JP2012074729A5 - Immersion exposure apparatus, immersion exposure method, and device manufacturing method - Google Patents

Immersion exposure apparatus, immersion exposure method, and device manufacturing method Download PDF

Info

Publication number
JP2012074729A5
JP2012074729A5 JP2011266301A JP2011266301A JP2012074729A5 JP 2012074729 A5 JP2012074729 A5 JP 2012074729A5 JP 2011266301 A JP2011266301 A JP 2011266301A JP 2011266301 A JP2011266301 A JP 2011266301A JP 2012074729 A5 JP2012074729 A5 JP 2012074729A5
Authority
JP
Japan
Prior art keywords
optical member
substrate
immersion exposure
immersion
immersion liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011266301A
Other languages
Japanese (ja)
Other versions
JP2012074729A (en
JP5660016B2 (en
Filing date
Publication date
Application filed filed Critical
Publication of JP2012074729A publication Critical patent/JP2012074729A/en
Publication of JP2012074729A5 publication Critical patent/JP2012074729A5/en
Application granted granted Critical
Publication of JP5660016B2 publication Critical patent/JP5660016B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Claims (48)

光学部材を介して露光ビームで基板を露光する液浸露光装置であって、
前記基板を載置するテーブルを有する基板ステージと、
前記テーブルと異なる、前記基板ステージに設けられる部材と、を備え、
前記テーブルと前記部材とはそれぞれ、前記光学部材と対向して位置付けられることによって、前記光学部材の下に液浸液体を維持し、
前記テーブルと前記部材とは、前記光学部材と対向して位置付けられる前記テーブルの表面と前記部材の表面とが並置された状態で、前記基板ステージによって前記光学部材に対して移動され、前記光学部材の下で液浸液体は前記テーブルから前記部材に移動する。 An immersion exposure apparatus for exposing a substrate with an exposure beam through an optical member, comprising:
A substrate stage having a table on which the substrate is placed;
And a member provided on the substrate stage, which is different from the table.
The table and the member are each positioned opposite to the optical member to maintain immersion liquid under the optical member,
The table and the member are moved relative to the optical member by the substrate stage in a state in which the surface of the table positioned opposite to the optical member and the surface of the member are juxtaposed The immersion liquid travels from the table to the member under 光学部材を介して露光ビームで基板を露光する液浸露光装置であって、
前記基板を載置するテーブルを有する基板ステージと、
前記テーブルと異なる、前記基板ステージに設けられる部材と、を備え、
前記光学部材と前記テーブルとの間に液浸液体が維持される第１状態から、前記光学部材と前記部材との間に液浸液体が維持される第２状態に遷移するように、前記テーブルと前記部材とは、前記基板ステージによって前記光学部材に対して移動される。 An immersion exposure apparatus for exposing a substrate with an exposure beam through an optical member, comprising:
A substrate stage having a table on which the substrate is placed;
And a member provided on the substrate stage, which is different from the table.
The table is transitioned from a first state in which immersion liquid is maintained between the optical member and the table to a second state in which immersion liquid is maintained between the optical member and the member And the member are moved relative to the optical member by the substrate stage. 請求項２に記載の液浸露光装置において、
前記テーブルと前記部材とは、前記光学部材と対向して位置付けられる前記テーブルの表面と前記部材の表面とが並置された状態で、前記光学部材に対して移動される。 In the immersion exposure apparatus according to claim 2,
The table and the member are moved relative to the optical member in a state in which the surface of the table positioned to face the optical member and the surface of the member are juxtaposed. 請求項１〜３のいずれか一項に記載の液浸露光装置において、
前記テーブルと前記部材とは互いに接近した状態で前記光学部材に対して移動される。 In the immersion exposure apparatus according to any one of claims 1 to 3,
The table and the member are moved relative to the optical member in a state in which they are close to each other. 請求項１〜４のいずれか一項に記載の液浸露光装置において、
前記光学部材に対する前記テーブルと前記部材の移動において、前記光学部材の下に液浸液体が実質的に維持される、あるいは、前記光学部材は前記液浸液体との接触が実質的に維持される。 In the immersion exposure apparatus according to any one of claims 1 to 4,
In movement of the table and the member relative to the optical member, immersion liquid is substantially maintained under the optical member, or the optical member is substantially maintained in contact with the immersion liquid . 請求項１〜５のいずれか一項に記載の液浸露光装置において、
前記テーブルと前記部材とは相対移動可能に前記基板ステージに設けられる。 In the immersion exposure apparatus according to any one of claims 1 to 5,
The table and the member are provided on the substrate stage so as to be relatively movable. 請求項１〜６のいずれか一項に記載の液浸露光装置において、
前記部材は、前記テーブルが前記光学部材の下から離れるために、前記テーブルの代わりに前記光学部材の下方で液浸液体を維持する。 In the immersion exposure apparatus according to any one of claims 1 to 6,
The member maintains immersion liquid below the optical member instead of the table so that the table is separated from below the optical member. 請求項１〜７のいずれか一項に記載の液浸露光装置において、
前記テーブルと前記部材とは、前記テーブルの代わりに前記部材が前記光学部材の下方で液浸液体を維持するまで、前記光学部材に対して移動される。 In the immersion exposure apparatus according to any one of claims 1 to 7,
The table and the member are moved relative to the optical member until the member maintains immersion liquid below the optical member instead of the table. 請求項１〜８のいずれか一項に記載の液浸露光装置において、
前記テーブルと前記部材とは、その境界が前記液浸液体の下を通過するように、前記光学部材に対して移動される。 The immersion exposure apparatus according to any one of claims 1 to 8
The table and the member are moved relative to the optical member such that the boundary passes under the immersion liquid. 請求項１〜９のいずれか一項に記載の液浸露光装置において、
前記テーブルと前記部材とは近接した状態、あるいはギャップを挟んで配置された状態で、前記光学部材に対して移動される。 The immersion exposure apparatus according to any one of claims 1 to 9.
The table and the member are moved relative to the optical member in a state in which the table and the member are in proximity to each other or in a state in which the table and the member are disposed across a gap. 請求項１〜１０のいずれか一項に記載の液浸露光装置において、
前記テーブルと前記部材とは、前記光学部材の下に液浸液体が実質的に維持されるように近接した状態で、前記光学部材に対して移動される。 The immersion exposure apparatus according to any one of claims 1 to 10.
The table and the member are moved relative to the optical member in close proximity such that immersion liquid is substantially maintained under the optical member. 請求項１〜１１のいずれか一項に記載の液浸露光装置において、
前記テーブルと前記部材とはギャップを挟んで配置された状態で前記光学部材に対して移動される。 The immersion exposure apparatus according to any one of claims 1 to 11.
The table and the member are moved with respect to the optical member in a state in which the table and the member are disposed across the gap. 請求項１２に記載の液浸露光装置において、
前記テーブルと前記部材とは、前記ギャップが前記液浸液体の下を通過するように、前記光学部材に対して移動される。 In the immersion exposure apparatus according to claim 12,
The table and the member are moved relative to the optical member such that the gap passes under the immersion liquid. 請求項１〜１３のいずれか一項に記載の液浸露光装置において、
前記テーブルと前記部材とは、前記光学部材に対する移動において対向するエッジが前記液浸液体の下を通過するように移動される。 The immersion exposure apparatus according to any one of claims 1 to 13.
The table and the member are moved such that opposite edges in movement relative to the optical member pass under the immersion liquid. 請求項１〜１４のいずれか一項に記載の液浸露光装置において、
前記テーブルと前記部材とは、前記光学部材に対して実質的に同時に移動される。 In the immersion exposure apparatus according to any one of claims 1 to 14,
The table and the member are moved substantially simultaneously with respect to the optical member. 請求項１〜１５のいずれか一項に記載の液浸露光装置において、
前記テーブルと前記部材とは、前記光学部材に対する移動において実質的に連続する表面を形成する。 In the immersion exposure apparatus according to any one of claims 1 to 15,
The table and the member form a substantially continuous surface in movement relative to the optical member. 請求項１〜１６のいずれか一項に記載の液浸露光装置において、
前記基板ステージは、それぞれ基板を載置する、前記テーブルを含む２つのテーブルを有し、前記２つのテーブルが交互に前記光学部材と対向して位置付けられ、
前記部材は、前記２つのテーブルの一方の代わりに前記光学部材の下方で液浸液体を維持するとともに、前記２つのテーブルの他方は、前記部材の代わりに前記光学部材の下方で液浸液体を維持する。 The immersion exposure apparatus according to any one of claims 1 to 16.
The substrate stage has two tables each including the table on which the substrate is mounted, and the two tables are alternately positioned opposite to the optical member,
The member maintains immersion liquid below the optical member instead of one of the two tables, and the other of the two tables instead of immersion liquid below the optical member. maintain. 請求項１〜１７のいずれか一項に記載の液浸露光装置において、
前記テーブルは、前記部材によって前記光学部材の下に液浸液体が維持される間、前記光学部材の直下から離れて、前記基板の露光動作と異なる動作が行われる。 The immersion exposure apparatus according to any one of claims 1 to 17.
While the immersion liquid is maintained under the optical member by the member, the table is separated from immediately below the optical member to perform an operation different from the exposure operation of the substrate. 請求項１８に記載の液浸露光装置において、
前記異なる動作は、前記基板のロード及び／又はアンロードを含む。 In the immersion exposure apparatus according to claim 18,
The different operations include loading and / or unloading of the substrate. 請求項１９に記載の液浸露光装置において、
前記異なる動作は、前記基板のアライメントを含む。 In the immersion exposure apparatus according to claim 19,
The different operations include the alignment of the substrate. 請求項１〜２０のいずれか一項に記載の液浸露光装置において、
前記基板のアライメントを行うアライメントシステムを、さらに備え、
前記部材が前記光学部材と対向して位置付けられる間、前記アライメントシステムによって、前記テーブルに載置される基板のアライメントが行われる。 The immersion exposure apparatus according to any one of claims 1 to 20,
Further comprising an alignment system for aligning the substrate,
The alignment system aligns the substrate mounted on the table while the member is positioned opposite the optical member. 請求項１〜２１のいずれか一項に記載の液浸露光装置において、
前記テーブルに載置される基板を交換する交換システムを、さらに備え、
前記部材が前記光学部材と対向して位置付けられる間、前記交換システムによって、前記テーブルに載置される基板の交換が行われる。 22. In the immersion exposure apparatus according to any one of claims 1 to 21,
The system further comprises a replacement system for replacing a substrate placed on the table,
While the member is positioned opposite the optical member, the exchange system exchanges the substrate placed on the table. 請求項２２に記載の液浸露光装置において、
前記テーブルが前記光学部材と対向して位置付けられる間、前記光学部材と前記液浸液体とを介して前記テーブルに載置される基板の露光が行われ、
前記部材が前記光学部材と対向して位置付けられる間、前記交換システムによって、前記テーブルに載置される前記露光された基板の交換が行われる。 In the immersion exposure apparatus according to claim 22,
While the table is positioned to face the optical member, exposure of a substrate mounted on the table is performed via the optical member and the immersion liquid.
While the member is positioned opposite the optical member, the exchange system exchanges the exposed substrate placed on the table. デバイス製造方法であって、
請求項１〜２３のいずれか一項に記載の液浸露光装置を用いてワークピースを露光することと、
前記露光されたワークピースを現像することと、を含む。 A device manufacturing method,
Exposure of a workpiece using the immersion exposure apparatus according to any one of claims 1 to 23,
Developing the exposed workpiece. 光学部材を介して露光ビームで基板を露光する液浸露光方法であって、
前記基板を載置するテーブルを有する基板ステージによって、前記テーブルに載置された基板を前記光学部材と対向して位置付けることと、
前記光学部材と液浸液体を介して前記露光ビームで前記テーブルに載置された基板を露光することと、
前記テーブルと、前記テーブルと異なる、前記基板ステージに設けられる部材とを、前記光学部材と対向して位置付けられる前記テーブルの表面と前記部材の表面とが並置された状態で、前記基板ステージによって前記光学部材に対して移動することと、を含み、
この移動によって、前記光学部材の下で液浸液体は前記テーブルから前記部材に移動する。 An immersion exposure method for exposing a substrate with an exposure beam through an optical member, comprising:
Positioning the substrate placed on the table opposite to the optical member by a substrate stage having a table on which the substrate is placed;
Exposing the substrate mounted on the table by the exposure beam through the optical member and the immersion liquid;
The table and the member provided on the substrate stage different from the table are arranged by the substrate stage in a state where the surface of the table positioned opposite to the optical member and the surface of the member are juxtaposed Moving with respect to the optical member,
This movement causes the immersion liquid to move from the table to the member under the optical member. 光学部材を介して露光ビームで基板を露光する液浸露光方法であって、
前記基板を載置するテーブルを有する基板ステージによって、前記テーブルに載置された基板を前記光学部材と対向して位置付けることと、
前記光学部材と液浸液体を介して前記露光ビームで前記テーブルに載置された基板を露光することと、
前記光学部材と前記テーブルとの間に液浸液体が維持される第１状態から、前記光学部材と、前記テーブルと異なる、前記基板ステージに設けられる部材との間に液浸液体が維持される第２状態に遷移するように、前記テーブルと前記部材とを、前記基板ステージによって前記光学部材に対して移動することと、を含む。 An immersion exposure method for exposing a substrate with an exposure beam through an optical member, comprising:
Positioning the substrate placed on the table opposite to the optical member by a substrate stage having a table on which the substrate is placed;
Exposing the substrate mounted on the table by the exposure beam through the optical member and the immersion liquid;
From the first state in which immersion liquid is maintained between the optical member and the table, immersion liquid is maintained between the optical member and a member provided on the substrate stage which is different from the table Moving the table and the member relative to the optical member by the substrate stage to transition to a second state. 請求項２６に記載の液浸露光方法において、
前記テーブルと前記部材とは、前記光学部材と対向して位置付けられる前記テーブルの表面と前記部材の表面とが並置された状態で、前記光学部材に対して移動される。 In the immersion exposure method according to claim 26,
The table and the member are moved relative to the optical member in a state in which the surface of the table positioned to face the optical member and the surface of the member are juxtaposed. 請求項２５〜２７のいずれか一項に記載の液浸露光方法において、
前記テーブルと前記部材とは互いに接近した状態で前記光学部材に対して移動される。 The immersion exposure method according to any one of claims 25 to 27,
The table and the member are moved relative to the optical member in a state in which they are close to each other. 請求項２５〜２８のいずれか一項に記載の液浸露光方法において、
前記光学部材に対する前記テーブルと前記部材の移動において、前記光学部材の下に液浸液体が実質的に維持される、あるいは、前記光学部材は前記液浸液体との接触が実質的に維持される。 The immersion exposure method according to any one of claims 25 to 28
In movement of the table and the member relative to the optical member, immersion liquid is substantially maintained under the optical member, or the optical member is substantially maintained in contact with the immersion liquid . 請求項２５〜２９のいずれか一項に記載の液浸露光方法において、
前記テーブルと前記部材とは相対移動可能に前記基板ステージに設けられる。 The immersion exposure method according to any one of claims 25 to 29,
The table and the member are provided on the substrate stage so as to be relatively movable. 請求項２５〜３０のいずれか一項に記載の液浸露光方法において、
前記部材は、前記テーブルが前記光学部材の下から離れるために、前記テーブルの代わりに前記光学部材の下方で液浸液体を維持する。 The immersion exposure method according to any one of claims 25 to 30,
The member maintains immersion liquid below the optical member instead of the table so that the table is separated from below the optical member. 請求項２５〜３１のいずれか一項に記載の液浸露光方法において、
前記テーブルと前記部材とは、前記テーブルの代わりに前記部材が前記光学部材の下方で液浸液体を維持するまで、前記光学部材に対して移動される。 The immersion exposure method according to any one of claims 25 to 31
The table and the member are moved relative to the optical member until the member maintains immersion liquid below the optical member instead of the table. 請求項２５〜３２のいずれか一項に記載の液浸露光方法において、
前記テーブルと前記部材とは、その境界が前記液浸液体の下を通過するように、前記光学部材に対して移動される。 The immersion exposure method according to any one of claims 25 to 32
The table and the member are moved relative to the optical member such that the boundary passes under the immersion liquid. 請求項２５〜３３のいずれか一項に記載の液浸露光方法において、
前記テーブルと前記部材とは近接した状態、あるいはギャップを挟んで配置された状態で、前記光学部材に対して移動される。 In the immersion exposure method according to any one of claims 25 to 33,
The table and the member are moved relative to the optical member in a state in which the table and the member are in proximity to each other or in a state in which the table and the member are disposed across a gap. 請求項２５〜３４のいずれか一項に記載の液浸露光方法において、
前記テーブルと前記部材とは、前記光学部材の下に液浸液体が実質的に維持されるように近接した状態で、前記光学部材に対して移動される。 In the immersion exposure method according to any one of claims 25 to 34,
The table and the member are moved relative to the optical member in close proximity such that immersion liquid is substantially maintained under the optical member. 請求項２５〜３５のいずれか一項に記載の液浸露光方法において、
前記テーブルと前記部材とはギャップを挟んで配置された状態で前記光学部材に対して移動される。 In the immersion exposure method according to any one of claims 25 to 35,
The table and the member are moved with respect to the optical member in a state in which the table and the member are disposed across the gap. 請求項３６に記載の液浸露光方法において、
前記テーブルと前記部材とは、前記ギャップが前記液浸液体の下を通過するように、前記光学部材に対して移動される。 In the immersion exposure method according to claim 36,
The table and the member are moved relative to the optical member such that the gap passes under the immersion liquid. 請求項２５〜３７のいずれか一項に記載の液浸露光方法において、
前記テーブルと前記部材とは、前記光学部材に対する移動において対向するエッジが前記液浸液体の下を通過するように移動される。 The immersion exposure method according to any one of claims 25 to 37,
The table and the member are moved such that opposite edges in movement relative to the optical member pass under the immersion liquid. 請求項２５〜３８のいずれか一項に記載の液浸露光方法において、
前記テーブルと前記部材とは、前記光学部材に対して実質的に同時に移動される。 The immersion exposure method according to any one of claims 25 to 38
The table and the member are moved substantially simultaneously with respect to the optical member. 請求項２５〜３９のいずれか一項に記載の液浸露光方法において、
前記テーブルと前記部材とは、前記光学部材に対する移動において実質的に連続する表面を形成する。 The immersion exposure method according to any one of claims 25 to 39, wherein
The table and the member form a substantially continuous surface in movement relative to the optical member. 請求項２５〜４０のいずれか一項に記載の液浸露光方法において、
前記基板ステージは、それぞれ基板を載置する、前記テーブルを含む２つのテーブルを有し、前記２つのテーブルが交互に前記光学部材と対向して位置付けられ、
前記部材は、前記２つのテーブルの一方の代わりに前記光学部材の下方で液浸液体を維持するとともに、前記２つのテーブルの他方は、前記部材の代わりに前記光学部材の下方で液浸液体を維持する。 The immersion exposure method according to any one of claims 25 to 40,
The substrate stage has two tables each including the table on which the substrate is mounted, and the two tables are alternately positioned opposite to the optical member,
The member maintains immersion liquid below the optical member instead of one of the two tables, and the other of the two tables instead of immersion liquid below the optical member. maintain. 請求項２５〜４１のいずれか一項に記載の液浸露光方法において、
前記テーブルは、前記部材によって前記光学部材の下に液浸液体が維持される間、前記光学部材の直下から離れて、前記基板の露光動作と異なる動作が行われる。 The immersion exposure method according to any one of claims 25 to 41,
While the immersion liquid is maintained under the optical member by the member, the table is separated from immediately below the optical member to perform an operation different from the exposure operation of the substrate. 請求項４２に記載の液浸露光方法において、
前記異なる動作は、前記基板のロード及び／又はアンロードを含む。 In the immersion exposure method according to claim 42,
The different operations include loading and / or unloading of the substrate. 請求項４３に記載の液浸露光方法において、
前記異なる動作は、前記基板のアライメントを含む。 In the immersion exposure method according to claim 43,
The different operations include the alignment of the substrate. 請求項２５〜４４のいずれか一項に記載の液浸露光方法において、
前記部材が前記光学部材と対向して位置付けられる間、アライメントシステムによって、前記テーブルに載置される基板のアライメントが行われる。 The immersion exposure method according to any one of claims 25 to 44, wherein
While the member is positioned opposite the optical member, an alignment system aligns the substrate mounted on the table. 請求項２５〜４５のいずれか一項に記載の液浸露光方法において、
前記部材が前記光学部材と対向して位置付けられる間、交換システムによって、前記テーブルに載置される基板の交換が行われる。 In the immersion exposure method according to any one of claims 25 to 45,
While the member is positioned opposite the optical member, the exchange system exchanges the substrate mounted on the table. 請求項４６に記載の液浸露光方法において、
前記テーブルが前記光学部材と対向して位置付けられる間、前記光学部材と前記液浸液体とを介して前記テーブルに載置される基板の露光が行われ、
前記部材が前記光学部材と対向して位置付けられる間、前記交換システムによって、前記テーブルに載置される前記露光された基板の交換が行われる。 In the immersion exposure method according to claim 46,
While the table is positioned to face the optical member, exposure of a substrate mounted on the table is performed via the optical member and the immersion liquid.
While the member is positioned opposite the optical member, the exchange system exchanges the exposed substrate placed on the table. デバイス製造方法であって、
請求項２５〜４７のいずれか一項に記載の液浸露光方法を用いてワークピースを露光することと、
前記露光されたワークピースを現像することと、を含む。 A device manufacturing method,
Exposing a workpiece using the immersion exposure method according to any one of claims 25 to 47;
Developing the exposed workpiece.
JP2011266301A 2003-04-11 2011-12-05 Immersion exposure apparatus, immersion exposure method, and device manufacturing method Expired - Fee Related JP5660016B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US46249903P 2003-04-11 2003-04-11
US60/462,499 2003-04-11

