点、セラミック素子および素子システム
CN202010106693.8A CN111508707B (zh) 2015-02-27 2016-02-25 陶瓷器件、器件装置和制造陶瓷器件的方法
KR1020197016161A KR102088606B1 (ko) 2015-02-27 2016-02-25 세라믹 부품의 전기 연결 접점, 세라믹 부품 및 부품의 배열
PCT/EP2016/054007 WO2016135255A1 (de) 2015-02-27 2016-02-25 Elektrischer anschlusskontakt fuer ein keramisches bauelement, keramisches bauelement und bauelementanordnung
JP2019032867A JP7030730B2 (ja) 2015-02-27 2019-02-26 セラミック素子およびセラミック素子の製造方法
JP2019091391A JP6929321B2 (ja) 2015-02-27 2019-05-14 電気素子および電気素子の製造方法
US16/447,639 US10943740B2 (en) 2015-02-27 2019-06-20 Electrical connection contact for a ceramic component, a ceramic component, and a component arrangement
JP2021128500A JP7223814B2 (ja) 2015-02-27 2021-08-04 セラミック素子およびセラミック素子の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102015102866.2A DE102015102866B4 (de) 2015-02-27 2015-02-27 Keramisches Bauelement, Bauelementanordnung und Verfahren zur Herstellung eines keramischen Bauelements

Publications (2)

Publication Number Publication Date
DE102015102866A1 DE102015102866A1 (de) 2016-09-01
DE102015102866B4 true DE102015102866B4 (de) 2023-02-02

Family

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Family Applications (1)

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DE102015102866.2A Active DE102015102866B4 (de) 2015-02-27 2015-02-27 Keramisches Bauelement, Bauelementanordnung und Verfahren zur Herstellung eines keramischen Bauelements

Country Status (7)

Country Link
US (3) US11342126B2 (ja)
EP (2) EP3262666B1 (ja)
JP (5) JP6588101B2 (ja)
KR (4) KR20170118900A (ja)
CN (3) CN107278322B (ja)
DE (1) DE102015102866B4 (ja)
WO (2) WO2016134804A1 (ja)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015102866B4 (de) * 2015-02-27 2023-02-02 Tdk Electronics Ag Keramisches Bauelement, Bauelementanordnung und Verfahren zur Herstellung eines keramischen Bauelements
DE102016107931A1 (de) * 2016-04-28 2017-11-02 Epcos Ag Elektronisches Bauelement zur Einschaltstrombegrenzung und Verwendung eines elektronischen Bauelements
DE102016110742A1 (de) 2016-06-10 2017-12-14 Epcos Ag Filterbauelement zur Filterung eines Störsignals
EP3520126A4 (en) * 2016-09-27 2020-05-27 Perkinelmer Health Sciences Canada, Inc RADIO FREQUENCY CAPACITORS AND GENERATORS AND OTHER DEVICES USING THE SAME
JP2018142608A (ja) * 2017-02-27 2018-09-13 株式会社村田製作所 表面実装型電子部品
JP6863016B2 (ja) * 2017-03-31 2021-04-21 Tdk株式会社 電子部品
DE112018002384T5 (de) 2017-05-10 2020-01-16 Rohm Co., Ltd. Leistungshalbleitereinrichtung und Fertigungsverfahren für selbige
DE102018104459A1 (de) * 2018-02-27 2019-08-29 Tdk Electronics Ag Vielschichtbauelement mit externer Kontaktierung
JP7128436B2 (ja) * 2018-04-02 2022-08-31 Tdk株式会社 電子部品組立体
DE102018117283B3 (de) * 2018-06-13 2019-11-14 Electronicon Kondensatoren Gmbh Kontaktanordnung für Stirnseiten von Kondensatorwickeln
JP7102256B2 (ja) * 2018-06-27 2022-07-19 株式会社村田製作所 積層セラミック電子部品
JP7097761B2 (ja) * 2018-06-27 2022-07-08 株式会社村田製作所 積層セラミック電子部品
JP6962305B2 (ja) 2018-10-16 2021-11-05 株式会社村田製作所 積層セラミック電子部品
DE102019110374A1 (de) * 2019-04-18 2020-10-22 Tdk Electronics Ag Bauelement
CN114787950A (zh) 2020-02-03 2022-07-22 凯米特电子公司 结构引线框架
DE102020118857B4 (de) 2020-07-16 2023-10-26 Tdk Electronics Ag Vielschichtkondensator
KR20220079230A (ko) 2020-12-04 2022-06-13 삼성전기주식회사 전자 부품

