JP4645027B2 - Exposure apparatus, exposure method, and device manufacturing method - Google Patents

Description

  The present invention relates to an immersion exposure apparatus and an immersion exposure method for exposing with an image of a pattern projected by a projection optical system in a state where at least a part between the projection optical system and a substrate is filled with a liquid, and the exposure apparatus. The present invention relates to a device manufacturing method to be used.

Semiconductor devices and liquid crystal display devices are manufactured by a so-called photolithography technique in which a pattern formed on a mask is transferred onto a photosensitive substrate. An exposure apparatus used in this photolithography process has a mask stage for supporting a mask and a substrate stage for supporting a substrate, and a mask pattern is transferred via a projection optical system while sequentially moving the mask stage and the substrate stage. It is transferred to the substrate. In recent years, in order to cope with higher integration of device patterns, higher resolution of the projection optical system is desired. The resolution of the projection optical system becomes higher as the exposure wavelength used becomes shorter and the numerical aperture of the projection optical system becomes larger. Therefore, the exposure wavelength used in the exposure apparatus is shortened year by year, and the numerical aperture of the projection optical system is also increasing. The mainstream exposure wavelength is 248 nm of the KrF excimer laser, but the 193 nm of the shorter wavelength ArF excimer laser is also being put into practical use. Also, when performing exposure, the depth of focus (DOF) is important as well as the resolution. The resolution R and the depth of focus δ are each expressed by the following equations.
R = k ₁ · λ / NA (1)
δ = ± k ₂ · λ / NA ² (2)
Here, λ is the exposure wavelength, NA is the numerical aperture of the projection optical system, and k ₁ and k ₂ are process coefficients. From the equations (1) and (2), it can be seen that the depth of focus δ becomes narrower when the exposure wavelength λ is shortened and the numerical aperture NA is increased in order to increase the resolution R.

If the depth of focus δ becomes too narrow, it becomes difficult to match the substrate surface with the image plane of the projection optical system, and the focus margin during the exposure operation may be insufficient. Therefore, as a method for substantially shortening the exposure wavelength and increasing the depth of focus, for example, an immersion method disclosed in International Publication No. 99/49504 has been proposed. In this immersion method, the space between the lower surface of the projection optical system and the substrate surface is filled with a liquid such as water or an organic solvent, and the wavelength of the exposure light in the liquid is 1 / n (n is the refractive index of the liquid). The resolution is improved by utilizing the fact that the ratio is usually about 1.2 to 1.6), and the depth of focus is expanded about n times.
International Publication No. 99/49504 Pamphlet

  In the above-described exposure apparatus, detection light is projected onto the substrate surface during exposure of the substrate, and the substrate surface position is detected by receiving the reflected light, and is formed via the projection optical system based on the detection result. The positional relationship between the pattern image surface to be formed and the substrate surface is appropriately adjusted. However, in an immersion exposure apparatus based on the immersion method, a liquid exists between the projection optical system and the substrate, and the surface position of the substrate surface can be accurately detected due to the influence of the temperature change of the liquid. Therefore, the positional relationship between the pattern image surface and the substrate surface may not be adjusted appropriately. Similarly, if the alignment mark on the substrate is detected via a liquid, the substrate mark cannot be detected accurately due to the influence of the temperature change of the liquid, and the alignment between the mask and the substrate is accurate. May not be done.

  The present invention has been made in view of such circumstances, and it is possible to expose a substrate with good pattern transfer accuracy when performing an exposure process in a state where a liquid is filled between the projection optical system and the substrate. An object is to provide an exposure apparatus and an immersion exposure method. It is another object of the present invention to provide an immersion exposure apparatus and an immersion exposure method that can adjust the positional relationship between the substrate surface and the pattern image plane to an optimum state. It is another object of the present invention to provide an immersion exposure apparatus and an immersion exposure method that can accurately align the substrate.

  In order to solve the above-described problems, the present invention adopts the following configuration corresponding to FIGS. 1 to 8 shown in the embodiment. However, the reference numerals with parentheses attached to each element are merely examples of the element, and there is no intention to limit each element.

  According to the first aspect of the present invention, there is provided an exposure apparatus for transferring a pattern image onto a substrate (P) through a liquid (50) to expose the substrate, and projecting the pattern image onto the substrate. An optical system (PL), a first substrate stage (PST) holding a substrate (P), a liquid supply device (1) for supplying a liquid (50) to the image plane side of the projection optical system (PL), and a substrate (P) a surface detection system (14) that detects surface information on the surface without using the liquid (50), and based on the detected surface information, the surface of the substrate (P) and the projection optical system (PL) Provides an exposure apparatus (EX) that performs immersion exposure of the substrate (P) while adjusting the positional relationship with the image plane formed via the liquid (50).

  According to the present invention, since surface information on the substrate surface is detected without using a liquid for immersion exposure, and immersion exposure is performed based on the information, it is affected by the temperature change of the liquid. In addition, the positional relationship between the substrate surface and the image plane formed via the liquid can be adjusted, and the alignment between each shot area on the substrate and the projection position of the pattern image can be accurately performed. In addition, it is not necessary to configure the alignment system to be compatible with liquid immersion, and a conventional detection system can be used as it is.

  According to the second aspect of the present invention, a plurality of shots on the substrate are sequentially exposed to a plurality of shot regions (S1 to S20) on the substrate (P) through the liquid (50). An exposure apparatus that exposes an area, a projection optical system (PL) that projects a pattern image onto a substrate, a first substrate stage (PST) that holds the substrate (P), and an image of the projection optical system (PL) A liquid supply device (1) for supplying the liquid (50) to the surface side, and a first alignment system (18) for detecting an alignment mark on the substrate (P) without passing through the liquid (50); An exposure apparatus (EX) that performs immersion exposure of the substrate (P) while aligning the substrate (P) and the pattern based on the detection result of the one alignment system (18) is provided.

  According to the present invention, since the alignment mark on the substrate is detected without using the immersion exposure liquid, and then the immersion exposure is performed based on the information, the same as in the exposure apparatus of the first aspect. In addition, it is possible to adjust the positional relationship between the substrate surface and the image plane formed via the liquid without being affected by the temperature change of the liquid, and to align each shot area on the substrate with the projection position of the pattern image. Can be done accurately. In addition, it is not necessary to configure the alignment system to be compatible with liquid immersion, and a conventional detection system can be used as it is.

  The present invention provides a device manufacturing method using the exposure apparatus of the above aspect.

  According to a third aspect of the present invention, there is provided an immersion exposure method for transferring an image of a pattern onto a substrate (P) via a liquid (50) to expose the substrate, wherein the substrate (P) is exposed on the substrate (P). Steps (S2, S4) for obtaining surface information on the surface of the substrate by measurement without using the supplied liquid, Steps (S5) for supplying a liquid onto the substrate, and the substrate based on the obtained surface information. There is provided an immersion exposure method including a step (S8) of performing immersion exposure of the substrate while adjusting a positional relationship between a surface and an image plane formed through the liquid. According to this method, since the surface information of the substrate surface is obtained by measurement without using a liquid, the substrate positioning can be performed accurately and easily without being affected by physical changes such as the temperature of the liquid. Can do.

