JP2000058436A - Projection aligner and exposure method - Google Patents

Projection aligner and exposure method

Info

Publication number
JP2000058436A
JP2000058436A JP10239562A JP23956298A JP2000058436A JP 2000058436 A JP2000058436 A JP 2000058436A JP 10239562 A JP10239562 A JP 10239562A JP 23956298 A JP23956298 A JP 23956298A JP 2000058436 A JP2000058436 A JP 2000058436A
Authority
JP
Japan
Prior art keywords
lens
liquid
exposure
photosensitive
projection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10239562A
Other languages
Japanese (ja)
Inventor
Yohei Fujishima
Koichi Matsumoto
宏一 松本
洋平 藤島
Original Assignee
Nikon Corp
株式会社ニコン
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp, 株式会社ニコン filed Critical Nikon Corp
Priority to JP10239562A priority Critical patent/JP2000058436A/en
Publication of JP2000058436A publication Critical patent/JP2000058436A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Exposure apparatus for microlithography
    • G03F7/70216—Systems for imaging mask onto workpiece
    • G03F7/70325—Resolution enhancement techniques not otherwise provided for, e.g. darkfield imaging, interfering beams, spatial frequency multiplication, nearfield lens
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Exposure apparatus for microlithography
    • G03F7/70216—Systems for imaging mask onto workpiece
    • G03F7/70341—Immersion

Abstract

(57) [Summary] [PROBLEMS] Even when a projection optical system is used in a liquid immersion state, compared with a case where the projection optical system is used in a normal state, a change in an imaging position by the projection optical system and an imaging performance near an optical axis. Provided are a projection exposure apparatus and an exposure method with a small number. In a projection exposure apparatus having a projection optical system for transferring a pattern drawn on an original to a photosensitive surface of a substrate, a lens surface of the projection optical system closest to the substrate and a photosensitive surface. The auxiliary lens 4 is removably disposed in the space between the auxiliary lens 4 and the space between the lower surface of the auxiliary lens 4 and the photosensitive surface 5a is formed so as to be immersed in liquid. 1 is the original 1 side lens surface to the photosensitive surface 5
It is formed so as to be substantially equal to the distance d 1 on the optical axis Z up to a.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a projection exposure apparatus having a projection optical system for printing and transferring a pattern drawn on an original onto a substrate, and an exposure method.

[0002]

2. Description of the Related Art In recent years, miniaturization of a pattern transferred to a wafer as a photosensitive substrate has been desired. In order to achieve this, there are two methods of reducing the exposure wavelength and increasing the numerical aperture of the projection optical system.
Conventionally, among these methods, a liquid immersion type projection exposure apparatus has been proposed as a method of increasing the numerical aperture of a projection optical system. In an immersion type projection exposure apparatus, a space between the lens surface of the projection optical system closest to the wafer and the wafer, that is, the entire working distance (working distance) (hereinafter referred to as the working space) or the wafer side. Is a device for filling the subspace with a liquid such as oil. For example, the refractive index of air occupying the working space in normal use is 1.0, whereas the refractive index of oil is, for example, about 1.6. Therefore, if the entire working space or the partial space on the wafer side is replaced with such a liquid having a high refractive index, the numerical aperture on the wafer side of the projection optical system can be increased, and the exposure pattern can be miniaturized. it can.

[0003]

In the conventional liquid immersion type projection exposure apparatus, the working space is usually used with a gas such as air, and the entire working space or the wafer side is reduced by miniaturizing the pattern. When using liquid immersion with a partial space as a liquid,
Equivalent imaging performance could not be secured. For example, as a usage method during liquid immersion in which the wafer-side partial space of the working space is liquid, consider a case where a parallel plate glass is installed at the boundary between gas and liquid. In such a case, the following three problems occur.

The first problem is that when using liquid immersion, the position of the image formed by the projection optical system shifts due to refraction of light on the incident surface of the parallel plate glass. Therefore, it is necessary to move the projection optical system or the wafer so as to secure the focal length. Then, depending on the conditions at the time of using the liquid immersion, the imaging position may not be able to be adjusted on the wafer. The second problem is that a spherical aberration is caused by the parallel flat glass placed at the boundary between the gas and the liquid when the liquid immersion is used. As a result, the imaging performance is deteriorated when using the liquid immersion. Third, there is a problem that a change in imaging performance and an imaging position at the time of using the liquid immersion becomes large due to environmental fluctuation. That is, since the refractive index of the liquid changes significantly due to environmental changes such as temperature changes as compared with the refractive index of the gas, the imaging performance and the imaging position are not stable. Therefore, the present invention provides a projection exposure system in which, even when the projection optical system is used in the liquid immersion state, the imaging position by the projection optical system and the imaging performance near the optical axis are less changed than when the projection optical system is used in the normal state. It is an object to provide an apparatus and an exposure method.

[0005]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problem. That is, when the reference numerals in FIG. 1 and FIG. In a projection exposure apparatus having a projection optical system (2) for transferring a pattern (1a) drawn on an original (1) to a photosensitive surface (5a) of a substrate (5), 5) Side lens surface and photosensitive surface (5a)
Auxiliary lens (4) is removably arranged in the space with
The space between the lower surface of the auxiliary lens (4) and the photosensitive surface (5a)
The radius of curvature (R 1 ) of the lens surface on the master (1) side of the auxiliary lens (4) is formed on the optical axis (Z) from the lens surface on the master (1) side to the photosensitive surface (5a). Distance (d 1 )
The projection exposure apparatus is formed so as to be substantially equal to the following. At this time, if the reference numerals given in FIG. 3 of the attached drawings are further added in parentheses, the radius of curvature (R 2 ) of the lens surface on the substrate (5) side of the auxiliary lens (4) is
It is preferable that the distance between the side lens surface and the photosensitive surface (5a) be substantially equal to the distance (d 2 ) on the optical axis (Z).

Further, according to the present invention, when the reference numerals given in FIGS. 1 and 4 of the accompanying drawings are added in parentheses, the pattern (1a) drawn on the original (1) is used for the photosensitive surface (5) of the substrate (5).
a) In a projection exposure apparatus having a projection optical system (2) for transferring to the substrate (5), the radius of curvature (R 2 ) of the lens surface closest to the substrate (5) of the projection optical system ( 2 ) is set to a projection exposure apparatus characterized in that it is formed to be substantially equal to the distance (d 2) on the optical axis (Z) from the surface to the photosensitive surface (5a). Further, according to the present invention, in the method of exposing using the projection exposure apparatus having the above-described configuration, the illumination step of illuminating the original (1) with predetermined exposure light is described with the reference numerals in parentheses in FIG. And an exposure step of exposing the pattern image (1a) of the original (1) to the photosensitive surface (5a) of the substrate (5) via the projection optical system (2).

[0007]

Embodiments of the present invention will be described with reference to the drawings. 1 and 2 show a first embodiment of a projection exposure apparatus according to the present invention. FIG. 1 is a view showing a projection exposure apparatus during normal use according to a first embodiment of the present invention. The first embodiment employs an exposure method including an illumination step and an exposure step,
The image of the pattern surface 1a of the reticle 1 is transferred to the image surface 5a of the wafer 5.
(Photosensitive surface). That is, a light beam emitted from a light source 10 such as a KrF excimer laser light source is
After that, the pattern surface 1a of the reticle 1 as an original placed on the reticle stage 12 is uniformly illuminated. Exposure light emitted from the pattern surface 1a of the reticle 1
The image of the pattern surface 1a is formed on the image surface 5a of the wafer 5 placed on the XY stage 8 via the projection optical system 2. The normal use refers to a state in which the working space is only air.

Here, on the XY stage 8, a rotating shaft 7 is provided.
Auxiliary lens 4 held by lens holder 3 with
Is installed. The auxiliary lens 4 is rotatable about a rotation shaft 7. When rotated 180 ° from the position shown in FIG.
Is placed directly below. At this time, the optical axis of the auxiliary lens 4 matches the optical axis of the projection optical system 2. On the XY stage 8, a box-shaped liquid shielding plate 6 is provided.
FIG. 1 shows only a cross section of the liquid shielding plate 6 for simplicity.
Then, a liquid such as oil is put into a space surrounded by the liquid shielding plate 6, and a partial space on the wafer 5 side of the working space can be made liquid. When the projection exposure apparatus according to the first embodiment is used in a liquid immersion state, the auxiliary lens 4 is disposed immediately below the projection optical system 2, and the liquid is introduced into the liquid shielding plate 6. At this time, the space between the upper surface of the auxiliary lens 4 (the surface on the reticle 1 side) and the lower surface of the projection optical system 2 (the surface closest to the wafer 5) is air. Then, the lower surface of the auxiliary lens 4 (the surface on the wafer 5 side)
, And the liquid between the wafer 5. The broken line M in FIG.
Shows the boundary between air and liquid.

FIG. 2 is an enlarged view of the vicinity of the auxiliary lens 4 in the projection exposure apparatus when using liquid immersion according to the first embodiment of the present invention. As described above, when the liquid immersion is used, the space on the upper surface side of the auxiliary lens 4 is air A, and the space on the lower surface side of the auxiliary lens 4 is liquid L. Further, the refractive index of the auxiliary lens 4 in the first embodiment is substantially equal to the refractive index of the liquid L. The shape of the upper surface of the auxiliary lens 4 is such that all the light rays K imaged at the center of the image plane 5a on the wafer 5 are vertically incident. That is, the center of curvature of the upper surface of the auxiliary lens 4 coincides with the center of the image plane 5a in normal use where there is no auxiliary lens 4 and no liquid L. The radius of curvature R 1 of the upper surface of the auxiliary lens 4 satisfies the following equation. R 1 = d 1 (1) d 1 : distance on the optical axis Z from the upper surface of the auxiliary lens 4 to the wafer image plane 5a

On the other hand, the lower surface of the auxiliary lens 4 has a planar shape. As described above, since the refractive index of the auxiliary lens 4 and that of the liquid L are equal, all the light rays K imaged in the vicinity of the center of the image plane 5 a
Like the upper surface, it hardly bends. Therefore, the half angle of convergence during use of the liquid immersion is equal to the half angle of convergence during normal use. At this time, the numerical aperture N of the projection optical system 2 on the wafer 5 side
A is obtained by NA = n sin θ n: refractive index of liquid to air θ: half angle of convergence. The resolution Δr is obtained by the following equation. Δr = kλ 0 / NA λ 0 : refractive index of exposure light in air k: constant

Therefore, when using the liquid immersion, the numerical aperture can be increased by n times and the resolution near the center of the image plane 5a can be improved to 1 / n as compared with the normal use. Further, in the first embodiment, all the light rays K imaged at the center of the image plane 5a are not refracted by the auxiliary lens 4, so that no spherical aberration occurs. Further, when the chromatic dispersion of the auxiliary lens 4 is equal to the chromatic dispersion of the liquid L, no axial chromatic aberration occurs. As a result, on the image plane 5a near the optical axis Z, the imaging performance during normal use is substantially maintained even during liquid immersion use.
Further, there is no change in the image forming position by the projection optical system 5 between the time of using the liquid immersion and the time of normal use.

Next, FIG. 3 shows a second embodiment of the projection exposure apparatus according to the present invention. In the second embodiment, the auxiliary lens 4
Only the shape is different from the first embodiment. FIG. 3 is an enlarged view of the vicinity of the auxiliary lens 4 in the projection exposure apparatus at the time of using the liquid immersion according to the second embodiment of the present invention. The shape of the upper surface of the auxiliary lens 4 of the second embodiment is the same as that of the first embodiment.
It is equal to the shape of the upper surface of the auxiliary lens 4 of the embodiment. That is, the relationship of the expression (1) is established in the upper surface portion.

On the other hand, the lower surface of the auxiliary lens 4 of the first embodiment has a planar shape, whereas the lower surface of the auxiliary lens 4 of the second embodiment has a curved surface. The lower surface shape is such that all the light rays K imaged at the center of the image plane 5a on the wafer 5 are vertically incident, as in the upper surface shape. That is, the center of curvature of the lower surface of the auxiliary lens 4 coincides with the center of the image plane 5a in normal use. Then, the curvature radius R 2 of the lower surface of the auxiliary lens 4
Satisfies the following equation. R 2 = d 2 (2) d 2 : distance on the optical axis Z from the lower surface of the auxiliary lens 4 to the wafer image plane 5a

According to the second embodiment, even when the refractive index of the auxiliary lens 4 is different from that of the liquid L, or when the refractive index of the liquid L changes due to environmental fluctuation such as temperature change, aberrations and / or aberrations may occur. Little change in image position. That is, the light rays K of all the wavelengths imaged at the center of the image plane 5a are not refracted on the lower surface of the auxiliary lens 4 irrespective of the refractive index or chromatic dispersion of the liquid L. Therefore, also in the second embodiment, the first
As in the embodiment, high resolution can be obtained when using immersion. Further, even when the normal use and the liquid immersion use are compared, the image forming position by the projection optical system 2 does not change, and the image plane 5a
The imaging performance on the image plane 5a near the optical axis Z is maintained without any change in axial chromatic aberration or spherical aberration at the time. Further, even if the refractive index of the liquid L changes due to a temperature change or the like, there is no change in the imaging position, axial chromatic aberration, and spherical aberration.

FIG. 4 shows a third embodiment of the projection exposure apparatus according to the present invention. In the first and second embodiments, a part of the partial space on the wafer 5 side of the working space is used as the liquid when using the liquid immersion, but in the third embodiment, the whole working space is used as the liquid when using the liquid immersion. That is, when the liquid immersion is used, the surface of the projection optical system 2 closest to the wafer 5 is immersed in the liquid. Therefore, the projection exposure apparatus of the third embodiment is different from that of FIG.
Must be higher than the lower surface of the projection optical system 2. Further, the lens holder 3, the auxiliary lens 4, and the lens holder 3 shown in FIG.
The rotating shaft 7 becomes unnecessary.

FIG. 4 is an enlarged view of the surface of the projection optical system 2 closest to the wafer 5 when the liquid immersion is used. The shape of the surface of the projection optical system 2 closest to the wafer 5 is equal to the shape of the lower surface of the auxiliary lens 4 in the second embodiment. That is, the relationship of the expression (2) is established on the lower surface. On the other hand, even in the normal use, the projection optical system 2 shown in FIG. 4 is used. However, as in the case of using the liquid immersion, all the light rays K imaged near the center of the image plane 5a are not refracted. . Also in the third embodiment, high resolution can be obtained when using liquid immersion, as in the second embodiment. Further, even when the normal use and the liquid immersion use are compared, the image forming position by the projection optical system 2 does not change, there is no change in the axial chromatic aberration and the spherical aberration on the image plane 5a, and there is no change in the vicinity of the optical axis Z. Is maintained on the image plane 5a. Further, even if the refractive index of the liquid L changes due to a temperature change or the like, there is no change in the imaging position, axial chromatic aberration, and spherical aberration.

[0017]

As described above, according to the present invention, the projection exposure apparatus can be used in both the normal state and the liquid immersion state. In addition, it is possible to provide a projection exposure apparatus in which the imaging performance near the imaging position and the optical axis hardly changes even when the liquid immersion is used. Further, it is possible to provide a projection exposure apparatus and an exposure method which are less affected by a change in the refractive index of the liquid.

[Brief description of the drawings]

FIG. 1 is a view showing a projection exposure apparatus according to a first embodiment of the present invention.

FIG. 2 is a diagram showing a state of the projection exposure apparatus according to the first embodiment of the present invention when using liquid immersion.

FIG. 3 is a view showing a state of a projection exposure apparatus according to a second embodiment of the present invention when using liquid immersion.

