JP2018526244A - シート及び担体を有する物品及び方法 - Google Patents
シート及び担体を有する物品及び方法 Download PDFInfo
- Publication number
- JP2018526244A JP2018526244A JP2017566697A JP2017566697A JP2018526244A JP 2018526244 A JP2018526244 A JP 2018526244A JP 2017566697 A JP2017566697 A JP 2017566697A JP 2017566697 A JP2017566697 A JP 2017566697A JP 2018526244 A JP2018526244 A JP 2018526244A
- Authority
- JP
- Japan
- Prior art keywords
- carrier
- sheet
- binding
- modification layer
- binding surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 31
- 230000004048 modification Effects 0.000 claims abstract description 165
- 238000012986 modification Methods 0.000 claims abstract description 165
- 239000000463 material Substances 0.000 claims abstract description 46
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 13
- 238000000151 deposition Methods 0.000 claims abstract description 12
- 238000004519 manufacturing process Methods 0.000 claims abstract description 8
- 230000003746 surface roughness Effects 0.000 claims description 71
- 239000011521 glass Substances 0.000 claims description 33
- 239000010410 layer Substances 0.000 description 259
- 229920000642 polymer Polymers 0.000 description 19
- 239000001257 hydrogen Substances 0.000 description 10
- 229910052739 hydrogen Inorganic materials 0.000 description 10
- 238000005411 Van der Waals force Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- 239000000758 substrate Substances 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 230000035515 penetration Effects 0.000 description 5
- 235000019592 roughness Nutrition 0.000 description 5
- 238000011282 treatment Methods 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 230000003993 interaction Effects 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 229910002808 Si–O–Si Inorganic materials 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 229910000323 aluminium silicate Inorganic materials 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 2
- 239000002241 glass-ceramic Substances 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 125000005372 silanol group Chemical group 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- OHMHBGPWCHTMQE-UHFFFAOYSA-N 2,2-dichloro-1,1,1-trifluoroethane Chemical compound FC(F)(F)C(Cl)Cl OHMHBGPWCHTMQE-UHFFFAOYSA-N 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- XPDWGBQVDMORPB-UHFFFAOYSA-N Fluoroform Chemical compound FC(F)F XPDWGBQVDMORPB-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 229910003481 amorphous carbon Inorganic materials 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- KYKAJFCTULSVSH-UHFFFAOYSA-N chloro(fluoro)methane Chemical compound F[C]Cl KYKAJFCTULSVSH-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000011243 crosslinked material Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 238000009616 inductively coupled plasma Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
- C03C15/02—Surface treatment of glass, not in the form of fibres or filaments, by etching for making a smooth surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
- B32B17/10036—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising two outer glass sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
- B32B17/10128—Treatment of at least one glass sheet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
- B32B17/10559—Shape of the cross-section
- B32B17/10577—Surface roughness
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/28—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material
- C03C17/32—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material with synthetic or natural resins
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
- C03C27/10—Joining glass to glass by processes other than fusing with the aid of adhesive specially adapted for that purpose
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2315/00—Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
- B32B2315/08—Glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/10—Deposition methods
- C03C2218/15—Deposition methods from the vapour phase
- C03C2218/152—Deposition methods from the vapour phase by cvd
- C03C2218/153—Deposition methods from the vapour phase by cvd by plasma-enhanced cvd
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/30—Aspects of methods for coating glass not covered above
- C03C2218/32—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/30—Aspects of methods for coating glass not covered above
- C03C2218/355—Temporary coating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Laminated Bodies (AREA)
- Joining Of Glass To Other Materials (AREA)
Abstract
Description
(3)を(1)に代入して、付着エネルギー(W)を次のように近似することができる。
物品であって、
担体結合表面を有する担体と、
シート結合表面を有するシートと、
前記担体結合表面及び前記シート結合表面の少なくとも一方に配置された表面改質層と、を備え、前記表面改質層が、プラズマ重合材料を含み、前記プラズマ重合材料が、前記担体結合表面及び前記シート結合表面の前記少なくとも一方を平坦化し、前記担体が前記シートに一時的に結合されるように、前記担体結合表面及び前記シート結合表面が、前記表面改質層に結合されて成る物品。
前記平坦化された担体結合表面及び前記平坦化されたシート結合表面の前記少なくとも一方が、0.8nm未満の表面粗さRqを有する、実施形態1記載の物品。
前記担体結合表面及び前記シート結合表面の前記少なくとも一方が、約0.8nm〜約5.0nmの範囲内の表面粗さRqを有する、実施形態1又は2記載の物品。
前記担体結合表面及び前記シート結合表面の前記少なくとも一方が、約2.0nmを超える表面粗さRqを有する、実施形態1又は2記載の物品。
前記表面改質層が、前記担体結合表面及び前記シート結合表面の少なくとも一方の少なくとも一部が、前記表面改質層に侵入できるように構成された、弾性率及び塑性の少なくとも一方を有する、実施形態1〜4のいずれかに記載の物品。
前記弾性率が、約0.6GPa〜約20GPaの範囲である、実施形態5記載の物品。
前記担体及び前記シートの少なくとも一方が、ガラスを含んで成る、実施形態1〜6のいずれかに記載の物品。
前記担体が、約200μm〜3mmの厚さを有する、実施形態1〜7のいずれかに記載の物品。
前記シートが約300μm以下の厚さを有する、実施形態1〜8のいずれかに記載の物品。
前記表面改質層が、約0.1nm〜約100nmの範囲内の厚さを有する、実施形態1〜9のいずれかに記載の物品。
物品であって、
担体結合表面を有する担体と、
シート結合表面を有するシートと、
前記担体結合表面に配置された担体表面改質層及び前記シート結合表面に配置されたシート表面改質層の少なくとも一方と、
を備え、前記担体表面改質層及び前記シート表面改質層の前記少なくとも一方が、プラズマ重合材料を含み、前記プラズマ重合材料が、前記担体結合表面及び前記シート結合表面の前記少なくとも一方を平坦化し、前記担体が前記シートに一時的に結合されるように、前記担体結合表面及び前記シート結合表面が、前記担体表面改質層及び前記シート表面改質層の前記少なくとも一方に結合されて成る物品。
前記担体表面改質層及び前記シート表面改質層の前記少なくとも一方に関し、前記物品が前記担体表面改質層のみを有し、前記シート結合表面の少なくとも一部が、前記担体表面改質層に侵入して成る、実施形態11記載の物品。
前記担体表面改質層及び前記シート表面改質層の前記少なくとも一方に関し、前記物品が前記シート表面改質層のみを有し、前記担体結合表面の少なくとも一部が、前記シート表面改質層に侵入して成る、実施形態11記載の物品。
前記担体表面改質層及び前記シート表面改質層の前記少なくとも一方に関し、前記物品が、前記担体表面改質層及び前記シート表面改質層の両方を有し、(i)前記シート結合表面の少なくとも一部が、前記担体表面改質層に侵入して成る、及び(ii)前記担体結合表面の少なくとも一部が、前記シート表面改質層に侵入して成るかの少なくとも一方である、実施形態11記載の物品。
前記平坦化された担体結合表面及び前記平坦化されたシート結合表面の前記少なくとも一方が、約0.8nm未満の表面粗さRqを有する、実施形態11〜14のいずれかに記載の物品。
前記担体結合表面及び前記シート結合表面の前記少なくとも一方が、約0.8nm〜約5.0nmの範囲内の表面粗さRqを有する、実施形態11〜15のいずれかに記載の物品。
物品を製造する方法であって、
担体の担体結合表面及びシートのシート結合表面の少なくとも一方に、表面改質層を蒸着するステップであって、前記表面改質層がプラズマ重合材料を含み、前記プラズマ重合材料を蒸着することによって、前記担体結合表面及び前記シート結合表面の前記少なくとも一方が平坦化される、ステップと、
前記担体が前記シートに一時的に結合されるように、前記担体結合表面及び前記シート結合表面を、前記表面改質層に結合するステップと、
を備えた方法。
前記平坦化された担体結合表面及び前記平坦化されたシート結合表面の前記少なくとも一方が、約0.8nm未満の表面粗さRqを有する、実施形態17記載の方法。
前記担体結合表面及び前記シート結合表面の前記少なくとも一方が、約0.8nm〜約5.0nmの範囲内の表面粗さRqを有する、実施形態17又は18記載の方法。
前記表面改質層の弾性率及び塑性の少なくとも一方によって、前記担体結合表面及びシート結合表面の少なくとも一方の少なくとも一部が、前記表面改質層に侵入できるようにする、実施形態17〜19のいずれかに記載の方法。
101 物品厚さ
110 担体
111 担体厚さ
115 担体結合表面
120 シート
121 シート厚さ
125 シート結合表面
130 表面改質層
131 表面改質層厚さ
Claims (14)
- 物品であって、
担体結合表面を有する担体と、
シート結合表面を有するシートと、
前記担体結合表面及び前記シート結合表面の少なくとも一方に配置された表面改質層と、を備え、前記表面改質層が、プラズマ重合材料を含み、前記プラズマ重合材料が、前記担体結合表面及び前記シート結合表面の前記少なくとも一方を平坦化し、前記担体が前記シートに一時的に結合されるように、前記担体結合表面及び前記シート結合表面が、前記表面改質層に結合されて成ることを特徴とする物品。 - 物品であって、
担体結合表面を有する担体と、
シート結合表面を有するシートと、
前記担体結合表面に配置された担体表面改質層及び前記シート結合表面に配置されたシート表面改質層の少なくとも一方と、
を備え、前記担体表面改質層及び前記シート表面改質層の前記少なくとも一方が、プラズマ重合材料を含み、前記プラズマ重合材料が、前記担体結合表面及び前記シート結合表面の前記少なくとも一方を平坦化し、前記担体が前記シートに一時的に結合されるように、前記担体結合表面及び前記シート結合表面が、前記担体表面改質層及び前記シート表面改質層の前記少なくとも一方に結合されて成ることを特徴とする物品。 - 前記表面改質層が、前記担体結合表面及び前記シート結合表面の少なくとも一方の少なくとも一部が、前記表面改質層に侵入できるように構成された、弾性率及び塑性の少なくとも一方を有することを特徴とする、請求項1又は2記載の物品。
- 前記弾性率が、約0.6GPa〜約20GPaの範囲であることを特徴とする、請求項3記載の物品。