  According to a fourth aspect of the present invention, there is provided an immersion exposure method for exposing a substrate (P) by transferring a pattern image onto the substrate via a liquid (50), wherein the liquid is supplied onto the substrate. A step of detecting an alignment mark on the substrate when it is not (S1), a step of supplying a liquid onto the substrate (S5), and a substrate supplied with the liquid based on the detection result of the alignment mark And an immersion exposure method including an immersion exposure step (S8) of the substrate while performing alignment with the pattern. According to this method, since the alignment of the shot region of the substrate is performed without using a liquid (dry condition), it is accurate and easy without being affected by a physical change such as the temperature of the liquid used for immersion exposure. The positioning of the shot area of the substrate can be performed. On the other hand, since the exposure operation is performed in a state where liquid is supplied (wet condition), exposure with a wide depth of focus is possible. In addition, since the alignment system can use a conventional apparatus, an increase in apparatus cost associated with immersion exposure can be suppressed.

  The immersion exposure apparatus and the immersion exposure method of the present invention perform detection of surface information on the substrate surface and detection of alignment marks on the substrate without using a liquid for immersion exposure, and then based on the information. Since immersion exposure is performed, the positional relationship between the substrate surface and the image plane formed via the liquid can be adjusted, and the position of each shot area on the substrate and the projection position of the pattern image can be accurately adjusted. . Therefore, a highly accurate exposure process can be performed, and a device that exhibits desired performance can be manufactured.

  The exposure apparatus and device manufacturing method of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic block diagram showing an embodiment of the exposure apparatus of the present invention.

  In FIG. 1, an exposure apparatus EX includes a mask stage MST that supports a mask M, a substrate stage PST that supports a substrate P, and an illumination optical system IL that illuminates the mask M supported by the mask stage MST with exposure light EL. A projection optical system PL that projects and exposes an image of the pattern of the mask M illuminated by the exposure light EL onto the substrate P supported by the substrate stage PST, and a control device CONT that controls the overall operation of the exposure apparatus EX. It has.

  Here, in the present embodiment, as the exposure apparatus EX, scanning exposure is performed in which the pattern formed on the mask M is exposed to the substrate P while the mask M and the substrate P are synchronously moved in different directions (reverse directions) in the scanning direction. A case where an apparatus (so-called scanning stepper) is used will be described as an example. In the following description, the direction that coincides with the optical axis AX of the projection optical system PL is the Z-axis direction, the synchronous movement direction (scanning direction) between the mask M and the substrate P in the plane perpendicular to the Z-axis direction is the X-axis direction, A direction (non-scanning direction) perpendicular to the Z-axis direction and the Y-axis direction is defined as a Y-axis direction. Further, the directions around the X axis, the Y axis, and the Z axis are defined as θX, θY, and θZ directions, respectively. Here, the “substrate” includes a semiconductor wafer coated with a resist, and the “mask” includes a reticle on which a device pattern to be reduced and projected on the substrate is formed.

The illumination optical system IL illuminates the mask M supported by the mask stage MST with the exposure light EL, and the exposure light source, and an optical integrator and an optical integrator for uniformizing the illuminance of the light beam emitted from the exposure light source A condenser lens that collects the exposure light EL from the light source, a relay lens system, a variable field stop that sets the illumination area on the mask M by the exposure light EL in a slit shape, and the like. A predetermined illumination area on the mask M is illuminated with the exposure light EL having a uniform illuminance distribution by the illumination optical system IL. As the exposure light EL emitted from the illumination optical system IL, for example, far ultraviolet light (g-line, h-line, i-line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, DUV light), vacuum ultraviolet light (VUV light) such as ArF excimer laser light (wavelength 193 nm) and F ₂ laser light (wavelength 157 nm), or the like is used. In this embodiment, ArF excimer laser light is used.

  The mask stage MST supports the mask M, and can be two-dimensionally moved in a plane perpendicular to the optical axis AX of the projection optical system PL, that is, in the XY plane, and can be slightly rotated in the θZ direction. The mask stage MST is driven by a mask stage driving device MSTD such as a linear motor. The mask stage driving device MSTD is controlled by the control device CONT. A movable mirror 56 is provided on the mask stage MST. A laser interferometer 57 is provided at a position facing the movable mirror 56. The two-dimensional position and rotation angle of the mask M on the mask stage MST are measured in real time by the laser interferometer 57, and the measurement result is output to the control unit CONT. The control device CONT drives the mask stage drive device MSTD based on the measurement result of the laser interferometer 57, thereby positioning the mask M supported by the mask stage MST.

  The projection optical system PL projects and exposes the pattern of the mask M onto the substrate P at a predetermined projection magnification β, and is composed of a plurality of optical elements (lenses). These optical elements are mirrors as metal members. It is supported by the cylinder PK. In the present embodiment, the projection optical system PL is a reduction system having a projection magnification β of, for example, 1/4 or 1/5. Note that the projection optical system PL may be either an equal magnification system or an enlargement system. Further, the optical element (lens) 60 is exposed from the lens barrel PK on the front end side (substrate P side) of the projection optical system PL of the present embodiment. This optical element 60 is detachably (replaceable) with respect to the lens barrel PK.

  The substrate stage (first substrate stage) PST supports the substrate P, and includes a Z stage 51 that holds the substrate P via a substrate holder, an XY stage 52 that supports the Z stage 51, and an XY stage 52. And a base 53 for supporting the. The substrate stage PST is driven by a substrate stage driving device PSTD such as a linear motor. The substrate stage driving device PSTD is controlled by the control device CONT.

  Surface information (position information and tilt information in the Z-axis direction) of the surface of the substrate P is detected by a focus / leveling detection system 14 which is a surface detection system. The focus / leveling detection system 14 includes a projection system 14A for projecting detection light onto the surface of the substrate P and a light receiving system 14B for receiving reflected light from the substrate P. The detection result of the focus / leveling detection system 14 is output to the control device CONT. The control device CONT drives the Z stage 51 based on the detection result of the focus / leveling detection system 14 and adjusts the position (focus position) and tilt angle of the substrate P held by the Z stage 51 in the Z-axis direction. As a result, the surface of the substrate P is adjusted to an optimum state with respect to the image plane of the projection optical system PL by the autofocus method and the autoleveling method. Note that the Z stage and the XY stage may be integrally formed.

  On the substrate stage PST (Z stage 51), a movable mirror 54 that moves with respect to the projection optical system PL together with the substrate stage PST is provided. A laser interferometer 55 is provided at a position facing the movable mirror 54. The two-dimensional position and rotation angle of the substrate P on the substrate stage PST are measured in real time by the laser interferometer 55, and the measurement result is output to the control device CONT. The control device CONT drives the XY stage 52 via the substrate stage drive device PSTD based on the measurement result of the laser interferometer 55 to thereby position the substrate P in the XY direction (substantially parallel to the image plane of the projection optical system PL). The position of the substrate P is supported by the substrate stage PST.

  A substrate alignment system (first alignment system) 18 for detecting an alignment mark on the substrate P or a reference mark (described later) provided on the Z stage 51 is disposed near the tip of the projection optical system PL. A mask alignment system (second alignment system) 19 that detects a reference mark on the Z stage 51 via the mask M and the projection optical system PL is provided in the vicinity of the mask stage MST.

  The configuration of the autofocus / leveling detection system 14 is disclosed in, for example, Japanese Patent Application Laid-Open No. 8-37149 (US Pat. No. 6,195,154). The configuration of the substrate alignment system 18 is disclosed in Japanese Patent Laid-Open No. 4-65603 (US Pat. No. 5,493,403). Further, the configuration of the mask alignment system 19 is disclosed in Japanese Patent Laid-Open No. 7-176468 (US Pat. No. 5,646,413).

