WO2006120779A1 - 積層型固体電解コンデンサ及びその製造方法 - Google Patents
積層型固体電解コンデンサ及びその製造方法 Download PDFInfo
- Publication number
- WO2006120779A1 WO2006120779A1 PCT/JP2005/023731 JP2005023731W WO2006120779A1 WO 2006120779 A1 WO2006120779 A1 WO 2006120779A1 JP 2005023731 W JP2005023731 W JP 2005023731W WO 2006120779 A1 WO2006120779 A1 WO 2006120779A1
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- Prior art keywords
- anode
- solid electrolytic
- anode mounting
- cathode
- electrolytic capacitor
- Prior art date
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 146
- 239000007787 solid Substances 0.000 title claims abstract description 59
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 238000000034 method Methods 0.000 title claims description 10
- 238000003466 welding Methods 0.000 claims abstract description 12
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 238000005452 bending Methods 0.000 claims description 7
- 230000001105 regulatory effect Effects 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 claims description 2
- 238000003475 lamination Methods 0.000 claims description 2
- 230000004048 modification Effects 0.000 description 14
- 238000012986 modification Methods 0.000 description 14
- 229920005989 resin Polymers 0.000 description 11
- 239000011347 resin Substances 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 239000003973 paint Substances 0.000 description 4
- 229920000123 polythiophene Polymers 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 239000007784 solid electrolyte Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 229920001940 conductive polymer Polymers 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920000414 polyfuran Polymers 0.000 description 2
- 229920000128 polypyrrole Polymers 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 241001676573 Minium Species 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- FOBPTJZYDGNHLR-UHFFFAOYSA-N diphosphorus Chemical compound P#P FOBPTJZYDGNHLR-UHFFFAOYSA-N 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/15—Solid electrolytic capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
- H01G9/012—Terminals specially adapted for solid capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/06—Mounting in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/14—Structural combinations or circuits for modifying, or compensating for, electric characteristics of electrolytic capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/26—Structural combinations of electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices with each other
Definitions
- the present invention relates to a multilayer solid electrolytic capacitor and a method for manufacturing the same.
- the multilayer solid electrolytic capacitor according to the present invention is used as a chip capacitor mounted on a printed board, for example.
- solid-state solid electrolytic capacitors those using dielectric polymers such as TCNQ complex salt polypyrrole, polythiophene, polyfuran, and polyaniline are attracting attention as solid electrolytes.
- solid electrolytic capacitors are required to be small in size and large in capacity.
- the technical trend of high frequency and high current has been strengthened, and low ESR of capacitors has been strongly demanded.
- a conventional multilayer solid electrolytic capacitor has been manufactured by the following manufacturing method.
- a dielectric oxide film 42, a solid electrolyte layer 43, a carbon layer 44, and a silver paint layer 45 are sequentially formed on a part of the surface of a metal 41 having a valve action (for example, aluminum). Then, a capacitor element 46 is produced.
- a plurality of capacitor elements 46 are formed on one surface of anode mounting portion 51 formed integrally with anode terminal 52 and cathode mounting portion 47 formed integrally with cathode terminal 48. Is placed in a laminated state and then covered with an exterior resin 54, or, as shown in FIG. 17, a plurality of capacitor elements 46 are laminated in both surfaces of the anode mounting part 51 and the cathode mounting part 47. After the placement, a laminated solid electrolytic capacitor was manufactured through a process of coating with the exterior resin 54.
- the capacitor element 46 When the capacitor element 46 is laminated, the capacitor element 46 is first transported and placed on the lead frame while holding the cathode portion (main body portion) 46b of the capacitor element 46, and then the capacitor element 46 After the anode part 46a of 46 and the anode terminal 52 are connected by resistance welding, the anode part 46a of the capacitor element 46 to be newly laminated on the anode part 46a of the connected capacitor element 46 is welded. On the other hand, the cathodes of the capacitor element 46 are connected to each other by a conductive adhesive 57. Continue. And it laminates
- Patent Document 1 Japanese Patent Laid-Open No. 11-135367
- the anode portion 46a has a thickness L10 100 ⁇ and the cathode portion 46b has a thickness L11 230 / im, as shown in FIG. Since the difference between the thickness L1 of the anode portion 46a and the thickness L2 of the cathode portion 46b increases, the capacitor element 46 tilts and mechanical stress increases. This is conspicuous in the capacitor element 46 disposed at the top (disposed away from the anode mounting portion 47). In addition, variations in connection strength due to welding also increase. Because of these powers, there has been a problem that LC defects frequently occur in multilayer solid electrolytic capacitors. In the stacked solid electrolytic capacitor shown in FIG. 16, only four capacitor elements 46 are stacked. However, when a larger number of capacitor elements 46 are stacked, the above-described problem is noticeable.
