DE602007013478D1 - RFID-Vorrichtung - Google Patents
RFID-VorrichtungInfo
- Publication number
- DE602007013478D1 DE602007013478D1 DE602007013478T DE602007013478T DE602007013478D1 DE 602007013478 D1 DE602007013478 D1 DE 602007013478D1 DE 602007013478 T DE602007013478 T DE 602007013478T DE 602007013478 T DE602007013478 T DE 602007013478T DE 602007013478 D1 DE602007013478 D1 DE 602007013478D1
- Authority
- DE
- Germany
- Prior art keywords
- rfid device
- rfid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
- B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
- B05B13/0278—Arrangement or mounting of spray heads
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/30—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages
- B05B1/3033—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages the control being effected by relative coaxial longitudinal movement of the controlling element and the spray head
- B05B1/304—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages the control being effected by relative coaxial longitudinal movement of the controlling element and the spray head the controlling element being a lift valve
- B05B1/3046—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages the control being effected by relative coaxial longitudinal movement of the controlling element and the spray head the controlling element being a lift valve the valve element, e.g. a needle, co-operating with a valve seat located downstream of the valve element and its actuating means, generally in the proximity of the outlet orifice
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/002—Manually-actuated controlling means, e.g. push buttons, levers or triggers
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- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Thin Film Transistor (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006031720 | 2006-02-08 |
Publications (1)
Publication Number | Publication Date |
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DE602007013478D1 true DE602007013478D1 (de) | 2011-05-12 |
Family
ID=37944356
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602007013478T Active DE602007013478D1 (de) | 2006-02-08 | 2007-01-31 | RFID-Vorrichtung |
Country Status (4)
Country | Link |
---|---|
US (1) | US8138614B2 (de) |
EP (2) | EP1818860B1 (de) |
KR (1) | KR101402104B1 (de) |
DE (1) | DE602007013478D1 (de) |
Families Citing this family (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8518304B1 (en) | 2003-03-31 | 2013-08-27 | The Research Foundation Of State University Of New York | Nano-structure enhancements for anisotropic conductive material and thermal interposers |
US7923800B2 (en) * | 2006-12-27 | 2011-04-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and electronic device |
US8354724B2 (en) * | 2007-03-26 | 2013-01-15 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and electronic device |
JP5408930B2 (ja) * | 2007-08-31 | 2014-02-05 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
TWM336510U (en) * | 2007-09-04 | 2008-07-11 | Genesys Logic Inc | Non-volatile memory storage device |
WO2009139282A1 (en) * | 2008-05-12 | 2009-11-19 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing semiconductor device |
US8081118B2 (en) * | 2008-05-15 | 2011-12-20 | The Boeing Company | Phased array antenna radiator assembly and method of forming same |
EP2297778A1 (de) * | 2008-05-23 | 2011-03-23 | Semiconductor Energy Laboratory Co, Ltd. | Halbleiterbauelement |
WO2009142310A1 (en) | 2008-05-23 | 2009-11-26 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
WO2009148001A1 (en) * | 2008-06-06 | 2009-12-10 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
US8053253B2 (en) * | 2008-06-06 | 2011-11-08 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
JP5248412B2 (ja) * | 2008-06-06 | 2013-07-31 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
