JP2000058436A - Projection aligner and exposure method - Google Patents
Projection aligner and exposure methodInfo
- Publication number
- JP2000058436A JP2000058436A JP10239562A JP23956298A JP2000058436A JP 2000058436 A JP2000058436 A JP 2000058436A JP 10239562 A JP10239562 A JP 10239562A JP 23956298 A JP23956298 A JP 23956298A JP 2000058436 A JP2000058436 A JP 2000058436A
- Authority
- JP
- Japan
- Prior art keywords
- lens
- liquid
- exposure
- photosensitive
- projection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007788 liquids Substances 0.000 claims abstract description 67
- 230000003287 optical Effects 0.000 claims abstract description 56
- 239000000758 substrates Substances 0.000 claims abstract description 18
- 238000005286 illumination Methods 0.000 claims description 4
- 238000007654 immersion Methods 0.000 abstract description 34
- 238000003384 imaging method Methods 0.000 abstract description 17
- 230000004075 alteration Effects 0.000 description 13
- 239000003570 air Substances 0.000 description 8
- 240000006028 Sambucus nigra Species 0.000 description 4
- 239000007789 gases Substances 0.000 description 4
- 239000006185 dispersions Substances 0.000 description 3
- 239000005357 flat glasses Substances 0.000 description 3
- 239000003921 oils Substances 0.000 description 3
- 238000010586 diagrams Methods 0.000 description 2
- 101710062074 KRT222 Proteins 0.000 description 1
- 102100004408 Keratin-like protein KRT222 Human genes 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Exposure apparatus for microlithography
- G03F7/70216—Systems for imaging mask onto workpiece
- G03F7/70325—Resolution enhancement techniques not otherwise provided for, e.g. darkfield imaging, interfering beams, spatial frequency multiplication, nearfield lens
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Exposure apparatus for microlithography
- G03F7/70216—Systems for imaging mask onto workpiece
- G03F7/70341—Immersion
Abstract
It is formed so as to be substantially equal to the distance d 1 on the optical axis Z up to a.
Description
[0001]
The present invention relates to a projection exposure apparatus having a projection optical system for printing and transferring a pattern drawn on an original onto a substrate, and an exposure method.
[0002]
2. Description of the Related Art In recent years, miniaturization of a pattern transferred to a wafer as a photosensitive substrate has been desired. In order to achieve this, there are two methods of reducing the exposure wavelength and increasing the numerical aperture of the projection optical system.
Conventionally, among these methods, a liquid immersion type projection exposure apparatus has been proposed as a method of increasing the numerical aperture of a projection optical system. In an immersion type projection exposure apparatus, a space between the lens surface of the projection optical system closest to the wafer and the wafer, that is, the entire working distance (working distance) (hereinafter referred to as the working space) or the wafer side. Is a device for filling the subspace with a liquid such as oil. For example, the refractive index of air occupying the working space in normal use is 1.0, whereas the refractive index of oil is, for example, about 1.6. Therefore, if the entire working space or the partial space on the wafer side is replaced with such a liquid having a high refractive index, the numerical aperture on the wafer side of the projection optical system can be increased, and the exposure pattern can be miniaturized. it can.
[0003]
In the conventional liquid immersion type projection exposure apparatus, the working space is usually used with a gas such as air, and the entire working space or the wafer side is reduced by miniaturizing the pattern. When using liquid immersion with a partial space as a liquid,
Equivalent imaging performance could not be secured. For example, as a usage method during liquid immersion in which the wafer-side partial space of the working space is liquid, consider a case where a parallel plate glass is installed at the boundary between gas and liquid. In such a case, the following three problems occur.
The first problem is that when using liquid immersion, the position of the image formed by the projection optical system shifts due to refraction of light on the incident surface of the parallel plate glass. Therefore, it is necessary to move the projection optical system or the wafer so as to secure the focal length. Then, depending on the conditions at the time of using the liquid immersion, the imaging position may not be able to be adjusted on the wafer. The second problem is that a spherical aberration is caused by the parallel flat glass placed at the boundary between the gas and the liquid when the liquid immersion is used. As a result, the imaging performance is deteriorated when using the liquid immersion. Third, there is a problem that a change in imaging performance and an imaging position at the time of using the liquid immersion becomes large due to environmental fluctuation. That is, since the refractive index of the liquid changes significantly due to environmental changes such as temperature changes as compared with the refractive index of the gas, the imaging performance and the imaging position are not stable. Therefore, the present invention provides a projection exposure system in which, even when the projection optical system is used in the liquid immersion state, the imaging position by the projection optical system and the imaging performance near the optical axis are less changed than when the projection optical system is used in the normal state. It is an object to provide an apparatus and an exposure method.