  In the present embodiment, the immersion method is applied to improve the resolution by substantially shortening the exposure wavelength and to substantially increase the depth of focus. Therefore, at least while the pattern image of the mask M is transferred onto the substrate P, the surface of the substrate P and the front end surface (lower surface) 7 of the optical element (lens) 60 on the substrate P side of the projection optical system PL. In the meantime, a predetermined liquid 50 is filled. As described above, the lens 60 is exposed at the front end side of the projection optical system PL, and the liquid 50 is supplied so as to contact only the lens 60. Thereby, corrosion etc. of the lens barrel PK made of metal are prevented. In the present embodiment, pure water is used for the liquid 50. Pure water is not only ArF excimer laser light but also far ultraviolet light such as ultraviolet emission lines (g-line, h-line, i-line) emitted from a mercury lamp and KrF excimer laser light (wavelength 248 nm). Even when light (DUV light) is used, the exposure light EL can be transmitted.

  The exposure apparatus EX supplies a predetermined liquid 50 to the space 56 between the front end surface 7 (the front end surface of the lens 60) of the projection optical system PL and the substrate P, that is, the image plane side of the projection optical system PL. 1 and a liquid recovery apparatus 2 that recovers the liquid 50 in the space 56. The liquid supply apparatus 1 is for filling at least a part between the projection optical system PL and the substrate P with the liquid 50, and includes a tank for storing the liquid 50, a pressure pump, and the like. One end of a supply pipe 3 is connected to the liquid supply apparatus 1, and a supply nozzle 4 is connected to the other end of the supply pipe 3. The liquid supply apparatus 1 supplies the liquid 50 to the space 56 via the supply pipe 3 and the supply nozzle 4.

  The liquid recovery apparatus 2 includes a suction pump, a tank for storing the recovered liquid 50, and the like. One end of a recovery pipe 6 is connected to the liquid recovery apparatus 2, and a recovery nozzle 5 is connected to the other end of the recovery pipe 6. The liquid recovery apparatus 2 recovers the liquid 50 in the space 56 via the recovery nozzle 5 and the recovery pipe 6. When filling the space 50 with the liquid 50, the control device CONT drives the liquid supply device 1 to supply a predetermined amount of the liquid 50 per unit time to the space 56 via the supply pipe 3 and the supply nozzle 4. The recovery device 2 is driven, and a predetermined amount of liquid 50 per unit time is recovered from the space 56 via the recovery nozzle 5 and the recovery pipe 6. Thereby, the liquid 50 is held in the space 56 between the front end surface 7 of the projection optical system PL and the substrate P. The temperature of the liquid 50 is set to be approximately the same as the temperature in the chamber in which the exposure apparatus EX is accommodated, for example.

  2 is a partially enlarged view of FIG. 1 showing the lower part of the projection optical system PL of the exposure apparatus EX, the liquid supply apparatus 1, the liquid recovery apparatus 2, and the like. In FIG. 2, the lens 60 at the lowest end of the projection optical system PL is formed in a rectangular shape elongated in the Y-axis direction (non-scanning direction), leaving only the portion where the tip 60A is necessary in the scanning direction. At the time of scanning exposure, a part of the pattern image of the mask M is projected onto the rectangular projection area directly under the tip 60A, and the mask M is at the velocity V in the −X direction (or + X direction) with respect to the projection optical system PL. In synchronization with the movement, the substrate P moves in the + X direction (or -X direction) at the speed β · V (β is the projection magnification) via the XY stage 52. Then, after the exposure of one shot area is completed, the next shot area is moved to the scanning start position by stepping the substrate P, and thereafter, the exposure process for each shot area is sequentially performed by the step-and-scan method. In the present embodiment, the liquid 50 is set to flow along the moving direction of the substrate P.

  FIG. 3 shows the tip 60A of the lens 60 of the projection optical system PL, the supply nozzle 4 (4A-4C) for supplying the liquid 50 in the X-axis direction, and the recovery nozzle 5 (5A, 5B) for recovering the liquid 50. It is a figure which shows these positional relationships. In FIG. 3, the shape of the tip 60A of the lens 60 is a rectangular shape elongated in the Y-axis direction, and is 3 on the + X direction side so as to sandwich the tip 60A of the lens 60 of the projection optical system PL in the X-axis direction. Two supply nozzles 4A to 4C are arranged, and two recovery nozzles 5A and 5B are arranged on the −X direction side. The supply nozzles 4 </ b> A to 4 </ b> C are connected to the liquid supply apparatus 1 via the supply pipe 3, and the recovery nozzles 5 </ b> A and 5 </ b> B are connected to the liquid recovery apparatus 2 via the recovery pipe 4. Further, the supply nozzles 8A to 8C and the recovery nozzles 9A and 9B are arranged at positions where the supply nozzles 4A to 4C and the recovery nozzles 5A and 5B are rotated by approximately 180 ° with respect to the center of the tip portion 60A. Supply nozzles 4A to 4C and recovery nozzles 9A and 9B are alternately arranged in the Y-axis direction, supply nozzles 8A to 8C and recovery nozzles 5A and 5B are alternately arranged in the Y-axis direction, and supply nozzles 8A to 8C are The recovery nozzles 9 </ b> A and 9 </ b> B are connected to the liquid recovery apparatus 2 via the recovery pipe 11.

  When scanning exposure is performed by moving the substrate P in the scanning direction (−X direction) indicated by the arrow Xa, the supply pipe 3, the supply nozzles 4A to 4C, the recovery pipe 4, and the recovery nozzles 5A and 5B are used. Thus, the liquid supply device 1 and the liquid recovery device 2 supply and recover the liquid 50. That is, when the substrate P moves in the −X direction, the liquid 50 is supplied between the projection optical system PL and the substrate P from the liquid supply device 1 via the supply pipe 3 and the supply nozzles 4 (4A to 4C). At the same time, the liquid 50 is recovered by the liquid recovery device 2 via the recovery nozzles 5 (5A, 5B) and the recovery pipe 6, and the liquid 50 is applied in the −X direction so as to fill between the lens 60 and the substrate P. Flowing. On the other hand, when scanning exposure is performed by moving the substrate P in the scanning direction (+ X direction) indicated by the arrow Xb, the supply pipe 10, the supply nozzles 8A to 8C, the recovery pipe 11, and the recovery nozzles 9A and 9B are used. The liquid supply device 1 and the liquid recovery device 2 supply and recover the liquid 50. That is, when the substrate P moves in the + X direction, the liquid 50 is supplied from the liquid supply device 1 between the projection optical system PL and the substrate P via the supply pipe 10 and the supply nozzles 8 (8A to 8C). At the same time, the liquid 50 is recovered by the liquid recovery apparatus 2 via the recovery nozzle 9 (9A, 9B) and the recovery pipe 11, and the liquid 50 flows in the + X direction so as to fill the space between the lens 60 and the substrate P. In this way, the control device CONT uses the liquid supply device 1 and the liquid recovery device 2 to flow the liquid 50 in the same direction as the movement direction of the substrate P along the movement direction of the substrate P. In this case, for example, the liquid 50 supplied from the liquid supply apparatus 1 via the supply nozzle 4 flows so as to be drawn into the space 56 as the substrate P moves in the −X direction. Even if the energy is small, the liquid 50 can be easily supplied to the space 56. Then, by switching the flow direction of the liquid 50 according to the scanning direction, the substrate P is scanned between the front end surface 7 of the lens 60 and the substrate P in either the + X direction or the −X direction. Can be filled with the liquid 50, and high resolution and a wide depth of focus can be obtained.