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2010012365A Division JP4952804B2 (en) 2003-04-11 2010-01-22 Immersion exposure apparatus and immersion exposure method

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014136910A Division JP5862716B2 (en) 2003-04-11 2014-07-02 Immersion lithography apparatus and device manufacturing method

Publications (3)

Publication Number Publication Date
JP2012074729A JP2012074729A (en) 2012-04-12
JP2012074729A5 true JP2012074729A5 (en) 2013-04-18
JP5660016B2 JP5660016B2 (en) 2015-01-28

Family

ID=33159850

Family Applications (12)

Application Number Title Priority Date Filing Date
JP2006506525A Expired - Fee Related JP4315198B2 (en) 2003-04-11 2004-03-17 Lithographic apparatus for maintaining immersion liquid under an optical assembly, immersion liquid maintenance method and device manufacturing method using them
JP2008111219A Expired - Fee Related JP4775402B2 (en) 2003-04-11 2008-04-22 Immersion exposure apparatus, immersion exposure method, device manufacturing method, and immersion exposure apparatus manufacturing method
JP2010012365A Expired - Fee Related JP4952804B2 (en) 2003-04-11 2010-01-22 Immersion exposure apparatus and immersion exposure method
JP2011112549A Expired - Fee Related JP5440551B2 (en) 2003-04-11 2011-05-19 Immersion exposure apparatus, immersion exposure method, and device manufacturing method
JP2011266301A Expired - Fee Related JP5660016B2 (en) 2003-04-11 2011-12-05 Immersion exposure apparatus, immersion exposure method, and device manufacturing method
JP2011266300A Expired - Fee Related JP5556798B2 (en) 2003-04-11 2011-12-05 Immersion exposure apparatus, immersion exposure method, and device manufacturing method
JP2012078264A Expired - Fee Related JP5556840B2 (en) 2003-04-11 2012-03-29 Immersion exposure apparatus, immersion exposure method, and device manufacturing method
JP2013127364A Expired - Lifetime JP5510596B2 (en) 2003-04-11 2013-06-18 Immersion lithography apparatus and device manufacturing method
JP2014136910A Expired - Fee Related JP5862716B2 (en) 2003-04-11 2014-07-02 Immersion lithography apparatus and device manufacturing method
JP2015010863A Expired - Fee Related JP5900669B2 (en) 2003-04-11 2015-01-23 Immersion lithography apparatus and device manufacturing method
JP2015127873A Expired - Fee Related JP6028838B2 (en) 2003-04-11 2015-06-25 Immersion lithography apparatus and device manufacturing method
JP2016026294A Expired - Fee Related JP6090486B2 (en) 2003-04-11 2016-02-15 Immersion lithography apparatus and device manufacturing method

Family Applications Before (4)

Application Number Title Priority Date Filing Date
JP2006506525A Expired - Fee Related JP4315198B2 (en) 2003-04-11 2004-03-17 Lithographic apparatus for maintaining immersion liquid under an optical assembly, immersion liquid maintenance method and device manufacturing method using them
JP2008111219A Expired - Fee Related JP4775402B2 (en) 2003-04-11 2008-04-22 Immersion exposure apparatus, immersion exposure method, device manufacturing method, and immersion exposure apparatus manufacturing method
JP2010012365A Expired - Fee Related JP4952804B2 (en) 2003-04-11 2010-01-22 Immersion exposure apparatus and immersion exposure method
JP2011112549A Expired - Fee Related JP5440551B2 (en) 2003-04-11 2011-05-19 Immersion exposure apparatus, immersion exposure method, and device manufacturing method

Family Applications After (7)

Application Number Title Priority Date Filing Date
JP2011266300A Expired - Fee Related JP5556798B2 (en) 2003-04-11 2011-12-05 Immersion exposure apparatus, immersion exposure method, and device manufacturing method
JP2012078264A Expired - Fee Related JP5556840B2 (en) 2003-04-11 2012-03-29 Immersion exposure apparatus, immersion exposure method, and device manufacturing method
JP2013127364A Expired - Lifetime JP5510596B2 (en) 2003-04-11 2013-06-18 Immersion lithography apparatus and device manufacturing method
JP2014136910A Expired - Fee Related JP5862716B2 (en) 2003-04-11 2014-07-02 Immersion lithography apparatus and device manufacturing method
JP2015010863A Expired - Fee Related JP5900669B2 (en) 2003-04-11 2015-01-23 Immersion lithography apparatus and device manufacturing method
JP2015127873A Expired - Fee Related JP6028838B2 (en) 2003-04-11 2015-06-25 Immersion lithography apparatus and device manufacturing method
JP2016026294A Expired - Fee Related JP6090486B2 (en) 2003-04-11 2016-02-15 Immersion lithography apparatus and device manufacturing method

Country Status (10)

Country Link
US (18) US7372538B2 (en)
EP (8) EP2613194B1 (en)
JP (12) JP4315198B2 (en)
KR (15) KR101159564B1 (en)
CN (3) CN101002140B (en)
HK (7) HK1087782A1 (en)
IL (5) IL170735A (en)
SG (12) SG194260A1 (en)
TW (16) TW201144925A (en)
WO (1) WO2004090577A2 (en)

