FR2838865B1 - Procede de fabrication d'un substrat avec couche utile sur support de resistivite elevee - Google Patents
Procede de fabrication d'un substrat avec couche utile sur support de resistivite eleveeInfo
- Publication number
- FR2838865B1 FR2838865B1 FR0205054A FR0205054A FR2838865B1 FR 2838865 B1 FR2838865 B1 FR 2838865B1 FR 0205054 A FR0205054 A FR 0205054A FR 0205054 A FR0205054 A FR 0205054A FR 2838865 B1 FR2838865 B1 FR 2838865B1
- Authority
- FR
- France
- Prior art keywords
- producing
- substrate
- high resistivity
- useful layer
- resistivity support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/322—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections
- H01L21/3221—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections of silicon bodies, e.g. for gettering
- H01L21/3225—Thermally inducing defects using oxygen present in the silicon body for intrinsic gettering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/322—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections
- H01L21/3221—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections of silicon bodies, e.g. for gettering
- H01L21/3226—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections of silicon bodies, e.g. for gettering of silicon on insulator
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
- H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/30—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by physical imperfections; having polished or roughened surface
- H01L29/32—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by physical imperfections; having polished or roughened surface the imperfections being within the semiconductor body
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0205054A FR2838865B1 (fr) | 2002-04-23 | 2002-04-23 | Procede de fabrication d'un substrat avec couche utile sur support de resistivite elevee |
EP03727798.5A EP1497854B1 (fr) | 2002-04-23 | 2003-04-23 | Procede pour fabriquer un substrat presentant une couche utile sur un support a haute resistivite |
KR1020047017132A KR100797212B1 (ko) | 2002-04-23 | 2003-04-23 | 고 저항성 지지체 상에 유용층을 구비한 기판의 제조 방법 |
JP2004500314A JP2005524228A (ja) | 2002-04-23 | 2003-04-23 | 高抵抗支持体上に有用層を有する基板の製造方法 |
PCT/IB2003/002237 WO2003092041A2 (fr) | 2002-04-23 | 2003-04-23 | Procede pour fabriquer un substrat presentant une couche utile sur un support a haute resistivite |
AU2003232998A AU2003232998A1 (en) | 2002-04-23 | 2003-04-23 | Method for fabricating a soi substrate a high resistivity support substrate |
US10/968,695 US7268060B2 (en) | 2002-04-23 | 2004-10-18 | Method for fabricating a substrate with useful layer on high resistivity support |
US11/831,217 US7586154B2 (en) | 2002-04-23 | 2007-07-31 | Method for fabricating a substrate with useful layer on high resistivity support |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0205054A FR2838865B1 (fr) | 2002-04-23 | 2002-04-23 | Procede de fabrication d'un substrat avec couche utile sur support de resistivite elevee |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2838865A1 FR2838865A1 (fr) | 2003-10-24 |
FR2838865B1 true FR2838865B1 (fr) | 2005-10-14 |
Family
ID=28686280
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0205054A Expired - Lifetime FR2838865B1 (fr) | 2002-04-23 | 2002-04-23 | Procede de fabrication d'un substrat avec couche utile sur support de resistivite elevee |
Country Status (7)
Country | Link |
---|---|
US (2) | US7268060B2 (fr) |
EP (1) | EP1497854B1 (fr) |
JP (1) | JP2005524228A (fr) |
KR (1) | KR100797212B1 (fr) |
AU (1) | AU2003232998A1 (fr) |
FR (1) | FR2838865B1 (fr) |
WO (1) | WO2003092041A2 (fr) |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2773261B1 (fr) | 1997-12-30 | 2000-01-28 | Commissariat Energie Atomique | Procede pour le transfert d'un film mince comportant une etape de creation d'inclusions |