  In addition, the shape of the nozzle mentioned above is not specifically limited, For example, you may make it supply or collect | recover the liquid 50 with 2 pairs of nozzles about the long side of 60 A of front-end | tip parts. In this case, the supply nozzle and the recovery nozzle may be arranged side by side so that the liquid 50 can be supplied and recovered from either the + X direction or the −X direction. . Although not shown, nozzles for supplying and collecting the liquid 50 are provided around the lens 60 of the projection optical system PL at predetermined intervals, and the substrate P is in the scanning direction (+ X direction, −X direction). When moving in a direction other than the above, the liquid 50 can flow in the same direction as the movement direction of the substrate P in parallel with the movement direction of the substrate P.

  FIG. 4 is a schematic plan view of the Z stage 51 as viewed from above. A movable mirror 54 is disposed on two side surfaces of the rectangular Z stage 51 that are perpendicular to each other, and the substrate P is held at a substantially center of the Z stage 51 via a holder (not shown). On the substrate P, a plurality of shot areas S1 to S20 are set. Around the substrate P, an auxiliary plate 41 having a plane substantially the same height as the surface of the substrate P is provided. There is a gap of about 1 to 2 mm between the edge of the substrate P and the auxiliary plate 41, but the liquid 50 hardly flows into the gap due to the surface tension of the liquid 50, and when the vicinity of the periphery of the substrate P is exposed. Also, the liquid 50 can be held under the projection optical system PL.

  A reference plate (reference member) 42 is provided integrally with the auxiliary plate 41 at one corner of the Z stage 51. On the reference plate 42, a reference mark PFM detected by the substrate alignment system 18 and a substrate mark MFM detected by the mask alignment system 19 are provided in a predetermined positional relationship. Further, the surface of the reference plate 42 is substantially flat, and also serves as a reference surface for the focus / leveling detection system 14. The reference surface of the focus / leveling detection system 14 may be provided on the Z stage 51 separately from the reference plate 42. Further, the reference plate 42 may be provided about 1-2 mm away from the auxiliary plate 41. Further, the reference mark PFM and the reference mark MFM may be provided on different members. Further, the surface of the reference plate 42 is set to be almost the same height as the surface of the substrate P and the surface of the auxiliary plate 41, and the liquid below the projection optical system PL is held while the liquid 50 is held under the projection optical system PL. The immersion part can be moved between the reference plate 42 and the substrate P.

  Next, a procedure for exposing the pattern of the mask M onto the substrate P using the above-described exposure apparatus EX will be described with reference to the flowchart of FIG.

[Detection of alignment mark (XY direction) in dry condition]
Before supplying the liquid 50 from the liquid supply apparatus 1, a measurement process is first performed in a state where there is no liquid on the substrate P. The control device CONT moves the XY stage 52 while monitoring the output of the laser interferometer 55 so that the optical axis AX of the projection optical system PL advances on the shot areas S1 to S20 along the wavy arrow 43 in FIG. In the middle of the movement, the substrate alignment system 18 detects a plurality of alignment marks (not shown) formed on the substrate P without passing the liquid (S1). Note that the XY stage 52 is stopped when the substrate alignment system 18 detects the alignment mark. As a result, position information of each alignment mark within the coordinate system defined by the laser interferometer 55 is measured. The detection of alignment marks by the substrate alignment system 18 may detect all alignment marks on the substrate P or only a part of them. When the substrate alignment system 18 can detect the alignment mark on the substrate P while moving the substrate P, the XY stage 52 need not be stopped.

[Detection of substrate surface position (Z direction) in dry condition]
Further, during the movement of the XY stage 52, the surface information of the substrate P is detected without passing through the liquid by the focus / leveling detection system 14 (S2). The detection of surface information by the focus / leveling detection system 14 is performed for every shot region S1 to S20 on the substrate P, and the detection result corresponds to the position of the substrate P in the scanning direction (X-axis direction) and the control device CONT. Is remembered. It should be noted that the detection of surface information by the focus / leveling detection system 14 may be performed only for a part of the shot areas.
The movement of the XY stage 52 is not limited to that shown in FIG.
Alternatively, one of detection of position information of a plurality of alignment marks and detection of surface information of the substrate P may be completed first, and then the other detection may be executed.

[Detection of reference mark PFM (XY direction) in dry condition]
When the detection of the alignment mark on the substrate P and the detection of the surface information on the substrate P are completed, the control device CONT moves the XY stage 52 so that the detection region of the substrate alignment system 18 is positioned on the reference plate 42. The substrate alignment system 18 detects the reference mark PFM on the reference plate 42 and measures the position information of the reference mark PFM within the coordinate system defined by the laser interferometer 55 (S3).

  When the detection process of the reference mark PFM is completed, the positional relationship between the reference mark PFM and a plurality of alignment marks on the substrate P is obtained. Since the positional relationship between the plurality of alignment marks and the shot areas S1 to S20 is known, when the positional relationship between the reference mark PFM and the plurality of alignment marks on the substrate P is obtained, a plurality of shots on the reference mark PFM and the substrate P are obtained. The positional relationships with the areas S1 to S20 are respectively obtained. Further, since the reference mark PFM and the reference mark MFM are in a predetermined positional relationship, the positional relationship between the reference mark MFM and the plurality of shot areas S1 to S20 on the substrate P in the XY plane is determined. .

[Detection of surface position (Z direction) of reference plate in dry condition]
Before or after the detection of the reference mark PFM by the substrate alignment system 18, the control device CONT detects the surface information of the surface (reference surface) of the reference plate 42 by the focus / leveling detection system 14 (S4). With the completion of the detection process of the surface of the reference plate 42, the relationship between the surface of the reference plate 42 and the surface of the substrate P is obtained.

[Detection of reference mark MFM (XY direction) in wet condition]
Next, the control unit CONT moves the XY stage 52 so that the mask alignment system 19 can detect the reference mark MFM on the reference plate 42. As a matter of course, in this state, the front end portion 60A of the projection optical system PL and the reference plate 42 are opposed to each other. Here, the control device CONT starts supply and recovery of the liquid 50 by the liquid supply device 1 and the liquid recovery device 2, and fills the space between the projection optical system PL and the reference plate 42 with the liquid 50 (S5).

  Next, the control device CONT detects the reference mark MFM by the mask alignment system 19 through the mask M, the projection optical system PL, and the liquid 50 (S6). That is, the positional relationship between the mark on the mask M and the reference mark MFM is detected via the projection optical system PL and the liquid. As a result, the position of the mask M in the XY plane, that is, the projection position information of the pattern image of the mask M is detected using the reference mark MFM via the projection optical system PL and the liquid 50.

[Detection of reference plate in wet condition (Z direction)]
Further, the control device CONT detects the surface (reference surface) of the reference plate 42 with the focus / leveling detection system 14 in a state where the liquid 50 is supplied between the projection optical system PL and the reference plate 42, and the projection optical system. The relationship between the image plane formed through the PL and the liquid 50 and the surface of the reference plate 42 is measured (S7). The focus / leveling detection system 14 can detect the positional relationship (displacement) between the image plane formed through the liquid 50 by the projection optical system PL and the test surface in the wet condition. By detecting the surface of the reference plate 42, the relationship between the image plane formed via the projection optical system PL and the liquid 50 and the surface of the substrate P is detected using the reference plate 42.

[Alignment and exposure in wet conditions]
When the measurement processing as described above is completed, the control device CONT moves the XY stage 52 while supplying and collecting the liquid 50 in order to expose each of the shot areas S1 to S20 on the substrate P, thereby projecting the optical system PL. The lower liquid immersion portion is moved onto the substrate P. Since the surfaces of the reference plate 42, the auxiliary plate 41, and the substrate P are substantially the same height, the XY stage 52 can be moved while the liquid 50 is held under the projection optical system PL.