[0005]
SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problem. That is, when the reference numerals in FIG. 1 and FIG. In a projection exposure apparatus having a projection optical system (2) for transferring a pattern (1a) drawn on an original (1) to a photosensitive surface (5a) of a substrate (5), 5) Side lens surface and photosensitive surface (5a)
Auxiliary lens (4) is removably arranged in the space with
The space between the lower surface of the auxiliary lens (4) and the photosensitive surface (5a)
The radius of curvature (R 1 ) of the lens surface on the master (1) side of the auxiliary lens (4) is formed on the optical axis (Z) from the lens surface on the master (1) side to the photosensitive surface (5a). Distance (d 1 )
The projection exposure apparatus is formed so as to be substantially equal to the following. At this time, if the reference numerals given in FIG. 3 of the attached drawings are further added in parentheses, the radius of curvature (R 2 ) of the lens surface on the substrate (5) side of the auxiliary lens (4) is
It is preferable that the distance between the side lens surface and the photosensitive surface (5a) be substantially equal to the distance (d 2 ) on the optical axis (Z).
Further, according to the present invention, when the reference numerals given in FIGS. 1 and 4 of the accompanying drawings are added in parentheses, the pattern (1a) drawn on the original (1) is used for the photosensitive surface (5) of the substrate (5).
a) In a projection exposure apparatus having a projection optical system (2) for transferring to the substrate (5), the radius of curvature (R 2 ) of the lens surface closest to the substrate (5) of the projection optical system ( 2 ) is set to a projection exposure apparatus characterized in that it is formed to be substantially equal to the distance (d 2) on the optical axis (Z) from the surface to the photosensitive surface (5a). Further, according to the present invention, in the method of exposing using the projection exposure apparatus having the above-described configuration, the illumination step of illuminating the original (1) with predetermined exposure light is described with the reference numerals in parentheses in FIG. And an exposure step of exposing the pattern image (1a) of the original (1) to the photosensitive surface (5a) of the substrate (5) via the projection optical system (2).
[0007]
Embodiments of the present invention will be described with reference to the drawings. 1 and 2 show a first embodiment of a projection exposure apparatus according to the present invention. FIG. 1 is a view showing a projection exposure apparatus during normal use according to a first embodiment of the present invention. The first embodiment employs an exposure method including an illumination step and an exposure step,
The image of the pattern surface 1a of the reticle 1 is transferred to the image surface 5a of the wafer 5.
(Photosensitive surface). That is, a light beam emitted from a light source 10 such as a KrF excimer laser light source is
After that, the pattern surface 1a of the reticle 1 as an original placed on the reticle stage 12 is uniformly illuminated. Exposure light emitted from the pattern surface 1a of the reticle 1
The image of the pattern surface 1a is formed on the image surface 5a of the wafer 5 placed on the XY stage 8 via the projection optical system 2. The normal use refers to a state in which the working space is only air.
Here, on the XY stage 8, a rotating shaft 7 is provided.
Auxiliary lens 4 held by lens holder 3 with
Is installed. The auxiliary lens 4 is rotatable about a rotation shaft 7. When rotated 180 ° from the position shown in FIG.
Is placed directly below. At this time, the optical axis of the auxiliary lens 4 matches the optical axis of the projection optical system 2. On the XY stage 8, a box-shaped liquid shielding plate 6 is provided.
FIG. 1 shows only a cross section of the liquid shielding plate 6 for simplicity.
Then, a liquid such as oil is put into a space surrounded by the liquid shielding plate 6, and a partial space on the wafer 5 side of the working space can be made liquid. When the projection exposure apparatus according to the first embodiment is used in a liquid immersion state, the auxiliary lens 4 is disposed immediately below the projection optical system 2, and the liquid is introduced into the liquid shielding plate 6. At this time, the space between the upper surface of the auxiliary lens 4 (the surface on the reticle 1 side) and the lower surface of the projection optical system 2 (the surface closest to the wafer 5) is air. Then, the lower surface of the auxiliary lens 4 (the surface on the wafer 5 side)
, And the liquid between the wafer 5. The broken line M in FIG.
Shows the boundary between air and liquid.
