JP3817836B2 - Exposure apparatus, its manufacturing method, exposure method, and device manufacturing method - Google Patents

Exposure apparatus, its manufacturing method, exposure method, and device manufacturing method Download PDF

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Publication number
JP3817836B2
JP3817836B2 JP15198597A JP15198597A JP3817836B2 JP 3817836 B2 JP3817836 B2 JP 3817836B2 JP 15198597 A JP15198597 A JP 15198597A JP 15198597 A JP15198597 A JP 15198597A JP 3817836 B2 JP3817836 B2 JP 3817836B2
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Prior art keywords
optical system
liquid
projection optical
refractive index
photosensitive substrate
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JPH10340846A (en
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威人 工藤
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株式会社ニコン
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70216Systems for imaging mask onto workpiece
    • G03F7/70341Immersion

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an exposure apparatus provided with a projection optical system for projecting a device pattern provided on a reticle onto a photosensitive substrate, an exposure method using the exposure apparatus, and a device manufacturing method. More particularly, the present invention relates to an immersion type exposure apparatus in which a liquid is filled in an optical path between a projection optical system and a photosensitive substrate. The present invention is suitable for manufacturing a semiconductor element, an image pickup element (CCD or the like), a liquid crystal display element, a thin film magnetic head, or the like.
[0002]
[Prior art]
The space between the final surface of the optical system and the image plane is called working distance. In the projection optical system of the conventional exposure apparatus, the working distance is filled with air. By the way, in the process of manufacturing an IC or LSI, it is always desired to make a pattern exposed on a silicon wafer finer. For this purpose, the wavelength of light used for exposure is shortened, or the numerical aperture on the image side. Need to be larger. As the wavelength of light becomes shorter, the number of glass materials having a transmittance sufficient to secure a sufficient amount of light for exposure while obtaining satisfactory imaging performance decreases.
[0003]
Therefore, it has been proposed to increase the numerical aperture on the image side by making the final medium up to the image plane a liquid having a refractive index greater than that of air, and an exposure apparatus having a projection optical system using such a liquid. Is called an immersion type exposure apparatus.
In the exposure apparatus, in order to correct the imaging performance of the projection optical system, the imaging performance correction for adjusting the imaging performance in the most object side optical path or the most image side optical path of the projection optical system. A technique is known in which members are replaceably provided.
[0004]
[Problems to be solved by the invention]
However, since the immersion type exposure apparatus is configured to fill the liquid in the optical path (working distance) between the projection optical system and the photosensitive substrate, it is difficult to arrange a member for correcting the imaging performance. is there. In addition, since there are only a limited number of such imaging performance correction members that can be prepared in consideration of a realistic apparatus configuration, there is a problem that the imaging performance can be corrected only discretely. .
[0005]
In addition, the imaging performance of the projection optical system needs to be within a predetermined allowable range. However, if the imaging performance can be corrected only discretely as described above, it is difficult to keep the imaging performance within the predetermined allowable range. It becomes. In particular, when a finer exposure pattern or an increased exposure area is required, the allowable range of the imaging performance is narrowed, and when performing a scanning exposure method in which exposure is performed while scanning a reticle and a photosensitive substrate. However, the allowable range of fluctuation range of the imaging performance characteristics is narrow, and it cannot be handled by discrete correction.
[0006]
Further, when the imaging performance correcting member is replaced as described above, the projection optical system itself vibrates, which may adversely affect the imaging performance.
Therefore, a first object of the present invention is to enable continuous image forming performance correction without vibration.
The second object of the present invention is to achieve both the increase in the numerical aperture of the projection optical system and the correction of the imaging performance.
[0007]
[Means for Solving the Problems]
In order to achieve the first object, an exposure apparatus according to the present invention includes an illumination optical system that illuminates a pattern provided on a reticle, and a projection optical system that forms an image of the pattern on a photosensitive substrate. An exposure apparatus that performs exposure through a liquid located in at least a part of an optical path between the projection optical system and the photosensitive substrate, Supplying an additive to the liquid; It has a refractive index adjusting means for adjusting the refractive index of the liquid.
[0008]
Here, according to a preferred aspect recited in claim 2, the refractive index adjusting means adjusts the refractive index of the liquid so as to correct the imaging performance of the projection optical system.
An exposure apparatus according to the present invention includes an illumination optical system that illuminates a pattern provided on a reticle, and a projection optical system that forms an image of the pattern on a photosensitive substrate. An exposure apparatus that performs exposure through a liquid located in at least a part of an optical path between a substrate and an image forming apparatus, an image forming performance measuring unit that measures an image forming performance of a projection optical system, and the image forming performance is corrected. In this way, a refractive index adjusting means for adjusting the refractive index of the liquid is provided.