Families Citing this family (211)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10503084B2 (en) 2002-11-12 2019-12-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
DE60335595D1 (en) 2002-11-12 2011-02-17 Asml Netherlands Bv Immersion lithographic apparatus and method of making a device
EP1420299B1 (en) 2002-11-12 2011-01-05 ASML Netherlands B.V. Immersion lithographic apparatus and device manufacturing method
US9482966B2 (en) 2002-11-12 2016-11-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
SG121818A1 (en) 2002-11-12 2006-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
SG121822A1 (en) 2002-11-12 2006-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
CN100568101C (en) 2002-11-12 2009-12-09 Asml荷兰有限公司 Lithographic equipment and device making method
US7110081B2 (en) 2002-11-12 2006-09-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
SG171468A1 (en) 2002-12-10 2011-06-29 Nikon Corp Exposure apparatus and method for producing device
US7948604B2 (en) 2002-12-10 2011-05-24 Nikon Corporation Exposure apparatus and method for producing device
US7242455B2 (en) 2002-12-10 2007-07-10 Nikon Corporation Exposure apparatus and method for producing device
KR20050062665A (en) 2002-12-10 2005-06-23 가부시키가이샤 니콘 Exposure apparatus and method for manufacturing device
JP4362867B2 (en) 2002-12-10 2009-11-11 株式会社ニコン Exposure apparatus and device manufacturing method
KR101036114B1 (en) 2002-12-10 2011-05-23 가부시키가이샤 니콘 Exposure apparatus, exposure method and method for manufacturing device
DE10261775A1 (en) 2002-12-20 2004-07-01 Carl Zeiss Smt Ag Device for the optical measurement of an imaging system
TW201908879A (en) 2003-02-26 2019-03-01 日商尼康股份有限公司 Exposure apparatus, exposure method, and method for producing device
EP1610361B1 (en) 2003-03-25 2014-05-21 Nikon Corporation Exposure system and device production method
WO2004090956A1 (en) 2003-04-07 2004-10-21 Nikon Corporation Exposure apparatus and method for manufacturing device
KR101177331B1 (en) 2003-04-09 2012-08-30 가부시키가이샤 니콘 Immersion lithography fluid control system
SG141425A1 (en) 2003-04-10 2008-04-28 Nikon Corp Environmental system including vacuum scavange for an immersion lithography apparatus
KR101177330B1 (en) 2003-04-10 2012-08-30 가부시키가이샤 니콘 An immersion lithography apparatus
EP2921905B1 (en) 2003-04-10 2017-12-27 Nikon Corporation Run-off path to collect liquid for an immersion lithography apparatus
JP4582089B2 (en) 2003-04-11 2010-11-17 株式会社ニコン Liquid jet recovery system for immersion lithography
KR101508809B1 (en) 2003-04-11 2015-04-06 가부시키가이샤 니콘 Cleanup method for optics in immersion lithography
JP4315198B2 (en) * 2003-04-11 2009-08-19 株式会社ニコン Lithographic apparatus for maintaining immersion liquid under an optical assembly, immersion liquid maintenance method and device manufacturing method using them
JP2006523958A (en) 2003-04-17 2006-10-19 株式会社ニコン Optical structure of an autofocus element for use in immersion lithography
TWI295414B (en) 2003-05-13 2008-04-01 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
TWI424470B (en) 2003-05-23 2014-01-21 尼康股份有限公司 A method of manufacturing an exposure apparatus and an element
TWI421906B (en) 2003-05-23 2014-01-01 尼康股份有限公司 An exposure method, an exposure apparatus, and an element manufacturing method
CN100541717C (en) 2003-05-28 2009-09-16 株式会社尼康 Exposure method, exposure device and device making method
US7213963B2 (en) 2003-06-09 2007-05-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7684008B2 (en) 2003-06-11 2010-03-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP3401946A1 (en) 2003-06-13 2018-11-14 Nikon Corporation Exposure apparatus and device manufacturing method
US6867844B2 (en) 2003-06-19 2005-03-15 Asml Holding N.V. Immersion photolithography system and method using microchannel nozzles
KR101146962B1 (en) 2003-06-19 2012-05-22 가부시키가이샤 니콘 Exposure device and device producing method
US6809794B1 (en) 2003-06-27 2004-10-26 Asml Holding N.V. Immersion photolithography system and method using inverted wafer-projection optics interface
DE60308161T2 (en) 2003-06-27 2007-08-09 Asml Netherlands B.V. Lithographic apparatus and method for making an article
JP3862678B2 (en) 2003-06-27 2006-12-27 キヤノン株式会社 Exposure apparatus and device manufacturing method
EP2466382B1 (en) 2003-07-08 2014-11-26 Nikon Corporation Wafer table for immersion lithography
WO2005006416A1 (en) 2003-07-09 2005-01-20 Nikon Corporation Linking unit, exposure apparatus and method for manufacturing device
WO2005006418A1 (en) 2003-07-09 2005-01-20 Nikon Corporation Exposure apparatus and method for manufacturing device
EP2264531B1 (en) 2003-07-09 2013-01-16 Nikon Corporation Exposure apparatus and device manufacturing method
EP1650787A4 (en) 2003-07-25 2007-09-19 Nikon Corp Inspection method and inspection device for projection optical system, and production method for projection optical system
EP1503244A1 (en) 2003-07-28 2005-02-02 ASML Netherlands B.V. Lithographic projection apparatus and device manufacturing method
EP2264534B1 (en) 2003-07-28 2013-07-17 Nikon Corporation Exposure apparatus, method for producing device, and method for controlling exposure apparatus
US7175968B2 (en) 2003-07-28 2007-02-13 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and a substrate
US7779781B2 (en) 2003-07-31 2010-08-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
TWI263859B (en) 2003-08-29 2006-10-11 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
SG145780A1 (en) 2003-08-29 2008-09-29 Nikon Corp Exposure apparatus and device fabricating method
KR101748923B1 (en) 2003-09-03 2017-06-19 가부시키가이샤 니콘 Apparatus and method for providing fluid for immersion lithography
WO2005029559A1 (en) 2003-09-19 2005-03-31 Nikon Corporation Exposure apparatus and device producing method
KR101421398B1 (en) 2003-09-29 2014-07-18 가부시키가이샤 니콘 Exposure apparatus, exposure method, and device manufacturing method
KR20060126949A (en) 2003-10-08 2006-12-11 가부시키가이샤 니콘 Substrate transporting apparatus and method, exposure apparatus and method, and device producing method
KR101111364B1 (en) 2003-10-08 2012-02-27 가부시키가이샤 자오 니콘 Substrate carrying apparatus, substrate carrying method, exposure apparatus, exposure method, and method for producing device
TW201738932A (en) 2003-10-09 2017-11-01 Nippon Kogaku Kk Exposure apparatus, exposure method, and device producing method
US7352433B2 (en) 2003-10-28 2008-04-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7411653B2 (en) 2003-10-28 2008-08-12 Asml Netherlands B.V. Lithographic apparatus
JP4295712B2 (en) 2003-11-14 2009-07-15 エーエスエムエル ネザーランズ ビー．ブイ． Lithographic apparatus and apparatus manufacturing method
TWI470371B (en) 2003-12-03 2015-01-21 尼康股份有限公司 An exposure apparatus, an exposure method, an element manufacturing method, and an optical component
KR101499405B1 (en) 2003-12-15 2015-03-05 가부시키가이샤 니콘 Stage system, exposure apparatus and exposure method
US7394521B2 (en) 2003-12-23 2008-07-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1706793B1 (en) 2004-01-20 2010-03-03 Carl Zeiss SMT AG Exposure apparatus and measuring device for a projection lens
US7589822B2 (en) * 2004-02-02 2009-09-15 Nikon Corporation Stage drive method and stage unit, exposure apparatus, and device manufacturing method
WO2005076321A1 (en) 2004-02-03 2005-08-18 Nikon Corporation Exposure apparatus and method of producing device
TWI402893B (en) 2004-03-25 2013-07-21 尼康股份有限公司 Exposure method
US7898642B2 (en) 2004-04-14 2011-03-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7400460B2 (en) * 2004-04-26 2008-07-15 Carl Zeiss Smt Ag Method for connection of an optical element to a mount structure
EP1747499A2 (en) 2004-05-04 2007-01-31 Nikon Corporation Apparatus and method for providing fluid for immersion lithography
US7616383B2 (en) 2004-05-18 2009-11-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2005119368A2 (en) 2004-06-04 2005-12-15 Carl Zeiss Smt Ag System for measuring the image quality of an optical imaging system
EP2966670B1 (en) 2004-06-09 2017-02-22 Nikon Corporation Exposure apparatus and device manufacturing method
KR20160137690A (en) 2004-06-09 2016-11-30 가부시키가이샤 니콘 Substrate holding device, exposure apparatus having same, exposure method, method for producing device, and liquid repellent plate
US7463330B2 (en) 2004-07-07 2008-12-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
ATE441937T1 (en) 2004-07-12 2009-09-15 Nikon Corp EXPOSURE DEVICE AND COMPONENT PRODUCTION METHOD
EP3258318B1 (en) * 2004-08-03 2019-02-27 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
TW200615716A (en) * 2004-08-05 2006-05-16 Nikon Corp Stage device and exposure device
EP1801853A4 (en) 2004-08-18 2008-06-04 Nikon Corp Exposure apparatus and device manufacturing method
US7701550B2 (en) 2004-08-19 2010-04-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR101364347B1 (en) 2004-10-15 2014-02-18 가부시키가이샤 니콘 Exposure apparatus and device manufacturing method
US7119876B2 (en) 2004-10-18 2006-10-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2006049134A1 (en) * 2004-11-01 2006-05-11 Nikon Corporation Exposure apparatus and device producing method
JP4517354B2 (en) * 2004-11-08 2010-08-04 株式会社ニコン Exposure apparatus and device manufacturing method
US7583357B2 (en) 2004-11-12 2009-09-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7411657B2 (en) * 2004-11-17 2008-08-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
TWI654661B (en) * 2004-11-18 2019-03-21 日商尼康股份有限公司 Position measurement method, position control method, measurement method, loading method, exposure method and exposure device, and element manufacturing method
EP1840943A4 (en) * 2004-11-25 2010-04-21 Nikon Corp Mobile body system, exposure apparatus, and method of producing device
US7446850B2 (en) 2004-12-03 2008-11-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1821337B1 (en) 2004-12-06 2016-05-11 Nikon Corporation Maintenance method
US7196770B2 (en) 2004-12-07 2007-03-27 Asml Netherlands B.V. Prewetting of substrate before immersion exposure
US7365827B2 (en) 2004-12-08 2008-04-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4752473B2 (en) 2004-12-09 2011-08-17 株式会社ニコン Exposure apparatus, exposure method, and device manufacturing method
US7352440B2 (en) 2004-12-10 2008-04-01 Asml Netherlands B.V. Substrate placement in immersion lithography
US7403261B2 (en) 2004-12-15 2008-07-22 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7880860B2 (en) 2004-12-20 2011-02-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7528931B2 (en) * 2004-12-20 2009-05-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7491661B2 (en) 2004-12-28 2009-02-17 Asml Netherlands B.V. Device manufacturing method, top coat material and substrate
US7405805B2 (en) 2004-12-28 2008-07-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20060147821A1 (en) 2004-12-30 2006-07-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1681597B1 (en) 2005-01-14 2010-03-10 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
EP2506289A3 (en) 2005-01-31 2013-05-22 Nikon Corporation Exposure apparatus and method for manufacturing device
US8692973B2 (en) 2005-01-31 2014-04-08 Nikon Corporation Exposure apparatus and method for producing device
US8859188B2 (en) 2005-02-10 2014-10-14 Asml Netherlands B.V. Immersion liquid, exposure apparatus, and exposure process
US7224431B2 (en) 2005-02-22 2007-05-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8018573B2 (en) 2005-02-22 2011-09-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7378025B2 (en) 2005-02-22 2008-05-27 Asml Netherlands B.V. Fluid filtration method, fluid filtered thereby, lithographic apparatus and device manufacturing method
US7282701B2 (en) 2005-02-28 2007-10-16 Asml Netherlands B.V. Sensor for use in a lithographic apparatus
US7428038B2 (en) 2005-02-28 2008-09-23 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and apparatus for de-gassing a liquid
US7324185B2 (en) 2005-03-04 2008-01-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7684010B2 (en) 2005-03-09 2010-03-23 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method, seal structure, method of removing an object and a method of sealing
US7330238B2 (en) 2005-03-28 2008-02-12 Asml Netherlands, B.V. Lithographic apparatus, immersion projection apparatus and device manufacturing method