FIG. 2 is an enlarged view of the vicinity of the auxiliary lens 4 in the projection exposure apparatus when using liquid immersion according to the first embodiment of the present invention. As described above, when the liquid immersion is used, the space on the upper surface side of the auxiliary lens 4 is air A, and the space on the lower surface side of the auxiliary lens 4 is liquid L. Further, the refractive index of the auxiliary lens 4 in the first embodiment is substantially equal to the refractive index of the liquid L. The shape of the upper surface of the auxiliary lens 4 is such that all the light rays K imaged at the center of the image plane 5a on the wafer 5 are vertically incident. That is, the center of curvature of the upper surface of the auxiliary lens 4 coincides with the center of the image plane 5a in normal use where there is no auxiliary lens 4 and no liquid L. The radius of curvature R 1 of the upper surface of the auxiliary lens 4 satisfies the following equation. R 1 = d 1 (1) d 1 : distance on the optical axis Z from the upper surface of the auxiliary lens 4 to the wafer image plane 5a
On the other hand, the lower surface of the auxiliary lens 4 has a planar shape. As described above, since the refractive index of the auxiliary lens 4 and that of the liquid L are equal, all the light rays K imaged in the vicinity of the center of the image plane 5 a
Like the upper surface, it hardly bends. Therefore, the half angle of convergence during use of the liquid immersion is equal to the half angle of convergence during normal use. At this time, the numerical aperture N of the projection optical system 2 on the wafer 5 side
A is obtained by NA = n sin θ n: refractive index of liquid to air θ: half angle of convergence. The resolution Δr is obtained by the following equation. Δr = kλ 0 / NA λ 0 : refractive index of exposure light in air k: constant
Therefore, when using the liquid immersion, the numerical aperture can be increased by n times and the resolution near the center of the image plane 5a can be improved to 1 / n as compared with the normal use. Further, in the first embodiment, all the light rays K imaged at the center of the image plane 5a are not refracted by the auxiliary lens 4, so that no spherical aberration occurs. Further, when the chromatic dispersion of the auxiliary lens 4 is equal to the chromatic dispersion of the liquid L, no axial chromatic aberration occurs. As a result, on the image plane 5a near the optical axis Z, the imaging performance during normal use is substantially maintained even during liquid immersion use.
Further, there is no change in the image forming position by the projection optical system 5 between the time of using the liquid immersion and the time of normal use.
Next, FIG. 3 shows a second embodiment of the projection exposure apparatus according to the present invention. In the second embodiment, the auxiliary lens 4
Only the shape is different from the first embodiment. FIG. 3 is an enlarged view of the vicinity of the auxiliary lens 4 in the projection exposure apparatus at the time of using the liquid immersion according to the second embodiment of the present invention. The shape of the upper surface of the auxiliary lens 4 of the second embodiment is the same as that of the first embodiment.
It is equal to the shape of the upper surface of the auxiliary lens 4 of the embodiment. That is, the relationship of the expression (1) is established in the upper surface portion.
On the other hand, the lower surface of the auxiliary lens 4 of the first embodiment has a planar shape, whereas the lower surface of the auxiliary lens 4 of the second embodiment has a curved surface. The lower surface shape is such that all the light rays K imaged at the center of the image plane 5a on the wafer 5 are vertically incident, as in the upper surface shape. That is, the center of curvature of the lower surface of the auxiliary lens 4 coincides with the center of the image plane 5a in normal use. Then, the curvature radius R 2 of the lower surface of the auxiliary lens 4
Satisfies the following equation. R 2 = d 2 (2) d 2 : distance on the optical axis Z from the lower surface of the auxiliary lens 4 to the wafer image plane 5a
According to the second embodiment, even when the refractive index of the auxiliary lens 4 is different from that of the liquid L, or when the refractive index of the liquid L changes due to environmental fluctuation such as temperature change, aberrations and / or aberrations may occur. Little change in image position. That is, the light rays K of all the wavelengths imaged at the center of the image plane 5a are not refracted on the lower surface of the auxiliary lens 4 irrespective of the refractive index or chromatic dispersion of the liquid L. Therefore, also in the second embodiment, the first
As in the embodiment, high resolution can be obtained when using immersion. Further, even when the normal use and the liquid immersion use are compared, the image forming position by the projection optical system 2 does not change, and the image plane 5a
The imaging performance on the image plane 5a near the optical axis Z is maintained without any change in axial chromatic aberration or spherical aberration at the time. Further, even if the refractive index of the liquid L changes due to a temperature change or the like, there is no change in the imaging position, axial chromatic aberration, and spherical aberration.