[0009]
An exposure apparatus according to the present invention includes an illumination optical system that illuminates a pattern provided on a reticle, and a projection optical system that forms an image of the pattern on a photosensitive substrate. An exposure apparatus that performs exposure through a liquid located in at least a part of an optical path between the substrate and a substrate, the variation factor detecting means for detecting a state of a factor of variation in imaging performance of the projection optical system, and the connection And a refractive index adjusting means for adjusting the refractive index of the liquid so as to correct the image performance.
Based on this configuration, according to a preferred aspect recited in claim 5, the illumination optical system is configured to be able to change the illumination condition for the reticle, and the variation factor detecting means detects the condition of the illumination condition and refracts the light. The rate adjusting means adjusts the refractive index of the liquid so as to correct the imaging performance according to a change in illumination conditions.
[0010]
According to a preferred aspect of the present invention, the variation factor detecting means determines the type of the reticle, and the refractive index adjusting means corrects the imaging performance according to the type of the reticle. The refractive index of the liquid is adjusted.
In order to achieve the second object described above, it is preferable to fill the entire optical path between the projection optical system and the photosensitive substrate with a liquid. At this time, the exposure apparatus according to the present invention supplies a side wall for filling the optical path between the projection optical system and the photosensitive substrate with the liquid, supplies the liquid to the photosensitive substrate holder, and collects the liquid from the photosensitive substrate holder. It is preferable to further include a photosensitive substrate holder that includes a supply / recovery unit for holding the photosensitive substrate.
[0011]
The refractive index adjusting means preferably includes an additive supply unit for supplying an additive for adjusting the refractive index to the liquid, and an additive recovery unit for recovering the additive from the liquid.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
In the present invention having the above-described configuration, since the refractive index of the liquid located in the optical path between the projection optical system and the photosensitive substrate can be adjusted, the change in the refractive index changes the image of the projection optical system. The performance can be corrected. Here, as a method of adjusting the refractive index, if the liquid is a mixed liquid of many substances, the refractive index n of the mixed liquid is in accordance with the Lorentz-Lorenz equation,
[0013]
[Expression 1]
[0014]
It becomes.
However,
[0015]
[Expression 2]
[0016]
It is.
For example, when the liquid is an aqueous solution, the refractive index of the aqueous solution changes according to the concentration of the aqueous solution itself. Therefore, the concentration of the substance added to the aqueous solution may be increased or decreased.
Thus, if the refractive index of the liquid is changed so that the refractive index value can compensate for the imaging performance of the projection optical system, the imaging performance of the projection optical system will be good.
[0017]
Here, the adjustment of the refractive index may be performed by measuring the imaging performance such as the aberration of the projection optical system, and adjusting the refractive index according to the result, corresponding to the fluctuation of the imaging performance of the projection optical system. The refractive index may be adjusted according to the detection result.
In the former method of measuring the imaging performance of the projection optical system, the aberration of the projection optical system is measured when the exposure apparatus is manufactured, and the refractive index value that compensates for this aberration is set to the initial value of the refractive index of the liquid. You may do it. Thus, if the refractive index is adjusted as part of the adjustment at the time of manufacture, there is an advantage that the manufacture and adjustment becomes easy. Further, an aberration measuring mechanism or the like may be provided in the exposure apparatus itself, and the refractive index of the liquid may be changed according to the aberration measurement result by the aberration measuring mechanism.
[0018]
On the other hand, variations in factors corresponding to the latter variation in imaging performance include the type of reticle, the state of illumination conditions, the amount of exposure energy passing through the projection optical system, and the like. Here, the illumination conditions for illuminating the reticle (σ value, modified illumination, etc.) are determined optimally depending on the type of pattern provided on the reticle, and if this illumination condition changes, the projection optical system Imaging performance including aberration changes. For this reason, for example, for each factor such as the type of reticle and illumination conditions, the refractive index value for compensating for the imaging performance that changes with the variation of this factor is stored in advance in a memory or the like. And the refractive index of the liquid may be adjusted based on the stored relationship. In addition, there is so-called irradiation fluctuation that changes the imaging performance of the projection optical system depending on the amount of exposure energy passing through the projection optical system. Even in this case, it varies depending on the amount of exposure energy and the amount of exposure energy. The refractive index value for compensating the imaging performance to be compensated may be stored in advance in a memory or the like, the variation of this factor is detected, and the refractive index of the liquid may be adjusted based on the stored relationship. In this method, it may be calculated by a predetermined calculation formula instead of storing in the memory.