  Then, the respective shot areas S1 to S20 on the substrate P are scanned and exposed using the information obtained during the above-described measurement process (S8). That is, during scanning exposure for each of the shot areas, information on the positional relationship between the reference mark PFM and each of the shot areas S1 to S20 obtained before supplying the liquid 50 and the reference mark MFM after supplying the liquid 50 are used. Based on the obtained projection position information of the pattern image of the mask M, the respective shot areas S1 to S20 on the substrate P and the mask M are aligned (S8).

  Further, during the scanning exposure for each of the shot regions S1 to S20, information on the relationship between the surface of the reference plate 42 and the surface of the substrate P obtained before the liquid 50 is supplied, and the surface of the reference plate 42 and the liquid obtained after the liquid 50 is supplied. The positional relationship between the surface of the substrate P and the image plane formed via the liquid 50 can be obtained without using the focus / leveling detection system 14 based on the information on the positional relationship between the image plane and the image plane formed via the liquid 50. Adjusted. As described above, since the detection of the focus / leveling detection system 14 performed through the liquid 50 is performed only when the surface of the reference plate 42 before the exposure of the substrate P is started, the influence of the temperature change of the liquid 50 is minimized. The detection operation of the focus / leveling detection system 14 can be performed with the limit.

  Note that the surface information on the surface of the substrate P may be detected by using the focus / leveling detection system 14 during scanning exposure, and used to check the adjustment result of the positional relationship between the surface of the substrate P and the image surface. Further, the surface information on the surface of the substrate P is detected by using the focus / leveling detection system 14 during the scanning exposure, and the surface information detected during the scanning exposure is further added to the position of the surface of the substrate P and the image surface. The relationship may be adjusted.

  In the above-described embodiment, when the surface information of the substrate P is detected without liquid, the focus / leveling detection system 14 that projects detection light in or near the projection region where the pattern image of the mask M is formed. However, a focus leveling detection system (not shown) mounted on the substrate alignment system 18 may be used. The focus / leveling detection system mounted on the substrate alignment system 18 is used to adjust the surface position of the substrate P when the substrate alignment system 18 detects an alignment mark on the substrate P. A specific configuration of the focus / leveling detection system is disclosed in, for example, Japanese Patent Application Laid-Open No. 2001-257157 (US Patent Publication 2001 / 0023918A).

In the above-described embodiment, adjustment of the positional relationship between the surface of the substrate P and the image plane is performed by moving the Z stage 51 that holds the substrate P. However, a plurality of components constituting the mask M and the projection optical system PL are used. A part of the lens may be moved so that the image plane matches the surface of the substrate P, or the wavelength of the exposure light EL may be finely adjusted.
Further, in the above-described embodiment, the supply of the liquid 50 from the liquid supply apparatus 1 is started after the alignment mark and the reference mark PFM on the substrate P are detected. Then, the liquid 50 is supplied from the liquid supply apparatus 1, and the alignment mark and the reference mark PFM on the substrate P are detected without passing through the liquid while the liquid 50 is locally held on the image plane side of the projection optical system PL. You may do it.
In the above-described embodiment, the surface information of the substrate P measured by the dry condition is associated with the image plane formed through the projection optical system PL and the liquid 50 through the reference plate 42. However, instead of the reference plate 42, a predetermined area on the substrate P is used as a reference surface, and the dry area and wet condition are used to detect the predetermined area by the focus / leveling detection system 14, and the substrate is measured in the dry condition. The surface information of P may be associated with the image plane formed via the projection optical system PL and the liquid 50.
In the above-described embodiment, the focus / leveling detection system 14 is used in both the dry condition and the wet condition. However, the focus / leveling detection system for the dry condition and the focus / leveling detection for the wet condition are used. The system may be provided separately.
When the focus leveling detection system 14 knows in advance the relationship (offset) between the surface information of the substrate P detected by the dry condition and the image plane formed via the liquid by the projection optical system PL, The detection in the wet condition by the focus / leveling detection system 14 is omitted, and based on the surface information of the substrate P measured in the dry condition, the image plane formed through the liquid by the projection optical system PL and the surface of the substrate P The respective shot areas on the substrate P may be subjected to immersion exposure while adjusting the positional relationship with In this case, the reference plate 42 as the reference surface may not be provided on the substrate stage PST. A reference member on which a reference mark is formed is necessary.

  As described above, since the alignment mark on the substrate P and the surface information of the substrate P are detected without using the liquid 50 for immersion exposure, the immersion exposure is performed based on the information. The alignment between the shot areas S1 to S20 on the P and the mask M and the positional relationship between the surface of the substrate P and the image plane formed through the liquid 50 can be accurately performed.

  FIG. 5 is a diagram showing a modification of the present invention, and is a diagram showing a schematic configuration in the vicinity of the lens 60 of the projection optical system PL. In FIG. 5, the liquid supply device 1, the liquid recovery device 2, the substrate alignment system 18 and the like are omitted for simplicity.

  The exposure apparatus EX shown in FIG. 5 has a focus / leveling detection system for detecting surface information on the surface of the substrate P on both sides of the lens 60 of the projection optical system PL in the X-axis direction, with the same configuration as the focus / leveling detection system 14. 61 and 62 are provided. The detection areas of the focus / leveling systems 61 and 62 are also provided when the liquid 50 is supplied under the projection optical system PL (the liquid 50 is locally held on the image plane side of the projection optical system PL). The position is set away from the liquid immersion portion. The focus / leveling detection system 61 is used when scanning exposure is performed while the substrate P is moving in the −X direction, and the focus / leveling detection system 62 is used when scanning exposure is performed while the substrate P is moving in the + X direction. Used.

  In the case of the exposure apparatus of the present embodiment, alignment (alignment) between the mask M and each shot area on the substrate P is performed in the same manner as in the above-described embodiment.

  In the measurement processing of the present embodiment, the surface level of the reference plate 42 is detected by the focus / leveling detection system 14 in a state where the liquid 50 is supplied between the projection optical system PL and the reference plate 42, and the detection result is used as the detection result. Based on this, the Z stage 51 is moved to align the surface of the reference plate 42 with the image plane formed via the projection optical system PL and the liquid 50. At this time, the detection areas of the focus / leveling detection systems 61 and 62 are also located on the reference plate 42 (at this time, no liquid is present in the detection areas of the focus / leveling detection systems 61 and 62), and the focus / leveling detection systems 61 and 62 are located. By detecting the surface of the reference plate 42 with the detection systems 61 and 62, the control device CONT detects the image plane formed via the projection optical system PL and the liquid 50 and the liquid with the focus / leveling detection systems 61 and 62, respectively. It is possible to obtain the relationship with each surface information detected without going through.

  When the measurement processing as described above is completed, the control apparatus CONT moves the XY stage 52 while supplying and collecting the liquid 50 in order to expose each of the shot areas S1 to S20 on the substrate P, thereby projecting the projection optics. The liquid immersion part under the system PL is moved onto the substrate P. The control device CONT scans and exposes each of the shot areas S1 to S20 on the substrate P using each information obtained during the above-described measurement process. During the scanning exposure of each shot area on the substrate P, the positional relationship between the image plane formed via the projection optical system PL and the liquid 50 and the surface of the substrate P is adjusted without using the focus / leveling detection system 14. This is performed using focus / leveling detection systems 61 and 62 having detection areas outside the liquid immersion part between the projection optical system PL and the substrate P. For example, when scanning exposure is performed on a certain shot area on the substrate P while moving the substrate P in the −X direction, the shot area to be exposed enters the liquid immersion portion between the projection optical system PL and the substrate P. Before, the surface level information on the surface of the shot area is sequentially detected by the focus / leveling detection system 61, and when the shot area passes through the liquid immersion portion between the projection optical system PL and the substrate P, the focus / leveling detection is performed. Based on the surface position information detected by the system 61, the positional relationship between the shot area surface and the image plane is adjusted. Since the relationship between the surface information detected by the focus / leveling detection system 61 and the optimum image plane is obtained in advance using the reference plate 42, only the surface position information detected by the focus / leveling detection system 61 can be used as a liquid. The surface of the shot area can be accurately adjusted to the optimum image plane without being affected by 50 temperature changes. As described in the previous embodiment, it goes without saying that the focus / leveling detection system 14 may be used during exposure.