FIG. 4 shows a third embodiment of the projection exposure apparatus according to the present invention. In the first and second embodiments, a part of the partial space on the wafer 5 side of the working space is used as the liquid when using the liquid immersion, but in the third embodiment, the whole working space is used as the liquid when using the liquid immersion. That is, when the liquid immersion is used, the surface of the projection optical system 2 closest to the wafer 5 is immersed in the liquid. Therefore, the projection exposure apparatus of the third embodiment is different from that of FIG.
Must be higher than the lower surface of the projection optical system 2. Further, the lens holder 3, the auxiliary lens 4, and the lens holder 3 shown in FIG.
The rotating shaft 7 becomes unnecessary.
FIG. 4 is an enlarged view of the surface of the projection optical system 2 closest to the wafer 5 when the liquid immersion is used. The shape of the surface of the projection optical system 2 closest to the wafer 5 is equal to the shape of the lower surface of the auxiliary lens 4 in the second embodiment. That is, the relationship of the expression (2) is established on the lower surface. On the other hand, even in the normal use, the projection optical system 2 shown in FIG. 4 is used. However, as in the case of using the liquid immersion, all the light rays K imaged near the center of the image plane 5a are not refracted. . Also in the third embodiment, high resolution can be obtained when using liquid immersion, as in the second embodiment. Further, even when the normal use and the liquid immersion use are compared, the image forming position by the projection optical system 2 does not change, there is no change in the axial chromatic aberration and the spherical aberration on the image plane 5a, and there is no change in the vicinity of the optical axis Z. Is maintained on the image plane 5a. Further, even if the refractive index of the liquid L changes due to a temperature change or the like, there is no change in the imaging position, axial chromatic aberration, and spherical aberration.
[0017]
As described above, according to the present invention, the projection exposure apparatus can be used in both the normal state and the liquid immersion state. In addition, it is possible to provide a projection exposure apparatus in which the imaging performance near the imaging position and the optical axis hardly changes even when the liquid immersion is used. Further, it is possible to provide a projection exposure apparatus and an exposure method which are less affected by a change in the refractive index of the liquid.
FIG. 1 is a view showing a projection exposure apparatus according to a first embodiment of the present invention.
FIG. 2 is a diagram showing a state of the projection exposure apparatus according to the first embodiment of the present invention when using liquid immersion.
FIG. 3 is a view showing a state of a projection exposure apparatus according to a second embodiment of the present invention when using liquid immersion.
FIG. 4 is a diagram showing a state of a projection exposure apparatus according to a third embodiment of the present invention when using liquid immersion.
DESCRIPTION OF SYMBOLS 1 ... Reticle 1a ... Pattern surface 2 ... Projection optical system 3 ... Lens holder 4 ... Auxiliary lens 5 ... Wafer 5a ... Image surface 6 ... Liquid shielding plate 7 ... Rotation axis 8 ... XY stage 10 ... Light source 11 ... Illumination optical system 12 ... Reticle stage Z: Optical axis K: Ray A: Gas L: Liquid
──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2H087 KA21 LA00 NA04 PA01 PB01 QA01 QA03 5F046 BA03 CA04 CB12 CB25 CB26 CB27 DA13
Claims (4)
A projection exposure apparatus formed to be substantially equal to a distance on the optical axis from the lens surface on the substrate side to the photosensitive surface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10239562A JP2000058436A (en) | 1998-08-11 | 1998-08-11 | Projection aligner and exposure method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10239562A JP2000058436A (en) | 1998-08-11 | 1998-08-11 | Projection aligner and exposure method |
Publications (1)
Publication Number | Publication Date |
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JP2000058436A true JP2000058436A (en) | 2000-02-25 |
Family
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Family Applications (1)
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JP10239562A Pending JP2000058436A (en) | 1998-08-11 | 1998-08-11 | Projection aligner and exposure method |
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JP (1) | JP2000058436A (en) |
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US7339650B2 (en) | 2003-04-09 | 2008-03-04 | Nikon Corporation | Immersion lithography fluid control system that applies force to confine the immersion liquid |
