DD224448A1 - Means for photolithographic strukturuebertragung - Google Patents

Means for photolithographic strukturuebertragung Download PDF

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Publication number
DD224448A1
DD224448A1 DD26046084A DD26046084A DD224448A1 DD 224448 A1 DD224448 A1 DD 224448A1 DD 26046084 A DD26046084 A DD 26046084A DD 26046084 A DD26046084 A DD 26046084A DD 224448 A1 DD224448 A1 DD 224448A1
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German Democratic Republic
Prior art keywords
photosensitive layer
device
optically transparent
substrate
chamber
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DD26046084A
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German (de)
Inventor
Rainer Hesse
Wolfgang Gaertner
Karl-Heinz Kuch
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Zeiss Jena Veb Carl
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Application filed by Zeiss Jena Veb Carl filed Critical Zeiss Jena Veb Carl
Priority to DD26046084A priority Critical patent/DD224448A1/en
Publication of DD224448A1 publication Critical patent/DD224448A1/en

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70216Systems for imaging mask onto workpiece
    • G03F7/70341Immersion

Abstract

Es wird eine Einrichtung zur fotolithografischen Strukturuebertragung mittels eines Projektionsobjektivs beschrieben. There is described a device for photolithographic Strukturuebertragung by means of a projection lens. Sie ist zur Erzeugung von Halbleiterstrukturen in einer fotoempfindlichen Schicht einer Halbleiterscheibe nach der Planartechnologie anwendbar. It is applicable for the production of semiconductor structures in a photosensitive layer of a semiconductor wafer by the planar. Das Ziel der Erfindung besteht in der Erhoehung der Genauigkeit bei hoher Produktivitaet der Strukturuebertragung. The object of the invention is to increase the accuracy with high productivity Strukturuebertragung. Als Aufgabe steht die Schaffung einer Einrichtung, die bei Verwendung einer Immersionsfluessigkeit Turbulenzen vermeidet und moegliche Verunreinigungen ausserhalb des Schaerfentiefebereiches des Probjektionsobjektivs haelt. An object is to provide a device that avoids turbulence when using a Immersionsfluessigkeit and holds possible impurities outside the Schaerfentiefebereiches of Probjektionsobjektivs. Die Erfindung besteht darin, dass zwei mit Immersionsfluessigkeit gefuellte Kammern vorgesehen sind, von denen eine dem Projektionsobjektiv und die zweite dem Substrat zugeordnet sind. The invention consists in that two Immersionsfluessigkeit filled chambers are provided, one of which the projection lens and the second substrate are assigned. Hoechste Aufloesung wird erreicht, wenn zwischen den die Kammern abschliessenden optisch transparenten Medien ebenfalls Immersionsfluessigkeit eingebracht wird. The highest resolution is achieved when between the chambers final optically transparent media is also introduced Immersionsfluessigkeit. Fig. 1 Fig. 1

Description

Titel der Erfindung Title of the invention

Einrichtung zur fotolithografischen Strukturübertragung Means for photolithographic pattern transfer

Anwendungsgebiet der Erfindung Field of the Invention

Die Erfindung betrifft eine Einrichtung zur fotolithografischen Strukturübertragung mittels eines Projektionsobjektivs zum Erzeugen eines Belichtungsmusters in einer fotoempfindlichen Schicht eines Substrates. The invention relates to a device for photolithographic pattern transfer by means of a projection objective for producing an exposure pattern in a photosensitive layer of a substrate. Sie ist insbesondere bei der Erzeugung einer Mikrostruktur in einer fotoempfindlichen Schicht einer Halbleiterscheibe zur Herstellung von Halbleiterstrukturen nach der Planartechnologie anwendbar. It is particularly applicable in the production of a microstructure in a photosensitive layer of a semiconductor wafer for the manufacture of semiconductor structures according to the planar.