  In recent years, a twin stage type exposure apparatus equipped with two stages for holding the substrate P has appeared, but the present invention is also applicable to a twin stage type exposure apparatus.

  FIG. 6 is a schematic block diagram of a twin stage type exposure apparatus. The twin stage type exposure apparatus includes first and second substrate stages PST1 and PST2 that can move independently on a common base 71, respectively. The first and second substrate stages PST1 and PST2 include reference plates 74 and 75 having the same configuration as the reference plate 42 shown in FIG. Further, the twin stage type exposure apparatus has an exposure station and a measurement / exchange station, and all of the system shown in FIG. 4 (including the focus / leveling detection system 14) except the substrate alignment system 18 is mounted on the exposure station. Has been. The measurement / replacement station is equipped with a focus / leveling detection system 73 having a substrate alignment system 72, a projection system 73A, and a light receiving system 73B.

  As a basic operation of such a twin stage type exposure apparatus, for example, during the exposure processing of the substrate P on the second substrate stage PST2 in the exposure station, the substrate P on the first substrate stage PST1 in the measurement / exchange station. Replacement and measurement processing are performed. When the respective operations are completed, the second substrate stage PST2 moves to the measurement / exchange station, and in parallel therewith, the first substrate stage PST1 moves to the exposure station, and this time the second substrate stage PST2 performs measurement and exchange. Processing is performed, and exposure processing is performed on the substrate P on the first substrate stage PST1.

  When the present invention is applied to a twin stage type exposure apparatus, the measurement process performed without using the liquid described in the above embodiment is performed at the measurement / exchange station. For example, while the immersion exposure processing is being performed on the substrate P on the second substrate stage PST2 at the exposure station, the substrate alignment system 72, the focus and focus are processed at the measurement station on the substrate P on the first substrate stage PST1. Using the leveling detection system 73 and the reference plate 74, a measurement process without using a liquid is performed. When the measurement process without liquid is completed, the first substrate stage PST1 and the second substrate stage PST2 are exchanged. As shown in FIG. 6, the reference plate 74 and the projection optics of the first substrate stage PST1 are used. The first substrate stage PST1 is positioned so as to face the system PL. In this state, the control device CONT starts supplying the liquid 50, fills the space between the projection optical system PL and the reference plate 74 with the liquid 50, and performs the measurement process and exposure process via the liquid as in the above-described embodiment. I do. The alignment information of each shot area once obtained at the measurement / exchange station is determined (stored) with reference to the reference mark PFM of the reference plate, and when immersion exposure is performed at the exposure station. Moves the first substrate stage PST1 so that each shot area is positioned based on the positional relationship between the reference mark MFM formed in a predetermined positional relationship with respect to the reference mark PFM on the reference plate and the mask M. Is controlled. That is, the alignment information of each shot area obtained at the measurement / exchange station is effectively transferred to the exposure station using the reference marks PFM and MFM.

As described above, in the case of the twin stage type exposure apparatus, during the immersion exposure process in one stage, the measurement process without using the liquid can be performed in the other stage, thereby improving the throughput of the exposure process. Can do. Regarding the structure and exposure operation of a twin stage type exposure apparatus, for example, Japanese Patent Application Laid-Open Nos. 10-163099 and 10-214783 (corresponding US Pat. Nos. 6,341,007, 6,400,441, 6,549, 269 and 6,590,634), JP 2000-505958 (corresponding US Pat. No. 5,969,441) or US Pat. No. 6,208,407.
In the above-described twin-stage type exposure apparatus, the focus / leveling detection system 14 is arranged in the exposure station. However, as disclosed in US Pat. No. 6,208,407, the focus / leveling of the exposure station. The positional relationship between the image plane of the projection optical system PL and the surface of the substrate P may be adjusted using an interferometer that measures position information in the Z direction of the substrate stage PST without the detection system. Of course, an interferometer that measures position information of the substrate stage PST in the Z direction and the focus / leveling detection system 14 may be used in combination.

  In the above-described embodiment, the reference mark MFM on the reference plate (for example, the reference plate 42) is detected by the mask alignment system 19 via the liquid 50. However, a transparent member having a predetermined thickness is formed on the reference mark MFM. (Cover glass, correction member) may be arranged, and the reference mark MFM may be detected by the mask alignment system 19 without using a liquid. In this case, since a pseudo liquid immersion state is formed between the projection optical system PL and the reference mark MFM by the transparent member, the pattern image of the mask M can be projected using the reference mark MFM without using liquid. Position information can be accurately measured. Therefore, since not only the alignment mark on the substrate P but also the reference mark MFM is detected without using the liquid 50, alignment information for aligning the mask M and the substrate P can be obtained stably and accurately. Can do.

  The mask alignment system 19 is not limited to the configuration disclosed in Japanese Patent Laid-Open No. 7-176468. In short, the position of the mask M (mark of the mask M) and the reference (MFM) on the substrate stage PST is important. It suffices if the relationship can be detected.

  In the above-described embodiment, since the liquid is supplied onto the substrate P after the alignment mark on the substrate P is detected without liquid, the deformation (extension / contraction) of the substrate P or the substrate depends on the weight of the liquid or the temperature of the liquid. Even if the stage PST is deformed and liquid immersion exposure is performed based on the position information of the alignment mark detected by the dry condition and the surface information of the substrate P, errors such as misalignment and defocus occur, and the mask There is a possibility that the pattern image of M is not projected on the substrate P in a desired state.

  In such a case, with respect to the alignment (alignment) between the pattern image and each shot on the substrate P, for example, a technique as disclosed in Japanese Patent Laid-Open No. 2002-353121 (US Patent Publication 2002 / 0042664A) For example, correction information (map information) for correcting misalignment caused by supplying liquid onto the substrate P using, for example, is prepared in advance, and the position information of the alignment mark of the substrate P detected by the dry condition In addition, in consideration of the correction information, the pattern image and each shot area on the substrate P may be aligned. Alternatively, test exposure may be performed to obtain similar correction information from the positional deviation amount of each shot pattern, and alignment between the substrate P and each shot area may be performed using the correction information.

  As for the focus / leveling control, correction information for correcting an error (such as defocus) caused by supplying a liquid onto the substrate P by performing a test exposure or the like is obtained in advance and detected in a dry condition. By adding the correction information to the surface information of the substrate P, the positional relationship between the image plane formed via the liquid and the surface of the substrate P may be adjusted by the projection optical system PL.

  As described above, pure water is used as the liquid 50 in the present embodiment. Pure water has an advantage that it can be easily obtained in large quantities at a semiconductor manufacturing factory or the like, and has no adverse effect on the photoresist, optical element (lens), etc. on the substrate P. In addition, pure water has no adverse effects on the environment, and since the impurity content is extremely low, it can be expected to clean the surface of the substrate P and the surface of the optical element provided on the front end surface of the projection optical system PL. .

