FR2855909B1 - Procede d'obtention concomitante d'au moins une paire de structures comprenant au moins une couche utile reportee sur un substrat - Google Patents

Procede d'obtention concomitante d'au moins une paire de structures comprenant au moins une couche utile reportee sur un substrat

Info

Publication number
FR2855909B1
FR2855909B1 FR0306845A FR0306845A FR2855909B1 FR 2855909 B1 FR2855909 B1 FR 2855909B1 FR 0306845 A FR0306845 A FR 0306845A FR 0306845 A FR0306845 A FR 0306845A FR 2855909 B1 FR2855909 B1 FR 2855909B1
Authority
FR
France
Prior art keywords
structures
substrate
pair
useful layer
concurrent production
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0306845A
Other languages
English (en)
Other versions
FR2855909A1 (fr
Inventor
Bruno Ghyselen
Cecile Aulnette
Benoit Bataillou
Carlos Mazure
Hubert Moriceau
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Soitec SA
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Soitec SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA, Soitec SA filed Critical Commissariat a lEnergie Atomique CEA
Priority to FR0306845A priority Critical patent/FR2855909B1/fr
Priority to US10/686,084 priority patent/US7115481B2/en
Priority to EP04767237A priority patent/EP1631983A1/fr
Priority to JP2006508351A priority patent/JP4625913B2/ja
Priority to PCT/FR2004/001368 priority patent/WO2005004232A1/fr
Priority to CNB2004800118243A priority patent/CN100358124C/zh
Priority to KR1020057022437A priority patent/KR100751150B1/ko
Publication of FR2855909A1 publication Critical patent/FR2855909A1/fr
Application granted granted Critical
Publication of FR2855909B1 publication Critical patent/FR2855909B1/fr
Priority to US11/509,047 priority patent/US7407867B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
    • H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/977—Thinning or removal of substrate
FR0306845A 2003-06-06 2003-06-06 Procede d'obtention concomitante d'au moins une paire de structures comprenant au moins une couche utile reportee sur un substrat Expired - Fee Related FR2855909B1 (fr)

Priority Applications (8)

Application Number Priority Date Filing Date Title
FR0306845A FR2855909B1 (fr) 2003-06-06 2003-06-06 Procede d'obtention concomitante d'au moins une paire de structures comprenant au moins une couche utile reportee sur un substrat
US10/686,084 US7115481B2 (en) 2003-06-06 2003-10-14 Method for concurrently producing at least a pair of semiconductor structures that each include at least one useful layer on a substrate
JP2006508351A JP4625913B2 (ja) 2003-06-06 2004-06-03 有用層で被覆された一対の基板の同時製造方法
PCT/FR2004/001368 WO2005004232A1 (fr) 2003-06-06 2004-06-03 Procede d'obtention concomitante d'une paire de substrats recouverts d'une couche utile
EP04767237A EP1631983A1 (fr) 2003-06-06 2004-06-03 Procede d'obtention concomitante d'une paire de substrats recouverts d'une couche utile
CNB2004800118243A CN100358124C (zh) 2003-06-06 2004-06-03 用于同时得到一对由有用层覆盖的衬底的方法
KR1020057022437A KR100751150B1 (ko) 2003-06-06 2004-06-03 이송층에 의해 덮혀진 한 쌍의 기판을 동시에 얻는 방법
US11/509,047 US7407867B2 (en) 2003-06-06 2006-08-24 Method for concurrently producing at least a pair of semiconductor structures that each include at least one useful layer on a substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0306845A FR2855909B1 (fr) 2003-06-06 2003-06-06 Procede d'obtention concomitante d'au moins une paire de structures comprenant au moins une couche utile reportee sur un substrat

Publications (2)

Publication Number Publication Date
FR2855909A1 FR2855909A1 (fr) 2004-12-10
FR2855909B1 true FR2855909B1 (fr) 2005-08-26

Family

ID=33443190

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0306845A Expired - Fee Related FR2855909B1 (fr) 2003-06-06 2003-06-06 Procede d'obtention concomitante d'au moins une paire de structures comprenant au moins une couche utile reportee sur un substrat

Country Status (7)