US7345742B2 (en) | 2003-04-10 | 2008-03-18 | Nikon Corporation | Environmental system including a transport region for an immersion lithography apparatus |
US7352440B2 (en) | 2004-12-10 | 2008-04-01 | Asml Netherlands B.V. | Substrate placement in immersion lithography |
US7352435B2 (en) | 2003-10-15 | 2008-04-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
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US7379155B2 (en) | 2004-10-18 | 2008-05-27 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7379159B2 (en) | 2004-05-03 | 2008-05-27 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7378025B2 (en) | 2005-02-22 | 2008-05-27 | Asml Netherlands B.V. | Fluid filtration method, fluid filtered thereby, lithographic apparatus and device manufacturing method |
US7397532B2 (en) | 2003-04-10 | 2008-07-08 | Nikon Corporation | Run-off path to collect liquid for an immersion lithography apparatus |
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US7405805B2 (en) | 2004-12-28 | 2008-07-29 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7408652B2 (en) | 2002-12-20 | 2008-08-05 | Carl Zeiss Smt Ag | Device and method for the optical measurement of an optical system by using an immersion fluid |
US7411657B2 (en) | 2004-11-17 | 2008-08-12 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7411654B2 (en) | 2005-04-05 | 2008-08-12 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7411658B2 (en) | 2005-10-06 | 2008-08-12 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7414699B2 (en) | 2004-11-12 | 2008-08-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
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US7423720B2 (en) | 2004-11-12 | 2008-09-09 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP2008219017A (en) * | 2003-12-23 | 2008-09-18 | Asml Netherlands Bv | Lithographic apparatus, alignment apparatus, device manufacturing method, aligning method, and method of converting apparatus |
US7428038B2 (en) | 2005-02-28 | 2008-09-23 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and apparatus for de-gassing a liquid |
US7433015B2 (en) | 2003-10-15 | 2008-10-07 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7433016B2 (en) | 2005-05-03 | 2008-10-07 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7433019B2 (en) | 2003-07-09 | 2008-10-07 | Nikon Corporation | Exposure apparatus and device manufacturing method |
US7443482B2 (en) | 2003-04-11 | 2008-10-28 | Nikon Corporation | Liquid jet and recovery system for immersion lithography |
US7446850B2 (en) | 2004-12-03 | 2008-11-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7450217B2 (en) | 2005-01-12 | 2008-11-11 | Asml Netherlands B.V. | Exposure apparatus, coatings for exposure apparatus, lithographic apparatus, device manufacturing method, and device manufactured thereby |
CN100433253C (en) * | 2003-02-26 | 2008-11-12 | 株式会社尼康 | Exposure apparatus, exposure method, and method for producing device |
US7456929B2 (en) | 2004-10-15 | 2008-11-25 | Nikon Corporation | Exposure apparatus and device manufacturing method |
US7468779B2 (en) | 2005-06-28 | 2008-12-23 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7474379B2 (en) | 2005-06-28 | 2009-01-06 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7486381B2 (en) | 2004-05-21 | 2009-02-03 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7491661B2 (en) | 2004-12-28 | 2009-02-17 | Asml Netherlands B.V. | Device manufacturing method, top coat material and substrate |
US7501220B2 (en) * | 2003-01-31 | 2009-03-10 | Tokyo Ohka Kogyo Co., Ltd. | Resist composition |
US7522261B2 (en) | 2004-09-24 | 2009-04-21 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7524618B2 (en) | 2004-03-24 | 2009-04-28 | Kabushiki Kaisha Toshiba | Resist pattern forming method, semiconductor apparatus using said method, and exposure apparatus thereof |
US7528931B2 (en) | 2004-12-20 | 2009-05-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7532306B2 (en) | 2003-05-30 | 2009-05-12 | Carl Zeiss Smt Ag | Microlithographic projection exposure apparatus |
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US7583357B2 (en) | 2004-11-12 | 2009-09-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7623218B2 (en) | 2004-11-24 | 2009-11-24 | Carl Zeiss Smt Ag | Method of manufacturing a miniaturized device |
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US7649611B2 (en) | 2005-12-30 | 2010-01-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
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US7656501B2 (en) | 2005-11-16 | 2010-02-02 | Asml Netherlands B.V. | Lithographic apparatus |
US7670730B2 (en) | 2004-12-30 | 2010-03-02 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7684010B2 (en) | 2005-03-09 | 2010-03-23 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method, seal structure, method of removing an object and a method of sealing |
US7697110B2 (en) | 2004-01-26 | 2010-04-13 | Nikon Corporation | Exposure apparatus and device manufacturing method |