WO2006106833A1 (en) * 2005-03-30 2006-10-12 Nikon Corporation Exposure apparatus, exposure method, and device producing method
US7411654B2 (en) 2005-04-05 2008-08-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7291850B2 (en) 2005-04-08 2007-11-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
USRE43576E1 (en) 2005-04-08 2012-08-14 Asml Netherlands B.V. Dual stage lithographic apparatus and device manufacturing method
US20060232753A1 (en) 2005-04-19 2006-10-19 Asml Holding N.V. Liquid immersion lithography system with tilted liquid flow
JP5239337B2 (en) 2005-04-28 2013-07-17 株式会社ニコン Exposure method, exposure apparatus, and device manufacturing method
US8248577B2 (en) 2005-05-03 2012-08-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7433016B2 (en) 2005-05-03 2008-10-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7317507B2 (en) 2005-05-03 2008-01-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7751027B2 (en) 2005-06-21 2010-07-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7652746B2 (en) 2005-06-21 2010-01-26 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7468779B2 (en) 2005-06-28 2008-12-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7834974B2 (en) 2005-06-28 2010-11-16 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7474379B2 (en) 2005-06-28 2009-01-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7583358B2 (en) 2005-07-25 2009-09-01 Micron Technology, Inc. Systems and methods for retrieving residual liquid during immersion lens photolithography
JP5309565B2 (en) * 2005-08-05 2013-10-09 株式会社ニコン Stage apparatus, exposure apparatus, method, exposure method, and device manufacturing method
US8054445B2 (en) 2005-08-16 2011-11-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR101388345B1 (en) * 2005-09-09 2014-04-22 가부시키가이샤 니콘 Exposure apparatus, exposure method, and device production method
US7417710B2 (en) * 2005-09-26 2008-08-26 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP3997245B2 (en) * 2005-10-04 2007-10-24 キヤノン株式会社 Exposure apparatus and device manufacturing method
JP4164508B2 (en) * 2005-10-04 2008-10-15 キヤノン株式会社 Exposure apparatus and device manufacturing method
JP3997244B2 (en) * 2005-10-04 2007-10-24 キヤノン株式会社 Exposure apparatus and device manufacturing method
US7411658B2 (en) 2005-10-06 2008-08-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JPWO2007055237A1 (en) * 2005-11-09 2009-04-30 株式会社ニコン Exposure apparatus, exposure method, and device manufacturing method
US7656501B2 (en) 2005-11-16 2010-02-02 Asml Netherlands B.V. Lithographic apparatus
US7804577B2 (en) 2005-11-16 2010-09-28 Asml Netherlands B.V. Lithographic apparatus
US7864292B2 (en) 2005-11-16 2011-01-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7633073B2 (en) 2005-11-23 2009-12-15 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7773195B2 (en) 2005-11-29 2010-08-10 Asml Holding N.V. System and method to increase surface tension and contact angle in immersion lithography
US8125610B2 (en) 2005-12-02 2012-02-28 ASML Metherlands B.V. Method for preventing or reducing contamination of an immersion type projection apparatus and an immersion type lithographic apparatus
US7420194B2 (en) 2005-12-27 2008-09-02 Asml Netherlands B.V. Lithographic apparatus and substrate edge seal
US7839483B2 (en) 2005-12-28 2010-11-23 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and a control system
US7649611B2 (en) 2005-12-30 2010-01-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8472004B2 (en) * 2006-01-18 2013-06-25 Micron Technology, Inc. Immersion photolithography scanner
EP3171220A1 (en) * 2006-01-19 2017-05-24 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
EP3327507B1 (en) * 2006-02-21 2019-04-03 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US8045134B2 (en) 2006-03-13 2011-10-25 Asml Netherlands B.V. Lithographic apparatus, control system and device manufacturing method
US7760324B2 (en) * 2006-03-20 2010-07-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4889331B2 (en) * 2006-03-22 2012-03-07 大日本スクリーン製造株式会社 Substrate processing apparatus and substrate processing method
US8027019B2 (en) 2006-03-28 2011-09-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2007118014A2 (en) 2006-04-03 2007-10-18 Nikon Corporation Incidence surfaces and optical windows that are solvophobic to immersion liquids
US9477158B2 (en) 2006-04-14 2016-10-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
DE102006021797A1 (en) 2006-05-09 2007-11-15 Carl Zeiss Smt Ag Optical imaging device with thermal damping
CN100456138C (en) * 2006-06-13 2009-01-28 上海微电子装备有限公司 Submersible photoetching apparatus soaking liquid flow field maintaining system
KR101711323B1 (en) * 2006-08-31 2017-02-28 가부시키가이샤 니콘 Mobile body drive method and mobile body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method
US7872730B2 (en) * 2006-09-15 2011-01-18 Nikon Corporation Immersion exposure apparatus and immersion exposure method, and device manufacturing method
CN100468212C (en) * 2006-09-22 2009-03-11 上海微电子装备有限公司 Two-sets location switching system
JP5120377B2 (en) * 2006-09-29 2013-01-16 株式会社ニコン Exposure apparatus, exposure method, and device manufacturing method
US20080158531A1 (en) * 2006-11-15 2008-07-03 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US7973910B2 (en) * 2006-11-17 2011-07-05 Nikon Corporation Stage apparatus and exposure apparatus
JP5089143B2 (en) * 2006-11-20 2012-12-05 キヤノン株式会社 Immersion exposure equipment
US8045135B2 (en) 2006-11-22 2011-10-25 Asml Netherlands B.V. Lithographic apparatus with a fluid combining unit and related device manufacturing method
US9632425B2 (en) 2006-12-07 2017-04-25 Asml Holding N.V. Lithographic apparatus, a dryer and a method of removing liquid from a surface
US8634053B2 (en) 2006-12-07 2014-01-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7728952B2 (en) * 2007-01-25 2010-06-01 Taiwan Semiconductor Manufacturing Company, Ltd. Method and system for closing plate take-over in immersion lithography
US8237911B2 (en) 2007-03-15 2012-08-07 Nikon Corporation Apparatus and methods for keeping immersion fluid adjacent to an optical assembly during wafer exchange in an immersion lithography machine
US7900641B2 (en) 2007-05-04 2011-03-08 Asml Netherlands B.V. Cleaning device and a lithographic apparatus cleaning method
US8947629B2 (en) 2007-05-04 2015-02-03 Asml Netherlands B.V. Cleaning device, a lithographic apparatus and a lithographic apparatus cleaning method
JP2009033111A (en) * 2007-05-28 2009-02-12 Nikon Corp Exposure device, device manufacturing method, cleaning device, and cleaning method and exposure method
US8279399B2 (en) 2007-10-22 2012-10-02 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
WO2009060585A1 (en) 2007-11-07 2009-05-14 Nikon Corporation Exposure apparatus, exposure method and device manufacturing method
SG183058A1 (en) * 2007-12-17 2012-08-30 Nikon Corp Exposure apparatus, exposure method and device manufacturing method
US8451425B2 (en) 2007-12-28 2013-05-28 Nikon Corporation Exposure apparatus, exposure method, cleaning apparatus, and device manufacturing method
JP2009182110A (en) * 2008-01-30 2009-08-13 Nikon Corp Exposure system, exposure method and device manufacturing method
US8610873B2 (en) * 2008-03-17 2013-12-17 Nikon Corporation Immersion lithography apparatus and method having movable liquid diverter between immersion liquid confinement member and substrate
US20100039628A1 (en) * 2008-03-19 2010-02-18 Nikon Corporation Cleaning tool, cleaning method, and device fabricating method
US8654306B2 (en) * 2008-04-14 2014-02-18 Nikon Corporation Exposure apparatus, cleaning method, and device fabricating method
JP5097166B2 (en) 2008-05-28 2012-12-12 エーエスエムエル ネザーランズ ビー．ブイ． Lithographic apparatus and method of operating the apparatus
US20100053588A1 (en) * 2008-08-29 2010-03-04 Nikon Corporation Substrate Stage movement patterns for high throughput While Imaging a Reticle to a pair of Imaging Locations
US20100060106A1 (en) * 2008-09-10 2010-03-11 Hiwin Mikrosystem Corp. Linear planar servomotor with spare-mover standby area
DE102009015717B4 (en) * 2009-03-31 2012-12-13 Globalfoundries Dresden Module One Limited Liability Company & Co. Kg Method and system for detecting particle contamination in an immersion lithography apparatus
US8792084B2 (en) 2009-05-20 2014-07-29 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US8970820B2 (en) 2009-05-20 2015-03-03 Nikon Corporation Object exchange method, exposure method, carrier system, exposure apparatus, and device manufacturing method
US20100294742A1 (en) * 2009-05-22 2010-11-25 Enrico Magni Modifications to Surface Topography of Proximity Head
NL2005207A (en) 2009-09-28 2011-03-29 Asml Netherlands Bv Heat pipe, lithographic apparatus and device manufacturing method.
US20110199591A1 (en) * 2009-10-14 2011-08-18 Nikon Corporation Exposure apparatus, exposing method, maintenance method and device fabricating method
KR20170113709A (en) 2009-11-09 2017-10-12 가부시키가이샤 니콘 Exposure apparatus, exposure method, exposure apparatus maintenance method, exposure apparatus adjustment method and device manufacturing method
US8896810B2 (en) * 2009-12-29 2014-11-25 Globalfoundries Singapore Pte. Ltd. Liquid immersion scanning exposure system using an immersion liquid confined within a lens hood
EP2381310B1 (en) 2010-04-22 2015-05-06 ASML Netherlands BV Fluid handling structure and lithographic apparatus
US8883024B2 (en) 2010-10-18 2014-11-11 Tokyo Electron Limited Using vacuum ultra-violet (VUV) data in radio frequency (RF) sources
US20120188521A1 (en) 2010-12-27 2012-07-26 Nikon Corporation Cleaning method, liquid immersion member, immersion exposure apparatus, device fabricating method, program and storage medium
US20120162619A1 (en) 2010-12-27 2012-06-28 Nikon Corporation Liquid immersion member, immersion exposure apparatus, exposing method, device fabricating method, program, and storage medium
US9329496B2 (en) 2011-07-21 2016-05-03 Nikon Corporation Exposure apparatus, exposure method, method of manufacturing device, program, and storage medium
US20130135594A1 (en) 2011-11-25 2013-05-30 Nikon Corporation Liquid immersion member, immersion exposure apparatus, exposure method, device manufacturing method, program, and recording medium
US20130169944A1 (en) 2011-12-28 2013-07-04 Nikon Corporation Exposure apparatus, exposure method, device manufacturing method, program, and recording medium
US9207549B2 (en) 2011-12-29 2015-12-08 Nikon Corporation Exposure apparatus and exposure method, and device manufacturing method with encoder of higher reliability for position measurement
JP6037732B2 (en) * 2012-09-03 2016-12-07 オリンパス株式会社 Immersion holder, observation site fixing device, and microscope
US9772564B2 (en) 2012-11-12 2017-09-26 Nikon Corporation Exposure apparatus and exposure method, and device manufacturing method
JP6362312B2 (en) * 2013-09-09 2018-07-25 キヤノン株式会社 Exposure apparatus and device manufacturing method using the same
WO2015147039A1 (en) * 2014-03-26 2015-10-01 株式会社ニコン Moving body device, exposure device, method for manufacturing flat panel display, and method for manufacturing device
EP3149533A4 (en) * 2014-05-29 2017-06-07 Rarecyte, Inc. Apparatus for holding a substrate within a secondary device
US10802260B2 (en) 2014-05-29 2020-10-13 Rarecyte, Inc. Automated substrate loading
US10890748B2 (en) 2014-05-29 2021-01-12 Rarecyte, Inc. Automated substrate loading
US11422352B2 (en) 2014-05-29 2022-08-23 Rarecyte, Inc. Automated substrate loading
US11300769B2 (en) 2014-05-29 2022-04-12 Rarecyte, Inc. Automated substrate loading
KR102022471B1 (en) * 2014-09-19 2019-09-18 한화정밀기계 주식회사 Apparatus for inspection of substrate
US10632556B2 (en) * 2014-11-07 2020-04-28 Kiffer Industries, Inc. Method and apparatus for eliminating cut taper
US10406318B2 (en) * 2015-05-19 2019-09-10 Abbott Cardiovascular Systems, Inc. Balloon catheter
US20180329292A1 (en) * 2015-11-20 2018-11-15 Asml Netherlands B.V. Lithographic Apparatus and Method of Operating a Lithographic Apparatus
DK3515478T3 (en) 2016-09-21 2024-05-21 Nextcure Inc Antibodies to SIGLEC-15 and methods of use thereof
US10948830B1 (en) 2019-12-23 2021-03-16 Waymo Llc Systems and methods for lithography