WO2004061943A1 (fr) * | 2003-01-07 | 2004-07-22 | S.O.I.Tec Silicon On Insulator Technologies | Recyclage par des moyens mecaniques d'une plaquette comprenant une structure multicouche apres separation d'une couche mince de celle-ci |
US20090325362A1 (en) * | 2003-01-07 | 2009-12-31 | Nabil Chhaimi | Method of recycling an epitaxied donor wafer |
FR2857953B1 (fr) * | 2003-07-21 | 2006-01-13 | Commissariat Energie Atomique | Structure empilee, et procede pour la fabriquer |
US20060138601A1 (en) * | 2004-12-27 | 2006-06-29 | Memc Electronic Materials, Inc. | Internally gettered heteroepitaxial semiconductor wafers and methods of manufacturing such wafers |
FR2896618B1 (fr) * | 2006-01-23 | 2008-05-23 | Soitec Silicon On Insulator | Procede de fabrication d'un substrat composite |
EP1835533B1 (fr) * | 2006-03-14 | 2020-06-03 | Soitec | Méthode de fabrication de plaquettes composites et procédé de recyclage d'un substrat donneur usagé |
US20090061593A1 (en) * | 2007-08-28 | 2009-03-05 | Kishor Purushottam Gadkaree | Semiconductor Wafer Re-Use in an Exfoliation Process Using Heat Treatment |
FR2929755B1 (fr) * | 2008-04-03 | 2011-04-22 | Commissariat Energie Atomique | Procede de traitement d'un substrat semi-conducteur par activation thermique d'elements legers |
FR2929758B1 (fr) * | 2008-04-07 | 2011-02-11 | Commissariat Energie Atomique | Procede de transfert a l'aide d'un substrat ferroelectrique |
FR2933235B1 (fr) * | 2008-06-30 | 2010-11-26 | Soitec Silicon On Insulator | Substrat bon marche et procede de fabrication associe |
FR2933234B1 (fr) * | 2008-06-30 | 2016-09-23 | S O I Tec Silicon On Insulator Tech | Substrat bon marche a structure double et procede de fabrication associe |
FR2933233B1 (fr) * | 2008-06-30 | 2010-11-26 | Soitec Silicon On Insulator | Substrat de haute resistivite bon marche et procede de fabrication associe |
JP5532680B2 (ja) * | 2009-05-27 | 2014-06-25 | 信越半導体株式会社 | Soiウェーハの製造方法およびsoiウェーハ |
FR2947098A1 (fr) | 2009-06-18 | 2010-12-24 | Commissariat Energie Atomique | Procede de transfert d'une couche mince sur un substrat cible ayant un coefficient de dilatation thermique different de celui de la couche mince |
KR20130029110A (ko) * | 2010-06-30 | 2013-03-21 | 코닝 인코포레이티드 | 절연체 기판상의 실리콘 마감을 위한 방법 |
WO2012088710A1 (fr) * | 2010-12-27 | 2012-07-05 | 上海新傲科技股份有限公司 | Procédé de préparation d'un substrat à semi-conducteur doté d'une couche enterrée isolante faisant appel à un processus de getterisation |
FR2973159B1 (fr) | 2011-03-22 | 2013-04-19 | Soitec Silicon On Insulator | Procede de fabrication d'un substrat de base |
FR2973158B1 (fr) * | 2011-03-22 | 2014-02-28 | Soitec Silicon On Insulator | Procédé de fabrication d'un substrat de type semi-conducteur sur isolant pour applications radiofréquences |
FR2983342B1 (fr) * | 2011-11-30 | 2016-05-20 | Soitec Silicon On Insulator | Procede de fabrication d'une heterostructure limitant la formation de defauts et heterostructure ainsi obtenue |
US8536035B2 (en) | 2012-02-01 | 2013-09-17 | International Business Machines Corporation | Silicon-on-insulator substrate and method of forming |
JP6232993B2 (ja) * | 2013-12-12 | 2017-11-22 | 日立化成株式会社 | 半導体基板の製造方法、半導体基板、太陽電池素子の製造方法及び太陽電池素子 |
JP6179530B2 (ja) * | 2015-01-23 | 2017-08-16 | 信越半導体株式会社 | 貼り合わせsoiウェーハの製造方法 |
FR3037438B1 (fr) | 2015-06-09 | 2017-06-16 | Soitec Silicon On Insulator | Procede de fabrication d'un element semi-conducteur comprenant une couche de piegeage de charges |
FR3051968B1 (fr) * | 2016-05-25 | 2018-06-01 | Soitec | Procede de fabrication d'un substrat semi-conducteur a haute resistivite |
FR3058561B1 (fr) | 2016-11-04 | 2018-11-02 | Soitec | Procede de fabrication d'un element semi-conducteur comprenant un substrat hautement resistif |
FR3062238A1 (fr) | 2017-01-26 | 2018-07-27 | Soitec | Support pour une structure semi-conductrice |
FR3064820B1 (fr) | 2017-03-31 | 2019-11-29 | Soitec | Procede d'ajustement de l'etat de contrainte d'un film piezoelectrique |
JP7230297B2 (ja) | 2018-07-05 | 2023-03-01 | ソイテック | 集積された高周波デバイスのための基板及びそれを製造するための方法 |