US7697111B2 (en) | 2003-08-26 | 2010-04-13 | Nikon Corporation | Optical element and exposure apparatus |
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US7705962B2 (en) | 2005-01-14 | 2010-04-27 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP2010098328A (en) * | 2003-09-29 | 2010-04-30 | Nikon Corp | Exposure apparatus, method for exposure, and method for manufacturing device |
US7719658B2 (en) | 2004-02-13 | 2010-05-18 | Carl Zeiss Smt Ag | Imaging system for a microlithographical projection light system |
US7733459B2 (en) | 2003-08-29 | 2010-06-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7738074B2 (en) | 2003-07-16 | 2010-06-15 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7751027B2 (en) | 2005-06-21 | 2010-07-06 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7759631B2 (en) * | 2008-01-22 | 2010-07-20 | Nanosurf Ag | Raster scanning microscope having transparent optical element with inner curved surface |
KR100971440B1 (en) | 2002-12-19 | 2010-07-21 | 코닌클리케 필립스 일렉트로닉스 엔.브이. | Method and device for irradiating spots on a layer |
US7773195B2 (en) | 2005-11-29 | 2010-08-10 | Asml Holding N.V. | System and method to increase surface tension and contact angle in immersion lithography |
US7791709B2 (en) | 2006-12-08 | 2010-09-07 | Asml Netherlands B.V. | Substrate support and lithographic process |
US7804574B2 (en) | 2003-05-30 | 2010-09-28 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method using acidic liquid |
US7804576B2 (en) | 2004-12-06 | 2010-09-28 | Nikon Corporation | Maintenance method, maintenance device, exposure apparatus, and device manufacturing method |
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US7804577B2 (en) | 2005-11-16 | 2010-09-28 | Asml Netherlands B.V. | Lithographic apparatus |
US7812926B2 (en) | 2005-08-31 | 2010-10-12 | Nikon Corporation | Optical element, exposure apparatus based on the use of the same, exposure method, and method for producing microdevice |
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US7830611B2 (en) | 2005-07-25 | 2010-11-09 | Carl Zeiss Smt Ag | Projection objective of a microlithographic projection exposure apparatus |
US7834974B2 (en) | 2005-06-28 | 2010-11-16 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
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US7839483B2 (en) | 2005-12-28 | 2010-11-23 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and a control system |
US7864292B2 (en) | 2005-11-16 | 2011-01-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7872730B2 (en) | 2006-09-15 | 2011-01-18 | Nikon Corporation | Immersion exposure apparatus and immersion exposure method, and device manufacturing method |
US7894040B2 (en) | 2004-10-05 | 2011-02-22 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7898643B2 (en) | 2003-06-27 | 2011-03-01 | Asml Holding N.V. | Immersion photolithography system and method using inverted wafer-projection optics interface |
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US7932996B2 (en) | 2003-10-28 | 2011-04-26 | Nikon Corporation | Exposure apparatus, exposure method, and device fabrication method |
US7948604B2 (en) | 2002-12-10 | 2011-05-24 | Nikon Corporation | Exposure apparatus and method for producing device |
US7973910B2 (en) | 2006-11-17 | 2011-07-05 | Nikon Corporation | Stage apparatus and exposure apparatus |
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US8018573B2 (en) | 2005-02-22 | 2011-09-13 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
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US8035799B2 (en) | 2004-12-09 | 2011-10-11 | Nikon Corporation | Exposure apparatus, exposure method, and device producing method |
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US8054445B2 (en) | 2005-08-16 | 2011-11-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
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US8111374B2 (en) | 2005-09-09 | 2012-02-07 | Nikon Corporation | Analysis method, exposure method, and device manufacturing method |
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US8164736B2 (en) | 2007-05-29 | 2012-04-24 | Nikon Corporation | Exposure method, exposure apparatus, and method for producing device |
US8179517B2 (en) | 2005-06-30 | 2012-05-15 | Nikon Corporation | Exposure apparatus and method, maintenance method for exposure apparatus, and device manufacturing method |
US8203693B2 (en) | 2005-04-19 | 2012-06-19 | Asml Netherlands B.V. | Liquid immersion lithography system comprising a tilted showerhead relative to a substrate |
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US8208119B2 (en) | 2004-02-04 | 2012-06-26 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
US8208124B2 (en) | 2003-08-29 | 2012-06-26 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8208123B2 (en) | 2003-08-29 | 2012-06-26 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8236467B2 (en) | 2005-04-28 | 2012-08-07 | Nikon Corporation | Exposure method, exposure apparatus, and device manufacturing method |