- 前記担体及び前記シートの少なくとも一方が、ガラスを含んで成ることを特徴とする、請求項1〜4いずれか1項記載の物品。
- 前記担体が、約200μm〜3mmの厚さを有することを特徴とする、請求項1〜5いずれか1項記載の物品。
- 前記シートが約300μm以下の厚さを有することを特徴とする、請求項1〜6いずれか1項記載の物品。
- 前記表面改質層が、約0.1nm〜約100nmの範囲内の厚さを有することを特徴とする、請求項1〜7いずれか1項記載の物品。
- 前記平坦化された担体結合表面及び前記平坦化されたシート結合表面の前記少なくとも一方が、約0.8nm未満の表面粗さRqを有することを特徴とする、請求項1〜8いずれか1項記載の物品。
- 前記担体結合表面及び前記シート結合表面の前記少なくとも一方が、約0.8nm〜約5.0nmの範囲内の表面粗さRqを有することを特徴とする、請求項1〜9いずれか1項記載の物品。
- 物品を製造する方法であって、
担体の担体結合表面及びシートのシート結合表面の少なくとも一方に、表面改質層を蒸着するステップであって、前記表面改質層がプラズマ重合材料を含み、前記プラズマ重合材料を蒸着することによって、前記担体結合表面及び前記シート結合表面の前記少なくとも一方が平坦化される、ステップと、
前記担体が前記シートに一時的に結合されるように、前記担体結合表面及び前記シート結合表面を、前記表面改質層に結合するステップと、
を備えたことを特徴とする方法。 - 前記平坦化された担体結合表面及び前記平坦化されたシート結合表面の前記少なくとも一方が、約0.8nm未満の表面粗さRqを有することを特徴とする、請求項11記載の方法。
- 前記担体結合表面及び前記シート結合表面の前記少なくとも一方が、約0.8nm〜約5.0nmの範囲内の表面粗さRqを有することを特徴とする、請求項11又は12記載の方法。
- 前記表面改質層の弾性率及び塑性の少なくとも一方によって、前記担体結合表面及びシート結合表面の少なくとも一方の少なくとも一部が、前記表面改質層に侵入できることを特徴とする、請求項11〜13いずれか1項記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201562185095P | 2015-06-26 | 2015-06-26 | |
US62/185,095 | 2015-06-26 | ||
PCT/US2016/038663 WO2016209897A1 (en) | 2015-06-26 | 2016-06-22 | Methods and articles including a sheet and a carrier |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018526244A true JP2018526244A (ja) | 2018-09-13 |
JP7106276B2 JP7106276B2 (ja) | 2022-07-26 |
Family
ID=56360509
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017566697A Active JP7106276B2 (ja) | 2015-06-26 | 2016-06-22 | シート及び担体を有する物品及び方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US11905201B2 (ja) |
EP (1) | EP3313799B1 (ja) |
JP (1) | JP7106276B2 (ja) |
KR (1) | KR102524620B1 (ja) |
CN (2) | CN117534339A (ja) |
TW (1) | TWI723025B (ja) |
WO (1) | WO2016209897A1 (ja) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10543662B2 (en) | 2012-02-08 | 2020-01-28 | Corning Incorporated | Device modified substrate article and methods for making |
US10014177B2 (en) | 2012-12-13 | 2018-07-03 | Corning Incorporated | Methods for processing electronic devices |
US9340443B2 (en) | 2012-12-13 | 2016-05-17 | Corning Incorporated | Bulk annealing of glass sheets |
US10086584B2 (en) | 2012-12-13 | 2018-10-02 | Corning Incorporated | Glass articles and methods for controlled bonding of glass sheets with carriers |
TWI617437B (zh) | 2012-12-13 | 2018-03-11 | 康寧公司 | 促進控制薄片與載體間接合之處理 |
US10510576B2 (en) | 2013-10-14 | 2019-12-17 | Corning Incorporated | Carrier-bonding methods and articles for semiconductor and interposer processing |
KR102353030B1 (ko) | 2014-01-27 | 2022-01-19 | 코닝 인코포레이티드 | 얇은 시트와 캐리어의 제어된 결합을 위한 물품 및 방법 |
SG11201608442TA (en) | 2014-04-09 | 2016-11-29 | Corning Inc | Device modified substrate article and methods for making |
KR102573207B1 (ko) | 2015-05-19 | 2023-08-31 | 코닝 인코포레이티드 | 시트와 캐리어의 결합을 위한 물품 및 방법 |
CN117534339A (zh) | 2015-06-26 | 2024-02-09 | 康宁股份有限公司 | 包含板材和载体的方法和制品 |
CN108353507B (zh) | 2015-10-30 | 2020-11-27 | 康宁股份有限公司 | 用于加工与第二基材粘结的第一基材的方法 |
TW201825623A (zh) | 2016-08-30 | 2018-07-16 | 美商康寧公司 | 用於片材接合的矽氧烷電漿聚合物 |
TWI821867B (zh) | 2016-08-31 | 2023-11-11 | 美商康寧公司 | 具以可控制式黏結的薄片之製品及製作其之方法 |
WO2019036710A1 (en) | 2017-08-18 | 2019-02-21 | Corning Incorporated | TEMPORARY BINDING USING POLYCATIONIC POLYMERS |
CN111372903A (zh) | 2017-11-20 | 2020-07-03 | 康宁股份有限公司 | 使用阳离子表面活性剂和/或有机盐的玻璃对的临时结合 |
JP7431160B2 (ja) | 2017-12-15 | 2024-02-14 | コーニング インコーポレイテッド | 基板を処理するための方法および結合されたシートを含む物品を製造するための方法 |
KR102603870B1 (ko) * | 2018-02-01 | 2023-11-21 | 삼성디스플레이 주식회사 | 봉지 구조, 상기 봉지 구조를 갖는 유기발광표시장치 및 이의 제조방법 |
CN114920468B (zh) * | 2022-06-01 | 2023-12-05 | 北方夜视技术股份有限公司 | 一种硼硅玻璃亲水性键合方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014093776A1 (en) * | 2012-12-13 | 2014-06-19 | Corning Incorporated | Glass articles and methods for controlled bonding of glass sheets with carriers |
WO2014093775A1 (en) * | 2012-12-13 | 2014-06-19 | Corning Incorporated | Glass and methods of making glass articles |
WO2015054098A1 (en) * | 2013-10-07 | 2015-04-16 | Corning Incorporated | Glass articles and methods for controlled bonding of glass sheets with carriers |
Family Cites Families (378)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1082116A (en) | 1964-09-03 | 1967-09-06 | Owens Illinois Inc | Organopolysiloxane resins and their production |
US3722181A (en) | 1970-05-22 | 1973-03-27 | Du Pont | Chromatographic packing with chemically bonded organic stationary phases |
FR2110495A5 (ja) | 1970-10-19 | 1972-06-02 | Michelin & Cie | |
IE35508B1 (en) | 1971-08-11 | 1976-03-03 | Intercontinental Chem Co Ltd | Method of forming adhesive bonds between surfaces |
US4096315A (en) | 1976-12-15 | 1978-06-20 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Process for producing a well-adhered durable optical coating on an optical plastic substrate |
GB1583544A (en) | 1977-07-25 | 1981-01-28 | Uop Inc | Metal-clad laminates |
US4179324A (en) | 1977-11-28 | 1979-12-18 | Spire Corporation | Process for fabricating thin film and glass sheet laminate |
US4397722A (en) | 1981-12-31 | 1983-08-09 | International Business Machines Corporation | Polymers from aromatic silanes and process for their preparation |
US4599243A (en) | 1982-12-23 | 1986-07-08 | International Business Machines Corporation | Use of plasma polymerized organosilicon films in fabrication of lift-off masks |
US4849284A (en) | 1987-02-17 | 1989-07-18 | Rogers Corporation | Electrical substrate material |
US4822466A (en) | 1987-06-25 | 1989-04-18 | University Of Houston - University Park | Chemically bonded diamond films and method for producing same |
US4810326A (en) | 1987-08-31 | 1989-03-07 | International Business Machines Corporation | Interlaminate adhesion between polymeric materials and electrolytic copper surfaces |
US5357726A (en) | 1989-02-02 | 1994-10-25 | Chemfab Corporation | Composite materials for structural end uses |
US5141800A (en) | 1989-02-02 | 1992-08-25 | Chemical Fabrics Corporation | Method of making laminated PTFE-containing composites and products thereof |
US4990462A (en) | 1989-04-12 | 1991-02-05 | Advanced Micro Devices, Inc. | Method for coplanar integration of semiconductor ic devices |
US5073181A (en) | 1990-08-09 | 1991-12-17 | Corning Incorporated | Method of protecting glass surfaces using submicron refractory particles |
US5143747A (en) | 1991-02-12 | 1992-09-01 | Hughes Aircraft Company | Die improved tooling for metal working |
CA2065918A1 (en) | 1991-04-22 | 1992-10-23 | Bradley W. Reed | Liquid membrane modules with minimal effective membrane thickness and methods of making the same |
CA2069038C (en) | 1991-05-22 | 1997-08-12 | Kiyofumi Sakaguchi | Method for preparing semiconductor member |
EP0646151B1 (en) | 1991-06-14 | 1997-11-05 | W.L. Gore & Associates, Inc. | Surface modified porous expanded polytetrafluoroethylene and process for making |
US5462781A (en) | 1991-06-14 | 1995-10-31 | W. L. Gore & Associates, Inc. | Surface modified porous expanded polytetrafluoroethylene and process for making |
US5222494A (en) | 1991-07-31 | 1993-06-29 | Cyberonics, Inc. | Implantable tissue stimulator output stabilization system |
JP3039070B2 (ja) | 1991-10-09 | 2000-05-08 | 住友電気工業株式会社 | 弗素樹脂被覆物 |
FR2690279B1 (fr) | 1992-04-15 | 1997-10-03 | Picogiga Sa | Composant photovoltauique multispectral. |
US5491571A (en) | 1993-01-19 | 1996-02-13 | Hughes Aircraft Company | Liquid crystal display including electrodes and driver devices integrally formed in monocrystalline semiconductor layer |