  The refractive index n of pure water (water) with respect to the exposure light EL having a wavelength of about 193 nm is said to be about 1.44 to 1.47, and ArF excimer laser light (wavelength 193 nm) is used as the light source of the exposure light EL. Is used, the wavelength is shortened to 1 / n, that is, about 131 to 134 nm on the substrate P, and a high resolution can be obtained. Furthermore, since the depth of focus is expanded to about n times, that is, about 1.44 to 1.47 times compared with that in the air, if it is sufficient to ensure the same depth of focus as that used in the air. The numerical aperture of the projection optical system PL can be further increased, and the resolution is improved in this respect as well.

  In the above embodiment, the lens 60 is attached to the tip of the projection optical system PL. However, as an optical element attached to the tip of the projection optical system PL, optical characteristics of the projection optical system PL, such as aberration (spherical aberration, coma aberration) Etc.) may be used. Alternatively, it may be a plane parallel plate that can transmit the exposure light EL. By making the optical element in contact with the liquid 50 into a plane parallel plate that is cheaper than the lens, the transmittance of the projection optical system PL and the exposure light EL on the substrate P during transportation, assembly, adjustment, etc. of the exposure apparatus EX. Even if a substance that reduces the illuminance and the uniformity of the illuminance distribution (for example, silicon-based organic matter) adheres to the plane-parallel plate, the plane-parallel plate may be replaced just before the liquid 50 is supplied. There is an advantage that the replacement cost is lower than in the case where the optical element in contact with the lens is a lens. That is, the surface of the optical element that comes into contact with the liquid 50 is contaminated due to scattering particles generated from the resist by exposure to the exposure light EL, or adhesion of impurities in the liquid 50, and the optical element is periodically replaced. Although it is necessary, by making this optical element an inexpensive parallel flat plate, the cost of replacement parts is lower than that of lenses and the time required for replacement can be shortened, resulting in an increase in maintenance costs (running costs). And a decrease in throughput.

  Further, when the pressure between the optical element at the tip of the projection optical system PL generated by the flow of the liquid 50 and the substrate P is large, the optical element is not exchangeable but the optical element is moved by the pressure. It may be fixed firmly so that there is no.

Although the liquid 50 in the embodiment is water, a liquid other than water may be, for example, when the light source of exposure light EL is an F ₂ laser, the F ₂ laser beam is not transmitted through water In this case, the liquid 50 may be, for example, fluorine oil (liquid) or perfluorinated polyether (PFPE) that can transmit the F ₂ laser beam. In addition, as the liquid 50, the liquid 50 is transmissive to the exposure light EL, has a refractive index as high as possible, and is stable with respect to the photoresist applied to the projection optical system PL and the surface of the substrate P (for example, Cedar). Oil) can also be used.

  The substrate P in each of the above embodiments is not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  In the above-described embodiment, an exposure apparatus that locally fills the space between the projection optical system PL and the substrate P with a liquid is adopted. However, the stage holding the substrate to be exposed is moved in the liquid tank. The present invention can also be applied to an immersion exposure apparatus to be used or an immersion exposure apparatus in which a liquid tank having a predetermined depth is formed on a stage and a substrate is held therein. The structure and exposure operation of an immersion exposure apparatus for moving a stage holding a substrate to be exposed in a liquid tank are disclosed in detail, for example, in Japanese Patent Application Laid-Open No. 6-124873, and a predetermined depth on the stage. The structure and exposure operation of an immersion exposure apparatus that forms a liquid tank and holds a substrate therein are disclosed in detail, for example, in Japanese Patent Laid-Open No. 10-303114 (US Pat. No. 5,825,043). Yes.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise. The present invention can also be applied to a step-and-stitch type exposure apparatus that partially transfers at least two patterns on the substrate P.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern on the substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). ) Or an exposure apparatus for manufacturing reticles or masks.

  When a linear motor is used for the substrate stage PST and the mask stage MST, either an air levitation type using an air bearing or a magnetic levitation type using a Lorentz force or a reactance force may be used. Each stage PST, MST may be a type that moves along a guide, or may be a guideless type that does not have a guide. Examples using a linear motor for the stage are disclosed in US Pat. Nos. 5,623,853 and 5,528,118.

  As a driving mechanism for each stage PST, MST, a planar motor that drives each stage PST, MST by electromagnetic force with a magnet unit having a two-dimensionally arranged magnet and an armature unit having a two-dimensionally arranged coil facing each other is provided. It may be used. In this case, either one of the magnet unit and the armature unit may be connected to the stages PST and MST, and the other of the magnet unit and the armature unit may be provided on the moving surface side of the stages PST and MST.

  The reaction force generated by the movement of the substrate stage PST may be released mechanically to the floor (ground) using a frame member so as not to be transmitted to the projection optical system PL. This reaction force processing method is disclosed in detail, for example, in JP-A-8-166475 (US Pat. No. 5,528,118).

  The reaction force generated by the movement of the mask stage MST may be released mechanically to the floor (ground) using a frame member so as not to be transmitted to the projection optical system PL. This reaction force processing method is disclosed in detail, for example, in Japanese Patent Laid-Open No. 8-330224 (US Pat. No. 5,874,820).

  As described above, the exposure apparatus EX according to the present embodiment maintains various mechanical subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Manufactured by assembling. To ensure these various accuracies, before and after this assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection, and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 7, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for producing a mask (reticle) based on the design step, and a substrate as a base material of the device. Manufacturing step 203, exposure processing step 204 for exposing the mask pattern onto the substrate by the exposure apparatus EX of the above-described embodiment, device assembly step (including dicing process, bonding process, packaging process) 205, inspection step 206, etc. It is manufactured after.

It is a schematic block diagram which shows one Embodiment of the exposure apparatus of this invention. It is a figure which shows the positional relationship of the front-end | tip part of a projection optical system, a liquid supply apparatus, and a liquid collection | recovery apparatus. It is a figure which shows the example of arrangement | positioning of a supply nozzle and a collection | recovery nozzle. It is a top view of the substrate stage holding a substrate. It is a schematic block diagram which shows other embodiment of the exposure apparatus of this invention. It is a schematic block diagram which shows other embodiment of the exposure apparatus of this invention. It is a flowchart figure which shows an example of the manufacturing process of a semiconductor device. It is a flowchart which shows the procedure which exposes the pattern of a mask to a board | substrate using exposure apparatus.

Explanation of symbols

1 ... Liquid supply device, 2 ... Liquid recovery device,
14. Focus / leveling detection system (surface detection system),
18 ... Substrate alignment system (first alignment system),
19 ... mask alignment system (second alignment system),
42 ... reference member, 50 ... liquid, CONT ... control device, EX ... exposure device, P ... substrate,
PL: projection optical system, PST: substrate stage (first substrate stage),
PST1 ... first substrate stage, PST2 ... second substrate stage

Claims (30)