US8237915B2 (en) | 2002-12-10 | 2012-08-07 | Carl Zeiss Smt Gmbh | Method for improving an optical imaging property of a projection objective of a microlithographic projection exposure apparatus |
US8248577B2 (en) | 2005-05-03 | 2012-08-21 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8253921B2 (en) | 2003-09-03 | 2012-08-28 | Nikon Corporation | Exposure apparatus and device fabricating method |
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US8319939B2 (en) | 2004-07-07 | 2012-11-27 | Asml Netherlands B.V. | Immersion lithographic apparatus and device manufacturing method detecting residual liquid |
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US8373843B2 (en) | 2004-06-10 | 2013-02-12 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
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US8488099B2 (en) | 2004-04-19 | 2013-07-16 | Nikon Corporation | Exposure apparatus and device manufacturing method |
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JP2013191871A (en) * | 2013-05-13 | 2013-09-26 | Nikon Corp | Cata-dioptric type projection optical system, exposure device, and exposure method |
US20130271945A1 (en) | 2004-02-06 | 2013-10-17 | Nikon Corporation | Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method |
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US8629418B2 (en) * | 2005-02-28 | 2014-01-14 | Asml Netherlands B.V. | Lithographic apparatus and sensor therefor |
US8634053B2 (en) | 2006-12-07 | 2014-01-21 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8638415B2 (en) | 2004-05-18 | 2014-01-28 | Asml Netherlands B.V. | Active drying station and method to remove immersion liquid using gas flow supply with gas outlet between two gas inlets |
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US8698998B2 (en) | 2004-06-21 | 2014-04-15 | Nikon Corporation | Exposure apparatus, method for cleaning member thereof, maintenance method for exposure apparatus, maintenance device, and method for producing device |
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US8797502B2 (en) | 2003-09-29 | 2014-08-05 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device with electricity removal device by adding additive to liquid |
JP2014160274A (en) * | 2014-04-21 | 2014-09-04 | Nikon Corp | Projection optical system, exposure device, exposure method, and method of manufacturing the device |
KR20140114461A (en) * | 2004-06-10 | 2014-09-26 | 가부시키가이샤 니콘 | Exposure apparatus, exposure method, and device producing method |
JP2014194552A (en) * | 2014-04-28 | 2014-10-09 | Nikon Corp | Cata-dioptric type projection optical system, exposure device, and exposure method |
US8860922B2 (en) | 2003-10-28 | 2014-10-14 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8859188B2 (en) | 2005-02-10 | 2014-10-14 | Asml Netherlands B.V. | Immersion liquid, exposure apparatus, and exposure process |
US8860923B2 (en) | 2003-10-28 | 2014-10-14 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP2014199461A (en) * | 2004-07-14 | 2014-10-23 | カール・ツァイス・エスエムティー・ゲーエムベーハー | Catadioptric projection objective |
US8891053B2 (en) | 2008-09-10 | 2014-11-18 | Asml Netherlands B.V. | Lithographic apparatus, method of manufacturing an article for a lithographic apparatus and device manufacturing method |
US8902401B2 (en) | 2006-05-09 | 2014-12-02 | Carl Zeiss Smt Gmbh | Optical imaging device with thermal attenuation |
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KR101469405B1 (en) * | 2003-04-10 | 2014-12-10 | 가부시키가이샤 니콘 | Environmental system including vaccum scavange for an immersion lithography apparatus |
US8913316B2 (en) | 2004-05-17 | 2014-12-16 | Carl Zeiss Smt Gmbh | Catadioptric projection objective with intermediate images |
US8928856B2 (en) | 2003-10-31 | 2015-01-06 | Nikon Corporation | Exposure apparatus and device fabrication method |
US8937704B2 (en) | 2003-07-31 | 2015-01-20 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method involving a resistivity sensor |
US8941811B2 (en) | 2004-12-20 | 2015-01-27 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8947637B2 (en) | 2003-08-29 | 2015-02-03 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8947629B2 (en) | 2007-05-04 | 2015-02-03 | Asml Netherlands B.V. | Cleaning device, a lithographic apparatus and a lithographic apparatus cleaning method |
US8964164B2 (en) | 2003-05-13 | 2015-02-24 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8964163B2 (en) | 2003-07-28 | 2015-02-24 | Asml Netherlands B.V. | Immersion lithographic apparatus and device manufacturing method with a projection system having a part movable relative to another part |
US9013672B2 (en) | 2007-05-04 | 2015-04-21 | Asml Netherlands B.V. | Cleaning device, a lithographic apparatus and a lithographic apparatus cleaning method |