FIG. 4 is a diagram showing a state of a projection exposure apparatus according to a third embodiment of the present invention when using liquid immersion.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Reticle 1a ... Pattern surface 2 ... Projection optical system 3 ... Lens holder 4 ... Auxiliary lens 5 ... Wafer 5a ... Image surface 6 ... Liquid shielding plate 7 ... Rotation axis 8 ... XY stage 10 ... Light source 11 ... Illumination optical system 12 ... Reticle stage Z: Optical axis K: Ray A: Gas L: Liquid

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2H087 KA21 LA00 NA04 PA01 PB01 QA01 QA03 5F046 BA03 CA04 CB12 CB25 CB26 CB27 DA13

Claims (4)

[Claims]
1. A projection exposure apparatus having a projection optical system for transferring a pattern drawn on an original onto a photosensitive surface of a substrate, wherein a projection optical system has a space between a lens surface closest to the substrate and the photosensitive surface. An auxiliary lens is disposed so as to be able to be inserted and removed, a space between the lower surface of the auxiliary lens and the photosensitive surface is formed so as to be immersed in liquid, and a radius of curvature of the original-side lens surface of the auxiliary lens is from the original-side lens surface. A projection exposure apparatus formed so as to be substantially equal to a distance on the optical axis to the photosensitive surface.
2. The apparatus according to claim 1, wherein a radius of curvature of the substrate side lens surface of the auxiliary lens is substantially equal to a distance on the optical axis from the substrate side lens surface to the photosensitive surface. 2. The projection exposure apparatus according to claim 1.
3. A projection exposure apparatus having a projection optical system for transferring a pattern drawn on an original onto a photosensitive surface of a substrate, wherein a radius of curvature of a lens surface closest to the substrate of the projection optical system is:
A projection exposure apparatus formed to be substantially equal to a distance on the optical axis from the lens surface on the substrate side to the photosensitive surface.
4. A method of exposing using the projection exposure apparatus according to claim 1, wherein an illumination step of illuminating the original with predetermined exposure light; Exposing the pattern image of the original to a photosensitive surface of the substrate through the exposure step.
JP10239562A 1998-08-11 1998-08-11 Projection aligner and exposure method Pending JP2000058436A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10239562A JP2000058436A (en) 1998-08-11 1998-08-11 Projection aligner and exposure method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10239562A JP2000058436A (en) 1998-08-11 1998-08-11 Projection aligner and exposure method

Publications (1)

Publication Number Publication Date
JP2000058436A true JP2000058436A (en) 2000-02-25

Family

ID=17046655

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10239562A Pending JP2000058436A (en) 1998-08-11 1998-08-11 Projection aligner and exposure method

Country Status (1)

Country Link
JP (1) JP2000058436A (en)