US5482896A (en) | 1993-11-18 | 1996-01-09 | Eastman Kodak Company | Light emitting device comprising an organic LED array on an ultra thin substrate and process for forming same |
US5616179A (en) | 1993-12-21 | 1997-04-01 | Commonwealth Scientific Corporation | Process for deposition of diamondlike, electrically conductive and electron-emissive carbon-based films |
US5554680A (en) | 1994-02-16 | 1996-09-10 | E. I. Du Pont De Nemours And Company | Heat-resistant perfluoroelastomer composition |
JP3081122B2 (ja) | 1994-07-18 | 2000-08-28 | シャープ株式会社 | 基板搬送用治具及びそれを用いた液晶表示素子の製造方法 |
US5760100B1 (en) | 1994-09-06 | 2000-11-14 | Ciba Vision Corp | Extended wear ophthalmic lens |
US5413940A (en) | 1994-10-11 | 1995-05-09 | Taiwan Semiconductor Manufacturing Company | Process of treating SOG layer using end-point detector for outgassing |
EP0764704B1 (en) | 1995-09-25 | 2000-03-08 | Dow Corning Corporation | Use of preceramic polymers as electronic adhesives |
DK0854891T3 (da) | 1995-10-13 | 2003-09-22 | Dow Global Technologies Inc | Fremgangsmåde til fremstilling af belagte plastoverflader |
US5661618A (en) | 1995-12-11 | 1997-08-26 | International Business Machines Corporation | Magnetic recording device having a improved slider |
JP3930591B2 (ja) | 1995-12-22 | 2007-06-13 | 東陶機器株式会社 | 光触媒性親水性コーティング組成物、親水性被膜の形成方法および被覆物品 |
US5888591A (en) | 1996-05-06 | 1999-03-30 | Massachusetts Institute Of Technology | Chemical vapor deposition of fluorocarbon polymer thin films |
US5989998A (en) | 1996-08-29 | 1999-11-23 | Matsushita Electric Industrial Co., Ltd. | Method of forming interlayer insulating film |
US6124154A (en) | 1996-10-22 | 2000-09-26 | Seiko Epson Corporation | Fabrication process for thin film transistors in a display or electronic device |
US5820991A (en) | 1997-02-24 | 1998-10-13 | Cabo; Ana M. | Fused glass sheets having ceramic paint and metal foil and method of making same |
DE19711459A1 (de) | 1997-03-19 | 1998-09-24 | Flachglas Automotive Gmbh | Verfahren zur Herstellung einer gebogenen Verbundsicherheitsglasscheibe |
JP3551702B2 (ja) | 1997-05-08 | 2004-08-11 | カシオ計算機株式会社 | 液晶表示素子とその駆動方法 |
US6687969B1 (en) | 1997-05-16 | 2004-02-10 | Micron Technology, Inc. | Methods of fixturing flexible substrates and methods of processing flexible substrates |
US5972152A (en) | 1997-05-16 | 1999-10-26 | Micron Communications, Inc. | Methods of fixturing flexible circuit substrates and a processing carrier, processing a flexible circuit and processing a flexible circuit substrate relative to a processing carrier |
JPH1126733A (ja) | 1997-07-03 | 1999-01-29 | Seiko Epson Corp | 薄膜デバイスの転写方法、薄膜デバイス、薄膜集積回路装置,アクティブマトリクス基板、液晶表示装置および電子機器 |
US6180496B1 (en) | 1997-08-29 | 2001-01-30 | Silicon Genesis Corporation | In situ plasma wafer bonding method |
US5966622A (en) | 1997-10-08 | 1999-10-12 | Lucent Technologies Inc. | Process for bonding crystalline substrates with different crystal lattices |
US20010045351A1 (en) | 1997-11-21 | 2001-11-29 | Korea Institute Of Science And Technology | Plasma polymerization on surface of material |
US6852650B2 (en) | 1998-02-05 | 2005-02-08 | Asm Japan K.K. | Insulation film on semiconductor substrate and method for forming same |
US6159385A (en) | 1998-05-08 | 2000-12-12 | Rockwell Technologies, Llc | Process for manufacture of micro electromechanical devices having high electrical isolation |
NL1009703C2 (nl) * | 1998-07-21 | 2000-01-24 | Instituut Voor Dierhouderij En | Werkwijze voor het vervaardigen van een preparaathouder voor chemische of biochemische tests. |
EP1048628A1 (de) | 1999-04-30 | 2000-11-02 | Schott Glas | Polymerbeschichtete Dünnglasfoliensubstrate |
US6379746B1 (en) | 1999-02-02 | 2002-04-30 | Corning Incorporated | Method for temporarily protecting glass articles |
JP3202718B2 (ja) | 1999-02-23 | 2001-08-27 | 鹿児島日本電気株式会社 | 表示装置製造用治具及びそれを用いた表示装置の製造方法 |
US6387736B1 (en) | 1999-04-26 | 2002-05-14 | Agilent Technologies, Inc. | Method and structure for bonding layers in a semiconductor device |
US6338901B1 (en) | 1999-05-03 | 2002-01-15 | Guardian Industries Corporation | Hydrophobic coating including DLC on substrate |
US6602606B1 (en) | 1999-05-18 | 2003-08-05 | Nippon Sheet Glass Co., Ltd. | Glass sheet with conductive film, method of manufacturing the same, and photoelectric conversion device using the same |
US8853696B1 (en) | 1999-06-04 | 2014-10-07 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical device and electronic device |
US6824879B2 (en) | 1999-06-10 | 2004-11-30 | Honeywell International Inc. | Spin-on-glass anti-reflective coatings for photolithography |
SG93210A1 (en) | 1999-06-29 | 2002-12-17 | Univ Singapore | Method for lamination of fluoropolymer to metal and printed circuit board (pcb) substrate |
TW487959B (en) | 1999-08-13 | 2002-05-21 | Semiconductor Energy Lab | Laser apparatus, laser annealing method, and manufacturing method of a semiconductor device |
JP4593049B2 (ja) | 2000-02-01 | 2010-12-08 | アナログ デバイシーズ インコーポレイテッド | 静止摩擦を低減し微細加工デバイス表面を不動態化するウェハレベル処理のための方法およびそれに使用するチップ |
US6902987B1 (en) | 2000-02-16 | 2005-06-07 | Ziptronix, Inc. | Method for low temperature bonding and bonded structure |
US6528145B1 (en) | 2000-06-29 | 2003-03-04 | International Business Machines Corporation | Polymer and ceramic composite electronic substrates |
DE10034737C2 (de) | 2000-07-17 | 2002-07-11 | Fraunhofer Ges Forschung | Verfahren zur Herstellung einer permanenten Entformungsschicht durch Plasmapolymerisation auf der Oberfläche eines Formteilwerkzeugs, ein nach dem Verfahren herstellbares Formteilwerkzeug und dessen Verwendung |
US6649540B2 (en) | 2000-11-09 | 2003-11-18 | The Boc Group, Inc. | Organosilane CVD precursors and their use for making organosilane polymer low-k dielectric film |
FR2823599B1 (fr) | 2001-04-13 | 2004-12-17 | Commissariat Energie Atomique | Substrat demomtable a tenue mecanique controlee et procede de realisation |
FR2823596B1 (fr) | 2001-04-13 | 2004-08-20 | Commissariat Energie Atomique | Substrat ou structure demontable et procede de realisation |
FR2824821B1 (fr) | 2001-05-17 | 2003-08-29 | Essilor Int | Procede de preparation d'un verre apte au debordage, verre ainsi obtenu et procede de debordage d'un tel verre |
US7045878B2 (en) | 2001-05-18 | 2006-05-16 | Reveo, Inc. | Selectively bonded thin film layer and substrate layer for processing of useful devices |
US6956268B2 (en) | 2001-05-18 | 2005-10-18 | Reveo, Inc. | MEMS and method of manufacturing MEMS |
JP5415658B2 (ja) | 2001-05-28 | 2014-02-12 | 三菱樹脂株式会社 | 中間膜用粘着シート及び透明積層体 |
ATE431970T1 (de) | 2001-06-20 | 2009-06-15 | Showa Denko Kk | Licht emittierendes material und organische leuchtdiode |
JP4036018B2 (ja) | 2001-06-20 | 2008-01-23 | 昭和電工株式会社 | 有機発光素子および発光材料 |
EP1275624B1 (en) | 2001-06-29 | 2007-08-15 | Crystal Systems Inc. | Antifogging product, inorganic hydrophilic hard layer forming material and process for producing antifogging lens |
US6735982B2 (en) | 2001-07-12 | 2004-05-18 | Intel Corporation | Processing relatively thin glass sheets |
US6649212B2 (en) | 2001-07-30 | 2003-11-18 | Guardian Industries Corporation | Modified silicon-based UV absorbers useful in crosslinkable polysiloxane coatings via sol-gel polymerization |
TW558743B (en) | 2001-08-22 | 2003-10-21 | Semiconductor Energy Lab | Peeling method and method of manufacturing semiconductor device |
JP2003077187A (ja) | 2001-08-30 | 2003-03-14 | Toshiba Corp | 光ディスクの製造方法 |
JP2003071937A (ja) | 2001-09-05 | 2003-03-12 | Toppan Printing Co Ltd | 積層体及びその製造方法、並びに多層回路基板 |
US7033910B2 (en) | 2001-09-12 | 2006-04-25 | Reveo, Inc. | Method of fabricating multi layer MEMS and microfluidic devices |