- the present invention suppresses mechanical stress at the time of welding, and reduces the LC failure by suppressing the inclination of the element for increasing the number of stacks.
- An object of the present invention is to realize an increase in capacitance by multi-layering. Means for solving the problem
- the invention according to claim 1 of the present invention is that an anode body having an anode portion, and a dielectric oxide film and a cathode layer are sequentially formed on the surface of the anode body.
- a plurality of capacitor elements having a cathode part are provided, the capacitor elements are arranged in a laminated state, and the anode part is welded and fixed to the anode mounting surface of the anode mounting part provided in the anode terminal.
- multiple anode mounting parts are provided.
- the anode mounting portions are arranged so as to be parallel to each other, and adjacent anode mounting portions are connected to each other by connecting portions.
- the capacitor elements to be stacked can be electrically connected to each anode mounting portion for each stacked group. Therefore, since the capacitor elements connected to each anode mounting portion are relatively reduced, the inclination of the capacitor elements arranged away from the anode mounting portion can be suppressed, and mechanical stress is alleviated. In addition, variations in connection strength due to welding are alleviated. For these reasons, it is possible to suppress the occurrence of LC defects in multilayer solid electrolytic capacitors.
- the capacitor elements to be stacked can be electrically connected to each anode mounting portion for each stack group, the current-carrying resistance in the capacitor is smaller than in the prior art, and the current-carrying state is improved. I can keep it.
- each anode mounting portion is connected to each other by a connecting portion, the overall strength increases, and each anode mounting portion can support a plurality of anode portions, so that stable holding is ensured. .
- the capacitor elements connected to any anode mounting part are stacked in an orderly manner without distortion.
- the multilayer solid electrolytic capacitor It is possible to prevent an increase in size.
- the invention according to claim 2 is the invention according to claim 1, wherein the cathode parts adjacent to each other of the capacitor element, the cathode mounting part electrically connected to the cathode terminal, and the cathode mounting part are provided.
- the capacitor element disposed on the cathode part is electrically connected with a conductive adhesive.
- Conductivity between the cathodes of a plurality of capacitor elements is obtained by adhering the cathode parts having the above-described configuration, and the cathode mounting part and the cathode part disposed on the cathode mounting part with a conductive adhesive. Sex can be ensured.
- the angles formed by the adjacent anode mounting portions and the connecting portions connecting the anode mounting portions are substantially perpendicular to each other. It is characterized by being regulated by
- An adjacent anode mounting portion having the above-described configuration and a connecting portion that connects these anode mounting portions. If each formed angle is substantially vertical, the two anode mounting parts and the connecting part are substantially U-shaped, so that the three parts can be firmly held and the anode part of the capacitor element is anode mounted. It can be stably laminated on the part.
- the invention of claim 4 is the invention of claims 1 to 3, wherein the adjacent anode mounting portion is
- the anode mounting surfaces are arranged so as to face each other, and the height of the connecting portion connecting the anode mounting portions having these anode mounting surfaces is the total of the capacitor elements existing between adjacent anode mounting portions. It is characterized by being defined so as to be approximately equal to the thickness.
- the height of the connecting portion for connecting the anode mounting portions having the anode mounting surface as described above is specified to be approximately equal to the total thickness of the capacitor elements existing between adjacent anode mounting portions. If this is done, the generation of voids between the capacitor elements can be suppressed, so that the capacitor elements can be laminated more stably.
- the invention described in claim 5 is the invention described in claims:! To 4, characterized in that a notch is formed at a boundary between the anode mounting portion and the connecting portion.
- the lead frame including the anode mounting portion and the connecting portion can be easily bent.
- the invention according to claim 6 is the anode mounting in which the anti-anode mounting surfaces of the adjacent anode mounting portions are arranged in contact with each other in the inventions according to claims 1 to 3, and the anode mounting surfaces are provided.
- the height of the connecting part that connects the parts is defined to be approximately equal to the total thickness of the two anode mounting parts.
- the anti-anode mounting surfaces of adjacent anode mounting portions are arranged in contact with each other, that is, the lead frame is folded over in an inverted state, so that a space required for bending is small. Therefore, the multilayer solid electrolytic capacitor can be miniaturized.