Family Cites Families (318)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US211920A (en) * 1879-02-04 Improvement in manufacture of boots
GB1242527A (en) 1967-10-20 1971-08-11 Kodak Ltd Optical instruments
US4026653A (en) 1975-05-09 1977-05-31 Bell Telephone Laboratories, Incorporated Proximity printing method
US4341164A (en) * 1980-06-13 1982-07-27 Charles H. Ruble Folding camp table
US4509852A (en) * 1980-10-06 1985-04-09 Werner Tabarelli Apparatus for the photolithographic manufacture of integrated circuit elements
US4346164A (en) 1980-10-06 1982-08-24 Werner Tabarelli Photolithographic method for the manufacture of integrated circuits
JPS57117238A (en) 1981-01-14 1982-07-21 Nippon Kogaku Kk <Nikon> Exposing and baking device for manufacturing integrated circuit with illuminometer
JPS57153433A (en) 1981-03-18 1982-09-22 Hitachi Ltd Manufacturing device for semiconductor
JPS58202448A (en) 1982-05-21 1983-11-25 Hitachi Ltd Exposing device
JPS5919912A (en) 1982-07-26 1984-02-01 Hitachi Ltd Immersion distance holding device
DD221563A1 (en) 1983-09-14 1985-04-24 Mikroelektronik Zt Forsch Tech IMMERSIONS OBJECTIVE FOR THE STEP-BY-STEP PROJECTION IMAGING OF A MASK STRUCTURE
US4650983A (en) 1983-11-07 1987-03-17 Nippon Kogaku K. K. Focusing apparatus for projection optical system
DD224448A1 (en) 1984-03-01 1985-07-03 Zeiss Jena Veb Carl DEVICE FOR PHOTOLITHOGRAPHIC STRUCTURAL TRANSMISSION
US4780617A (en) 1984-08-09 1988-10-25 Nippon Kogaku K.K. Method for successive alignment of chip patterns on a substrate
JPS6144429A (en) 1984-08-09 1986-03-04 Nippon Kogaku Kk <Nikon> Alignment method
JPS6265326A (en) 1985-09-18 1987-03-24 Hitachi Ltd Exposure device
JPS62121417A (en) * 1985-11-22 1987-06-02 Hitachi Ltd Liquid-immersion objective lens device
JPS63157419A (en) 1986-12-22 1988-06-30 Toshiba Corp Fine pattern transfer apparatus
JP2940553B2 (en) 1988-12-21 1999-08-25 株式会社ニコン Exposure method
JP2897355B2 (en) 1990-07-05 1999-05-31 株式会社ニコン Alignment method, exposure apparatus, and position detection method and apparatus
US5121256A (en) * 1991-03-14 1992-06-09 The Board Of Trustees Of The Leland Stanford Junior University Lithography system employing a solid immersion lens
JPH04305915A (en) 1991-04-02 1992-10-28 Nikon Corp Adhesion type exposure device
JPH04305917A (en) 1991-04-02 1992-10-28 Nikon Corp Adhesion type exposure device
JP3200874B2 (en) 1991-07-10 2001-08-20 株式会社ニコン Projection exposure equipment
US5243195A (en) * 1991-04-25 1993-09-07 Nikon Corporation Projection exposure apparatus having an off-axis alignment system and method of alignment therefor
JPH0562877A (en) 1991-09-02 1993-03-12 Yasuko Shinohara Optical system for lsi manufacturing contraction projection aligner by light
JP3203719B2 (en) * 1991-12-26 2001-08-27 株式会社ニコン Exposure apparatus, device manufactured by the exposure apparatus, exposure method, and device manufacturing method using the exposure method
JPH05304072A (en) 1992-04-08 1993-11-16 Nec Corp Manufacture of semiconductor device
US5469963A (en) * 1992-04-08 1995-11-28 Asyst Technologies, Inc. Sealable transportable container having improved liner
JPH06124873A (en) * 1992-10-09 1994-05-06 Canon Inc Liquid-soaking type projection exposure apparatus
JP2753930B2 (en) 1992-11-27 1998-05-20 キヤノン株式会社 Immersion type projection exposure equipment
JP3316833B2 (en) 1993-03-26 2002-08-19 株式会社ニコン Scanning exposure method, surface position setting device, scanning type exposure device, and device manufacturing method using the method
KR100300618B1 (en) 1992-12-25 2001-11-22 오노 시게오 EXPOSURE METHOD, EXPOSURE DEVICE, AND DEVICE MANUFACTURING METHOD USING THE DEVICE
JPH06208058A (en) * 1993-01-13 1994-07-26 Olympus Optical Co Ltd Microscope objective lens
US5591958A (en) * 1993-06-14 1997-01-07 Nikon Corporation Scanning exposure method and apparatus
JP3412704B2 (en) 1993-02-26 2003-06-03 株式会社ニコン Projection exposure method and apparatus, and exposure apparatus
JP3747958B2 (en) 1995-04-07 2006-02-22 株式会社ニコン Catadioptric optics
JP3747951B2 (en) 1994-11-07 2006-02-22 株式会社ニコン Catadioptric optics
US5636066A (en) 1993-03-12 1997-06-03 Nikon Corporation Optical apparatus
JPH09311278A (en) 1996-05-20 1997-12-02 Nikon Corp Reflection type dioptric system
JP3635684B2 (en) 1994-08-23 2005-04-06 株式会社ニコン Catadioptric reduction projection optical system, catadioptric optical system, and projection exposure method and apparatus
US5534970A (en) 1993-06-11 1996-07-09 Nikon Corporation Scanning exposure apparatus
JP3265503B2 (en) 1993-06-11 2002-03-11 株式会社ニコン Exposure method and apparatus
JP3212199B2 (en) 1993-10-04 2001-09-25 旭硝子株式会社 Flat cathode ray tube
WO1995019637A1 (en) * 1994-01-13 1995-07-20 Ims Ionen Mikrofabrikations Systeme Gesellschaft Mbh Particle beam, in particular ionic optic reproduction system
JPH07220990A (en) * 1994-01-28 1995-08-18 Hitachi Ltd Pattern forming method and exposure apparatus therefor
US7365513B1 (en) 1994-04-01 2008-04-29 Nikon Corporation Positioning device having dynamically isolated frame, and lithographic device provided with such a positioning device
US5528118A (en) 1994-04-01 1996-06-18 Nikon Precision, Inc. Guideless stage with isolated reaction stage
US6989647B1 (en) 1994-04-01 2006-01-24 Nikon Corporation Positioning device having dynamically isolated frame, and lithographic device provided with such a positioning device
US5874820A (en) 1995-04-04 1999-02-23 Nikon Corporation Window frame-guided stage mechanism
JP3395801B2 (en) 1994-04-28 2003-04-14 株式会社ニコン Catadioptric projection optical system, scanning projection exposure apparatus, and scanning projection exposure method
JP3555230B2 (en) 1994-05-18 2004-08-18 株式会社ニコン Projection exposure equipment
JPH07335748A (en) 1994-06-07 1995-12-22 Miyazaki Oki Electric Co Ltd Manufacture of semiconductor element
US5715064A (en) * 1994-06-17 1998-02-03 International Business Machines Corporation Step and repeat apparatus having enhanced accuracy and increased throughput
USRE38438E1 (en) 1994-08-23 2004-02-24 Nikon Corporation Catadioptric reduction projection optical system and exposure apparatus having the same
JPH0883753A (en) * 1994-09-13 1996-03-26 Nikon Corp Focal point detecting method
US5623853A (en) 1994-10-19 1997-04-29 Nikon Precision Inc. Precision motion stage with single guide beam and follower stage
JPH08136475A (en) 1994-11-14 1996-05-31 Kawasaki Steel Corp Surface observing apparatus for plate-like material
JP3387075B2 (en) * 1994-12-12 2003-03-17 株式会社ニコン Scanning exposure method, exposure apparatus, and scanning exposure apparatus
JPH08171054A (en) 1994-12-16 1996-07-02 Nikon Corp Reflection refraction optical system
US5677758A (en) * 1995-02-09 1997-10-14 Mrs Technology, Inc. Lithography System using dual substrate stages
US5699201A (en) 1995-03-27 1997-12-16 Hewlett-Packard Co. Low-profile, high-gain, wide-field-of-view, non-imaging optics
US6008500A (en) 1995-04-04 1999-12-28 Nikon Corporation Exposure apparatus having dynamically isolated reaction frame
JPH08316124A (en) 1995-05-19 1996-11-29 Hitachi Ltd Method and apparatus for projection exposing
JPH08316125A (en) 1995-05-19 1996-11-29 Hitachi Ltd Method and apparatus for projection exposing
JP3526042B2 (en) 1995-08-09 2004-05-10 株式会社ニコン Projection exposure equipment
JPH09232213A (en) 1996-02-26 1997-09-05 Nikon Corp Projection aligner
US5964441A (en) * 1996-04-01 1999-10-12 Lear Corporation Linkage assembly with extruded hole member
JPH103039A (en) 1996-06-14 1998-01-06 Nikon Corp Reflective/refractive optical system
JPH1020195A (en) 1996-06-28 1998-01-23 Nikon Corp Cata-dioptric system
US5825043A (en) * 1996-10-07 1998-10-20 Nikon Precision Inc. Focusing and tilting adjustment system for lithography aligner, manufacturing apparatus or inspection apparatus
JP4029183B2 (en) 1996-11-28 2008-01-09 株式会社ニコン Projection exposure apparatus and projection exposure method
JP4029181B2 (en) 1996-11-28 2008-01-09 株式会社ニコン Projection exposure equipment
CN1144263C (en) 1996-11-28 2004-03-31 株式会社尼康 Aligner and method for exposure
JP4029182B2 (en) 1996-11-28 2008-01-09 株式会社ニコン Exposure method
WO1998028665A1 (en) * 1996-12-24 1998-07-02 Koninklijke Philips Electronics N.V. Two-dimensionally balanced positioning device with two object holders, and lithographic device provided with such a positioning device
US5815246A (en) 1996-12-24 1998-09-29 U.S. Philips Corporation Two-dimensionally balanced positioning device, and lithographic device provided with such a positioning device
JPH10209039A (en) * 1997-01-27 1998-08-07 Nikon Corp Method and apparatus for projection exposure
JP3612920B2 (en) 1997-02-14 2005-01-26 ソニー株式会社 Exposure apparatus for producing an optical recording medium master
USRE40043E1 (en) 1997-03-10 2008-02-05 Asml Netherlands B.V. Positioning device having two object holders
JPH10255319A (en) 1997-03-12 1998-09-25 Hitachi Maxell Ltd Master disk exposure device and method therefor
JP3747566B2 (en) * 1997-04-23 2006-02-22 株式会社ニコン Immersion exposure equipment
JP3817836B2 (en) * 1997-06-10 2006-09-06 株式会社ニコン EXPOSURE APPARATUS, ITS MANUFACTURING METHOD, EXPOSURE METHOD, AND DEVICE MANUFACTURING METHOD
JPH1116816A (en) 1997-06-25 1999-01-22 Nikon Corp Projection aligner, method for exposure with the device, and method for manufacturing circuit device using the device
US5900354A (en) 1997-07-03 1999-05-04 Batchelder; John Samuel Method for optical inspection and lithography
EP1028456A4 (en) 1997-09-19 2003-03-05 Nikon Corp Stage device, a scanning aligner and a scanning exposure method, and a device manufactured thereby
JP2000106340A (en) 1997-09-26 2000-04-11 Nikon Corp Aligner, scanning exposure method, and stage device
JP4210871B2 (en) 1997-10-31 2009-01-21 株式会社ニコン Exposure equipment
AU1175799A (en) * 1997-11-21 1999-06-15 Nikon Corporation Projection aligner and projection exposure method
JPH11176727A (en) 1997-12-11 1999-07-02 Nikon Corp Projection aligner
US6897963B1 (en) * 1997-12-18 2005-05-24 Nikon Corporation Stage device and exposure apparatus
JP4264676B2 (en) 1998-11-30 2009-05-20 株式会社ニコン Exposure apparatus and exposure method
EP1041357A4 (en) 1997-12-18 2005-06-15 Nikon Corp Stage device and exposure apparatus
US6208407B1 (en) 1997-12-22 2001-03-27 Asm Lithography B.V. Method and apparatus for repetitively projecting a mask pattern on a substrate, using a time-saving height measurement
AU2747999A (en) 1998-03-26 1999-10-18 Nikon Corporation Projection exposure method and system
JP2000058436A (en) 1998-08-11 2000-02-25 Nikon Corp Projection aligner and exposure method
WO2000017916A1 (en) 1998-09-17 2000-03-30 Nikon Corporation Method of adjusting optical projection system
WO2000033359A2 (en) * 1998-12-02 2000-06-08 Kensington Laboratories, Inc. Specimen holding robotic arm end effector
WO2000055891A1 (en) * 1999-03-12 2000-09-21 Nikon Corporation Exposure device, exposure method, and device manufacturing method
JP4365934B2 (en) * 1999-05-10 2009-11-18 キヤノン株式会社 Exposure apparatus, semiconductor manufacturing apparatus, and device manufacturing method
JP4504479B2 (en) 1999-09-21 2010-07-14 オリンパス株式会社 Immersion objective lens for microscope
JP2001118773A (en) 1999-10-18 2001-04-27 Nikon Corp Stage device and exposure system
WO2001035168A1 (en) 1999-11-10 2001-05-17 Massachusetts Institute Of Technology Interference lithography utilizing phase-locked scanning beams
TW546551B (en) * 1999-12-21 2003-08-11 Asml Netherlands Bv Balanced positioning system for use in lithographic apparatus
EP1111471B1 (en) 1999-12-21 2005-11-23 ASML Netherlands B.V. Lithographic projection apparatus with collision preventing device
TWI223734B (en) 1999-12-21 2004-11-11 Asml Netherlands Bv Crash prevention in positioning apparatus for use in lithographic projection apparatus
US7187503B2 (en) 1999-12-29 2007-03-06 Carl Zeiss Smt Ag Refractive projection objective for immersion lithography
US6995930B2 (en) 1999-12-29 2006-02-07 Carl Zeiss Smt Ag Catadioptric projection objective with geometric beam splitting
JP2001267239A (en) 2000-01-14 2001-09-28 Nikon Corp Exposure method, exposure device and manufacturing method of device
JP2001313250A (en) 2000-02-25 2001-11-09 Nikon Corp Aligner, its adjusting method, and method for fabricating device using aligner