[0019]
In this manner, adjusting the refractive index of the liquid is effective for correcting spherical aberration and field curvature, among other imaging performances of the projection optical system.
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[First Embodiment]
FIG. 1 schematically shows an exposure apparatus according to the first embodiment of the present invention. In FIG. 1, the XYZ coordinate system is adopted.
[0020]
In FIG. 1, a light source S supplies, for example, exposure light having a wavelength of 248 nm. The exposure light from the light source S passes through a reticle R through an illumination optical system IL and a reflecting mirror M under a substantially uniform illuminance distribution. Illuminate. Here, in this example, a KrF excimer laser light source is used as the light source S. Instead, an ArF excimer laser light source that supplies 193 nm exposure light, a high-pressure mercury lamp that supplies g-line, i-line, and the like are used. It may be used. Although not shown in FIG. 1, the illumination optical system IL is an optical integrator for forming a surface light source and a light for condensing and uniformly illuminating the irradiated surface by condensing light from the surface light source. It has a condenser optical system and a variable aperture stop that is arranged at the position of the surface light source formed by the optical integrator and makes the shape of the surface light source variable. Here, as the shape of the surface light source, there are a surface light source having a plurality of surface light sources decentered from the optical axis, a ring-shaped shape, and a circular shape having a different size. As such an illumination optical system IL, for example, those disclosed in US Pat. No. 5,329,094 and US Pat. No. 5,576,801 can be used.
[0021]
Then, the exposure light that has passed through and diffracted through the reticle R reaches the wafer W via the projection optical system T, and an image of the reticle R is formed on the wafer.
Here, the reticle R is held by the reticle loader RL, and the reticle loader RL is configured to be able to move at any speed on the loader table LT at any speed on the loader table LT by the driving device T1. . Here, the moving speed of the reticle loader RL on the loader table LT is detected by the speed sensor SS, and the output from the speed sensor SS is transmitted to the first control unit CPU1.
[0022]
The wafer W is held by a wafer table WT. The wafer table WT is provided with a side wall for storing the liquid LQ. In this example, the side wall is configured so that the entire optical path from the wafer W to the projection optical system T is filled with the liquid LQ. The wafer table WT is configured to be movable at an arbitrary speed in the X-axis direction and the Y-axis direction on the holder table HT by the driving device T2.
[0023]
Here, the first control unit CPU1 calculates the moving speed of the wafer table WT on the holder table from the moving speed of the reticle loader RL on the loader table LT and the exposure magnification β of the projection optical system T. And transmitted to the driving device T2. The driving device moves the wafer table WT based on the moving speed transmitted from the first control unit CPU1.
[0024]
FIG. 2 is a diagram showing the configuration of the wafer table WT in detail. In FIG. 2, the optical member closest to the wafer W of the projection optical system T and the metal frame of the projection optical system T are in close contact or packed so as not to penetrate the liquid LQ. A plurality of openings are provided at the bottom of wafer table WT, and wafer W is adsorbed to wafer table WT by reducing the pressure from piping V connected to these openings. The wafer table WT is provided with electrodes D1 and D2, and around each of these electrodes D1 and D2,
Ion exchange membranes I1 and I2 are provided. By these ion exchange membranes I1 and I2, the periphery of the electrodes D1 and D2 is separated from the region where the exposure light passes through the liquid LQ. Here, the atmosphere around the electrode D1 is a sealed space by the ion exchange membrane I1 and the partition wall K1, and an exhaust pipe H1 is connected to the sealed space. The atmosphere around the electrode D2 is a sealed space by the ion exchange membrane I2 and the partition wall K2, and an exhaust pipe H2 is connected to the sealed space. These exhaust pipes H1 and H2 are both connected to the mixer K. One end of an introduction pipe LD having an electromagnetic valve DV is connected to the mixer K, and the other end of the introduction pipe LD is located in the vicinity of the wafer table WT.
[0025]
The applied voltage to the electrodes D1 and D2 is supplied from a power supply unit (not shown), and the applied voltage supplied from the power supply unit is controlled by the second control unit CPU2. Further, the second control unit CPU2 controls the opening / closing of the electromagnetic valve DV. In this example, these electrodes D1 and D2, ion exchange membranes I1 and I2, partition walls K1 and K2, exhaust pipes H1 and H2, mixer K, electromagnetic valve DV, introduction pipe LD, power supply unit not shown, second control The unit CPU2 constitutes a refractive index adjusting means.
[0026]
Hereinafter, the operation of the refractive index adjusting means will be described. In the following description, the liquid LQ is obtained by adding hydrogen chloride as an additive to pure water.