- the invention described in claim 7 is characterized in that, in the invention described in claim 6, a notch is formed in the central portion of the connecting portion.
- the lead frame can be easily bent.
- the invention according to claim 8 is the invention according to claims:! To 7, in which the restriction wall in the same direction as the stacking direction of the capacitor elements is formed at the boundary of the anode terminal with the anode mounting portion. It is characterized in that a part is formed.
- the regulation wall portion is formed in the same direction as the capacitor element lamination direction on the anode terminal as described above, that is, if the lead frame is bent, the strength of the lead frame increases. Therefore, the capacitor element can be held more firmly. The capacitor element can be easily positioned with respect to the lead frame.
- the invention according to claim 10 is the invention according to claims 2 to 9, wherein the number of the cathode mounting portions is the same as the number of the anode mounting portions.
- the capacitor element can be held more firmly.
- the invention according to claim 11 of the present invention is characterized in that a dielectric oxide film and a cathode layer are sequentially formed on a part of the surface of the anode body, thereby
- a lead frame having a plurality of anode mounting portions and adjacent anode mounting portions connected to each other by a connecting portion is manufactured.
- the multilayer solid electrolytic capacitor of claim 1 can be easily produced.
- the length of the connecting portion exists between two anode mounting portions connected to the connecting portion.
- a lead frame was fabricated so that it was approximately equal to the total thickness of the capacitor element, and the above
- the lead frame is folded so that the two adjacent anode mounting surfaces face each other.
- the multilayer solid electrolytic capacitor of claim 4 can be easily produced.
- the length of the connecting portion is substantially equal to the total thickness of the two anode mounting portions.
- the lead frame is manufactured, and in the third step, the lead frame is bent so that the two anti-anode mounting surfaces that are in contact with each other are arranged in contact with each other.
- the multilayer solid electrolytic capacitor of claim 6 can be easily produced.
- the mechanical stress at the time of welding can be suppressed, and the inclination of the element can be suppressed for increasing the number of stacked layers, thereby reducing the LC failure.
- the electrostatic capacity it is possible to increase the electrostatic capacity by increasing the number of layers while improving the yield.
- multilayer solid electrolytic capacitor and a method for manufacturing the same according to the present invention will be described in detail with reference to FIGS. 1 to 10.
- the multilayer solid electrolytic capacitor and the method for manufacturing the same according to the present invention are not limited to those shown in the following best modes, and can be implemented with appropriate modifications within the scope without changing the gist thereof. Is.
- the multilayer solid electrolytic capacitor of the present invention has an anode in which a plurality of capacitor elements 30 in a laminated state are covered with a synthetic resin housing, that is, an exterior resin 8, and connected to a cathode terminal 11.
- the mounting portions 7a and 7b are connected to the anode portion 3 Oa of the capacitor element 30, while the cathode mounting portion 6 connected to the cathode terminal 10 is connected to the cathode portion (main body portion) 30b of the capacitor element 30. It is structured to be connected. Specifically, it is as follows.
- the capacitor element 30 is a metal having a valve action (in this example, an Al A portion of the surface of the anode body 31 made of (minium), a dielectric oxide film 32, a solid electrolyte layer 33 made of a polythiophene-based conductive polymer, a carbon layer 34, a cathode portion 30b made of a silver paint layer 35, and And an anode part 30a from which the anode body 31 is exposed.
- a valve action in this example, an Al A portion of the surface of the anode body 31 made of (minium), a dielectric oxide film 32, a solid electrolyte layer 33 made of a polythiophene-based conductive polymer, a carbon layer 34, a cathode portion 30b made of a silver paint layer 35, and And an anode part 30a from which the anode body 31 is exposed.
- the two anode mounting portions 7a, 7b for laminating and fixing the anode portion 30a of the capacitor element 30 are arranged to face each other with a predetermined interval, and the anode mounting portions 7a, 7b are connected by the connecting portion 9, respectively.
- the angles formed by the anode mounting portion 7a and the connecting portion 9, and the anode mounting portion 7b and the connecting portion 9 are configured to be substantially perpendicular to each other, and thereby, the anode mounting portions 7a and 7b and the connecting portion 9 are The shape created by is substantially U-shaped.
- a group of anode parts 30a of the plurality of capacitor elements 30 are laminated and fixed to one anode mounting part 7a in a conductive state, and the other group of anode parts 30a is mounted on the other anode.
- the parts 7b are laminated and fixed to each other in a conductive state.