Charakteristik der bekannten technischen Lösungen In der veröffentlichten Europäischen Patentanmeldung E? Characteristic of the known technical solutions in published European Patent Application E? 0 023 231 sind ein Verfahren und eine Vorrichtung zum Kopieren eines Musters auf eine Halbleiterscheibe beschrieben, die zwischen einem Projektionsobjektiv und einer Halbleiterplatte eine Flüssigkeit verwendet, deren Brechungsindex dem des Lacküberzuges der Halbleiterplatte entspricht. 0,023,231 a method and an apparatus for copying a pattern described on a semiconductor wafer that uses a liquid between a projection lens and a semiconductor plate the refractive index corresponds to that of enamel coating of the semiconductor wafer. Dabei wird die Flüssigkeit ständig ausgetauscht und temperiert und/oder gefiltert. The liquid is continuously exchanged and heated and / or filtered. Diese Vorrichtung soll eine Vergrößerung der numerischen Apertur ohne Vergrößerung des Einfallswinkels ermöglichen. This device should enable an increase in the numerical aperture without increasing the angle of incidence. Dieses auch aus der Mikroskopie bekannte Prinzip (man vergleiche hierzu: Brockhaus, "ABC der Optik" Brockhaus Verlag Leipzig, 19β1 S. 565 ff.) ist bei Übertragung auf das Gebiet der Mikro- This also known from microscopy principle (compare this: Brockhaus, "ABC optics" Brockhaus publishing house Leipzig, 19β1 S. 565 et seq.) Is when transmitted to the field of micro-

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_ A 11·-· -if. _ A 11 · - · -if. C I ~ *, P» /. C I ~ * P »/. Λ O Λ O Λ Λ

lithografie mit Nachteilen behaftet. lithografie disadvantages. Ein Nachteil besteht darin, daß in der Flüssigkeit, deren Volumen bei dem beschriebenen Verfahren erheblich ist , zwischen Projektionsobjektiv und Halbleiterscheibe bei der Herstellung von hochintegrierten Schaltkreisen infolge der notwendigen Verfahrbewegung der auf einem Koordinatentisch befindlichen Halbleiterscheibe Turbulenzen erzeugt werden. A disadvantage is that in the liquid whose volume is substantially in the described method, turbulence is generated between projection lens and wafer in the production of large scale integrated circuits because of the necessary travel movement of the semiconductor wafer located on an XY table. Deshalb wird man, bei heute aus Produktivitätsgründen hohen Verfahrgeschwindigkeiten, endweder Fehler . Therefore, it is in today high speeds for productivity, endweder error. bei der Strukturübertragung in Kauf nehmen müssen oder man muß das Zeitregime für jeden Belichtungsschritt, um die Zeit für die Beruhigung der Turbulenzen erweitern, was wiederum Produktivitätseinbußen bedeutet. have to accept in the pattern transfer or you need the time regime for each exposure step to extend the time to calm the turbulence, which in turn means lost productivity.

Ein weiterer Nachteil ist die Handhabbarkeit des zu belichtenden Substrates unter Cleanrοom-Bedingungen. A further disadvantage is the handling of the substrate to be exposed under Cleanrοom conditions. Bei dem Verfahren gemäß obengenannter Patentanmeldung muß nach jeder vollständigen Belichtung einer Halbleiterscheibe diese aus der Flüssigkeit herausgebracht werden und von der Flüssigkeit getrennt werden. In the method according to the above-mentioned patent application, this must be brought out of the liquid and are separated from the liquid after each complete exposure of a semiconductor wafer. Hier besteht zunächst die Gefahr, daß zum Beispiel Staub oder andere unerwünschte Stoffe die Oberfläche des Substrates belegen. Here, first is a risk that, for example, dust or other unwanted materials coat the surface of the substrate. Desweiteren läßt sich die Oberfläche des Substrates zum Beispiel zur Vorbereitung auf einen Kontrollschritt infolge der zahlreichen Stufen, Gräben, Erhöhungen etc. nur mit hohem Aufwand von der Flüssigkeit befreien. Furthermore, the surface of the substrate can be free only with great effort, etc. from the liquid, for example, in preparation for a control step as a result of the numerous steps, trenches, increases. Weiterhin nachteilig ist die Verwendung eines nach oben offenen Behälters, der die Flüssigkeit beinhaltet. Another disadvantage is the use of an upwardly open container which contains the liquid. Die daraus resultierende große Flüssigkeitsoberfläche bietet so Eintrittsmöglichkeiten für Verunreinigungen der Flüssigkeit, die erst nach Durchlauf eines Filters beseitigt werden können. The resulting large liquid surface, providing entry opportunities for contamination of the liquid, which can be removed only after passing through a filter.

Ziel der Erfindung OBJECT OF THE INVENTION

Ziel der Erfindung ist die Schaffung einer hochproduktiven und hochgenauen Einrichtung zur fotolithografischen Strukturübertragung. The aim of the invention is to provide a highly productive and highly accurate means for photolithographic pattern transfer.