First, when lowering the refractive index of the liquid LQ, the second control unit CPU2 sends a command to the power supply unit, and applies a predetermined voltage between the electrode D1 and the electrode D2 for a predetermined time. At this time, oxygen gas is generated from the electrode serving as the anode, and a mixed gas of hydrogen and chlorine is generated from the electrode serving as the cathode. At this time, since the hydrogen chloride concentration in the liquid LQ is lowered, the refractive index of the liquid LQ is lowered as can be seen from the above equation (1). Here, the gas generated in the vicinity of the electrodes D1 and D2 does not pass through the ion exchange membranes I1 and I2, and can be recovered through the exhaust pipes H1 and H2. The recovered gas is sent to the mixer K. In the mixer K, the recovered gases (oxygen gas, hydrogen gas, hydrogen chloride gas) are mixed together, and thereby an additive aqueous solution having a concentration higher than that of the liquid LQ is generated.
[0027]
Further, when increasing the refractive index of the liquid LQ, the second control unit CPU2 sends a command to the electromagnetic valve DV so as to open the electromagnetic valve DV and add the high-concentration additive aqueous solution to the liquid LQ. As a result, the refractive index of the liquid LQ increases.
With this configuration, the refractive index of the liquid LQ can be made variable.
In the memory M1 connected to the second control unit CPU2, the refractive index values are stored in the form of a table corresponding to various illumination conditions. Here, the value of the refractive index is a value of the refractive index of the liquid LQ necessary for correcting the aberration generated in the projection optical system T under a certain illumination condition. The memory M1 stores the value of the additive concentration in the liquid LQ at a certain point in a constantly updated form.
[0028]
The illumination optical system IL is connected to the second control unit CPU2 in order to transmit information related to the shape of the surface light source formed by the illumination optical system IL to the second control unit CPU2. Here, when the illumination condition—in this example, the shape of the surface light source—changes, this information is transmitted to the second control unit CPU2. At this time, the second control unit CPU2 retrieves the value of the refractive index corresponding to the transmitted illumination condition from the memory M1, and calculates the concentration of the additive for realizing the refractive index from the above equation (1). . Next, the second control unit CPU2 sets the current additive concentration to the calculated additive concentration according to the current additive concentration stored in the memory M1 and the calculated additive concentration. D1, D2 or solenoid valve DV is controlled.
[0029]
Thereby, the value of the refractive index of the liquid LQ corrects the aberration of the projection optical system T when the liquid LQ is included.
[Second Embodiment]
The second embodiment is greatly different in that the additive in the first embodiment is ethyl alcohol. The ethyl alcohol does not dissolve the resist layer of the wafer W coated with a resist as a photosensitive substrate, and the optical member closest to the wafer W in the projection optical system T (an optical member in contact with the liquid LQ) and the optical member. There is an advantage that there is little influence on the applied optical coat.
[0030]
Further, in the second embodiment, the configuration of the refractive index adjusting means is different from that of the first embodiment. Hereinafter, the configuration of the refractive index adjusting means will be described with reference to FIG. In FIG. 3, members having the same functions as those shown in FIG.
In FIG. 3 showing the wafer table WT according to the second embodiment, the difference from the first embodiment is that an additive supply pipe LS for supplying the additive to the liquid LQ and pure water are supplied. The pure water supply pipe WS for supplying the liquid LQ and the discharge pipe L for discharging the liquid LQ so that the liquid LQ does not overflow from the wafer table WT are provided.
[0031]
Here, the additive supply pipe LS, the pure water supply pipe WS and the discharge pipe L are provided for adjusting the discharge amounts of the electromagnetic valves DVLS and DVWS and the liquid LQ for adjusting the supply amounts of the additive and pure water. A solenoid valve DVL is provided, and the opening and closing of these solenoid valves DVLS, DVWS, DVL is controlled by the second control unit CPU2.
The operation at the time of refractive index adjustment in the second embodiment will be described.
[0032]
First, when increasing the refractive index of the liquid LQ, the second control unit CPU2 controls the electromagnetic valve DVLS to add an additive to the liquid LQ by a predetermined amount. At this time, the liquid LQ is discharged from the discharge pipe L by a predetermined amount. The amount of liquid LQ discharged is preferably the same as the amount of additive added. Thereby, the additive concentration in the liquid LQ increases, and the refractive index thereof increases.
[0033]
When lowering the refractive index of the liquid LQ, the second control unit CPU2 controls the electromagnetic valve DVWS to add pure water to the liquid LQ by a predetermined amount. At this time, the liquid LQ is discharged from the discharge pipe L by a predetermined amount. The amount of liquid LQ to be discharged is preferably the same as the amount of pure water added. Thereby, the additive concentration in the liquid LQ is lowered, and the refractive index is lowered.