- the anode portions 30a of the four capacitor elements 30 and the anode portions 30a adjacent to the anode mounting portion 7a and the anode mounting portion 7a are fixed by welding, while the anode portions 30a of the four capacitor elements 30 are the same.
- the anode 30a and the anode mounting portion 7b adjacent to the first and second anode mounting portions 7b are welded and fixed.
- the anode mounting portions 7a and 7b are connected to an anode terminal 11, respectively, and a portion of one anode terminal 11 is exposed from the exterior resin 8.
- the anode terminal 11 that does not extend to the outside of the capacitor (the anode terminal 11 positioned on the upper side in FIG. 1) and the anode terminal 11 that extends to the outside of the capacitor ( In FIG. 1, the bent surface 27b of the anode terminal 11) located below is welded and fixed, thereby improving the strength of the capacitor.
- the cathode portion 30b of the capacitor element 30 is laminated and integrated with each other in a conductive state, and the cathode portion 30b on the cathode mounting portion 6 and the cathode mounting portion 6 are connected in a conductive state.
- the conductive adhesive 25 is interposed between the cathode portions 30b and between the cathode portions 30b on the cathode mounting portion 6 and the cathode mounting portion 6.
- the cathode mounting portion 6 is integrally formed with a cathode terminal 10 partially exposed from the exterior resin 8.
- the capacitor element 30 is attached to the lead frame 12, and the laminated solid One of the characteristics of the process of forming electrolytic capacitors is.
- the lead frame structure is shown below.
- FIG. 3 is a plan view of the metal plate 29 that becomes the lead frame 12.
- a metal plate 29 containing copper as a main component is punched to open the opening 16.
- the anode part 30a of the capacitor element 30 is connected between the connecting parts 15 and 15 extending linearly in the part other than the opening 16 (the remaining part).
- the cathode terminal 10 that connects the cathode mounting portion 6 and the side edge portion of the metal plate 29 are arranged.
- one multilayer solid electrolytic capacitor is manufactured by the lead frame 20 existing between the connecting portions 15 and 15.
- a first bent portion 17a that bends upward at about 90 ° is formed at the boundary portion between the cathode terminal 10 and the cathode mounting portion 6, and only a distance L1 is formed from the first bent portion 17a.
- a second bent portion 17b that bends outward at about 90 ° is formed at the distant portion.
- a first bent portion 18a that bends upward at about 90 ° is formed at the boundary portion of the anode terminal 11 with the anode mounting portions 7a and 7b, and the first bent portion 18a is separated from the first bent portion 18a by a distance L2.
- the capacitor element 30 (four in this embodiment) mounted on the anode mounting portion 7a and the cathode mounting portion 6 is configured. ) In the total thickness of the cathode portion 30b or the length substantially matching the total thickness of the cathode portion 30b in the capacitor element 30 (four in this embodiment) mounted on the anode mounting portion 7b. It is configured as follows.
- notches 13 that facilitate bending of the lead frame 12 are formed at the boundary between the anode mounting portion 7a and the connecting portion 9 and at the boundary between the anode mounting portion 7b and the connecting portion 9.
- the distance L3 between 13 is configured to be approximately twice the distance L1.
- the lead frame 12 has an opening in the vicinity of the restriction wall portion 17c on the bent surface 27c of the cathode terminal 10, and in the vicinity of the restriction wall portion 18c in the bent surfaces 27a and 27b of the anode terminal 11. 28 is formed, and these openings 28 naturally reduce the weight by punching, but when stacking the capacitor element 30, the centers of both ends thereof are aligned with the openings 28 so that the center can be easily formed.
- the overlapping position at the time of bending can be accurately determined. Further, since the resin enters the opening 28 when the exterior resin 8 is filled, the bond between the lead frame and the exterior resin 8 is strengthened.
- the bent surfaces 27a and 27b form contact surfaces with each other to stabilize the U-shape formation. It is possible to prevent an unexpected load from being applied to one side of the denser element 30.
- an aluminum foil is cut into a plate shape to form an anode body 31, which is subjected to electrolytic conversion treatment in an aqueous solution of phosphoric acid or adipic acid of 0.001 to 2 wt%, and the surface is treated with A100
- a device is created by forming a dielectric layer 32.
- the element is immersed in a chemical polymerization solution made of 1-butanol, and a cathode layer 33 made of polythiophene is formed on the dielectric layer 32. Thereafter, a carbon layer 34 and a silver paint layer 35 are sequentially formed on the cathode layer 33 to complete a capacitor element (aluminum single plate element) 30.