FR3098642B1 (fr) | 2019-07-12 | 2021-06-11 | Soitec Silicon On Insulator | procédé de fabrication d'une structure comprenant une couche mince reportée sur un support muni d’une couche de piégeage de charges |
FR3121548B1 (fr) | 2021-03-30 | 2024-02-16 | Soitec Silicon On Insulator | Procede de preparation d’un substrat avance, notamment pour des applications photoniques |
JP2023535319A (ja) | 2020-07-28 | 2023-08-17 | ソイテック | 電荷トラップ層が設けられたキャリア基板に薄層を転写するプロセス |
FR3113184B1 (fr) | 2020-07-28 | 2022-09-16 | Soitec Silicon On Insulator | Procede de preparation d’un substrat support, et procede de report d’une couche mince sur ce substrat support |
FR3119929B1 (fr) * | 2021-02-15 | 2023-11-03 | Soitec Silicon On Insulator | Procede de fabrication d’une structure adaptee pour les applications radiofrequences, et substrat support pour ladite structure |
FR3129029B1 (fr) | 2021-11-09 | 2023-09-29 | Soitec Silicon On Insulator | Procede de preparation d’un substrat support muni d’une couche de piegeage de charges |
FR3129028B1 (fr) | 2021-11-09 | 2023-11-10 | Soitec Silicon On Insulator | Procede de preparation d’un substrat support muni d’une couche de piegeage de charges |
FR3137493A1 (fr) | 2022-06-29 | 2024-01-05 | Soitec | Procede de fabrication d’une structure comportant une couche barriere a la diffusion d’especes atomiques |
FR3137490A1 (fr) | 2022-07-04 | 2024-01-05 | Soitec | Procede de fabrication d’une structure comportant une couche barriere a la diffusion d’especes atomiques |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5856343A (ja) * | 1981-09-29 | 1983-04-04 | Fujitsu Ltd | 半導体装置の製造方法 |
JPS5887833A (ja) * | 1981-11-20 | 1983-05-25 | Hitachi Ltd | 半導体装置の製造方法 |
DE3240351A1 (de) * | 1982-10-30 | 1984-05-03 | Wabco Westinghouse Steuerungstechnik GmbH & Co, 3000 Hannover | Druckmittelbetaetigter arbeitszylinder |
KR960019696A (ko) * | 1994-11-23 | 1996-06-17 | 김광호 | 커패시터 구조 및 그 제조방법 |
JPH08293589A (ja) * | 1995-04-21 | 1996-11-05 | Hitachi Ltd | 半導体基板および半導体装置 |
JPH10135164A (ja) * | 1996-10-29 | 1998-05-22 | Komatsu Electron Metals Co Ltd | 半導体ウェハの製造方法 |
JP3271658B2 (ja) * | 1998-03-23 | 2002-04-02 | 信越半導体株式会社 | 半導体シリコン単結晶ウェーハのラップ又は研磨方法 |
KR100269331B1 (ko) * | 1998-07-06 | 2000-10-16 | 윤종용 | 고유전체막을 구비하는 커패시터 형성방법 |
JP2000031439A (ja) * | 1998-07-13 | 2000-01-28 | Fuji Electric Co Ltd | Soi基板およびその製造方法 |
DE60041309D1 (de) | 1999-03-16 | 2009-02-26 | Shinetsu Handotai Kk | Herstellungsverfahren für siliziumwafer und siliziumwafer |
JP2002009081A (ja) * | 2000-06-26 | 2002-01-11 | Toshiba Corp | 半導体装置及びその製造方法 |
-
2002
- 2002-04-23 FR FR0205054A patent/FR2838865B1/fr not_active Expired - Lifetime
-
2003
- 2003-04-23 KR KR1020047017132A patent/KR100797212B1/ko active IP Right Grant
- 2003-04-23 EP EP03727798.5A patent/EP1497854B1/fr not_active Expired - Lifetime
- 2003-04-23 AU AU2003232998A patent/AU2003232998A1/en not_active Abandoned
- 2003-04-23 JP JP2004500314A patent/JP2005524228A/ja active Pending
- 2003-04-23 WO PCT/IB2003/002237 patent/WO2003092041A2/fr active Application Filing
-
2004
- 2004-10-18 US US10/968,695 patent/US7268060B2/en not_active Expired - Lifetime
-
2007
- 2007-07-31 US US11/831,217 patent/US7586154B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US20070269663A1 (en) | 2007-11-22 |
AU2003232998A8 (en) | 2003-11-10 |
JP2005524228A (ja) | 2005-08-11 |
US20050112845A1 (en) | 2005-05-26 |
EP1497854A2 (fr) | 2005-01-19 |
KR100797212B1 (ko) | 2008-01-23 |
EP1497854B1 (fr) | 2019-08-07 |
KR20040102169A (ko) | 2004-12-03 |
AU2003232998A1 (en) | 2003-11-10 |
US7268060B2 (en) | 2007-09-11 |
WO2003092041A2 (fr) | 2003-11-06 |
WO2003092041A3 (fr) | 2003-12-24 |
FR2838865A1 (fr) | 2003-10-24 |
WO2003092041B1 (fr) | 2004-04-01 |
US7586154B2 (en) | 2009-09-08 |
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Legal Events
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Owner name: SOITEC, FR Effective date: 20120423 |
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