WO2010005064A1 (en) | 2008-07-10 | 2010-01-14 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device and electronic device |
TWI475282B (zh) * | 2008-07-10 | 2015-03-01 | Semiconductor Energy Lab | 液晶顯示裝置和其製造方法 |
JP5216716B2 (ja) | 2008-08-20 | 2013-06-19 | 株式会社半導体エネルギー研究所 | 発光装置及びその作製方法 |
WO2010032602A1 (en) | 2008-09-18 | 2010-03-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
WO2010032611A1 (en) | 2008-09-19 | 2010-03-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
WO2010035627A1 (en) | 2008-09-25 | 2010-04-01 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
WO2010035625A1 (en) | 2008-09-25 | 2010-04-01 | Semiconductor Energy Laboratory Co., Ltd. | Semi conductor device |
KR101611643B1 (ko) * | 2008-10-01 | 2016-04-11 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
US8739402B2 (en) * | 2008-12-17 | 2014-06-03 | Microconnections Sas | Method of manufacture of IC contactless communication devices |
JPWO2010070779A1 (ja) * | 2008-12-19 | 2012-05-24 | パナソニック株式会社 | 異方性導電樹脂、基板接続構造及び電子機器 |
JP2010157112A (ja) * | 2008-12-26 | 2010-07-15 | Sony Corp | Icカード、データ制御方法およびプログラム |
US8877648B2 (en) | 2009-03-26 | 2014-11-04 | Semprius, Inc. | Methods of forming printable integrated circuit devices by selective etching to suspend the devices from a handling substrate and devices formed thereby |
TWI517268B (zh) * | 2009-08-07 | 2016-01-11 | 半導體能源研究所股份有限公司 | 端子構造的製造方法和電子裝置的製造方法 |
JP5719560B2 (ja) * | 2009-10-21 | 2015-05-20 | 株式会社半導体エネルギー研究所 | 端子構造の作製方法 |
US8686297B2 (en) | 2011-08-29 | 2014-04-01 | Apple Inc. | Laminated flex circuit layers for electronic device components |
KR101952844B1 (ko) * | 2011-09-14 | 2019-02-28 | 삼성전기주식회사 | 전력 모듈 패키지 및 그 제조방법 |
US9269914B2 (en) | 2013-08-01 | 2016-02-23 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device, electronic device, and lighting device |
US10046542B2 (en) | 2014-01-27 | 2018-08-14 | Corning Incorporated | Articles and methods for controlled bonding of thin sheets with carriers |
EP3129221A1 (de) | 2014-04-09 | 2017-02-15 | Corning Incorporated | Vorrichtungsmodifizierter substratartikel und herstellungsverfahren |
JP2015216072A (ja) * | 2014-05-13 | 2015-12-03 | 株式会社ジャパンディスプレイ | 有機el装置及びその製造方法 |
WO2016059497A1 (en) | 2014-10-17 | 2016-04-21 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device, module, electronic device, and method for manufacturing light-emitting device |
JP2018524201A (ja) | 2015-05-19 | 2018-08-30 | コーニング インコーポレイテッド | シートをキャリアと結合するための物品および方法 |
JP7106276B2 (ja) | 2015-06-26 | 2022-07-26 | コーニング インコーポレイテッド | シート及び担体を有する物品及び方法 |
KR102632066B1 (ko) | 2015-07-30 | 2024-02-02 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치의 제작 방법, 발광 장치, 모듈, 및 전자 기기 |
EP3156947B1 (de) * | 2015-10-12 | 2020-01-01 | Nxp B.V. | Elektronische vorrichtung |
TW202216444A (zh) | 2016-08-30 | 2022-05-01 | 美商康寧公司 | 用於片材接合的矽氧烷電漿聚合物 |
TWI821867B (zh) | 2016-08-31 | 2023-11-11 | 美商康寧公司 | 具以可控制式黏結的薄片之製品及製作其之方法 |
JP7260523B2 (ja) | 2017-08-18 | 2023-04-18 | コーニング インコーポレイテッド | ポリカチオン性高分子を使用した一時的結合 |
CN111615567B (zh) | 2017-12-15 | 2023-04-14 | 康宁股份有限公司 | 用于处理基板的方法和用于制备包括粘合片材的制品的方法 |
FR3095735B1 (fr) * | 2019-05-03 | 2021-05-21 | Idemia Identity & Security France | Etui d’enrôlement pour carte à puce |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4278510A (en) * | 1980-03-31 | 1981-07-14 | Gulf Oil Corporation | Platable propylene polymer compositions |
US4642263A (en) * | 1984-12-18 | 1987-02-10 | American Hoechst Corporation | Antistat coated films |
US4851487A (en) * | 1988-02-22 | 1989-07-25 | Lockheed Corporation | Conductive polymer materials and method of producing same |
DE4107729A1 (de) | 1991-03-11 | 1992-09-17 | Philips Patentverwaltung | Anordnung zur erzeugung von digitalsignalen |
JPH05334912A (ja) * | 1992-06-01 | 1993-12-17 | Casio Comput Co Ltd | 異方性導電接着剤および導電接続構造 |