Country Link
US (2) US7115481B2 (fr)
EP (1) EP1631983A1 (fr)
JP (1) JP4625913B2 (fr)
KR (1) KR100751150B1 (fr)
CN (1) CN100358124C (fr)
FR (1) FR2855909B1 (fr)
WO (1) WO2005004232A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8951887B2 (en) 2011-06-23 2015-02-10 Soitec Process for fabricating a semiconductor structure employing a temporary bond

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FR2892228B1 (fr) * 2005-10-18 2008-01-25 Soitec Silicon On Insulator Procede de recyclage d'une plaquette donneuse epitaxiee
US20090325362A1 (en) * 2003-01-07 2009-12-31 Nabil Chhaimi Method of recycling an epitaxied donor wafer
FR2855910B1 (fr) * 2003-06-06 2005-07-15 Commissariat Energie Atomique Procede d'obtention d'une couche tres mince par amincissement par auto-portage provoque
US20060194400A1 (en) * 2005-01-21 2006-08-31 Cooper James A Method for fabricating a semiconductor device
JP2006210660A (ja) * 2005-01-28 2006-08-10 Hitachi Cable Ltd 半導体基板の製造方法
US7262112B2 (en) * 2005-06-27 2007-08-28 The Regents Of The University Of California Method for producing dislocation-free strained crystalline films
EP1777735A3 (fr) * 2005-10-18 2009-08-19 S.O.I.Tec Silicon on Insulator Technologies Procédé de recyclage d'une plaquette donneuse épitaxiée
FR2896618B1 (fr) 2006-01-23 2008-05-23 Soitec Silicon On Insulator Procede de fabrication d'un substrat composite
FR2896619B1 (fr) * 2006-01-23 2008-05-23 Soitec Silicon On Insulator Procede de fabrication d'un substrat composite a proprietes electriques ameliorees
IL174844A (en) 2006-04-06 2011-02-28 Semi Conductor Devices An Elbit Systems Rafael Partnership Unipolar semiconductor photodetector with suppressed dark current and method for producing the same
EP1950803B1 (fr) 2007-01-24 2011-07-27 S.O.I.TEC Silicon on Insulator Technologies S.A. Procédé de fabrication de plaquettes silicium sur isolant, et plaquette correspondante
EP1986229A1 (fr) * 2007-04-27 2008-10-29 S.O.I.T.E.C. Silicon on Insulator Technologies Procédé de fabrication de galettes de matériau composé et galette de matériau composé correspondante
US7795114B2 (en) * 2007-08-10 2010-09-14 Semiconductor Energy Laboratory Co., Ltd. Manufacturing methods of SOI substrate and semiconductor device
US7781308B2 (en) * 2007-12-03 2010-08-24 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing SOI substrate
US7820527B2 (en) * 2008-02-20 2010-10-26 Varian Semiconductor Equipment Associates, Inc. Cleave initiation using varying ion implant dose
JP2009212387A (ja) * 2008-03-05 2009-09-17 Semiconductor Energy Lab Co Ltd 半導体基板の製造方法
FR2929758B1 (fr) * 2008-04-07 2011-02-11 Commissariat Energie Atomique Procede de transfert a l'aide d'un substrat ferroelectrique
FR2934924B1 (fr) * 2008-08-06 2011-04-22 Soitec Silicon On Insulator Procede de multi implantation dans un substrat.
EP2157602A1 (fr) * 2008-08-20 2010-02-24 Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. Procédé de fabrication de plusieurs wafers de fabrication
JP5611571B2 (ja) * 2008-11-27 2014-10-22 株式会社半導体エネルギー研究所 半導体基板の作製方法及び半導体装置の作製方法
JP5404135B2 (ja) * 2009-03-31 2014-01-29 株式会社ブリヂストン 支持基板、貼り合わせ基板、支持基板の製造方法、及び貼り合わせ基板の製造方法
FR2944914B1 (fr) * 2009-04-22 2011-05-20 Commissariat Energie Atomique Procede de transfert d'au moins une couche micro-technologique
FR2940852A1 (fr) * 2009-04-22 2010-07-09 Commissariat Energie Atomique Procede de transfert d'une couche depuis un substrat de depart vers un substrat final, par double fragilisation