[0034]
Here, the amount of additive and pure water to be added and the amount of liquid LQ to be discharged are controlled by the second controller CPU2. The point that the value of the refractive index is stored in the memory M1 corresponding to the type of illumination condition, and the value of the additive concentration of the liquid LQ at a certain point in time is stored in the first embodiment described above. Similar to the first embodiment, the additive concentration for realizing the refractive index capable of correcting the aberration of the projection optical system T is calculated based on these pieces of information.
[0035]
In this way, the second control unit CPU2 in the second embodiment calculates the current additive concentration according to the current additive concentration stored in the memory M1 and the calculated additive concentration. The opening and closing of the solenoid valves DVLS, DVWS, DVL are controlled so as to obtain the additive concentration.
Thereby, the value of the refractive index of the liquid LQ corrects the aberration of the projection optical system T when the liquid LQ is included.
[Third Embodiment]
Next, a third embodiment will be described with reference to FIG. The exposure apparatus according to the third embodiment is different from the first and second embodiments described above in that it includes an aberration measuring apparatus. In FIG. 4, members having the same functions as those in the examples of FIGS. 1 to 3 described above are denoted by the same reference numerals, and the same XYZ coordinate system as in FIG. 1 is adopted.
[0036]
In FIG. 4, a light source S supplies exposure light having a wavelength of 248 nm, and the exposure light from the light source S is adjusted to a predetermined shape by the beam shaping optical system 11 and then enters the first fly-eye lens 12. To do. A secondary light source including a plurality of light source images is formed on the emission side of the first fly-eye lens 12. The exposure light from the secondary light source enters the second fly-eye lens 15 through the relay lens systems 13F and 13R. The relay lens system includes a front group 13F and a rear group 13R, and a vibration mirror 14 for preventing speckles on the irradiated surface is disposed between the front group 13F and the rear group 13R. Yes.
[0037]
Now, on the exit surface side of the second fly-eye lens 15, a plurality of secondary light source images are formed by the first fly-eye lens, and this becomes the tertiary light source. A variable aperture stop 16 capable of setting a plurality of aperture stops having a predetermined shape or a predetermined size is disposed at a position where the tertiary light source is formed. For example, as shown in FIG. 5, the variable aperture stop 16 has six aperture stops 16a to 16e patterned in a turret shape on a transparent substrate made of quartz or the like. Here, the two aperture stops 16a and 16b having circular apertures are apertures for changing the σ value (the numerical aperture of the illumination optical system with respect to the numerical aperture of the projection optical system), and the two apertures having an annular shape. The diaphragms 16c and 16d are diaphragms having different annular ratios. The remaining two aperture stops 16e and 16f are stops having four eccentric apertures. The variable aperture stop 16 is driven by the variable aperture stop drive unit 17 so that any one of the plurality of aperture stops 16a to 16f is located in the optical path.
[0038]
Returning to FIG. 4, the exposure light from the variable aperture stop 16 is condensed by the condenser lens system 18 and illuminates the reticle blind 19 in a superimposed manner. The reticle blind 19 is arranged in a conjugate manner with the pattern forming surface of the reticle R with respect to the relay optical systems 20F and 20R, and the shape of the illumination area on the reticle R is determined by the opening shape of the reticle blind 19. The exposure light from the reticle blind 19 forms an illumination area having a substantially uniform illuminance distribution at a predetermined position on the reticle R via the front group 20F of the relay optical system, the reflecting mirror M, and the rear group 20R of the relay optical system. Form.
[0039]
In addition, the beam shaping optical system 11 to the relay optical systems 20F and 20R shown in this embodiment can be applied to the illumination optical system IL in the first and second embodiments described above.
The reticle R is placed on a reticle loader RL, and the reticle loader RL can move on the holder table LT in the XY direction and the rotation direction (θ direction) about the Z axis in the figure. It has become. The reticle loader-RL is provided with a moving mirror RIM, and the reticle interferometer RI detects the positions of the reticle loader-RL in the XY direction and the θ direction. The reticle loader RL is driven in the XY direction and the θ direction by the reticle loader drive unit RLD. Here, the output from the reticle interferometer RI is transmitted to the first control unit CPU1, and the first control unit CPU1 is configured to control the reticle loader-driving unit RLD.
[0040]
In addition, a barcode reader BR for reading a barcode provided on the reticle R is provided in the middle of the conveyance path from the reticle stocker (not shown). Information regarding the type of reticle R read by the barcode reader BR is transmitted to the second control unit CPU2. Here, in the memory M1 connected to the second control unit CPU2, information on the optimum illumination condition for each type of reticle R and the optimum value of the refractive index of the liquid LQ for each type of reticle R are stored. Has been.