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6081416A (en) 1998-05-28 2000-06-27 Trinh; Hung Lead frames for mounting ceramic electronic parts, particularly ceramic capacitors, where the coefficient of thermal expansion of the lead frame is less than that of the ceramic
DE19928190A1 (de) 1999-06-19 2001-01-11 Bosch Gmbh Robert Piezoaktor
DE102013108753A1 (de) 2013-08-13 2015-02-19 Epcos Ag Vielschichtbauelement mit einer Außenkontaktierung und Verfahren zur Herstellung eines Vielschichtbauelements mit einer Außenkontaktierung
DE102013108751A1 (de) 2013-08-13 2015-02-19 Wihag Fahrzeugbausysteme Gmbh Runge für ein Nutzfahrzeug

Family Cites Families (109)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3022480A (en) * 1957-02-07 1962-02-20 Tiffany Frank Emery Sandwich circuit strips
US2965812A (en) * 1958-01-16 1960-12-20 United Carr Fastener Corp Electrical connector
US3082397A (en) * 1960-02-04 1963-03-19 Sylvania Electric Prod Socket
NL130848C (ja) * 1964-02-27
SE327749B (ja) * 1969-09-25 1970-08-31 Saab Ab
US3846740A (en) * 1972-07-17 1974-11-05 Augat Inc Multiple-pin plug adaptor
US3780431A (en) * 1972-09-25 1973-12-25 Bowmar Ali Inc Process for producing computer circuits utilizing printed circuit boards
US3866999A (en) * 1973-11-16 1975-02-18 Ife Co Electronic microelement assembly
US4072376A (en) * 1974-12-06 1978-02-07 Amp Incorporated Socket assemblies
US4216523A (en) * 1977-12-02 1980-08-05 Rca Corporation Modular printed circuit board
JPS55138221A (en) 1979-04-10 1980-10-28 Matsushita Electric Ind Co Ltd Chip type electronic component and method of manufacturing same
JPS5627912A (en) 1979-08-15 1981-03-18 Matsushita Electric Ind Co Ltd Method of manufacturing chip type electronic part
US4293890A (en) 1979-10-01 1981-10-06 Vitramon Incorporated Ceramic capacitor with end terminals
DE2941770C2 (de) * 1979-10-16 1982-11-04 C.A. Weidmüller KG, 4930 Detmold Verfahren und Vorrichtung zur Herstellung von Kontakten mit Crimpanschluß
JPS58168214A (ja) 1982-03-30 1983-10-04 日本電気株式会社 積層コンデンサの製造方法
JPS58175625U (ja) 1982-05-20 1983-11-24 日本ケミコン株式会社 コンデンサ集合体
JPS59203305A (ja) 1983-04-30 1984-11-17 日本メクトロン株式会社 ハイキヤパシタンス積層母線
GB2141583A (en) 1983-06-17 1984-12-19 Standard Telephones Cables Ltd Leadless capacitors
JPS60119739A (ja) 1983-11-30 1985-06-27 Sharp Corp 集積回路装置
JPS60119739U (ja) * 1984-01-23 1985-08-13 株式会社　指月電機製作所 チツプ状コンデンサ
DE3412492A1 (de) * 1984-04-03 1985-10-03 Siemens AG, 1000 Berlin und 8000 München Elektrischer kondensator als chip-bauelement
US4578736A (en) 1984-08-28 1986-03-25 At&T Technologies, Inc. Surface mounted electrical components and method of fabrication
US4884335A (en) * 1985-06-21 1989-12-05 Minnesota Mining And Manufacturing Company Surface mount compatible connector system with solder strip and mounting connector to PCB