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Darlegung des Wesens der Erfindung Principle of the invention

Der Erfindung liegt die Aufgabe zugrunde, eine Einrichtung zur fotolithografischen Strukturübertragung mittels eines Projektionsobjektivs zu entwickeln, in welcher ein geringes Volumen Immersionsflüssigkeit Verwendung findet, so daß keine störenden Turbulenzen in Erscheinung treten und die so aufgebaut ist, daß mögliche Verunreinigungen außerhalb des Schärfentiefebereiches des Projektionsobjektivs liegen und so keine Strukturierungsfehler verursachen. The invention has for its object to develop a means for photolithographic pattern transfer by means of a projection lens in which a small volume is immersion liquid used, so that no disturbing turbulences appear and which is constructed so that possible contaminants outside the depth of field range of the projection objective are and so do not cause structuring mistakes. Das zu belichtende Substrat soll so handhabbar sein, daß die fotoempfindliche Schicht des Substrats in keiner Weise beeinträchtigt wird. The substrate to be exposed should be handled so that the photosensitive layer of the substrate is not impaired in any way.

Erfindungsgemäß wird die Aufgabe dadurch gelöst, daß bei einer Einrichtung zur fotolithografischen Strukturübertragung mittels eines Projektionsobjektivs zum Erzeugen eines Belichtungsmusters in einer fotoempfindlichen Schicht eines parallel zur Bildebene schrittweise bewegten und auswechselbaren Substrats, wobei im optischen Strahlengang zwischen der fotoempfindlichen Schicht und der dieser zugewandten Grenzfläche des Produktionsobjektivs eine Immersionsflüssigkeit annähernd gleichen Brechwertes wie der der lichtempfindlichen Schicht Verwendung findet,im optischen Strahlengang zwischen Projektionsobjektiv und der fotoempfindlichen Schicht des Substrats zwei voneinander getrennte, gegen die Atmosphäre abgeschlossene, relativ zueinander bewegbare und mit Immersionsflüssigkeit gefüllte Kammern vorgesehen sind, wobei die erste Kammer, die mit dem Projektionsobjektiv fest verbunden ist, von der der fotoempfindlichen Schicht zugewandten Grenzfläche des Projektionsobjektivs und v According to the invention, the object is achieved in that in a device for photolithographic pattern transfer by means of a projection objective for producing an exposure pattern in a photosensitive layer of the image plane gradually moved parallel and replaceable substrate, in the optical path between the photosensitive layer and the facing this interface of the production lens an immersion liquid approximately the same refractive power as that of the light-sensitive layer used is, in the optical path between the projection lens and the photosensitive layer of the substrate, two separate, closed to the atmosphere, relatively movable and filled with immersion liquid chambers are provided, wherein the first chamber is fixedly connected to the projection lens, of which the photosensitive layer facing boundary surface of the projection objective and v on einem optisch transparenten Medium begrenzt wird, und die zweite Kammer, die mit dem Substrat verbunden ist, von der fotoempfindlichen Schicht des Substrats und von einem weiteren optisch transparenten Medium begrenzt wird. is limited on an optically transparent medium, and the second chamber, which is connected to the substrate, is delimited by the photosensitive layer of the substrate and a further optically transparent medium.

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Als optisch transparente Medien lassen sich vorteilhaft Glasplatten und/oder Folien einsetzen. advantageously glass sheets and / or films can be used as optically transparent media.

Zur.Verringerung des Volumens an bewegter Immersionsflüssigkeit und damit zur Verringerung von Turbulenzen in der Immersionsflüssigkeit ist es von Vorteil, wenn mindestens eine Kammer mit einer Einrichtung zur Veränderung des Druckes der Immersionsflüssigkeit in Verbindung steht und wenn das optisch transparente Medium dieser Kammer senkrecht zur Bildebene bewegbar angeordnet ist. Zur.Verringerung the volume of moving the immersion liquid and thereby reducing turbulence in the immersion liquid, it is advantageous if at least one chamber with a device for changing the pressure of the immersion liquid is in communication, and when the optically transparent medium of this chamber is movable perpendicular to the plane is arranged.

Zur weiteren Erhöhung der Auflösung des Projektionsobjektivs sowie zur Verringerung von Strukturübertragungsfehlern kann man zwischen den die Kammern begrenzenden optisch transparenten Medien ebenfalls Immersionsflüssigkeit einbringen. To further increase the resolution of the projection lens and to reduce pattern transfer failures can bring the immersion liquid between the chambers delimiting optically transparent media also.