US6771350B2 (en) 2000-02-25 2004-08-03 Nikon Corporation Exposure apparatus and exposure method capable of controlling illumination distribution
JP2001241439A (en) 2000-02-25 2001-09-07 Canon Inc Moving device provided with hydrostatic bearing
US6426790B1 (en) * 2000-02-28 2002-07-30 Nikon Corporation Stage apparatus and holder, and scanning exposure apparatus and exposure apparatus
JP2001257143A (en) * 2000-03-09 2001-09-21 Nikon Corp Stage device and aligner, and method of manufacturing device
US20020041377A1 (en) * 2000-04-25 2002-04-11 Nikon Corporation Aerial image measurement method and unit, optical properties measurement method and unit, adjustment method of projection optical system, exposure method and apparatus, making method of exposure apparatus, and device manufacturing method
JP2002014005A (en) 2000-04-25 2002-01-18 Nikon Corp Measuring method of spatial image, measuring method of imaging characteristic, measuring device for spatial image, and exposuring device
EP1279070B1 (en) * 2000-05-03 2007-10-03 ASML Holding N.V. Apparatus for providing a purged optical path in a projection photolithography system and a corresponding method
TW591653B (en) * 2000-08-08 2004-06-11 Koninkl Philips Electronics Nv Method of manufacturing an optically scannable information carrier
JP4405071B2 (en) 2000-10-23 2010-01-27 パナソニック株式会社 Feeding device and optical disc master recording device having the same
KR100866818B1 (en) 2000-12-11 2008-11-04 가부시키가이샤 니콘 Projection optical system and exposure apparatus comprising the same
JP2002305140A (en) 2001-04-06 2002-10-18 Nikon Corp Aligner and substrate processing system
US20020163629A1 (en) 2001-05-07 2002-11-07 Michael Switkes Methods and apparatus employing an index matching medium
US6788385B2 (en) 2001-06-21 2004-09-07 Nikon Corporation Stage device, exposure apparatus and method
TW529172B (en) * 2001-07-24 2003-04-21 Asml Netherlands Bv Imaging apparatus
US6680774B1 (en) * 2001-10-09 2004-01-20 Ultratech Stepper, Inc. Method and apparatus for mechanically masking a workpiece
US6665054B2 (en) * 2001-10-22 2003-12-16 Nikon Corporation Two stage method
US7134668B2 (en) * 2001-10-24 2006-11-14 Ebara Corporation Differential pumping seal apparatus
JP2003249443A (en) 2001-12-21 2003-09-05 Nikon Corp Stage apparatus, stage position-controlling method, exposure method and projection aligner, and device- manufacturing method
US7190527B2 (en) 2002-03-01 2007-03-13 Carl Zeiss Smt Ag Refractive projection objective
DE10229249A1 (en) 2002-03-01 2003-09-04 Zeiss Carl Semiconductor Mfg Refractive projection lens with a waist
US7154676B2 (en) 2002-03-01 2006-12-26 Carl Zeiss Smt A.G. Very-high aperture projection objective
DE10210899A1 (en) 2002-03-08 2003-09-18 Zeiss Carl Smt Ag Refractive projection lens for immersion lithography
US7092069B2 (en) 2002-03-08 2006-08-15 Carl Zeiss Smt Ag Projection exposure method and projection exposure system
DE10229818A1 (en) 2002-06-28 2004-01-15 Carl Zeiss Smt Ag Focus detection method and imaging system with focus detection system
CN1650401B (en) 2002-04-09 2010-04-21 株式会社尼康 Exposure method, exposure apparatus, and method for manufacturing device
KR20040104691A (en) 2002-05-03 2004-12-10 칼 짜이스 에스엠테 아게 Projection lens comprising an extremely high aperture
JP2004017261A (en) 2002-06-20 2004-01-22 Shinya Tsukamoto Machining device, machining method, and machining system
US7362508B2 (en) 2002-08-23 2008-04-22 Nikon Corporation Projection optical system and method for photolithography and exposure apparatus and method using same
US6954993B1 (en) 2002-09-30 2005-10-18 Lam Research Corporation Concentric proximity processing head
US6988326B2 (en) 2002-09-30 2006-01-24 Lam Research Corporation Phobic barrier meniscus separation and containment
US7383843B2 (en) * 2002-09-30 2008-06-10 Lam Research Corporation Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer
US7367345B1 (en) 2002-09-30 2008-05-06 Lam Research Corporation Apparatus and method for providing a confined liquid for immersion lithography
US7093375B2 (en) 2002-09-30 2006-08-22 Lam Research Corporation Apparatus and method for utilizing a meniscus in substrate processing
US6788477B2 (en) 2002-10-22 2004-09-07 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus for method for immersion lithography
EP1420299B1 (en) * 2002-11-12 2011-01-05 ASML Netherlands B.V. Immersion lithographic apparatus and device manufacturing method
US7110081B2 (en) 2002-11-12 2006-09-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
CN100568101C (en) 2002-11-12 2009-12-09 Asml荷兰有限公司 Lithographic equipment and device making method
DE60335595D1 (en) * 2002-11-12 2011-02-17 Asml Netherlands Bv Immersion lithographic apparatus and method of making a device
CN101424881B (en) 2002-11-12 2011-11-30 Asml荷兰有限公司 Lithography projection apparatus
EP1420300B1 (en) 2002-11-12 2015-07-29 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
SG121818A1 (en) 2002-11-12 2006-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
SG121822A1 (en) 2002-11-12 2006-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
US7372541B2 (en) 2002-11-12 2008-05-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
SG131766A1 (en) * 2002-11-18 2007-05-28 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
DE10253679A1 (en) 2002-11-18 2004-06-03 Infineon Technologies Ag Optical arrangement used in the production of semiconductor components comprises a lens system arranged behind a mask, and a medium having a specified refractive index lying between the mask and the lens system
DE10258718A1 (en) 2002-12-09 2004-06-24 Carl Zeiss Smt Ag Projection lens, in particular for microlithography, and method for tuning a projection lens
JP4362867B2 (en) 2002-12-10 2009-11-11 株式会社ニコン Exposure apparatus and device manufacturing method
JP4232449B2 (en) * 2002-12-10 2009-03-04 株式会社ニコン Exposure method, exposure apparatus, and device manufacturing method
JP4701606B2 (en) * 2002-12-10 2011-06-15 株式会社ニコン Exposure method, exposure apparatus, and device manufacturing method
JP4352874B2 (en) 2002-12-10 2009-10-28 株式会社ニコン Exposure apparatus and device manufacturing method
JP4645027B2 (en) * 2002-12-10 2011-03-09 株式会社ニコン Exposure apparatus, exposure method, and device manufacturing method
EP1429190B1 (en) 2002-12-10 2012-05-09 Canon Kabushiki Kaisha Exposure apparatus and method
DE10257766A1 (en) 2002-12-10 2004-07-15 Carl Zeiss Smt Ag Method for setting a desired optical property of a projection lens and microlithographic projection exposure system
JP4184346B2 (en) 2002-12-13 2008-11-19 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Liquid removal in a method and apparatus for irradiating a spot on a layer
US7010958B2 (en) 2002-12-19 2006-03-14 Asml Holding N.V. High-resolution gas gauge proximity sensor
TWI251116B (en) * 2002-12-19 2006-03-11 Asml Netherlands Bv Device manufacturing method, computer-readable medium and lithographic apparatus
KR100971440B1 (en) 2002-12-19 2010-07-21 코닌클리케 필립스 일렉트로닉스 엔.브이. Method and device for irradiating spots on a layer
DE60307322T2 (en) 2002-12-19 2007-10-18 Koninklijke Philips Electronics N.V. METHOD AND ARRANGEMENT FOR IRRADIATING A LAYER THROUGH A LIGHT POINT
US6781670B2 (en) 2002-12-30 2004-08-24 Intel Corporation Immersion lithography
US7090964B2 (en) 2003-02-21 2006-08-15 Asml Holding N.V. Lithographic printing with polarized light
US6943941B2 (en) 2003-02-27 2005-09-13 Asml Netherlands B.V. Stationary and dynamic radial transverse electric polarizer for high numerical aperture systems
US7206059B2 (en) 2003-02-27 2007-04-17 Asml Netherlands B.V. Stationary and dynamic radial transverse electric polarizer for high numerical aperture systems
US7029832B2 (en) 2003-03-11 2006-04-18 Samsung Electronics Co., Ltd. Immersion lithography methods using carbon dioxide
US20050164522A1 (en) 2003-03-24 2005-07-28 Kunz Roderick R. Optical fluids, and systems and methods of making and using the same
WO2004090956A1 (en) 2003-04-07 2004-10-21 Nikon Corporation Exposure apparatus and method for manufacturing device
KR101177331B1 (en) 2003-04-09 2012-08-30 가부시키가이샤 니콘 Immersion lithography fluid control system
EP2921905B1 (en) 2003-04-10 2017-12-27 Nikon Corporation Run-off path to collect liquid for an immersion lithography apparatus
SG141425A1 (en) 2003-04-10 2008-04-28 Nikon Corp Environmental system including vacuum scavange for an immersion lithography apparatus
WO2004090633A2 (en) 2003-04-10 2004-10-21 Nikon Corporation An electro-osmotic element for an immersion lithography apparatus
KR101177330B1 (en) 2003-04-10 2012-08-30 가부시키가이샤 니콘 An immersion lithography apparatus
KR101508809B1 (en) 2003-04-11 2015-04-06 가부시키가이샤 니콘 Cleanup method for optics in immersion lithography
JP4582089B2 (en) 2003-04-11 2010-11-17 株式会社ニコン Liquid jet recovery system for immersion lithography
JP4315198B2 (en) * 2003-04-11 2009-08-19 株式会社ニコン Lithographic apparatus for maintaining immersion liquid under an optical assembly, immersion liquid maintenance method and device manufacturing method using them
JP2006523958A (en) 2003-04-17 2006-10-19 株式会社ニコン Optical structure of an autofocus element for use in immersion lithography
JP4025683B2 (en) 2003-05-09 2007-12-26 松下電器産業株式会社 Pattern forming method and exposure apparatus
JP4146755B2 (en) 2003-05-09 2008-09-10 松下電器産業株式会社 Pattern formation method
TWI295414B (en) 2003-05-13 2008-04-01 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
TWI424470B (en) * 2003-05-23 2014-01-21 尼康股份有限公司 A method of manufacturing an exposure apparatus and an element
US6995833B2 (en) 2003-05-23 2006-02-07 Canon Kabushiki Kaisha Projection optical system, exposure apparatus, and device manufacturing method
JP2004349645A (en) 2003-05-26 2004-12-09 Sony Corp Liquid-immersed differential liquid-drainage static-pressure floating pad, master-disk exposure apparatus, and method of exposure using liquid-immersed differential liquid-drainage
TWI442694B (en) * 2003-05-30 2014-06-21 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
US7213963B2 (en) 2003-06-09 2007-05-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7684008B2 (en) * 2003-06-11 2010-03-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4054285B2 (en) 2003-06-12 2008-02-27 松下電器産業株式会社 Pattern formation method
JP4084710B2 (en) 2003-06-12 2008-04-30 松下電器産業株式会社 Pattern formation method
KR101146962B1 (en) * 2003-06-19 2012-05-22 가부시키가이샤 니콘 Exposure device and device producing method
US6867844B2 (en) 2003-06-19 2005-03-15 Asml Holding N.V. Immersion photolithography system and method using microchannel nozzles
JP4029064B2 (en) 2003-06-23 2008-01-09 松下電器産業株式会社 Pattern formation method
JP4084712B2 (en) 2003-06-23 2008-04-30 松下電器産業株式会社 Pattern formation method
JP4343597B2 (en) * 2003-06-25 2009-10-14 キヤノン株式会社 Exposure apparatus and device manufacturing method
JP2005019616A (en) * 2003-06-25 2005-01-20 Canon Inc Immersion type exposure apparatus
EP1498778A1 (en) * 2003-06-27 2005-01-19 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
DE60308161T2 (en) 2003-06-27 2007-08-09 Asml Netherlands B.V. Lithographic apparatus and method for making an article
US6809794B1 (en) 2003-06-27 2004-10-26 Asml Holding N.V. Immersion photolithography system and method using inverted wafer-projection optics interface
JP3862678B2 (en) 2003-06-27 2006-12-27 キヤノン株式会社 Exposure apparatus and device manufacturing method
EP1494074A1 (en) * 2003-06-30 2005-01-05 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1639391A4 (en) 2003-07-01 2009-04-29 Nikon Corp Using isotopically specified fluids as optical elements
EP2466382B1 (en) 2003-07-08 2014-11-26 Nikon Corporation Wafer table for immersion lithography
US7738074B2 (en) * 2003-07-16 2010-06-15 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7384149B2 (en) 2003-07-21 2008-06-10 Asml Netherlands B.V. Lithographic projection apparatus, gas purging method and device manufacturing method and purge gas supply system
EP1500982A1 (en) * 2003-07-24 2005-01-26 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
US7006209B2 (en) 2003-07-25 2006-02-28 Advanced Micro Devices, Inc. Method and apparatus for monitoring and controlling imaging in immersion lithography systems