JPS62169317A (ja) 1986-12-19 1987-07-25 株式会社村田製作所 積層コンデンサの製造方法
US4832622A (en) * 1987-01-23 1989-05-23 Autosplice, Inc. Endless electrical connector
JPH0614458Y2 (ja) 1988-09-26 1994-04-13 株式会社村田製作所 積層コンデンサ集合体
JP2643396B2 (ja) * 1988-12-15 1997-08-20 日立電線株式会社 セラミックコンデンサに半田接合される板状のリード線
JP2865817B2 (ja) 1990-06-27 1999-03-08 川崎製鉄株式会社 Ｈ形鋼の反り矯正用ローラ矯正機
JPH0459124U (ja) * 1990-09-27 1992-05-21
JPH04364708A (ja) 1991-06-12 1992-12-17 Tdk Corp 回路部品収納ケース
US5402321A (en) 1991-05-27 1995-03-28 Tdk Corporation Composite device having inductor and coupling member
JPH0585060A (ja) 1991-09-30 1993-04-06 Asahi Denka Kogyo Kk 感熱記録材料
JPH0543618U (ja) 1991-11-05 1993-06-11 株式会社トーキン 多連チツプ型三端子フイルタ
JPH05243075A (ja) 1992-02-27 1993-09-21 Matsushita Electric Ind Co Ltd 薄膜コンデンサの製造方法
US5242097A (en) * 1992-06-26 1993-09-07 Indium Corporation Of America Integrated preforms
JPH06104031A (ja) 1992-09-17 1994-04-15 Fujitsu Ltd 調整部品用端子
GB9302228D0 (en) * 1993-02-05 1993-03-24 Ncr Int Inc Method of forming discrete solder portions on respective contact pads of a printed circuit board
JPH07235357A (ja) 1994-02-23 1995-09-05 Fujitsu Ltd 調整部品の取付構造
JPH097877A (ja) 1995-04-18 1997-01-10 Rohm Co Ltd 多層セラミックチップ型コンデンサ及びその製造方法
US5548473A (en) * 1995-09-12 1996-08-20 Wang; Ching-Heng Condensers
US5957739A (en) * 1996-01-11 1999-09-28 Autosplice Systems Inc. Continuous electronic stamping with offset carrier
US5834084A (en) * 1996-06-25 1998-11-10 Seagate Technology, Inc. Disc drive flex assembly having a low particulating circuit board
US5830012A (en) * 1996-08-30 1998-11-03 Berg Technology, Inc. Continuous plastic strip for use in manufacturing insulative housings in electrical connectors
US5945732A (en) 1997-03-12 1999-08-31 Staktek Corporation Apparatus and method of manufacturing a warp resistant thermally conductive integrated circuit package
JP3206734B2 (ja) 1997-06-27 2001-09-10 ティーディーケイ株式会社 セラミックコンデンサ
JPH11186100A (ja) 1997-12-25 1999-07-09 Murata Mfg Co Ltd 非線形誘電体素子
EP0929087B1 (en) 1998-01-07 2007-05-09 TDK Corporation Ceramic capacitor
JP3596268B2 (ja) 1998-01-27 2004-12-02 株式会社村田製作所 非線形誘電体素子
JP2000003829A (ja) 1998-06-12 2000-01-07 Murata Mfg Co Ltd セラミック電子部品およびその製造方法
JP2000021675A (ja) 1998-06-30 2000-01-21 Murata Mfg Co Ltd リードフレームおよびそれを用いた電子部品の製造方法
JP2000049042A (ja) * 1998-07-31 2000-02-18 Kyocera Corp コンデンサ装置
EP1950775B1 (en) * 1998-12-15 2013-07-03 Murata Manufacturing Co. Ltd. Monolithic ceramic capacitor
JP3307351B2 (ja) 1998-12-18 2002-07-24 株式会社村田製作所 積層セラミックコンデンサ
JP3459186B2 (ja) 1998-12-29 2003-10-20 マルコン電子株式会社 積層セラミック電子部品の製造方法
JP2000223358A (ja) 1999-02-04 2000-08-11 Murata Mfg Co Ltd 面実装型セラミック電子部品
JP2000235932A (ja) 1999-02-16 2000-08-29 Murata Mfg Co Ltd セラミック電子部品