US6528351B1 (en) | 2001-09-24 | 2003-03-04 | Jigsaw Tek, Inc. | Integrated package and methods for making same |
US6814833B2 (en) | 2001-10-26 | 2004-11-09 | Corning Incorporated | Direct bonding of articles containing silicon |
US6521857B1 (en) | 2001-11-19 | 2003-02-18 | Geomat Insights, Llc | Plasma enhanced bonding method and device |
DE10162435A1 (de) | 2001-12-19 | 2003-07-17 | Joerg Lahann | Verfahren zur Erzeugung von Oberflächenbeschichtungen, die die Adsorption von Proteinen bzw. die Adhäsion von Bakterien und/oder Zellen vermindern |
US6824872B2 (en) | 2002-04-23 | 2004-11-30 | Laurel Products Llc | Surface-treating fluoropolymer powders using atmospheric plasma |
US6699798B2 (en) | 2002-04-24 | 2004-03-02 | Intel Corporation | Promoting adhesion of fluoropolymer films to semiconductor substrates |
FR2874455B1 (fr) | 2004-08-19 | 2008-02-08 | Soitec Silicon On Insulator | Traitement thermique avant collage de deux plaquettes |
JP3639978B2 (ja) | 2002-05-10 | 2005-04-20 | 日本航空電子工業株式会社 | 光スイッチ |
EP1363319B1 (en) | 2002-05-17 | 2009-01-07 | Semiconductor Energy Laboratory Co., Ltd. | Method of transferring an object and method of manufacturing a semiconductor device |
KR101005989B1 (ko) | 2002-06-11 | 2011-01-05 | 코니카 미놀타 홀딩스 가부시키가이샤 | 표면 처리 방법 및 광학 부품 |
US7101947B2 (en) | 2002-06-14 | 2006-09-05 | Florida State University Research Foundation, Inc. | Polyelectrolyte complex films for analytical and membrane separation of chiral compounds |
CN1675058B (zh) | 2002-08-07 | 2010-12-29 | 株式会社丰田中央研究所 | 包括粘合层的层压产品和包括保护膜的层压产品 |
JP3941627B2 (ja) | 2002-08-07 | 2007-07-04 | 株式会社豊田中央研究所 | 密着層を備える積層体 |
EP1573086A4 (en) | 2002-09-18 | 2012-10-03 | Air Prod & Chem | ADDITIVES FOR PREVENTING DETERIORATION OF ALKYL-HYDROGEN SILOXANES |
DE20215401U1 (de) | 2002-10-07 | 2004-02-19 | Schott Glas | Verbund aus einem Dünnstsubsrat und einem Trägersubstrat mit lösbarem Verbindungsmittel |
TW578439B (en) | 2002-10-25 | 2004-03-01 | Ritdisplay Corp | Organic light emitting diode and material applied in the organic light emitting diode |
KR20050083935A (ko) | 2002-11-20 | 2005-08-26 | 레베오 인코포레이티드 | 기판상에 다층 장치들을 제조하기 위한 방법 및 장치 |
JP2004178891A (ja) | 2002-11-26 | 2004-06-24 | Mitsubishi Electric Corp | 電子放出型発光素子の製造方法 |
JP4936667B2 (ja) | 2002-11-29 | 2012-05-23 | フラウンホファー ゲゼルシャフト ツール フェルドルンク デル アンゲヴァントテン フォルシュンク エー ファウ | ウェーハ処理プロセス及び装置並びに中間層及びキャリヤー層を有するウェーハ |
DE10353530A1 (de) | 2003-11-14 | 2005-06-23 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Wafer mit Deckschicht und Trennschicht, Verfahren zur Herstellung eines solchen Wafers sowie Verfahren zum Dünnen bzw. Rückseitenmetallisieren eines Wafers |
WO2004054728A2 (de) | 2002-12-17 | 2004-07-01 | Wipf Ag | Substrat mit einer polaren plasmapolymerisierten schicht |
US6762074B1 (en) | 2003-01-21 | 2004-07-13 | Micron Technology, Inc. | Method and apparatus for forming thin microelectronic dies |
US6964201B2 (en) | 2003-02-25 | 2005-11-15 | Palo Alto Research Center Incorporated | Large dimension, flexible piezoelectric ceramic tapes |
US7089635B2 (en) | 2003-02-25 | 2006-08-15 | Palo Alto Research Center, Incorporated | Methods to make piezoelectric ceramic thick film arrays and elements |
TWI361814B (en) | 2003-03-07 | 2012-04-11 | Kuraray Co | Plastic bonding method |
US7220656B2 (en) | 2003-04-29 | 2007-05-22 | Micron Technology, Inc. | Strained semiconductor by wafer bonding with misorientation |
US6969166B2 (en) | 2003-05-29 | 2005-11-29 | 3M Innovative Properties Company | Method for modifying the surface of a substrate |
JP2005014599A (ja) | 2003-05-30 | 2005-01-20 | Toyota Central Res & Dev Lab Inc | 樹脂シート及びエレクトロルミネッセンス表示装置 |
FR2855909B1 (fr) | 2003-06-06 | 2005-08-26 | Soitec Silicon On Insulator | Procede d'obtention concomitante d'au moins une paire de structures comprenant au moins une couche utile reportee sur un substrat |
US20040258850A1 (en) | 2003-06-18 | 2004-12-23 | Ann Straccia | Environmentally friendly reactive fixture to allow localized surface engineering for improved adhesion to coated and non-coated substrates |
US20050001201A1 (en) | 2003-07-03 | 2005-01-06 | Bocko Peter L. | Glass product for use in ultra-thin glass display applications |
FR2859312B1 (fr) | 2003-09-02 | 2006-02-17 | Soitec Silicon On Insulator | Scellement metallique multifonction |
US7242041B2 (en) | 2003-09-22 | 2007-07-10 | Lucent Technologies Inc. | Field-effect transistors with weakly coupled layered inorganic semiconductors |
US20050069713A1 (en) | 2003-09-30 | 2005-03-31 | Rahul Gupta | Capillary coating method |
US20050242341A1 (en) | 2003-10-09 | 2005-11-03 | Knudson Christopher T | Apparatus and method for supporting a flexible substrate during processing |
US6992371B2 (en) | 2003-10-09 | 2006-01-31 | Freescale Semiconductor, Inc. | Device including an amorphous carbon layer for improved adhesion of organic layers and method of fabrication |
US20050081993A1 (en) | 2003-10-16 | 2005-04-21 | Ilkka Steven J. | Method of bonding glass |
GB0326537D0 (en) | 2003-11-14 | 2003-12-17 | Koninkl Philips Electronics Nv | Flexible devices |
US20050118742A1 (en) | 2003-11-17 | 2005-06-02 | Frank Henning | Method for reducing the adhesive properties of MEMS and anti-adhesion-coated device |
GB0327093D0 (en) | 2003-11-21 | 2003-12-24 | Koninkl Philips Electronics Nv | Active matrix displays and other electronic devices having plastic substrates |
KR101002936B1 (ko) | 2003-12-17 | 2010-12-21 | 삼성전자주식회사 | 캐리어 기판, 이를 이용한 플라스틱 기판의 적층 방법 및유연한 디스플레이 장치의 제조 방법 |
US7220497B2 (en) | 2003-12-18 | 2007-05-22 | Lam Research Corporation | Yttria-coated ceramic components of semiconductor material processing apparatuses and methods of manufacturing the components |
KR101073032B1 (ko) | 2003-12-19 | 2011-10-12 | 삼성전자주식회사 | 플라스틱 기판의 적층 방법 및 이를 이용한 유연한디스플레이 장치의 제조방법 |
US7041608B2 (en) | 2004-02-06 | 2006-05-09 | Eastman Kodak Company | Providing fluorocarbon layers on conductive electrodes in making electronic devices such as OLED devices |
US7147891B2 (en) | 2004-02-11 | 2006-12-12 | Dionex Corporation | Polymer substrate coated with weak cationic-exchange functional layer |
EP1737044B1 (en) | 2004-03-12 | 2014-12-10 | Japan Science and Technology Agency | Amorphous oxide and thin film transistor |
US7087134B2 (en) | 2004-03-31 | 2006-08-08 | Hewlett-Packard Development Company, L.P. | System and method for direct-bonding of substrates |
JP2005300972A (ja) | 2004-04-13 | 2005-10-27 | Seiko Epson Corp | 表示装置の製造方法及び基板貼り合わせ装置 |
JP2006003684A (ja) | 2004-06-18 | 2006-01-05 | Nikon Corp | 基板レスフィルタの製造方法 |
ITMI20041252A1 (it) | 2004-06-22 | 2004-09-22 | Solvay Solexis Spa | Composizioni perfluoroelastomeriche |
US7261793B2 (en) | 2004-08-13 | 2007-08-28 | Hewlett-Packard Development Company, L.P. | System and method for low temperature plasma-enhanced bonding |
US7226869B2 (en) | 2004-10-29 | 2007-06-05 | Lam Research Corporation | Methods for protecting silicon or silicon carbide electrode surfaces from morphological modification during plasma etch processing |
US20060134362A1 (en) | 2004-12-17 | 2006-06-22 | 3M Innovative Properties Company | Optically clear pressure sensitive adhesive |
KR101278460B1 (ko) | 2005-03-01 | 2013-07-02 | 다우 코닝 코포레이션 | 반도체 가공을 위한 임시 웨이퍼 접착방법 |
CN101175633B (zh) | 2005-04-19 | 2011-12-21 | 宇部兴产株式会社 | 聚酰亚胺薄膜层合体 |
US20060246218A1 (en) | 2005-04-29 | 2006-11-02 | Guardian Industries Corp. | Hydrophilic DLC on substrate with barrier discharge pyrolysis treatment |