[0041]
A projection optical system T having a predetermined reduction magnification | β | is provided below the reticle R. A liquid between the optical member closest to the wafer surface of the projection optical system T and the wafer W is provided. LQ intervenes. The projection optical system T forms a reduced image of the reticle R on the wafer surface through the liquid LQ.
The wafer W is attracted and fixed to the wafer table WT, and the wafer table WT is moved in the Z-axis direction and tilted (tilt with respect to the Z-axis) by the Z actuators ZD1, ZD2, and the like. It is attached to a wafer stage WTS that can move in the XY direction with respect to the surface plate via ZD3. Wafer stage WTS is driven by wafer stage drive unit WD. Further, the side wall of the wafer table is mirror-finished, and this portion serves as a movable mirror of the wafer interferometer WI. Here, the driving of the wafer stage driving unit WD is controlled by the above-described first control unit CPU1, and the output from the wafer interferometer WI is transmitted to the first control unit CPU1.
[0042]
Further, the projection optical system T is provided with a focus sensor AF for measuring the distance in the Z direction between the projection optical system T and the wafer W. The focus sensor AF irradiates light on the wafer surface via an optical element close to the wafer W in the projection optical system T, and receives light reflected by the wafer via the optical element, and the light receiving position. Thus, the distance in the Z direction between the projection optical system T and the wafer W is measured. Such a configuration of the focus sensor AF is disclosed in, for example, Japanese Patent Laid-Open No. 6-66543.
[0043]
In the third embodiment, the additive supply pipe LS for supplying the high concentration additive aqueous solution stored in the additive storage unit LST to the liquid LQ and the pure water storage unit WST are stored. And a pure water supply pipe WS for supplying pure water to the liquid LQ. The additive supply pipe LS and the pure water supply pipe WS are provided with an electromagnetic for adjusting the supply amount of the additive aqueous solution and pure water. Valves DVLS and DVWS are provided. Further, the wafer table WT is provided with a discharge pipe L for discharging the liquid LQ so that the liquid LQ does not overflow from the wafer table, and this discharge pipe L is for adjusting the discharge amount of the liquid LQ. The solenoid valve is provided. The opening / closing of these solenoid valves DVLS, DVWS, DVL is controlled by the second control unit CPU2 as in the second embodiment described above.
[0044]
On wafer table WT, an aberration measuring unit AS for measuring the aberration of the projection optical system and an additive concentration detecting unit DS for detecting the additive concentration of liquid LQ are provided. Here, as the aberration measuring unit AS, for example, one disclosed in Japanese Patent Laid-Open No. 6-84757 can be used. Here, the outputs from the aberration measuring section AS and additive concentration detecting section DS are transmitted to the second control section CPU2. Further, the output from the additive concentration detection unit DS is stored as the value of the additive concentration of the liquid LQ at a certain point in time in the memory M1 via the second control unit CPU2.
[0045]
Next, the operation of the third embodiment will be described.
First, while the reticle R is taken out from a reticle stocker (not shown) and placed on the reticle loader RL, the barcode reader BR reads a barcode provided on the reticle R and performs second control on the information. To the CPU 2. The second control unit CPU2 reads information on the illumination condition corresponding to the type of the reticle R stored in the memory M1, and controls the variable aperture stop driving unit 17 in accordance with the information to control one of the aperture stops 16a to 16f. A predetermined one is positioned in the optical path. Further, the second control unit CPU2 calculates the concentration of the additive for realizing the refractive index based on the refractive index value of the liquid LQ stored in the memory M1 from the above equation (1). Thereafter, the current additive concentration is set to the calculated additive concentration according to the current additive concentration detected by the additive concentration detection unit DS and stored in the memory M1 and the calculated additive concentration. In addition, the opening and closing of the solenoid valves DVLS, DVWS, DVL is controlled.
[0046]
Thereby, the value of the refractive index of the liquid LQ corrects the aberration of the projection optical system T when the liquid LQ is included. Thereafter, the position and tilt of the wafer W in the Z direction are detected by the focus sensor AF, and the Z actuators ZD1, ZD2, and ZD3 are driven so that the wafer W becomes a required position. In this state, the exposure light from the light source S is guided to the reticle R via the illumination optical system, and the first control unit CPU1 detects the positions of the reticle R and the wafer W using the reticle interferometer RI and the wafer interferometer WI. Then, the reticle loader drive unit RLD and the wafer stage drive unit WD are driven, and the reticle R and the wafer W are moved under the speed ratio of the projection magnification | β | of the projection optical system T. As a result, the pattern on the reticle R is transferred onto the wafer W under a good imaging state.