JP3942000B2 (ja) * 1999-06-01 2007-07-11 ローム株式会社 パッケージ型固体電解コンデンサの構造及びその製造方法
US6595788B2 (en) * 1999-10-14 2003-07-22 Berg Technology, Inc. Electrical connector with continuous strip contacts
JP2002008741A (ja) 2000-06-23 2002-01-11 Fuji Photo Film Co Ltd 光電変換素子および光電池
JP2002057063A (ja) * 2000-08-11 2002-02-22 Murata Mfg Co Ltd 積層セラミック電子部品
JP2002217058A (ja) * 2001-01-22 2002-08-02 Murata Mfg Co Ltd コンデンサ装置およびコンデンサモジュール
JP2002313667A (ja) 2001-04-12 2002-10-25 Murata Mfg Co Ltd セラミック電子部品
US6780028B1 (en) * 2002-12-06 2004-08-24 Autosplice Systems Inc. Solder reserve transfer device and process
JP3883528B2 (ja) 2003-08-19 2007-02-21 Ｔｄｋ株式会社 電子部品
US7450366B2 (en) 2004-02-27 2008-11-11 Rohm Co., Ltd. Solid electrolytic capacitor
JP4382546B2 (ja) * 2004-03-22 2009-12-16 三菱電機株式会社 キャパシタの実装構造
US6924967B1 (en) * 2004-04-30 2005-08-02 Alan Devoe Noninterdigitated mounting for interdigitated stacked capacitor and method
JP2006024825A (ja) 2004-07-09 2006-01-26 Mitsubishi Electric Corp 電気部品
JPWO2006022257A1 (ja) 2004-08-25 2008-05-08 株式会社村田製作所 セラミック電子部品
JP2006073706A (ja) * 2004-09-01 2006-03-16 Kyocera Corp 太陽電池モジュール
JP4307363B2 (ja) 2004-11-25 2009-08-05 三菱電機株式会社 セラミック電子部品アセンブリ及びその実装構造
WO2006120779A1 (ja) * 2005-05-13 2006-11-16 Sanyo Electric Co., Ltd. 積層型固体電解コンデンサ及びその製造方法
ZA200802444B (en) * 2005-12-07 2009-09-30 Unilever Plc Improved detergent composition
TWI303543B (en) 2006-10-16 2008-11-21 Delta Electronics Inc Stacked electronic device and the clipping device thereof
KR101249989B1 (ko) * 2006-11-07 2013-04-01 삼성디스플레이 주식회사 광원 유닛과 이를 포함한 백라이트 유닛 및 액정표시장치
JP2008130954A (ja) 2006-11-24 2008-06-05 Maruwa Co Ltd 導電脚体付きチップ形積層コンデンサ及びその製造方法並びにチップ形積層コンデンサの導電脚体形成用前駆体
JP2008141079A (ja) * 2006-12-05 2008-06-19 Saga Sanyo Industries Co Ltd 電解コンデンサ
US7570479B2 (en) * 2007-10-23 2009-08-04 Gemmy Electronics Co., Ltd. Solid electrolytic capacitor
JP2009117450A (ja) * 2007-11-02 2009-05-28 Rohm Co Ltd モジュールおよびその製造方法
US20090147440A1 (en) * 2007-12-11 2009-06-11 Avx Corporation Low inductance, high rating capacitor devices
JP5176775B2 (ja) * 2008-06-02 2013-04-03 株式会社村田製作所 セラミック電子部品及びその製造方法
KR100994172B1 (ko) * 2008-07-23 2010-11-15 삼화콘덴서공업주식회사 커패시터 모듈
WO2010056312A2 (en) * 2008-11-14 2010-05-20 Amphenol Corporation Filtered power connector
JP5045649B2 (ja) * 2008-11-17 2012-10-10 株式会社村田製作所 セラミックコンデンサ及びそれを備えた電子部品
KR101018646B1 (ko) * 2008-12-09 2011-03-03 삼화콘덴서공업주식회사 Ｍｌｃｃ 모듈
JP5353251B2 (ja) * 2009-01-07 2013-11-27 Ｔｄｋ株式会社 積層コンデンサ及び積層コンデンサの実装構造
EP2411988B1 (en) 2009-03-26 2013-10-02 Kemet Electronics Corporation Leaded multi-layer ceramic capacitor with low esl and low esr
JP5003735B2 (ja) * 2009-08-18 2012-08-15 Ｔｄｋ株式会社 電子部品
CN102576802B (zh) 2009-09-18 2015-08-05 欧司朗光电半导体有限公司 有机电子器件和用于掺杂有机半导体基质材料的掺杂剂