Ausführungsbeispiele embodiments

In der Zeichnung sind Ausführungsbeispiele der Erfindung dargestellt, und zwar zeigen: In the drawing embodiments of the invention are illustrated, and show namely:

Pig. Pig. 1 ein Ausführungsbeispiel der erfindungsgemäßen Einrichtung mit zwei Glasplatten als Abschluß der Kammern, 1 shows an embodiment of the device according to the invention with two glass plates as the conclusion of the chambers,

Fig. 2 ein Ausführungsbeispiel mit einer mittels Ringmembran bewegbar angeordneten Glasplatte, Fig. 3 ein Ausführungsbeispiel, wo die Kammer vor dem Projektionsobjektiv mit einer Folie abgeschlossen ist. Fig. 2 shows an embodiment with a means of annular diaphragm movably disposed glass plate, Fig. 3 shows an embodiment where the chamber is closed in front of the projection lens with a film.

Die erfindungsgemäße Einrichtung besteht nach Fig. 1 aus einem gestellfesten Projektionsobjektiv 1. Mit dem Projektionsobjektiv 1 fest verbunden ist eine Kammer 2, die restlos mit Immersionsflüssigkeit 3 gefüllt ist. The device of the invention consists according to Fig. 1 consists of a frame-mounted projection lens 1. fixedly connected to the projection lens 1 is a chamber 2, which is completely filled with immersion liquid 3. Die Kammer 2 ist gegen die Atmosphäre abgeschlossen und wird im optischen Strahlengang von der der fotoempfindlichen Schicht zugewandten Grenzfläche 4 des Projektionsobjektivs 1 und von einer optisch transparenten, planparallelen Glasplatte 5 begrenzt. The chamber 2 is closed off from the atmosphere and is limited in the optical path from the side facing the photosensitive layer interface 4 of the projection lens 1 and of an optically transparent, plane-parallel glass plate. 5 Desweiteren besteht die Furthermore, there is the

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Einrichtung aus einer zweiten Kammer 6, die mit dem zu belichtenden Substrat zum Beispiel mit einer Halbleiterscheibe 7 verbunden ist. Means of a second chamber 6 which is connected to the substrate to be exposed, for example, a semiconductor wafer. 7 Diese zweite Kammer 6 wird unter anderem von der fotoempfindlichen Schicht 8 der Halbleiterscheibe 7 und von einer weiteren optisch transparenten, planparallelen Glasplatte 9 begrenzt. This second chamber 6 is limited, inter alia, from the photosensitive layer 8 of the semiconductor wafer 7 and a further optically transparent, plane-parallel glass plate. 9 In der zweiten Kammer 6 befindet sich ebenfalls Immer^ sionsflüssigkeit 10. Die zweite Kammer 6 einschließlich der Glasplatte 9 und der Halbleiterscheibe 7 befinden sich auf der Tischplatte 11 eines Koordinatentisches, der über Bewegungseinrichtungen' 12 eine Relativbewegung der Halbleiterscheibe 7 parallel und senkrecht zur Bildebene 13 bewirkt. In the second chamber 6 always ^ also include immersion fluid 10. The second chamber 6 including the glass plate 9 and the semiconductor wafer 7 are located on the table top 11 of a coordinate table, the above moving means' 12, a relative movement of the semiconductor wafer 7 parallel and perpendicular to the plane 13 causes. Zur Erhöhung der Auflösung befindet sich zwischen den beiden die Kammern 2, 6 begrenzenden Glasplatten 5 und 9 weitere Immersionsflüssigkeit 14, deren Oberfläche 15 in einem Behälter 16 höher liegt, als die der Halbleiterscheibe zugewandte Fläche 17 der Glasplatte Zwischen der Grenzfläche 4 des Projektionsobjektivs 1 und der fotoempfindlichen Schicht 8 der Halbleiterscheibe 7 verläuft der optische Strahlengang somit nur in Medien annähernd gleichen Brechwertes wie der der fotoempfindlichen Schicht, wenn man voraussetzt, daß die Brechwerte der Immersionsflüssigkeiten 3, 10 und 14 und der Glasplatten 5 und 9 annähernd übereinstimmen. To increase the resolution is located between the two chambers 2, 6 delimiting glass plates 5 and 9 more immersion liquid 14, the surface thereof is higher in a container 15, 16 as the side facing the semiconductor wafer surface 17 of the glass plate between the interface 4 of the projection lens 1 and the photosensitive layer 8 of the semiconductor wafer 7 of the optical beam path thus runs only in media approximately the same refractive power as that of the photosensitive layer, if one assumes that the indices of refraction of the immersion liquid 3, 10 and 14 and the glass plates 5 and 9 approximately coincide. Will man eine weitere Reduzierung des bewegten Volumens an Immersipnsflüssigkeit 14 erreichen, das heißt auch eine Reduzierung der darin auftretenden Turbulenzen, dann kann man den Abstand zwischen den beiden zueinander bewegten Kammern 2 und 6 minimal auslegen. If one wants to achieve a further reduction in the volume of moving Immersipnsflüssigkeit 14, that is also a reduction in the turbulence occurring therein, then one can the distance between the two mutually moving chambers 2 and 6 minimal interpret. Vorteilhaft lassen sich hier zum Beispiel an Kammer 2, wie in Figur 2, Glasplatten 18 einsetzen, die in der Kammer mittels einer Ringmembran senkrecht zur Bildebene 13 beweglich angeordnet ist. can be advantageous here for example in chamber 2, as used in Figure 2, glass sheets 18, which is arranged in the chamber by means of an annular diaphragm perpendicular to the plane 13 movable. Den gleichen Zweck soll die Folie 20 in Figur 3 erfüllen. The same purpose is to fulfill in Figure 3, the film 20. Die Kammer 2 steht in diesen Fällen über einem Anschlußstutzen 21 mit einer The chamber 2 is in these cases, via a connecting piece 21 having a