EP2264534B1 (en) 2003-07-28 2013-07-17 Nikon Corporation Exposure apparatus, method for producing device, and method for controlling exposure apparatus
JP4492239B2 (en) 2003-07-28 2010-06-30 株式会社ニコン Exposure apparatus, device manufacturing method, and exposure apparatus control method
US7175968B2 (en) 2003-07-28 2007-02-13 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and a substrate
EP1503244A1 (en) * 2003-07-28 2005-02-02 ASML Netherlands B.V. Lithographic projection apparatus and device manufacturing method
US7326522B2 (en) 2004-02-11 2008-02-05 Asml Netherlands B.V. Device manufacturing method and a substrate
US7779781B2 (en) * 2003-07-31 2010-08-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2005057294A (en) * 2003-08-07 2005-03-03 Asml Netherlands Bv Interface unit, lithographic projector equipped with interface, and method of manufacturing device
US7061578B2 (en) 2003-08-11 2006-06-13 Advanced Micro Devices, Inc. Method and apparatus for monitoring and controlling imaging in immersion lithography systems
US7579135B2 (en) 2003-08-11 2009-08-25 Taiwan Semiconductor Manufacturing Company, Ltd. Lithography apparatus for manufacture of integrated circuits
US7700267B2 (en) 2003-08-11 2010-04-20 Taiwan Semiconductor Manufacturing Company, Ltd. Immersion fluid for immersion lithography, and method of performing immersion lithography
US7085075B2 (en) 2003-08-12 2006-08-01 Carl Zeiss Smt Ag Projection objectives including a plurality of mirrors with lenses ahead of mirror M3
US6844206B1 (en) 2003-08-21 2005-01-18 Advanced Micro Devices, Llp Refractive index system monitor and control for immersion lithography
TWI263859B (en) * 2003-08-29 2006-10-11 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
TWI245163B (en) * 2003-08-29 2005-12-11 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
US6954256B2 (en) 2003-08-29 2005-10-11 Asml Netherlands B.V. Gradient immersion lithography
US7070915B2 (en) 2003-08-29 2006-07-04 Tokyo Electron Limited Method and system for drying a substrate
US7014966B2 (en) 2003-09-02 2006-03-21 Advanced Micro Devices, Inc. Method and apparatus for elimination of bubbles in immersion medium in immersion lithography systems
KR101748923B1 (en) 2003-09-03 2017-06-19 가부시키가이샤 니콘 Apparatus and method for providing fluid for immersion lithography
JP4378136B2 (en) * 2003-09-04 2009-12-02 キヤノン株式会社 Exposure apparatus and device manufacturing method
JP3870182B2 (en) * 2003-09-09 2007-01-17 キヤノン株式会社 Exposure apparatus and device manufacturing method
US6961186B2 (en) 2003-09-26 2005-11-01 Takumi Technology Corp. Contact printing using a magnified mask image
EP1519231B1 (en) * 2003-09-29 2005-12-21 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1519230A1 (en) * 2003-09-29 2005-03-30 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
US7158211B2 (en) 2003-09-29 2007-01-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7369217B2 (en) 2003-10-03 2008-05-06 Micronic Laser Systems Ab Method and device for immersion lithography
JP2005136374A (en) * 2003-10-06 2005-05-26 Matsushita Electric Ind Co Ltd Semiconductor manufacturing apparatus and pattern formation method using the same
EP1524558A1 (en) * 2003-10-15 2005-04-20 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1524557A1 (en) * 2003-10-15 2005-04-20 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
US7678527B2 (en) 2003-10-16 2010-03-16 Intel Corporation Methods and compositions for providing photoresist with improved properties for contacting liquids
US7352433B2 (en) * 2003-10-28 2008-04-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7411653B2 (en) 2003-10-28 2008-08-12 Asml Netherlands B.V. Lithographic apparatus
JP2005159322A (en) * 2003-10-31 2005-06-16 Nikon Corp Surface plate, stage apparatus, exposure device and exposing method
JP2007525824A (en) 2003-11-05 2007-09-06 ディーエスエム アイピー アセッツ ビー．ブイ． Method and apparatus for manufacturing a microchip
EP1530217A2 (en) * 2003-11-05 2005-05-11 Fujitsu Limited Semiconductor integrated circuit having temperature detector
US7924397B2 (en) 2003-11-06 2011-04-12 Taiwan Semiconductor Manufacturing Company, Ltd. Anti-corrosion layer on objective lens for liquid immersion lithography applications
EP1531362A3 (en) * 2003-11-13 2007-07-25 Matsushita Electric Industrial Co., Ltd. Semiconductor manufacturing apparatus and pattern formation method
JP2005150290A (en) 2003-11-13 2005-06-09 Canon Inc Exposure apparatus and method of manufacturing device
JP4295712B2 (en) * 2003-11-14 2009-07-15 エーエスエムエル ネザーランズ ビー．ブイ． Lithographic apparatus and apparatus manufacturing method
WO2005054953A2 (en) 2003-11-24 2005-06-16 Carl-Zeiss Smt Ag Holding device for an optical element in an objective
US7545481B2 (en) 2003-11-24 2009-06-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
DE10355301B3 (en) * 2003-11-27 2005-06-23 Infineon Technologies Ag Method for imaging a structure on a semiconductor wafer by means of immersion lithography
US7125652B2 (en) 2003-12-03 2006-10-24 Advanced Micro Devices, Inc. Immersion lithographic process using a conforming immersion medium
JP2005175016A (en) * 2003-12-08 2005-06-30 Canon Inc Substrate holding device, exposure device using the same, and method of manufacturing device
JP2005175034A (en) * 2003-12-09 2005-06-30 Canon Inc Aligner
WO2005059654A1 (en) 2003-12-15 2005-06-30 Carl Zeiss Smt Ag Objective as a microlithography projection objective with at least one liquid lens
WO2005106589A1 (en) 2004-05-04 2005-11-10 Carl Zeiss Smt Ag Microlithographic projection exposure apparatus and immersion liquid therefore
KR101200654B1 (en) 2003-12-15 2012-11-12 칼 짜이스 에스엠티 게엠베하 Projection objective having a high aperture and a planar end surface
JP4308638B2 (en) * 2003-12-17 2009-08-05 パナソニック株式会社 Pattern formation method
US20050185269A1 (en) 2003-12-19 2005-08-25 Carl Zeiss Smt Ag Catadioptric projection objective with geometric beam splitting
US7460206B2 (en) 2003-12-19 2008-12-02 Carl Zeiss Smt Ag Projection objective for immersion lithography
JP4323946B2 (en) 2003-12-19 2009-09-02 キヤノン株式会社 Exposure equipment
JP5102492B2 (en) 2003-12-19 2012-12-19 カール・ツァイス・エスエムティー・ゲーエムベーハー Objective lens for microlithography projection with crystal elements
US7589818B2 (en) 2003-12-23 2009-09-15 Asml Netherlands B.V. Lithographic apparatus, alignment apparatus, device manufacturing method, and a method of converting an apparatus
US7394521B2 (en) 2003-12-23 2008-07-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7119884B2 (en) 2003-12-24 2006-10-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20050147920A1 (en) 2003-12-30 2005-07-07 Chia-Hui Lin Method and system for immersion lithography
US7088422B2 (en) 2003-12-31 2006-08-08 International Business Machines Corporation Moving lens for immersion optical lithography
JP4371822B2 (en) 2004-01-06 2009-11-25 キヤノン株式会社 Exposure equipment
JP4429023B2 (en) 2004-01-07 2010-03-10 キヤノン株式会社 Exposure apparatus and device manufacturing method
US20050153424A1 (en) 2004-01-08 2005-07-14 Derek Coon Fluid barrier with transparent areas for immersion lithography
CN102169226B (en) 2004-01-14 2014-04-23 卡尔蔡司Smt有限责任公司 Catadioptric projection objective
US8279524B2 (en) 2004-01-16 2012-10-02 Carl Zeiss Smt Gmbh Polarization-modulating optical element
WO2005069078A1 (en) 2004-01-19 2005-07-28 Carl Zeiss Smt Ag Microlithographic projection exposure apparatus with immersion projection lens
EP1706793B1 (en) 2004-01-20 2010-03-03 Carl Zeiss SMT AG Exposure apparatus and measuring device for a projection lens
US7026259B2 (en) 2004-01-21 2006-04-11 International Business Machines Corporation Liquid-filled balloons for immersion lithography
US7391501B2 (en) 2004-01-22 2008-06-24 Intel Corporation Immersion liquids with siloxane polymer for immersion lithography
US7589822B2 (en) * 2004-02-02 2009-09-15 Nikon Corporation Stage drive method and stage unit, exposure apparatus, and device manufacturing method
EP1723467A2 (en) 2004-02-03 2006-11-22 Rochester Institute of Technology Method of photolithography using a fluid and a system thereof
WO2005076321A1 (en) 2004-02-03 2005-08-18 Nikon Corporation Exposure apparatus and method of producing device
EP1716454A1 (en) 2004-02-09 2006-11-02 Carl Zeiss SMT AG Projection objective for a microlithographic projection exposure apparatus
US7050146B2 (en) 2004-02-09 2006-05-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2007522508A (en) 2004-02-13 2007-08-09 カール・ツアイス・エスエムテイ・アーゲー Projection objective for a microlithographic projection exposure apparatus
WO2005081030A1 (en) 2004-02-18 2005-09-01 Corning Incorporated Catadioptric imaging system for high numerical aperture imaging with deep ultraviolet light
JP2005236087A (en) 2004-02-20 2005-09-02 Nikon Corp Aligner
JP4622340B2 (en) 2004-03-04 2011-02-02 株式会社ニコン Exposure apparatus and device manufacturing method
JP2005259789A (en) 2004-03-09 2005-09-22 Nikon Corp Detection system, aligner and manufacturing method of device
US20050205108A1 (en) 2004-03-16 2005-09-22 Taiwan Semiconductor Manufacturing Co., Ltd. Method and system for immersion lithography lens cleaning
JP2005268700A (en) 2004-03-22 2005-09-29 Nikon Corp Staging device and aligner
US7027125B2 (en) 2004-03-25 2006-04-11 International Business Machines Corporation System and apparatus for photolithography
US7084960B2 (en) 2004-03-29 2006-08-01 Intel Corporation Lithography using controlled polarization
US7227619B2 (en) 2004-04-01 2007-06-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7034917B2 (en) 2004-04-01 2006-04-25 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufactured thereby
US7295283B2 (en) * 2004-04-02 2007-11-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2005098504A1 (en) 2004-04-08 2005-10-20 Carl Zeiss Smt Ag Imaging system with mirror group
US7898642B2 (en) * 2004-04-14 2011-03-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7271878B2 (en) * 2004-04-22 2007-09-18 International Business Machines Corporation Wafer cell for immersion lithography
US7244665B2 (en) 2004-04-29 2007-07-17 Micron Technology, Inc. Wafer edge ring structures and methods of formation
US7379159B2 (en) 2004-05-03 2008-05-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1747499A2 (en) 2004-05-04 2007-01-31 Nikon Corporation Apparatus and method for providing fluid for immersion lithography
US7091502B2 (en) 2004-05-12 2006-08-15 Taiwan Semiconductor Manufacturing, Co., Ltd. Apparatus and method for immersion lithography
KR101213831B1 (en) 2004-05-17 2012-12-24 칼 짜이스 에스엠티 게엠베하 Catadioptric projection objective with intermediate images
US7616383B2 (en) 2004-05-18 2009-11-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7486381B2 (en) 2004-05-21 2009-02-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2005119368A2 (en) 2004-06-04 2005-12-15 Carl Zeiss Smt Ag System for measuring the image quality of an optical imaging system
US8605257B2 (en) 2004-06-04 2013-12-10 Carl Zeiss Smt Gmbh Projection system with compensation of intensity variations and compensation element therefor
US7057702B2 (en) * 2004-06-23 2006-06-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7463330B2 (en) 2004-07-07 2008-12-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR101364347B1 (en) 2004-10-15 2014-02-18 가부시키가이샤 니콘 Exposure apparatus and device manufacturing method
US7119876B2 (en) 2004-10-18 2006-10-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7583357B2 (en) * 2004-11-12 2009-09-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7403261B2 (en) * 2004-12-15 2008-07-22 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7528931B2 (en) * 2004-12-20 2009-05-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
SG124351A1 (en) 2005-01-14 2006-08-30 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
US7161659B2 (en) * 2005-04-08 2007-01-09 Asml Netherlands B.V. Dual stage lithographic apparatus and device manufacturing method
CN102156389A (en) * 2006-05-23 2011-08-17 株式会社尼康 Maintenance method, exposure method and apparatus, and device manufacturing method
US10022493B2 (en) 2011-05-12 2018-07-17 Bayer Healthcare Llc Fluid injection system having various systems for controlling an injection procedure