TWI402935B (zh) | 2005-05-17 | 2013-07-21 | Koninkl Philips Electronics Nv | 彩色主動矩陣顯示器 |
US7462552B2 (en) | 2005-05-23 | 2008-12-09 | Ziptronix, Inc. | Method of detachable direct bonding at low temperatures |
US20070020451A1 (en) | 2005-07-20 | 2007-01-25 | 3M Innovative Properties Company | Moisture barrier coatings |
US7166520B1 (en) | 2005-08-08 | 2007-01-23 | Silicon Genesis Corporation | Thin handle substrate method and structure for fabricating devices using one or more films provided by a layer transfer process |
CN101242951B (zh) | 2005-08-09 | 2012-10-31 | 旭硝子株式会社 | 薄板玻璃层压体以及利用薄板玻璃层压体的显示装置的制造方法 |
US20070048530A1 (en) | 2005-08-29 | 2007-03-01 | Wen-Kuang Tsao | Anti-static substrate |
TWI288493B (en) | 2005-09-13 | 2007-10-11 | Ind Tech Res Inst | Method for fabricating a device with flexible substrate and method for stripping flexible-substrate |
US7901743B2 (en) | 2005-09-30 | 2011-03-08 | Tokyo Electron Limited | Plasma-assisted vapor phase treatment of low dielectric constant films using a batch processing system |
US8039049B2 (en) | 2005-09-30 | 2011-10-18 | Tokyo Electron Limited | Treatment of low dielectric constant films using a batch processing system |
US7462551B2 (en) | 2005-09-30 | 2008-12-09 | Intel Corporation | Adhesive system for supporting thin silicon wafer |
JP2007138144A (ja) | 2005-10-18 | 2007-06-07 | Hitachi Chem Co Ltd | シリカ系被膜形成用組成物 |
KR20070047114A (ko) | 2005-11-01 | 2007-05-04 | 주식회사 엘지화학 | 플렉서블 기판을 구비한 소자의 제조방법 및 이에 의해제조된 플렉서블 기판을 구비한 소자 |
WO2007055142A1 (en) | 2005-11-11 | 2007-05-18 | Semiconductor Energy Laboratory Co., Ltd. | Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor device |
FR2893750B1 (fr) | 2005-11-22 | 2008-03-14 | Commissariat Energie Atomique | Procede de fabrication d'un dispositif electronique flexible du type ecran comportant une pluralite de composants en couches minces. |
US20070134784A1 (en) | 2005-12-09 | 2007-06-14 | Halverson Kurt J | Microreplicated microarrays |
DE602007013478D1 (de) | 2006-02-08 | 2011-05-12 | Semiconductor Energy Lab | RFID-Vorrichtung |
KR100831562B1 (ko) | 2006-03-23 | 2008-05-21 | 주식회사 엘지화학 | 유연성 기판 반송용 점착제 조성물 |
US7909928B2 (en) | 2006-03-24 | 2011-03-22 | The Regents Of The University Of Michigan | Reactive coatings for regioselective surface modification |
US7737035B1 (en) | 2006-03-31 | 2010-06-15 | Novellus Systems, Inc. | Dual seal deposition process chamber and process |
US20070248809A1 (en) | 2006-04-19 | 2007-10-25 | Steven Vincent Haldeman | Interlayers Comprising Stable Infrared Absorbing Agents |
WO2007121524A1 (en) | 2006-04-20 | 2007-11-01 | Epitactix Pty Ltd. | Method of manufacture and resulting structures for semiconductor devices |
KR20090006824A (ko) | 2006-05-08 | 2009-01-15 | 아사히 가라스 가부시키가이샤 | 박판 유리 적층체, 박판 유리 적층체를 이용한 표시 장치의제조 방법 및 지지 유리 기판 |
KR101358255B1 (ko) | 2006-06-27 | 2014-02-05 | 엘지디스플레이 주식회사 | 광경화 타입 소수성 몰드 및 그 제조방법 |
KR20090037856A (ko) | 2006-07-12 | 2009-04-16 | 아사히 가라스 가부시키가이샤 | 보호 유리가 부착된 유리 기판, 보호 유리가 부착된 유리 기판을 사용한 표시 장치의 제조 방법 및 박리지용 실리콘 |
US20080044588A1 (en) | 2006-08-15 | 2008-02-21 | Sakhrani Vinay G | Method for Treating a Hydrophilic Surface |
US8084103B2 (en) | 2006-08-15 | 2011-12-27 | Sakhrani Vinay G | Method for treating a hydrophilic surface |
JP2008072087A (ja) | 2006-08-16 | 2008-03-27 | Kyoto Univ | 半導体装置および半導体装置の製造方法、ならびに表示装置 |
EP2074188A1 (en) | 2006-10-13 | 2009-07-01 | Sunwoo AMC Co., Ltd. | Laminating film of plastic/teflon-silicon and method for preparing the same |
GB0620955D0 (en) | 2006-10-20 | 2006-11-29 | Speakman Stuart P | Methods and apparatus for the manufacture of microstructures |
US7903083B2 (en) | 2006-11-13 | 2011-03-08 | Motorola Mobility, Inc. | Mixed-mode encapsulated electrophoretic display for electronic device |
JP5008381B2 (ja) | 2006-11-15 | 2012-08-22 | 富士フイルム株式会社 | 可撓性基板を用いた有機エレクトロルミネッセンス発光パネルの製造方法、それにより製造された有機エレクトロルミネッセンス発光パネル、及びその製造に使用する支持基板 |
US8069229B2 (en) | 2006-12-28 | 2011-11-29 | Computer Associates Think, Inc. | Topology static zones |
KR100890250B1 (ko) | 2007-01-08 | 2009-03-24 | 포항공과대학교 산학협력단 | 플렉서블 소자의 제조 방법 및 플렉서블 표시 장치의 제조방법 |
US8110906B2 (en) | 2007-01-23 | 2012-02-07 | Infineon Technologies Ag | Semiconductor device including isolation layer |
CN101626991B (zh) | 2007-03-12 | 2012-08-22 | 旭硝子株式会社 | 带保护用玻璃的玻璃基板及采用带保护用玻璃的玻璃基板的显示装置的制造方法 |
JP5277552B2 (ja) | 2007-03-19 | 2013-08-28 | 富士通セミコンダクター株式会社 | 半導体装置の製造方法 |
US8399047B2 (en) | 2007-03-22 | 2013-03-19 | The Regents Of The Univeristy Of Michigan | Multifunctional CVD coatings |
CN101687893B (zh) | 2007-04-26 | 2014-01-22 | 巴斯夫欧洲公司 | 含有吩噻嗪s-氧化物或吩噻嗪s,s-二氧化物基团的硅烷及其在oled中的用途 |
US7635617B2 (en) | 2007-04-27 | 2009-12-22 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor substrate and manufacturing method of semiconductor device |
US7960916B2 (en) | 2007-05-16 | 2011-06-14 | Advanced Lcd Technologies Development Center Co., Ltd. | Display device and electronic device using thin-film transistors formed on semiconductor thin films which are crystallized on insulating substrates |
JP5359871B2 (ja) | 2007-06-20 | 2013-12-04 | 旭硝子株式会社 | フッ素化剤による酸化物ガラスの表面処理方法 |
KR20080113576A (ko) | 2007-06-25 | 2008-12-31 | 엘지디스플레이 주식회사 | 액정표시장치 및 그 제조방법 |
WO2009003029A2 (en) | 2007-06-25 | 2008-12-31 | Brewer Science Inc. | High-temperature spin-on temporary bonding compositions |
TW200907003A (en) | 2007-07-03 | 2009-02-16 | Hitachi Chemical Co Ltd | Adhesive composition and method of manufacturing thereof, adhesive member using the adhesive composition and method of manufacturing thereof, supporting member for mounting semiconductor and method of manufacturing thereof, and semiconductor apparatus an |
JP2009035721A (ja) | 2007-07-11 | 2009-02-19 | Seiko Epson Corp | 接合膜付き基材、接合方法および接合体 |
JP2009028922A (ja) | 2007-07-24 | 2009-02-12 | Seiko Epson Corp | 接合方法、接合体、液滴吐出ヘッドおよび液滴吐出装置 |
JP2009028923A (ja) | 2007-07-24 | 2009-02-12 | Seiko Epson Corp | 接合方法、接合体および配線基板 |
JP2009074002A (ja) | 2007-09-21 | 2009-04-09 | Seiko Epson Corp | 接着シート、接合方法および接合体 |
US20090091025A1 (en) | 2007-10-04 | 2009-04-09 | Agency For Science, Technology And Research | Method for forming and releasing interconnects |
US9056951B2 (en) | 2007-10-05 | 2015-06-16 | The Regents Of The University Of Michigan | Ultrastrong and stiff layered polymer nanocomposites and hierarchical laminate materials thereof |
JP4710897B2 (ja) | 2007-11-28 | 2011-06-29 | セイコーエプソン株式会社 | 接合体の剥離方法 |
KR101445734B1 (ko) | 2007-12-07 | 2014-10-01 | 삼성전자 주식회사 | 액정표시장치 |
PT2238618E (pt) | 2008-01-24 | 2015-09-03 | Brewer Science Inc | Método para montagem reversível de uma bolacha de dispositivo num substrato de suporte |
JP5024087B2 (ja) | 2008-02-05 | 2012-09-12 | 旭硝子株式会社 | ガラス積層体、支持体付き表示装置用パネル、およびそれらの製造方法 |
AU2009212751B2 (en) | 2008-02-05 | 2013-02-07 | Saint-Gobain Performance Plastics Corporation | Multi-layer article |
GB0802912D0 (en) | 2008-02-15 | 2008-03-26 | Carben Semicon Ltd | Thin-film transistor, carbon-based layer and method of production thereof |
KR20090095026A (ko) | 2008-03-04 | 2009-09-09 | 삼성전자주식회사 | 표시 장치 제조 방법 |
JP5555226B2 (ja) | 2008-04-08 | 2014-07-23 | アリゾナ ボード オブ リージェンツ ア ボディー コーポレート アクティング オン ビハーフ オブ アリゾナ ステイト ユニバーシティ | 半導体加工中のフレキシブル基板のwarpおよびbowを減少させるアセンブリおよび方法 |
JPWO2009128359A1 (ja) | 2008-04-17 | 2011-08-04 | 旭硝子株式会社 | ガラス積層体、支持体付き表示装置用パネルおよびこれらの製造方法 |
KR101500684B1 (ko) | 2008-04-17 | 2015-03-10 | 삼성디스플레이 주식회사 | 캐리어 기판 및 이를 이용한 가요성 표시 장치의 제조 방법 |
US7842548B2 (en) | 2008-04-22 | 2010-11-30 | Taiwan Semconductor Manufacturing Co., Ltd. | Fixture for P-through silicon via assembly |