Cited By (284)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004053958A1 (en) * 2002-12-10 2004-06-24 Nikon Corporation Exposure apparatus and method for manufacturing device
WO2004053959A1 (en) * 2002-12-10 2004-06-24 Nikon Corporation Optical device and projection exposure apparatus using such optical device
WO2004053953A1 (en) * 2002-12-10 2004-06-24 Nikon Corporation Exposure apparatus and method for manufacturing device
WO2004053957A1 (en) * 2002-12-10 2004-06-24 Nikon Corporation Surface position detection apparatus, exposure method, and device porducing method
WO2004053955A1 (en) * 2002-12-10 2004-06-24 Nikon Corporation Exposure system and device producing method
WO2004053954A1 (en) * 2002-12-10 2004-06-24 Nikon Corporation Exposure apparatus and method for manufacturing device
WO2004053956A1 (en) * 2002-12-10 2004-06-24 Nikon Corporation Exposure apparatus, exposure method and method for manufacturing device
JP2004207711A (en) * 2002-12-10 2004-07-22 Nikon Corp Exposure device, exposure method, and device manufacturing method
WO2004086470A1 (en) * 2003-03-25 2004-10-07 Nikon Corporation Exposure system and device production method
WO2004086468A1 (en) * 2003-02-26 2004-10-07 Nikon Corporation Exposure apparatus and method, and method of producing apparatus
WO2004112108A1 (en) * 2003-06-13 2004-12-23 Nikon Corporation Exposure method, substrate stage, exposure apparatus and method for manufacturing device
WO2005010962A1 (en) * 2003-07-28 2005-02-03 Nikon Corporation Exposure apparatus, device producing method, and exposure apparatus controlling method
WO2005031799A2 (en) 2003-09-29 2005-04-07 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
JP2005101488A (en) * 2002-12-10 2005-04-14 Nikon Corp Aligner, exposure method, and manufacturing method of device
WO2005076322A1 (en) * 2004-02-09 2005-08-18 Yoshihiko Okamoto Aligner and semiconductor device manufacturing method using the aligner
WO2005076323A1 (en) * 2004-02-10 2005-08-18 Nikon Corporation Aligner, device manufacturing method, maintenance method and aligning method
WO2005078777A1 (en) * 2004-02-18 2005-08-25 Nikon Corporation Drive method, exposure method, exposure device, and device manufacturing method
WO2005081067A1 (en) 2004-02-13 2005-09-01 Carl Zeiss Smt Ag Projection objective for a microlithographic projection exposure apparatus
WO2005081295A1 (en) * 2004-02-20 2005-09-01 Nikon Corporation Exposure method, exposure apparatus, exposure system and method for manufacturing device
JP2005268742A (en) * 2003-07-28 2005-09-29 Nikon Corp Exposure device and device manufacturing method, and controlling method of its exposure device
US6952253B2 (en) 2002-11-12 2005-10-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2005106930A1 (en) * 2004-04-27 2005-11-10 Nikon Corporation Exposure method, exposure system, and method for fabricating device
WO2005124833A1 (en) * 2004-06-21 2005-12-29 Nikon Corporation Exposure device, exposure device member cleaning method, exposure device maintenance method, maintenance device, and device manufacturing method
JP2006023538A (en) * 2004-07-08 2006-01-26 Fuji Photo Film Co Ltd Protective film forming composition for liquid immersion exposure, and pattern forming method using the same
JP2006030603A (en) * 2004-07-16 2006-02-02 Fuji Photo Film Co Ltd Protective film forming composition for liquid immersion exposure, and pattern forming method using the same
EP1630616A2 (en) * 2004-08-27 2006-03-01 ASML Holding N.V. System for reducing movement induced disturbances in immersion lithography
US7009682B2 (en) 2002-11-18 2006-03-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7012673B2 (en) 2003-06-27 2006-03-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1645911A1 (en) * 2004-10-07 2006-04-12 ASML Netherlands BV Lithographic apparatus and device manufacturing method
EP1647865A1 (en) * 2004-10-18 2006-04-19 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2006041083A1 (en) * 2004-10-13 2006-04-20 Nikon Corporation Exposure apparatus, exposure method and device manufacturing method
US7034917B2 (en) 2004-04-01 2006-04-25 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufactured thereby
US7038760B2 (en) 2003-06-30 2006-05-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7050146B2 (en) 2004-02-09 2006-05-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2006140459A (en) * 2004-10-13 2006-06-01 Nikon Corp Aligner, exposing method, and device manufacturing method
JP2006165502A (en) * 2004-06-21 2006-06-22 Nikon Corp Exposure apparatus, method of cleaning member thereof, maintenance method of exposure apparatus, maintenance device, and device manufacturing method
US7075616B2 (en) 2002-11-12 2006-07-11 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2006190971A (en) * 2004-10-13 2006-07-20 Nikon Corp Exposure apparatus, exposure method, and device manufacturing method
US7081943B2 (en) 2002-11-12 2006-07-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR100609795B1 (en) 2003-06-19 2006-08-08 에이에스엠엘 홀딩 엔.브이. Immersion photolithography system and method using microchannel nozzles
US7110081B2 (en) 2002-11-12 2006-09-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7110087B2 (en) 2003-06-30 2006-09-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7119874B2 (en) 2003-06-27 2006-10-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2006053751A3 (en) * 2004-11-18 2006-10-12 Zeiss Carl Smt Ag Projection lens system of a microlithographic projection exposure installation
US7133114B2 (en) 2004-09-20 2006-11-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7145630B2 (en) 2004-11-23 2006-12-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2006332669A (en) * 2005-05-25 2006-12-07 Carl Zeiss Smt Ag Projection lens suitable for use together with different immersion liquid, and converting method and manufacturing method therefor
US7158211B2 (en) 2003-09-29 2007-01-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7161663B2 (en) 2004-07-22 2007-01-09 Asml Netherlands B.V. Lithographic apparatus
US7161654B2 (en) 2004-12-02 2007-01-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2007005830A (en) * 2003-07-28 2007-01-11 Nikon Corp Exposure system, exposure method, and method for manufacturing device
US7175968B2 (en) 2003-07-28 2007-02-13 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and a substrate
US7184122B2 (en) 2003-07-24 2007-02-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1759248A1 (en) * 2004-06-04 2007-03-07 Carl Zeiss SMT AG Projection system with compensation of intensity variatons and compensation element therefor
US7193681B2 (en) 2003-09-29 2007-03-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7193232B2 (en) 2002-11-12 2007-03-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method with substrate measurement not through liquid
US7196770B2 (en) 2004-12-07 2007-03-27 Asml Netherlands B.V. Prewetting of substrate before immersion exposure
WO2007034838A1 (en) * 2005-09-21 2007-03-29 Nikon Corporation Exposure device, exposure method, and device fabrication method
US7199939B2 (en) 2005-01-05 2007-04-03 Canon Kabushiki Kaisha Immersion optical system and optical apparatus having the same
US7199858B2 (en) 2002-11-12 2007-04-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7213963B2 (en) 2003-06-09 2007-05-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7224431B2 (en) 2005-02-22 2007-05-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7227619B2 (en) 2004-04-01 2007-06-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2007157827A (en) * 2005-12-01 2007-06-21 Tokyo Ohka Kogyo Co Ltd Method for removing liquid and method for evaluating resist pattern using same
JP2007516613A (en) * 2003-12-15 2007-06-21 カール・ツアイス・エスエムテイ・アーゲー Objective lens as a microlithographic projection objective comprising at least one liquid lens
US7248334B2 (en) 2004-12-07 2007-07-24 Asml Netherlands B.V. Sensor shield
JP2007520893A (en) * 2004-02-03 2007-07-26 ロチェスター インスティテュート オブ テクノロジー Photolithographic method and system using fluid
US7251013B2 (en) 2004-11-12 2007-07-31 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7291850B2 (en) 2005-04-08 2007-11-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7295283B2 (en) 2004-04-02 2007-11-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7304715B2 (en) 2004-08-13 2007-12-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7317507B2 (en) 2005-05-03 2008-01-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7324185B2 (en) 2005-03-04 2008-01-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7330238B2 (en) 2005-03-28 2008-02-12 Asml Netherlands, B.V. Lithographic apparatus, immersion projection apparatus and device manufacturing method
US7339650B2 (en) 2003-04-09 2008-03-04 Nikon Corporation Immersion lithography fluid control system that applies force to confine the immersion liquid
US7345742B2 (en) 2003-04-10 2008-03-18 Nikon Corporation Environmental system including a transport region for an immersion lithography apparatus
US7352440B2 (en) 2004-12-10 2008-04-01 Asml Netherlands B.V. Substrate placement in immersion lithography
US7352435B2 (en) 2003-10-15 2008-04-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7355674B2 (en) 2004-09-28 2008-04-08 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and computer program product
US7359030B2 (en) 2002-11-29 2008-04-15 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7365827B2 (en) 2004-12-08 2008-04-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7379155B2 (en) 2004-10-18 2008-05-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7379159B2 (en) 2004-05-03 2008-05-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7378025B2 (en) 2005-02-22 2008-05-27 Asml Netherlands B.V. Fluid filtration method, fluid filtered thereby, lithographic apparatus and device manufacturing method
US7397532B2 (en) 2003-04-10 2008-07-08 Nikon Corporation Run-off path to collect liquid for an immersion lithography apparatus
US7403261B2 (en) 2004-12-15 2008-07-22 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7405805B2 (en) 2004-12-28 2008-07-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7408652B2 (en) 2002-12-20 2008-08-05 Carl Zeiss Smt Ag Device and method for the optical measurement of an optical system by using an immersion fluid
US7411657B2 (en) 2004-11-17 2008-08-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7411654B2 (en) 2005-04-05 2008-08-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7411658B2 (en) 2005-10-06 2008-08-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7414699B2 (en) 2004-11-12 2008-08-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7420194B2 (en) 2005-12-27 2008-09-02 Asml Netherlands B.V. Lithographic apparatus and substrate edge seal
US7423720B2 (en) 2004-11-12 2008-09-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2008219017A (en) * 2003-12-23 2008-09-18 Asml Netherlands Bv Lithographic apparatus, alignment apparatus, device manufacturing method, aligning method, and method of converting apparatus
US7428038B2 (en) 2005-02-28 2008-09-23 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and apparatus for de-gassing a liquid
US7433015B2 (en) 2003-10-15 2008-10-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7433016B2 (en) 2005-05-03 2008-10-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7433019B2 (en) 2003-07-09 2008-10-07 Nikon Corporation Exposure apparatus and device manufacturing method
US7443482B2 (en) 2003-04-11 2008-10-28 Nikon Corporation Liquid jet and recovery system for immersion lithography
US7446850B2 (en) 2004-12-03 2008-11-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7450217B2 (en) 2005-01-12 2008-11-11 Asml Netherlands B.V. Exposure apparatus, coatings for exposure apparatus, lithographic apparatus, device manufacturing method, and device manufactured thereby
CN100433253C (en) * 2003-02-26 2008-11-12 株式会社尼康 Exposure apparatus, exposure method, and method for producing device
US7456929B2 (en) 2004-10-15 2008-11-25 Nikon Corporation Exposure apparatus and device manufacturing method
US7468779B2 (en) 2005-06-28 2008-12-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7474379B2 (en) 2005-06-28 2009-01-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7486381B2 (en) 2004-05-21 2009-02-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7491661B2 (en) 2004-12-28 2009-02-17 Asml Netherlands B.V. Device manufacturing method, top coat material and substrate
US7501220B2 (en) * 2003-01-31 2009-03-10 Tokyo Ohka Kogyo Co., Ltd. Resist composition
US7522261B2 (en) 2004-09-24 2009-04-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7524618B2 (en) 2004-03-24 2009-04-28 Kabushiki Kaisha Toshiba Resist pattern forming method, semiconductor apparatus using said method, and exposure apparatus thereof
US7528931B2 (en) 2004-12-20 2009-05-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7532306B2 (en) 2003-05-30 2009-05-12 Carl Zeiss Smt Ag Microlithographic projection exposure apparatus
US7535644B2 (en) 2005-08-12 2009-05-19 Asml Netherlands B.V. Lens element, lithographic apparatus, device manufacturing method, and device manufactured thereby
US7545481B2 (en) 2003-11-24 2009-06-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7583357B2 (en) 2004-11-12 2009-09-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7623218B2 (en) 2004-11-24 2009-11-24 Carl Zeiss Smt Ag Method of manufacturing a miniaturized device
US7633073B2 (en) 2005-11-23 2009-12-15 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7649611B2 (en) 2005-12-30 2010-01-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7652746B2 (en) 2005-06-21 2010-01-26 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7656501B2 (en) 2005-11-16 2010-02-02 Asml Netherlands B.V. Lithographic apparatus
US7670730B2 (en) 2004-12-30 2010-03-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7684010B2 (en) 2005-03-09 2010-03-23 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method, seal structure, method of removing an object and a method of sealing
US7697110B2 (en) 2004-01-26 2010-04-13 Nikon Corporation Exposure apparatus and device manufacturing method
US7697111B2 (en) 2003-08-26 2010-04-13 Nikon Corporation Optical element and exposure apparatus
US7705968B2 (en) 2005-03-18 2010-04-27 Nikon Corporation Plate member, substrate holding device, exposure apparatus and method, and device manufacturing method
US7705962B2 (en) 2005-01-14 2010-04-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2010098328A (en) * 2003-09-29 2010-04-30 Nikon Corp Exposure apparatus, method for exposure, and method for manufacturing device
US7719658B2 (en) 2004-02-13 2010-05-18 Carl Zeiss Smt Ag Imaging system for a microlithographical projection light system
US7733459B2 (en) 2003-08-29 2010-06-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7738074B2 (en) 2003-07-16 2010-06-15 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7751027B2 (en) 2005-06-21 2010-07-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7759631B2 (en) * 2008-01-22 2010-07-20 Nanosurf Ag Raster scanning microscope having transparent optical element with inner curved surface
KR100971440B1 (en) 2002-12-19 2010-07-21 코닌클리케 필립스 일렉트로닉스 엔.브이. Method and device for irradiating spots on a layer
US7773195B2 (en) 2005-11-29 2010-08-10 Asml Holding N.V. System and method to increase surface tension and contact angle in immersion lithography
US7791709B2 (en) 2006-12-08 2010-09-07 Asml Netherlands B.V. Substrate support and lithographic process
US7804574B2 (en) 2003-05-30 2010-09-28 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method using acidic liquid
US7804576B2 (en) 2004-12-06 2010-09-28 Nikon Corporation Maintenance method, maintenance device, exposure apparatus, and device manufacturing method
US7803516B2 (en) 2005-11-21 2010-09-28 Nikon Corporation Exposure method, device manufacturing method using the same, exposure apparatus, and substrate processing method and apparatus
US7804577B2 (en) 2005-11-16 2010-09-28 Asml Netherlands B.V. Lithographic apparatus
US7812926B2 (en) 2005-08-31 2010-10-12 Nikon Corporation Optical element, exposure apparatus based on the use of the same, exposure method, and method for producing microdevice
US7817245B2 (en) 2003-09-29 2010-10-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7830611B2 (en) 2005-07-25 2010-11-09 Carl Zeiss Smt Ag Projection objective of a microlithographic projection exposure apparatus
US7834974B2 (en) 2005-06-28 2010-11-16 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7839485B2 (en) 2006-01-19 2010-11-23 Nikon Corporation Movable body drive method, movable body drive system, pattern formation method, pattern forming apparatus, exposure method, exposure apparatus, and device manufacturing method
US7839483B2 (en) 2005-12-28 2010-11-23 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and a control system
US7864292B2 (en) 2005-11-16 2011-01-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7872730B2 (en) 2006-09-15 2011-01-18 Nikon Corporation Immersion exposure apparatus and immersion exposure method, and device manufacturing method
US7894040B2 (en) 2004-10-05 2011-02-22 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7898643B2 (en) 2003-06-27 2011-03-01 Asml Holding N.V. Immersion photolithography system and method using inverted wafer-projection optics interface
US7924416B2 (en) 2005-06-22 2011-04-12 Nikon Corporation Measurement apparatus, exposure apparatus, and device manufacturing method
US7932996B2 (en) 2003-10-28 2011-04-26 Nikon Corporation Exposure apparatus, exposure method, and device fabrication method
US7948604B2 (en) 2002-12-10 2011-05-24 Nikon Corporation Exposure apparatus and method for producing device
US7973910B2 (en) 2006-11-17 2011-07-05 Nikon Corporation Stage apparatus and exposure apparatus
US8013975B2 (en) 2006-12-01 2011-09-06 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US8018573B2 (en) 2005-02-22 2011-09-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8023100B2 (en) 2004-02-20 2011-09-20 Nikon Corporation Exposure apparatus, supply method and recovery method, exposure method, and device producing method
US8035800B2 (en) 2006-03-13 2011-10-11 Nikon Corporation Exposure apparatus, maintenance method, exposure method, and method for producing device
US8035799B2 (en) 2004-12-09 2011-10-11 Nikon Corporation Exposure apparatus, exposure method, and device producing method
US8035797B2 (en) 2003-09-26 2011-10-11 Nikon Corporation Projection exposure apparatus, cleaning and maintenance methods of a projection exposure apparatus, and device manufacturing method
US8040489B2 (en) 2004-10-26 2011-10-18 Nikon Corporation Substrate processing method, exposure apparatus, and method for producing device by immersing substrate in second liquid before immersion exposure through first liquid
US8040490B2 (en) 2006-12-01 2011-10-18 Nikon Corporation Liquid immersion exposure apparatus, exposure method, and method for producing device
US8045134B2 (en) 2006-03-13 2011-10-25 Asml Netherlands B.V. Lithographic apparatus, control system and device manufacturing method
US8045135B2 (en) 2006-11-22 2011-10-25 Asml Netherlands B.V. Lithographic apparatus with a fluid combining unit and related device manufacturing method
US8054557B2 (en) 2005-06-14 2011-11-08 Carl Zeiss Smt Gmbh Lithography projection objective, and a method for correcting image defects of the same
US8054445B2 (en) 2005-08-16 2011-11-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8054465B2 (en) 2004-11-18 2011-11-08 Nikon Corporation Position measurement method
US8064044B2 (en) 2004-01-05 2011-11-22 Nikon Corporation Exposure apparatus, exposure method, and device producing method
US8064039B2 (en) 2005-04-25 2011-11-22 Nikon Corporation Exposure method, exposure apparatus, and device manufacturing method
US8064037B2 (en) 2003-08-21 2011-11-22 Nikon Corporation Immersion exposure apparatus and device manufacturing method with no liquid recovery during exposure
US8070145B2 (en) 2005-08-26 2011-12-06 Nikon Corporation Holding unit, assembly system, sputtering unit, and processing method and processing unit
US8102512B2 (en) 2004-09-17 2012-01-24 Nikon Corporation Substrate holding device, exposure apparatus, and device manufacturing method
US8111374B2 (en) 2005-09-09 2012-02-07 Nikon Corporation Analysis method, exposure method, and device manufacturing method
US8134681B2 (en) 2006-02-17 2012-03-13 Nikon Corporation Adjustment method, substrate processing method, substrate processing apparatus, exposure apparatus, inspection apparatus, measurement and/or inspection system, processing apparatus, computer system, program and information recording medium
US8164736B2 (en) 2007-05-29 2012-04-24 Nikon Corporation Exposure method, exposure apparatus, and method for producing device
US8179517B2 (en) 2005-06-30 2012-05-15 Nikon Corporation Exposure apparatus and method, maintenance method for exposure apparatus, and device manufacturing method
US8203693B2 (en) 2005-04-19 2012-06-19 Asml Netherlands B.V. Liquid immersion lithography system comprising a tilted showerhead relative to a substrate
US8203697B2 (en) 2006-08-31 2012-06-19 Nikon Corporation Movable body drive method and system, pattern formation method and apparatus, exposure method and apparatus for driving movable body based on measurement value of encoder and information on flatness of scale, and device manufacturing method
US8208119B2 (en) 2004-02-04 2012-06-26 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US8208124B2 (en) 2003-08-29 2012-06-26 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8208123B2 (en) 2003-08-29 2012-06-26 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8236467B2 (en) 2005-04-28 2012-08-07 Nikon Corporation Exposure method, exposure apparatus, and device manufacturing method
US8237915B2 (en) 2002-12-10 2012-08-07 Carl Zeiss Smt Gmbh Method for improving an optical imaging property of a projection objective of a microlithographic projection exposure apparatus
US8248577B2 (en) 2005-05-03 2012-08-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8253921B2 (en) 2003-09-03 2012-08-28 Nikon Corporation Exposure apparatus and device fabricating method
US8294873B2 (en) 2004-11-11 2012-10-23 Nikon Corporation Exposure method, device manufacturing method, and substrate
US8319939B2 (en) 2004-07-07 2012-11-27 Asml Netherlands B.V. Immersion lithographic apparatus and device manufacturing method detecting residual liquid
US8325326B2 (en) 2004-06-07 2012-12-04 Nikon Corporation Stage unit, exposure apparatus, and exposure method
US8330939B2 (en) 2004-11-01 2012-12-11 Nikon Corporation Immersion exposure apparatus and device manufacturing method with a liquid recovery port provided on at least one of a first stage and second stage
US8368870B2 (en) 2004-06-21 2013-02-05 Nikon Corporation Exposure apparatus and device manufacturing method
US8373843B2 (en) 2004-06-10 2013-02-12 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US8411271B2 (en) 2005-12-28 2013-04-02 Nikon Corporation Pattern forming method, pattern forming apparatus, and device manufacturing method
US8477283B2 (en) 2006-05-10 2013-07-02 Nikon Corporation Exposure apparatus and device manufacturing method
US8482716B2 (en) 2004-06-10 2013-07-09 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US8488099B2 (en) 2004-04-19 2013-07-16 Nikon Corporation Exposure apparatus and device manufacturing method
US8508713B2 (en) 2004-06-10 2013-08-13 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US8520184B2 (en) 2004-06-09 2013-08-27 Nikon Corporation Immersion exposure apparatus and device manufacturing method with measuring device
JP2013191871A (en) * 2013-05-13 2013-09-26 Nikon Corp Cata-dioptric type projection optical system, exposure device, and exposure method
US20130271945A1 (en) 2004-02-06 2013-10-17 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US8570484B2 (en) 2006-08-30 2013-10-29 Nikon Corporation Immersion exposure apparatus, device manufacturing method, cleaning method, and cleaning member to remove foreign substance using liquid
US8629418B2 (en) * 2005-02-28 2014-01-14 Asml Netherlands B.V. Lithographic apparatus and sensor therefor
US8634053B2 (en) 2006-12-07 2014-01-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8638415B2 (en) 2004-05-18 2014-01-28 Asml Netherlands B.V. Active drying station and method to remove immersion liquid using gas flow supply with gas outlet between two gas inlets
US8638422B2 (en) 2005-03-18 2014-01-28 Nikon Corporation Exposure method, exposure apparatus, method for producing device, and method for evaluating exposure apparatus
US8654308B2 (en) 2004-07-12 2014-02-18 Nikon Corporation Method for determining exposure condition, exposure method, exposure apparatus, and method for manufacturing device
US8675174B2 (en) 2004-09-17 2014-03-18 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US8698998B2 (en) 2004-06-21 2014-04-15 Nikon Corporation Exposure apparatus, method for cleaning member thereof, maintenance method for exposure apparatus, maintenance device, and method for producing device
US8705008B2 (en) 2004-06-09 2014-04-22 Nikon Corporation Substrate holding unit, exposure apparatus having same, exposure method, method for producing device, and liquid repellant plate
US8717533B2 (en) 2004-06-10 2014-05-06 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US8721803B2 (en) 2006-12-05 2014-05-13 Nikon Corporation Cleaning liquid, cleaning method, liquid generating apparatus, exposure apparatus, and device fabricating method
US8780326B2 (en) 2005-09-09 2014-07-15 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US8797502B2 (en) 2003-09-29 2014-08-05 Nikon Corporation Exposure apparatus, exposure method, and method for producing device with electricity removal device by adding additive to liquid
JP2014160274A (en) * 2014-04-21 2014-09-04 Nikon Corp Projection optical system, exposure device, exposure method, and method of manufacturing the device
KR20140114461A (en) * 2004-06-10 2014-09-26 가부시키가이샤 니콘 Exposure apparatus, exposure method, and device producing method
JP2014194552A (en) * 2014-04-28 2014-10-09 Nikon Corp Cata-dioptric type projection optical system, exposure device, and exposure method
US8860922B2 (en) 2003-10-28 2014-10-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8859188B2 (en) 2005-02-10 2014-10-14 Asml Netherlands B.V. Immersion liquid, exposure apparatus, and exposure process
US8860923B2 (en) 2003-10-28 2014-10-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2014199461A (en) * 2004-07-14 2014-10-23 カール・ツァイス・エスエムティー・ゲーエムベーハー Catadioptric projection objective
US8891053B2 (en) 2008-09-10 2014-11-18 Asml Netherlands B.V. Lithographic apparatus, method of manufacturing an article for a lithographic apparatus and device manufacturing method
US8902401B2 (en) 2006-05-09 2014-12-02 Carl Zeiss Smt Gmbh Optical imaging device with thermal attenuation
US8908269B2 (en) 2004-01-14 2014-12-09 Carl Zeiss Smt Gmbh Immersion catadioptric projection objective having two intermediate images
KR101469405B1 (en) * 2003-04-10 2014-12-10 가부시키가이샤 니콘 Environmental system including vaccum scavange for an immersion lithography apparatus
US8913316B2 (en) 2004-05-17 2014-12-16 Carl Zeiss Smt Gmbh Catadioptric projection objective with intermediate images
US8928856B2 (en) 2003-10-31 2015-01-06 Nikon Corporation Exposure apparatus and device fabrication method
US8937704B2 (en) 2003-07-31 2015-01-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method involving a resistivity sensor
US8941811B2 (en) 2004-12-20 2015-01-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8947637B2 (en) 2003-08-29 2015-02-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8947629B2 (en) 2007-05-04 2015-02-03 Asml Netherlands B.V. Cleaning device, a lithographic apparatus and a lithographic apparatus cleaning method
US8964164B2 (en) 2003-05-13 2015-02-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8964163B2 (en) 2003-07-28 2015-02-24 Asml Netherlands B.V. Immersion lithographic apparatus and device manufacturing method with a projection system having a part movable relative to another part
US9013672B2 (en) 2007-05-04 2015-04-21 Asml Netherlands B.V. Cleaning device, a lithographic apparatus and a lithographic apparatus cleaning method
KR101529844B1 (en) * 2003-06-19 2015-06-17 가부시키가이샤 니콘 Exposure device and device producing method
US9081295B2 (en) 2003-05-06 2015-07-14 Nikon Corporation Catadioptric projection optical system, exposure apparatus, and exposure method
US9097992B2 (en) 2004-08-19 2015-08-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9110389B2 (en) 2003-06-11 2015-08-18 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9134622B2 (en) 2003-11-14 2015-09-15 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9207543B2 (en) 2004-04-14 2015-12-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method involving a groove to collect liquid
US9224632B2 (en) 2004-12-15 2015-12-29 Nikon Corporation Substrate holding apparatus, exposure apparatus, and device fabricating method
EP2960702A1 (en) * 2003-09-03 2015-12-30 Nikon Corporation Apparatus and method for providing fluid for immersion lithography
US9239524B2 (en) 2005-03-30 2016-01-19 Nikon Corporation Exposure condition determination method, exposure method, exposure apparatus, and device manufacturing method involving detection of the situation of a liquid immersion region
US9250537B2 (en) 2004-07-12 2016-02-02 Nikon Corporation Immersion exposure apparatus and method with detection of liquid on members of the apparatus
US9256136B2 (en) 2010-04-22 2016-02-09 Asml Netherlands B.V. Fluid handling structure, lithographic apparatus and device manufacturing method involving gas supply
US9329060B2 (en) 2006-02-21 2016-05-03 Nikon Corporation Measuring apparatus and method, processing apparatus and method, pattern forming apparatus and method, exposure apparatus and method, and device manufacturing method
JP2016075931A (en) * 2015-11-30 2016-05-12 株式会社ニコン Exposure equipment, exposure method, and device production method
US9341954B2 (en) 2007-10-24 2016-05-17 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US9377698B2 (en) 2006-09-01 2016-06-28 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and calibration method
US9423698B2 (en) 2003-10-28 2016-08-23 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9429495B2 (en) 2004-06-04 2016-08-30 Carl Zeiss Smt Gmbh System for measuring the image quality of an optical imaging system
US9436095B2 (en) 2004-01-20 2016-09-06 Carl Zeiss Smt Gmbh Exposure apparatus and measuring device for a projection lens
US9477158B2 (en) 2006-04-14 2016-10-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9482966B2 (en) 2002-11-12 2016-11-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9500943B2 (en) 2003-05-06 2016-11-22 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
US9500960B2 (en) 2003-04-11 2016-11-22 Nikon Corporation Apparatus and method for maintaining immersion fluid in the gap under the projection lens during wafer exchange in an immersion lithography machine
US9507270B2 (en) 2004-06-16 2016-11-29 Asml Netherlands B.V. Vacuum system for immersion photolithography
US9632425B2 (en) 2006-12-07 2017-04-25 Asml Holding N.V. Lithographic apparatus, a dryer and a method of removing liquid from a surface
US9632431B2 (en) 2004-02-02 2017-04-25 Nikon Corporation Lithographic apparatus and method having substrate and sensor tables
CN106707699A (en) * 2003-07-28 2017-05-24 株式会社尼康 Exposure apparatus and device producing method
US9678332B2 (en) 2007-11-06 2017-06-13 Nikon Corporation Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
US9678437B2 (en) 2003-04-09 2017-06-13 Nikon Corporation Illumination optical apparatus having distribution changing member to change light amount and polarization member to set polarization in circumference direction
US9690214B2 (en) 2006-02-21 2017-06-27 Nikon Corporation Pattern forming apparatus and pattern forming method, movable body drive system and movable body drive method, exposure apparatus and exposure method, and device manufacturing method
US9746781B2 (en) 2005-01-31 2017-08-29 Nikon Corporation Exposure apparatus and method for producing device
US9772478B2 (en) 2004-01-14 2017-09-26 Carl Zeiss Smt Gmbh Catadioptric projection objective with parallel, offset optical axes
US9798245B2 (en) 2003-12-15 2017-10-24 Nikon Corporation Exposure apparatus, and exposure method, with recovery device to recover liquid leaked from between substrate and member
US9857697B2 (en) 2006-02-21 2018-01-02 Nikon Corporation Pattern forming apparatus, mark detecting apparatus, exposure apparatus, pattern forming method, exposure method, and device manufacturing method
US9874822B2 (en) 2006-09-01 2018-01-23 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method
US9885872B2 (en) 2003-11-20 2018-02-06 Nikon Corporation Illumination optical apparatus, exposure apparatus, and exposure method with optical integrator and polarization member that changes polarization state of light
US9891539B2 (en) 2005-05-12 2018-02-13 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
US9933708B2 (en) 2003-05-23 2018-04-03 Nikon Corporation Exposure method, exposure apparatus, and method for producing device
US9939739B2 (en) 2003-05-23 2018-04-10 Nikon Corporation Exposure apparatus and method for producing device
US9958792B2 (en) 2006-08-31 2018-05-01 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method
US9958786B2 (en) 2003-04-11 2018-05-01 Nikon Corporation Cleanup method for optics in immersion lithography using object on wafer holder in place of wafer
JP2018077519A (en) * 2018-01-09 2018-05-17 株式会社ニコン Exposure apparatus, exposure method and method for manufacturing device
US9977352B2 (en) 2003-07-09 2018-05-22 Nikon Corporation Exposure apparatus and device manufacturing method
US10061207B2 (en) 2005-12-02 2018-08-28 Asml Netherlands B.V. Method for preventing or reducing contamination of an immersion type projection apparatus and an immersion type lithographic apparatus
US10067428B2 (en) 2006-08-31 2018-09-04 Nikon Corporation Movable body drive system and movable body drive method, pattern formation apparatus and method, exposure apparatus and method, device manufacturing method, and decision-making method
US10082739B2 (en) 2003-05-28 2018-09-25 Nikon Corporation Exposure method, exposure apparatus, and method for producing device
US10088760B2 (en) 2003-12-03 2018-10-02 Nikon Corporation Exposure apparatus, exposure method, method for producing device, and optical part
US10101666B2 (en) 2007-10-12 2018-10-16 Nikon Corporation Illumination optical apparatus, exposure apparatus, and device manufacturing method
US10126661B2 (en) 2004-03-25 2018-11-13 Nikon Corporation Exposure apparatus and device fabrication method
US10151983B2 (en) 2004-02-03 2018-12-11 Nikon Corporation Exposure apparatus and device manufacturing method
US10209623B2 (en) 2003-10-09 2019-02-19 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US10503084B2 (en) 2002-11-12 2019-12-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
USRE47943E1 (en) 2005-04-08 2020-04-14 Asml Netherlands B.V. Dual stage lithographic apparatus and device manufacturing method