JPH10198778A (ja) * | 1997-01-14 | 1998-07-31 | Rohm Co Ltd | Icカード |
EP0921147B1 (de) | 1997-12-03 | 2005-01-12 | Nissan Chemical Industries, Limited | Transparente leitfähige Polymere |
US6107920A (en) * | 1998-06-09 | 2000-08-22 | Motorola, Inc. | Radio frequency identification tag having an article integrated antenna |
US6018299A (en) * | 1998-06-09 | 2000-01-25 | Motorola, Inc. | Radio frequency identification tag having a printed antenna and method |
US6359444B1 (en) * | 1999-05-28 | 2002-03-19 | University Of Kentucky Research Foundation | Remote resonant-circuit analyte sensing apparatus with sensing structure and associated method of sensing |
TW561266B (en) * | 1999-09-17 | 2003-11-11 | Jsr Corp | Anisotropic conductive sheet, its manufacturing method, and connector |
KR100426344B1 (ko) * | 2001-03-21 | 2004-04-06 | 이석현 | 용해성 자발배열 물질 및 그 물질을 포함하는 전도성고분자 조성물 |
CN1656574A (zh) | 2002-04-01 | 2005-08-17 | 环球产权公司 | 导电的聚合物泡沫和弹性体及其制造方法 |
US6937153B2 (en) * | 2002-06-28 | 2005-08-30 | Appleton Papers Inc. | Thermal imaging paper laminate |
KR101003406B1 (ko) | 2002-10-09 | 2010-12-23 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광장치의 제조방법 |
WO2004068389A2 (en) | 2003-01-28 | 2004-08-12 | Conductive Inkjet Technology Limited | Method of forming a conductive metal region on a substrate |
WO2004086070A1 (ja) | 2003-03-25 | 2004-10-07 | Semiconductor Energy Laboratory Co. Ltd. | 半導体装置の検査回路、および検査方法 |
JP3803097B2 (ja) | 2003-10-07 | 2006-08-02 | 株式会社日立製作所 | 無線通信媒体の製造方法 |
US20050130397A1 (en) * | 2003-10-29 | 2005-06-16 | Bentley Philip G. | Formation of layers on substrates |
WO2005044451A1 (en) * | 2003-10-29 | 2005-05-19 | Conductive Inkjet Technology Limited | Electrical connection of components |
JP2007510063A (ja) | 2003-10-29 | 2007-04-19 | コンダクティブ・インクジェット・テクノロジー・リミテッド | 基板上の層の形成 |
US7243421B2 (en) * | 2003-10-29 | 2007-07-17 | Conductive Inkjet Technology Limited | Electrical connection of components |
EP1689909B1 (de) | 2003-12-05 | 2017-10-11 | CIT Technology Limited | Ausbildung von festen schichten auf trägern |
US8435603B2 (en) * | 2003-12-05 | 2013-05-07 | Conductive Inkjet Technology Limited | Formation of solid layers on substrates |
JP2005174220A (ja) * | 2003-12-15 | 2005-06-30 | Konica Minolta Photo Imaging Inc | Icカード及びicカードの製造方法 |
JP4494003B2 (ja) * | 2003-12-19 | 2010-06-30 | 株式会社半導体エネルギー研究所 | 半導体装置 |
US7271076B2 (en) | 2003-12-19 | 2007-09-18 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of thin film integrated circuit device and manufacturing method of non-contact type thin film integrated circuit device |
US7405665B2 (en) | 2003-12-19 | 2008-07-29 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, RFID tag and label-like object |
US7342490B2 (en) * | 2004-11-23 | 2008-03-11 | Alien Technology Corporation | Radio frequency identification static discharge protection |
US7482925B2 (en) * | 2005-06-24 | 2009-01-27 | Visa U.S.A. | Apparatus and method to electromagnetically shield portable consumer devices |
-
2007
- 2007-01-31 EP EP07002102A patent/EP1818860B1/de not_active Not-in-force
- 2007-01-31 DE DE602007013478T patent/DE602007013478D1/de active Active
- 2007-01-31 EP EP10010109.6A patent/EP2259213B1/de not_active Not-in-force
- 2007-02-05 US US11/702,085 patent/US8138614B2/en not_active Expired - Fee Related
- 2007-02-05 KR KR1020070011384A patent/KR101402104B1/ko active IP Right Grant
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KR20070080829A (ko) | 2007-08-13 |
EP1818860A2 (de) | 2007-08-15 |
US20070181875A1 (en) | 2007-08-09 |
EP1818860A3 (de) | 2007-08-29 |
EP1818860B1 (de) | 2011-03-30 |
EP2259213A3 (de) | 2011-10-05 |
EP2259213A2 (de) | 2010-12-08 |
US8138614B2 (en) | 2012-03-20 |
KR101402104B1 (ko) | 2014-05-30 |
EP2259213B1 (de) | 2015-12-23 |
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