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Einrichtung 22 zur Veränderung des Druckes der Immersionsflüssigkeit in Verbindung. Means 22 for changing the pressure of the immersion liquid in combination. Während der Belichtung der fotoempfindlichen Schicht, 8 wird die Glasplatte 18 durch einen erhöhten Druck in der Kammer 2 in Richtung Bildebene 13 bewegt. During exposure of the photosensitive layer, 8, the glass plate 18 is moved by an increased pressure in the chamber 2 in the direction of the image plane. 13 Während der Bewegung der Tischplatte 11 zur Vermeidung von Beschädigungen der Glasplatte 18 oder Folie 20 wird durch Druckminderung der Immersionsflüssigkeit 3 in Kammer 2 die Glasplatte 18 oder Polie 20 von der sich bewegenden Glasplatte 9 wegbewegt. During the movement of the table top 11 to prevent damage of the glass sheet 18 or sheet 20, the glass plate 18 or Polie 20 is moved away from the moving glass plate 9 by pressure reduction of the immersion liquid in chamber 3. 2

Die im Ausführungsbeispiel beschriebene Einrichtung läßt sich auch ohne Immersionsflüssigkeit 14 beschreiben· In diesem Falle hätte man mit keinerlei Turbulenzen zu rechnen. The device described in the embodiment can also be described without immersion liquid 14 · In this case, one would have to expect any turbulence. Die Vorteile der erfindungsgemäßen Einrichtung bleiben erhalten, weil der Abstand beider Kammern 2 und 6 minimal gehalten werden kann und die gegen Verunreinigungen (Staub ua) empfindlichen Flächen außerhalb des Schärfentiefenbereichs des Projektionsobjektivs 7 liegen. retained the advantages of the device according to the invention, because the distance between the two chambers 2 and 6 can be kept to a minimum and to contaminants (dust, etc.) are sensitive areas outside the depth of field of the projection lens. 7

Claims (4)