US9502612B2 (en) * 2009-09-20 2016-11-22 Viagan Ltd. Light emitting diode package with enhanced heat conduction
US8075321B1 (en) * 2010-05-26 2011-12-13 Tyco Electronics Corporation Electrical connector for mounting a ribbon cable on a printed circuit board
US8902565B2 (en) 2010-05-26 2014-12-02 Kemet Electronics Corporation Electronic component termination and assembly by means of transient liquid phase sintering and polymer solder pastes
JP5663962B2 (ja) 2010-05-31 2015-02-04 ソニー株式会社 電池ユニット
JP2012023322A (ja) 2010-07-13 2012-02-02 Maruwa Co Ltd チップ型積層セラミックコンデンサ及びその製造方法
FR2964291B1 (fr) 2010-08-25 2012-08-24 Hispano Suiza Sa Circuit imprime comportant au moins un composant ceramique
DE102011107193A1 (de) * 2011-07-13 2013-01-17 Epcos Ag Elektrische Vorrichtung
US20130107419A1 (en) 2011-10-28 2013-05-02 Kemet Electronics Corporation Multilayered ceramic capacitor with improved lead frame attachment
US8988857B2 (en) 2011-12-13 2015-03-24 Kemet Electronics Corporation High aspect ratio stacked MLCC design
KR101306600B1 (ko) * 2011-12-27 2013-09-11 비나텍주식회사 표면 실장형 슈퍼 커패시터의 제조 방법
US8873219B2 (en) * 2012-06-26 2014-10-28 Kemet Electronics Corporation Method for stacking electronic components
US9042079B2 (en) 2012-08-24 2015-05-26 Tdk Corporation Ceramic electronic component
US10229785B2 (en) * 2012-12-06 2019-03-12 Kemet Electronics Corporation Multi-layered ceramic capacitor with soft leaded module
JP5821878B2 (ja) 2013-03-14 2015-11-24 株式会社村田製作所 電子部品
JP5716078B2 (ja) 2013-12-04 2015-05-13 太陽誘電株式会社 セラミックコンデンサ
JP2015195272A (ja) * 2014-03-31 2015-11-05 新光電気工業株式会社 半導体装置及び半導体装置の製造方法
CN106465548B (zh) * 2014-05-13 2019-04-02 株式会社村田制作所 树脂密封型模块
KR20160000953A (ko) * 2014-06-25 2016-01-06 삼성전자주식회사 기판 및 반도체 패키지의 제조방법
DE102015102866B4 (de) * 2015-02-27 2023-02-02 Tdk Electronics Ag Keramisches Bauelement, Bauelementanordnung und Verfahren zur Herstellung eines keramischen Bauelements
WO2017156246A1 (en) 2016-03-09 2017-09-14 Peerbridge Health, Inc. System and method for monitoring conditions of a subject based on wireless sensor data

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6081416A (en) 1998-05-28 2000-06-27 Trinh; Hung Lead frames for mounting ceramic electronic parts, particularly ceramic capacitors, where the coefficient of thermal expansion of the lead frame is less than that of the ceramic
DE19928190A1 (de) 1999-06-19 2001-01-11 Bosch Gmbh Robert Piezoaktor
DE102013108753A1 (de) 2013-08-13 2015-02-19 Epcos Ag Vielschichtbauelement mit einer Außenkontaktierung und Verfahren zur Herstellung eines Vielschichtbauelements mit einer Außenkontaktierung
DE102013108751A1 (de) 2013-08-13 2015-02-19 Wihag Fahrzeugbausysteme Gmbh Runge für ein Nutzfahrzeug

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