US8546238B2 (en) 2009-04-22 2013-10-01 Commissariat A L'energie Atomique Et Aux Energies Method for transferring at least one micro-technological layer
US8513090B2 (en) * 2009-07-16 2013-08-20 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor substrate, and semiconductor device
US20110108854A1 (en) * 2009-11-10 2011-05-12 Chien-Min Sung Substantially lattice matched semiconductor materials and associated methods
US8921239B2 (en) * 2009-12-15 2014-12-30 Soitec Process for recycling a substrate
CN102194827A (zh) * 2010-03-16 2011-09-21 北京大学 一种基于高介电常数材料的抗辐照soi器件及制备方法
CN102820251A (zh) * 2011-06-08 2012-12-12 中国科学院上海微系统与信息技术研究所 一种基于键合工艺的高k介质埋层的soi材料制备方法
JPWO2013105634A1 (ja) * 2012-01-12 2015-05-11 信越化学工業株式会社 熱酸化異種複合基板及びその製造方法
US10543662B2 (en) 2012-02-08 2020-01-28 Corning Incorporated Device modified substrate article and methods for making
FR2992464B1 (fr) * 2012-06-26 2015-04-03 Soitec Silicon On Insulator Procede de transfert d'une couche
US10014177B2 (en) 2012-12-13 2018-07-03 Corning Incorporated Methods for processing electronic devices
TWI617437B (zh) 2012-12-13 2018-03-11 康寧公司 促進控制薄片與載體間接合之處理
US10086584B2 (en) 2012-12-13 2018-10-02 Corning Incorporated Glass articles and methods for controlled bonding of glass sheets with carriers
US9340443B2 (en) 2012-12-13 2016-05-17 Corning Incorporated Bulk annealing of glass sheets
US10510576B2 (en) 2013-10-14 2019-12-17 Corning Incorporated Carrier-bonding methods and articles for semiconductor and interposer processing
KR102353030B1 (ko) 2014-01-27 2022-01-19 코닝 인코포레이티드 얇은 시트와 캐리어의 제어된 결합을 위한 물품 및 방법
EP3129221A1 (fr) 2014-04-09 2017-02-15 Corning Incorporated Article de substrat modifié de dispositif et procédés de fabrication
FR3029538B1 (fr) * 2014-12-04 2019-04-26 Soitec Procede de transfert de couche
EP3297824A1 (fr) 2015-05-19 2018-03-28 Corning Incorporated Articles et procédés pour lier des feuilles minces à des supports
KR102524620B1 (ko) 2015-06-26 2023-04-21 코닝 인코포레이티드 시트 및 캐리어를 포함하는 방법들 및 물품들
FR3051979B1 (fr) * 2016-05-25 2018-05-18 Soitec Procede de guerison de defauts dans une couche obtenue par implantation puis detachement d'un substrat
TW202216444A (zh) 2016-08-30 2022-05-01 美商康寧公司 用於片材接合的矽氧烷電漿聚合物
TWI810161B (zh) 2016-08-31 2023-08-01 美商康寧公司 具以可控制式黏結的薄片之製品及製作其之方法
US11331692B2 (en) 2017-12-15 2022-05-17 Corning Incorporated Methods for treating a substrate and method for making articles comprising bonded sheets
CN110078017B (zh) * 2018-01-26 2021-11-05 沈阳硅基科技有限公司 一种贯穿空腔结构硅片的加工方法

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JP3697052B2 (ja) * 1997-03-26 2005-09-21 キヤノン株式会社 基板の製造方法及び半導体膜の製造方法
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8951887B2 (en) 2011-06-23 2015-02-10 Soitec Process for fabricating a semiconductor structure employing a temporary bond

Also Published As

Publication number Publication date
CN100358124C (zh) 2007-12-26
US20060286770A1 (en) 2006-12-21
US7407867B2 (en) 2008-08-05
US7115481B2 (en) 2006-10-03
EP1631983A1 (fr) 2006-03-08
CN1781188A (zh) 2006-05-31
US20040248378A1 (en) 2004-12-09
FR2855909A1 (fr) 2004-12-10
KR100751150B1 (ko) 2007-08-22
WO2005004232A1 (fr) 2005-01-13
JP4625913B2 (ja) 2011-02-02
JP2006527478A (ja) 2006-11-30
KR20060017615A (ko) 2006-02-24

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Legal Events

Date Code Title Description
CD Change of name or company name

Owner name: COMMISSARIAT A L ENERGIE ATOMIQUE, FR

Effective date: 20120423

Owner name: SOITEC, FR

Effective date: 20120423

ST Notification of lapse

Effective date: 20150227