KR101458901B1 (ko) | 2008-04-29 | 2014-11-10 | 삼성디스플레이 주식회사 | 가요성 표시 장치의 제조 방법 |
US7960840B2 (en) | 2008-05-12 | 2011-06-14 | Texas Instruments Incorporated | Double wafer carrier process for creating integrated circuit die with through-silicon vias and micro-electro-mechanical systems protected by a hermetic cavity created at the wafer level |
JP2009283155A (ja) | 2008-05-19 | 2009-12-03 | Seiko Epson Corp | 表示装置の製造方法、表示装置および電子機器 |
JP5029523B2 (ja) | 2008-07-14 | 2012-09-19 | 旭硝子株式会社 | ガラス積層体、支持体付き表示装置用パネル、表示装置用パネル、表示装置およびこれらの製造方法 |
US7690344B2 (en) | 2008-07-24 | 2010-04-06 | Gm Global Technology Operations, Inc. | Method and apparatus for supporting stop-and-go engine functionality |
GB2462615A (en) | 2008-08-12 | 2010-02-17 | Nec Corp | Optional Access Stratum security activation depending on purpose of request or message parameter in an evolved UTRAN communication network. |
DE102008045370B4 (de) | 2008-09-02 | 2010-07-08 | Grenzebach Maschinenbau Gmbh | Verfahren und Vorrichtung zum Transport großflächiger, dünner Glasplatten |
US20110311789A1 (en) | 2008-09-12 | 2011-12-22 | Arizona Board of Regents, a body corporate acting for and on behalf of Arizona State University | Methods for Attaching Flexible Substrates to Rigid Carriers and Resulting Devices |
TWI354854B (en) | 2008-09-15 | 2011-12-21 | Ind Tech Res Inst | Substrate structures applied in flexible electrica |
JP2010107597A (ja) | 2008-10-28 | 2010-05-13 | Seiko Epson Corp | 光学素子および光学素子の製造方法 |
KR101555551B1 (ko) | 2008-11-07 | 2015-09-24 | 엘지디스플레이 주식회사 | 플렉시블 표시장치 제조방법 |
EP2350198A1 (en) | 2008-11-19 | 2011-08-03 | Dow Corning Corporation | A silicone composition and a method for preparing the same |
US8211270B2 (en) | 2008-11-21 | 2012-07-03 | Nitto Denko Corporation | Method of detaching attached boards from each other |
DE102009022628A1 (de) | 2008-12-05 | 2010-06-10 | Evonik Goldschmidt Gmbh | Verfahren zur Modifizierung von Oberflächen |
CN102239553B (zh) | 2008-12-05 | 2014-08-27 | 皇家飞利浦电子股份有限公司 | 具有塑料基板的电子装置 |
TW201033000A (en) | 2009-01-09 | 2010-09-16 | Asahi Glass Co Ltd | Glass laminate and manufacturing method therefor |
US9063605B2 (en) | 2009-01-09 | 2015-06-23 | Apple Inc. | Thin glass processing using a carrier |
JP5207306B2 (ja) | 2009-01-26 | 2013-06-12 | 武井電機工業株式会社 | 薄膜積層ガラス基板の薄膜除去方法及び装置 |
CA2751881C (en) | 2009-02-27 | 2013-09-17 | Exxonmobil Oil Corporation | Plasma treated evoh multilayer film |
TWI410329B (zh) | 2009-03-09 | 2013-10-01 | Ind Tech Res Inst | 可撓式裝置的取下設備及其取下方法 |
JP5402184B2 (ja) | 2009-04-13 | 2014-01-29 | 日本電気硝子株式会社 | ガラスフィルムおよびその製造方法 |
CN101873532B (zh) | 2009-04-22 | 2013-01-02 | 电信科学技术研究院 | 广播多播系统中发送和获取控制信息的方法、基站和ue |
US8697228B2 (en) * | 2009-05-06 | 2014-04-15 | Corning Incorporated | Carrier for glass substrates |
JP5578174B2 (ja) | 2009-05-08 | 2014-08-27 | 日立化成株式会社 | 半導体封止用フィルム状接着剤、半導体装置及びその製造方法 |
GB0908193D0 (en) | 2009-05-13 | 2009-06-24 | Albright Patents | Treatment of disease state |
CN102459704B (zh) | 2009-06-03 | 2014-08-20 | 应用材料公司 | 用于蚀刻的方法和设备 |
CN101924067B (zh) | 2009-06-09 | 2013-05-08 | 财团法人工业技术研究院 | 挠性膜自载板上脱离的方法及可挠式电子装置的制造方法 |
JP2010284869A (ja) | 2009-06-11 | 2010-12-24 | Shin-Etsu Chemical Co Ltd | 接合部材 |
JP5594522B2 (ja) | 2009-07-03 | 2014-09-24 | 日本電気硝子株式会社 | 電子デバイス製造用ガラスフィルム積層体 |
US7987566B2 (en) | 2009-07-15 | 2011-08-02 | Sturzebecher Richard J | Capacitor forming method |
US8568184B2 (en) | 2009-07-15 | 2013-10-29 | Apple Inc. | Display modules |
CN101989469A (zh) | 2009-07-31 | 2011-03-23 | 群康科技(深圳)有限公司 | 导电板 |
US8048794B2 (en) | 2009-08-18 | 2011-11-01 | International Business Machines Corporation | 3D silicon-silicon die stack structure and method for fine pitch interconnection and vertical heat transport |
DE102009028640A1 (de) | 2009-08-19 | 2011-02-24 | Evonik Goldschmidt Gmbh | Härtbare Masse enthaltend Urethangruppen aufweisende silylierte Polymere und deren Verwendung in Dicht- und Klebstoffen, Binde- und/oder Oberflächenmodifizierungsmitteln |
JP2011048979A (ja) | 2009-08-26 | 2011-03-10 | Canon Inc | 画像表示装置 |
CN102596565B (zh) | 2009-08-27 | 2014-09-10 | 旭硝子株式会社 | 挠性基材-支撑体的层叠结构体、带有支撑体的电子装置用面板、以及电子装置用面板的制造方法 |
US9847243B2 (en) | 2009-08-27 | 2017-12-19 | Corning Incorporated | Debonding a glass substrate from carrier using ultrasonic wave |
JP5562597B2 (ja) | 2009-08-28 | 2014-07-30 | 荒川化学工業株式会社 | 支持体、ガラス基板積層体、支持体付き表示装置用パネル、および表示装置用パネルの製造方法 |
CN102481764B (zh) | 2009-09-08 | 2014-11-05 | 旭硝子株式会社 | 玻璃/树脂层叠体、及使用其的电子设备 |
JP2011058579A (ja) | 2009-09-10 | 2011-03-24 | Tokyo Institute Of Technology | エネルギ吸収構造体 |
KR101583394B1 (ko) | 2009-09-11 | 2016-01-07 | 헨켈 아이피 앤드 홀딩 게엠베하 | 중합체 결합을 위한 조성물 |
CN102471129B (zh) | 2009-09-18 | 2015-04-15 | 日本电气硝子株式会社 | 玻璃膜的制造方法及玻璃膜的处理方法以及玻璃膜层叠体 |
CN102576106B (zh) | 2009-10-20 | 2015-02-11 | 旭硝子株式会社 | 玻璃层叠体及其制造方法、显示面板的制造方法及利用该制造方法获得的显示面板 |
KR20120099018A (ko) | 2009-10-20 | 2012-09-06 | 아사히 가라스 가부시키가이샤 | 유리 적층체, 지지체를 구비한 표시 장치용 패널, 표시 장치용 패널, 표시 장치 및 이들의 제조 방법 |
KR20110043376A (ko) | 2009-10-21 | 2011-04-27 | 엘지디스플레이 주식회사 | 전기영동 표시장치 및 그 제조 방법 |
KR101617280B1 (ko) | 2009-10-21 | 2016-05-03 | 엘지디스플레이 주식회사 | 플라스틱 기판을 이용한 표시장치 제조 방법 |
KR20110045136A (ko) | 2009-10-26 | 2011-05-04 | 주식회사 삼영테크놀로지 | 윈도우와 디스플레이 패널을 분리하기 위한 코팅방법 |
US9019211B2 (en) | 2009-10-30 | 2015-04-28 | Corning Incorporated | Methods and apparatus for providing touch sensitive displays |
KR101635914B1 (ko) | 2009-12-16 | 2016-07-05 | 엘지디스플레이 주식회사 | 플렉서블 표시장치의 제조 방법 |
AU2010340894B2 (en) | 2009-12-17 | 2014-11-20 | Ceramtec Gmbh | Surface conditioning for improving bone cement adhesion to ceramic substrates |
WO2011086991A1 (ja) | 2010-01-12 | 2011-07-21 | 日本電気硝子株式会社 | ガラスフィルム積層体及びその製造方法並びにガラスフィルムの製造方法 |
JP2011159697A (ja) | 2010-01-29 | 2011-08-18 | Dainippon Printing Co Ltd | 薄膜トランジスタ搭載基板、その製造方法及び画像表示装置 |
US8995146B2 (en) | 2010-02-23 | 2015-03-31 | Semblant Limited | Electrical assembly and method |
GB201003067D0 (en) | 2010-02-23 | 2010-04-07 | Semblant Ltd | Plasma-polymerized polymer coating |
JP2011201976A (ja) | 2010-03-24 | 2011-10-13 | Seiko Epson Corp | 接合方法 |
JP2011201977A (ja) | 2010-03-24 | 2011-10-13 | Seiko Epson Corp | 接合方法 |
US8349727B2 (en) | 2010-04-08 | 2013-01-08 | Liang Guo | Integrated method for high-density interconnection of electronic components through stretchable interconnects |
US20110256385A1 (en) | 2010-04-15 | 2011-10-20 | Seiko Epson Corporation | Bonding film-attached substrate and bonding film-attached substrate manufacturing method |
JP5625470B2 (ja) | 2010-05-10 | 2014-11-19 | セイコーエプソン株式会社 | 接合方法 |
WO2011142280A1 (ja) | 2010-05-11 | 2011-11-17 | 旭硝子株式会社 | 積層体の製造方法、および積層体 |
JP5516046B2 (ja) | 2010-05-11 | 2014-06-11 | セイコーエプソン株式会社 | 接合膜転写シートおよび接合方法 |
JP2011235556A (ja) | 2010-05-11 | 2011-11-24 | Seiko Epson Corp | 励起エネルギー特定方法、励起エネルギー特定装置、接合方法および接合装置 |
JP2011248011A (ja) | 2010-05-25 | 2011-12-08 | Bridgestone Corp | 表示媒体用粒子およびこれを用いた情報表示用パネル |
GB2481187B (en) | 2010-06-04 | 2014-10-29 | Plastic Logic Ltd | Processing substrates |
KR101721414B1 (ko) | 2010-06-09 | 2017-03-31 | 삼성디스플레이 주식회사 | 백라이트 어셈블리 및 이를 포함하는 액정표시장치 |
US8852391B2 (en) | 2010-06-21 | 2014-10-07 | Brewer Science Inc. | Method and apparatus for removing a reversibly mounted device wafer from a carrier substrate |
TWI432835B (zh) | 2010-06-24 | 2014-04-01 | Au Optronics Corp | 可撓性顯示面板及其製造方法 |
DE102010025967B4 (de) | 2010-07-02 | 2015-12-10 | Schott Ag | Verfahren zur Erzeugung einer Vielzahl von Löchern, Vorrichtung hierzu und Glas-Interposer |
CN101916022B (zh) | 2010-07-06 | 2012-10-10 | 友达光电股份有限公司 | 可挠性显示面板及其制造方法 |
KR101804195B1 (ko) | 2010-07-28 | 2017-12-04 | 니폰 덴키 가라스 가부시키가이샤 | 유리 필름 적층체 |