An exposure apparatus that exposes a substrate by transferring an image of a pattern onto the substrate via a liquid,
A projection optical system that projects an image of the pattern onto the substrate;
A first substrate stage for holding the substrate;
A liquid supply device for supplying the liquid to the image plane side of the projection optical system;
A surface detection system for detecting surface information of the substrate surface without a liquid ;
A reference member having a reference surface of the surface detection system and provided on the first substrate stage,
Based on the relationship between the surface information of the substrate surface detected without passing through the liquid and the reference surface, and the relationship between the image surface formed by the projection optical system through the liquid and the reference surface. An exposure apparatus for performing immersion exposure of the substrate while adjusting a positional relationship between the substrate surface and an image plane formed via the liquid by the projection optical system. The exposure apparatus according to claim 1 , wherein the surface detection system detects a relationship between the substrate surface and the reference surface. In a state where a liquid is supplied between the projection optical system and the reference surface, a relationship between an image surface formed by the projection optical system via the liquid and the reference surface is detected, and the image surface The exposure apparatus according to claim 2 , wherein a relationship between the substrate surface and the image plane is determined based on a relationship with the reference plane. The relationship between the image plane and the reference plane detected in a state where liquid is supplied between the projection optical system and the reference plane is determined by using another plane detection system different from the plane detection system. The exposure apparatus according to claim 3 . The liquid supply device, after the detection of the surface information of the substrate surface by the surface detection system, said projection optical system and the reference plane of the claims 1 to 4, starts supplying the liquid in a state in which the opposing The exposure apparatus according to any one of the above. Detection of surface information of the substrate surface is performed not through the liquid by the surface detection system, any one of claims 1 to 5, which is executed in a state of holding the liquid on an image plane side of the projection optical system The exposure apparatus described. A second substrate stage different from the first substrate stage, and a substrate held on the second substrate stage during detection of surface information of the substrate surface held on the first substrate stage by the surface detection system; an apparatus according with a liquid being supplied to any one of claims 1 to 6, the liquid immersion exposure of the substrate held by the second substrate stage between the projection optical system. A first alignment system for detecting an alignment mark on the substrate held by the first substrate stage without using a liquid is provided, and alignment between the substrate and the pattern is performed based on a detection result of the first alignment system. The exposure apparatus according to claim 7 , wherein the substrate is subjected to immersion exposure. And a controller for controlling the operation of the exposure apparatus, the controller based on the detected surface information, and an image surface formed via the projection optical system and the liquid. The exposure apparatus according to any one of claims 1 to 8 , wherein the positional relationship is adjusted. An alignment system that detects the position of the alignment mark on the substrate without using a liquid,
On the basis of the detection result of the alignment system, an exposure apparatus according to any one of claims 1 to 6 for performing liquid immersion exposure of the substrate while performing alignment between the substrate and the pattern. The surface of the reference member is substantially flush with the surface of the substrate held on the first substrate stage,
The first substrate stage is configured so that the projection optical system and the substrate are in a state in which the projection optical system and the reference member face each other while the liquid is locally held on the image plane side of the projection optical system. The exposure apparatus according to any one of claims 1 to 10 , wherein the exposure apparatus is movable to a state where the two face each other. The liquid is locally held on the image plane side of the projection optical system;
The first substrate stage, said around the substrate held by the first substrate stage, the exposure apparatus according to claim 1 to 11, further comprising a flat portion substantially flush with the substrate surface. An exposure apparatus that exposes a plurality of shot areas on the substrate by sequentially exposing a pattern image on the plurality of shot areas on the substrate via a liquid,
A projection optical system that projects an image of the pattern onto the substrate;
A first substrate stage for holding the substrate;
A liquid supply device for supplying the liquid to the image plane side of the projection optical system;
A first alignment system for detecting an alignment mark on the substrate without using a liquid ;
A reference member provided on the first substrate stage and having a reference mark formed thereon,
Based on the positional relationship between the alignment mark and the reference mark by the first alignment system, and the positional relationship between the projection position of the pattern image formed through the liquid by the projection optical system and the reference mark. An exposure apparatus that performs immersion exposure of the substrate while aligning the substrate and the image of the pattern formed through the liquid by the projection optical system. The exposure apparatus according to claim 13 , wherein the first alignment system determines a positional relationship between the reference mark and each shot area on the substrate by detecting the alignment mark. A second alignment system for detecting the reference mark via the projection optical system, and based on the detection result of the second alignment system, each shot region on the substrate and the projection optical system via the liquid The exposure apparatus according to claim 14 , wherein a relationship with a projection position of an image of the pattern to be formed is determined. The exposure apparatus according to claim 15 , wherein the second alignment system detects the reference mark in a state where a liquid is supplied between the projection optical system and the reference member. A second alignment system configured to detect a positional relationship between the reference mark and the pattern via the projection optical system, and each shot region on the substrate and the projection optics based on a detection result of the second alignment system; The exposure apparatus according to claim 13 , wherein a relationship with a projection position of an image of the pattern formed through the liquid is determined by a system. The pattern is formed on a mask, and the second alignment system detects a positional relationship between the reference mark and the mark on the mask in a state where liquid is supplied between the projection optical system and the reference member. The exposure apparatus according to claim 17 to be performed. The exposure apparatus according to claim 15 , wherein the second alignment system detects the reference mark via the transparent member disposed between the projection optical system and the reference member, and the projection optical system. The liquid supply device, after the detection of the alignment mark of the substrate by the first alignment system, in a state where the projection optical system and said reference member is opposed, in claim 13 for starting the supply of the liquid The exposure apparatus described. The surface of the reference member is substantially flush with the surface of the substrate held on the first substrate stage,
In the first substrate stage, the projection optical system and the substrate are opposed to each other from the state where the projection optical system and the reference member are opposed to each other while the liquid is held on the image plane side of the projection optical system. 21. The exposure apparatus according to any one of claims 13 to 20 , wherein the exposure apparatus is movable to a closed state. The liquid is locally held on the image plane side of the projection optical system;
The exposure apparatus according to any one of claims 13 to 21 , wherein the first substrate stage has a flat portion that is substantially flush with the substrate surface around the substrate held by the first substrate stage. A second substrate stage different from the first substrate stage, and a substrate held on the second substrate stage during detection of an alignment mark on the substrate held on the first substrate stage by the first alignment system; The exposure apparatus according to any one of claims 13 to 22 , wherein the substrate held on the second substrate stage is subjected to immersion exposure while a liquid is supplied between the projection optical system and the projection optical system. And a controller for controlling the operation of the exposure apparatus. The controller supplies the liquid on the substrate based on the detection result of the first alignment system in a state where the liquid is not supplied on the substrate. The exposure apparatus according to any one of claims 13 to 23 , wherein the substrate stage is controlled so as to perform alignment between the substrate and the pattern in a state of being performed. A device manufacturing method using the exposure apparatus according to any one of claims 1 to 24 . An immersion exposure method in which an image of a pattern is transferred onto a substrate via a liquid to expose the substrate,
Obtaining position information of an image plane of the pattern formed through the liquid;
Obtaining surface information of the substrate surface by measurement without passing through the liquid supplied onto the substrate;
Supplying a liquid onto the substrate;
Based on the the determined surface information and position information of the image plane, the immersion exposure method comprising the steps of adjusting and while the liquid immersion exposure of the substrate the positional relationship between the substrate surface and the image plane. In the step of obtaining the surface information of the substrate surface by measurement not involving the liquid supplied onto the substrate, the relationship between the image surface of the pattern formed via the liquid by supplying the liquid onto the substrate and the surface information of the substrate surface The immersion exposure method according to claim 26 , further comprising: 27. The exposure method according to claim 26 , wherein the step of obtaining the surface position of the substrate surface and the step of immersion exposure are performed in separate stations. An immersion exposure method in which an image of a pattern is transferred onto a substrate via a liquid to expose the substrate,
Detecting an alignment mark on the substrate when no liquid is supplied on the substrate;
Supplying a liquid onto the substrate;
Obtaining position information of an image of the pattern formed through the liquid;
Based on the detection result of the alignment mark and the position information of the image of the pattern , the liquid immersion of the substrate is performed while aligning the substrate supplied with the liquid and the image of the pattern formed via the liquid. An immersion exposure method including an exposure step. 30. The exposure method according to claim 29 , wherein the step of detecting the alignment mark and the step of performing immersion exposure are performed at different stations.

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