Cited By (771)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9366972B2 (en) 2002-11-12 2016-06-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9740107B2 (en) 2002-11-12 2017-08-22 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7932999B2 (en) 2002-11-12 2011-04-26 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8344341B2 (en) 2002-11-12 2013-01-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7193232B2 (en) 2002-11-12 2007-03-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method with substrate measurement not through liquid
US7199858B2 (en) 2002-11-12 2007-04-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7224436B2 (en) 2002-11-12 2007-05-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9195153B2 (en) 2002-11-12 2015-11-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8558989B2 (en) 2002-11-12 2013-10-15 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10788755B2 (en) 2002-11-12 2020-09-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8472002B2 (en) 2002-11-12 2013-06-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10503084B2 (en) 2002-11-12 2019-12-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9885965B2 (en) 2002-11-12 2018-02-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7482611B2 (en) 2002-11-12 2009-01-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7110081B2 (en) 2002-11-12 2006-09-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9482966B2 (en) 2002-11-12 2016-11-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9091940B2 (en) 2002-11-12 2015-07-28 Asml Netherlands B.V. Lithographic apparatus and method involving a fluid inlet and a fluid outlet
US10261428B2 (en) 2002-11-12 2019-04-16 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10222706B2 (en) 2002-11-12 2019-03-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7081943B2 (en) 2002-11-12 2006-07-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US6952253B2 (en) 2002-11-12 2005-10-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7075616B2 (en) 2002-11-12 2006-07-11 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8446568B2 (en) 2002-11-12 2013-05-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10620545B2 (en) 2002-11-12 2020-04-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9057967B2 (en) 2002-11-12 2015-06-16 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10191389B2 (en) 2002-11-12 2019-01-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9588442B2 (en) 2002-11-12 2017-03-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9097987B2 (en) 2002-11-12 2015-08-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9360765B2 (en) 2002-11-12 2016-06-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2010135857A (en) * 2002-11-12 2010-06-17 Asml Netherlands Bv Lithography apparatus and method for fabricating device
US7795603B2 (en) 2002-11-12 2010-09-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7119881B2 (en) 2002-11-18 2006-10-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7009682B2 (en) 2002-11-18 2006-03-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7359030B2 (en) 2002-11-29 2008-04-15 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7876418B2 (en) 2002-12-10 2011-01-25 Nikon Corporation Optical element and projection exposure apparatus based on use of the optical element
US7446851B2 (en) 2002-12-10 2008-11-04 Nikon Corporation Exposure apparatus and device manufacturing method
US7379158B2 (en) 2002-12-10 2008-05-27 Nikon Corporation Exposure apparatus and method for producing device
WO2004053958A1 (en) * 2002-12-10 2004-06-24 Nikon Corporation Exposure apparatus and method for manufacturing device
US7460207B2 (en) 2002-12-10 2008-12-02 Nikon Corporation Exposure apparatus and method for producing device
US7639343B2 (en) 2002-12-10 2009-12-29 Nikon Corporation Exposure apparatus and device manufacturing method
US8767173B2 (en) 2002-12-10 2014-07-01 Nikon Corporation Optical element and projection exposure apparatus based on use of the optical element
JP2004207711A (en) * 2002-12-10 2004-07-22 Nikon Corp Exposure device, exposure method, and device manufacturing method
JP4529433B2 (en) * 2002-12-10 2010-08-25 株式会社ニコン Exposure apparatus, exposure method, and device manufacturing method
JP4596076B2 (en) * 2002-12-10 2010-12-08 株式会社ニコン Exposure apparatus, exposure method, and device manufacturing method
US7466392B2 (en) 2002-12-10 2008-12-16 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US7436486B2 (en) 2002-12-10 2008-10-14 Nikon Corporation Exposure apparatus and device manufacturing method
US7589820B2 (en) 2002-12-10 2009-09-15 Nikon Corporation Exposure apparatus and method for producing device
US8237915B2 (en) 2002-12-10 2012-08-07 Carl Zeiss Smt Gmbh Method for improving an optical imaging property of a projection objective of a microlithographic projection exposure apparatus
JP2009105471A (en) * 2002-12-10 2009-05-14 Nikon Corp Exposure apparatus and method of manufacturing device
JP4595320B2 (en) * 2002-12-10 2010-12-08 株式会社ニコン Exposure apparatus and device manufacturing method
JP4596077B2 (en) * 2002-12-10 2010-12-08 株式会社ニコン Vacuum system, immersion exposure apparatus and exposure method, and device manufacturing method
US7505111B2 (en) 2002-12-10 2009-03-17 Nikon Corporation Exposure apparatus and device manufacturing method
US7436487B2 (en) 2002-12-10 2008-10-14 Nikon Corporation Exposure apparatus and method for producing device
WO2004053956A1 (en) * 2002-12-10 2004-06-24 Nikon Corporation Exposure apparatus, exposure method and method for manufacturing device
JP2009105472A (en) * 2002-12-10 2009-05-14 Nikon Corp Vacuum system, immersion exposure device and method for exposure, and method for manufacturing device
WO2004053954A1 (en) * 2002-12-10 2004-06-24 Nikon Corporation Exposure apparatus and method for manufacturing device
US7515246B2 (en) 2002-12-10 2009-04-07 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US7948604B2 (en) 2002-12-10 2011-05-24 Nikon Corporation Exposure apparatus and method for producing device
WO2004053955A1 (en) * 2002-12-10 2004-06-24 Nikon Corporation Exposure system and device producing method
WO2004053957A1 (en) * 2002-12-10 2004-06-24 Nikon Corporation Surface position detection apparatus, exposure method, and device porducing method
WO2004053953A1 (en) * 2002-12-10 2004-06-24 Nikon Corporation Exposure apparatus and method for manufacturing device
WO2004053959A1 (en) * 2002-12-10 2004-06-24 Nikon Corporation Optical device and projection exposure apparatus using such optical device
US7589821B2 (en) 2002-12-10 2009-09-15 Nikon Corporation Exposure apparatus and device manufacturing method
JP2005101488A (en) * 2002-12-10 2005-04-14 Nikon Corp Aligner, exposure method, and manufacturing method of device
KR100971440B1 (en) 2002-12-19 2010-07-21 코닌클리케 필립스 일렉트로닉스 엔.브이. Method and device for irradiating spots on a layer
USRE46433E1 (en) 2002-12-19 2017-06-13 Asml Netherlands B.V. Method and device for irradiating spots on a layer
US7408652B2 (en) 2002-12-20 2008-08-05 Carl Zeiss Smt Ag Device and method for the optical measurement of an optical system by using an immersion fluid
US7501220B2 (en) * 2003-01-31 2009-03-10 Tokyo Ohka Kogyo Co., Ltd. Resist composition
US8198004B2 (en) 2003-01-31 2012-06-12 Tokyo Ohka Kogyo Co., Ltd. Resist composition
US7541138B2 (en) 2003-01-31 2009-06-02 Tokyo Ohka Kogyo Co., Ltd. Resist composition
US7527909B2 (en) 2003-01-31 2009-05-05 Tokyo Ohka Kogyo Co., Ltd. Resist composition
KR101442361B1 (en) * 2003-02-26 2014-09-23 가부시키가이샤 니콘 Exposure apparatus and method, and method of producing apparatus
US7542128B2 (en) 2003-02-26 2009-06-02 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
JP2011023765A (en) * 2003-02-26 2011-02-03 Nikon Corp Exposure apparatus, exposure method, and method of producing device
US7268854B2 (en) 2003-02-26 2007-09-11 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
JP2009147386A (en) * 2003-02-26 2009-07-02 Nikon Corp Exposure apparatus and method of producing device
JP2017068287A (en) * 2003-02-26 2017-04-06 株式会社ニコン Exposure apparatus, exposure method, and method for producing device
US10180632B2 (en) 2003-02-26 2019-01-15 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US9766555B2 (en) 2003-02-26 2017-09-19 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
KR101169288B1 (en) 2003-02-26 2012-08-02 가부시키가이샤 니콘 Exposure apparatus and method, and method of manufacturing device
CN106873316A (en) * 2003-02-26 2017-06-20 株式会社尼康 Exposure device, exposure method and device making method
US7453550B2 (en) 2003-02-26 2008-11-18 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
CN100433253C (en) * 2003-02-26 2008-11-12 株式会社尼康 Exposure apparatus, exposure method, and method for producing device
JP2016075963A (en) * 2003-02-26 2016-05-12 株式会社ニコン Exposure apparatus, exposure method, and method for producing device
KR101562447B1 (en) 2003-02-26 2015-10-21 가부시키가이샤 니콘 Exposure apparatus and method, and method of producing apparatus
KR101288767B1 (en) 2003-02-26 2013-07-23 가부시키가이샤 니콘 Exposure apparatus and method, and method of producing apparatus
KR101875296B1 (en) 2003-02-26 2018-07-05 가부시키가이샤 니콘 Exposure apparatus and method, and method of producing apparatus
JP4640516B2 (en) * 2003-02-26 2011-03-02 株式会社ニコン Exposure apparatus and device manufacturing method
KR101643112B1 (en) 2003-02-26 2016-07-26 가부시키가이샤 니콘 Exposure apparatus and method, and method of producing apparatus
JP2015121825A (en) * 2003-02-26 2015-07-02 株式会社ニコン Exposure equipment, exposure method, and device manufacturing method
KR101563453B1 (en) 2003-02-26 2015-10-26 가부시키가이샤 니콘 Exposure apparatus and method, and method of producing apparatus
JP2018106206A (en) * 2003-02-26 2018-07-05 株式会社ニコン Exposure apparatus, exposure method, and method for producing device
JP2012129565A (en) * 2003-02-26 2012-07-05 Nikon Corp Exposure equipment, exposure method, and device manufacturing method
KR20150052334A (en) * 2003-02-26 2015-05-13 가부시키가이샤 니콘 Exposure apparatus and method, and method of producing apparatus
CN102495540A (en) * 2003-02-26 2012-06-13 株式会社尼康 Exposure apparatus, exposure method, and method for producing device
US7535550B2 (en) 2003-02-26 2009-05-19 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
JP2009302596A (en) * 2003-02-26 2009-12-24 Nikon Corp Exposure apparatus, exposure method, and method for manufacturing device
JP2010028127A (en) * 2003-02-26 2010-02-04 Nikon Corp Exposure apparatus, exposure method and device manufacturing method
WO2004086468A1 (en) * 2003-02-26 2004-10-07 Nikon Corporation Exposure apparatus and method, and method of producing apparatus
JP2014112741A (en) * 2003-02-26 2014-06-19 Nikon Corp Exposure equipment, exposure method, and device manufacturing method
JP2012080148A (en) * 2003-03-25 2012-04-19 Nikon Corp Exposure apparatus, and device manufacturing method
WO2004086470A1 (en) * 2003-03-25 2004-10-07 Nikon Corporation Exposure system and device production method
JP2009158977A (en) * 2003-03-25 2009-07-16 Nikon Corp Exposure apparatus and device fabrication method
JP2014030061A (en) * 2003-03-25 2014-02-13 Nikon Corp Exposure apparatus, and device manufacturing method
JP2011044736A (en) * 2003-03-25 2011-03-03 Nikon Corp Exposure apparatus, and device manufacturing method
US9885959B2 (en) 2003-04-09 2018-02-06 Nikon Corporation Illumination optical apparatus having deflecting member, lens, polarization member to set polarization in circumference direction, and optical integrator
US9618852B2 (en) 2003-04-09 2017-04-11 Nikon Corporation Immersion lithography fluid control system regulating flow velocity of gas based on position of gas outlets
US7339650B2 (en) 2003-04-09 2008-03-04 Nikon Corporation Immersion lithography fluid control system that applies force to confine the immersion liquid
US9678437B2 (en) 2003-04-09 2017-06-13 Nikon Corporation Illumination optical apparatus having distribution changing member to change light amount and polarization member to set polarization in circumference direction
US9632427B2 (en) 2003-04-10 2017-04-25 Nikon Corporation Environmental system including a transport region for an immersion lithography apparatus
US9910370B2 (en) 2003-04-10 2018-03-06 Nikon Corporation Environmental system including a transport region for an immersion lithography apparatus
US7397532B2 (en) 2003-04-10 2008-07-08 Nikon Corporation Run-off path to collect liquid for an immersion lithography apparatus
US9977350B2 (en) 2003-04-10 2018-05-22 Nikon Corporation Environmental system including vacuum scavenge for an immersion lithography apparatus
US7345742B2 (en) 2003-04-10 2008-03-18 Nikon Corporation Environmental system including a transport region for an immersion lithography apparatus
KR101469405B1 (en) * 2003-04-10 2014-12-10 가부시키가이샤 니콘 Environmental system including vaccum scavange for an immersion lithography apparatus
US9658537B2 (en) 2003-04-10 2017-05-23 Nikon Corporation Environmental system including vacuum scavenge for an immersion lithography apparatus
US10185222B2 (en) 2003-04-11 2019-01-22 Nikon Corporation Liquid jet and recovery system for immersion lithography
US9500960B2 (en) 2003-04-11 2016-11-22 Nikon Corporation Apparatus and method for maintaining immersion fluid in the gap under the projection lens during wafer exchange in an immersion lithography machine
US7443482B2 (en) 2003-04-11 2008-10-28 Nikon Corporation Liquid jet and recovery system for immersion lithography
US9958786B2 (en) 2003-04-11 2018-05-01 Nikon Corporation Cleanup method for optics in immersion lithography using object on wafer holder in place of wafer
US9785057B2 (en) 2003-04-11 2017-10-10 Nikon Corporation Liquid jet and recovery system for immersion lithography
US9946163B2 (en) 2003-04-11 2018-04-17 Nikon Corporation Apparatus and method for maintaining immersion fluid in the gap under the projection lens during wafer exchange in an immersion lithography machine
US9933705B2 (en) 2003-05-06 2018-04-03 Nikon Corporation Reduction projection optical system, exposure apparatus, and exposure method
US9081295B2 (en) 2003-05-06 2015-07-14 Nikon Corporation Catadioptric projection optical system, exposure apparatus, and exposure method
US9846366B2 (en) 2003-05-06 2017-12-19 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
US9086635B2 (en) 2003-05-06 2015-07-21 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
US10156792B2 (en) 2003-05-06 2018-12-18 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
US9500943B2 (en) 2003-05-06 2016-11-22 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
US9606443B2 (en) 2003-05-06 2017-03-28 Nikon Corporation Reducing immersion projection optical system
US9477160B2 (en) 2003-05-13 2016-10-25 Asml Netherland B.V. Lithographic apparatus and device manufacturing method
US9798246B2 (en) 2003-05-13 2017-10-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10466595B2 (en) 2003-05-13 2019-11-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8964164B2 (en) 2003-05-13 2015-02-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9977336B2 (en) 2003-05-23 2018-05-22 Nikon Corporation Exposure method, exposure apparatus, and method for producing device
US9939739B2 (en) 2003-05-23 2018-04-10 Nikon Corporation Exposure apparatus and method for producing device
US9933708B2 (en) 2003-05-23 2018-04-03 Nikon Corporation Exposure method, exposure apparatus, and method for producing device
US10082739B2 (en) 2003-05-28 2018-09-25 Nikon Corporation Exposure method, exposure apparatus, and method for producing device
US7804574B2 (en) 2003-05-30 2010-09-28 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method using acidic liquid
US7808611B2 (en) 2003-05-30 2010-10-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method using acidic liquid
US7532306B2 (en) 2003-05-30 2009-05-12 Carl Zeiss Smt Ag Microlithographic projection exposure apparatus
US7570343B2 (en) 2003-05-30 2009-08-04 Carl Zeis Smt Ag Microlithographic projection exposure apparatus
US9081299B2 (en) 2003-06-09 2015-07-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method involving removal of liquid entering a gap
US9541843B2 (en) 2003-06-09 2017-01-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method involving a sensor detecting a radiation beam through liquid
US10180629B2 (en) 2003-06-09 2019-01-15 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7213963B2 (en) 2003-06-09 2007-05-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9152058B2 (en) 2003-06-09 2015-10-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method involving a member and a fluid opening
US10678139B2 (en) 2003-06-09 2020-06-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9110389B2 (en) 2003-06-11 2015-08-18 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9964858B2 (en) 2003-06-11 2018-05-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2004112108A1 (en) * 2003-06-13 2004-12-23 Nikon Corporation Exposure method, substrate stage, exposure apparatus and method for manufacturing device
JP2010010703A (en) * 2003-06-13 2010-01-14 Nikon Corp Substrate stage, exposure device, and device manufacturing method
TWI607292B (en) * 2003-06-13 2017-12-01 Nikon Corp Exposure device, exposure method, and device manufacturing method
JP2010161381A (en) * 2003-06-13 2010-07-22 Nikon Corp Photolithography method, substrate stage, photolithography machine, and method of manufacturing device
US9846371B2 (en) 2003-06-13 2017-12-19 Nikon Corporation Exposure method, substrate stage, exposure apparatus, and device manufacturing method
JP2013016839A (en) * 2003-06-13 2013-01-24 Nikon Corp Substrate stage, exposure device, and device manufacturing method
JP2012248892A (en) * 2003-06-13 2012-12-13 Nikon Corp Substrate stage, exposure device, and device manufacturing method
US9715178B2 (en) 2003-06-19 2017-07-25 Asml Holding N.V. Immersion photolithography system and method using microchannel nozzles
KR101529844B1 (en) * 2003-06-19 2015-06-17 가부시키가이샤 니콘 Exposure device and device producing method
KR100609795B1 (en) 2003-06-19 2006-08-08 에이에스엠엘 홀딩 엔.브이. Immersion photolithography system and method using microchannel nozzles
US10191388B2 (en) 2003-06-19 2019-01-29 Nikon Corporation Exposure apparatus, and device manufacturing method
US9709899B2 (en) 2003-06-19 2017-07-18 Asml Holding N.V. Immersion photolithography system and method using microchannel nozzles
JP2017227915A (en) * 2003-06-19 2017-12-28 株式会社ニコン Exposure device, exposure method and device production method
US10007188B2 (en) 2003-06-19 2018-06-26 Nikon Corporation Exposure apparatus and device manufacturing method
US8004649B2 (en) 2003-06-19 2011-08-23 Asml Holding N.V. Immersion photolithography system and method using microchannel nozzles
US9810995B2 (en) 2003-06-19 2017-11-07 Nikon Corporation Exposure apparatus and device manufacturing method
US7411650B2 (en) 2003-06-19 2008-08-12 Asml Holding N.V. Immersion photolithography system and method using microchannel nozzles
USRE42741E1 (en) 2003-06-27 2011-09-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7012673B2 (en) 2003-06-27 2006-03-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7119874B2 (en) 2003-06-27 2006-10-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7898643B2 (en) 2003-06-27 2011-03-01 Asml Holding N.V. Immersion photolithography system and method using inverted wafer-projection optics interface
US7110087B2 (en) 2003-06-30 2006-09-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7038760B2 (en) 2003-06-30 2006-05-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7433019B2 (en) 2003-07-09 2008-10-07 Nikon Corporation Exposure apparatus and device manufacturing method
US9977352B2 (en) 2003-07-09 2018-05-22 Nikon Corporation Exposure apparatus and device manufacturing method
US10151989B2 (en) 2003-07-16 2018-12-11 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9383655B2 (en) 2003-07-16 2016-07-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8823920B2 (en) 2003-07-16 2014-09-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10656538B2 (en) 2003-07-16 2020-05-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8913223B2 (en) 2003-07-16 2014-12-16 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8711323B2 (en) 2003-07-16 2014-04-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7738074B2 (en) 2003-07-16 2010-06-15 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9733575B2 (en) 2003-07-16 2017-08-15 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7184122B2 (en) 2003-07-24 2007-02-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8711333B2 (en) 2003-07-24 2014-04-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9594308B2 (en) 2003-07-24 2017-03-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7557901B2 (en) 2003-07-24 2009-07-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9804509B2 (en) 2003-07-24 2017-10-31 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10444644B2 (en) 2003-07-24 2019-10-15 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10146143B2 (en) 2003-07-24 2018-12-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9213247B2 (en) 2003-07-24 2015-12-15 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
CN106707699A (en) * 2003-07-28 2017-05-24 株式会社尼康 Exposure apparatus and device producing method
JP2010118690A (en) * 2003-07-28 2010-05-27 Nikon Corp Exposure apparatus, method for manufacturing device, and method for controlling exposure apparatus
KR101403117B1 (en) 2003-07-28 2014-06-03 가부시키가이샤 니콘 Exposure apparatus, device producing method, and exposure apparatus controlling method
JP2005268742A (en) * 2003-07-28 2005-09-29 Nikon Corp Exposure device and device manufacturing method, and controlling method of its exposure device
JP2010109393A (en) * 2003-07-28 2010-05-13 Nikon Corp Exposure apparatus, method for manufacturing device, and method for controlling exposure apparatus
WO2005010962A1 (en) * 2003-07-28 2005-02-03 Nikon Corporation Exposure apparatus, device producing method, and exposure apparatus controlling method
JP4492600B2 (en) * 2003-07-28 2010-06-30 株式会社ニコン Exposure apparatus, exposure method, and device manufacturing method
US8964163B2 (en) 2003-07-28 2015-02-24 Asml Netherlands B.V. Immersion lithographic apparatus and device manufacturing method with a projection system having a part movable relative to another part
JP4492239B2 (en) * 2003-07-28 2010-06-30 株式会社ニコン Exposure apparatus, device manufacturing method, and exposure apparatus control method
JP2007005830A (en) * 2003-07-28 2007-01-11 Nikon Corp Exposure system, exposure method, and method for manufacturing device
CN104122760B (en) * 2003-07-28 2017-04-19 株式会社尼康 Exposure apparatus and device producing method
JP2010109392A (en) * 2003-07-28 2010-05-13 Nikon Corp Exposure apparatus, and method for manufacturing device
US10185232B2 (en) 2003-07-28 2019-01-22 Nikon Corporation Exposure apparatus, method for producing device, and method for controlling exposure apparatus
US9639006B2 (en) 2003-07-28 2017-05-02 Asml Netherlands B.V. Lithographic projection apparatus and device manufacturing method
