FR2893750B1 - Procede de fabrication d'un dispositif electronique flexible du type ecran comportant une pluralite de composants en couches minces. - Google Patents
Procede de fabrication d'un dispositif electronique flexible du type ecran comportant une pluralite de composants en couches minces.Info
- Publication number
- FR2893750B1 FR2893750B1 FR0511798A FR0511798A FR2893750B1 FR 2893750 B1 FR2893750 B1 FR 2893750B1 FR 0511798 A FR0511798 A FR 0511798A FR 0511798 A FR0511798 A FR 0511798A FR 2893750 B1 FR2893750 B1 FR 2893750B1
- Authority
- FR
- France
- Prior art keywords
- electronic device
- thin film
- flexible electronic
- screen type
- type flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000010409 thin film Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
- H01L27/1266—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate the substrate on which the devices are formed not being the final device substrate, e.g. using a temporary substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/206—Insulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/702—Amorphous
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/202—LCD, i.e. liquid crystal displays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/206—Organic displays, e.g. OLED
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133305—Flexible substrates, e.g. plastics, organic film
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78603—Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the insulating substrate or support
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/17—Passive-matrix OLED displays
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0511798A FR2893750B1 (fr) | 2005-11-22 | 2005-11-22 | Procede de fabrication d'un dispositif electronique flexible du type ecran comportant une pluralite de composants en couches minces. |
EP06831137A EP1952441A1 (fr) | 2005-11-22 | 2006-11-20 | Procede de fabrication d un dispositif electronique flexible du type ecran comportant une pluralite de composants en couches minces |
US12/094,521 US20090262294A9 (en) | 2005-11-22 | 2006-11-20 | Process for fabricating a flexible electronic device of the screen type, including a plurality of thin-film components |
PCT/FR2006/002543 WO2007060314A1 (fr) | 2005-11-22 | 2006-11-20 | Procede de fabrication d’un dispositif electronique flexible du type ecran comportant une pluralite de composants en couches minces |
JP2008541786A JP2009516863A (ja) | 2005-11-22 | 2006-11-20 | 複数の薄膜部品を含むスクリーン形の可撓性電子デバイスを製造する方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0511798A FR2893750B1 (fr) | 2005-11-22 | 2005-11-22 | Procede de fabrication d'un dispositif electronique flexible du type ecran comportant une pluralite de composants en couches minces. |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2893750A1 FR2893750A1 (fr) | 2007-05-25 |
FR2893750B1 true FR2893750B1 (fr) | 2008-03-14 |
Family
ID=36786003
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0511798A Expired - Fee Related FR2893750B1 (fr) | 2005-11-22 | 2005-11-22 | Procede de fabrication d'un dispositif electronique flexible du type ecran comportant une pluralite de composants en couches minces. |
Country Status (5)
Country | Link |
---|---|
US (1) | US20090262294A9 (fr) |
EP (1) | EP1952441A1 (fr) |
JP (1) | JP2009516863A (fr) |
FR (1) | FR2893750B1 (fr) |
WO (1) | WO2007060314A1 (fr) |
Families Citing this family (44)
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JP4866200B2 (ja) * | 2006-10-05 | 2012-02-01 | パナソニック株式会社 | 発光デバイスの製造方法 |