[0047]
Now, the imaging performance (aberration and the like) of the projection optical system T is not always constant, and may change due to temperature change, atmospheric pressure change, temperature rise caused by the projection optical system T absorbing exposure light, and the like. Therefore, in the third embodiment, the aberration measurement unit AS measures the aberration (imaging performance) of the actual projection optical system T, and adjusts the refractive index value of the liquid LQ based on the measurement result. Yes.
[0048]
Specifically, in the third embodiment, the value of the refractive index of the liquid LQ that can correct the aberration is stored in the memory M1 in a form corresponding to the aberration value of the projection optical system. Then, the aberration of the projection optical system T detected by the aberration measuring unit AS is transmitted to the second control unit CPU2. The second control unit CPU2 reads the refractive index value of the liquid LQ stored in the memory M1, and obtains the additive concentration from the above equation (1) so that the refractive index value is obtained. The opening and closing of the solenoid valves DVLS, DVWS, and DVL are controlled so that the additive concentration is obtained.
[0049]
With this configuration, even if there is a change in the environment of the projection optical system T (temperature change, atmospheric pressure fluctuation, fluctuation due to exposure light absorption), it is possible to maintain good imaging performance. Note that the measurement by the aberration measuring unit AS does not have to be performed at all times, and may be performed every predetermined period.
[Fourth Embodiment]
Next, a fourth embodiment will be described with reference to FIG. In the fourth embodiment, not all of the optical path between the projection optical system and the wafer is filled with liquid, but a part of this optical path is filled with liquid.
[0050]
6 (a) and 6 (b), members having the same functions as those in the first and second embodiments shown in FIGS. In the fourth embodiment shown in FIGS. 6 (a) and 6 (b), instead of storing the liquid LQ by the side wall of the wafer holder-WT, the container C1, which is made of a material (for example, quartz) that transmits the exposure light, The configuration that fills the liquid LQ in C2 is different from the first and second embodiments described above. With this configuration, among the effects of the first and second embodiments described above, although there is no effect of increasing the numerical aperture or increasing the effective depth of focus, the aberration (result) of the projection optical system T is continuously increased. (Image performance) adjustment is possible.
[0051]
In the fourth embodiment, the containers C1 and C2 containing the liquid LQ may be provided integrally with the projection optical system T.
In the above first to fourth embodiments, pure water is used as the liquid LQ, but it is not limited to pure water.
[0052]
【The invention's effect】
As described above, according to the present invention, the imaging performance of the projection optical system can be continuously adjusted without vibration. Further, it is possible to achieve both an increase in numerical aperture (or an effective increase in depth of focus) and adjustment of imaging performance.
[Brief description of the drawings]
FIG. 1 is a schematic view generally showing an exposure apparatus according to first and second embodiments of the present invention.
FIG. 2 is a cross-sectional view showing a main part of the exposure apparatus according to the first embodiment of the present invention.
FIG. 3 is a cross-sectional view showing a main part of an exposure apparatus according to a second embodiment of the present invention.
FIG. 4 is a schematic view showing an exposure apparatus according to a third embodiment of the present invention.
FIG. 5 is a schematic view showing a part of an exposure apparatus according to a third embodiment of the present invention.
FIG. 6 is a sectional view showing the main part of an exposure apparatus according to a fourth embodiment of the present invention.
[Explanation of symbols]
S: Light source T2: Drive device
IL ... Illumination optics M1 ... Memory
M ... reflector V ... decompression tube
T ... Projection optical system D1, D2 ... Electrode
W ... Wafer I1, I2 ... Ion exchange membrane
LQ ... Liquid K1, K2 ... Bulkhead
R ... Reticle H1, H2 ... Piping
RL ... reticle loader L ... discharge pipe
LT ... loader table LD ... introducing pipe
SS ... Sensor WS ... Pure water supply pipe
WT ... Wafer table LS ... Additive supply pipe
T1 ... Drive device

Claims (17)

  1. An illumination optical system that illuminates a pattern provided on a reticle; and a projection optical system that forms an image of the pattern on a photosensitive substrate; and an optical path between the projection optical system and the photosensitive substrate. In an exposure apparatus for performing exposure through a liquid located in at least a part of
    An exposure apparatus comprising: a refractive index adjusting unit that supplies an additive to the liquid to adjust a refractive index of the liquid.
  2.   The exposure apparatus according to claim 1, wherein the refractive index adjusting unit adjusts the refractive index of the liquid so as to correct an imaging performance of the projection optical system.