  1. Erfindungξanspruch Erfindungξanspruch
    1. Einrichtung zur fotolithografischen Strukturübertragung mittels- eines Projektionsobjektivs zum Erzeugen eines Belichtungsmusters in einer fotoempfindlichen Schicht eines parallel zur Bildebene schrittweise bewegten und auswechselbaren Substrats, wobei im optischen Strahlengang zwischen der fotoempfindlichen Schicht und der dieser zugewandten Grenzfläche des Projektionsobjektivs eine Immersionsflüssigkeit annähernd gleichen Brechwertes wie der der lichtempfindlichen Schicht Verwendung findet, dadurch gekennzeichnet, daß im optischen Strahlengang zwischen Projektionsobjektiv und der fotoempfindlichen Schicht des Substrats zwei voneinander getrennte, gegen die Atmosphäre abgeschlossene, relativ zueinander bewegbare und mit Immersionsflüssigkeit gefüllte Kammern vorgesehen sind, wobei die erste Kammer, die mit dem Projektionsobjektiv fest verbunden ist, von der der fotoempfindlichen Schicht zugewandten Grenzfläche des Projektionsobjektivs und von einem optisch transparenten Me 1. Device for photolithographic pattern transfer middlemen a projection objective for producing an exposure pattern in a photosensitive layer of a parallel to the image plane moved stepwise and replaceable substrate, in the optical path between the photosensitive layer and the facing this boundary surface of the projection objective an immersion liquid approximately the same refractive power as the the photosensitive layer using place, characterized in that two separate, closed to the atmosphere, relatively movable and filled with immersion liquid chambers are provided in the optical path between the projection lens and the photosensitive layer of the substrate, wherein the first chamber communicating with the projection lens is firmly connected, from the side facing the photosensitive layer interface of the projection lens, and an optically transparent Me dium begrenzt wird und die zweite Kammer, die mit dem Substrat verbunden ist, von der fotoempfindlichen Schicht des Substrats und von einem v/eiteren optisch transparenten Medium begrenzt wird. dium is limited and the second chamber, which is connected to the substrate of the photosensitive layer of the substrate and from a v / Eiteren optically transparent medium is limited.
  2. 2. Einrichtung nach Punkt 1, dadurch gekennzeichnet, daß die optisch transparenten" Medien Glasplatten und/oder Folien sind. 2. Device according to item 1, characterized in that the optically transparent "media sheets of glass and / or films.
  3. 3. Einrichtung nach Punkt 1 und 2, dadurch gekennzeichnet, daß mindestens eine Kammer mit einer Einrichtung zur Veränderung des Druckes der Immersionsflüssigkeit in Verbindung steht, und daß das optisch transparente Medium dieser Kammer senkrecht zur Bildebene bewegbar angeordnet ist. 3. The device of item 1 and 2, characterized in that at least one chamber with a device for changing the pressure of the immersion liquid is connected, and that the optically transparent medium of this chamber is arranged perpendicularly to the image plane movable.
  4. 4. Einrichtung nach Punkt 1 bis 3» dadurch gekennzeichnet, daß sich zwischen den die Kammern "begrenzenden optisch transparenten Medien ebenfalls Immersionsflüssigkeit befindet» 4. The device of item 1 to 3 "characterized in that the chambers between the" limiting optically transparent media is also immersion liquid "
    Hierzu 3 Blatt Zeichnungen. For this purpose, 3 sheets drawings.
DD26046084A 1984-03-01 1984-03-01 Means for photolithographic strukturuebertragung DD224448A1 (en)

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EP1477856A1 (en) * 2003-05-13 2004-11-17 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2004107048A2 (en) * 2003-05-30 2004-12-09 Carl Zeiss Smt Ag Microlithographic projection exposure system
EP1510871A3 (en) * 2003-08-29 2005-04-06 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1524557A1 (en) * 2003-10-15 2005-04-20 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1420299A3 (en) * 2002-11-12 2005-08-10 ASML Netherlands B.V. Immersion lithographic apparatus and device manufacturing method
WO2005076084A1 (en) * 2004-02-09 2005-08-18 Carl Zeiss Smt Ag Projection objective for a microlithographic projection exposure apparatus
EP1420298A3 (en) * 2002-11-12 2005-10-12 ASML Netherlands B.V. Immersion lithographic apparatus and device manufacturing method
WO2005119742A1 (en) 2004-06-04 2005-12-15 Nikon Corporation Exposure apparatus, exposure method, and device producing method
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US7012673B2 (en) 2003-06-27 2006-03-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2006043457A1 (en) 2004-10-18 2006-04-27 Nikon Corporation Projection optical system, exposure system, and exposure method
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US7268854B2 (en) 2003-02-26 2007-09-11 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
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US7339650B2 (en) 2003-04-09 2008-03-04 Nikon Corporation Immersion lithography fluid control system that applies force to confine the immersion liquid
US7345742B2 (en) 2003-04-10 2008-03-18 Nikon Corporation Environmental system including a transport region for an immersion lithography apparatus
US7359034B2 (en) 2003-05-15 2008-04-15 Nikon Corporation Exposure apparatus and device manufacturing method
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US7379158B2 (en) 2002-12-10 2008-05-27 Nikon Corporation Exposure apparatus and method for producing device
US7388649B2 (en) 2003-05-23 2008-06-17 Nikon Corporation Exposure apparatus and method for producing device
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US7399979B2 (en) 2003-05-23 2008-07-15 Nikon Corporation Exposure method, exposure apparatus, and method for producing device
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