US7968382B2 (en) * | 2007-02-02 | 2011-06-28 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing semiconductor device |
KR100889625B1 (ko) | 2007-07-19 | 2009-03-20 | 삼성모바일디스플레이주식회사 | 접합방법 및 그를 이용한 유기전계발광표시장치의 제조방법 |
JP2011003522A (ja) | 2008-10-16 | 2011-01-06 | Semiconductor Energy Lab Co Ltd | フレキシブル発光装置、電子機器及びフレキシブル発光装置の作製方法 |
US8784189B2 (en) | 2009-06-08 | 2014-07-22 | Cfph, Llc | Interprocess communication regarding movement of game devices |
US8545327B2 (en) * | 2009-06-08 | 2013-10-01 | Cfph, Llc | Amusement device including means for processing electronic data in play of a game in which an outcome is dependant upon card values |
US8419535B2 (en) * | 2009-06-08 | 2013-04-16 | Cfph, Llc | Mobile playing card devices |
US8771078B2 (en) | 2009-06-08 | 2014-07-08 | Cfph, Llc | Amusement device including means for processing electronic data in play of a game of chance |
US8545328B2 (en) * | 2009-06-08 | 2013-10-01 | Cfph, Llc | Portable electronic charge device for card devices |
US8287386B2 (en) * | 2009-06-08 | 2012-10-16 | Cfph, Llc | Electrical transmission among interconnected gaming systems |
US8613671B2 (en) * | 2009-06-08 | 2013-12-24 | Cfph, Llc | Data transfer and control among multiple computer devices in a gaming environment |
JP5594522B2 (ja) * | 2009-07-03 | 2014-09-24 | 日本電気硝子株式会社 | 電子デバイス製造用ガラスフィルム積層体 |
CN101996535A (zh) * | 2009-08-25 | 2011-03-30 | 精工爱普生株式会社 | 电光学装置和电子设备 |
CN102471129B (zh) * | 2009-09-18 | 2015-04-15 | 日本电气硝子株式会社 | 玻璃膜的制造方法及玻璃膜的处理方法以及玻璃膜层叠体 |
US9156230B2 (en) * | 2010-01-12 | 2015-10-13 | Nippon Electric Glass Co., Ltd. | Glass film laminate without adhesive |
JP5748088B2 (ja) * | 2010-03-25 | 2015-07-15 | 日本電気硝子株式会社 | ガラス基板の製造方法 |
KR101779586B1 (ko) * | 2010-09-27 | 2017-10-10 | 엘지디스플레이 주식회사 | 플라스틱 기판을 이용한 표시장치 제조 방법 |
US10543662B2 (en) * | 2012-02-08 | 2020-01-28 | Corning Incorporated | Device modified substrate article and methods for making |
JP5888158B2 (ja) * | 2012-04-05 | 2016-03-16 | 日本電気硝子株式会社 | ガラスフィルムの割断方法 |
JP2013216513A (ja) * | 2012-04-05 | 2013-10-24 | Nippon Electric Glass Co Ltd | ガラスフィルムの切断方法及びガラスフィルム積層体 |
WO2013179881A1 (fr) * | 2012-05-29 | 2013-12-05 | 旭硝子株式会社 | Stratifié en verre et procédé de fabrication d'un dispositif électronique |
US10086584B2 (en) | 2012-12-13 | 2018-10-02 | Corning Incorporated | Glass articles and methods for controlled bonding of glass sheets with carriers |
TWI617437B (zh) | 2012-12-13 | 2018-03-11 | 康寧公司 | 促進控制薄片與載體間接合之處理 |
US10014177B2 (en) | 2012-12-13 | 2018-07-03 | Corning Incorporated | Methods for processing electronic devices |
US9340443B2 (en) * | 2012-12-13 | 2016-05-17 | Corning Incorporated | Bulk annealing of glass sheets |
DE102012112989A1 (de) * | 2012-12-21 | 2014-06-26 | Ev Group E. Thallner Gmbh | Verfahren zum Aufbringen einer Temporärbondschicht |
US10510576B2 (en) | 2013-10-14 | 2019-12-17 | Corning Incorporated | Carrier-bonding methods and articles for semiconductor and interposer processing |
KR102151247B1 (ko) * | 2013-11-11 | 2020-09-03 | 삼성디스플레이 주식회사 | 플렉서블 표시 패널의 제조 방법 및 플렉서블 표시 장치의 제조 방법 |
US20150209654A1 (en) | 2013-11-12 | 2015-07-30 | Deq Systems Corp. | Reconfigurable playing cards and game display devices |
CN106132688B (zh) | 2014-01-27 | 2020-07-14 | 康宁股份有限公司 | 用于薄片与载体的受控粘结的制品和方法 |
SG11201608442TA (en) | 2014-04-09 | 2016-11-29 | Corning Inc | Device modified substrate article and methods for making |