US10303066B2 (en) 2003-07-28 2019-05-28 Asml Netherlands B.V. Lithographic projection apparatus and device manufacturing method
CN104122760A (en) * 2003-07-28 2014-10-29 株式会社尼康 Exposure apparatus and device producing method
JP2010118689A (en) * 2003-07-28 2010-05-27 Nikon Corp Exposure apparatus, method for manufacturing device, and method for controlling exposure apparatus
TWI633581B (en) * 2003-07-28 2018-08-21 尼康股份有限公司 Exposure apparatus and exposure method, and component manufacturing method
JP2012151493A (en) * 2003-07-28 2012-08-09 Nikon Corp Exposure apparatus, method for manufacturing device, and method for controlling exposure apparatus
US7175968B2 (en) 2003-07-28 2007-02-13 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and a substrate
US9760026B2 (en) 2003-07-28 2017-09-12 Nikon Corporation Exposure apparatus, method for producing device, and method for controlling exposure apparatus
US9285686B2 (en) 2003-07-31 2016-03-15 Asml Netherlands B.V. Lithographic apparatus involving an immersion liquid supply system with an aperture
US8937704B2 (en) 2003-07-31 2015-01-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method involving a resistivity sensor
JP2018049295A (en) * 2003-08-21 2018-03-29 株式会社ニコン Exposure apparatus, and method of manufacturing device
US10209622B2 (en) 2003-08-21 2019-02-19 Nikon Corporation Exposure method and device manufacturing method having lower scanning speed to expose peripheral shot area
US10203608B2 (en) 2003-08-21 2019-02-12 Nikon Corporation Exposure apparatus and device manufacturing method having lower scanning speed to expose peripheral shot area
US8064037B2 (en) 2003-08-21 2011-11-22 Nikon Corporation Immersion exposure apparatus and device manufacturing method with no liquid recovery during exposure
US7697111B2 (en) 2003-08-26 2010-04-13 Nikon Corporation Optical element and exposure apparatus
US10175584B2 (en) 2003-08-26 2019-01-08 Nikon Corporation Optical element and exposure apparatus
US9316919B2 (en) 2003-08-29 2016-04-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8953144B2 (en) 2003-08-29 2015-02-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7733459B2 (en) 2003-08-29 2010-06-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9581914B2 (en) 2003-08-29 2017-02-28 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10025204B2 (en) 2003-08-29 2018-07-17 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9442388B2 (en) 2003-08-29 2016-09-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8947637B2 (en) 2003-08-29 2015-02-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9025127B2 (en) 2003-08-29 2015-05-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9606448B2 (en) 2003-08-29 2017-03-28 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10146142B2 (en) 2003-08-29 2018-12-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8804097B2 (en) 2003-08-29 2014-08-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8208123B2 (en) 2003-08-29 2012-06-26 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8208124B2 (en) 2003-08-29 2012-06-26 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9568841B2 (en) 2003-08-29 2017-02-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10514618B2 (en) 2003-08-29 2019-12-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8253921B2 (en) 2003-09-03 2012-08-28 Nikon Corporation Exposure apparatus and device fabricating method
KR101748923B1 (en) 2003-09-03 2017-06-19 가부시키가이샤 니콘 Apparatus and method for providing fluid for immersion lithography
US10203610B2 (en) 2003-09-03 2019-02-12 Nikon Corporation Apparatus and method for providing fluid for immersion lithography
US9817319B2 (en) 2003-09-03 2017-11-14 Nikon Corporation Apparatus and method for providing fluid for immersion lithography
EP2960702A1 (en) * 2003-09-03 2015-12-30 Nikon Corporation Apparatus and method for providing fluid for immersion lithography
US8724076B2 (en) 2003-09-26 2014-05-13 Nikon Corporation Projection exposure apparatus, cleaning and maintenance methods of a projection exposure apparatus, and device manufacturing method
US8035797B2 (en) 2003-09-26 2011-10-11 Nikon Corporation Projection exposure apparatus, cleaning and maintenance methods of a projection exposure apparatus, and device manufacturing method
KR101323396B1 (en) 2003-09-29 2013-10-29 가부시키가이샤 니콘 Exposure apparatus, exposure method, and device manufacturing method
WO2005031799A2 (en) 2003-09-29 2005-04-07 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US8400615B2 (en) 2003-09-29 2013-03-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7193681B2 (en) 2003-09-29 2007-03-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7817245B2 (en) 2003-09-29 2010-10-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2010098328A (en) * 2003-09-29 2010-04-30 Nikon Corp Exposure apparatus, method for exposure, and method for manufacturing device
US8797502B2 (en) 2003-09-29 2014-08-05 Nikon Corporation Exposure apparatus, exposure method, and method for producing device with electricity removal device by adding additive to liquid
EP1670043A2 (en) * 2003-09-29 2006-06-14 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US10025194B2 (en) 2003-09-29 2018-07-17 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
EP3093711A3 (en) * 2003-09-29 2017-05-24 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
EP1670043A4 (en) * 2003-09-29 2008-07-30 Nikon Corp Exposure apparatus, exposure method, and device manufacturing method
EP2837969A1 (en) * 2003-09-29 2015-02-18 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US7158211B2 (en) 2003-09-29 2007-01-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
TWI610342B (en) * 2003-09-29 2018-01-01 Exposure apparatus and exposure method, and component manufacturing method
EP3093710A3 (en) * 2003-09-29 2016-12-21 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US10209623B2 (en) 2003-10-09 2019-02-19 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US9285685B2 (en) 2003-10-15 2016-03-15 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8174674B2 (en) 2003-10-15 2012-05-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8570486B2 (en) 2003-10-15 2013-10-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7961293B2 (en) 2003-10-15 2011-06-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8711330B2 (en) 2003-10-15 2014-04-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7433015B2 (en) 2003-10-15 2008-10-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7352435B2 (en) 2003-10-15 2008-04-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9182679B2 (en) 2003-10-28 2015-11-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10527955B2 (en) 2003-10-28 2020-01-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7932996B2 (en) 2003-10-28 2011-04-26 Nikon Corporation Exposure apparatus, exposure method, and device fabrication method
US9423698B2 (en) 2003-10-28 2016-08-23 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US8860922B2 (en) 2003-10-28 2014-10-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8860923B2 (en) 2003-10-28 2014-10-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8797506B2 (en) 2003-10-28 2014-08-05 Nikon Corporation Exposure apparatus, exposure method, and device fabrication method
US9482962B2 (en) 2003-10-28 2016-11-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10248034B2 (en) 2003-10-28 2019-04-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9760014B2 (en) 2003-10-28 2017-09-12 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US8272544B2 (en) 2003-10-28 2012-09-25 Nikon Corporation Exposure apparatus, exposure method, and device fabrication method
US9563133B2 (en) 2003-10-31 2017-02-07 Nikon Corporation Exposure apparatus and device fabrication method
US8928856B2 (en) 2003-10-31 2015-01-06 Nikon Corporation Exposure apparatus and device fabrication method
US9829801B2 (en) 2003-10-31 2017-11-28 Nikon Corporation Exposure apparatus and device fabrication method
US10048597B2 (en) 2003-10-31 2018-08-14 Nikon Corporation Exposure apparatus and device fabrication method
US9134623B2 (en) 2003-11-14 2015-09-15 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9952515B2 (en) 2003-11-14 2018-04-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9134622B2 (en) 2003-11-14 2015-09-15 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10345712B2 (en) 2003-11-14 2019-07-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9885872B2 (en) 2003-11-20 2018-02-06 Nikon Corporation Illumination optical apparatus, exposure apparatus, and exposure method with optical integrator and polarization member that changes polarization state of light
US10281632B2 (en) 2003-11-20 2019-05-07 Nikon Corporation Illumination optical apparatus, exposure apparatus, and exposure method with optical member with optical rotatory power to rotate linear polarization direction
US7545481B2 (en) 2003-11-24 2009-06-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8472006B2 (en) 2003-11-24 2013-06-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10088760B2 (en) 2003-12-03 2018-10-02 Nikon Corporation Exposure apparatus, exposure method, method for producing device, and optical part
US7428105B2 (en) 2003-12-15 2008-09-23 Carl Zeiss Smt Ag Objectives as a microlithography projection objective with at least one liquid lens
US7385764B2 (en) 2003-12-15 2008-06-10 Carl Zeiss Smt Ag Objectives as a microlithography projection objective with at least one liquid lens
US9798245B2 (en) 2003-12-15 2017-10-24 Nikon Corporation Exposure apparatus, and exposure method, with recovery device to recover liquid leaked from between substrate and member
JP2007516613A (en) * 2003-12-15 2007-06-21 カール・ツアイス・エスエムテイ・アーゲー Objective lens as a microlithographic projection objective comprising at least one liquid lens
US7474469B2 (en) 2003-12-15 2009-01-06 Carl Zeiss Smt Ag Arrangement of optical elements in a microlithographic projection exposure apparatus
US9684250B2 (en) 2003-12-23 2017-06-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8767171B2 (en) 2003-12-23 2014-07-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20090296061A1 (en) * 2003-12-23 2009-12-03 Asml Netherlands B.V. Lithographic apparatus, alignment apparatus, device manufacturing method, and a method of converting an apparatus
US9465301B2 (en) 2003-12-23 2016-10-11 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9817321B2 (en) 2003-12-23 2017-11-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2011009753A (en) * 2003-12-23 2011-01-13 Asml Netherlands Bv Alignment apparatus
JP2008219017A (en) * 2003-12-23 2008-09-18 Asml Netherlands Bv Lithographic apparatus, alignment apparatus, device manufacturing method, aligning method, and method of converting apparatus
US10768538B2 (en) 2003-12-23 2020-09-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7589818B2 (en) 2003-12-23 2009-09-15 Asml Netherlands B.V. Lithographic apparatus, alignment apparatus, device manufacturing method, and a method of converting an apparatus
US10613447B2 (en) 2003-12-23 2020-04-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8064044B2 (en) 2004-01-05 2011-11-22 Nikon Corporation Exposure apparatus, exposure method, and device producing method
US9588436B2 (en) 2004-01-05 2017-03-07 Nikon Corporation Exposure apparatus, exposure method, and device producing method
US9910369B2 (en) 2004-01-05 2018-03-06 Nikon Corporation Exposure apparatus, exposure method, and device producing method
US9772478B2 (en) 2004-01-14 2017-09-26 Carl Zeiss Smt Gmbh Catadioptric projection objective with parallel, offset optical axes
US8908269B2 (en) 2004-01-14 2014-12-09 Carl Zeiss Smt Gmbh Immersion catadioptric projection objective having two intermediate images
US9436095B2 (en) 2004-01-20 2016-09-06 Carl Zeiss Smt Gmbh Exposure apparatus and measuring device for a projection lens
US10345710B2 (en) 2004-01-20 2019-07-09 Carl Zeiss Smt Gmbh Microlithographic projection exposure apparatus and measuring device for a projection lens
US8330934B2 (en) 2004-01-26 2012-12-11 Nikon Corporation Exposure apparatus and device manufacturing method
US7697110B2 (en) 2004-01-26 2010-04-13 Nikon Corporation Exposure apparatus and device manufacturing method
US10007196B2 (en) 2004-02-02 2018-06-26 Nikon Corporation Lithographic apparatus and method having substrate and sensor tables
US9684248B2 (en) 2004-02-02 2017-06-20 Nikon Corporation Lithographic apparatus having substrate table and sensor table to measure a patterned beam
US9665016B2 (en) 2004-02-02 2017-05-30 Nikon Corporation Lithographic apparatus and method having substrate table and sensor table to hold immersion liquid
US9632431B2 (en) 2004-02-02 2017-04-25 Nikon Corporation Lithographic apparatus and method having substrate and sensor tables
US10139737B2 (en) 2004-02-02 2018-11-27 Nikon Corporation Lithographic apparatus and method having substrate and sensor tables
US10151983B2 (en) 2004-02-03 2018-12-11 Nikon Corporation Exposure apparatus and device manufacturing method
JP2007520893A (en) * 2004-02-03 2007-07-26 ロチェスター インスティテュート オブ テクノロジー Photolithographic method and system using fluid
US8208119B2 (en) 2004-02-04 2012-06-26 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US10048602B2 (en) 2004-02-04 2018-08-14 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US8605252B2 (en) 2004-02-04 2013-12-10 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US20130271945A1 (en) 2004-02-06 2013-10-17 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US10234770B2 (en) 2004-02-06 2019-03-19 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US10241417B2 (en) 2004-02-06 2019-03-26 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US10007194B2 (en) 2004-02-06 2018-06-26 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
JP4529141B2 (en) * 2004-02-09 2010-08-25 好彦 岡本 Exposure apparatus and method of manufacturing semiconductor device using the same
WO2005076322A1 (en) * 2004-02-09 2005-08-18 Yoshihiko Okamoto Aligner and semiconductor device manufacturing method using the aligner
JPWO2005076322A1 (en) * 2004-02-09 2008-02-21 好彦 岡本 Exposure apparatus and method of manufacturing semiconductor device using the same
JP2010153922A (en) * 2004-02-09 2010-07-08 Yoshihiko Okamoto Method of manufacturing semiconductor device
US7050146B2 (en) 2004-02-09 2006-05-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JPWO2005076323A1 (en) * 2004-02-10 2007-10-18 株式会社ニコン Exposure apparatus, device manufacturing method, maintenance method, and exposure method
JP4548341B2 (en) * 2004-02-10 2010-09-22 株式会社ニコン Exposure apparatus, device manufacturing method, maintenance method, and exposure method
US7557900B2 (en) 2004-02-10 2009-07-07 Nikon Corporation Exposure apparatus, device manufacturing method, maintenance method, and exposure method
WO2005076323A1 (en) * 2004-02-10 2005-08-18 Nikon Corporation Aligner, device manufacturing method, maintenance method and aligning method
US8115902B2 (en) 2004-02-10 2012-02-14 Nikon Corporation Exposure apparatus, device manufacturing method, maintenance method, and exposure method
US7719658B2 (en) 2004-02-13 2010-05-18 Carl Zeiss Smt Ag Imaging system for a microlithographical projection light system
JP2007522508A (en) * 2004-02-13 2007-08-09 カール・ツアイス・エスエムテイ・アーゲー Projection objective for a microlithographic projection exposure apparatus
WO2005081067A1 (en) 2004-02-13 2005-09-01 Carl Zeiss Smt Ag Projection objective for a microlithographic projection exposure apparatus
WO2005078777A1 (en) * 2004-02-18 2005-08-25 Nikon Corporation Drive method, exposure method, exposure device, and device manufacturing method
WO2005081295A1 (en) * 2004-02-20 2005-09-01 Nikon Corporation Exposure method, exposure apparatus, exposure system and method for manufacturing device
US8023100B2 (en) 2004-02-20 2011-09-20 Nikon Corporation Exposure apparatus, supply method and recovery method, exposure method, and device producing method
JP4974049B2 (en) * 2004-02-20 2012-07-11 株式会社ニコン Exposure method, exposure apparatus, and device manufacturing method
TWI471900B (en) * 2004-02-20 2015-02-01 尼康股份有限公司 Exposure method, exposure apparatus, exposure system, and device manufacturing method
US7524618B2 (en) 2004-03-24 2009-04-28 Kabushiki Kaisha Toshiba Resist pattern forming method, semiconductor apparatus using said method, and exposure apparatus thereof
US7821616B2 (en) 2004-03-24 2010-10-26 Kabushiki Kaisha Toshiba Resist pattern forming method, semiconductor apparatus using said method, and exposure apparatus thereof
US10048593B2 (en) 2004-03-24 2018-08-14 Toshiba Memory Corporation Resist pattern forming method, semiconductor apparatus using said method, and exposure apparatus thereof
US10126661B2 (en) 2004-03-25 2018-11-13 Nikon Corporation Exposure apparatus and device fabrication method
US7034917B2 (en) 2004-04-01 2006-04-25 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufactured thereby
US7227619B2 (en) 2004-04-01 2007-06-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7295283B2 (en) 2004-04-02 2007-11-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10234768B2 (en) 2004-04-14 2019-03-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10705432B2 (en) 2004-04-14 2020-07-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9207543B2 (en) 2004-04-14 2015-12-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method involving a groove to collect liquid
US9989861B2 (en) 2004-04-14 2018-06-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9568840B2 (en) 2004-04-14 2017-02-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9829799B2 (en) 2004-04-14 2017-11-28 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8488099B2 (en) 2004-04-19 2013-07-16 Nikon Corporation Exposure apparatus and device manufacturing method
US9599907B2 (en) 2004-04-19 2017-03-21 Nikon Corporation Exposure apparatus and device manufacturing method
WO2005106930A1 (en) * 2004-04-27 2005-11-10 Nikon Corporation Exposure method, exposure system, and method for fabricating device
US7652751B2 (en) 2004-05-03 2010-01-26 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7379159B2 (en) 2004-05-03 2008-05-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9726979B2 (en) 2004-05-17 2017-08-08 Carl Zeiss Smt Gmbh Catadioptric projection objective with intermediate images
US9134618B2 (en) 2004-05-17 2015-09-15 Carl Zeiss Smt Gmbh Catadioptric projection objective with intermediate images
US8913316B2 (en) 2004-05-17 2014-12-16 Carl Zeiss Smt Gmbh Catadioptric projection objective with intermediate images
US9019596B2 (en) 2004-05-17 2015-04-28 Carl Zeiss Smt Gmbh Catadioptric projection objective with intermediate images
US9623436B2 (en) 2004-05-18 2017-04-18 Asml Netherlands B.V. Active drying station and method to remove immersion liquid using gas flow supply with gas outlet between two gas inlets
US8638415B2 (en) 2004-05-18 2014-01-28 Asml Netherlands B.V. Active drying station and method to remove immersion liquid using gas flow supply with gas outlet between two gas inlets
US10761438B2 (en) 2004-05-18 2020-09-01 Asml Netherlands B.V. Active drying station and method to remove immersion liquid using gas flow supply with gas outlet between two gas inlets
US7486381B2 (en) 2004-05-21 2009-02-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9429495B2 (en) 2004-06-04 2016-08-30 Carl Zeiss Smt Gmbh System for measuring the image quality of an optical imaging system
JP2008502127A (en) * 2004-06-04 2008-01-24 カール・ツァイス・エスエムティー・アーゲー Projection system with compensation for intensity variation and compensation element therefor
JP2012028803A (en) * 2004-06-04 2012-02-09 Carl Zeiss Smt Gmbh Projection system with compensation of intensity variations and compensation element therefor
EP1759248A1 (en) * 2004-06-04 2007-03-07 Carl Zeiss SMT AG Projection system with compensation of intensity variatons and compensation element therefor
JP4913041B2 (en) * 2004-06-04 2012-04-11 カール・ツァイス・エスエムティー・ゲーエムベーハー Projection system with compensation for intensity variation and compensation element therefor
US8325326B2 (en) 2004-06-07 2012-12-04 Nikon Corporation Stage unit, exposure apparatus, and exposure method
US8704997B2 (en) 2004-06-09 2014-04-22 Nikon Corporation Immersion lithographic apparatus and method for rinsing immersion space before exposure
US9645505B2 (en) 2004-06-09 2017-05-09 Nikon Corporation Immersion exposure apparatus and device manufacturing method with measuring device to measure specific resistance of liquid
US8525971B2 (en) 2004-06-09 2013-09-03 Nikon Corporation Lithographic apparatus with cleaning of substrate table
US8520184B2 (en) 2004-06-09 2013-08-27 Nikon Corporation Immersion exposure apparatus and device manufacturing method with measuring device
US8705008B2 (en) 2004-06-09 2014-04-22 Nikon Corporation Substrate holding unit, exposure apparatus having same, exposure method, method for producing device, and liquid repellant plate
US8373843B2 (en) 2004-06-10 2013-02-12 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US10203614B2 (en) 2004-06-10 2019-02-12 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US8508713B2 (en) 2004-06-10 2013-08-13 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US9411247B2 (en) 2004-06-10 2016-08-09 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
KR20140114461A (en) * 2004-06-10 2014-09-26 가부시키가이샤 니콘 Exposure apparatus, exposure method, and device producing method
US8482716B2 (en) 2004-06-10 2013-07-09 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US9529273B2 (en) 2004-06-10 2016-12-27 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
JP2017037344A (en) * 2004-06-10 2017-02-16 株式会社ニコン Exposure apparatus, exposure method, and device manufacturing method
KR101639928B1 (en) 2004-06-10 2016-07-14 가부시키가이샤 니콘 Exposure apparatus, exposure method, and device producing method
JP2016048395A (en) * 2004-06-10 2016-04-07 株式会社ニコン Exposure apparatus, exposure method, and device manufacturing method
JP2013229632A (en) * 2004-06-10 2013-11-07 Nikon Corp Exposure apparatus, exposure method, and device manufacturing method
JP2015128171A (en) * 2004-06-10 2015-07-09 株式会社ニコン Exposure apparatus, exposure method, and device manufacturing method
US9778580B2 (en) 2004-06-10 2017-10-03 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US8717533B2 (en) 2004-06-10 2014-05-06 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US9507270B2 (en) 2004-06-16 2016-11-29 Asml Netherlands B.V. Vacuum system for immersion photolithography
US9857699B2 (en) 2004-06-16 2018-01-02 Asml Netherlands B.V. Vacuum system for immersion photolithography
US10168624B2 (en) 2004-06-16 2019-01-01 Asml Netherlands B.V. Vacuum system for immersion photolithography
KR101228244B1 (en) 2004-06-21 2013-01-31 가부시키가이샤 니콘 Exposure device, exposure device member cleaning method, exposure device maintenance method, maintenance device and device manufacturing method
WO2005124833A1 (en) * 2004-06-21 2005-12-29 Nikon Corporation Exposure device, exposure device member cleaning method, exposure device maintenance method, maintenance device, and device manufacturing method