KR101529844B1 (en) * | 2003-06-19 | 2015-06-17 | 가부시키가이샤 니콘 | Exposure device and device producing method |
US9081295B2 (en) | 2003-05-06 | 2015-07-14 | Nikon Corporation | Catadioptric projection optical system, exposure apparatus, and exposure method |
US9097992B2 (en) | 2004-08-19 | 2015-08-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9110389B2 (en) | 2003-06-11 | 2015-08-18 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9134622B2 (en) | 2003-11-14 | 2015-09-15 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9207543B2 (en) | 2004-04-14 | 2015-12-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method involving a groove to collect liquid |
US9224632B2 (en) | 2004-12-15 | 2015-12-29 | Nikon Corporation | Substrate holding apparatus, exposure apparatus, and device fabricating method |
EP2960702A1 (en) * | 2003-09-03 | 2015-12-30 | Nikon Corporation | Apparatus and method for providing fluid for immersion lithography |
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US9256136B2 (en) | 2010-04-22 | 2016-02-09 | Asml Netherlands B.V. | Fluid handling structure, lithographic apparatus and device manufacturing method involving gas supply |
US9329060B2 (en) | 2006-02-21 | 2016-05-03 | Nikon Corporation | Measuring apparatus and method, processing apparatus and method, pattern forming apparatus and method, exposure apparatus and method, and device manufacturing method |
JP2016075931A (en) * | 2015-11-30 | 2016-05-12 | 株式会社ニコン | Exposure equipment, exposure method, and device production method |
US9341954B2 (en) | 2007-10-24 | 2016-05-17 | Nikon Corporation | Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method |
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US9477158B2 (en) | 2006-04-14 | 2016-10-25 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
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-
1998
- 1998-08-11 JP JP10239562A patent/JP2000058436A/en active Pending
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US10234768B2 (en) | 2004-04-14 | 2019-03-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
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US9829799B2 (en) | 2004-04-14 | 2017-11-28 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
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WO2005106930A1 (en) * | 2004-04-27 | 2005-11-10 | Nikon Corporation | Exposure method, exposure system, and method for fabricating device |
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US9623436B2 (en) | 2004-05-18 | 2017-04-18 | Asml Netherlands B.V. | Active drying station and method to remove immersion liquid using gas flow supply with gas outlet between two gas inlets |
US8638415B2 (en) | 2004-05-18 | 2014-01-28 | Asml Netherlands B.V. | Active drying station and method to remove immersion liquid using gas flow supply with gas outlet between two gas inlets |
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US7486381B2 (en) | 2004-05-21 | 2009-02-03 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9429495B2 (en) | 2004-06-04 | 2016-08-30 | Carl Zeiss Smt Gmbh | System for measuring the image quality of an optical imaging system |
JP2008502127A (en) * | 2004-06-04 | 2008-01-24 | カール・ツァイス・エスエムティー・アーゲー | Projection system with compensation for intensity variation and compensation element therefor |
JP2012028803A (en) * | 2004-06-04 | 2012-02-09 | Carl Zeiss Smt Gmbh | Projection system with compensation of intensity variations and compensation element therefor |
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KR20140114461A (en) * | 2004-06-10 | 2014-09-26 | 가부시키가이샤 니콘 | Exposure apparatus, exposure method, and device producing method |
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US9507270B2 (en) | 2004-06-16 | 2016-11-29 | Asml Netherlands B.V. | Vacuum system for immersion photolithography |
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WO2005124833A1 (en) * | 2004-06-21 | 2005-12-29 | Nikon Corporation | Exposure device, exposure device member cleaning method, exposure device maintenance method, maintenance device, and device manufacturing method |
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JP4677833B2 (en) * | 2004-06-21 | 2011-04-27 | 株式会社ニコン | EXPOSURE APPARATUS, METHOD FOR CLEANING ITS MEMBER, EXPOSURE APPARATUS MAINTENANCE METHOD, MAINTENANCE EQUIPMENT AND DEVICE MANUFACTURING METHOD |
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US7161663B2 (en) | 2004-07-22 | 2007-01-09 | Asml Netherlands B.V. | Lithographic apparatus |
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US10599054B2 (en) | 2004-08-19 | 2020-03-24 | Asml Holding N.V. | Lithographic apparatus and device manufacturing method |
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WO2006053751A3 (en) * | 2004-11-18 | 2006-10-12 | Zeiss Carl Smt Ag | Projection lens system of a microlithographic projection exposure installation |
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