Similar Documents

Publication Publication Date Title
JP2012074729A5 (en) Immersion exposure apparatus, immersion exposure method, and device manufacturing method
JP2010123991A5 (en)
JP2011166173A5 (en) Immersion exposure apparatus, immersion exposure method, and device manufacturing method
JP2012084903A5 (en) Immersion exposure apparatus, immersion exposure method, and device manufacturing method
JP2011097112A5 (en)
JP2010098333A5 (en)
JP2012142604A5 (en)
JP2012142603A5 (en)
JP2011109138A5 (en)
JP2011211222A5 (en)
JP2011049607A5 (en)
JP2012138617A5 (en)
JP2009117877A5 (en)
JP2011124606A5 (en)
JP2008244488A5 (en)
JP2012142592A5 (en) Exposure apparatus and stage control method
JP2012094902A5 (en) Exposure method, exposure apparatus, and device manufacturing method
JP2008188727A (en) Alignment method and its apparatus
JP2012138624A5 (en) Immersion lithography apparatus and cleaning method
JP2019016801A5 (en) Object moving method, object moving apparatus, exposure apparatus, flat panel display manufacturing method, and device manufacturing method
JP2009520110A5 (en)
JP2011097114A5 (en) Exposure apparatus and liquid supply method
HRP20151059A2 (en) Method of grinding a weld of the metal band
JP2014170957A5 (en)
JP2013257409A5 (en)