KR101342303B1 (en) 2004-06-21 2013-12-16 가부시키가이샤 니콘 Exposure device, exposure device member cleaning method, exposure device maintenance method, maintenance device and device manufacturing method
US8810767B2 (en) 2004-06-21 2014-08-19 Nikon Corporation Exposure apparatus, method for cleaning member thereof, maintenance method for exposure apparatus, maintenance device, and method for producing device
US9904182B2 (en) 2004-06-21 2018-02-27 Nikon Corporation Exposure apparatus
US8368870B2 (en) 2004-06-21 2013-02-05 Nikon Corporation Exposure apparatus and device manufacturing method
US9470984B2 (en) 2004-06-21 2016-10-18 Nikon Corporation Exposure apparatus
JP4677833B2 (en) * 2004-06-21 2011-04-27 株式会社ニコン EXPOSURE APPARATUS, METHOD FOR CLEANING ITS MEMBER, EXPOSURE APPARATUS MAINTENANCE METHOD, MAINTENANCE EQUIPMENT AND DEVICE MANUFACTURING METHOD
JP2006165502A (en) * 2004-06-21 2006-06-22 Nikon Corp Exposure apparatus, method of cleaning member thereof, maintenance method of exposure apparatus, maintenance device, and device manufacturing method
US8698998B2 (en) 2004-06-21 2014-04-15 Nikon Corporation Exposure apparatus, method for cleaning member thereof, maintenance method for exposure apparatus, maintenance device, and method for producing device
US10338478B2 (en) 2004-07-07 2019-07-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8319939B2 (en) 2004-07-07 2012-11-27 Asml Netherlands B.V. Immersion lithographic apparatus and device manufacturing method detecting residual liquid
US10739684B2 (en) 2004-07-07 2020-08-11 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9104117B2 (en) 2004-07-07 2015-08-11 Bob Streefkerk Lithographic apparatus having a liquid detection system
JP4551704B2 (en) * 2004-07-08 2010-09-29 富士フイルム株式会社 Protective film forming composition for immersion exposure and pattern forming method using the same
JP2006023538A (en) * 2004-07-08 2006-01-26 Fuji Photo Film Co Ltd Protective film forming composition for liquid immersion exposure, and pattern forming method using the same
US8654308B2 (en) 2004-07-12 2014-02-18 Nikon Corporation Method for determining exposure condition, exposure method, exposure apparatus, and method for manufacturing device
US9250537B2 (en) 2004-07-12 2016-02-02 Nikon Corporation Immersion exposure apparatus and method with detection of liquid on members of the apparatus
JP2014199461A (en) * 2004-07-14 2014-10-23 カール・ツァイス・エスエムティー・ゲーエムベーハー Catadioptric projection objective
JP2015121815A (en) * 2004-07-14 2015-07-02 カール・ツァイス・エスエムティー・ゲーエムベーハー Catadioptric projection objective
JP2016224460A (en) * 2004-07-14 2016-12-28 カール・ツァイス・エスエムティー・ゲーエムベーハー Catadioptric projection objective system
JP2016021076A (en) * 2004-07-14 2016-02-04 カール・ツァイス・エスエムティー・ゲーエムベーハー Catadioptric projection objective system
JP2006030603A (en) * 2004-07-16 2006-02-02 Fuji Photo Film Co Ltd Protective film forming composition for liquid immersion exposure, and pattern forming method using the same
JP4551706B2 (en) * 2004-07-16 2010-09-29 富士フイルム株式会社 Protective film forming composition for immersion exposure and pattern forming method using the same
US7161663B2 (en) 2004-07-22 2007-01-09 Asml Netherlands B.V. Lithographic apparatus
US9268242B2 (en) 2004-08-13 2016-02-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method involving a heater and a temperature sensor
US9188880B2 (en) 2004-08-13 2015-11-17 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method involving a heater
US7304715B2 (en) 2004-08-13 2007-12-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7804575B2 (en) 2004-08-13 2010-09-28 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method having liquid evaporation control
US10838310B2 (en) 2004-08-13 2020-11-17 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method involving a heater
US10254663B2 (en) 2004-08-13 2019-04-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method involving a heater
US9097992B2 (en) 2004-08-19 2015-08-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9488923B2 (en) 2004-08-19 2016-11-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9904185B2 (en) 2004-08-19 2018-02-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9507278B2 (en) 2004-08-19 2016-11-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10705439B2 (en) 2004-08-19 2020-07-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10599054B2 (en) 2004-08-19 2020-03-24 Asml Holding N.V. Lithographic apparatus and device manufacturing method
US10331047B2 (en) 2004-08-19 2019-06-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9746788B2 (en) 2004-08-19 2017-08-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1630616A2 (en) * 2004-08-27 2006-03-01 ASML Holding N.V. System for reducing movement induced disturbances in immersion lithography
EP1630616A3 (en) * 2004-08-27 2007-10-31 ASML Holding N.V. System for reducing movement induced disturbances in immersion lithography
US9341959B2 (en) 2004-09-17 2016-05-17 Nikon Corporation Substrate holding device, exposure apparatus, and device manufacturing method
US8675174B2 (en) 2004-09-17 2014-03-18 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US8102512B2 (en) 2004-09-17 2012-01-24 Nikon Corporation Substrate holding device, exposure apparatus, and device manufacturing method
US9958785B2 (en) 2004-09-17 2018-05-01 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US7133114B2 (en) 2004-09-20 2006-11-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8427629B2 (en) 2004-09-24 2013-04-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7522261B2 (en) 2004-09-24 2009-04-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7808614B2 (en) 2004-09-24 2010-10-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7355674B2 (en) 2004-09-28 2008-04-08 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and computer program product
US8068210B2 (en) 2004-09-28 2011-11-29 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and computer program product
US8027026B2 (en) 2004-10-05 2011-09-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8755027B2 (en) 2004-10-05 2014-06-17 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method involving fluid mixing and control of the physical property of a fluid
US7894040B2 (en) 2004-10-05 2011-02-22 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1645911A1 (en) * 2004-10-07 2006-04-12 ASML Netherlands BV Lithographic apparatus and device manufacturing method
US7209213B2 (en) 2004-10-07 2007-04-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2006140459A (en) * 2004-10-13 2006-06-01 Nikon Corp Aligner, exposing method, and device manufacturing method
WO2006041083A1 (en) * 2004-10-13 2006-04-20 Nikon Corporation Exposure apparatus, exposure method and device manufacturing method
US7852456B2 (en) 2004-10-13 2010-12-14 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
JP2006190971A (en) * 2004-10-13 2006-07-20 Nikon Corp Exposure apparatus, exposure method, and device manufacturing method
US7456929B2 (en) 2004-10-15 2008-11-25 Nikon Corporation Exposure apparatus and device manufacturing method
US8456609B2 (en) 2004-10-15 2013-06-04 Nikon Corporation Exposure apparatus and device manufacturing method
US9753380B2 (en) 2004-10-18 2017-09-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7119876B2 (en) 2004-10-18 2006-10-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8934082B2 (en) 2004-10-18 2015-01-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9436097B2 (en) 2004-10-18 2016-09-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7379155B2 (en) 2004-10-18 2008-05-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8004652B2 (en) 2004-10-18 2011-08-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10248033B2 (en) 2004-10-18 2019-04-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1647865A1 (en) * 2004-10-18 2006-04-19 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
US8941808B2 (en) 2004-10-26 2015-01-27 Nikon Corporation Immersion lithographic apparatus rinsing outer contour of substrate with immersion space
US8040489B2 (en) 2004-10-26 2011-10-18 Nikon Corporation Substrate processing method, exposure apparatus, and method for producing device by immersing substrate in second liquid before immersion exposure through first liquid
US9709900B2 (en) 2004-11-01 2017-07-18 Nikon Corporation Exposure apparatus and device fabricating method
US8330939B2 (en) 2004-11-01 2012-12-11 Nikon Corporation Immersion exposure apparatus and device manufacturing method with a liquid recovery port provided on at least one of a first stage and second stage
US8922754B2 (en) 2004-11-01 2014-12-30 Nikon Corporation Immersion exposure apparatus and device fabricating method with two substrate stages and metrology station
US8294873B2 (en) 2004-11-11 2012-10-23 Nikon Corporation Exposure method, device manufacturing method, and substrate
US7852457B2 (en) 2004-11-12 2010-12-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7414699B2 (en) 2004-11-12 2008-08-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8817231B2 (en) 2004-11-12 2014-08-26 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method involving a liquid confinement structure
US10274832B2 (en) 2004-11-12 2019-04-30 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method involving a liquid confinement structure
US7423720B2 (en) 2004-11-12 2008-09-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9964861B2 (en) 2004-11-12 2018-05-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method involving a liquid confinement structure
US7583357B2 (en) 2004-11-12 2009-09-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9645507B2 (en) 2004-11-12 2017-05-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9798247B2 (en) 2004-11-12 2017-10-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method involving a liquid confinement structure
US10620546B2 (en) 2004-11-12 2020-04-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method involving a liquid confinement structure
US7251013B2 (en) 2004-11-12 2007-07-31 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9261797B2 (en) 2004-11-12 2016-02-16 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method involving a liquid confinement structure
US7710537B2 (en) 2004-11-12 2010-05-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9188882B2 (en) 2004-11-17 2015-11-17 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7411657B2 (en) 2004-11-17 2008-08-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7978306B2 (en) 2004-11-17 2011-07-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9581916B2 (en) 2004-11-17 2017-02-28 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8319944B2 (en) 2004-11-18 2012-11-27 Carl Zeiss Smt Gmbh Projection lens system of a microlithographic projection exposure installation
US9857692B2 (en) 2004-11-18 2018-01-02 Nikon Corporation Position measurement method, position control method, measurement method, loading method, exposure method and exposure apparatus, and device manufacturing method
WO2006053751A3 (en) * 2004-11-18 2006-10-12 Zeiss Carl Smt Ag Projection lens system of a microlithographic projection exposure installation
US9164396B2 (en) 2004-11-18 2015-10-20 Carl Zeiss Smt Gmbh Projection lens system of a microlithographic projection exposure installation
US8576379B2 (en) 2004-11-18 2013-11-05 Nikon Corporation Position measurement method, position control method, measurement method, loading method, exposure method and exposure apparatus, and device manufacturing method
US9298108B2 (en) 2004-11-18 2016-03-29 Nikon Corporation Position measurement method, position control method, measurement method, loading method, exposure method and exposure apparatus, and device manufacturing method
US9223231B2 (en) 2004-11-18 2015-12-29 Nikon Corporation Position measurement method, position control method, measurement method, loading method, exposure method and exposure apparatus, and device manufacturing method
US9223230B2 (en) 2004-11-18 2015-12-29 Nikon Corporation Position measurement method, position control method, measurement method, loading method, exposure method and exposure apparatus, and device manufacturing method
US7782440B2 (en) 2004-11-18 2010-08-24 Carl Zeiss Smt Ag Projection lens system of a microlithographic projection exposure installation
US8054465B2 (en) 2004-11-18 2011-11-08 Nikon Corporation Position measurement method
US8072578B2 (en) 2004-11-18 2011-12-06 Nikon Corporation Position measurement method, position control method, measurement method, loading method, exposure method and exposure apparatus, and device manufacturing method
US9348238B2 (en) 2004-11-18 2016-05-24 Niko Corporation Position measurement method, position control method, measurement method, loading method, exposure method and exposure apparatus, and device manufacturing method
US10222708B2 (en) 2004-11-18 2019-03-05 Nikon Corporation Position measurement method, position control method, measurement method, loading method, exposure method and exposure apparatus, and device manufacturing method
JP2008521224A (en) * 2004-11-18 2008-06-19 カール・ツアイス・エスエムテイ・アーゲー Projection objective lens of microlithography projection exposure apparatus
US8059260B2 (en) 2004-11-18 2011-11-15 Nikon Corporation Position measurement method, position control method, measurement method, loading method, exposure method and exposure apparatus, and device manufacturing method
US7145630B2 (en) 2004-11-23 2006-12-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7623218B2 (en) 2004-11-24 2009-11-24 Carl Zeiss Smt Ag Method of manufacturing a miniaturized device
US7161654B2 (en) 2004-12-02 2007-01-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7812924B2 (en) 2004-12-02 2010-10-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7764356B2 (en) 2004-12-03 2010-07-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7446850B2 (en) 2004-12-03 2008-11-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8891055B2 (en) 2004-12-06 2014-11-18 Nikon Corporation Maintenance method, maintenance device, exposure apparatus, and device manufacturing method
US7804576B2 (en) 2004-12-06 2010-09-28 Nikon Corporation Maintenance method, maintenance device, exposure apparatus, and device manufacturing method
US8456608B2 (en) 2004-12-06 2013-06-04 Nikon Corporation Maintenance method, maintenance device, exposure apparatus, and device manufacturing method
US7248334B2 (en) 2004-12-07 2007-07-24 Asml Netherlands B.V. Sensor shield
US7196770B2 (en) 2004-12-07 2007-03-27 Asml Netherlands B.V. Prewetting of substrate before immersion exposure
US7643127B2 (en) 2004-12-07 2010-01-05 Asml Netherlands B.V. Prewetting of substrate before immersion exposure
US7365827B2 (en) 2004-12-08 2008-04-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8860926B2 (en) 2004-12-08 2014-10-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8115905B2 (en) 2004-12-08 2012-02-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8913224B2 (en) 2004-12-09 2014-12-16 Nixon Corporation Exposure apparatus, exposure method, and device producing method
US8035799B2 (en) 2004-12-09 2011-10-11 Nikon Corporation Exposure apparatus, exposure method, and device producing method
US10345711B2 (en) 2004-12-10 2019-07-09 Asml Netherlands B.V. Substrate placement in immersion lithography
US9182222B2 (en) 2004-12-10 2015-11-10 Asml Netherlands B.V. Substrate placement in immersion lithography
US7352440B2 (en) 2004-12-10 2008-04-01 Asml Netherlands B.V. Substrate placement in immersion lithography
US9740106B2 (en) 2004-12-10 2017-08-22 Asml Netherlands B.V. Substrate placement in immersion lithography
US7751032B2 (en) 2004-12-15 2010-07-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7403261B2 (en) 2004-12-15 2008-07-22 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9224632B2 (en) 2004-12-15 2015-12-29 Nikon Corporation Substrate holding apparatus, exposure apparatus, and device fabricating method
US9964860B2 (en) 2004-12-15 2018-05-08 Nikon Corporation Substrate holding apparatus, exposure apparatus, and device fabricating method
US8233135B2 (en) 2004-12-15 2012-07-31 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9690206B2 (en) 2004-12-15 2017-06-27 Nikon Corporation Substrate holding apparatus, exposure apparatus, and device fabricating method
US9116443B2 (en) 2004-12-20 2015-08-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8462312B2 (en) 2004-12-20 2013-06-11 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10509326B2 (en) 2004-12-20 2019-12-17 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8941811B2 (en) 2004-12-20 2015-01-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10248035B2 (en) 2004-12-20 2019-04-02 Asml Netherlands B.V. Lithographic apparatus
US9835960B2 (en) 2004-12-20 2017-12-05 Asml Netherlands B.V. Lithographic apparatus
US7528931B2 (en) 2004-12-20 2009-05-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8233137B2 (en) 2004-12-20 2012-07-31 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9417535B2 (en) 2004-12-20 2016-08-16 Asml Netherlands B.V. Lithographic apparatus
US9329494B2 (en) 2004-12-20 2016-05-03 Asml Netherlands B.V. Lithographic apparatus
US9703210B2 (en) 2004-12-20 2017-07-11 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8913225B2 (en) 2004-12-28 2014-12-16 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7763355B2 (en) 2004-12-28 2010-07-27 Asml Netherlands B.V. Device manufacturing method, top coat material and substrate
US7405805B2 (en) 2004-12-28 2008-07-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7491661B2 (en) 2004-12-28 2009-02-17 Asml Netherlands B.V. Device manufacturing method, top coat material and substrate
US8013978B2 (en) 2004-12-28 2011-09-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8354209B2 (en) 2004-12-30 2013-01-15 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8102507B2 (en) 2004-12-30 2012-01-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7670730B2 (en) 2004-12-30 2010-03-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7199939B2 (en) 2005-01-05 2007-04-03 Canon Kabushiki Kaisha Immersion optical system and optical apparatus having the same
US8830446B2 (en) 2005-01-12 2014-09-09 Asml Netherlands B.V. Exposure apparatus
US8542341B2 (en) 2005-01-12 2013-09-24 Asml Netherlands B.V. Exposure apparatus
US7450217B2 (en) 2005-01-12 2008-11-11 Asml Netherlands B.V. Exposure apparatus, coatings for exposure apparatus, lithographic apparatus, device manufacturing method, and device manufactured thereby
US7705962B2 (en) 2005-01-14 2010-04-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9746781B2 (en) 2005-01-31 2017-08-29 Nikon Corporation Exposure apparatus and method for producing device
US10712675B2 (en) 2005-02-10 2020-07-14 Asml Netherlands B.V. Immersion liquid, exposure apparatus, and exposure process
US9454088B2 (en) 2005-02-10 2016-09-27 Asml Netherlands B.V. Immersion liquid, exposure apparatus, and exposure process
US9164391B2 (en) 2005-02-10 2015-10-20 Asml Netherlands B.V. Immersion liquid, exposure apparatus, and exposure process
US9772565B2 (en) 2005-02-10 2017-09-26 Asml Netherlands B.V. Immersion liquid, exposure apparatus, and exposure process
US8859188B2 (en) 2005-02-10 2014-10-14 Asml Netherlands B.V. Immersion liquid, exposure apparatus, and exposure process
US7914687B2 (en) 2005-02-22 2011-03-29 Asml Netherlands B.V. Fluid filtration method, fluid filtered thereby, lithographic apparatus and device manufacturing method
US8902404B2 (en) 2005-02-22 2014-12-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7224431B2 (en) 2005-02-22 2007-05-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8018573B2 (en) 2005-02-22 2011-09-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7378025B2 (en) 2005-02-22 2008-05-27 Asml Netherlands B.V. Fluid filtration method, fluid filtered thereby, lithographic apparatus and device manufacturing method
US8246838B2 (en) 2005-02-22 2012-08-21 Asml Netherlands B.V. Fluid filtration method, fluid filtered thereby, lithographic apparatus and device manufacturing method
US8629418B2 (en) * 2005-02-28 2014-01-14 Asml Netherlands B.V. Lithographic apparatus and sensor therefor
US8958051B2 (en) 2005-02-28 2015-02-17 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and apparatus for de-gassing a liquid
US7428038B2 (en) 2005-02-28 2008-09-23 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and apparatus for de-gassing a liquid
US8107053B2 (en) 2005-02-28 2012-01-31 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and apparatus for de-gassing a liquid
US10495981B2 (en) 2005-03-04 2019-12-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9477159B2 (en) 2005-03-04 2016-10-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7324185B2 (en) 2005-03-04 2008-01-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10495980B2 (en) 2005-03-04 2019-12-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8514369B2 (en) 2005-03-04 2013-08-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7843551B2 (en) 2005-03-04 2010-11-30 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8390778B2 (en) 2005-03-09 2013-03-05 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method, seal structure, method of removing an object and a method of sealing
US7684010B2 (en) 2005-03-09 2010-03-23 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method, seal structure, method of removing an object and a method of sealing
US7705968B2 (en) 2005-03-18 2010-04-27 Nikon Corporation Plate member, substrate holding device, exposure apparatus and method, and device manufacturing method
US8638422B2 (en) 2005-03-18 2014-01-28 Nikon Corporation Exposure method, exposure apparatus, method for producing device, and method for evaluating exposure apparatus
US7859644B2 (en) 2005-03-28 2010-12-28 Asml Netherlands B.V. Lithographic apparatus, immersion projection apparatus and device manufacturing method
US7330238B2 (en) 2005-03-28 2008-02-12 Asml Netherlands, B.V. Lithographic apparatus, immersion projection apparatus and device manufacturing method
US9239524B2 (en) 2005-03-30 2016-01-19 Nikon Corporation Exposure condition determination method, exposure method, exposure apparatus, and device manufacturing method involving detection of the situation of a liquid immersion region
US10209629B2 (en) 2005-04-05 2019-02-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7411654B2 (en) 2005-04-05 2008-08-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8976334B2 (en) 2005-04-05 2015-03-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9429853B2 (en) 2005-04-05 2016-08-30 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8988651B2 (en) 2005-04-05 2015-03-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10495984B2 (en) 2005-04-05 2019-12-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8259287B2 (en) 2005-04-05 2012-09-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9857695B2 (en) 2005-04-05 2018-01-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
USRE47943E1 (en) 2005-04-08 2020-04-14 Asml Netherlands B.V. Dual stage lithographic apparatus and device manufacturing method