- the capacitor element 30 is placed on the lead frame 12.
- the anode part 30a of the capacitor element 30 and the anode mounting parts 7a and 7b of the lead frame 12 and the anode part 30a are electrically connected by resistance welding, while the cathode part 30b of the capacitor element 30 and the lead are connected to each other.
- the cathode mounting part 6 of the frame 12 and the cathode part 30b are electrically connected by a conductive adhesive.
- the lead frame 12 shown in FIG. 7 has the same configuration as the above-described best mode except that the cathode mounting portions 6 are provided in a number corresponding to the anode mounting portions 7b. Note that members having the same functions as those in the best mode are given the same reference numerals. Specifically, the cathode mounting portion 6 is juxtaposed with the same shape at a predetermined interval, similarly to the juxtaposed structure of the anode mounting portions 7a and 7b. In such a lead frame 12, as shown in FIG. 8, in the upper four capacitor elements 30 among the eight capacitor elements 30, one cathode mounting portion is provided in the same manner as the lower four capacitor elements 30. 6 will be electrically connected.
- both the anode and the cathode of the capacitor element 30 can be stably received when the capacitor element 30 is stacked and when the lead frame 12 is bent.
- the cathode mounting portions 6 and 6 are also connected to the anode mounting portion by the connecting portion 21 in the same manner as the anode mounting portions 7a and 7b, and the lead frame between the adjacent cathode mounting portions 6 and 6 is connected. Even if the structure is such that 12 is bent in a U shape, it is acceptable. With such a structure, the above actions and effects are further exhibited.
- the configuration is the same as the best mode described above except that only one notch 13a is provided between the anode mounting portions 7a and 7b of the lead frame 12.
- the direction is opposite to that of the best mode, that is, the inside out.
- the anode mounting portion 7a and the anode mounting portion 7b are extremely short (a length equivalent to the total thickness of the two anode mounting portions 7a and 7b). It is connected via the connecting part 9.
- the lead frame is provided with one more cathode mounting part 6 and one anode mounting part 7b (that is, three cathode mounting parts and three anode mounting parts are provided).
- the configuration is the same as 1.
- one anode mounting portion 7b is folded back in the same direction as in the first modification, and the other anode mounting portion 7b is turned in the opposite direction to the first modification. Wrapping. With such a structure, a larger number of capacitor elements 30 can be mounted.
- the number of consecutive three anode mounting portions 7a, 7b, 7b can be increased within the range allowed by design, if necessary, whether it is four or five. In this case, the folding directions are sequentially reversed.
- notches 13 that facilitate bending of the lead frame 12 are formed at the boundary between the anode mounting portion 7a and the connecting portion 9 and the boundary between the anode mounting portion 7b and the connecting portion 9.
- the notch 13 is not always necessary for the configuration of the present invention.
- the force that provides the cathode-side regulating wall portion 17c and the anode-side regulating wall portion 18c are not necessarily required for the configuration of the present invention. .
- the metal having a valve action is not limited to the above aluminum, but may be tantalum, niobium or the like.
- the solid electrolyte layer is not limited to polythiophene-based conductive polymer, but may be polypyrrole-based, poly-alloy. It may be a conductive polymer such as diphosphorus or polyfuran or dimanganese manganese.
- the present invention is used as, for example, a chip capacitor mounted on a printed circuit board, but can be used in various other fields.
- FIG. 1 is a vertical side view of a multilayer solid electrolytic capacitor according to the present invention.
- FIG. 2 is a longitudinal side view of a capacitor element used in the multilayer solid electrolytic capacitor according to the present invention.
- FIG. 3 is a plan view of a lead frame of a multilayer solid electrolytic capacitor that is useful in the present invention.
- FIG. 4 is a perspective view of the main part of the lead frame of the multilayer solid electrolytic capacitor of FIG. 3 that is useful for the present invention.
- FIG. 5 is a perspective view showing one step of a method for producing a multilayer solid electrolytic capacitor according to the present invention.
- FIG. 6 is a perspective view showing one step of a method for producing a multilayer solid electrolytic capacitor according to the present invention.
- FIG. 7 is a plan view of a lead frame used in the multilayer solid electrolytic capacitor of Modification 1.
- FIG. 8 is a perspective view showing one step of a manufacturing method of the multilayer solid electrolytic capacitor of Modification 1.
- FIG. 9 is a plan view of another embodiment of a lead frame used in the multilayer solid electrolytic capacitor of Modification 1.