WO2012014499A1 (ja) | 2010-07-29 | 2012-02-02 | 三井化学株式会社 | 組成物、この組成物からなる表示デバイス端面シール剤用組成物、表示デバイス、およびその製造方法 |
JP5602529B2 (ja) | 2010-07-29 | 2014-10-08 | 日本合成化学工業株式会社 | 積層体の製法、ガラス基板付き偏光板の製法、およびそれにより得られたガラス基板付き偏光板 |
US20120035309A1 (en) | 2010-08-06 | 2012-02-09 | Baker Hughes Incorporated | Method to disperse nanoparticles into elastomer and articles produced therefrom |
US9263314B2 (en) | 2010-08-06 | 2016-02-16 | Brewer Science Inc. | Multiple bonding layers for thin-wafer handling |
JP5462107B2 (ja) | 2010-08-09 | 2014-04-02 | 株式会社日本製鋼所 | 中空成形品の製造方法および製造装置 |
US8846499B2 (en) | 2010-08-17 | 2014-09-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Composite carrier structure |
TWI446420B (zh) | 2010-08-27 | 2014-07-21 | Advanced Semiconductor Eng | 用於半導體製程之載體分離方法 |
US20120063952A1 (en) | 2010-09-10 | 2012-03-15 | Hong Keith C | Uv resistant clear laminates |
KR101164945B1 (ko) | 2010-09-13 | 2012-07-12 | 한국과학기술원 | 플렉시블 소자의 제작 방법 |
KR101779586B1 (ko) | 2010-09-27 | 2017-10-10 | 엘지디스플레이 주식회사 | 플라스틱 기판을 이용한 표시장치 제조 방법 |
EP2624326A4 (en) | 2010-09-29 | 2017-05-10 | Posco | Method for manufacturing a flexible electronic device using a roll-shaped motherboard, flexible electronic device, and flexible substrate |
US8822306B2 (en) | 2010-09-30 | 2014-09-02 | Infineon Technologies Ag | Method for manufacturing a composite wafer having a graphite core, and composite wafer having a graphite core |
KR101267529B1 (ko) | 2010-10-30 | 2013-05-24 | 엘지디스플레이 주식회사 | 플렉서블한 유기전계 발광소자 제조 방법 |
US8859103B2 (en) | 2010-11-05 | 2014-10-14 | Joseph Eugene Canale | Glass wafers for semiconductor fabrication processes and methods of making same |
CN102034746B (zh) | 2010-11-08 | 2013-06-05 | 昆山工研院新型平板显示技术中心有限公司 | 一种有源矩阵有机发光显示器阵列基板的制造方法 |
KR101295532B1 (ko) | 2010-11-11 | 2013-08-12 | 엘지디스플레이 주식회사 | 플렉시블 평판소자의 제조방법 |
KR101271838B1 (ko) | 2010-11-24 | 2013-06-07 | 주식회사 포스코 | 보강기판을 이용한 플렉서블 전자소자의 제조방법, 플렉서블 전자소자 및 플렉서블 기판 |
KR101842134B1 (ko) | 2010-11-26 | 2018-03-26 | 엘지디스플레이 주식회사 | 전기영동 표시장치 및 그 제조 방법 |
EP2458620B1 (en) | 2010-11-29 | 2021-12-01 | IHP GmbH-Innovations for High Performance Microelectronics / Leibniz-Institut für innovative Mikroelektronik | Fabrication of graphene electronic devices using step surface contour |
TW201238014A (en) | 2010-11-30 | 2012-09-16 | Corning Inc | Methods of forming a glass wiring board substrate |
JP2012119611A (ja) | 2010-12-03 | 2012-06-21 | Asahi Glass Co Ltd | 貫通電極基板の製造方法 |
KR101049380B1 (ko) | 2010-12-21 | 2011-07-15 | 한국기계연구원 | 전해도금을 이용한 반도체 소자 3차원 패키지용 관통 전극 및 그 제조 방법 |
CN102070120B (zh) | 2010-12-31 | 2012-09-05 | 东南大学 | 用于微电子系统级封装的高密度转接板的制备方法 |
KR101211961B1 (ko) | 2011-02-01 | 2012-12-18 | 마이크로 테크놀러지 가부시키가이샤 | 박판 글라스 기판 첩합체 및 그 제조방법 |
JP2012166999A (ja) | 2011-02-16 | 2012-09-06 | Asahi Glass Co Ltd | インターポーザ用ガラス基板の製造方法、インターポーザの製造方法、インターポーザ用ガラス基板、およびインターポーザ |
KR101918284B1 (ko) | 2011-03-03 | 2019-01-30 | 엘지디스플레이 주식회사 | 플렉시블 표시장치의 제조 방법 |
JP5355618B2 (ja) | 2011-03-10 | 2013-11-27 | 三星ディスプレイ株式會社 | 可撓性表示装置及びこの製造方法 |
JP2012209545A (ja) | 2011-03-17 | 2012-10-25 | Sekisui Chem Co Ltd | 半導体積層体の製造方法 |
TWI445626B (zh) | 2011-03-18 | 2014-07-21 | Eternal Chemical Co Ltd | 製造軟性元件的方法 |
JP5429375B2 (ja) | 2011-04-15 | 2014-02-26 | 東洋紡株式会社 | 積層体とその製造方法および、この積層体を用いたデバイス構造体の作成方法 |
JP2012227310A (ja) | 2011-04-19 | 2012-11-15 | Panasonic Corp | セラミックス多層基板とその製造方法 |
US10155361B2 (en) | 2011-11-09 | 2018-12-18 | Corning Incorporated | Method of binding nanoparticles to glass |
KR20140018937A (ko) | 2011-04-22 | 2014-02-13 | 아사히 가라스 가부시키가이샤 | 적층체, 그 제조 방법 및 용도 |
JP5862238B2 (ja) | 2011-05-27 | 2016-02-16 | 東洋紡株式会社 | 積層体とその製造方法及びそれを用いたデバイス構造体の製造方法 |
JP5760696B2 (ja) | 2011-05-27 | 2015-08-12 | 株式会社デンソー | 画像認識装置 |
JP5862866B2 (ja) | 2011-05-30 | 2016-02-16 | 東洋紡株式会社 | 積層体の作成方法および、この積層体を利用したフィルムデバイスの作成方法 |
JP5883236B2 (ja) | 2011-06-10 | 2016-03-09 | 日東電工株式会社 | 薄層基材用キャリア材 |
KR20130000211A (ko) | 2011-06-22 | 2013-01-02 | 삼성전자주식회사 | 기판 가공 방법 |
KR20130003997A (ko) | 2011-07-01 | 2013-01-09 | 엘지디스플레이 주식회사 | 캐리어 기판과 박형 글라스의 탈부착 방법 |
US9827757B2 (en) | 2011-07-07 | 2017-11-28 | Brewer Science Inc. | Methods of transferring device wafers or layers between carrier substrates and other surfaces |
US8617925B2 (en) | 2011-08-09 | 2013-12-31 | Soitec | Methods of forming bonded semiconductor structures in 3D integration processes using recoverable substrates, and bonded semiconductor structures formed by such methods |
US8383460B1 (en) | 2011-09-23 | 2013-02-26 | GlobalFoundries, Inc. | Method for fabricating through substrate vias in semiconductor substrate |
EP2761051B1 (en) | 2011-09-27 | 2018-11-07 | Applied Materials, Inc. | Carrier for thin glass substrates and use thereof |
JP5796449B2 (ja) | 2011-10-12 | 2015-10-21 | 旭硝子株式会社 | 電子デバイスの製造方法、樹脂層付きキャリア基板の製造方法 |
JP5790392B2 (ja) | 2011-10-12 | 2015-10-07 | 旭硝子株式会社 | 電子デバイスの製造方法 |
KR101973826B1 (ko) | 2011-10-18 | 2019-08-26 | 에이지씨 가부시키가이샤 | 적층체, 적층체의 제조 방법 및 전자 디바이스용 부재가 부착된 유리 기판의 제조 방법 |
KR101820171B1 (ko) | 2011-10-24 | 2018-01-19 | 엘지디스플레이 주식회사 | 경량 박형의 액정표시장치 제조방법 |
EP2804747B1 (en) | 2012-01-16 | 2022-07-13 | DDP Specialty Electronic Materials US 9, LLC | Optical article and method of forming |
US8696864B2 (en) | 2012-01-26 | 2014-04-15 | Promerus, Llc | Room temperature debonding composition, method and stack |
US8550061B2 (en) | 2012-01-26 | 2013-10-08 | Maruzen Company Limited | Toy gun |
US8975157B2 (en) | 2012-02-08 | 2015-03-10 | Advanced Semiconductor Engineering, Inc. | Carrier bonding and detaching processes for a semiconductor wafer |
WO2013119737A2 (en) | 2012-02-08 | 2013-08-15 | Corning Incorporated | Processing flexible glass with a carrier |
US10543662B2 (en) | 2012-02-08 | 2020-01-28 | Corning Incorporated | Device modified substrate article and methods for making |
US9725357B2 (en) | 2012-10-12 | 2017-08-08 | Corning Incorporated | Glass articles having films with moderate adhesion and retained strength |
US8696212B2 (en) | 2012-03-01 | 2014-04-15 | Amsted Rail Company, Inc. | Roller bearing backing ring assembly |
JP2013184346A (ja) | 2012-03-07 | 2013-09-19 | Asahi Glass Co Ltd | ガラス積層体、電子デバイスの製造方法 |
JP2013184872A (ja) | 2012-03-09 | 2013-09-19 | Nippon Electric Glass Co Ltd | ガラス基板の端部処理方法、ガラス基板の端部処理装置及びガラス基板 |
KR101390212B1 (ko) | 2012-03-14 | 2014-05-14 | 한양대학교 에리카산학협력단 | 전기분무건조를 이용한 글리아딘 나노입자의 제조방법 |
JP2013207084A (ja) | 2012-03-28 | 2013-10-07 | Sumitomo Electric Ind Ltd | 放熱板付基板モジュールおよび放熱板付基板モジュールの製造方法 |
JP2013216513A (ja) | 2012-04-05 | 2013-10-24 | Nippon Electric Glass Co Ltd | ガラスフィルムの切断方法及びガラスフィルム積層体 |
EP2650938A1 (en) | 2012-04-13 | 2013-10-16 | Acreo Swedish ICT AB | Organic Field-Effect Transistor Device |
JP2013224475A (ja) | 2012-04-23 | 2013-10-31 | Shimazu Kogyo Kk | 溶射用粒子、溶射皮膜の形成方法及び溶射部材 |
DE102012207149A1 (de) | 2012-04-27 | 2013-10-31 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verbund mit temporärer Schutzfolie |
KR20150023312A (ko) | 2012-05-29 | 2015-03-05 | 아사히 가라스 가부시키가이샤 | 유리 적층체 및 전자 디바이스의 제조 방법 |
KR20130095605A (ko) | 2012-06-22 | 2013-08-28 | 코스텍시스템(주) | 디바이스 웨이퍼와 캐리어 웨이퍼의 본딩과 디본딩 장치 |
CN102815052B (zh) | 2012-06-29 | 2016-08-24 | 法国圣戈班玻璃公司 | 超疏水减反基板及其制作方法 |
US9139469B2 (en) | 2012-07-17 | 2015-09-22 | Corning Incorporated | Ion exchangeable Li-containing glass compositions for 3-D forming |
JP2014019597A (ja) | 2012-07-17 | 2014-02-03 | Nippon Electric Glass Co Ltd | ガラスフィルムの製造方法及びガラスフィルム積層体 |
CN102789125B (zh) | 2012-07-27 | 2013-11-13 | 京东方科技集团股份有限公司 | 隔垫物制作方法 |
JP6360055B2 (ja) | 2012-08-17 | 2018-07-18 | コーニング インコーポレイテッド | 極薄強化ガラス |