US7291850B2 (en) 2005-04-08 2007-11-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7582881B2 (en) 2005-04-08 2009-09-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8203693B2 (en) 2005-04-19 2012-06-19 Asml Netherlands B.V. Liquid immersion lithography system comprising a tilted showerhead relative to a substrate
US9335639B2 (en) 2005-04-25 2016-05-10 Nikon Corporation Exposure method, exposure apparatus, and device manufacturing method
US8064039B2 (en) 2005-04-25 2011-11-22 Nikon Corporation Exposure method, exposure apparatus, and device manufacturing method
US9618854B2 (en) 2005-04-25 2017-04-11 Nikon Corporation Exposure method, exposure apparatus, and device manufacturing method
US8941812B2 (en) 2005-04-28 2015-01-27 Nikon Corporation Exposure method, exposure apparatus, and device manufacturing method
US8236467B2 (en) 2005-04-28 2012-08-07 Nikon Corporation Exposure method, exposure apparatus, and device manufacturing method
US8248577B2 (en) 2005-05-03 2012-08-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9081300B2 (en) 2005-05-03 2015-07-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10488759B2 (en) 2005-05-03 2019-11-26 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8115903B2 (en) 2005-05-03 2012-02-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10025196B2 (en) 2005-05-03 2018-07-17 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9477153B2 (en) 2005-05-03 2016-10-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10451973B2 (en) 2005-05-03 2019-10-22 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10353296B2 (en) 2005-05-03 2019-07-16 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9229335B2 (en) 2005-05-03 2016-01-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8860924B2 (en) 2005-05-03 2014-10-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9146478B2 (en) 2005-05-03 2015-09-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7433016B2 (en) 2005-05-03 2008-10-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7317507B2 (en) 2005-05-03 2008-01-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10684554B2 (en) 2005-05-03 2020-06-16 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9606449B2 (en) 2005-05-03 2017-03-28 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9891539B2 (en) 2005-05-12 2018-02-13 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
JP2006332669A (en) * 2005-05-25 2006-12-07 Carl Zeiss Smt Ag Projection lens suitable for use together with different immersion liquid, and converting method and manufacturing method therefor
US9316922B2 (en) 2005-06-14 2016-04-19 Carl Zeiss Smt Gmbh Lithography projection objective, and a method for correcting image defects of the same
US8054557B2 (en) 2005-06-14 2011-11-08 Carl Zeiss Smt Gmbh Lithography projection objective, and a method for correcting image defects of the same
US9964859B2 (en) 2005-06-14 2018-05-08 Carl Zeiss Smt Gmbh Lithography projection objective, and a method for correcting image defects of the same
US8879159B2 (en) 2005-06-14 2014-11-04 Carl Zeiss Smt Gmbh Lithography projection objective, and a method for correcting image defects of the same
US7751027B2 (en) 2005-06-21 2010-07-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7652746B2 (en) 2005-06-21 2010-01-26 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9268236B2 (en) 2005-06-21 2016-02-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method having heat pipe with fluid to cool substrate and/or substrate holder
US7924416B2 (en) 2005-06-22 2011-04-12 Nikon Corporation Measurement apparatus, exposure apparatus, and device manufacturing method
US9952514B2 (en) 2005-06-28 2018-04-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8120749B2 (en) 2005-06-28 2012-02-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9099501B2 (en) 2005-06-28 2015-08-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7474379B2 (en) 2005-06-28 2009-01-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7468779B2 (en) 2005-06-28 2008-12-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7929112B2 (en) 2005-06-28 2011-04-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10386725B2 (en) 2005-06-28 2019-08-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8687168B2 (en) 2005-06-28 2014-04-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9448494B2 (en) 2005-06-28 2016-09-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7834974B2 (en) 2005-06-28 2010-11-16 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8848165B2 (en) 2005-06-28 2014-09-30 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9766556B2 (en) 2005-06-28 2017-09-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8179517B2 (en) 2005-06-30 2012-05-15 Nikon Corporation Exposure apparatus and method, maintenance method for exposure apparatus, and device manufacturing method
US7990622B2 (en) 2005-07-25 2011-08-02 Carl Zeiss Smt Gmbh Projection objective of a microlithographic projection exposure apparatus
US7830611B2 (en) 2005-07-25 2010-11-09 Carl Zeiss Smt Ag Projection objective of a microlithographic projection exposure apparatus
US7535644B2 (en) 2005-08-12 2009-05-19 Asml Netherlands B.V. Lens element, lithographic apparatus, device manufacturing method, and device manufactured thereby
US8054445B2 (en) 2005-08-16 2011-11-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8070145B2 (en) 2005-08-26 2011-12-06 Nikon Corporation Holding unit, assembly system, sputtering unit, and processing method and processing unit
US8668191B2 (en) 2005-08-26 2014-03-11 Nikon Corporation Holding unit, assembly system, sputtering unit, and processing method and processing unit
US8724075B2 (en) 2005-08-31 2014-05-13 Nikon Corporation Optical element, exposure apparatus based on the use of the same, exposure method, and method for producing microdevice
US7812926B2 (en) 2005-08-31 2010-10-12 Nikon Corporation Optical element, exposure apparatus based on the use of the same, exposure method, and method for producing microdevice
US8780326B2 (en) 2005-09-09 2014-07-15 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US8111374B2 (en) 2005-09-09 2012-02-07 Nikon Corporation Analysis method, exposure method, and device manufacturing method
WO2007034838A1 (en) * 2005-09-21 2007-03-29 Nikon Corporation Exposure device, exposure method, and device fabrication method
JPWO2007034838A1 (en) * 2005-09-21 2009-03-26 株式会社ニコン Exposure apparatus, exposure method, and device manufacturing method
US8004654B2 (en) 2005-10-06 2011-08-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8958054B2 (en) 2005-10-06 2015-02-17 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7411658B2 (en) 2005-10-06 2008-08-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7864292B2 (en) 2005-11-16 2011-01-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10126664B2 (en) 2005-11-16 2018-11-13 Asml Netherlands, B.V. Lithographic apparatus and device manufacturing method
US7656501B2 (en) 2005-11-16 2010-02-02 Asml Netherlands B.V. Lithographic apparatus
US8786823B2 (en) 2005-11-16 2014-07-22 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8421996B2 (en) 2005-11-16 2013-04-16 Asml Netherlands B.V. Lithographic apparatus
US9618853B2 (en) 2005-11-16 2017-04-11 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7804577B2 (en) 2005-11-16 2010-09-28 Asml Netherlands B.V. Lithographic apparatus
US10768536B2 (en) 2005-11-16 2020-09-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9140996B2 (en) 2005-11-16 2015-09-22 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7803516B2 (en) 2005-11-21 2010-09-28 Nikon Corporation Exposure method, device manufacturing method using the same, exposure apparatus, and substrate processing method and apparatus
US7633073B2 (en) 2005-11-23 2009-12-15 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7928407B2 (en) 2005-11-23 2011-04-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8138486B2 (en) * 2005-11-23 2012-03-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8456611B2 (en) 2005-11-29 2013-06-04 Asml Holding N.V. System and method to increase surface tension and contact angle in immersion lithography
US7773195B2 (en) 2005-11-29 2010-08-10 Asml Holding N.V. System and method to increase surface tension and contact angle in immersion lithography
JP2007157827A (en) * 2005-12-01 2007-06-21 Tokyo Ohka Kogyo Co Ltd Method for removing liquid and method for evaluating resist pattern using same
US10061207B2 (en) 2005-12-02 2018-08-28 Asml Netherlands B.V. Method for preventing or reducing contamination of an immersion type projection apparatus and an immersion type lithographic apparatus
US8232540B2 (en) 2005-12-27 2012-07-31 Asml Netherlands B.V. Lithographic apparatus and substrate edge seal
US8003968B2 (en) 2005-12-27 2011-08-23 Asml Netherlands B.V. Lithographic apparatus and substrate edge seal
US7420194B2 (en) 2005-12-27 2008-09-02 Asml Netherlands B.V. Lithographic apparatus and substrate edge seal
US7839483B2 (en) 2005-12-28 2010-11-23 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and a control system
US8411271B2 (en) 2005-12-28 2013-04-02 Nikon Corporation Pattern forming method, pattern forming apparatus, and device manufacturing method
US8564760B2 (en) 2005-12-28 2013-10-22 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and a control system
US9436096B2 (en) 2005-12-30 2016-09-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10761433B2 (en) 2005-12-30 2020-09-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9851644B2 (en) 2005-12-30 2017-12-26 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10222711B2 (en) 2005-12-30 2019-03-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8947631B2 (en) 2005-12-30 2015-02-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8743339B2 (en) 2005-12-30 2014-06-03 Asml Netherlands Lithographic apparatus and device manufacturing method
US7649611B2 (en) 2005-12-30 2010-01-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8941810B2 (en) 2005-12-30 2015-01-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10203613B2 (en) 2006-01-19 2019-02-12 Nikon Corporation Movable body drive method, movable body drive system, pattern formation method, pattern forming apparatus, exposure method, exposure apparatus, and device manufacturing method
US10133195B2 (en) 2006-01-19 2018-11-20 Nikon Corporation Movable body drive method, movable body drive system, pattern formation method, pattern forming apparatus, exposure method, exposure apparatus, and device manufacturing method
US10185227B2 (en) 2006-01-19 2019-01-22 Nikon Corporation Movable body drive method, movable body drive system, pattern formation method, pattern forming apparatus, exposure method, exposure apparatus, and device manufacturing method
US10185228B2 (en) 2006-01-19 2019-01-22 Nikon Corporation Movable body drive method, movable body drive system, pattern formation method, pattern forming apparatus, exposure method, exposure apparatus, and device manufacturing method
US7839485B2 (en) 2006-01-19 2010-11-23 Nikon Corporation Movable body drive method, movable body drive system, pattern formation method, pattern forming apparatus, exposure method, exposure apparatus, and device manufacturing method
US8134681B2 (en) 2006-02-17 2012-03-13 Nikon Corporation Adjustment method, substrate processing method, substrate processing apparatus, exposure apparatus, inspection apparatus, measurement and/or inspection system, processing apparatus, computer system, program and information recording medium
US10132658B2 (en) 2006-02-21 2018-11-20 Nikon Corporation Measuring apparatus and method, processing apparatus and method, pattern forming apparatus and method, exposure apparatus and method, and device manufacturing method
US9690214B2 (en) 2006-02-21 2017-06-27 Nikon Corporation Pattern forming apparatus and pattern forming method, movable body drive system and movable body drive method, exposure apparatus and exposure method, and device manufacturing method
US10088759B2 (en) 2006-02-21 2018-10-02 Nikon Corporation Pattern forming apparatus and pattern forming method, movable body drive system and movable body drive method, exposure apparatus and exposure method, and device manufacturing method
US10234773B2 (en) 2006-02-21 2019-03-19 Nikon Corporation Pattern forming apparatus, mark detecting apparatus, exposure apparatus, pattern forming method, exposure method, and device manufacturing method
US9989859B2 (en) 2006-02-21 2018-06-05 Nikon Corporation Measuring apparatus and method, processing apparatus and method, pattern forming apparatus and method, exposure apparatus and method, and device manufacturing method
US9329060B2 (en) 2006-02-21 2016-05-03 Nikon Corporation Measuring apparatus and method, processing apparatus and method, pattern forming apparatus and method, exposure apparatus and method, and device manufacturing method
US10012913B2 (en) 2006-02-21 2018-07-03 Nikon Corporation Pattern forming apparatus and pattern forming method, movable body drive system and movable body drive method, exposure apparatus and exposure method, and device manufacturing method
US9857697B2 (en) 2006-02-21 2018-01-02 Nikon Corporation Pattern forming apparatus, mark detecting apparatus, exposure apparatus, pattern forming method, exposure method, and device manufacturing method
US10345121B2 (en) 2006-02-21 2019-07-09 Nikon Corporation Measuring apparatus and method, processing apparatus and method, pattern forming apparatus and method, exposure apparatus and method, and device manufacturing method
US10409173B2 (en) 2006-02-21 2019-09-10 Nikon Corporation Pattern forming apparatus, mark detecting apparatus, exposure apparatus, pattern forming method, exposure method, and device manufacturing method
US10088343B2 (en) 2006-02-21 2018-10-02 Nikon Corporation Measuring apparatus and method, processing apparatus and method, pattern forming apparatus and method, exposure apparatus and method, and device manufacturing method
US10139738B2 (en) 2006-02-21 2018-11-27 Nikon Corporation Pattern forming apparatus and pattern forming method, movable body drive system and movable body drive method, exposure apparatus and exposure method, and device manufacturing method
US8035800B2 (en) 2006-03-13 2011-10-11 Nikon Corporation Exposure apparatus, maintenance method, exposure method, and method for producing device
US8045134B2 (en) 2006-03-13 2011-10-25 Asml Netherlands B.V. Lithographic apparatus, control system and device manufacturing method
US9482967B2 (en) 2006-03-13 2016-11-01 Asml Netherlands B.V. Lithographic apparatus, control system and device manufacturing method
US10802410B2 (en) 2006-04-14 2020-10-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method involving a barrier structure to handle liquid
US9477158B2 (en) 2006-04-14 2016-10-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8902401B2 (en) 2006-05-09 2014-12-02 Carl Zeiss Smt Gmbh Optical imaging device with thermal attenuation
US9810996B2 (en) 2006-05-09 2017-11-07 Carl Zeiss Smt Gmbh Optical imaging device with thermal attenuation
US8477283B2 (en) 2006-05-10 2013-07-02 Nikon Corporation Exposure apparatus and device manufacturing method
US8570484B2 (en) 2006-08-30 2013-10-29 Nikon Corporation Immersion exposure apparatus, device manufacturing method, cleaning method, and cleaning member to remove foreign substance using liquid
US8947639B2 (en) 2006-08-31 2015-02-03 Nikon Corporation Exposure method and apparatus measuring position of movable body based on information on flatness of encoder grating section
US10162274B2 (en) 2006-08-31 2018-12-25 Nikon Corporation Movable body drive method and system, pattern formation method and apparatus, exposure method and apparatus for driving movable body based on measurement value of encoder and information on flatness of scale, and device manufacturing method
US10101673B2 (en) 2006-08-31 2018-10-16 Nikon Corporation Movable body drive method and system, pattern formation method and apparatus, exposure method and apparatus for driving movable body based on measurement value of encoder and information on flatness of scale, and device manufacturing method
US8203697B2 (en) 2006-08-31 2012-06-19 Nikon Corporation Movable body drive method and system, pattern formation method and apparatus, exposure method and apparatus for driving movable body based on measurement value of encoder and information on flatness of scale, and device manufacturing method
US10073359B2 (en) 2006-08-31 2018-09-11 Nikon Corporation Movable body drive system and movable body drive method, pattern formation apparatus and method, exposure apparatus and method, device manufacturing method, and decision-making method
US10067428B2 (en) 2006-08-31 2018-09-04 Nikon Corporation Movable body drive system and movable body drive method, pattern formation apparatus and method, exposure apparatus and method, device manufacturing method, and decision-making method
US8937710B2 (en) 2006-08-31 2015-01-20 Nikon Corporation Exposure method and apparatus compensating measuring error of encoder due to grating section and displacement of movable body in Z direction
US9983486B2 (en) 2006-08-31 2018-05-29 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method
US10353302B2 (en) 2006-08-31 2019-07-16 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method
US10353301B2 (en) 2006-08-31 2019-07-16 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method
US10338482B2 (en) 2006-08-31 2019-07-02 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method
US9958792B2 (en) 2006-08-31 2018-05-01 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method
US9625834B2 (en) 2006-09-01 2017-04-18 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and calibration method
US9971253B2 (en) 2006-09-01 2018-05-15 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and calibration method
US10289010B2 (en) 2006-09-01 2019-05-14 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method
US10289012B2 (en) 2006-09-01 2019-05-14 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and calibration method
US9760021B2 (en) 2006-09-01 2017-09-12 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and calibration method
US9874822B2 (en) 2006-09-01 2018-01-23 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method
US9740114B2 (en) 2006-09-01 2017-08-22 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and calibration method
US9377698B2 (en) 2006-09-01 2016-06-28 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and calibration method
US10197924B2 (en) 2006-09-01 2019-02-05 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and calibration method
US9846374B2 (en) 2006-09-01 2017-12-19 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and calibration method
US7872730B2 (en) 2006-09-15 2011-01-18 Nikon Corporation Immersion exposure apparatus and immersion exposure method, and device manufacturing method
US8743341B2 (en) 2006-09-15 2014-06-03 Nikon Corporation Immersion exposure apparatus and immersion exposure method, and device manufacturing method
US7973910B2 (en) 2006-11-17 2011-07-05 Nikon Corporation Stage apparatus and exposure apparatus
US8749755B2 (en) 2006-11-17 2014-06-10 Nikon Corporation Stage apparatus and exposure apparatus
US8045135B2 (en) 2006-11-22 2011-10-25 Asml Netherlands B.V. Lithographic apparatus with a fluid combining unit and related device manufacturing method
US9330912B2 (en) 2006-11-22 2016-05-03 Asml Netherlands B.V. Lithographic apparatus, fluid combining unit and device manufacturing method
US8013975B2 (en) 2006-12-01 2011-09-06 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US8040490B2 (en) 2006-12-01 2011-10-18 Nikon Corporation Liquid immersion exposure apparatus, exposure method, and method for producing device
US8721803B2 (en) 2006-12-05 2014-05-13 Nikon Corporation Cleaning liquid, cleaning method, liquid generating apparatus, exposure apparatus, and device fabricating method
US10185231B2 (en) 2006-12-07 2019-01-22 Asml Holding N.V. Lithographic apparatus, a dryer and a method of removing liquid from a surface
US10268127B2 (en) 2006-12-07 2019-04-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8634053B2 (en) 2006-12-07 2014-01-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9632425B2 (en) 2006-12-07 2017-04-25 Asml Holding N.V. Lithographic apparatus, a dryer and a method of removing liquid from a surface
US9645506B2 (en) 2006-12-07 2017-05-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10649349B2 (en) 2006-12-07 2020-05-12 Asml Holding N.V. Lithographic apparatus, a dryer and a method of removing liquid from a surface
US7791709B2 (en) 2006-12-08 2010-09-07 Asml Netherlands B.V. Substrate support and lithographic process
US9013672B2 (en) 2007-05-04 2015-04-21 Asml Netherlands B.V. Cleaning device, a lithographic apparatus and a lithographic apparatus cleaning method
US8947629B2 (en) 2007-05-04 2015-02-03 Asml Netherlands B.V. Cleaning device, a lithographic apparatus and a lithographic apparatus cleaning method
US8164736B2 (en) 2007-05-29 2012-04-24 Nikon Corporation Exposure method, exposure apparatus, and method for producing device
US10101666B2 (en) 2007-10-12 2018-10-16 Nikon Corporation Illumination optical apparatus, exposure apparatus, and device manufacturing method
US9341954B2 (en) 2007-10-24 2016-05-17 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US9857599B2 (en) 2007-10-24 2018-01-02 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US9678332B2 (en) 2007-11-06 2017-06-13 Nikon Corporation Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
US7759631B2 (en) * 2008-01-22 2010-07-20 Nanosurf Ag Raster scanning microscope having transparent optical element with inner curved surface
US8891053B2 (en) 2008-09-10 2014-11-18 Asml Netherlands B.V. Lithographic apparatus, method of manufacturing an article for a lithographic apparatus and device manufacturing method
US10620544B2 (en) 2010-04-22 2020-04-14 Asml Netherlands B.V. Fluid handling structure, lithographic apparatus and device manufacturing method
US9256136B2 (en) 2010-04-22 2016-02-09 Asml Netherlands B.V. Fluid handling structure, lithographic apparatus and device manufacturing method involving gas supply
US9846372B2 (en) 2010-04-22 2017-12-19 Asml Netherlands B.V. Fluid handling structure, lithographic apparatus and device manufacturing method
US10209624B2 (en) 2010-04-22 2019-02-19 Asml Netherlands B.V. Fluid handling structure, lithographic apparatus and device manufacturing method
JP2013191871A (en) * 2013-05-13 2013-09-26 Nikon Corp Cata-dioptric type projection optical system, exposure device, and exposure method
JP2014160274A (en) * 2014-04-21 2014-09-04 Nikon Corp Projection optical system, exposure device, exposure method, and method of manufacturing the device
JP2014194552A (en) * 2014-04-28 2014-10-09 Nikon Corp Cata-dioptric type projection optical system, exposure device, and exposure method
JP2016075931A (en) * 2015-11-30 2016-05-12 株式会社ニコン Exposure equipment, exposure method, and device production method
JP2017076138A (en) * 2015-11-30 2017-04-20 株式会社ニコン Exposure apparatus, exposure method and method for manufacturing device
JP2018077519A (en) * 2018-01-09 2018-05-17 株式会社ニコン Exposure apparatus, exposure method and method for manufacturing device