  3. An illumination optical system that illuminates a pattern provided on a reticle; and a projection optical system that forms an image of the pattern on a photosensitive substrate; and an optical path between the projection optical system and the photosensitive substrate. In an exposure apparatus for performing exposure through a liquid located in at least a part of
    Imaging performance measuring means for measuring imaging performance of the projection optical system;
    An exposure apparatus comprising: a refractive index adjusting unit that adjusts a refractive index of the liquid so as to correct an imaging performance of the projection optical system.
  4. An illumination optical system that illuminates a pattern provided on a reticle; and a projection optical system that forms an image of the pattern on a photosensitive substrate; and an optical path between the projection optical system and the photosensitive substrate. In an exposure apparatus for performing exposure through a liquid located in at least a part of
    Fluctuation factor detection means for detecting the state of the factor of fluctuation in the imaging performance of the projection optical system;
    An exposure apparatus comprising: a refractive index adjusting unit that adjusts a refractive index of the liquid so as to correct an imaging performance of the projection optical system.
  5. The illumination optical system is configured to be able to change illumination conditions for the reticle,
    The variation factor detection means detects the state of the illumination condition,
    The exposure apparatus according to claim 4, wherein the refractive index adjusting unit adjusts the refractive index of the liquid so as to correct the imaging performance in accordance with the change in the illumination condition.
  6. The variation factor detection means is for determining the type of the reticle,
    5. The exposure apparatus according to claim 4, wherein the refractive index adjusting unit adjusts the refractive index of the liquid so as to correct the imaging performance according to the type of the reticle.
  7.   The refractive index adjusting means has an additive supply unit for supplying an additive for adjusting the refractive index to the liquid, and an additive recovery unit for recovering the additive from the liquid. An exposure apparatus according to any one of claims 3 to 6.
  8. A photosensitive substrate holder for holding the photosensitive substrate;
    The photosensitive substrate holder includes a sidewall for filling an optical path between the projection optical system and the photosensitive substrate with the liquid, and supplies the liquid to the photosensitive substrate holder and collects it from the photosensitive substrate holder. An exposure apparatus according to any one of claims 1 to 7, further comprising a supply / recovery unit.
  9. Illuminating the reticle under a predetermined illumination condition; and transferring the pattern provided on the reticle onto a photosensitive substrate using a projection optical system, the light from the projection optical system being predetermined In the exposure method for leading to the photosensitive substrate through the liquid of
    An exposure method comprising the step of supplying an additive to the liquid to adjust the refractive index of the liquid in order to correct the imaging performance of the projection optical system.
  10. Illuminating the reticle under a predetermined illumination condition, and transferring the device pattern provided on the reticle onto a photosensitive substrate using a projection optical system, the light from the projection optical system being In a device manufacturing method for leading to the photosensitive substrate through a predetermined liquid,
    A device manufacturing method, wherein a refractive index of the liquid is changed when at least one of the reticle and the illumination condition is changed.
  11. An illumination optical system that illuminates a pattern provided on a reticle; and a projection optical system that forms an image of the pattern on a photosensitive substrate; and an optical path between the projection optical system and the photosensitive substrate. In an exposure apparatus manufacturing method for performing exposure through a liquid located in at least a part of
    Measuring the imaging performance of the projection optical system;
    And a step of determining an initial value of the refractive index of the liquid based on the measured imaging performance.
  12.   Illuminating the reticle under a predetermined illumination condition, and transferring the device pattern provided on the reticle onto a photosensitive substrate using a projection optical system, the light from the projection optical system being In a device manufacturing method for leading to the photosensitive substrate through a predetermined liquid,
      A device manufacturing method, wherein an additive is added to the liquid to change a refractive index of the liquid.
  13.   The device manufacturing method according to claim 12, wherein the additive contains hydrogen chloride.
  14.   The device manufacturing method according to claim 12, wherein the additive contains ethyl alcohol.
  15.   The device manufacturing method according to claim 12, wherein the liquid is pure water.
  16.   Further comprising measuring the imaging performance of the projection optical system,
      The device manufacturing method according to claim 12, wherein the adjustment of the refractive index of the liquid is performed so as to correct an imaging performance of the projection optical system.
  17.   Further comprising detecting a state of a fluctuation factor of the imaging performance of the projection optical system,
      The device manufacturing method according to claim 12, wherein the adjustment of the refractive index of the liquid is performed so as to correct an imaging performance of the projection optical system.
JP15198597A 1997-06-10 1997-06-10 Exposure apparatus, its manufacturing method, exposure method, and device manufacturing method Expired - Lifetime JP3817836B2 (en)

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