DE102015113041A1 (de) * | 2014-12-01 | 2016-06-02 | Schott Ag | Verfahren und Vorrichtung zur Verarbeitung von dünnen Gläsern |
WO2016118544A1 (fr) * | 2015-01-22 | 2016-07-28 | Corning Incorporated | Procédés pour liaison de substrat hautement flexible à un support et produit formé par ceux-ci |
EP3297824A1 (fr) | 2015-05-19 | 2018-03-28 | Corning Incorporated | Articles et procédés pour lier des feuilles minces à des supports |
WO2016209897A1 (fr) | 2015-06-26 | 2016-12-29 | Corning Incorporated | Procédés et articles comportant une feuille et un support |
FR3053046B1 (fr) | 2016-06-24 | 2018-08-10 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procede de collage reversible entre deux elements |
TW201825623A (zh) | 2016-08-30 | 2018-07-16 | 美商康寧公司 | 用於片材接合的矽氧烷電漿聚合物 |
TWI810161B (zh) | 2016-08-31 | 2023-08-01 | 美商康寧公司 | 具以可控制式黏結的薄片之製品及製作其之方法 |
KR102652732B1 (ko) | 2016-12-15 | 2024-03-28 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 점착 필름 |
US10658592B2 (en) | 2017-07-31 | 2020-05-19 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Method for fabricating flexible display device, flexible display device, and display apparatus |
CN107464893A (zh) * | 2017-07-31 | 2017-12-12 | 武汉华星光电半导体显示技术有限公司 | 柔性显示器件的制备方法、柔性显示器件及显示器 |
WO2019118660A1 (fr) | 2017-12-15 | 2019-06-20 | Corning Incorporated | Procédés de traitement d'un substrat et procédé de fabrication d'articles à base de feuilles liées |
FR3077284B1 (fr) | 2018-01-30 | 2020-03-06 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procede d'encapsulation d'un dispositif microelectronique, par des substrats fins ou ultrafins, facilement manipulables |
TWI800190B (zh) * | 2021-12-30 | 2023-04-21 | 欣興電子股份有限公司 | 玻璃載板保護結構及其製法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7427526B2 (en) * | 1999-12-20 | 2008-09-23 | The Penn State Research Foundation | Deposited thin films and their use in separation and sacrificial layer applications |
FR2823599B1 (fr) * | 2001-04-13 | 2004-12-17 | Commissariat Energie Atomique | Substrat demomtable a tenue mecanique controlee et procede de realisation |
FR2823596B1 (fr) * | 2001-04-13 | 2004-08-20 | Commissariat Energie Atomique | Substrat ou structure demontable et procede de realisation |
US6934001B2 (en) * | 2001-08-13 | 2005-08-23 | Sharp Laboratories Of America, Inc. | Structure and method for supporting a flexible substrate |
US20050136625A1 (en) * | 2002-07-17 | 2005-06-23 | Debora Henseler | Ultra-thin glass devices |
KR100484109B1 (ko) * | 2002-12-14 | 2005-04-18 | 삼성에스디아이 주식회사 | 기판 제조방법, 이 기판제조방법을 이용한 유기 전계발광표시장치의 제조방법 및 유기 전계 발광 표시장치 |
KR100641793B1 (ko) * | 2002-12-26 | 2006-11-02 | 샤프 가부시키가이샤 | 표시패널 및 그 제조방법 |
JP4554180B2 (ja) * | 2003-09-17 | 2010-09-29 | ソニー株式会社 | 薄膜半導体デバイスの製造方法 |
KR20050096562A (ko) * | 2004-03-31 | 2005-10-06 | 엘지.필립스 엘시디 주식회사 | 감온성 점착제를 이용한 액정패널의 제조방법 |
-
2005
- 2005-11-22 FR FR0511798A patent/FR2893750B1/fr not_active Expired - Fee Related
-
2006
- 2006-11-20 WO PCT/FR2006/002543 patent/WO2007060314A1/fr active Application Filing
- 2006-11-20 JP JP2008541786A patent/JP2009516863A/ja not_active Withdrawn
- 2006-11-20 US US12/094,521 patent/US20090262294A9/en not_active Abandoned
- 2006-11-20 EP EP06831137A patent/EP1952441A1/fr not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
WO2007060314A1 (fr) | 2007-05-31 |
US20090262294A9 (en) | 2009-10-22 |
EP1952441A1 (fr) | 2008-08-06 |
JP2009516863A (ja) | 2009-04-23 |
US20080309867A1 (en) | 2008-12-18 |
FR2893750A1 (fr) | 2007-05-25 |
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