Similar Documents

Publication Publication Date Title
US20180052398A1 (en) Projection optical system, exposure apparatus, and exposure method
KR101213831B1 (en) Catadioptric projection objective with intermediate images
US5241423A (en) High resolution reduction catadioptric relay lens
US5999333A (en) Exposure apparatus having catadioptric projection optical system
DE69933973T2 (en) Catadiopric optical system and equipped exposure device
KR101127346B1 (en) Microlithography projection optical system, method for manufacturing a device and method to design an optical surface
KR100674045B1 (en) Illumination apparatus, exposure apparatus and device manufacturing method
US4977426A (en) Projection exposure apparatus
US6665126B2 (en) Projection exposure lens with aspheric elements
US6469827B1 (en) Diffraction spectral filter for use in extreme-UV lithography condenser
US5448408A (en) Projection lens system
US6956694B2 (en) Broad spectrum ultraviolet inspection systems employing catadioptric imaging
KR100387003B1 (en) Projection optical system and projection exposure apparatus
US5835275A (en) Catadioptric system for photolithography
JP4309980B2 (en) Annular surface reduction projection optical system
KR100451339B1 (en) High numerical aperture ring field optical reduction system
US6142641A (en) Four-mirror extreme ultraviolet (EUV) lithography projection system
US6930837B2 (en) Optical projection lens system
KR100412174B1 (en) Reflective Refractive Optics and Exposure Equipment
US7079314B1 (en) Catadioptric optical system and exposure apparatus equipped with the same
TWI276924B (en) Exposure apparatus and method
EP1422562B1 (en) Reticle and optical characteristic measuring method
JP4292497B2 (en) Projection optical system, exposure apparatus, and exposure method
KR100914370B1 (en) Projective optical system, exposing apparatus and exposing method
JP3200894B2 (en) Exposure method and apparatus

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050707

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20070109

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080318

RD05 Notification of revocation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7425

Effective date: 20080423

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20080806