- FIG. 10 is a plan view of a lead frame used in the multilayer solid electrolytic capacitor of Modification 2.
- FIG. 11 is a perspective view showing one step of a manufacturing method of the multilayer solid electrolytic capacitor of Modification 2.
- FIG. 12 is a longitudinal side view showing one step of a method for producing the multilayer solid electrolytic capacitor of Modification 2.
- FIG. 13 is a plan view of a lead frame used in the multilayer solid electrolytic capacitor of Modification 3.
- FIG. 14 is a perspective view showing one step of a manufacturing method of the multilayer solid electrolytic capacitor of Modification 3.
- FIG. 15 is a longitudinal sectional view of a capacitor element used in a conventional multilayer solid electrolytic capacitor.
- FIG. 16 is a longitudinal sectional view of a multilayer solid electrolytic capacitor showing the prior art.
- FIG. 17 is a longitudinal sectional view of another aspect of the multilayer solid electrolytic capacitor showing the prior art.
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- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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CN2005800497761A CN101176172B (zh) | 2005-05-13 | 2005-12-26 | 层叠型固体电解电容器及其制造方法 |
KR1020077026288A KR101117041B1 (ko) | 2005-05-13 | 2005-12-26 | 적층형 고체 전해 컨덴서 및 그 제조 방법 |
US11/914,184 US7916457B2 (en) | 2005-05-13 | 2005-12-26 | Multi-layered solid electrolytic capacitor and method of manufacturing same |
JP2007526813A JP4688875B2 (ja) | 2005-05-13 | 2005-12-26 | 積層型固体電解コンデンサ及びその製造方法 |
Applications Claiming Priority (2)
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JP2005140992 | 2005-05-13 | ||
JP2005-140992 | 2005-05-13 |
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WO2006120779A1 true WO2006120779A1 (ja) | 2006-11-16 |
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PCT/JP2005/023731 WO2006120779A1 (ja) | 2005-05-13 | 2005-12-26 | 積層型固体電解コンデンサ及びその製造方法 |
Country Status (6)
Country | Link |
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US (1) | US7916457B2 (ja) |
JP (1) | JP4688875B2 (ja) |
KR (1) | KR101117041B1 (ja) |
CN (1) | CN101176172B (ja) |
TW (1) | TWI292164B (ja) |
WO (1) | WO2006120779A1 (ja) |
Cited By (4)
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JP2009224627A (ja) * | 2008-03-18 | 2009-10-01 | Sanyo Electric Co Ltd | 固体電解コンデンサ及びその製造方法 |
US20100103591A1 (en) * | 2008-10-28 | 2010-04-29 | Sanyo Electric Co., Ltd. | Solid electrolytic capacitor and method of manufacturing same |
WO2010076883A1 (ja) * | 2008-12-29 | 2010-07-08 | 昭和電工株式会社 | 固体電解コンデンサ |
CN103456513A (zh) * | 2013-02-06 | 2013-12-18 | 钰邦电子(无锡)有限公司 | 用于降低等效串联电阻的固态电解电容器封装结构及其制作方法 |
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US20130258555A1 (en) * | 2012-04-02 | 2013-10-03 | Apaq Technology Co., Ltd. | Capacitor unit and stacked solid electrolytic capacitor having the same |
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TWM616164U (zh) | 2021-06-24 | 2021-08-21 | 立隆電子工業股份有限公司 | 堆疊型鋁電解電容器 |
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- 2005-12-26 US US11/914,184 patent/US7916457B2/en not_active Expired - Fee Related
- 2005-12-26 KR KR1020077026288A patent/KR101117041B1/ko not_active IP Right Cessation
- 2005-12-26 CN CN2005800497761A patent/CN101176172B/zh active Active
- 2005-12-26 JP JP2007526813A patent/JP4688875B2/ja active Active
- 2005-12-26 WO PCT/JP2005/023731 patent/WO2006120779A1/ja active Application Filing
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Also Published As
Publication number | Publication date |
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US7916457B2 (en) | 2011-03-29 |
KR101117041B1 (ko) | 2012-03-19 |
JP4688875B2 (ja) | 2011-05-25 |
JPWO2006120779A1 (ja) | 2008-12-18 |
TWI292164B (en) | 2008-01-01 |
CN101176172B (zh) | 2012-09-26 |
CN101176172A (zh) | 2008-05-07 |
TW200641941A (en) | 2006-12-01 |
US20090080146A1 (en) | 2009-03-26 |
KR20080010413A (ko) | 2008-01-30 |
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