CN102820262A (zh) | 2012-09-05 | 2012-12-12 | 江苏物联网研究发展中心 | 一种玻璃通孔的制作及互连的方法 |
CN107265844B (zh) | 2012-09-28 | 2020-04-14 | Hoya株式会社 | 外置保护罩玻璃及其制造方法、玻璃基板、保护罩玻璃 |
US10487009B2 (en) * | 2012-10-12 | 2019-11-26 | Corning Incorporated | Articles having retained strength |
US20140150244A1 (en) | 2012-11-30 | 2014-06-05 | General Electric Company | Adhesive-free carrier assemblies for glass substrates |
CN103035490A (zh) | 2012-12-11 | 2013-04-10 | 京东方科技集团股份有限公司 | 柔性显示器件的制备方法 |
TWI617437B (zh) | 2012-12-13 | 2018-03-11 | 康寧公司 | 促進控制薄片與載體間接合之處理 |
US10014177B2 (en) | 2012-12-13 | 2018-07-03 | Corning Incorporated | Methods for processing electronic devices |
US9340443B2 (en) | 2012-12-13 | 2016-05-17 | Corning Incorporated | Bulk annealing of glass sheets |
KR102046534B1 (ko) | 2013-01-25 | 2019-11-19 | 삼성전자주식회사 | 기판 가공 방법 |
US10000675B2 (en) | 2013-03-03 | 2018-06-19 | John Cleaon Moore | Temporary adhesive with tunable adhesion force sufficient for processing thin solid materials |
WO2014164206A1 (en) | 2013-03-09 | 2014-10-09 | John Moore | Aqueous detergent soluble coating and adhesive and methods of temporary bonding for manufacturing |
WO2014142280A1 (ja) | 2013-03-15 | 2014-09-18 | 日産自動車株式会社 | 非水電解質二次電池 |
EP2969997A1 (en) | 2013-03-15 | 2016-01-20 | Corning Incorporated | Bulk annealing of glass sheets |
KR101432575B1 (ko) | 2013-03-29 | 2014-08-21 | 엘지디스플레이 주식회사 | 경량 박형의 액정표시장치 제조방법 |
KR20150138191A (ko) | 2013-04-02 | 2015-12-09 | 아사히 가라스 가부시키가이샤 | 피막을 구비한 유리 기판 및 그 제조 방법 |
KR102070617B1 (ko) | 2013-08-21 | 2020-01-30 | 엘지이노텍 주식회사 | 멤스 진폭 변조기 및 이를 포함하는 멤스 자계 센서 |
KR20150034829A (ko) | 2013-08-30 | 2015-04-06 | 주식회사 엔씰텍 | 플렉시블 정보 표시 소자 제조용 지지 기판, 이의 제조 방법, 이를 이용하여 제조된 플렉시블 정보 표시 소자 및 이의 제조방법 |
KR101580015B1 (ko) | 2013-08-30 | 2015-12-24 | 주식회사 엔씰텍 | 임시 점착/탈착층을 사용하는 플렉시블 정보 표시 소자 제조용 지지 기판, 이의 제조 방법, 그를 이용한 플렉시블 정보 표시 소자 및 그의 제조 방법 |
US10510576B2 (en) | 2013-10-14 | 2019-12-17 | Corning Incorporated | Carrier-bonding methods and articles for semiconductor and interposer processing |
JP6176067B2 (ja) | 2013-11-11 | 2017-08-09 | 旭硝子株式会社 | ガラス積層体および電子デバイスの製造方法 |
JP6119567B2 (ja) | 2013-11-11 | 2017-04-26 | 旭硝子株式会社 | ガラス積層体の製造方法および電子デバイスの製造方法 |
JP6136909B2 (ja) | 2013-12-17 | 2017-05-31 | 旭硝子株式会社 | 樹脂層付き支持基板の製造方法、ガラス積層体の製造方法、電子デバイスの製造方法 |
JP2017511756A (ja) | 2014-01-27 | 2017-04-27 | コーニング インコーポレイテッド | 薄いシートの担体との制御された結合のための表面改質層の処理 |
JP2017506204A (ja) | 2014-01-27 | 2017-03-02 | コーニング インコーポレイテッド | 高分子表面の担体との制御された結合のための物品および方法 |
KR102353030B1 (ko) | 2014-01-27 | 2022-01-19 | 코닝 인코포레이티드 | 얇은 시트와 캐리어의 제어된 결합을 위한 물품 및 방법 |
KR101522941B1 (ko) | 2014-02-05 | 2015-05-26 | 도레이첨단소재 주식회사 | 실리콘 이형필름 및 그 제조방법 |
WO2015119210A1 (ja) | 2014-02-07 | 2015-08-13 | 旭硝子株式会社 | ガラス積層体 |
US9406746B2 (en) | 2014-02-19 | 2016-08-02 | International Business Machines Corporation | Work function metal fill for replacement gate fin field effect transistor process |
JP2017087417A (ja) | 2014-03-26 | 2017-05-25 | 旭硝子株式会社 | ガラス積層体 |
SG11201608442TA (en) | 2014-04-09 | 2016-11-29 | Corning Inc | Device modified substrate article and methods for making |
CN106163798B (zh) | 2014-04-10 | 2019-05-10 | Agc株式会社 | 玻璃层叠体及其制造方法、电子器件的制造方法 |
JP6322469B2 (ja) | 2014-04-25 | 2018-05-09 | ニッタ株式会社 | 基板加工方法 |
KR20160146712A (ko) | 2014-04-25 | 2016-12-21 | 아사히 가라스 가부시키가이샤 | 유리 적층체 및 전자 디바이스의 제조 방법 |
CN106573443B (zh) | 2014-08-01 | 2018-09-25 | Agc株式会社 | 带无机膜的支撑基板及玻璃层叠体、以及它们的制造方法及电子器件的制造方法 |
US9790593B2 (en) | 2014-08-01 | 2017-10-17 | Corning Incorporated | Scratch-resistant materials and articles including the same |
US9576811B2 (en) | 2015-01-12 | 2017-02-21 | Lam Research Corporation | Integrating atomic scale processes: ALD (atomic layer deposition) and ALE (atomic layer etch) |
KR102573207B1 (ko) | 2015-05-19 | 2023-08-31 | 코닝 인코포레이티드 | 시트와 캐리어의 결합을 위한 물품 및 방법 |
CN117534339A (zh) | 2015-06-26 | 2024-02-09 | 康宁股份有限公司 | 包含板材和载体的方法和制品 |
JP6123919B2 (ja) | 2016-01-07 | 2017-05-10 | 住友ベークライト株式会社 | 化粧板 |
WO2018038961A1 (en) | 2016-08-22 | 2018-03-01 | Corning Incorporated | Articles of controllably bonded sheets and methods for making same |
US10079154B1 (en) | 2017-03-20 | 2018-09-18 | Lam Research Corporation | Atomic layer etching of silicon nitride |
-
2016
- 2016-06-22 CN CN202311495612.8A patent/CN117534339A/zh active Pending
- 2016-06-22 JP JP2017566697A patent/JP7106276B2/ja active Active
- 2016-06-22 US US15/739,321 patent/US11905201B2/en active Active
- 2016-06-22 KR KR1020187002650A patent/KR102524620B1/ko active IP Right Grant
- 2016-06-22 WO PCT/US2016/038663 patent/WO2016209897A1/en active Application Filing
- 2016-06-22 CN CN201680037632.2A patent/CN107810168A/zh active Pending
- 2016-06-22 EP EP16735786.2A patent/EP3313799B1/en active Active
- 2016-06-23 TW TW105119764A patent/TWI723025B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014093776A1 (en) * | 2012-12-13 | 2014-06-19 | Corning Incorporated | Glass articles and methods for controlled bonding of glass sheets with carriers |
WO2014093775A1 (en) * | 2012-12-13 | 2014-06-19 | Corning Incorporated | Glass and methods of making glass articles |
WO2015054098A1 (en) * | 2013-10-07 | 2015-04-16 | Corning Incorporated | Glass articles and methods for controlled bonding of glass sheets with carriers |
Also Published As
Publication number | Publication date |
---|---|
KR102524620B1 (ko) | 2023-04-21 |
US20200039872A1 (en) | 2020-02-06 |
JP7106276B2 (ja) | 2022-07-26 |
CN107810168A (zh) | 2018-03-16 |
EP3313799B1 (en) | 2022-09-07 |
KR20180048589A (ko) | 2018-05-10 |
US11905201B2 (en) | 2024-02-20 |
WO2016209897A1 (en) | 2016-12-29 |
TW201708152A (zh) | 2017-03-01 |
CN117534339A (zh) | 2024-02-09 |
EP3313799A1 (en) | 2018-05-02 |
TWI723025B (zh) | 2021-04-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP7106276B2 (ja) | シート及び担体を有する物品及び方法 | |
TWI654088B (zh) | 用於聚合物表面與載具之受控接合之物件及方法 | |
KR20160114106A (ko) | 얇은 시트와 캐리어의 제어된 결합을 위한 표면 개질 층의 처리 | |
JP6353461B2 (ja) | Oledデバイスの加工方法 | |
JP5065748B2 (ja) | 貼り合わせウエーハの製造方法 | |
US20150329415A1 (en) | Glass and methods of making glass articles | |
WO2016088466A1 (ja) | 複合基板の製造方法及び複合基板 | |
WO2014153923A1 (zh) | 薄膜和制造薄膜的方法 | |
KR20160114107A (ko) | 얇은 시트와 캐리어의 제어된 결합을 위한 물품 및 방법 | |
KR20150097604A (ko) | 시트 및 캐리어 사이에 결합을 조절하기 위한 간편 공정 | |
US8420503B2 (en) | Method for producing SOI substrate | |
JP2012509581A (ja) | ヘテロ構造を作製するためのサファイア基板の表面の前処理 | |
JP2019524510A (ja) | 制御可能に結合されたシートの物品およびその製造方法 | |
JP6843232B2 (ja) | 2つの基板をボンディングするための装置および方法 | |
JP6369566B2 (ja) | ナノカーボン膜作製用複合基板及びナノカーボン膜の作製方法 | |
TWI616966B (zh) | 在顯示負的焦耳-湯姆遜(joule-thomson)係數之氣體氛圍中的接合方法 | |
Williams et al. | Planarization of GaN by the Etch-Back Method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20190621 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20200528 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20200617 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200917 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20210210 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20210510 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210629 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20211201 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20220301 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20220426 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220601 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20220615 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20220713 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7106276 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |